TW200907569A - Radiation-sensed resin composition, layer insulation film, microlens and forming method thereof - Google Patents

Abstract

The invention relates to a radioactive ray sensibility resin composition, a layer insulating file and a lenticule and forming method thereof. The invention relates to a radioactive ray sensibility resin composition, be characterised in that containing: [A] a copolymer of the unsaturated compound selected from at least one of (a1) unsaturated carboxylic acid and unsaturated carboxylic acid anhydride and at least one radical selected from the epoxy ethanyl and oxygen heterocyclic ring butyl; [B] 1, 2-diazonium quinonoid compound; and [C] the compound with the ester ring epoxy ethanyl and without the carboxyl. The radioactive ray sensibility resin composition has a high sensibility, which can form a great pattern shape of the development even the developing procedure is over the optimal developing time; the invention can easily form the layer insulating film or the lenticule with a great tight.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radiation sensitive linear resin composition, an interlayer insulating film, and a microlens, and a method of forming the same. [Prior Art] In an electronic component such as a thin film transistor (hereinafter referred to as "TFT") type liquid crystal display element, a magnetic head element, an integrated circuit element, or a solid-state imaging element, wiring is formed into a layer. Inter-insulation, provided with an interlayer insulating film. The material for forming the interlayer insulating film is preferably used in a small number of steps for obtaining a necessary pattern shape, and has sufficient flatness, so that a sensitive radiation linear resin composition can be widely used (refer to JP-A-200 1 - 3 54822 and JP-A 200). 1 - 343743 ) ° Among the above electronic components, for example, a TFT-type liquid crystal display element is formed on the interlayer insulating film to form a transparent electrode film, and further, a step of forming a liquid crystal alignment film thereon is performed, so that the interlayer insulating film is In the step of forming the transparent electrode film, it is exposed to a high temperature condition, or the pattern of the electrode exposed to the electrode forms a stripping liquid for use, and therefore sufficient resistance must be obtained. In addition, in recent years, the TFT-type liquid crystal display device is required to have a large size, a high brightness, a high definition, a high-speed response, and a thinner thickness. The composition for forming an interlayer insulating film used in the above is required. The high-sensitivity, the interlayer insulating film formed is required to have higher performance such as lower dielectric constant and high transmittance than conventional ones. -5- 200907569 In addition, for optical systems such as facsimile machines, electronic photocopiers, solid photographic elements, and the like, the optical system of the color filter film on the glass can be used with 3~1〇〇/ A microlens having a lens diameter of about /m, or a microlens array in which the plurality of microlenses are regularly arranged. The formation of the microlens or the microlens array is formed by forming a pattern-like film corresponding to the lens, and then melt-flowing by heat treatment, directly using the lens as a lens, or forming a mask pattern of the melted flow to form a mask A method of dry etching a shape of a substrate transfer lens or the like. The formation of the aforementioned lens pattern is widely used as a linear radiation-sensitive resin composition (refer to JP-A-6-8 702 and JP-A-6-136239). The element forming the microlens or the microlens array as described above removes various insulating films on the bonding pads of the subsequent wiring forming portions. Therefore, after forming a planarizing film and a photoresist film for etching, exposure is performed using a desired mask. The uranium engraved photoresist film of the adhesive pad portion is removed by development, and then the planarization film or various insulating films are removed by etching to supply the portion to expose the adhesive pad portion. Therefore, the microlens or microlens array is attached to the planarization film. And the film forming step of the etching photoresist film and the etching step must be solvent resistance or heat resistance. The sensitive radiation linear resin composition used to form such a microlens has high sensitivity, and the microlens formed therefrom has a desired radius of curvature, and high heat resistance, high transmittance, and the like are required. In the development step of forming the interlayer insulating film or the microlens system obtained in this way, if the development time is only slightly excessive in the optimum time, the imaging solution is easily permeated between the pattern and the substrate. Since it is peeled off, it is necessary to strictly control the development time, and there is a problem in terms of the yield of the product. -6 - 200907569 In this way, when an interlayer insulating film or a microlens is formed from a sensitive radiation linear resin composition, high sensitivity is required as a composition, and even when a developing time is excessive in a developing step, a pattern is generated. The type is peeled off to exhibit good adhesion, and the interlayer insulating film formed therefrom is required to have high heat resistance, high solvent resistance, low dielectric constant, high transmittance, etc., and when forming a microlens, The microlens is required to have a good melt shape (a desired radius of curvature), high heat resistance, high solvent resistance, high transmittance, etc., but a linear radiation-sensitive resin composition satisfying such requirements has not been known since. . SUMMARY OF THE INVENTION The present invention has been made in accordance with the above matters. Therefore, an object of the present invention is to provide a radiation sensitive linear resin composition which has a high radiation sensitivity and which has a good pattern shape even if the optimum development time is exceeded in the developing step. The edge can easily form a pattern-like film excellent in adhesion. Another object of the present invention is to provide a radiation sensitive linear resin composition which