KR102654278B1 - LED module with a heat dissipation structure on the front of the LED board - Google Patents

Abstract

An LED substrate on which an LED chip is mounted, a first heat sink that is coupled to the back side of the LED substrate to emit heat, a second heat sink that has one side coupled to the front side of the LED substrate to emit heat, and the second heat sink. It includes an LED lens unit coupled to the other side of the sieve, wherein the LED substrate is disposed on a front portion of the LED substrate and includes a heat absorbing portion that absorbs heat generated from the LED chip, and heat transferred from the heat absorbing portion to an external device. It includes an internal heat transfer unit that transfers heat to the heat transfer unit, wherein the second heat sink extends from a point of the external heat transfer unit and the external heat transfer unit disposed in contact with the internal heat transfer unit and the rear portion of the LED lens unit to form the LED lens. An LED module including a heat dissipating portion protruding to surround one side of the module is disclosed.

Description

LED module with a heat dissipation structure on the front of the LED board}

The present invention relates to a technology related to LED modules, and particularly to an LED module having a heat dissipation structure at the front of the LED.

Since LEDs used in conventional outdoor lighting fixtures are exposed to the outdoors, requirements for airtightness, water resistance, and heat dissipation are more important than for indoor devices. In particular, since LED devices have low heat resistance, LED modules, which are modularized by combining a board with LED chips and a heat sink, are used in outdoor lighting fixtures to dissipate the heat generated from the LED.

Recently, the possibility of replacing high-brightness LEDs is increasing, with the development of power LEDs with better brightness than high-brightness LEDs with the same power consumption. However, the problem of burnout due to the rise in temperature of LEDs has not been solved. In this way, heat dissipation of LED modules in outdoor lighting fixtures is a very important issue.

‘LM80’ is the LED lighting reliability evaluation standard of the Energy Star program hosted by the U.S. Environmental Protection Agency (EPA) and is a representative standard for evaluating LED performance. The LM80 test report lists the lifespan according to external temperature, indicating the importance of heat dissipation.

As a related technology, a Korean patent (10-1492040) discloses a replaceable LED module for LED lighting.

In the present invention, in order to compensate for the problem of poor heat dissipation of the heat sink at the back of the LED substrate, which is limited to the inside of the conventional lighting fixture, an LED substrate for heat dissipation and a heat sink at the front of the LED substrate are configured, and a part of the heat sink at the front is used outside the lighting fixture. By exposing it to the LED board, the heat generated from the front of the LED board is intended to be efficiently and naturally released.

In addition, the present invention seeks to provide an LED module with an improved heat emission structure that can prevent light pollution and save energy.

In addition, the present invention seeks to provide an LED module that improves the heat dissipation structure of the LED module, lowers the temperature generated during LED operation, increases luminance at the same power, and extends LED lifespan.

An LED module according to one aspect of the present invention includes an LED substrate on which an LED chip is mounted; a first heat sink coupled to the rear portion of the LED substrate to emit heat; a second heat sink, one surface of which is coupled to the front of the LED substrate to radiate heat; And it may include an LED lens unit coupled to the other surface of the second heat sink. The LED substrate is disposed on the front side of the LED substrate and includes a heat absorbing part that absorbs heat generated from the LED chip, and an internal heat transfer part that transfers the heat received from the heat absorbing part to an external heat transfer part, The second heat sink includes the external heat transfer unit disposed in contact with the internal heat transfer unit and the rear portion of the LED lens unit, and a heat dissipation unit extending from a point of the external heat transfer unit and protruding to surround one side of the LED lens unit. can do.

At this time, the LED substrate may include an insulating layer with thermal conductivity, a circuit layer connecting the LED circuit at the location where the LED chip is mounted, and a metal substrate for heat dissipation.

At this time, the heat absorption part and the internal heat transfer part may be disposed in contact with the insulating layer of the front part of the LED substrate.

At this time, the heat absorbing part may be disposed adjacent to the LED circuit at the location where the LED chip is mounted and surrounding the LED chip.

At this time, the heat absorbing portion is formed as many as the number of LED chips, and the internal heat transfer portion can be connected to any number of heat absorbing portions among the heat absorbing portions.

At this time, the external heat transfer unit may be directly connected to the internal heat transfer unit, or an insulating layer may be disposed between the external heat transfer unit and the internal heat transfer unit.

At this time, the lens of the LED lens unit is disposed at a position corresponding to the LED chip, one side of the LED lens unit is one side of the outer edge of the LED lens unit, and a through hole of the LED lens unit through which the heat dissipating unit penetrates. It may be any one side of the edge forming the .

