200919145 九、發明說明： 【發明所屬之技術頜域】 本發明與電子裝置之機殼結構有關，特別是關於一 空氣回流之機殼結構。 ；種防止熱 【先前技術】 在各種電子產品的效能不斷提昇之下，伴隨 ^ 也日益嚴重，其中又m攜式電子裝置的散熱:題問題 如筆記型電腦、掌上型電腦等等的可攜式電子裝置，、文重。例 巧易攜帶的特性，所以其機殼的設計都是以為了保有輕 工〆寻钮小為原則。i日 k 狀下，可攜式電子裝置機殼内部的空間就顯得相當有限，相 機殼内部的電子元件必須相當緊密的排列，所以電=元'"，致使 運作所產生的熱能也容易_在可攜式電子裝置機殼4長= 短時間崎整個可赋電子裝㈣溫糾相高。因此，〜在 適時地將可攜式電子裝卿謂的魏迅速排除，彳 子兀件一直處於高溫的作業環境下，勢 “ 置的正常運作，甚至造成電子元件過熱_^们攜式電子裝 =「第1圖」所示，為—般筆記型電腦散熱部位之局部剖面 筆=。筆記型電腦10具有一機殼U，而機㈣係用以包覆住 :niG之電子树。機殼u内部裝設有用來對電 =^=器12。機殼n的底部開設有多個散熱孔13與散 ^ 月^』12由散熱孔13從機殼η外面吸入溫度較低的 且空氣”走散絲12上由電子元件上魏的廢熱而升 〜後政熱$ 12再將溫度較高的空氣從散熱孔⑷非到機殼u 200919145 外’以藉由熱傳導與氣體對流排出電子元件運作時產生的熱能。 就散熱的角度而言，若是由散熱孔13進入散熱器12的空氣溫度 越低，散熱的效率就越好。然而，因散熱孔13及散熱孔14之間 並無任何阻隔，所以從散熱孔14排出的高溫空氣报有可能會沿著 機殼11底面流向散熱孔13周圍’然後再次被散熱器12由散熱孔 13吸入。如此一來，由散熱孔13進入散熱器12的空氣之溫度就 會提高許多，導致散熱器12的整體散熱效率下降。 【發明内容】 鑒於先前技術中筆記型電腦散熱排出之熱空氣會回流的問 題，本發明的主要目的在於提供一種電子裝置之機殼結構，以解 決先前技術中熱空氣回流導致散熱效率降低的問題。 為解決上述之問題，本發明係提供一種電子裝置之機殼結 構，係包括有-殼體及-止流擋>;，而且機殼結構㈣設置有一 散熱組件。散齡件具有-吸氣端及—職端，且組件係由 吸氣端吸氣並從排氣端排氣。殼體之一表面具有至少一進氣孔及 至少-排氣孔，其中進氣孔侧應於散触件之吸氣端，而排氣 孔則對應驗散触件之職端。散件可由殼體之進氣孔將 空氣吸入餘巾，然麟從殼體之減絲錢排㈣殼外。止 流播片設置於殼體之表面並位於進氣孔與排氣孔之間，而且止流 擋片係沿-長軸橫跨設置於進氣孔與職孔H使由排纽L 排出之空氣無法流動至吸氣口。 200919145 熱組件維持在較佳的散熱效率。 以下在貫施方式中詳細敘述本發明之詳細特徵以及優點，其 内谷足以使任何熟習相關技藝者了解本發明之技術内容並據以實 施且根據本說a月書所揭露之内容、申請專利範圍及圖式，任何 熟習相關技藝者可輕祕理解本發明前述之目的及優點。 以上之關於本發明内容之制及以下之實施方式之說明係用 以示範與轉本發明之顧，並域供本發明之專射請範圍更 進一步之解釋。 【實施方式】 為使對本發明的目的、構造、特徵、及其功能有進一步的瞭 解，紅配合實施例詳細說明如下。 所第2圖」及「第3圖」所示，為本發明第一實施例 :之電子U之機殼結構’侧以容置—電子裝置Μ之主 電子裝置樣結構包括 述電子裝置20可為但不;限於的狀實施方式中，前 式雷子^ ⑽㈣挪鶴、掌上型電腦等等可攜 埶植件^ 之機殼結構内部設置有—電路板21及一散 而且散熱組件23伽崎 期狀主枝板， 緣設置有多個連接埠211，初散熱。電路板21之邊 邊硬體裝置用。 （、電子裝置20之主機連接擴充周 以由吸氣端 一風扇233、 231 200919145 -散熱鰭片組234及—熱導管235所組成。熱導管 =Γ:其中鱗管235係觸導方式帶走電路板文 …源m且軸源之熱能傳導至賴鰭仏 233係用以產生一岭士血也妙u , 、 ^ 人向散熱鰭片組234與熱管235之 空f内進行對流，使散熱㈣組234與熱管况上的= 能以熱交財式料至錢，_由财換將' 散熱鰭片組234與熱管235上的熱能帶走。 …丄澹 請繼續參閱「第3圖」、「第4圖」及「第5圖」所示。電子 裝置20係放置於一平面5〇，例如桌子的頂面。殼體a係用以裝 载電子裝置20之主機，並提供主機内部之電子元件(電路板叫 及散熱組件23適當的保護與支擇。殼體a的底部具有一面對平 面50之表面221，表面221具有複數個進氣孔奶、複數個排氣 孔223及複數個分散之_似。㈣墊故的基部連接於殼體 22之表面221 ’而各腳塾224的前端抵擇於平面％，使電子裝置200919145 IX. INSTRUCTIONS: [Technical jaw region to which the invention pertains] The present invention relates to a casing structure of an electronic device, and more particularly to a casing structure for air recirculation. Kind of heat prevention [previous technology] Under the continuous improvement of the performance of various electronic products, the accompanying ^ is also becoming more and more serious, and the heat dissipation of the m-carrying electronic device: the problem of the problem such as the notebook computer, the palm-sized computer, etc. Electronic device, Wenzhong. The design is easy to carry, so the design of the case is based on the principle of keeping the light work and finding the button small. In the case of i-day k, the space inside the casing of the portable electronic device is quite limited, and the electronic components inside the camera case must be arranged quite closely, so the electric energy is easy to operate, so that the heat generated by the operation is also easy. _ In the portable electronic device case 4 length = short time, the entire can be electronically loaded (four) temperature correction phase high. Therefore, ~ in a timely manner, the portable electronic equipment is said to be quickly eliminated, and the electronic components have been in a high-temperature working environment, and the potential operation is set, and even the electronic components are overheated. = "Figure 1" shows a partial profile pen for the heat sink of a notebook computer. The notebook