can be used for forming an interlayer insulating film to form an interlayer insulating film having high heat resistance, high solvent resistance, high transmittance, and low dielectric constant. The film, in addition, when used for the formation of a microlens, can form a microlens having a high transmittance and a good molten shape. Still another object of the present invention is to provide a method of forming an interlayer insulating film and a microlens using the above-mentioned radiation-sensitive linear resin composition. Still another object of the present invention is to provide an interlayer insulating film and a microlens formed by the method of the present invention. Still another object and advantages of the present invention will be apparent from the following description. According to the present invention, the above objects and advantages of the present invention can be attained by the following linear radiation-sensitive resin composition: [A] containing (al) selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic anhydrides a copolymer of at least one of the constituent groups and (a2) an unsaturated compound having an unsaturated compound selected from the group consisting of at least one of an ethylene oxide group and an oxetanyl group (hereinafter referred to as a copolymer) "copolymer [A]"), [B] 1,2-quinonediazide compound (hereinafter referred to as "[B] component"), and [C] have an alicyclic oxirane group and have no A compound of a carboxyl group (hereinafter referred to as "[C] component"). The above objects and advantages of the present invention can be attained by the formation of an interlayer insulating film and a microlens in the following steps in the following order: (1) Coating of the above-mentioned sensitive radiation linear resin composition a step of forming a film on the substrate; (2) a step of irradiating the radiation on at least a portion of the film; (3) a developing step; and (4) a heating step. -8- 200907569 Further, the above objects and advantages of the present invention can be attained by the interlayer insulating film and the microlens formed by the above method. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the sensitive radiation linear resin composition of the present invention will be described in detail. Copolymer [A] The copolymer [A] contained in the radiation sensitive linear resin composition of the present invention can be obtained by containing: (al) at least one selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic anhydrides. (hereinafter referred to as "compound (a 1 )") and (a2) an unsaturated compound having at least one selected from the group consisting of an oxiranyl group and an oxetanyl group (hereinafter referred to as "a compound" The unsaturated compound (a2)") is preferably produced by radical polymerization in the presence of a polymerization initiator in a solvent. The compound (a I ) is at least one selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic anhydrides, and examples thereof include unsaturated monocarboxylic acids, unsaturated dicarboxylic acids, and unsaturated dicarboxylic acids. An acid anhydride, a mono[(meth)acryloxyalkylene ester of a polyvalent carboxylic acid, a mono(meth)acrylate having a polymer having a carboxyl group and a hydroxyl group at both terminals, and a polycyclic ring having a carboxyl group. Saturated compounds and their anhydrides, and the like. Specific examples of such an unsaturated monocarboxylic acid include acrylic acid, methacrylic acid, crotonic acid, and the like; and examples of the unsaturated dicarboxylic acid include maleic acid, fumaric acid, and citrine-9. - 200907569 Acid, mesaconic acid, itaconic acid, etc.; as the acid anhydride of the unsaturated dicarboxylic acid, for example, an acid anhydride of the compound exemplified as the unsaturated dicarboxylic acid, etc.; The propylene oxyalkylene ester may, for example, be succinic acid mono [2-(methyl) propylene oxyethyl], decanoic acid mono [2-(methyl) propylene oxiranyl], etc.; The mono(meth)acrylate having a polymer having a carboxyl group and a hydroxyl group at both terminals may, for example, be an ω-hydroxypolycaprolactone mono(meth)acrylate; or a polycyclic unsaturated compound having a carboxyl group; The acid anhydride thereof may, for example, be 5-carboxybicyclo[2.2.1]hept-2-ene, 5,6-dicarboxybicyclo[2.2.1]hept-2-ene or 5-carboxy-5-methylbicyclo[ 2.2·1]heptan-2-ene, 5-carboxy-5-ethylbicyclo[2.2.1]hept-2-ene, 5-carboxy-6-methylbicyclo[2.2.1]hept-2-ene, 5-carboxy-6-ethylbicyclo[2.2.1]hept-2-ene, 5,6-dicarboxybicyclo [2.2_1] hept-2-ene anhydride and the like. Among these, an acid anhydride of an unsaturated monocarboxylic acid or an unsaturated dicarboxylic acid is preferably used, and in terms of copolymerization reactivity, solubility in an aqueous alkali solution, and ease of use, acrylic acid, methacrylic acid or mala is particularly preferably used. Anhydride. These compounds (al) can be used singly or in combination. The compound (a2) is a radical polymerizable unsaturated compound having at least one selected from the group consisting of an ethylene oxide group and an oxetanyl group. The oxiranyl group-containing unsaturated compound is preferably used to increase the copolymerization reactivity and the obtained interlayer insulating film or to improve the heat resistance and surface hardness of the microlens-10-200907569, for example, glycidyl acrylate, Glycidyl methacrylate, glycidyl α-ethyl acrylate, glycidyl α-n-propyl acrylate, glycidyl α-n-butyl acrylate, 3,4-epoxy acrylate Ester, 3,4-epoxybutyl methacrylate, -6,7-epoxyheptyl acrylate, -6,7-epoxyheptyl methacrylate, α-ethyl acrylate-6, 7-epoxyheptyl ester, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, and the like. Among these, glycidyl methacrylate, -6,7-epoxyheptyl methacrylate, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl group are preferably used. Ether, p-vinylbenzyl glycidyl ether, 3,4-epoxycyclohexyl methacrylate, and the like. The unsaturated compound containing an oxetanyl group may, for example, be a (meth) acrylate having an oxetanyl group. The above (meth) acrylate having an oxetanyl group may, for example, be 3-((meth)acryloxymethyl)oxetane or 3-((meth)acryl oxime). Oxymethyl)-2-methyloxetane, 3-((meth)acryloxymethyl)-3-ethyloxetane, 3-((meth) propylene oxime Oxymethyl)-2-trifluoromethyloxetane, 