At this time, a plurality of protrusions (fins) for heat dissipation may be formed on the surface of the heat dissipating unit.

At this time, the first heat sink may be disposed inside the lighting housing, and the heat dissipating portion of the second heat sink may be disposed to be exposed to the outside of the lighting housing.

According to the present invention, it is possible to provide an LED module with improved heat dissipation performance by expanding the contact surface not only to the rear part of the LED substrate but also to the front part in order to dissipate heat generated from the LED substrate.

According to the present invention, heat generated from the front of the LED substrate on which the LED chip is mounted can be efficiently and naturally released by exposing the heat sink on the front of the LED substrate to the outside of the lighting fixture.

According to the present invention, it is possible to provide an LED module with an improved heat dissipation structure that can prevent light pollution and save energy. In other words, the heat sink on the front of the LED board exposed to the outside can prevent light pollution by controlling and limiting part of the light (backlight) emitted from the LED. In addition, the front heat sink of the LED substrate reflects light exposed outside the irradiation range and converts and condenses it within the irradiation range, thereby saving energy by utilizing the lost light.

In addition, according to the present invention, by improving the heat dissipation structure of the LED module, it is possible to provide an LED module that lowers the temperature generated during LED operation, increases luminance at the same power, and extends LED lifespan. In particular, conventional heat dissipation measures only existed on the back of the LED substrate, but the present invention absorbs heat generated on the front of the LED substrate and can dissipate heat generated from the LED substrate to the maximum area (maximum efficiency). In addition, effective cooling is possible through air cooling using natural wind by exposing the lamp to the outside of the lamp rather than simply providing a heat sink.

1 is a configuration diagram for explaining an LED module according to a conventional embodiment.
Figure 2 is a diagram for explaining an LED module according to a conventional embodiment.
Figure 3 is a side view for explaining an LED module according to an embodiment of the present invention.
Figure 4 is a perspective view for explaining an LED module according to an embodiment of the present invention.
Figure 5 is a diagram for explaining an LED substrate according to an embodiment of the present invention.
Figure 6 is a perspective view of a combined LED module according to one embodiment of the present invention.
Figure 7 shows a cross-section and front view of a combined LED module according to an embodiment of the present invention.
Figure 8 is a diagram for explaining the shape of the surface of the heat dissipating portion according to an embodiment of the present invention.
Figure 9 shows an LED module arranged in a lighting fixture housing according to an embodiment of the present invention.
Figure 10 shows a portion of an LED module according to an embodiment of the present invention.

Since the present invention can make various changes and have various embodiments, specific embodiments will be illustrated in the drawings and described in detail. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include all changes, equivalents, and substitutes included in the spirit and technical scope of the present invention.

Terms such as first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, a first component may be named a second component, and similarly, the second component may also be named a first component without departing from the scope of the present invention. The term and/or includes any of a plurality of related stated items or a combination of a plurality of related stated items.

In embodiments of the present application, “at least one of A and B” may mean “at least one of A or B” or “at least one of combinations of one or more of A and B.” Additionally, in embodiments of the present application, “one or more of A and B” may mean “one or more of A or B” or “one or more of combinations of one or more of A and B.”

When a component is said to be "connected" or "connected" to another component, it is understood that it may be directly connected to or connected to the other component, but that other components may exist in between. It should be. On the other hand, when it is mentioned that a component is “directly connected” or “directly connected” to another component, it should be understood that there are no other components in between.

The terms used in this application are only used to describe specific embodiments and are not intended to limit the invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, terms such as “comprise” or “have” are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but are not intended to indicate the presence of one or more other features. It should be understood that this does not exclude in advance the possibility of the existence or addition of elements, numbers, steps, operations, components, parts, or combinations thereof.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the technical field to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and unless explicitly defined in the present application, should not be interpreted in an idealized or excessively formal sense. No.

Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the attached drawings. In order to facilitate overall understanding when describing the present invention, the same reference numerals are used for the same components in the drawings, and duplicate descriptions for the same components are omitted.

1 is a configuration diagram for explaining an LED module according to a conventional embodiment.

Figure 2 is a diagram for explaining an LED module according to a conventional embodiment.

At least some of the prior art configurations of FIGS. 1 and 2 may be included as part of the present invention.

Hereinafter, description will be made with reference to FIGS. 1 and 2.

An LED module mounted on a lighting fixture may include an LED substrate 10, a heat sink 20, and a lens 30.

An LED chip 11 may be mounted on the LED substrate 10.

The heat sink 20 may be coupled to the rear portion of the LED substrate 10 to emit heat.

The lens 30 may be coupled to the front portion of the LED substrate 10. The lens 30 may be a plastic (PC) lens.

