TW200914855A - Testing apparatus of semiconductor package device - Google Patents

Testing apparatus of semiconductor package device Download PDF

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Publication number
TW200914855A
TW200914855A TW96135905A TW96135905A TW200914855A TW 200914855 A TW200914855 A TW 200914855A TW 96135905 A TW96135905 A TW 96135905A TW 96135905 A TW96135905 A TW 96135905A TW 200914855 A TW200914855 A TW 200914855A
Authority
TW
Taiwan
Prior art keywords
test
semiconductor package
transfer
unit
package component
Prior art date
Application number
TW96135905A
Other languages
English (en)
Chinese (zh)
Other versions
TWI336403B (enrdf_load_stackoverflow
Inventor
Yuan-Ji Lin
zhi-hong Xie
jun-hong Huang
Original Assignee
King Yuan Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by King Yuan Electronics Co Ltd filed Critical King Yuan Electronics Co Ltd
Priority to TW96135905A priority Critical patent/TW200914855A/zh
Publication of TW200914855A publication Critical patent/TW200914855A/zh
Application granted granted Critical
Publication of TWI336403B publication Critical patent/TWI336403B/zh

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  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW96135905A 2007-09-27 2007-09-27 Testing apparatus of semiconductor package device TW200914855A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96135905A TW200914855A (en) 2007-09-27 2007-09-27 Testing apparatus of semiconductor package device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96135905A TW200914855A (en) 2007-09-27 2007-09-27 Testing apparatus of semiconductor package device

Publications (2)

Publication Number Publication Date
TW200914855A true TW200914855A (en) 2009-04-01
TWI336403B TWI336403B (enrdf_load_stackoverflow) 2011-01-21

Family

ID=44725552

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96135905A TW200914855A (en) 2007-09-27 2007-09-27 Testing apparatus of semiconductor package device

Country Status (1)

Country Link
TW (1) TW200914855A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI470231B (zh) * 2012-06-06 2015-01-21 Howay Corp Test equipment and test methods
CN114435970A (zh) * 2020-11-03 2022-05-06 群翊工业股份有限公司 先进先出运输设备及其使用方法
TWI779892B (zh) * 2021-10-20 2022-10-01 鴻勁精密股份有限公司 承盤模組、置料裝置及作業機

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI470231B (zh) * 2012-06-06 2015-01-21 Howay Corp Test equipment and test methods
CN114435970A (zh) * 2020-11-03 2022-05-06 群翊工业股份有限公司 先进先出运输设备及其使用方法
TWI779892B (zh) * 2021-10-20 2022-10-01 鴻勁精密股份有限公司 承盤模組、置料裝置及作業機

Also Published As

Publication number Publication date
TWI336403B (enrdf_load_stackoverflow) 2011-01-21

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