200923261 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種帶有散熱裝置之發光二極體燈具。 【先前技術】 發光一極體光源作為一種新興之第三代光源，雖目前 還不能大規模取代傳統之白織燈，但其具有工作壽命長、 節能、環保等優點，而普遍被市場看好。且目前由發：二 極體組成之模組能產生大功率、高亮度之光源，因此將廣 泛地、革命性地取代傳統之白熾燈等f知光源，進而成為 符合節能環保主題之主要光源。 然，隨著發光二極體或其模組之功率、亮度之增大， 其產生之熱量亦越來越大’且在體積相對較小之發‘二極 體燈具内更是難於散發出去。故，發光二極體尚存在較大 散熱技術瓶頸’此亦為目前大功率、高亮度發光二極體燈 具市場化最難突破之關鍵。目前業界通用之散熱方案係在 該燈具内設置-散熱器，透過該散熱器表面與自然對流空 亂接觸之方式將熱量散發到周圍空氣中。然而僅僅依靠傳 統之散熱器難以滿足高功率高亮度之發光二極體模組之散 熱需求。 另，由於發光二極體都有-定之照射角度，而發光二 極體燈具中之發光二極體通f都設[在平直之電路板上， 使燈具之照射面積有限，很多情況下都難以使用戶滿意。 【發明内容】 有馨於此，有必要接供_ jir ii a 受抚货種政熱良好，又能增大照明 6 200923261 面積之發光二極體燈具。 一種發光二極體燈具，包 接之發光二極體模組，該散熱器熱連 面延伸而出之複數散熱韓片， 二板及由基板一表 成-橫截面為三角形之凸;:之另-表面上延伸形 愈極體核組貼設在該等均熱板上。 導性能之均熱板將發光二極體料=具=具有高熱傳 上進而快速散發，可有效解決 熱器 光-極形成之凸起，使安裝在其上之發 光一極體之出光方向向基板 之表 體數量之前提下，心大^ 在不增加發光二極 而辦大心J 極體之整體照射角度，進 曰大毛先一極體燈具之照明面積。 【實施方式】 =參考圖W，本發明發光二極體燈具包括 10、置於該散埶器10卜適* 政.、，' 為 20上之Μ貼設在均熱板 對發光0。該散熱器10和均熱板20用來 —極體杈組30散熱’使發光二極體模組30保持在 其允沣之溫度範圍内作方太 、在 作在本發明中，均熱板20即為内 有毛細結構及液體之板型熱管。 散，器H)包括-基板12、由基板12之—表面延伸而 數散熱鰭片14及由基板12之另—表面延伸形成之 15。基板12大致呈矩形塊狀。散熱鰭片14垂直於 土板12且沿縱向互相平行延伸。每兩相鄰散熱鰭片“之 200923261 :’成縱向方向上之供氣流通過之流道14〇。該等流道i4〇 兩緒之長邊平：。沿基板12之甲間部位向基板12之 呈二’厂# 14之高度逐漸減小，從而散熱器10之底端 請參圖4)。基板12之兩側分別開設有複數兩兩 向魅二口 16，該等切口 16沿與散㈣片14垂直之方向 ^^2内延伸並將部分散熱鰭片14切斷。在基板以 頁面:w複數切斷繼片14之溝槽18，該 Γ=σ16平行之方向延伸L溝槽_與其中 旦小Μ刀口 16直接相連通。在本實施例中，溝槽18之數 =8於切口 16之對數，且每相隔一對切口 16開設有一溝 、L凸起15沿基板12之頂面向上—體凸設形成，且凸起 延反12之縱向延伸’即其延伸方向與散熱縛片14之 Γ51位於基板12之頂面之中間部位。凸起二高二 數階梯部152,該等階梯部152上：兩側㈣^ 摇八处, 2〆口凸起b之頂端151呈對 稱刀佈。切口 16分佈在凸起15之兩側。 均熱板20包括一篦一於為 22。第-均熱板21呈長條狀=/和複數第二均熱板 :角:第二Γ均熱板22呈三稜柱形，其截面均呈 傾斜面與面，該兩 夫角用來女裝發光二極體 200923261 模組30 (請參圖4)。 發光二極體模組30包括複數長條狀之電路板31，每一 電路板31上設置有複數發光二極體32。每一電路板31分 別設置在每一均熱板20上。可以理解地，該等電路板31 可以用一整塊大之電路板來代替，發光二極體32可呈矩陣 式排列在該整塊電路板上。 請同時參考圖4和圖5,該發光二極體燈具組裝時，第 一均熱板21貼設於凸起15之頂端151上，每一第二均熱 板22貼置於凸起15之每一階梯部152上。每一電路板31 再分別貼設在每一均熱板20上。由於第二均熱板22收容 在階梯部152上之後形成平滑之傾斜面，置於第二均熱板 22上之電路板31因此會與基板12之頂面形成一炎角。 該發光二極體燈具工作時，由於均熱板20具有較高之 熱傳導效率，發光二極體模組30產生之熱量能被均熱板20 吸收並及時地傳遞到散熱器10之凸起15和基板12上，從 而不會在發光二極體模組30附近聚集。最後透過自然空氣 對流流過散熱鰭片14將熱量散發到周圍空氣中。在本實施 例中，一部分冷卻空氣可沿著散熱鰭片14間之流道140流 動並由該基板12之兩個較短侧邊方向流出，另外一部分氣 流會沿著切口 16和溝槽18流動並由基板12之兩個長邊方 向流出。如此冷卻氣流將由四個方向流出並帶走發光二極 體模組20工作時產生之熱量。該等切口 16和溝槽18之設 置能大大增強散熱器10之散熱鰭片14間之空氣對流。因 此，本發明在不增加散熱器10之體積和散熱鰭片14密度 9 200923261 之前提下而具有更高之散熱效率，姓 傳導性能，可解決發光二極體燈且之ς^、、、板^效之熱 因為設置在散熱器10夕八毛熱問題。 31與散熱器1〇之基板12呈—凸…起1之兩側面上之電路板 32之光線其照射角度可向散熱二之角兩寻張發:二ff 熱态10之兩側之照射面積增大。盥 κ、而朝散 設置在基板12上相比5光二極體32水平地 切 在發光二極體32之數量相 提下’本發明之發k極體32之照射面積更=相问之則 利申：=述’本發明符合發明專利要件，爱依法提出專 安以上所述者僅為本發明之較佳實施例，舉凡 ^匕之人士 m本發明精神所作之等效修飾 或支化，6應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1為本發明發光二極體燈具之一優選實施例之立體 組合圖。 圖2為圖i中發光二極體燈具之立體分解圖。 圖3為圖i中發光二極體燈具之另一視角圖圖。 圖4為圖1中發光二極體燈具之正視圖。 圖5為圖i中發光二極體燈具標出氣流走向之仰視圖。 【主要元件符號說明】 散熱器 10 散熱鰭片 14 凸起 15 基板 12 流道 140 頂端 151 200923261 階梯部 溝槽 第一均熱板 發光二極體模組 發光二極體 152 切口 16 18 均熱板 20 21 第二均熱板 22 30 電路板 31 32 11200923261 IX. Description of the Invention: [Technical Field] The present invention relates to a light-emitting diode lamp with a heat sink. [Prior Art] As a new generation of light source, the illuminating one-pole light source can not replace the traditional white woven lamp on a large scale, but it has the advantages of long working life, energy saving and environmental protection, and is generally favored by the market. At present, the module consisting of: a diode can generate a high-power, high-brightness light source, and thus will widely and revolutionarily replace the traditional incandescent light source, and thus become the main light source in line with the theme of energy conservation and environmental protection. However, as the power and brightness of the light-emitting diode or its module increase, the amount of heat generated is also larger and larger, and it is more difficult to emit in a relatively small volume of the 'diode lamp. Therefore, there are still large thermal energy bottlenecks in the LEDs. This is also the key to the breakthrough of the market for high-power, high-brightness LED lamps. At present, the common heat dissipation solution in the industry is to provide a heat sink in the luminaire, and to dissipate heat into the surrounding air through the surface of the heat sink in contact with natural convection. However, it