A conventional LED module can be installed inside a lighting fixture enclosure. At this time, the lens of the LED module is exposed to the outside of the luminaire enclosure, and the heat sink 20 is located inside the luminaire enclosure, so it has a contradictory structure as an air-cooled heat dissipation structure.

Heat is primarily stored inside the LED substrate (metal substrate) 10, and some of the heat may be released to the heat sink 20 at the rear of the LED substrate. However, in the case of the LED substrate 10, the same or more heat is generated not only in the rear portion of the LED substrate 10 but also in the front portion. In the case of a conventional LED module, the PC lens 30, which has poor heat conduction, is directly connected to the LED substrate 10. It is attached to the front and has a structure that is vulnerable to heat dissipation.

Figure 3 is a side view for explaining an LED module according to an embodiment of the present invention.

Figure 4 is a perspective view for explaining an LED module according to an embodiment of the present invention.

Hereinafter, it will be described with reference to FIGS. 3 and 4 together.

The LED module 100 may include an LED substrate 110, a first heat sink 120, a second heat sink 130, and an LED lens unit 140.

An LED chip 111 may be mounted on the LED substrate 110.

The first heat sink 120 may be coupled to the rear portion of the LED substrate 110 to store and emit heat.

The first heat sink 120 has a plate 121 on which the LED substrate 110 is inserted and contacted and coupled to the groove, and a plurality of protrusions (or a plurality of protrusions) on the opposite side of the surface in contact with the LED substrate 110. Home) (122). Through this, the heat dissipation surface area can be expanded.

One surface of the second heat sink 130 (specifically, one side of the external heat transfer unit) is in contact with a portion of the front part of the LED substrate 110, and the other surface of the second heat sink 130 (specifically, the other surface of the external heat transfer unit) may be placed in contact with the rear portion of the LED lens unit 140.

Specifically, the second heat sink 130 includes an external heat transfer unit 131 disposed in contact with a portion of the front portion of the LED substrate 110 and a portion of the rear portion of the LED lens portion 140, and the external heat transfer portion 131. It may include a heat dissipating portion 132 that extends from one point and protrudes to surround one side of the LED lens portion 140. For example, the second heat sink 130 may be a heat dissipation plate shaped like a letter ('L') or 'T'.

At this time, one side of the LED lens unit 140 is one side of the outer edge 143 of the LED lens unit 140, and a through hole of the LED lens unit 140 for the heat dissipation unit 132 to penetrate ( It may be one of the sides of the edge forming 142).

At this time, the external heat transfer unit 131 and the heat dissipation unit 132 may be made of a metal with high thermal conductivity and high specific heat, for example, aluminum.

Conventionally, the LED lens part is placed on the front part of the LED substrate, and due to the waterproof function of the LED lens part, it is difficult for heat generated from the LED chip to be discharged to the front part of the LED substrate. However, in the present invention, one surface of the external heat transfer unit 131 is brought into contact with the front part of the LED substrate 110 as well as the rear part of the LED substrate, and the other surface of the external heat transfer unit 131 is contacted with the rear part of the LED lens unit 140. Heat can be effectively absorbed by expanding the area directly in contact with the LED substrate 110, and the absorbed heat can be effectively dissipated through the heat dissipation portion 132, which is a protrusion.

The second heat sink 130 may radiate heat generated from the front of the LED substrate 110 to the outside of the lamp. In particular, the heat dissipation unit 132 can control backlight while dissipating heat to the outside of the lamp. The heat dissipating portion 132 may be surface treated in such a way that fins are formed to increase the surface area exposed to the outside.

The LED lens unit 140 can control light generated from the LED according to brightness and light distribution design.

The LED lens unit 140 may have a through hole 142 formed through which the heat dissipating unit 132 passes. Referring to FIG. 4, the LED lens unit 140 is formed with as many through holes 142 as the number of heat dissipating parts 132, and all of the heat dissipating parts 132 penetrate the through holes 142. Thus, it can be contacted and coupled to the LED lens unit 140. In another embodiment, the heat dissipating portion 132 of one of the pair of second heat sinks passes through the through hole 142 formed in the LED lens portion 140, and the heat dissipating portion 132 of the second heat sink of the other pair of second heat sinks passes through the through hole 142 formed in the LED lens portion 140. The heat dissipation unit 132 may be coupled to the LED lens unit 140 in contact with the LED lens unit 140 in a manner that surrounds the side of the LED lens unit 140.

At this time, a conductive material may be used to combine the components of the LED module 100, for example, a highly thermally conductive adhesive or thermal grease may be used.

