TW200914818A - Inspecting apparatus and inspecting method - Google Patents

Abstract

Provided are an inspecting apparatus and an inspecting method by which positions of a wafer and an imaging section can be automatically adjusted. The upper horizontal surface of a Z stage (11) can be changed. A ? stage (12) rotates a wafer (31) held by suction by a wafer holder (13) at a prescribed rotation speed.An apex imaging section (14), an upper bevel imaging section (15) and a lower bevel imaging section (16) pick up the image of an end section of the wafer (31), and a monitoring image of the edge section side surface indicated by a is obtained. A line CCD (17) is composed of at least one row of CCDs arranged in the vertical direction to have a width sufficiently more than the thickness of the wafer (31), and picks up the image of the side surface of the wafer (31) for detecting the position and status of the wafer (31).; When the wafer (31) is warped or deformed, the position of the wafer (31) at the imaging position is changed. An inspection apparatus (1) adjusts the relative positions of the wafer (31) and the apex imaging section (14), based on the imaging data obtained by the CCD (17).

Description

[Technical Field] The present invention relates to an inspection apparatus and an inspection method, and more particularly to an inspection apparatus and an inspection method which can be used for inspection of an end portion of a flat plate or the like. [Prior Art]

In recent years, it has been formed in the semiconductor crystal growth and has been used in the production process. The yield of the circuit that is defective near the end of the wafer. Based on this, the observation is more important. The integration of the circuit pattern on the circle is also managed by the material type of the round surface treatment, which will affect the production process of the wafer near the end of the wafer. Therefore, for example, the semiconductor wafer is observed in a plurality of directions. The periphery of the end of the substrate on the flat plate is checked for foreign matter, peeling of the film, bubbles in the film, backfilling of the film, and cutting marks. In the past, the inspection apparatus for performing the inspection irradiates the inspection object with, for example, a laser beam, and uses the scattered light to detect foreign matter around the end portion of the flat substrate such as the semiconductor wafer v. (Patent Document 1) 曰本特开平丨uhmo号 [Summary of the Invention] However, there is a problem in that it is required not to irradiate a standing object with laser light or the like to inspect a foreign matter using the scattered light, but by The enlarged shirt of the end F of the inspection object is like 'to observe the end state of the inspection object. Here, there is an idea that a microscope or the like is placed around the end of the object to be inspected, and that the image is enlarged at the end of the object to be inspected. However, when observing the end of the inspection object such as the 200914818 wafer, if the inspection object is bent or skewed, the position of the end surface (the flat object is horizontal). There is a large fluctuation in the position in the height direction of the end of the object to be inspected. At this time, it is possible to cause the center position of the side surface of the object to be inspected to deviate from the center of the field of view of the enlarged image obtained when the object to be inspected is viewed from the side, and in the worst case, even if the object to be inspected is separated from the field of view. The present invention is made in view of such a situation, and it is possible to easily and surely observe the end portion of the test object in which the deflection or the skew occurs.

An inspection apparatus according to one aspect of the present invention includes a detection means (for example, a linear ccrrn, a linear CCD 221, or a displacement meter of FIG. 1) for detecting the end of a flat object-shaped object (for example, wafer 31 of the figure). Position of the part (for example, the central position c of the end portion or the surface position of the upper and lower surfaces); the photographing means (10), as shown in the Apex photographing unit 14, the upper photographing unit 15, and the lower photographing unit (6), for photographing the end of the object to be inspected Video for observation; and adjustment means (10) Controller 51, Fig. 3 and Fig. 1 of Fig. 3: stage drive unit 63, figure

The photographic system driving unit 151 and the controller 241 of FIG. 14 adjust the detection result of the position of the object to be inspected according to the detection means, and adjust the shooting means to capture the observation shadow. " The relative position of the object and the photographing means. "Into # has a rotary driving means (10) as shown in Fig. f as the center of rotation of the plane of the object to be inspected as a center of rotation, with respect to the vertical direction of the plane ^ ^ ^ 乍 square In the direction of the rotating shaft, the object to be inspected is rotationally driven at a speed of the same speed. The driving device is driven, and the detecting means is disposed at a position where the end of the object to be inspected driven by the rotation and the rotation is detected. Position, 6 200914818, during the period in which the object to be inspected is substantially rotated, a plurality of positions of the object to be inspected are detected, and the photographing means is provided to be capable of photographing the object that is rotationally driven by the rotation driving means The position of the end portion of the inspection object is set at a position on the downstream side of the rotation direction of the inspection object by the rotation driving means, and the inspection object is photographed while the circumference of the inspection object is substantially rotated. The plurality of inspection object position. The adjustment means may further include position adjustment means (for example, the Z stage of FIG. 3 and FIG. 3 and the 2 stage driving part 63 of FIGS. 3 and 14) for perpendicular to the plane of the object to be inspected. And adjusting a relative position of the inspection object and the photographing means; and controlling the position adjustment means according to the detection result of the end position of the inspection object by the detecting means to adjust the inspection object to be opposite to the side photographing means The relative position of the plane of the object to be inspected in the vertical direction. The photographing means may include a side photographing means (for example, the Apex photographing section i 4 of FIGS. 1 and 13) for photographing the side surface of the object to be inspected from a horizontal direction with respect to the plane of the object to be inspected; The relative position of the side photographing means and the object to be inspected in the direction perpendicular to the plane of the object to be inspected is adjusted. The photographing means' may further include a planar photographing means (for example, the upper photographing unit 15 and the lower photographing section 16 of FIGS. 1 and 13), which is at least one of a vertical upper side or a lower vertical side with respect to the plane of the object to be inspected. The end portion of the plane of the object to be inspected is photographed; and the position adjusting means adjusts the side photographing means and the relative positional means of the plane photographing means and the object to be inspected. The photographing means may further include: a planar photographing means (for example, FIG. 1 200914818 and FIG. 1 3 upper photographing unit 15 and lower photographing section) 6), which is perpendicularly or vertically from the plane of the object to be examined. At least one of the lower sides captures an end of the plane of the object to be inspected; and a focus adjustment means (for example, the upper focus control unit and the lower focus control unit 66 of FIG. 3, FIG. 12 and FIG. 14) for controlling the planar photographing means Adjusting the photographic focus of the test object, the detecting means can detect the plane position of the object to be inspected by the plane photographic means; and the focus adjusting means can detect the plane position according to the detecting means To control the adjustment of the photographic focus of the object to be inspected by the planar photographic means. The detecting means is for detecting the position of the end of the object to be inspected within the range of the first object! Range detection means (such as the linear CCD 17 of Figure 13), and used in comparison! The second range detecting means (for example, Fig. 13, linear CCD 221) for detecting the end position of the object to be inspected in the second range is large; The range detecting means can determine whether or not the end portion of the object to be inspected is included in the first range; and the detecting means is based on the detecting of the third range detecting means when the third range of the object is included in the third range As a result, if the relative position of the test object and the photographing means is adjusted, if the end portion of the test object is not included in the first range of the object, the detection result of the adjustment + & root (4) 帛 2 range detecting means is adjusted. The detected position is not relative to the photographing means. The detecting means detects the position and state of the end of the object to be inspected (for example, wafer thickness, damage or chipping, foreign matter adhesion, or overcoating of the photoresist), and the detecting means can be based on the object to be inspected. In the horizontal direction of the plane, when the object to be inspected is observed, the position detected by the side boundary portion is sharply changed. The abnormal position of the state of the object to be inspected is detected (for example, 200914818 such as notch or damage, foreign matter adhesion, or light) The adjustment means adjusts the object to be inspected and the photographing based on the detection result of the detected position of the object to be inspected from the detection means, and the detection result of the detected abnormal position is subtracted The relative position of the means. The detecting means detects the position of the boundary portion on the side surface when the object is viewed from the horizontal direction with respect to the plane of the object to be inspected (for example, the sharp waveform of the differential waveform described using FIG. 6 is used. The position of the object to be inspected is detected according to the position of the object to be inspected. The hand can detect the position of the two planes of the object to be inspected (for example, The position of the sharp rise and the steep drop of the differential waveform described with reference to Fig. 6 is the boundary portion of the side surface when the object is inspected in the horizontal direction with respect to the plane of the object to be inspected. (For example, the recording unit 68 of FIGS. 3, 12, and 14) is used to record the position information of the two planes of the object to be inspected detected by the detecting means. The progress has an output means (for example, FIG. 3 and FIG. 12, and the output portion 69 of FIG. 14) is used to transmit the position information of the two planes of the object I to be inspected by the detecting means to an external device or a transmission path. The inspection method is for inspecting the inspection device of the inspection device at the end of the inspection object (such as the 〇 〇 ,, 曰曰 31 31 31 31 31 31 31 31 . . . . . . . . . . . . . . . . . . . . . The end position of the object to be inspected (for example, the end + + knowing. The central position c of the crucible or the upper and lower surface positions) (for example, step 5 of FIG. 10 to step S8', step S48 to step S51 of FIG. Treatment); ancient Zhou 敕 ° ° Wang v sudden 'root The result of the detection of the object to be inspected by the processing of the detection step ># _ end is adjusted by the imaging unit (for example, 200914818: 1st shot: Ρ6Χ, the imaging unit 14, the upper imaging unit 15, And the lower photography unit 砚 $ when the image is used, the relative position of the object to be inspected (for example, the processing of step S11 in FIG. 11); and the photographing step, which is adjusted using the processing of the adjustment step. The observation portion of the end portion of the inspection object is imaged by the camera portion ' at a position relative to the inspection object (for example, the processing of step S12 in Fig. 11).