3-((meth)propenyloxymethyl)-2-pentafluoroethyloxetane, 3-((A) Acryloxymethyl)-2-phenyloxetane, 3-((meth)acryloxymethyl)-2,2-difluoromethyloxetane, 3 -((Meth)acryloxymethyl)_2,2,4-trifluoromethyloxetane, 3-((meth)acryloxymethyl)-2,2,4, 4_tetrafluoromethyloxetane, 3-(2-(methyl)propenyloxyethyl)oxetane-11 - 200907569 alkane, 3-(2-(methyl)propene oxime Benzyl)-2-ethyloxetane, 3-(2-(methyl)propenyloxyethyl)-3-ethyloxetane, 3-(2-(methyl) ) propylene methoxyethyl)-2-trifluoromethyl oxetane, 3-(2-(methyl) propylene oxime Oxyethyl)_2_pentafluoroethyloxetane, 3-(2-(methyl)propenyloxyethyl)-2-phenyloxetane, 3-(2-( Methyl)propenyloxyethyl)-2,2-difluorooxetane, 3-(2-(methyl)propenyloxyethyl)-2,2,4-trifluoroox Cyclobutane, 3-(2-(methyl)propenyloxyethyl)-2,2,4,4-tetrafluorooxetane, 2-((meth)propenyloxyethyl Oxetane, 2-((meth)acryloxymethyl)-3-methyloxetane, 2-((meth)acryloxymethyl)-4-B Oxycyclobutane, 2-((meth)acryloxymethyl)-3-trifluoromethyloxetane, 2-((meth)acryloxymethyl)-3 - pentafluoroethyl oxetane, 2-((meth) propylene methoxymethyl)-3-phenyl oxetane ' 2-((methyl) propylene methoxymethyl)- 3,3-Difluorooxetane, 2-((meth)acryloxymethyl)-3,3,4-trifluorooxetane, 2-((meth)acrylofluorene Oxymethyl)-3,3,4,4-tetrafluorooxetane, 2-(2-(methyl)propenyloxyethyl)oxetane, 2-(2-( methyl) Eneoxyethyl)-3-ethyloxetane, 2-(2-(methyl)propenyloxyethyl)-4-ethyloxetane, 2-(2- (Meth)acryloxyethyl)-3-trifluoromethyloxetane, 2-(2-(methyl)propenyloxyethyl)-3-pentafluoroethyloxycyclohexane Butane, 2-(2-(methyl)acryloxyethyl)-3-phenyloxetane, 2- -12- 200907569 (2-(methyl)-propyl oxyethyl )-3,3-di-n-oxindole, 2·(2-(methyl)acryloxyethyl)-3,3,4-trifluorooxetane, 2-(2- (Meth)acryloxyethyl)-3,3,4,4-tetrafluorooxetane and the like. These compounds (a2) can be used singly or in combination. The unsaturated compound used in the production of the copolymer [A] may be an unsaturated compound composed only of the above compound (a 1 ) and the compound (a2), or a compound (al) and a compound (a2). Further, an unsaturated compound of another unsaturated compound (hereinafter referred to as "compound (a3)") may be further contained. The compound () is not particularly limited as long as it is a radically polymerizable unsaturated compound other than the above compounds (a1) and (a2), and examples thereof include alkyl methacrylate, cyclic alkyl acrylate, and methacrylic acid. Cyclic alkyl ester, methacrylate with hydroxyl group, cyclic alkyl acrylate, aryl methacrylate, aryl acrylate, unsaturated dicarboxylic acid diester, bicyclic unsaturated compound, maleimide compound, no Saturated aromatic compound, conjugated diene, with the following formula (I) R1

-13- 200907569 (In the formula (I), R1 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R2 to R6 are each independently a hydrogen atom, a base group or a carbon number of 1 to 4, and a B system. a single bond, -COO-, or -C〇NH-, m is an integer of 〇~3. However, at least one of R2 to R6 is a hydroxyl group-containing unsaturated compound having a phenolic hydroxyl group; having a tetrahydrofuran skeleton, furan Skeleton, tetrahydropyran, pyran skeleton or by the following formula (II)

(II) an unsaturated compound of a skeleton represented by (in the formula (II), R7 is a hydrogen atom or a methyl group); and other unsaturated compounds. Specific examples of such an alkyl methacrylate include methacrylate, ethyl methacrylate, n-butyl methacrylate, second butyl methacrylate, and tert-butyl methacrylate. 2-ethylhexyl methacrylate, isodecyl methacrylate, n-lauryl methacrylate, tridecyl methacrylate, n-stearyl methacrylate, etc.; Examples of the ester include methacrylate, isopropyl acrylate, and the like; and examples of the cyclic alkyl methacrylate include cyclohexyl methacrylate and 2-methylcyclohexyl methacrylate. , 三环[ 5.2.1.02 6]癸- -14- 200907569 8-yl methacrylate, tricyclo[5·2·1.〇2.6]癸-8_yloxyethyl methacrylate, isobornyl A methacrylate or the like; in the case of a methacrylate having a hydroxyl group, for example, hydroxymethyl methacrylate, 2-hydroxyethyl methacrylate, 3-hydroxypropyl methacrylate, 4 _hydroxybutyl methacrylate, diethylene glycol monomethacrylate, 2,3- Hydroxypropyl methacrylate, 2-methylpropenylethyl glucoside, 4-hydroxyphenyl methacrylate, etc.; as the cyclic alkyl acrylate, for example, cyclohexyl acrylate, 2-methyl Cyclohexyl acrylate, tricyclo[5.2.1.02·6]癸-8-yl acrylate, tricyclo[5.2.1.026] 癸-8-yl acrylate oxyethyl acrylate, isobornyl acrylate, etc.; Examples of the aryl methacrylate include phenylmethyl propionate, benzyl methacrylate, and the like; and examples of the acrylate acrylate include phenyl acrylate and phenyl methacrylate. The unsaturated dicarboxylic acid diester may, for example, be diethyl maleate, diethyl fumarate or diethyl itaconate; and the bicyclic unsaturated compound may, for example, be bicyclic. [2.2.1] anthracene-2-ene, 5-methylbicyclo[2.2.1]癸_2-ene, 5-ethylbicyclic dilute, 5-methoxybicyclo[2.2.1]癸-2 - , 5-ethoxybicyclo[2.2.1]non-2-ene, 5,6-dimethoxybicyclo[2.2.1]non-2-ene' 5,6-diethoxybicyclo[2.2. 1] indole-2-ene, 5-tributoxycarbonylbicyclo[2.2丨]癸_2_ suspicion, 5 - Hexyloxybicyclo[2.2.1]indole-2-iso, 5-phenoxyindenylbicyclo[2.2_1]indol-2-ene, 5,6-di(t-butoxy)yl double ring [2.2.1] -15- 200907569 癸-2 - aene, 5,6-di(cyclohexyloxycarbonyl)bicyclo[2.2.1]non-2-ene, 5-(2,-hydroxyethyl)bicyclo[ 2·2.1]癸_2_ene, 5,6-dihydroxybicyclo[2.2.1]non-2-ene, 5,6-di(hydroxymethyl)bicyclo[2.2.1]non-2-ene, 5,6-bis(2,-hydroxyethyl)bicyclo[2·2.1]癸·2-ene, 5-hydroxy-5-methylbicyclo[2.2.1]non-2-ene, 5-hydroxyethyl Bicyclo[2.2.1]non-2-ene, 5-hydroxymethyl-5-methylbicyclo[2.2.1]non-2-ene, etc.; as the maleimide compound, for example, N- Phenylmaleimide, N-cyclohexylmaleimide, N-benzylmethylmaleimide, N-(4-hydroxyphenyl)maleimide, N-(4-hydroxyl Benzyl)maleimide, N-succinimide diyl-3-maleimide benzoate, N-succinimide diyl-4-maleimide butyrate , N-succinimide diyl-6-maleimide valerate, N-succinimide diyl-3-maleimide propionate, N-(9-propylenediyl) horse In the case of an unsaturated aromatic compound, for example, styrene, α-styrene styrene, m-methyl styrene, p-methyl styrene, ethyl benzene, p-methoxybenzene Ethylene or the like; as the conjugated diene, for example, 1,3-butadiene, isoprene, 2,3-dimethyl-1,3-butadiene, etc.; The phenolic ketone-based unsaturated compound represented by I) may, for example, be represented by the following formula (1) to (5) -16 to 200907569, respectively.