is difficult to meet the heat dissipation requirements of high-power and high-brightness LED modules simply by relying on conventional heat sinks. In addition, since the light-emitting diodes have a certain illumination angle, and the light-emitting diodes in the light-emitting diode lamps are all provided [on a flat circuit board, the illumination area of the lamps is limited, and in many cases, It is difficult to satisfy the user. [Summary of the Invention] It is necessary to receive this _ jir ii a accommodating the heat of the seed, and can increase the illumination 6 200923261 area of the LED lamp. A light-emitting diode lamp, comprising a light-emitting diode module, wherein the heat-dissipating surface of the heat sink extends a plurality of heat-dissipating Korean films, and the second plate and the substrate are formed into a cross-section with a triangular shape; Further, the surface-extended extended body core group is attached to the soaking plates. The uniformity of the guiding performance of the light-emitting diode will have a high heat transfer and then rapid emission, which can effectively solve the protrusion formed by the light-pole of the heater, and the light-emitting direction of the light-emitting body mounted thereon The number of the body of the substrate is lifted before, and the heart is large. The overall illumination angle of the J-pole is not increased by increasing the number of the light-emitting diodes, and the illumination area of the first-pole lamp of the big hair is entered. [Embodiment] = Referring to Figure W, the illuminating diode lamp of the present invention comprises 10, placed in the sputum 10, and placed on the soaking plate to illuminate 0. The heat sink 10 and the heat equalizing plate 20 are used for the heat dissipation of the pole body group 30 to keep the light emitting diode module 30 within its allowable temperature range. In the present invention, the heat equalizing plate 20 It is a plate type heat pipe with a capillary structure and a liquid. The device H) includes a substrate 12, a heat sink fin 14 extending from the surface of the substrate 12, and a surface extending from the other surface of the substrate 12. The substrate 12 has a substantially rectangular block shape. The fins 14 are perpendicular to the web 12 and extend parallel to each other in the longitudinal direction. Each of the two adjacent heat-dissipating fins "200923261: 'in the longitudinal direction of the airflow through the flow channel 14 〇. The runners i4 〇 绪 之 长 : : : : : : : : 沿 沿 沿 沿 沿 沿 沿 沿 沿 沿 沿 沿 沿 沿 沿 沿 沿 沿 沿The height of the second 'factory #14 is gradually reduced, so the bottom end of the heat sink 10 is shown in Fig. 4). The two sides of the substrate 12 are respectively provided with a plurality of two-way fascinating two mouths 16, which are along the same (4) The vertical direction of the sheet 14 extends in the ^^2 and cuts off some of the heat-dissipating fins 14. On the substrate, the groove 18 of the succeeding sheet 14 is cut by the page:w, and the Γ=σ16 extends in the direction parallel to the L-groove_ In the present embodiment, the number of the grooves 18=8 is the logarithm of the slits 16, and each of the pair of slits 16 is opened with a groove, and the L protrusion 15 is along the top of the substrate 12. The upwardly facing body is formed in a convex shape, and the longitudinal extension of the convex extension 12, that is, the extending direction thereof and the ridge 51 of the heat dissipation tab 14 are located at a middle portion of the top surface of the substrate 12. The convex two high-numbered step portion 152, such On the step portion 152: two sides (four) ^ are shaken eight places, and the top end 151 of the two mouth protrusions b is a symmetric knife cloth. The slits 16 are distributed in the two protrusions 15 The heat equalizing plate 20 includes a first one of 22. The first heat equalizing plate 21 has a strip shape = / and a plurality of second heat equalizing plates: an angle: the second weird heat plate 22 has a triangular prism shape, and the cross section thereof is uniform. The