The end portion of the inspection object according to the one side of the present invention is inspected at a special position, and therefore, the observation image can be adjusted in accordance with the state in which the relative position of the detection knot has been adjusted. [Embodiment] The inspection method can detect the shape of the flat plate, detect the end of the object to be inspected, and take a picture between the end of the object to be inspected, and obtain the image. The embodiment. The inspection device i will be described with reference to Fig. 1 . . The configuration of the inspection device 1 includes: z stage u, 0 stage 12, crystal

The holder 13, the Apex photographing unit 14, the upper photographing unit 15, the lower photographing, and the linear CCD 17 are provided. The Z stage 1 1 can change the height of the upper level according to the control of the controller to be described later. The cymbal stage 12 is mounted on the upper surface of the z stage, and is driven to rotate so that the wafer holder 13 mounted on the upper portion thereof rotates at a predetermined speed. The rotation of the β stage 12 is detected by an encoder (not shown) in Fig. 1, and the detection result is supplied to a controller to be described later. The wafer holder 13 is mounted on the crucible table 12, and is held at the upper level of the level of 200914818 to be held as an object to be inspected and rotated at a predetermined speed. % and "Taiwan 12 into (4) (4) part) Photographing section 14 is based on the position of the height of the horizontal plane, the equivalent of the wafer 3 1 position 'to the remaining (four) of the end of the tool 13 to the number of + Rashis carried out photography with a magnification of about ten times that of the Japanese yen on the day of the Japanese yen. The end of the picture shows Qiu Qiu, and the image of the observation of the side of the cake 4 in the figure. The circle h ^ er ~ 4 14 can be used as an observation image on the side of the end portion of the Japanese yen 31 as shown in Fig. 2. The upper photographing portion 15 is mounted on the wafer holder 13 from the upper portion of the level with the wafer 31. The wafer 3 is photographed at a magnification of about several tens of times to obtain an observation image in the figure::= 邛 top (surface). Further, the 求出^ obtained in the processing described later may be based on the fruit. The detection of the surface position on the upper side of the second side is not the whole focus position of the δ. The lower photography unit 16 is separated from the lower jaw, the π π 疋 water + surface at a given distance. The 卩 pair is loaded on the wafer to maintain With 13 s S] u && 3,000 times the magnification of the end of the 31 曰曰 31 31 31 31 31 31 31 31 The image "obtains an observation image on the lower side (back surface) of the end shown by α in the figure. The yen 31 obtained by the processing described later can be adjusted according to the result of the focus. ^ < The detection level of the surface position is supported by the photographing unit branch portion 21 supported by the broken column 21a, and the column a is fixed to the unillustrated portion. Above the fixed seat. In the description, the 'inspection device!' is separated from the upper surface of the predetermined distance by the upper surface of the fish crystal toilet w and the position of the circle 1. The end inspection device 1 for obtaining the wafer 31 may have only a video for inspection. In contrast, the photographic unit of the upper part of the 丨罜 〗 〗 5 任 , , 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或Knife J does not have the upper photography unit 15

The Apex photographing unit 14 and the lower photographing unit have a Zhaominggong target for performing photographing of the observation image of the subtraction field and the lower photographing unit 16 of the wafer. The illumination can be an off-projection, and the month can be other than that. In addition, Zhao and Ming may first be used to expand light.