computer 10 has a casing U, and the machine (4) is used to cover the electronic tree of the :niG. The casing u is internally provided with a counter for the electric device. The bottom of the casing n is provided with a plurality of heat dissipation holes 13 and a plurality of heat dissipation holes 13 which are sucked from the outside of the casing n by the heat dissipation holes 13 and the air is removed from the waste heat of the electronic components. ~ After the political heat $ 12 and then the higher temperature air from the vents (4) to the case u 200919145 outside the 'heat energy generated by the heat conduction and gas convection discharge electronic components. In terms of heat dissipation, if it is The lower the temperature of the air entering the heat sink 12, the better the heat dissipation efficiency. However, since there is no barrier between the heat dissipation holes 13 and the heat dissipation holes 14, the high temperature air discharged from the heat dissipation holes 14 may be reported. It flows along the bottom surface of the casing 11 toward the periphery of the heat dissipation hole 13 and is again sucked by the heat dissipation hole 13 by the heat dissipation hole 13. Thus, the temperature of the air entering the heat sink 12 from the heat dissipation hole 13 is increased a lot, resulting in the heat sink 12 The overall heat dissipation efficiency is reduced. SUMMARY OF THE INVENTION In view of the problem that the hot air discharged from the notebook computer in the prior art is reflowed, the main object of the present invention is to provide a casing structure of the electronic device to solve the previous problem. In the technology, hot air recirculation causes a problem of reduced heat dissipation efficiency. To solve the above problems, the present invention provides a casing structure of an electronic device, including a casing and a stop block, and a casing structure (4) A heat dissipating component is disposed. The age piece has a suction end and a service end, and the component is inhaled by the suction end and exhausted from the exhaust end. One surface of the housing has at least one air inlet and at least one row The air hole, wherein the air inlet side should be at the suction end of the dispersing member, and the vent hole corresponds to the working end of the dispersive contact member. The loose member can be sucked into the residual towel by the air inlet hole of the housing, The outer wire of the casing is arranged outside the casing. The flow stop piece is disposed on the surface of the casing and located between the air inlet hole and the air vent hole, and the flow stop piece is disposed along the long axis across the air inlet hole and The service hole H prevents the air discharged from the discharge line L from flowing to the suction port. 200919145 The heat assembly maintains the heat dissipation efficiency. The detailed features and advantages of the present invention are described in detail below, and the inner valley is sufficient for Anyone skilled in the art will understand the technical content of the present invention and And the above-mentioned objects and advantages of the present invention can be understood by those skilled in the art in light of the disclosure, the scope of the application, and the drawings. The description is used to demonstrate and transfer the invention, and the scope of the invention is further explained by the scope of the