TW200911098A - Double-faced soft board with heat conductive design - Google Patents

Double-faced soft board with heat conductive design Download PDF

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Publication number
TW200911098A
TW200911098A TW96131726A TW96131726A TW200911098A TW 200911098 A TW200911098 A TW 200911098A TW 96131726 A TW96131726 A TW 96131726A TW 96131726 A TW96131726 A TW 96131726A TW 200911098 A TW200911098 A TW 200911098A
Authority
TW
Taiwan
Prior art keywords
heat
layer
electronic component
heat dissipation
double
Prior art date
Application number
TW96131726A
Other languages
English (en)
Chinese (zh)
Other versions
TWI339098B (enExample
Inventor
Wen-Bi Xu
De-Sheng Yang
Original Assignee
Kinsus Interconnect Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kinsus Interconnect Tech Corp filed Critical Kinsus Interconnect Tech Corp
Priority to TW96131726A priority Critical patent/TW200911098A/zh
Publication of TW200911098A publication Critical patent/TW200911098A/zh
Application granted granted Critical
Publication of TWI339098B publication Critical patent/TWI339098B/zh

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TW96131726A 2007-08-27 2007-08-27 Double-faced soft board with heat conductive design TW200911098A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96131726A TW200911098A (en) 2007-08-27 2007-08-27 Double-faced soft board with heat conductive design

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96131726A TW200911098A (en) 2007-08-27 2007-08-27 Double-faced soft board with heat conductive design

Publications (2)

Publication Number Publication Date
TW200911098A true TW200911098A (en) 2009-03-01
TWI339098B TWI339098B (enExample) 2011-03-11

Family

ID=44724582

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96131726A TW200911098A (en) 2007-08-27 2007-08-27 Double-faced soft board with heat conductive design

Country Status (1)

Country Link
TW (1) TW200911098A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407847B (zh) * 2010-06-01 2013-09-01 Azotek Co Ltd 散熱基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407847B (zh) * 2010-06-01 2013-09-01 Azotek Co Ltd 散熱基板

Also Published As

Publication number Publication date
TWI339098B (enExample) 2011-03-11

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