The method can be appropriately selected according to the purpose of photography or as an illumination class of these two. Observing the image type required for the w image Linear C C D1 7 Shooting 曰fii 2 1 recognize / . On the side of the day aSI 31, the photographic material is supplied to the controller described later. When the wafer 31 is deflected or skewed, the end position of the wafer η changes to the movable direction of the two stages. In addition, there are abnormalities such as chipping, damage, foreign matter, or photoresist overcoating in the crystal. In the controller to be described later, the position or state of the wafer 31 can be detected by the photographic data of the linear CCD 17. The photographing range of the linear CCD 17 has a visibility sufficiently larger than the thickness of the wafer 31, and is composed of at least the array ccd in which the pixels are arranged in the longitudinal direction. The photographing center of the linear CCD 17 is substantially equal to the center of the flat wafer 3 in the height direction of the side surface. Further, the linear CCD 17 is rotated relative to the wafer 3 in comparison with the photographing position of the wafer 3 by the Apex photographing unit 14, the upper photographing unit 15, and the lower photographing unit 16 indicated by α in the figure. In the upstream direction of the direction, that is, when the 0 stage 12 is turned to the left, the wafers 31 are disposed in the Apex photographing unit 14, the upper photographing unit 15, and the lower photographing unit 16 on the wafer. 3 1 to the right of the shooting position. In other words, 12 200914818 the photographing position of the observation image is compared with the photographing position of the linear ccm 7 in the downstream direction with respect to the rotation direction of the wafer 31. ??? Spring: The configuration of the CCD 17 is sufficient as long as it has at least one column of longitudinally arranged CCDs having a width sufficiently larger than the thickness of the wafer 31. For example, it is also possible to replace the linearity with a cCD having a two-dimensional arrangement (: (: £) 17). When the side of the wafer 31 is photographed by the Apex photographing unit 14, it is more desirable to make the wafer 3 in Fig. 2 The center of the thickness is a line segment L indicating the central portion of the facet for photographing. However, when the end of the object to be inspected such as the wafer 31 is not large, if the object to be inspected is deflected or skewed, There may be a large undulation of the end face position, causing the center c of the thickness of the wafer 31 to deviate from the line segment L indicating the central portion of the screen, and in the worst case, one of the side images of the wafer 31 may fall outside the field of view. The inspection device 检测 can detect the difference Δ〇 between the line segment L and the center C of the thickness of the wafer 31 based on the photographic data of the linear CCD 17 to adjust the relative position of the wafer 31 and the Apex photographing portion 14. Further, the inspection device 1 Detecting/measuring the surface position above and below the wafer 31 according to the photographic data of the linear CCD 107, in other words, detecting the edge position of the wafer 31 when the wafer 31 is viewed from the side. Further, the inspection apparatus 1 Depending on the edge position of the wafer 31, or the wafer 31 The detection result of the center c of the thickness "the focus of the upper imaging unit 15 and the lower imaging unit 16 is adjusted. The difference Δ detected by the linear CCD 17 on the image captured by the wafer 31 (: 'Control shown in Fig. 3, which will be described later) The controller 17 calculates the timing based on the rotation information of the 0 stage driving unit 61 shown in Fig. 3, and transmits the control signal to the cassette driving unit 63 shown in Fig. 3. The stage driving unit 63 is based on the control signal 13 200914818 諕, the height of the upper surface of the Z stage 11 is changed. Thereby, the center C of the thickness of the wafer μ can be constantly placed at the approximate center of the field of view of the Apex imaging unit 14. Further, the inspection device 1 can obtain the frame rate ( The frame rate is higher as the image for observation. ' For example, the 0 stage 12 can also be rotated at any angular velocity in either of the left and right directions. In this case, the wafer is 3 摄影 during the photographic processing. It is not stationary, so the shutter speed of the linear CCD 17 or the Apex photographing unit 14 or the like must be set to some extent early. In contrast, for example, the load a 12 can be rotated at a predetermined angle and a predetermined angular velocity. After the direction is rotated, make it temporary In this case, the photographing by the linear CCD 17 for detecting the position or state of the wafer 31, and the photographing of the end of the wafer 31 by the Apex photographing unit upper photographing unit 15 and the lower photographing unit 16 are performed. The process 'can be performed in a state where the wafer 31 is stopped. By this configuration, the wafer 31 is rotated substantially by one rotation by the rotation of the crucible stage 12, and strictly speaking, it is rotated in addition to the one-time rotation, and then rotated by linear. The photographing position of the cCDi7 is at a corresponding angle to the photographing position of the Apex photographing unit 14 or the like, and the state detection of the deflection or the undulation of the wafer 31 is simultaneously performed, and the position adjusted according to the detection result of the state is performed. Photographic processing at the end of the wafer. Thereby, compared with the state in which the wafer 3 is rotated about the circumference to detect the deflection or undulation of the wafer 31, and then the circumference of the wafer is rotated to perform the processing of the crystal = 31, the reduction can be reduced to Observe the steps taken by the wafer. In addition to the photographic processing of the linear CCD 17 illustrated in FIG. 1, the driving control of the z stage and the cymbal stage 12, there are also illumination control and focus control of the Apex photographic upper photographic portion 15 and the lower photographic portion 丨6. 200914818 Photographic processing, and the output of inspection results based on its data, etc., are controlled by the controller of the 疋. The controller can be disposed, for example, inside the z port 11 of Fig. 1, and can be disposed outside. The controller's control of the inspection device i will be described below with reference to the block diagram of FIG. The configuration of the 0 stage drive unit 61 includes a motor or the like for rotationally driving the turntable 12, a driver for driving the same, and the like. The controller 51 controls the pallet drive unit 61 to rotationally drive the 0 stage 12. The rotational drive of the 0 stage f 丨 2 is detected by the encoder 62, and the detection result is supplied to the controller 51. ～ controller 51-side control Θ stage drive unit..." The stage 12 is rotationally driven to acquire an image captured by the linear CCD 17, and based on this, the wafer 31 at the photographing position of the linear CCD 17 is detected. The configuration of the position Z stage driving unit 63 in the height direction includes a motor or the like for changing the height of the z stage η at the upper horizontal plane, and a device for driving the same. Further, the controller 51 controls the Apex photographing unit 14, the upper photographing unit Η, and the lower photographing unit 16 to photograph the wafers from the respective directions at appropriate intervals with respect to the rotational driving of the crucible table 12. 3 ι end observation image. The illumination drive unit 64 drives illumination for capturing the end of the crystal 31 by the photographing unit 14, the upper photographing unit 15, and the lower photographing unit 16 under the control of the controller 51. 15 200914818 The controller 5 1 calculates the optimal focus position when the upper imaging unit 15 and the lower imaging unit 16 capture the wafer 31 based on the image captured by the linear CCD 17 , and supplies the calculation result to the upper focus control unit 65 and Lower focus control unit 66. The upper focus control unit 65 controls, for example, the position of the optical system provided therein by the upper imaging unit 15 to perform focus control when the upper imaging unit (1) whitens the wafer. Further, the lower focus control unit 66 controls the position of the optical line (4) which is controlled by the lower imaging unit 16 to perform focus control when the wafer 31 is imaged by the lower imaging unit 16. Next, the controller 5 uses the processing result obtained by the linear ccm7 or the inspection result counted by the Apex photographing unit 14 and the upper photographing unit photographing unit 16 and outputs the result. ..., the upper portion of the end of the wafer 31 is produced: two memory 67 for temporary storage by, for example, the photographic department. 4 15 and the video of the observation image taken by the lower photography department 16 . σ 录 录 68, Sun Erzhen v said / day η rsi nickel to ', with the day of the end of the day 31 a: For example, it can be a hard disk or a semiconductor memory; also: a removable auxiliary medium and a drive for receiving information. '", Wenshang Lulian: Out::: Record information with external machines or established networks by wire or wireless (for example, wafer 3): 2: 2 devices, for example, the processing steps One step of the device, the wafer 3, the information, or the device or server used to manage the manufactured wafer 16 200914818 to the company, etc. The device or the feeding device can be used for the user to easily obtain the phase information of the wafer (for example, information on the defective wafer), and it is easy to find out the reason for manufacturing the defective film. ^ The display portion 70 is based on the controller η Control, so that the inspection result of the end of the wafer 31 is displayed on, for example, a liquid crystal display or a CRT display, etc. The functional block diagram of Fig. 4 is used to explain the functions of the controller 5, that is, if it is available The individual hardware that realizes each function shown in Fig. 4 can replace the controller 51 in this case, so that the inspection device tool has the same function. The differential processing unit 1 接收1 receives the linear CCD from the linear CCD 17. Negative material. The example shown in Figure 5 is The CCD of the frame frame supplied by the linear ccd 1 7 is an example of the distribution of the received light intensity (the voltage intensity of the supplied signal) of each element. The differential processing unit 1〇1 performs differential geography on the distribution to differentiate the processing. The results are shown in Fig. 6. As shown in Fig. 6, in the differential waveform, the edge portion of the wafer 31 when viewed from the side of the end portion, that is, the position of a and b in the figure, the differential waveform sharply drops and rises sharply. Further, the differential value other than the edge portion is substantially 0. The differential processing unit 1 供应1 supplies the differential processing result to the abnormal portion detecting portion 102 and the edge position detecting portion 103, and the abnormal portion detecting portion 102 The differential processing result at each position of the end of the circle 31 is supplied by the differential processing unit 1〇1, and the sharp waveform is sharply risen and steeped with respect to the rotation of the 0 stage 12 in the differential waveform. In addition, the abnormal portion detecting unit 102 regards the instantaneous change portion of the position where the steep rise 17 200914818 is raised and steeply dropped as the detected abnormal portion such as a notch, damage, foreign matter addition, or Photoresist Specifically, the abnormal portion detecting unit 102 records the differential waveform of a plurality of positions inside, and detects that the position of the sharply rising and steeply falling positions within a predetermined range is equal to or greater than the intermediate value. It is a notch, a damage, etc. 2, a normal knife. The above-mentioned target circumference and threshold setting ' can be set according to the empirical S test to determine the appropriate value for detecting the gap or breakage, and the user can change the range and the value. The abnormal portion detecting unit 102 supplies the detection result of the abnormal portion to the relative position error calculating unit 106, the upper and lower focus position calculating unit 11Q, the (four) memory recording control unit, the chart generating unit 1 15 , and Record/display//output control section "6. The edge detecting unit 103 detects the edge position when the end portion of the wafer 1 is viewed from the side, based on the position where the differential processing unit 1〇1 supplies the differential portion: the inside and the node has a sharp rise and a steep drop. That is, the upper and lower surface positions of the wafer 3 ^ are detected. The edge position detection 胄1〇3 supplies the detection result to the wafer thickness calculation unit 104, the center position detection unit 〇5, and the upper and lower focus position calculation unit η. The graph generating unit 115 and the recording and display output control unit ι... The wafer thickness calculating unit 104' detects the crystal based on the detection result of the surface position of the wafer 3丨 supplied from the edge position detecting unit 1〇3. The detection result is supplied to the chart generating unit 115. Thickness 曰: The central position detecting unit 105' detects the edge position of the wafer 31 supplied from the edge position detecting unit ι3, and sets the center of the edge position: the central portion of the thickness of the wafer 31 detected. That is, it is regarded as the position of the center c of the thickness of the circle 31 in Fig. 2 . The center position detecting unit (9) supplies the position detection result of the center of the thickness of the wafer 31 of the 200914818 to the relative position error calculating unit 106, the upper and lower focus position calculating unit 11A, and the graph generating unit 1 15 . The relative position error calculating unit 1〇6 detects the line segment L based on the position detection result of the central portion of the thickness of the wafer 31 supplied from the central position detecting unit 1〇5 (that is, has been described using FIG. 2 to indicate eight (10). The difference ΔΟ between the line segment of the photographing portion of the photographing unit μ in the center in the height direction and the center c of the thickness of the crystallite 31 is supplied to the relative position error recording unit 1〇7. The relative position error § the recorded portion i 〇 7 records the difference ΔC between the line segment L indicating the center portion of the screen and the center C of the thickness of the wafer 31 supplied from the relative position error calculating unit 106. The vertical relative position drive control unit 1〇8 reads out the difference ΔC of the relative position error record 邛107 and supplies it to the z stage drive unit 〇. In addition, if it is the position of the calculation target of the difference knives Δ C, it comes to the Apex photography department from the shooting position of the linear 7! During the period of the photography range of 4, etc., when there is movement on the upper position of the z stage U, the relative position drive control unit 1〇8, 疋>, ,, and the child position during the movement (ie, by linear The movement history of the CCD position of the ccd 丨 7 and the movement position of the photographing position of the ApeX photographing unit 14 and the like, and the difference Δ of the position read by the relative position error recording unit (10) : The correction is performed. Then, the corrected difference Δ C is supplied to the load stage drive unit 63. > The encoder output acquisition unit 109 obtains the detection result of the rotation of the encoder 62 for the 0 stage, and supplies it to the relative The position drive control unit 丨〇8 and the upper and lower focus position information supply unit 丨丨2. 19 200914818 The upper and lower focus position calculation unit 110 detects the surface position of the wafer 31 supplied from the edge position detecting unit ι3, The detection result of the central position of the thickness of the wafer 31 supplied from the central position detecting unit 1〇5 calculates the focus position of the upper imaging unit 丄$ controlled by the upper focus control unit 65, and the lower focus. control The lower focus position controlled by the portion 66 is supplied to the upper and lower focus position recording portion uj. That is, when the relative positions of the pixels of the linear CCD 17 and the upper photographing portion 15 and the lower photographing portion 16 are fixed in advance, The bit focus position calculating unit 1 1 calculates the focus position and the lower focus position of the upper photographing unit 15 based on the detection result of the surface position of the wafer 3 i supplied from the edge position detecting unit 103. Further, if the linear C cd When the relative positions of the respective pixels of the 117 and the upper photographic unit 15 and the lower photographic unit 16 are not fixed, the vertical focus position calculating unit 11 变动 is the variability of the detection result based on the central position of the thickness of the wafer 3 i The detection result of the surface position of the wafer 31 supplied from the edge position detecting unit 1A3 is corrected, whereby the upper position, the focus position ' and the lower focus position of the photographing unit 15 are calculated. In addition, the upper and lower focus I point positions are calculated. The calculation unit 110 may correct the detection result of the surface position of the supplied wafer 31 by using the difference AC that is different from the relative position error calculation unit 106. The position recording unit 1 1 1 'records the calculation result of the upper and lower positions of the wafer 3 supplied by the upper and lower focus position calculation unit 110 at the time of being photographed. The upper and lower focus position information supply unit 112, from the upper and lower focus Position record ♦ °卩1 11 § Recorded wafer 3 1 When it is photographed, its upper and lower position 20 200914818 Read and now borrow Apex photography department round 3 1 position 罟如芳组 by t 丨~ < Days 65 and ... are respectively supplied to the upper focus control unit lower focus control unit 66. Further, if the CCD 17 is photographed (f) w, the position of the image is within the range of the period of the linear period ΓΓ 6 Χ the photographing unit 14 or the like In the case where the upper position of the Z-stage is moved, the relative drive & unit 108 refers to the period during which the position is moved to the photographing position of the Apex photographing unit or the like during the movement. The movement history of the position of the stage (4) is subjected to the correction processing 'and then the value of the sum is supplied to the upper focus control unit 胄Μ and the lower focus control unit 66. Further, the 'relative position error calculation unit (10) or the upper and lower focus position shifting unit 110 may receive the detection result of the abnormal portion from the abnormal portion detecting unit 1〇2, and then apply the notch, the damage, the foreign matter, or the photoresist overcoating. The abnormal portion knife knows not to calculate the relative position error or the position of the upper and lower focus positions, or may perform the calculation but invalidate the result. For example, in the case of an abnormal portion such as a notch, a breakage, a foreign matter, or a overcoat of a photoresist, the center of the field of view of the Apex photographing unit 14 is overlapped with the center c of the thickness of the wafer 31, or the upper photographing unit is desired to be 丨5. When the focus of the lower photography unit ^ 6 is controlled to overlap, the observation image cannot be accurately captured. In contrast, if the relative position error or the upper and lower focus positions are not calculated for the abnormal portion such as the notch or the breakage, or the result is regarded as invalid, the result can be avoided. The problem has occurred. The photographing material acquisition unit 113 acquires the Apex photographing unit 14, the upper photographing unit 15 and the lower photographing unit! The photographic image of 6 is supplied to the frame memory 21, and the recording control unit 114 and the recording/display/output control unit ΐ6 are provided. The frame frame memory recording control unit i14 is for controlling the recording of the frame image memory 67 by the captured image of the Apex material 14, the upper image capturing unit 及, and the lower image capturing unit 16 supplied from the photographic data acquiring unit 113. Further, the frame frame memory recording control unit 114 receives the detection result of the abnormal portion by the abnormal portion detecting unit 1〇2, and reads out from the dragon memory 67 corresponding to the normal portion such as the notch, the breakage, the foreign matter, or the over-coating. The image is then supplied to the recording/display/output control unit 116. /