invention. [Embodiment] In order to further understand the object, structure, features and functions of the present invention, The red matching embodiment is described in detail below. The second embodiment and the third figure show the first embodiment of the present invention: the side of the casing structure of the electronic U is accommodated - the main electronic device of the electronic device The structure includes an electronic device 20 which may be, but not limited to; in the limited embodiment, the front type Leizi ^ (10) (four), the crane, the palm computer, etc., the inside of the casing structure of the portable planting member ^ is provided with a circuit board 21 And a diffuse and heat-dissipating component 23 gaezaki-shaped main branch board, the edge is provided with a plurality of ports 211 for initial heat dissipation. The side of the circuit board 21 is used for the hardware device. (The host connection of the electronic device 20 is extended by a suction end, a fan 233, 231 200919145 - a heat sink fin set 234 and a heat pipe 235. The heat pipe = Γ: wherein the scale tube 235 is taken away by the contact mode The circuit board text... source m and the heat energy of the shaft source is transmitted to the Lai fin 233 system for generating a lingering blood, and the convection of the cooling fin group 234 and the heat pipe 235 is performed to make the heat dissipation. (4) Group 234 and the heat pipe condition = can exchange the heat to the money, _ by the financial exchange will 'heat the fin group 234 and the heat pipe 235 heat energy. ... 继续 Please continue to refer to "3" As shown in Fig. 4 and Fig. 5. The electronic device 20 is placed on a flat surface, such as the top surface of a table. The housing a is used to mount the host of the electronic device 20 and provides internal host. The electronic component (the circuit board and the heat dissipating component 23 are appropriately protected and controlled. The bottom of the housing a has a surface 221 facing the plane 50, and the surface 221 has a plurality of air inlet holes, a plurality of air holes 223 and A plurality of discrete _like. (4) The base of the pad is connected to the surface 221 ' of the housing 22 and the front end of each of the ankles 224 Optional% to the plane of the electronic device
V 2〇的底部架高在平面50上，換句話說，殼體22之表面功係與 平面50保持一適當的距離。殼體22之進氣孔從係對應於散埶 組件23之吸氣端231，而且殼體22之排氣孔223係對應於散熱 組件23之排氣端232。因此，散熱組件23之風扇233就能夠順 利地由進氣孔222將空氣吸入殼體22㈣，以產生前述吹向散熱 鰭片組234之氣流，而氣流流過散熱,鰭片組234後也能夠順利地 從排氣孔223排出機殼22外。所以，由排氣孔223流出殼體2 之氣流為相對高溫之空氣，而位於進氣孔222周遭的空氣為相對 低溫之空氣。 ' 200919145 請繼續參閱「第4圖」及「第5圖」所示。止流播月24係設 置於殼體22底部之表面221，並且位於進氣孔222與拼氣孔223 之間其巾止雜24可以是—體賴於殼體22底部之表面 功，或者是藉由固定手段結合於殼體22底部之表面22卜止流 ^片24具有長度相對長之長侧及具有長度相對短之短侧，其中止 /瓜擋片24之長側係沿著一長轴置於殼體22之表面⑵，即前述 2轴係平行於止流擋;^ 24之長侧。止流擋片24係沿前述之長轴 板跨設置在進氣孔222與排氣孔223之間，使止流播片Μ的各長 側係刀別面對進氣孔222與排氣孔223。止流擒片24沿前述長軸 之長度係大於排氣孔223沿該長轴之長度，而且止流擔片24沿前 述長軸之長度係大於進氣孔222沿長軸之長度。因此，原本由排 纽223拼出殼體22之熱空氣有可能會往進氣孔222方向流動， 但是由於止流擋片24在進氣孔222與排氣孔奶形成阻隔下，使 _氣孔223排出之熱空氣無法流動至吸氣口 222。腳墊224之 呵度係大於止流擔片24之高度’即腳墊224前端與表面功之距 離大於止流擋片24前端與表面221之距離，使止流撞片％不會 影響電子裝置20放置於平面5〇上。 如「第6圖」及「第7圖」所示，為本發明第二實施例所提 供之電子m殼結構，其具體實财式與前述第—實施例大 致相同，而兩實施例的差異之處如下。第二實施例中止流擒片24 3端分別具有-侧擋部241。各側播部241之一端係分別與止 4片24的兩端邊緣連接，並且朝排氣孔223的側邊延伸 側擋部241之另-端位於排氣孔223之外側。因此，止流擒片Μ 200919145 與側擋部241係由三邊將排氣孔223包圍，更加能夠使由排氣孔 223排出之熱空氣無法流動至吸氣口 222。 又如「第8圖」及「第9圖」所示，為本發明第三實施例所 提供之電子裝置之機殼結構，其具體實施方式與前述第二實施例 大致相同，而兩實施例的差異之處如下。第三實施例中止流擋片 24之前端具有一前擋部242。前擋部242之一端與止流擋片24前 端邊緣連接，且前擋部242之兩侧邊緣與側擋部241前端邊緣連 接。