R1 1) R1 cr

NH R2 2 R5/L^p^R3 R4

O R1 0, (CH2)r cr Ό R2 r5"^V^^r3 R4 3) , R2 R4 (4) R1 R2 R4 (5) (in the formulas (1) to (5), n is 1 to 3 The integers, R1 to R6, are the same as defined in the above formula (I)) -17-200907569, and the unsaturated compound having a tetrahydrofuran skeleton, for example, tetrahydroindenyl (meth) acrylate 2, methacryloyloxy-propionic acid tetrahydrofurfuryl ester, 3-(meth) propylene decyloxytetrahydrofuran-2-one, etc.; and as the unsaturated compound having a furan skeleton, for example, 2 - Methyl-5-(3-furyl)-1-penten-3-one, mercapto (meth)acrylic acid vinegar, 1-indolyl-2-butyl-3-carbo-2-indole, 1- Ethyl-2-butyl-3-methoxy-3-ene-2-indole, 6-(2-furyl)-2-methylhexene-3-one, 6-(2- Furyl)-hex-1-en-3-one, 2-(2-furyl)-1-methyl-ethyl acrylate, 6-(2-furyl)-6-methyl-1-heptane An ene-3-one or the like; as an unsaturated compound having a tetrahydropyran skeleton, for example, (tetrahydropyran-2-yl)methyl methacrylate, 2,6-dimethyl-8-(four Hydropyran-2-yloxy)-oct-1-en-3-one, 2 - Tetrahydropyran-2-yl methacrylate, 1-(tetrahydropyran-2-yloxy)-butyl-3-en-2-one, etc.; in the case of an unsaturated compound having a pyran skeleton 'For example, 4-(L4-dioxa-5-oxo-6-heptenyl)-6-methyl-2-dipyrrolyl ketone, 4-(1,5-dioxin-6-oxygen- 7-octenyl)-6-methyl-2-dipyrrolidone or the like; and as the unsaturated compound having a skeleton represented by the above formula (II), for example, repeating of an ethylene glycol unit a polyethylene glycol mono(meth)acrylate having a number of 2 to 10, a polypropylene glycol mono(meth)acrylate having a repeating number of 2 to 10, and the like; as for other unsaturated compounds, Examples are acrylonitrile, methacrylonitrile, vinyl chloride, vinylidene chloride, acrylamide, methacrylamide, vinyl acetate, and the like. -18- 200907569 Among these, 'alkyl acrylate, alkyl methacrylate, cyclic alkyl methacrylate, cyclic alkyl acrylate, methacrylate with hydroxyl group, cyclic alkyl acrylate, horse An imine compound, an unsaturated aromatic compound or an unsaturated compound having a phenolic hydroxyl group represented by the above formula (I) or having a tetrahydrofuran skeleton 'furan skeleton, a tetrahydropyran skeleton, a pyran skeleton or the above formula ( II) the unsaturated compound of the skeleton shown; and other unsaturated compounds, in terms of copolymerization reactivity and solubility in the alkali developing solution, particularly preferably styrene, tert-butyl methacrylate, tricyclic [5_2_1.02'6]癸-8-yl methacrylate, n-lauryl methacrylate, p-methoxystyrene, 2-methylcyclohexyl acrylate, fluorene-phenyl maleimide , Ν-cyclohexylmaleimide, Ν-(3,5-dimethyl-4-hydroxybenzyl)methacrylamide, tetrahydrofurfuryl (meth) acrylate, ethylene glycol unit Polyethylene glycol mono(meth)acrylate, 3-(A) with a repeating unit number of 2~10 Acryloxytetrahydrofuran-2-one, 4-hydroxybenzyl (meth) acrylate, 4-hydroxyphenyl (meth) acrylate, o-hydroxystyrene, p-hydroxystyrene or α-methyl - P-hydroxybenzene is suspected. These compounds (a3) can be used singly or in combination. The copolymer [A] used in the present invention is derived from the constituent unit of the compound (a 1 ), and preferably contains 5 to 5 based on the total of the repeating units derived from the compounds (al), (a2) and (a3). 40% by weight, particularly preferably 5 to 25% by weight. When the copolymer having a constitution of less than 5% by weight is used, it is difficult to dissolve in an aqueous alkali solution in the developing step, and more than 40% by weight of the copolymer tends to have too much solubility in an aqueous alkali solution. -19- 200907569 The copolymer [A] used in the present invention is derived from the constituent unit of the compound (a2), based on the total of the repeating units derived from the compounds (a 1 ), ( a2 ) and (a3 ), It is preferably contained in an amount of 10 to 80% by weight, particularly preferably 30 to 80% by weight. When the constituent unit is less than 10% by weight, the heat resistance, surface hardness, and peeling resistance of the interlayer insulating film or the microlens obtained tend to decrease, and the amount of the constituent unit exceeds 80% by weight. The storage stability of the radiation linear resin composition tends to decrease. The copolymer [A] used in the present invention is derived from the constituent unit of the compound (a3), and preferably contains 1 依据 based on the total of the repeating units derived from the compounds (a 1 ), (a2) and (a3). ~60 weight ° /. It is especially suitable to contain 1 5 to 50% by weight. If the constituent unit is less than 1% by weight, the storage stability of the radiation sensitive linear resin composition tends to be insufficient. In addition, if the amount of the constituent unit exceeds 60% by weight, the interlayer insulating film or the micro layer obtained may be obtained. The heat resistance, the surface hardness, and the peeling resistance of the lens are insufficient. The preferred example of the copolymer [A] used in the present invention is, for example, methacrylic acid/tricyclic [5.2.1.02·6]. Alkan-8-ylmethacrylate/2-methylcyclohexyl acrylate/glycidyl methacrylate/N_(3,5-dimethyl-4-hydroxybenzyl)methacrylamide , methacrylic acid/tetrahydrofurfuryl methacrylate/glycidyl methacrylate/N-cyclohexylmaleimide/lauryl methacrylate/α-methyl-P-hydroxystyrene Copolymer, styrene/methacrylic acid/glycidyl methacrylate/(3-ethyloxetan-3-yl)methacrylate/tricyclo[5_2_1_026] decane_8_yl