The graph generating unit 115 calculates the wafer thickness calculation result from the wafer thickness calculating unit 1〇4 based on the detection result of the abnormal portion from the abnormal portion detecting unit 1〇2, the detection result from the edge position of the edge position detecting unit 〇1〇3. The detection result from the central position of the central position detecting 胄i 05 and the corresponding peripheral position of the slit of the wafer 31 obtained by each detection result, (4) the deflection, undulation, and crystal of the wafer 31 observed. Information such as the thickness of the circle is plotted and supplied to the recording/display/rounding control unit 丨丨6. Specifically, the graph generating portion 115 is such that the slit position of the crystal wafer 31 is made. Initialize by way of degree. For example, 'the wafer can be rotated by 1 to drive the linear CCD 17 around the periphery, and the edge position corresponding to the slit is detected: the change is made to detect the position of the slit. Further, the surface generating portion "5 is tied at =31 After the completion of the photographing of the linear CCD 17 at each of the outer peripheral positions, a state map of each outer peripheral position of the wafer 31 is performed, and is supplied to the recording/display/rounding control unit 116. (7) The graph generating unit 11 5, according to the detection result from the central position of the central position detecting unit ik, as shown in FIG. 7, the wafer 31 is rotated 360 22 200914818 degrees when the wafer 3 1 > + jk Λν X® _ / the displacement of the central position is plotted Supply, supply to record /