前擋部242係朝排氣孔223的側邊延伸，以與止流擋片24及 側擂部241形成一開口朝向排氣孔223之罩體3〇。因此，止流擔 片24、侧擋部241及前擋部242所形成之罩體3〇係罩住排氣孔 223的-側’更加能夠使由排氣孔223排出之熱空氣無法流動至 吸氣口 222。 再如第10圖」及「第n圖」所示，為本發明第四實施例 所提供之電子裝置之機殼結構，其具體實施方式與前述第一實施 例大致相同，而兩實施例的差異之處如下。第四實施例中止流揚 片24之兩端分別具有一側擋部加，而且止流則24係由表面田 1 «申出並朝排氣孔223彎曲成弧形之斷面。各侧播部241亦 配合止流擋片24構造而分猶接於止流擋片％的兩側與表面 221，並且位於排氣孔223之外侧。目此，止流播片μ與侧撞部 24!係形成-罩體3〇，而罩體如則罩住排氣孔223的一侧，能夠 ^ =空氣回流，使由排氣孔如排出之熱空氣無法流動至吸氣 綜觀前述之各實施例，正流擋片24可單獨或配合其他附件阻 10 200919145 擔氣流由殼體22之排氣孔223力向進氣孔拉，以防止溫产較古 的熱空氣由回流到進氣孔222，使進入進氣孔222的氣流 低的溫度，而散熱組件23也能_持在較佳的散熱效率。 雖然⑽明以前述之實施例揭露如上，鋪並非用以限定本 發明。在不脫離本發明之精神和範_，所為之更動與潤倚，均 屬本發明之專娜護範圍。關於本發明所界定之保護範圍請表考 所附之申請專利範圍。 【圖式簡單說明】 第1圖為習知技術中筆記型電腦散熱孔開設位置之剖面示意 圖。 ' 第2圖為本發明第一實施例中電子裝置之立體示意圖。 第3圖為本發明第一實施例中電子裝置之局部剖面示意圖。 第4圖為本發明第一實施例中電子裝置之局部立體示意圖。 第5圖為第3圖中氣流流動方向示意圖。 第6圖為本發明第二實施例中電子裝置之立體示意圖。 第7圖為本發明第二實施例中電子裝置之局部剖面示意圖。 第8圖為本發明第三實施例中電子裝置之立體示意圖。 第9圖為本發明第三實施例中電子裝置之局部剖面示意圖。 第10圖為本發明第四實施例中電子裝置之立體示意圖。 第11圖為本發明第四實施例中電子裝置之局部剖面示意圖。 【主要元件符號說明】 10 .............................筆記型電腦 11 .............................機殼 200919145 12 .............................散熱器 13 .............................散熱孔 14 .............................散熱孔 20 .............................電子裝置 21 .............................電路板 211...........................連接埠 22 .............................殼體 221 ...........................表面 222 ...........................進氣孔 223 ...........................排氣孔 224 ...........................腳墊 23 .............................散熱組件 231 ...........................吸氣端 232 ...........................排氣端 233 ...........................風扇 234 ...........................散熱鰭片組 235 ...........................熱導管 24 .............................止流擋片 241 ...........................側擋部 242 ...........................前擋部 30.............................罩體 50.............................平面 12The bottom of the V 2 crucible is elevated on the plane 50, in other words, the surface power of the housing 22 is maintained at an appropriate distance from the plane 50. The intake port of the housing 22 corresponds to the suction end 231 of the heat sink assembly 23, and the exhaust port 223 of the housing 22 corresponds to the exhaust end 232 of the heat sink assembly 23. Therefore, the fan 233 of the heat dissipating component 23 can smoothly suck the air into the casing 22 by the air inlet 222 to generate the airflow that is blown toward the fin group 234, and the airflow flows through the heat dissipation, and the fin group 234 can also The outer casing 22 is smoothly discharged from the exhaust hole 223. Therefore, the airflow from the venting opening 223 to the casing 2 is relatively high temperature air, and the air surrounding the air inlet 222 is relatively low temperature air. ' 200919145 Please continue to refer to "Figure 4" and "Figure 5". The flow stop 24 is disposed on the surface 221 of the bottom of the casing 22, and the towel stop 24 between the air inlet 222 and the air hole 223 may be the surface work of the bottom of the casing 22, or by The fixing means is coupled to the surface 22 of the bottom of the casing 22. The flow stop 24 has a long side having a relatively long length and a short side having a relatively short length, wherein the long side of the stop/gut block 24 is disposed along a long axis. On the surface (2) of the casing 22, that is, the aforementioned two-axis system is parallel to the long side of the stop block; The stop baffle 24 is disposed between the intake hole 222 and the exhaust hole 223 along the long axis plate so that the long