group Acrylate copolymer, methacrylic acid/tricyclo[5.2.1.0 6 6]decane-8-yl methacrylate / Ν-cyclohexylmalayiya Amine / -20- 200907569 Methyl acrylate acid glycidyl ester / styrene copolymer, methyl acrylate / 3,4-epoxycyclohexylmethyl (meth) acrylate / styrene / three Ring [5.2.1.02.6] decane-8-yl methacrylate copolymer and the like. The styrene-equivalent weight average molecular weight (hereinafter referred to as "Mw") of the copolymer [A] used in the present invention is preferably 2xl 〇 3 to lxl 〇 5, more preferably 5 x 10 3 to 5 x 10 4 . When Mw is less than 2x10, the development edge may be insufficient, and the residual film ratio of the obtained coating film may be lowered, etc., and the pattern shape and heat resistance of the obtained interlayer insulating film or microlens may be lowered. More than 1 X 1〇5, sometimes the sensitivity will drop or the shape of the pattern will be poor. Further, the molecular weight distribution (hereinafter referred to as "Mw/Mn") of the ratio of the number average molecular weight (hereinafter referred to as "Μη") to the polystyrene is preferably 5.0 or less, more preferably 3.0 or less. If Mw/Mn exceeds 5.0, the resulting interlayer insulating film or microlens has a poor pattern shape. The sensitive radiation linear resin composition containing the above copolymer [A] does not cause development residue upon development, and can easily form a specific pattern shape. The solvent used in the production of the copolymer [A] may, for example, be an alcohol, an ether, a glycol ether, an ethylene glycol alkyl ether acetate, a diethylene glycol, a propylene glycol monoalkyl ether or a propylene glycol alkyl ether acetate. Ester, propylene glycol alkyl ether propionate, aromatic hydrocarbon, ketone, ester, and the like. Specific examples of such an alcohol include methanol, ethanol, benzyl alcohol, 2-phenylethyl alcohol, and 3-phenyl-1-propanol; and examples of the ether include Tetrahydrofuran or the like; as the glycol ether, for example, ethylene glycol monomethyl ether, ethylene glycol monoethyl acid, etc.; -21 - 200907569 ethylene glycol alkyl ether acetate Base cellosolve acetate, ethyl cellosolve acetate, ethylene glycol monobutyl ether acetate, ethylene glycol monoethyl ether acetate, etc.; in the case of ethylene glycol, for example Diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, etc.; The alkyl ether may, for example, be propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether or propylene glycol monobutyl ether; and as the propylene glycol alkyl ether acetate, for example, propylene glycol A Ethyl ether acetate, propylene glycol ethyl ether acetate, propylene glycol propyl ether acetate, propylene glycol butyl ether acetate, etc.: Examples of the propylene glycol alkyl ether propionate include a diol methyl ether propionate, a propylene glycol ethyl ether propionate, a propylene glycol propyl ether propionate, a propylene glycol butyl ether propionate, etc., and an aromatic hydrocarbon, for example, toluene, xylene, etc.; The ketone may be exemplified by, for example, methyl ethyl hydrazine, cyclohexyl hydrazine, 4- peroxy-4-methyl-2-heptanone; and the ester may, for example, be methyl acetate, ethyl acetate or propyl acetate. , butyl acetate, ethyl 2-hydroxypropionate, methyl 2-hydroxy-2-methylpropionate, ethyl 2-hydroxy-2-methylpropionate, methyl hydroxyacetate, ethyl hydroxyacetate, hydroxyl Butyl acetate, methyl lactate, ethyl lactate, propyl lactate, butyl lactate, methyl 3-hydroxypropionate, ethyl 3-hydroxypropionate, propyl 3-hydroxypropionate, butyl 3-hydroxypropionate Ester, methyl 2-hydroxy-3-methylbutanoate, methyl methoxyacetate, ethyl methoxyacetate, propyl methoxyacetate, methoxy vinegar-22- 200907569 butyl acrylate, ethoxylate Methyl acetate, ethyl ethoxyacetate, propyl ethoxyacetate, butyl ethoxyacetate, methyl propoxyacetate, ethyl propoxyacetate, propyl propionate, propoxy vinegar Butyl ester, methyl butoxyacetate, ethyl butoxyacetate, propyl butoxyacetate, butyl butoxyacetate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate , propyl 2-methoxypropionate, butyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, propyl 2-ethoxypropionate , butyl 2-ethoxypropionate, methyl 2-butoxypropionate, ethyl 2-butoxypropionate, propyl 2-butoxypropionate, butyl 2-butoxypropionate , methyl 3-methoxypropionate, ethyl 3-methoxypropionate, propyl 3-methoxypropionate, butyl 3-methoxypropionate, methyl 3-ethoxypropionate , ethyl 3-ethoxypropionate, propyl 3-ethoxypropionate, butyl 3-ethoxypropionate, methyl 3-propoxypropionate, ethyl 3-propoxypropionate , propyl 3-propoxypropionate, butyl 3-propoxypropionate, methyl 3-butoxypropionate, ethyl 3-butoxypropionate, propyl 3-butoxypropionate , butyl 3-butoxypropionate, and the like. Such solvents are preferably ethylene glycol alkyl ether acetate, diethylene glycol, propylene glycol monoalkyl ether or propylene glycol alkyl ether acetate, particularly diethylene glycol dimethyl ether, diethyl Glycol ethyl methyl ether, propylene glycol methyl ether, propylene glycol ethyl ether, propylene glycol methyl ether acetate or methyl 3-methoxypropionate. As the polymerization initiator used in the production of the copolymer [A], those generally known as radical polymerization initiators can be used. For example, 2,2 '-azobisisobutyronitrile, 2,2'-azobis-(2,4-dimethylvaleronitrile), 2,2,-azobis-(4-methoxy) Azo compounds such as