inclined surface and the surface are used for the female light-emitting diode 200923261 module 30 (refer to Fig. 4). The light-emitting diode module 30 includes a plurality of long-length circuit boards 31, each of which is provided. A plurality of light emitting diodes 32 are disposed on each of the plurality of light emitting diodes 32. Each of the circuit boards 31 is disposed on each of the heat equalizing plates 20. As can be understood, the circuit boards 31 can be replaced by a whole large circuit board. The pole bodies 32 may be arranged in a matrix on the whole circuit board. Referring to FIG. 4 and FIG. 5 simultaneously, when the LED package is assembled, the first heat equalizing plate 21 is attached to the top end 151 of the protrusion 15. Each of the second heat equalizing plates 22 is placed on each of the step portions 152 of the protrusions 15. Each of the circuit boards 31 is respectively attached to each of the heat equalizing plates 20. Since the second heat equalizing plate 22 is housed in A smooth inclined surface is formed on the step portion 152, and the circuit board 31 placed on the second heat equalizing plate 22 thus forms an inflammatory angle with the top surface of the substrate 12. When the lamp is working, since the heat equalizing plate 20 has high heat conduction efficiency, the heat generated by the light emitting diode module 30 can be absorbed by the heat equalizing plate 20 and transmitted to the protrusion 15 and the substrate 12 of the heat sink 10 in time. Therefore, it does not accumulate in the vicinity of the LED module 30. Finally, convection through the natural air flows through the fins 14 to dissipate heat into the surrounding air. In this embodiment, a portion of the cooling air can be passed along the fins 14 The flow path 140 flows and flows out from the two shorter side directions of the substrate 12, and another part of the air flow flows along the slit 16 and the groove 18 and flows out from the two long sides of the substrate 12. The cooling airflow will flow out in four directions and carry away the heat generated by the operation of the LED module 20. The provision of the slits 16 and grooves 18 greatly enhances air convection between the fins 14 of the heat sink 10. Therefore, the present invention has higher heat dissipation efficiency without increasing the volume of the heat sink 10 and the density of the heat dissipation fins 14 200923261. The last name transmission performance can solve the LED light and the board, ^ The heat of effect is due to the problem of setting the heat on the radiator 10 overnight. 31, the substrate 12 of the heat sink 1 is convex - the light of the circuit board 32 on both sides of the 1 surface can be radiated to the two corners of the heat dissipation two: two ff illumination areas on both sides of the hot state 10 Increase.盥κ, and the scattered light is disposed on the substrate 12 compared to the number of the light-emitting diodes 32 horizontally cut by the light-emitting diode 32. 'The irradiation area of the k-pole body 32 of the present invention is more than the same.利申:=述' The present invention is in accordance with the requirements of the invention patent, and the above is only the preferred embodiment of the present invention, and the equivalent modification or branching of the spirit of the invention is 6 should be covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective assembled view of a preferred embodiment of a light-emitting diode lamp of the present invention. 2 is an exploded perspective view of the light-emitting diode lamp of FIG. 3 is another perspective view of the light-emitting diode lamp of FIG. 4 is a front elevational view of the light emitting diode lamp of FIG. 1. FIG. 5 is a bottom view of the flow direction of the light-emitting diode lamp of FIG. [Main component symbol description] Heat sink 10 Heat sink fin 14 Bump 15 Substrate 12 Flow path 140 Top 151 200923261 Stepped groove First heat spreader light emitting diode module Light-emitting diode 152 Cut 16 18 Heat spreader 20 21 Second heat spreader 22 30 Circuit board 31 32 11