side cutters of the flow stop piece 面对 face the intake hole 222 and the exhaust hole 223 . The length of the stop piece 24 along the long axis is greater than the length of the venting opening 223 along the major axis, and the length of the stop plate 24 along the longitudinal axis is greater than the length of the inlet aperture 222 along the major axis. Therefore, the hot air originally spliced out of the casing 22 by the row 223 may flow toward the air inlet hole 222, but since the stop block 24 forms a barrier between the air inlet hole 222 and the vent hole milk, the vent hole The hot air discharged by 223 cannot flow to the suction port 222. The height of the foot pad 224 is greater than the height of the flow stop plate 24, that is, the distance between the front end of the foot pad 224 and the surface work is greater than the distance between the front end of the stop block 24 and the surface 221, so that the flow stop plate % does not affect the electronic device. 20 placed on the plane 5〇. As shown in FIG. 6 and FIG. 7, an electronic m-shell structure according to a second embodiment of the present invention is substantially the same as the foregoing first embodiment, and the difference between the two embodiments is as shown in FIG. The place is as follows. In the second embodiment, the stop slabs 24 3 end have a side stop 241, respectively. One end of each of the side sowing portions 241 is connected to the both end edges of the stopper 24, and extends toward the side of the exhaust hole 223. The other end of the side stopper portion 241 is located on the outer side of the exhaust hole 223. Therefore, the stop Μ Μ 200919145 and the side stopper portion 241 surround the vent hole 223 by three sides, and the hot air discharged from the vent hole 223 can be prevented from flowing to the intake port 222. As shown in FIG. 8 and FIG. 9 , a casing structure of an electronic device according to a third embodiment of the present invention is substantially the same as the second embodiment, and two embodiments are provided. The differences are as follows. In the third embodiment, the front end of the flow stop piece 24 has a front stop portion 242. One end of the front stop portion 242 is coupled to the front end edge of the stop block 24, and both side edges of the front stop portion 242 are coupled to the front end edge of the side stop portion 241. The front stopper portion 242 extends toward the side of the vent hole 223 to form a cover 3 开口 with the opening stop piece 24 and the side dam portion 241 opening toward the vent hole 223. Therefore, the cover 3 formed by the stop plate 24, the side stop portion 241 and the front stop portion 242 covers the side of the exhaust hole 223, so that the hot air discharged from the exhaust hole 223 cannot flow to Intake port 222. Further, as shown in FIG. 10 and FIG. 5, a casing structure of an electronic device according to a fourth embodiment of the present invention is substantially the same as the first embodiment, and the two embodiments are The differences are as follows. In the fourth embodiment, both ends of the stop flow piece 24 have a side stop portion, and the stop flow 24 is a section which is formed by the surface field 1 «curved and curved toward the exhaust hole 223. Each of the side bearing portions 241 also cooperates with the stop block 24 to be attached to both sides of the stop chock and the surface 221, and is located outside the exhaust hole 