Display/output control Qiu]t A m @ ώ~ °ρ 116. Further, the graph generating unit 115 graphically changes the thickness of the wafer 3 1 when the mound 4 1 is rotated by 360 degrees, based on the calculation result of the wafer thickness from the crystal and the ejecting portion 104. : Up to 5 recorded/displayed/output control unit 116. Further, the graph generation unit "5, the detection result of the edge position of the edge position detecting unit j 〇3, is shown as a graph of the displacement of the edge position of the wafer 31 when the wafer 3 1 is rotated by 36 degrees. Chemical. The chart generation unit 115 may directly display a portion such as a notch or a break when the ? shown in FIG. 7, FIG. 8, and FIG. 9 is generated, or may be based on an abnormal portion of the abnormal portion detecting portion 1〇2. The detection result indicates that the abnormal part such as the missing or the skin is displayed in an emphasized manner, or the abnormal part is ignored in the display. Further, the abnormality of the graph generated by the graph generating unit 115 may be set by the user. . The recorded/displayed/rounded control 胄"6' is the position of the upper and lower surfaces of the side of the wafer 3! detected by the edge position detecting unit 0, and is photographed by Apex from the photographic data. The observation image captured by the upper portion i and the lower image capturing unit 16 is opposite to the abnormal portion such as the notch or the damage supplied by the remaining memory recording control unit m, and the image of the image is generated and the chart generating unit 115 The contents of the charts and the like shown in FIG. 7, FIG. 8, and FIG. 9 are recorded in the recording unit (9), outputted from other devices in the output unit, or displayed on the display unit 70. < "In the inspection apparatus 1, the 0 stage 12 is rotated at a predetermined speed to thereby drive from the linear CCD 1 7 , and the detection of the edge position, according to the detection. 23 200914818 Edge position to calculate 屮h> Mo, ... " relative position or upper and lower focus position, according to the calculation of the knot = 嶋 position or upper and lower focus position, and even various detection results and rotation, etc., parallel implementation. That is, after the end position of the wafer 31 by the linear ccm7 is "photographed, the rotational driving of the stage η" is moved to the Apex photographing unit 14, the upper photographing unit 15, and the lower photographing unit 4 at the position α. During the photographing position, the detection of the edge position is performed, and the relative position or the up and down focus position is calculated based on the detected edge position. Further, when the position α has moved to the photographing positions of the Apex photographing unit 14, the upper photographing unit 15, and the lower photographing unit 16, the relative position of the eight (10) photographing unit 14 and the wafer 31 or the upper and lower positions is controlled. Focus, the end of the wafer 31 is photographed in a plurality of directions. Also, at this time, in a parallel processing manner, a point different from the position, that is, a position closer to the downstream side in the rotation direction (for example, when the 0 stage 12 is turned left, the crystal is used) When the center of the circle is seen, the point on the right side is photographed by the linear CCD 17, or arithmetic processing is performed based on this. Next, the inspection process 1 of the wafer end portion by the inspection device i will be described with reference to the flowcharts of FIGS. 10 and 11. As described above, in the inspection apparatus 1, the 0 stage 12 is rotationally driven at a predetermined speed, thereby performing imaging, detection, calculation, and output of results in parallel, but the present invention is used for ease of understanding. The sequence of the flow chart 'describes the entanglement of the end of the wafer 31; the inspection process performed by the point. In step S1, the controller 51 controls the 0 stage driving unit 6 to start the rotational driving of the stage 12 . At step S2', the controller 51 controls the linear CCD 17, and photographs the predetermined position α of the end of the wafer 3 1 24 200914818. In step S3, the differential processing unit 1G1 of the camera 51 supplied by the CCD 17 is controlled to perform a differential processing on the received light intensity curve of the photographic image as shown in Fig. 5: the differential waveform described in Fig. 6 The differential edge position detecting unit 103 is supplied to the abnormal portion detecting unit (10), and in step S4, the abnormal portion detecting unit 102 that controls the crying 8 未β°° is monitored by the detaching processing unit 1〇1. You have a dramatic change, for example, there is a result of 'determining the differential 咐m. , , , , , and , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , When S4 determines that the differential waveform has changed, the abnormal portion detecting unit 102 of the step=51 detects that the corresponding (4) is an abnormal portion. Further, the abnormal portion detecting unit 1〇2 supplies the detection result of the abnormal 邛8 to The calculation unit "〇, _0 body=: 6, upper and lower focus position 丨 隐 隐 隐 隐 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 It is determined in step S4 that the differential waveform does not change. Or, after the processing of step S5 ends, the processing system moves to step %. In step S6, the edge position detecting portion ι3 of the controller 51, the root differential processing 胄1()1 is supplied in the differential processing result. The differential waveform has a sharp rise and fall position of the fish, and the edge position of the wafer 31 is detected. Further, the edge position detecting unit 1〇3 supplies the detection result to the wafer thickness calculation unit 1〇4. The center position detecting unit 1〇 5. The upper and lower focus position calculation unit ιι〇, the graph generation unit 1 1 5, and the recording/displaying/output control unit 丨16. 25 200914818 In step S7, the wafer thickness calculation unit j 〇4 of the controller 51 The thickness of the circle is detected based on the detection result of the surface position of the wafer 31 supplied from the edge position detecting unit 103, and then the detection result is supplied to the chart generating portion 115. At step S8, the central position of the controller 51 is detected. The portion j 〇 5 is configured to check the center position of the thickness of the end portion of the circle 31 based on the detection result of the surface position of the wafer 31 supplied from the edge position detecting unit 103. The center position of the thickness, that is, FIG. 2 Showing the position of the center C of the thickness of the wafer 31 Further, the detection is performed, and the detection result is supplied to the relative position error calculation unit 106, the upper and lower focus position calculation unit 11A, and the graph generation unit 115. In step S9, the controller 5 is relatively The position error calculation unit (10) calculates the center of the thickness of the line segment L and the wafer 31. Then, the difference is detected: the result is supplied to the relative position error recording unit 1〇7 and is recorded. Further, the lower position of the 51 state 51 The focus position calculation unit 'calculates the focus position of the upper photographing unit at the predetermined position α of the end portion of the wafer 31 based on the detection result of the surface position of the wafer 31 supplied from the edge position detecting unit 1〇3, and the lower position The focus position of the crotch portion 16 is supplied to the upper and lower focus position records lu. At this time, the upper and lower focus position calculating unit 2 can correct the calculation result based on the detection result of the position of the central portion of the thickness of the circle 31 or the difference ΔC. Further, the time taken from the half of the step to the processing of the step S9 is shorter than the time taken by the linear CCD 17 to take the predetermined position α and the time taken by the photographing unit (4) to the predetermined position α. In step SH), the relative position of the controller 51 drives the control unit (10), 26 200914818 to judge the end of the wafer 31 based on the output of the encoder 62 from the encoder output 屮, φ _ 邛 邛 109 The position of the 仏 u Δ 卩 卩 卩 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , When it is determined in step S1, the position of the wafer 31 is 邱 Δ ^ terminal 0 疋: the position has not been moved to be

