TW200924576A - Method for fabricating minute conductive structures on surfaces - Google Patents

Method for fabricating minute conductive structures on surfaces Download PDF

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Publication number
TW200924576A
TW200924576A TW097127233A TW97127233A TW200924576A TW 200924576 A TW200924576 A TW 200924576A TW 097127233 A TW097127233 A TW 097127233A TW 97127233 A TW97127233 A TW 97127233A TW 200924576 A TW200924576 A TW 200924576A
Authority
TW
Taiwan
Prior art keywords
substrate
ink
conductive
stamping
ditch
Prior art date
Application number
TW097127233A
Other languages
English (en)
Chinese (zh)
Inventor
Stefan Bahnmueller
Stefanie Eiden
Stephan Michael Meier
Christian Etienne Hendriks
Ulrich Schubert
Original Assignee
Bayer Materialscience Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE200710033523 external-priority patent/DE102007033523A1/de
Priority claimed from DE102007043396A external-priority patent/DE102007043396A1/de
Application filed by Bayer Materialscience Ag filed Critical Bayer Materialscience Ag
Publication of TW200924576A publication Critical patent/TW200924576A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Dispersion Chemistry (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Micromachines (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW097127233A 2007-07-19 2008-07-18 Method for fabricating minute conductive structures on surfaces TW200924576A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200710033523 DE102007033523A1 (de) 2007-07-19 2007-07-19 Verfahren zur Herstellung nicht sichtbarer leitfähiger Strukturen auf Oberflächen
DE102007043396A DE102007043396A1 (de) 2007-09-12 2007-09-12 Verfahren zur Herstellung feiner leitfähiger Strukturen auf Oberflächen

Publications (1)

Publication Number Publication Date
TW200924576A true TW200924576A (en) 2009-06-01

Family

ID=39929915

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097127233A TW200924576A (en) 2007-07-19 2008-07-18 Method for fabricating minute conductive structures on surfaces

Country Status (7)

Country Link
US (1) US20090061213A1 (enExample)
EP (1) EP2179633A1 (enExample)
JP (1) JP5606908B2 (enExample)
KR (1) KR20100044176A (enExample)
CN (1) CN101755493A (enExample)
TW (1) TW200924576A (enExample)
WO (1) WO2009010208A1 (enExample)

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JP5937300B2 (ja) * 2007-12-20 2016-06-22 シーマ ナノ テック イスラエル リミティド フィラー材料を有する透明導電性コーティング
KR101009442B1 (ko) * 2009-04-15 2011-01-19 한국과학기술연구원 전도성 구조체를 이용한 전도성필름 제조방법 및 전도성필름
KR101145752B1 (ko) * 2010-07-20 2012-05-16 김용문 인쇄회로기판용 잉크 조성물
US9011651B2 (en) 2010-12-09 2015-04-21 Ut-Battelle, Llc Apparatus and method for the electrolysis of water
KR101771138B1 (ko) 2011-05-13 2017-08-25 삼성전자주식회사 와이어 그리드 편광자, 상기 와이어 그리드 편광자의 제조 방법 및 상기 와이어 그리드 편광자를 포함하는 디스플레이 패널
KR101968635B1 (ko) * 2012-11-22 2019-04-12 삼성전자주식회사 잉크젯 프린팅을 이용한 배선 형성 방법
CN106166792A (zh) * 2015-10-16 2016-11-30 圣戈本陶瓷及塑料股份有限公司 具有复杂几何形状的透明陶瓷和其制造方法
JP6938024B2 (ja) * 2015-10-22 2021-09-22 国立研究開発法人産業技術総合研究所 被印刷基材の表面構造及びその製造方法
KR20200040798A (ko) * 2017-08-17 2020-04-20 캘리포니아 인스티튜트 오브 테크놀로지 효과적으로 투명한 콘택트를 위한 제조 방법
US11227964B2 (en) 2017-08-25 2022-01-18 California Institute Of Technology Luminescent solar concentrators and related methods of manufacturing
EP3762965A1 (en) * 2018-03-06 2021-01-13 3M Innovative Properties Company Automatic registration between circuit dies and interconnects
US11362229B2 (en) 2018-04-04 2022-06-14 California Institute Of Technology Epitaxy-free nanowire cell process for the manufacture of photovoltaics
EP3572873A1 (en) * 2018-05-24 2019-11-27 Paul Scherrer Institut Method for reducing the width of structures generated by ink deposition on pre-patterned substrates
WO2020041522A1 (en) 2018-08-21 2020-02-27 California Institute Of Technology Windows implementing effectively transparent conductors and related methods of manufacturing
CN109395790B (zh) * 2018-12-11 2024-03-29 福州大学 一种纸基复合三维微/纳电路及其加工方法
US11939688B2 (en) 2019-03-29 2024-03-26 California Institute Of Technology Apparatus and systems for incorporating effective transparent catalyst for photoelectrochemical application
US11745440B2 (en) * 2020-04-03 2023-09-05 The Boeing Company Automated lamination system and method for embedding printed electronic elements in a composite structure
US12402418B2 (en) 2020-06-12 2025-08-26 California Institute Of Technology Systems and methods for non-epitaxial high Schottky-barrier heterojunction solar cells
WO2023069739A1 (en) * 2021-10-22 2023-04-27 Worcester Polytechnic Institute Microchannel printing

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US5091339A (en) * 1990-07-23 1992-02-25 Microelectronics And Computer Technology Corporation Trenching techniques for forming vias and channels in multilayer electrical interconnects
JP2900335B2 (ja) * 1992-08-06 1999-06-02 アルプス電気株式会社 転写印刷配線基板
NL1008460C2 (nl) * 1998-03-03 1999-09-06 Acheson Colloiden B V Geleidende inkt of verf.
US6103033A (en) 1998-03-04 2000-08-15 Therasense, Inc. Process for producing an electrochemical biosensor
SG108820A1 (en) * 2001-02-23 2005-02-28 Agency Science Tech & Res Method and apparatus for forming a metallic feature on a substrate
US6896864B2 (en) * 2001-07-10 2005-05-24 Battelle Memorial Institute Spatial localization of dispersed single walled carbon nanotubes into useful structures
US6887450B2 (en) * 2002-01-02 2005-05-03 Zyvex Corporation Directional assembly of carbon nanotube strings
US6872645B2 (en) * 2002-04-02 2005-03-29 Nanosys, Inc. Methods of positioning and/or orienting nanostructures
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US7618704B2 (en) * 2003-09-29 2009-11-17 E.I. Du Pont De Nemours And Company Spin-printing of electronic and display components
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JPWO2006100790A1 (ja) * 2005-03-22 2008-08-28 クラスターテクノロジー株式会社 配線基板の製造方法及び配線基板
JP2007062254A (ja) * 2005-09-01 2007-03-15 Dainippon Ink & Chem Inc 熱成形用積層シートの成形方法

Also Published As

Publication number Publication date
JP2010533939A (ja) 2010-10-28
KR20100044176A (ko) 2010-04-29
WO2009010208A1 (de) 2009-01-22
EP2179633A1 (de) 2010-04-28
CN101755493A (zh) 2010-06-23
JP5606908B2 (ja) 2014-10-15
US20090061213A1 (en) 2009-03-05

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