223. Therefore, the flow stop piece μ and the side collision portion 24 are formed into the cover body 3, and the cover body covers the side of the exhaust hole 223, so that the air can be recirculated so that the exhaust hole is discharged. The hot air cannot flow to the inhalation to look at the foregoing embodiments. The positive flow baffle 24 can be used alone or in combination with other accessories. The load flow is pulled from the exhaust hole 223 of the casing 22 toward the intake hole to prevent the temperature from being produced. The older hot air is returned to the air inlet 222, so that the airflow entering the air inlet 222 is at a low temperature, and the heat dissipating component 23 can also maintain a better heat dissipation efficiency. Although (10) is disclosed above in the foregoing embodiments, the present invention is not intended to limit the invention. Without departing from the spirit and scope of the present invention, it is within the scope of the present invention. Regarding the scope of protection defined by the present invention, please refer to the attached patent application scope. [Simple description of the drawing] Fig. 1 is a schematic cross-sectional view showing the position of the cooling hole of the notebook computer in the prior art. Fig. 2 is a perspective view showing the electronic device in the first embodiment of the present invention. Figure 3 is a partial cross-sectional view showing the electronic device in the first embodiment of the present invention. Figure 4 is a partial perspective view of the electronic device in the first embodiment of the present invention. Figure 5 is a schematic view of the flow direction of the air flow in Figure 3. Figure 6 is a perspective view of an electronic device in a second embodiment of the present invention. Figure 7 is a partial cross-sectional view showing the electronic device in the second embodiment of the present invention. Figure 8 is a perspective view of an electronic device in a third embodiment of the present invention. Figure 9 is a partial cross-sectional view showing an electronic device in a third embodiment of the present invention. Figure 10 is a perspective view of an electronic device in a fourth embodiment of the present invention. Figure 11 is a partial cross-sectional view showing an electronic device in a fourth embodiment of the present invention. [Main component symbol description] 10 ............................. Notebook computer 11 .......... ...................Chassis 200919145 12 ........................... .. Radiator 13 .............................The vents 14 ............. ................heat vent 20 .............................electronic device 21 .............................Circuit board 211................ ..........Connection 埠22 ............................. Housing 221 ..... ......................surface 222 .......................... Air intake hole 223 ........................... vent hole 224 .............. .............foot pad 23 .............................heating assembly 231 .. ......................... Inhalation end 232 ..................... ...exhaust end 233 ...........................fan 234 ........... ................ Heat sink fin set 235 ...........................heat pipe 24 .............................stop block 241 ............... ......... side stop 242 ..................... front stop 30... ..........................cover 50.. ...........................plane 12