Apex Photography Department μ Rong && value S1ft .. When the position of the inspection object of the shirt is checked, the processing of step 1〇 is repeated until it is judged to the position of the inspection object; The 疋 position α of w has moved —, ., and right. When it is judged in step S10 that the 疋α of the end of the wafer 31 has been moved to the inspection target position, the processing proceeds to step S 1 1 〇 at step S 1 1 The relative position drive control unit 108 from the position error recording unit 107 reads the difference knife Δ from the predetermined position of the wafer 31 to the position error recording unit 107. c ' is then supplied to the stage driving unit 63. The stage driving unit drives the two stages n to the direction in which the differential AC is 0 in accordance with the difference supplied from the controller 51 to change the height of the wafer 3i. Further, the relative positions of the wafer 31 positioned at the end of the wafer 31 and the photographing unit 14 are adjusted. In addition to adjusting the relative positions of the wafer 31 and the Apex photographing unit 14, the upper photographing unit 15 and the lower position are also adjusted. The focus of the photographing unit 16. The controller upper and lower focus position information supply incense "12 reads the calculation result of the wafer 31 at the upper and lower positions corresponding to the predetermined position from the upper and lower focus position recording unit 1" Then supplied to the upper focus control unit Μ and the lower focus control unit 66, respectively.Further, 'the focus of the upper photographing unit 15 is adjusted by the upper focus control unit 65'. The lower photographing unit is adjusted by the lower focus control unit (9), and the point is "," 27, 2009, 18,818, and the position is reached from the photographing position of the linear CCD 17 In the period of the photographing range of the Apex photographing unit 14 and the like, when the position of the upper side of the z stage " is moved, the relative position driving unit 8 is the Z-stage 11 during this period. The movement history of the upper position is subjected to the correction processing 'and then the corrected value is output. In step S12, the Apex photographing unit 14, the upper photographing unit 15, and the lower photographing unit!6 respectively photograph the end of the wafer 31 from the respective directions. The predetermined position α is supplied to the controller $1. In step S13, 胄(1) is obtained from the photographic data of the controller 51, and the Apex photographing unit 14, the upper photographing unit 15, and the lower photographing unit μ are obtained. The fixed position of the end (4) photography series. In addition, the photographic data obtained the second line: " The photographic image of the predetermined position α is supplied to the frame memory memory record 2Π4' and the recording/display/output control unit"6. Remember Recalling the volume record = "114 will capture the photographic image supplied by the material acquisition unit ι ΐ 3, and the temporary t 5 is recorded in the frame frame memory 67. C. The frame frame memory recording control unit 114 of the root controller 51, Fruit::: The detection part of the abnormal part supplied by the second detection unit is abnormal. The position of the end of the 曰a 31 is notched or damaged, or the damage is different. 1 31 ^ The predetermined position α has a gap ^, Sickle In the step S15, the frame of the controller 51 is recorded, and the recording control unit 114 will (4) the memory of the memory of the memory of the memory box to & extract and read the video information of the recording/drying/normal portion. 'There is then supplied to Ji Ji/Hong No/Output Control Unit 116. ~Main" 28 200914818 When it is determined in step S14 that the predetermined position at the end of the wafer 31 "has no gap or broken (four) abnormal portion, or at the end step After the processing of si5, the processing proceeds to step S16. In step S16, the recording/display/output control unit 116' of the controller 51 detects the lower surface position of the side surface of the wafer 31 measured by the edge position detecting portion 1A3, and is supplied by the photographic material acquiring portion (1). The photographed image of the Aw photographing unit 14, the upper photographing unit 15, and the lower photographing unit 16 is used to perform the recording on the recording unit 68, the display on the display unit 7 (), and the output from the output unit 69. In step S17, the y 阁 阁 立 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , When it is determined in S17 that the imaging of the observation image for the rotation of the wafer 31 has not been completed, the process returns to step S2 to repeat the processing thereafter. When it is judged in step S17 that the imaging of the observation image for the i-turn of the wafer 31 has been completed, the processing proceeds to step S18. In step S18, the graph generation unit 115 of the controller 51 generates the maps which have been described with reference to Figs. 7, 8, and 9, and supplies them to the recording/output control unit 116. Each of the graphs is based on the detection result from the abnormal portion of the abnormal portion, the detection result from the edge position of the edge position detecting portion (8), and the wafer thickness from the wafer thickness calculating portion: the calculation result, and the command from the center The central position of the position detecting unit 1〇5: The result of the result of the joyful result is ij. In step S18, the recording/display/output control unit (1) of the controller 51 supplies the abnormality and the abnormality supplied by the frame memory control unit U4. Part 29 200914818 (such as gaps, breakages, etc.) corresponding to the image ^ 粑叼汾诼 讯, and the charts produced by the chart generation section 115 of the inspection company Wu Yinsi results. The recording unit 68 is already recorded, or the output unit 09 outputs the other device or the like, and the processing unit 70 ends the processing. By this processing, the wafer 3 held on the wafer holding/13 is rotated by the suspected driving of the 0 Portuguese A 1 2 a battle port, and the photographic processing is first performed with the linear CCD 17 by η. To detect the position or shape of the wafer 31. The braided L-connector adjusts the upper degree of the warhead 1 σ 丄 1 according to the position or state of the detected wafer 31 to adjust relative to

Apex Photographic Department 14 wafer 3 1 ή 6々r pull, position. Thereby, it is possible to easily and surely observe the end of the object to be inspected with deflection or skew. Further, the inspection apparatus 1 can fix the height of the upper surface of the z stage u based on the calculation result of the difference between the line segment L and the thickness of the wafer 31: c, and then adjust the Apex imaging unit 14 and the upper imaging unit 15 And the lower photography department 16^ is placed upright instead of adjusting the height of z from the upper surface of u. Next, referring to the block diagram of Fig. 12, another example of controlling the inspection apparatus 1 by the controller 5丄 will be described. This example preliminarily fixes the position of the Z stage 11, and adjusts Apex according to the result of the difference Δc operation. The positions of the photographing unit 14, the upper photographing unit 15, and the lower photographing unit 16. . Further, for the portion corresponding to the example of Fig. 3, the same character is assigned and the description thereof is omitted as appropriate. In other words, instead of the z stage driving unit 63, the imaging system driving unit 丨s丨 is provided, but otherwise the configuration is basically the same as that of the example of Fig. 3. The vertical shirt system driving unit 15 1 moves the camera in accordance with the control of the controller 51. The position of the support portion 21 is adjusted to adjust the position of the Apex photographing unit 14 and the upper photographing unit i5 supported by the photographing portion support portion 31. In other words, in the block of the function of the photographing unit 16 of Fig. 4 (4), the driver is controlled by the process of the pseudo-push drive control unit 108 to control the driver's photographing unit and the unit. The reference numeral 15 replaces the Z stage driving portion 63. In this case, the height of the upper surface of the z-loading u is fixed; t' is the position of the imaging unit Μ, the upper imaging unit 15, and the lower imaging unit 16 adjusted to a difference Δ based on the calculation result of the difference Δ(:: Further, in the inspection apparatus i, only the Apex photographing unit 14 may be supported by the photographing portion supporting portion 21, and the calculation result of the difference K between the thickness of the line segment L and the wafer 31 may be used. The position of the Apex photographing unit 14 is adjusted by the photographing system drive system ΐ5ι. In this case, the upper photographing unit and the lower photographing unit 6 are column-by-members by members different from the photographing portion of the branch portion 21. 2ia is supported to fix the position. In this case, the height of the upper surface of the z stage η is also fixed. Then, the upper photographing unit 15 is adjusted according to the detection result of the lower surface position of the wafer 3丨 and the like. The focus of each optical system of the lower photography department.