Figure 5 is a diagram for explaining an LED substrate according to an embodiment of the present invention.

The LED substrate 110 includes an insulating layer (not shown) with thermal conductivity, a circuit layer 117 connecting the LED circuit 116 at the location where the LED chip is mounted, and metal substrates 112, 113, and 114 for heat dissipation. may include.

The circuit layer and the metal substrate may be located under the insulating layer. The circuit layer and the metal substrate may be located on the same layer. At this time, the insulating layer is on the circuit layer, but the insulating layer may or may not be on the metal substrate.

The LED substrate 110 is disposed on the front part of the LED substrate 110 and includes a heat absorption unit 112 that absorbs heat generated from the LED chip 111, and an external heat transfer unit that transfers the heat received from the heat absorption unit 112 to the external heat transfer unit. It may include an internal heat transfer unit 114 that transfers heat to (131).

At this time, the LED substrate 110 may further include a heat passage 113 that conducts heat from the heat absorption portion 112 to the internal heat transfer portion 114.

At this time, the heat absorption portion 112, the heat passage 113, and the internal heat transfer portion 114 may be made of metal with high thermal conductivity and low specific heat, such as silver, copper, or gold.

At this time, the heat absorber 112 is arranged between the LED chip 111 and the LED substrate 110 to surround one side of the LED chip 111, which is the main heating element, depending on the size of the LED chip 111. The absorption area can be expanded. That is, the heat absorption portion 112 may be disposed adjacent to the LED circuit 116 at a location where the LED chip is mounted and surrounding the LED chip. For example, the heat absorption portion 112 may be formed in an hourglass or 'I' shape. The middle portion of the heat absorption portion 112 may be a portion that penetrates between a pair of internal circuits (circuit layers) of the area 115 where the LED chip 111 is mounted.

The heat absorption portion 112 may be formed as many as the number of LED chips. Additionally, the internal heat transfer unit 114 may be connected from as many heat absorption units 112 as there are LED chips, and may be composed of one or more internal heat transfer units 114 . For example, in the embodiment of FIG. 5, there are a total of 10 areas 115 where the LED chip 111 will be mounted (2 rows of 5 areas), and a heat absorption part 112 is formed in each area 115. The heat absorption units 112 may be connected to the internal heat transfer unit 114 through heat passages 113 connected to each other. For example, the five upper heat absorption units 112 may each be connected to one upper internal heat transfer unit 114 through the corresponding heat passage 113. Additionally, the five lower heat absorption units 112 may each be connected to one lower internal heat transfer unit 114 through the corresponding heat passage 113.

In other words, it can be understood that the heat absorbed through the five heat absorption units 112 is integrated into one internal heat transfer unit 114 and the heat can be dissipated.

In FIG. 5, one internal heat transfer unit 114 is shown for each of the five heat absorption units 112, but in other embodiments, any number of heat absorption units 112 (for example, one/or two, etc.) may be used. may be connected to the internal heat transfer unit 114. It is understandable that this correspondence may change depending on which case is more effective in dissipating heat.

Referring to FIGS. 4 and 5 together, the external heat transfer unit 131 of the second heat sink 130 may be disposed in contact with the internal heat transfer unit 114 of the LED substrate 110. The heat dissipating part 132 of the second heat sink 130 may extend from a point of the external heat transfer part 131 and protrude through a point of the LED lens part 140 or to surround one side.

At this time, the heat absorption portion 112, the heat passage 113, and the internal heat transfer portion 114 may be disposed in contact with the insulating layer on the front portion of the LED substrate 110. At this time, a heat conductive material or a direct contact may be disposed between the internal heat transfer unit 114 and the external heat transfer unit 131.

According to the present invention, the second heat sink 130 is configured so that the external heat transfer part 131 is in contact with the internal heat transfer part 114 of the front part of the LED substrate 110, and the wider the contact area is, the larger the contact area is. The heat dissipation effect can be excellent.

Figure 6 is a perspective view of a combined LED module according to one embodiment of the present invention.

Figure 7 shows a cross-section and front view of a combined LED module according to an embodiment of the present invention.

The upper view of FIG. 7 shows a cross-section of the LED module in the direction A-A of FIG. 6.

Hereinafter, it will be described with reference to FIGS. 6 and 7 together.

The lens 141 of the LED lens unit 140 may be disposed at a position corresponding to the LED chip 111. Looking at the cross section, it can be seen that the heat absorption part 112, the heat passage 113, and the internal heat transfer part 114 of the LED substrate 110 are arranged on the side of the LED chip 111. For example, in the embodiment of FIG. 7, it can be seen that the second heat sink 130 is a 'T' shaped plate. At this time, the heat absorption portion 112 and the internal heat transfer portion 114 may be disposed in contact with the insulating layer of the front portion of the LED substrate 110, or may be disposed in direct contact with the insulating layer.