benzyl-2,4-dimethylvaleronitrile; benzoyl peroxide, lauric acid peroxide, tert-butylperoxy-23-200907569 trimethyl acetate, ι, An organic peroxide such as ι'-bis-(t-butylperoxy)cyclohexane; hydrogen peroxide or the like. When a peroxide is used as the radical polymerization initiator, a peroxide and a reducing agent may be used to form a redox type initiator. In the production of the copolymer [A], 'the molecular weight is adjusted, and a molecular weight regulator can be used. Specific examples thereof include halogenated hydrocarbons such as chloroform and carbon tetrabromide; n-hexyl mercaptan, n-octyl mercaptan, n-dodecyl mercaptan, tri-dodecyl mercaptan, and sulfur a thiol compound such as an alkyd; a xanthogen compound such as dimethylxanthine thioether or diisopropylxanthogen disulfide; terpinolene or α-methyl benzene acetonitrile. [Β] component In the [Β] component used in the present invention, a 1,2-quinonediazide compound of a carboxylic acid is produced by irradiation with radiation, and a phenolic compound or an alcoholic compound (hereinafter referred to as "mother" may be used. a condensate of a core with a 1,2-naphthoquinonediazidesulfonic acid halide. The above-mentioned mother nucleus may, for example, be trihydroxybenzophenone, tetrahydroxybenzophenone, pentahydroxybenzophenone, hexahydroxybenzophenone, (polyhydroxyphenyl) alkane or the like. Specific examples of such a trihydroxybenzophenone include, for example, 2,3,4-trihydroxybenzophenone, 2,4,6-trihydroxybenzophenone, and the like; -24-200907569 The tetrahydroxybenzophenone may, for example, be 2,2',4,4'-tetrahydroxybenzophenone, 2,3,4,3'-tetrahydroxybenzophenone, 2,3,4 , 4'-tetrahydroxybenzophenone, 2,3,4,2'-tetrahydroxy-4'-methylbenzophenone, 2,3,4,4'-tetrahydroxy-3'-methoxy a benzophenone or the like; in the case of pentahydroxybenzophenone, for example, 2,3,4,2',6'-pentahydroxybenzophenone; in the case of hexahydroxybenzophenone, For example, 2,4,6,3',4',5'-hexahydroxybenzophenone, 3,4,5,3',4',5'-hexahydroxybenzophenone, etc.; The hydroxyphenyl) alkane may, for example, be bis(2,4-dihydroxyphenyl)methane, bis(p-hydroxyphenyl)methane, tris(p-hydroxyphenyl)methane or 1,1,1-three ( p-Hydroxyphenyl)ethane, bis(2,3,4-trihydroxyphenyl)methane, 2,2-bis(2,3,4-trihydroxyphenyl)propane, 1,1,3-tri 2,5-Dimethyl-4-hydroxyphenyl)-3-phenylpropane, 4,4'-[1-[4-[1-[4- Phenyl]-1-methylethyl]phenyl]p-vinyl]bisphenol, bis(2,5-dimethyl-4-hydroxyphenyl)-2-hydroxyphenylmethane, 3,3, 3',3'-tetramethyl-1,1,-spirobiguanidine-5,6,7,5,6,7,-hexanol, 2,2,4-trimethyl-7,2 ', 4'-three radix flavan, etc.; for other mother nucleus, for example, 2-methyl-2-(2,4-dihydroxyphenyl)-4-(4-hydroxyl Phenyl)-7-hydroxycoumarin, 2-[bis{(5-isopropyl-4-hydroxy-2-methyl)phenyl}methyl], 1-{1-(3-{1- (4-hydroxyphenyl)-1-methylethyl}-4,6-a-based base-1-methylethyl}-3-(1_(3-{1-(4-hydroxybenzene) ))-1-methylethyl}-4,6-dihydroxyphenyl)-1-methylethyl)benzene, 4,6-bis{1-(4-hydroxyphenyl)-1-methyl Ethyl}-1,3-dihydroxybenzene and the like. -25- 200907569 Further, '1,2-naphthoquinone diazidosulfonate decylamine which changes the ester bond of the above-exemplified parent core to a guanamine bond is also preferably used, for example, 2,3,4-trihydroxydiphenyl Keto-I, 2-naphthoquinonediazide-4-sulfonic acid decylamine and the like. In such a mother nucleus, it is preferably 2,3,4,4'-tetrahydroxybenzophenone or 4,4'-[1-[4-[1-[4-hydroxyphenyl]-1-methyl Ethylethyl]phenyl]p-vinyl]bisphenol. The halogenated 1,2-naphthoquinonediazidesulfonic acid is preferably 1,2-naphthoquinonediazidesulfonic acid chloride, and specific examples thereof include 1,2-naphthoquinonediazide-4-sulfonate. Acid and 1,2-naphthoquinonediazide-5-sulfonic acid, wherein 1,2-naphthoquinonediazide-5-sulfonic acid is preferably used. In the condensation reaction, it is preferred to use 30 to 85 mol% for the OH group in the phenolic compound or the alcohol compound, and it is more preferable to use a halogenated 1,2-naphthoquinone stack corresponding to 50 to 70 mol%. The sulfonic acid condensation reaction can be carried out by a known method. These components [B] can be used singly or in combination of two or more. The use ratio of the component [B] is preferably from 5 to 100 parts by weight, more preferably from 10 to 50 parts by weight, per 1 part by weight of the copolymer [A]. When the ratio is less than 5 parts by weight, the difference in solubility between the irradiated portion and the unirradiated portion of the aqueous solution which is the aqueous solution of the developing solution is small, and the pattern may become difficult. Further, the interlayer insulating film may be obtained. Or the heat resistance and solvent resistance of the microlens are insufficient. In addition, when the ratio exceeds 1 〇 〇 by weight, it may be difficult to perform development in the radiation irradiated portion where the solubility of the aqueous alkali solution is insufficient. -26-200907569 [C] Component The component [c] used in the present invention is a compound having an alicyclic oxiranyl group and having no residue (or an acid anhydride group). Here, the alicyclic epoxy-based system means a group having both an alicyclic structure and an epoxy-based structure. The alicyclic oxirane group preferably has an alicyclic structure and an atomic group constituting an oxygen atom bonded to two adjacent carbon atoms among the carbon atoms, and examples thereof are as follows: (111 -1) ) The base shown by ~ ( I Π - 3 ).