Further, in the inspection apparatus 说明 described with reference to Fig. 1, the wafer 31 is detected to be horizontal by a linear CCD 17 having a CCD having a width larger than the thickness of the object to be inspected (i.e., the wafer 31) and being longitudinally aligned. The position of the direction or its state, etc. However, when the deflection or skew of the wafer 31 is larger than the width of the linear CCD 17, the position adjustment cannot be performed correctly. Therefore, a plurality of widths may be provided. Linear CCD to correspond to wafer 31 with greater deflection or skew. Referring now to Figure 13, an inspection apparatus 201 is provided which is provided with a plurality of linear 31 200914818 CCDs having different widths. It is to be noted that the same reference numerals are given to the parts corresponding to the example of Fig. 1, and the description thereof will be omitted as appropriate. That is, the inspection apparatus 201 of Fig. 13 has a new linear CCD 221', and basically has the same external configuration as the inspection apparatus 1 described with reference to Fig. 1. Among the configurations of the linear CCD 22 1 , at least the CCD having the imaging range of the i-column and the longitudinal linear CCD 17 is sufficiently large and arranged in a vertical row. The linear CCD 221 is disposed at the photographing position of the linear CCD 17 on the wafer 31, and between the Apex photographing unit 14' upper photographing unit 15 and the lower photographing unit 16 on the photographing position of the wafer 31 (shown by α in the figure). . In the linear CCD 221, when at least a part of the edge portion of the wafer 31 cannot be captured by the linear cCD 17, the side of the wafer 31 is taken in the same manner as the linear CCD 17, and the photographic material is supplied to a controller to be described later. The position or state of the wafer 31 is observed. In addition, the pixel spacing of the linear CCD 17 is smaller than that of the linear CCD 221. That is, the linear CCD 17 has a higher resolution I than the linear CCD 221 for detecting the position or state of the wafer 31. The linear CCD 22 1 may be configured such that a CCD having a width larger than the width of the linear CCd 丨 7 and having at least one column arranged vertically is used, and a two-dimensionally arranged CCD may be provided instead of the linear CCD 221 . Next, referring to the block diagram of Fig. 14, the controller controls the inspection device 201. It is to be noted that the portions corresponding to the examples of Fig. 3 are given the same reference numerals and their descriptions are omitted as appropriate. 32 200914818 That is, the inspection device 201 has a controller 24 1 using two linear CCDs instead of the controller 51, for detecting the position of the wafer 31 in the horizontal direction or its state, etc. The output is not only the output of the linear CCD 17' but also the output of the linear CCD 221, except that it basically has the same function as the inspection apparatus 1 described using Fig. 3. The controller 241, and the controller described using Fig. 4 The case of 5 j has the same function, and it is judged whether or not the end portion of the wafer 31 also falls outside the photographing range of the linear CCD 17 based on the differential result of the photographic data of the linear CCD i7 in the differential processing unit 101. Then, only when the end of the wafer 3 ι falls within the photographing range of the linear CCD 17, the linear CCD 2 2 1 is driven to photograph the side of the wafer 31. For example, due to the deflection of the wafer 31 Or caused by skew, when the position of the wafer 3 is at a position higher or lower than the reference position, and when the wafer 31 is thicker than the h shape, the photography of the linear CCD 17 described in FIG. 2 is used. In the image, 'bearing a part of the wafer 3 1 The side image falls outside the field of view. In this case, the sharp rise and the steep P cow of the differential waveform obtained by the differential processing unit 101 occur at one or less positions. In this case, the controller 24 is driven, The spring CCD 22 1 differentiates the distribution of the 'sharp view' for the corresponding position on the side of the wafer 31. Further, the controller 241 detects the abnormal portion based on the differential result, or The relative position of the wafer 3 i and the Apex photographing unit 14 is adjusted, or the focus position of the upper photographing unit 15 and the lower photographing unit 16 is calculated. Then, the inspection result is generated and recorded, output, and continued. Referring to FIG. A flow chart for explaining the wafer end inspection process 2 of the inspection device 2 33 33 200914818. In addition, the singer is also spliced by the processing after the processing of the step S52 is completed. 〗 〖p % 0, 七 七 、 仏 仏 仏 已 已 已 已 已 已 已 步骤 步骤 步骤 步骤 步骤 步骤 步骤 步骤 步骤 步骤 步骤 步骤 步骤 步骤 步骤 步骤 步骤 步骤 步骤 步骤 步骤 步骤 步骤 步骤 步骤 步骤 步骤 步骤 步骤 步骤 步骤 步骤 步骤 步骤Rotating the crucible 12 at a given speed , Serve parallel photography embodiment, detection, computation, and

Output of the result, etc., and right this fg] :): 3⁄4 rabbit 7 P 士人Ttn A 隹This sample shows the check of the point α of the end of the wafer 3 1 for the sake of easy understanding. deal with. In step S4, the controller 241 controls the 0 stage driving unit 61 to start the rotational driving of the stage 12 by f. In step S42, the controller 241 controls the linear CCD i7 to capture the predetermined position of the end of the crystal 31. In step S43, the differential processing unit 1〇1 of the controller 241 performs differential processing (as shown in FIG. 5) on the received light intensity curve of the photographic image supplied from the linear CCD 17 to obtain the description of FIG. 6. The differential waveform. In step S44, the differential processing unit 1〇1 of the controller 241 determines whether the position of the two sharp rises and the steep drops is based on the obtained differential waveform, and judges that the first linear CCD (i.e., the linear CCD 17) is judged by 1/. Whether the end of the predetermined position α of the wafer 31 can be photographed. If it is determined in step S44 that the linear CCD 17 is at the position of the wafer 31 (at least a portion of the end portion of 2 cannot be photographed, in this case, the processing proceeds to step S45. At step S45, the controller The 241 series controls the linear CCD 221 of the second linear CCD to photograph the end portion of the wafer 3 i. Further, if it is determined in step S44, the predetermined position α of the wafer 31 can be determined by the linear ccD17 34 200914818. End photography, in this case, the predetermined position of the wafer 31 is not photographed by the linear CCD 221. That is, linear

The photographic processing is limited to the position where the linear CCD 17 cannot perform photographing of the entire end portion. In the case of driving the linear CCD 221, the edge position of the wafer 31 can be detected even if the resolution is low. Thereby, even in the case where the wafer 3 has a large deflection or skew, after that, the Apex photographing unit 14, the upper photographing unit 15, and the lower photographing unit 16 can be placed on the end of the wafer 31. The photographic range or focus is optimized. On the other hand, when the linear CCD 17 can detect the edge position of the wafer 31, since the linear CCD 17 has sufficient resolution, the detection accuracy of the edge position of the wafer 31 and the abnormal portion such as a notch or breakage can be improved. Detection accuracy. In step S46, the differential processing unit ι〇ι of the controller 241 performs differential processing on the received light intensity curve of the photographic image supplied from the linear CCD 221 (as shown in Fig. 5) to obtain the differential waveform described with reference to Fig. 6. If it is determined in step S44, the linear ccdi7 can be used to supply the wafer Μ: the differential processing unit ι〇ι of the control image 41 at the end of the photographing, and the differential processing result of the distribution state of the photographic data of the linear cm7 is supplied to Abnormality detection: 102 and edge position detecting unit 1〇3. Further, in the end step ccJ: the differential processing unit 101 of the control 1 241, the photographic data partial detection result of the linear CD 22 1 is supplied to the abnormality ^ edge position detecting unit 1 〇 3. : ' In the step S47 to the step kiss, the same processing as the step ^ step ^ step S9 is performed. Next, after the end of step S52 is completed, the process proceeds to step S10 of Fig. 11. As described above, in the inspection apparatus 201, the loaded wafer 31 is rotated by the rotation of 12, and the photographing process of the linear CCD 17 is first performed to detect the position or state of the wafer 3 i. Further, if the linear c c D i 7 is not = the position or state of the day 31 is detected, the image processing of the linear CCD 221 is performed. </ RTI> The height of the z stage n is adjusted based on the position or state of the detected wafer 31. This is processed to adjust the position with respect to the photographing unit i41. Hunting this, even if it has a large deflection or skew, it is easy and sure to observe its end. Also' in the inspection device! Further, the detection device 2〇1 may output the detection result of the edge position of the wafer detected by the edge position detecting unit 103 to another device by the 'P69'. Therefore, it is also possible to obtain another device for inspecting the information of the wafer defect output by the display i or the inspection device 2G1, and detecting the relative position of the end portion of the wafer 31 to a = 4, and performing various driving controls. The position of the wafer and the Apex photographing unit 14 is adjusted, or the position of the upper and lower positions is detected to control the focus of the upper and lower positions. In the above description, it is a matter of course that the object to be inspected is processed by the wafer 3, and the object to be inspected may be as thin as a shape, and the width of the object is thinner than the width of the linear ccm7. The end of the observation can be performed by using the m or the inspection device 2G1. By using 20%::: processing can be controlled by software. The software is: the program slot that constitutes the software is loaded and assembled, and various program slots are loaded, and various functions can be implemented. Example 36 200914818 If it can be loaded from the recording medium Use a personal computer, etc. The recording medium can be exemplified by a magnetic memory (including a floppy disk) and a compact disk (including CD_R〇M, ie C〇) which can be provided to the user by a program different from the medium of the computer. Mpact Disk-Read