At this time, the right end of the external heat transfer unit 131 and the end of the internal heat transfer unit 114 may be located in a straight line.

Referring to FIGS. 5 and 7 together, it can be seen that the heat absorption portion 112 extends further to the left than the left end of the LED chip 111.

Figure 8 is a diagram for explaining the shape of the surface of the heat dissipating portion according to an embodiment of the present invention.

A plurality of protrusions (fins) may be formed on the surface of the heat dissipation unit 132 to dissipate heat. In another embodiment, shallow grooves for heat dissipation may be formed on the surface of the heat dissipation unit 132. In another embodiment, the surface may be treated in a different way to increase the surface area for heat dissipation.

Figure 9 shows an LED module arranged in a lighting fixture housing according to an embodiment of the present invention.

Among the LED modules 100, the heat dissipating portion 132 of the second heat sink 130 and a portion of the LED lens portion 140 are coupled to the luminaire housing 200 so as to be exposed to the outside of the luminaire housing (enclosure) 200. It can be. That is, the first heat radiator 120 of the LED module 100 may be disposed inside the luminaire housing 200, and the second heat radiator 130 may be disposed to be exposed to the outside of the luminaire housing.

When the light fixture is turned on, heat is generated from the LED chip. The first heat sink 120 may emit heat through the rear portion of the LED substrate 110, and the second heat sink 130 may emit heat through the front portion of the LED substrate 110. However, since the LED lens unit 140, which cannot emit heat for waterproofing, is located on the front part of the second heat sink 130, the external heat transfer portion 131 of the second heat sink 130 absorbs heat and , heat may be dissipated through the surface of the heat dissipation unit 132. As seen in FIG. 7, the surface of the heat dissipating part 132 may be treated to increase the surface area of the heat dissipating part 132 to facilitate dissipation to the outside.

Figure 10 shows a portion of an LED module according to an embodiment of the present invention.

As described above, since the heat dissipation unit 132 surrounds the LED lens unit 140 and protrudes, light pollution can be prevented by controlling and limiting part of the light (backlight) emitted from the LED. In addition, the heat dissipation unit 132 reflects light exposed outside the irradiation range and converts and condenses it within the irradiation range, thereby saving energy by utilizing the lost light.

Although the present invention has been described with reference to preferred embodiments of the present invention, those skilled in the art may make various modifications and changes to the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. You will understand that it is possible.

Claims (9)

LED board with LED chip mounted on it;
a first heat sink coupled to the rear portion of the LED substrate to emit heat;
a second heat sink, one surface of which is coupled to the front of the LED substrate to radiate heat; and
An LED lens unit coupled to the other surface of the second heat sink and having a through hole formed therein;
Includes,
The LED substrate is disposed on the front side of the LED substrate and includes a heat absorbing part that absorbs heat generated from the LED chip, and an internal heat transfer part that transfers the heat received from the heat absorbing part to an external heat transfer part,
The second heat sink is arranged to be stacked in the order of the internal heat transfer unit, the external heat transfer unit, and the LED lens unit, and is perpendicular to the direction in which the external heat transfer unit extends from a point of the external heat transfer unit. A heat dissipating part extending in the direction and protruding through the through hole of the LED lens unit,
LED module. The LED module of claim 1, wherein the LED substrate includes an insulating layer with thermal conductivity, a circuit layer connecting the LED circuit at the position where the LED chip is mounted, and a metal substrate for heat dissipation. The LED module of claim 1, wherein the heat absorption part and the internal heat transfer part are disposed in contact with an insulating layer of the front portion of the LED substrate. The LED module of claim 1, wherein a portion of the heat absorption portion is in contact with the LED chip. The LED module of claim 1, wherein the heat absorption units are formed as many as the number of LED chips, and the internal heat transfer units are connected to a random number of heat absorption units among the heat absorption units. The LED module of claim 1, wherein the external heat transfer unit is directly connected to the internal heat transfer unit or an insulating layer is disposed between the external heat transfer unit and the internal heat transfer unit. The LED module of claim 1, wherein the lens of the LED lens unit is disposed at a position corresponding to the LED chip. The LED module according to claim 1, wherein a plurality of protrusions for heat dissipation are formed on the surface of the heat dissipation unit. The LED module of claim 1, wherein the first heat sink is disposed inside the lighting housing, and the heat dissipating portion of the second heat sink is disposed to be exposed to the outside of the lighting housing.

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