The [C] component having such an alicyclic oxirane group is, for example, (cl) an unsaturated compound having an alicyclic oxiranyl group and having no carboxyl group (hereinafter referred to as "compound (c 1 )" And (c2) a copolymer of an unsaturated compound having no alicyclic oxirane group and having no carboxyl group (hereinafter referred to as "compound (c2)") (hereinafter referred to as "copolymer (C)") Other compounds having a gastric alicyclic oxirane group and having no carboxyl group. The compound (c 1 ) which can be used to synthesize the copolymer [C] is, for example, 3,4-epoxycyclohexylmethyl (meth) acrylate or 3,4-epoxycyclohexylethyl group. (Meth) acrylate, 3,4. epoxycyclohexyl n-propyl (meth) acrylate, 3,4-epoxycyclohexyl isopropyl (methyl) -27- 200907569 Acrylate, Bu Vinyl·2,3-epoxycyclohexane, 〖-vinyl_3,4-epoxycyclohexane, allyl-2, 3-epoxycyclohexane, allyl- 3,4-epoxycyclohexane and the like. Among these compounds, 3,4-epoxycyclohexylmethyl (meth) acrylate is preferably used in terms of polymerizability. The compound (c2) is exemplified as the unsaturated compound of the compounds (a2) and (a3), and a compound which does not correspond to the compound (c1) can be used. Among them, an alkyl acrylate, an alkyl methacrylate, a cyclic alkyl methacrylate, a maleimide compound, an unsaturated aromatic compound, and a phenolic hydroxyl group represented by the above formula (1) are preferably used. An unsaturated compound, or a glycidyl skeleton, a tetrahydrofuran skeleton, a furan skeleton, a tetrahydrofuran skeleton, a pyran skeleton or an unsaturated compound having a skeleton represented by the above formula (II), in terms of copolymerization reactivity, particularly preferably Glycidyl methacrylate, p-vinylbenzyl glycidyl ether, styrene, tert-butyl methacrylate, tricyclo[5.2.1.06·6]decane-8-yl methacrylate, first month Citrine methacrylate, p-methoxystyrene, 2-methylhexyl methacrylate, N-phenyl maleimide, N-cyclohexylmaleimide, N-(3,5 - dimethyl-4-hydroxybenzyl)methacrylamide, tetrahydroindenyl (meth) acrylate, ethylene glycol unit repeat number of 2 to 10 polyethylene glycol mono (methyl) Acrylate, 3-(meth)propenyloxytetrahydrofuran-2-one, 4-hydroxybenzene Yl (meth) acrylate, 4 - hydroxyphenyl (meth) acrylate, o-hydroxystyrene, p-hydroxy styrene or [alpha] - methyl - p-hydroxy styrene. The copolymer [C] is derived from the constituent unit of the compound (c 1 ), and it is preferably contained in an amount of 5 to 90% by weight based on the total of the repeating units derived from the compounds (c 1 ) and (c2). It is especially preferable to contain ι 〇 80% by weight. When the amount of the constituent unit is less than 5% by weight, the heat resistance, surface hardness, and peeling resistance of the interlayer insulating film or the microlens obtained tend to be lowered, and when the amount of the constituent unit exceeds 90% by weight, the radiation is sensitive. The storage stability of the linear resin composition tends to decrease. The styrene-equivalent weight average molecular weight (Mw) of the copolymer [C] is preferably 2 x 10 3 to 5 x 10 4 , more preferably 5 x 10 3 to 3 x 10 4 . The copolymer [C] can be produced by subjecting the compounds (c 1 ) and (C2) to radical polymerization in the presence of a polymerization initiator in accordance with the synthesis method of the above copolymer [a]. Further, the copolymer [C] is copolymerized with the above copolymer [A] in the case of having an oxirane group, but the copolymer [C] is different from the copolymer [A] in that it does not have alkali solubility. In the present invention, other compounds having an alicyclic oxiranyl group and having no carboxyl group as the component [C] can be used, for example, the following formulas (6) to (8), respectively.