Integrated memory (such as Only Memory), DVD (Digital Versatile Disk), magneto-optical disk, or semiconductor memory, etc. In addition, the scope of implementation of the present invention is not limited to the above embodiment, (in the case of Various changes can be made within the scope of the gist of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an external view for explaining an inspection apparatus i. Fig. 2 is an image of an inspection apparatus of Fig. 1 taken by an Apex photographing unit. Figure 3 is a block diagram for explaining the function of the controller of Figure 1. Figure 4 is a functional block diagram for explaining the function of the controller of Figure 3. Figure 5 is a diagram of the distribution of the received light intensity obtained by a linear CCD. Fig. 6 is a diagram showing a waveform obtained by differentiating the distribution state of Fig. 5. Fig. 7 is an explanatory diagram of a graph generated as a result of the inspection. Fig. 8 is an explanatory diagram of a graph generated as a result of the inspection. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a flow chart for explaining the wafer end inspection process 1. Fig. 11 is a flow chart for explaining the wafer end inspection process 1. Fig. 12 is a flowchart To illustrate the inspection The device has a block diagram of one of the different functions. 37 200914818 Figure 1 3 is used to illustrate the appearance of the inspection device. Figure 1 is a block diagram for explaining the inspection device of Figure 13. The flow chart of the wafer end inspection process 2 will be described. [Description of main component symbols] 1 Inspection device 11 Z stage 12 β stage 14 Apex imaging unit 15 Upper imaging unit 16 Lower imaging unit 17 Linear CCD 31 Wafer 51 Control 63 Z stage drive unit 65 upper focus control unit 66 lower focus control unit 68 recording unit 69 output unit 70 display unit 151 photography system drive unit 201 inspection device 221 linear CCD 241 controller 38

Claims (1)

200914818 X. Patent application scope: ^ An inspection device having: means for detecting the end position of the object to be inspected in the shape of a flat plate. Photographic means for observing the end of the object to be inspected According to the detection result of the end position of the inspection object by the detecting means, the relative position of the inspection object and the photographing means when the photographing means captures the observation image is adjusted. </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> And: rotating the object to be inspected at a predetermined speed; the detecting means is disposed at a position at which a position state of the end of the object to be inspected by the rotation driving means is detected, and the object to be inspected is rotated substantially for one week And detecting a plurality of positions of the end of the object to be inspected; the photographing means is disposed at a position at which an end of the object to be inspected that is rotationally driven by the rotation driving means is photographed, and is a bit smaller than the detecting means The cough rotation driving means rotates the position on the downstream side in the rotation direction of the inspection object. During the period in which the inspection object is substantially rotated, the plurality of positions of the inspection object are imaged. 3. The inspection apparatus of claim i, wherein the adjustment means further includes a position adjustment means for adjusting the inspection object and the photographing means in a vertical direction with respect to a plane of the inspection object Relative 39 200914818 position; detecting the bee fruit of the end position of the object to be inspected according to the detecting means, controlling the position adjusting means to adjust the object to be inspected and the photographer hand to be opposite to the plane of the object to be inspected The relative position in the vertical direction. 4. The inspection apparatus of claim 3, wherein the photographing means comprises a side photographing means for photographing a side surface of the object to be inspected from a horizontal direction with respect to the plane of the object to be inspected; the position adjusting means is adjustable The side photographing means and the relative position of the object to be inspected in a direction perpendicular to the plane of the object to be inspected. 5. The inspection apparatus of claim 4, wherein the photographing means comprises a planar shadowing means for photographing the object to be inspected from at least one of a vertical upper side or a lower vertical direction with respect to the plane of the object to be inspected. The end portion of the plane; the position adjusting means adjusts the side photographing means and the relative position of the plane engraving hand to the object to be inspected. 6. The inspection apparatus of claim 4, wherein the photographing means further comprises: a flat photographing means for at least a square shot from a vertical dead or a vertical lower jaw relative to a plane of the object to be inspected The end focus adjustment means of the plane of the object to be inspected, the adjustment of the photographic focus of the object is used to control the planar photographic means to detect the detected means, and the plane position of the object is detected by the plane photographic means Test 40 200914818 The focus adjustment means controls the adjustment of the photographing point of the object to be inspected by the plane photographing means based on the plane position detected by the detecting means. μ "7. The inspection device of the first application of the patent scope - /, wherein the detection means is a first range detecting means for detecting the position of the end of the inspection object in the first range, and The second range detecting means for detecting the position of the end of the object to be inspected in the second range of the larger range; the first range detecting means determining whether or not the end of the object is included in the i-th range When the first range includes the end of the inspection object, the adjustment means adjusts the relative position of the inspection object and the photographing means based on the detection result of the first range detecting means; When the range does not include the end of the inspection object, the adjustment means adjusts the relative position of the inspection object and the photographing means based on the detection result of the second range detecting means. The inspection device 'where the detection means' detects the position and state of the end of the object to be inspected. 9. The inspection device of claim 8 wherein the detection means is based on relative to the object to be inspected When the object to be inspected is observed in the horizontal direction of the plane, the position of the side boundary portion detected is abruptly changed, and an abnormal position of the state of the object to be inspected is detected, and the adjustment means is based on the detection means. In the detection result of the inspection object position, the detection result of the portion of the detected abnormal position is subtracted to adjust the relative position of the inspection object to the photographing means. 41 200914818 w•If the inspection of the scope of the patent application is the first item In the apparatus, the detecting means detects the position of the object to be inspected based on the position of the boundary portion on the side surface when the object to be inspected is observed from the horizontal direction with respect to the plane of the object to be inspected. The inspection apparatus according to claim 10, wherein the detecting means detects the positions of the two planes of the object to be inspected as the boundary portion of the object to be inspected from a horizontal direction with respect to the plane of the inspection object «二·^violation 2. If the inspection device of the scope of application of the patent scope is item [u], the method of reading and reading is used to record the detection means. The position information of the two planes of the object to be inspected is detected. 13. The inspection device of claim u, further comprising 2 means 'for the object to be inspected by the detecting means The position information of the surface is transmitted to an external device or a transmission path. The S': second inspection method is a method for inspecting the end of the object to be inspected, and includes the following steps: a detection step for detecting The position of the end portion of the object to be inspected is based on the detection result of the position of the part to be used obtained by the processing of the detecting step, and the image is observed by the photographing unit and the image is tilted. The relative position of the object to be inspected and the photographing unit is adjusted, and the photographing step of photographing the object to be inspected is adjusted to use the photographing portion adjacent to the relative position between the objects to be inspected. This observation image. 42