-29- ch2-c-o- II 〇 o-

200907569 CH——C——0-

II o 0H——C——0-

II o ch2-c-

II o

(8) A compound represented by (in the formula (7), a, b, c and d are each independently an integer of from 1 to 20). Commercial products of such compounds include, for example, Celloxide 202 1 P, Celloxide 3 000, Epolead GT401, ΕΗΡΕ 3 15 0, ΕΗΡΕ 3150 Ε (above, manufactured by Daicel Chemical Industry Co., Ltd.). The radiation sensitive linear resin composition of the present invention preferably contains 40 parts by weight of the [C] component, and particularly preferably 5 to 30 parts by weight, based on 100 parts by weight of the polymer [A]. When the content of the [C] component is less than 1 part by weight, the heat resistance, surface hardness, and peeling resistance of the interlayer insulating film or the microlens obtained tend to decrease, and the content of the [C] component exceeds 40% by weight. In the case of a portion, the tendency to lower the solubility of the alkali developing solution is observed. -30-200907569 Other components The sensitive radiation linear resin composition of the present invention contains the above copolymer [A], [B] component and [C The component is an essential component, but may contain, as needed, a [D] thermosensitive acid generating compound, [E] a polymerizable compound having at least one ethylenically unsaturated double bond, [F] copolymer [A], and copolymerization. An epoxy resin other than [C], [G] adhesion aid or [H] surfactant. The above [D] thermosensitive acid generating compound can be used to further improve the heat resistance or hardness of the obtained interlayer insulating film or microlens. Examples thereof include gun salts of sulphur gun salt, benzothiazole gun salt, ammonium salt, and phosphor gun salt. Examples of the above sulfonium salt include alkylsulfonyl salt, benzyl sulfide salt, diphenylmethylsulfonium salt, substituted benzylsulfonium salt, benzothiazole gun salt and the like. Specific examples of such alkylsulfonyl salts include, for example, 4-ethoxyphenyl dimethylsulfuric hexafluoroantimonate, 4-ethoxycarbonyl phenyl dimethyl sulfonate Acid salt, dimethyl 4-(benzyloxy oxy) phenyl sulfonium hexafluoroantimonate, dimethyl-4-(benzyl oxime) phenyl sulfonium hexafluoroantimonate, Dimethyl-4-(benzimidyloxy)phenylsulfonium hexafluoroarsenate, dimethyl-3-chloro-4-ethoxythiazide phenylsulfonium hexafluorocatelate, etc.; benzene The methylsulfur gun salt may, for example, be benzyl-4-hydroxyphenylmethylsulfonium hexafluoroantimonate, benzyl-4-hydroxyphenylmethylsulfonium hexafluorophosphate or 4-ethyloxonium oxide. Phenylphenylmethylmethylsulfide hexafluoroantimonate, benzyl-4-methoxyphenylmethylsulfonium hexafluoroantimonate, benzyl-2-methyl-31 - 200907569 4-hydroxyphenylmethylsulfonium hexafluoroantimonate, benzyl-3-chloro-4-hydroxyphenylmethylsulfonium hexafluoroarsenate, 4-methoxybenzyl-4-hydroxyl Phenylmethylsulfide hexafluorophosphate or the like; a diphenylmethylsulfide salt may, for example, be diphenylmethyl-4-hydroxyphenylsulfonium hexafluoroantimonate or diphenylmethyl-4hydroxyl Phenylsulfur gun hexafluorophosphate, 4-ethoxylated phenyl diphenylmethylsulfide hexafluoroantimonate, diphenylmethyl-4-methoxyphenylsulfuric iron hexafluorophosphate _Benzylmethyl-3-chloro-4-hydroxyphenylsulfonium hexafluoroarsenate, benzhydryl-methyl-4-hydroxy-5-t-butylphenylsulfide hexafluoroarsenate, Benzyl-4-methoxybenzyl-4-hydroxyphenylsulfonium hexafluorophosphate; etc.; substituted benzylsulfide can be, for example, p-chlorobenzyl-4-hydroxyphenylmethylsulfide Hexafluoroantimonate, p-nitrobenzyl-4-hydroxyphenylmethylsulfur hexafluoroantimonate, p-chlorobenzyl-4-hydroxyphenylmethylsulfate hexafluorophosphate, phosphate Benzyl-3-methyl-4-hydroxyphenylmethylsulfonium hexafluoroantimonate, 3,5-dichlorobenzyl-4-hydroxyphenylmethylsulfone hexafluoroantimonate, adjacent Chlorobenzyl-3-chloro-4-hydroxyphenylmethylsulfonium hexafluoroantimonate; etc.; benzothiazole gun salt may, for example, be 3-benzylbenzothiazole, hexafluoroantimonate, 3 - Benzylbenzothiazole molybdate, 3-benzylbenzothiazole molybdate, 3-(p-methoxybenzyl)benzothiazole iron Fluoride, 3-benzyl-2-(methylthiobenzothiazolyl iron hexafluoroantimonate, 3-benzyl-5-chlorobenzothiazole hexafluoroantimonate, and the like. Among them, iron iron or benzothiazole iron should be used, and 4-ethoxymethoxyphenyldimethylsulfonium hexafluoroarsenate, benzyl-4-hydroxy-32-200907569 phenyl group is particularly preferably used. Methyl sulfonium hexafluoroantimonate, 4-ethoxymethoxyphenylbenzylmethylsulfide hexafluoroantimonate, diphenylmethyl-4-hydroxyphenylsulfur hexafluoroantimonate, 4 - ethoxylated phenyl phenyl sulfonium hexafluoroantimonate or 3-benzyl benzothiazole hexafluoroantimonate. Such commercially available products include, for example, Sun_aid SI-L85, SI-L110, SI-L145, SI-L150, SI-L160 (above, Sanshin Chemical Industry Co., Ltd.). The use ratio of the component [D] in the radiation sensitive linear resin composition of the present invention is preferably 20 parts by weight or less, and more preferably 5 parts by weight or less, relative to the copolymer [A] 100 parts by weight, [ When the amount of the component D is more than 20 parts by weight, precipitates may be precipitated in the coating film forming step, which may hinder the formation of the coating film. A polymerizable compound having at least one of the above-mentioned [E] ethylenically unsaturated double bonds (hereinafter referred to as "(E) component" may be exemplified as monofunctional (meth) acrylate, bifunctional (meth) acrylate An ester or a trifunctional or higher (meth) acrylate acid vinegar. The monofunctional (meth) acrylate may, for example, be 2-hydroxyethyl (meth) acrylate or carbitol (meth) acrylate. Isobornyl (meth) acrylate, 3-methoxybutyl (meth) acrylate, 2-(meth) propylene oxiranyl ethyl hydroxypropyl phthalate, etc. Commercially available products include, for example, Aronix M-101, M-111, M-114 (above 'East Asia Synthetic Co., Ltd.), KAYARAD TC-110S, TC-120S (above 'Nippon Chemical Co., Ltd.), viscoat 158, 2311 (above, Osaka Organic Chemical Industry Co., Ltd.), etc. -33- 200907569 The bifunctional (meth) acrylate type may, for example, be ethylene glycol (meth) acrylate vinegar, 1,6- Hexanediol di(methyl)propane phthalate, 1,9-nonanediol di(meth) acrylate, polypropylene glycol di(methyl) propyl Sour vinegar, tetraethylene glycol di(meth) acrylate, bisphenoxyethanol hydrazine dipropionate, bisphenoxyethanol hydrazine diacrylate, etc. Such commercially available products are, for example, Aronix M - 210, M-240, M-6200 (above, East Asia Synthetic Co., Ltd.), KAYARAD HDDA, HX-220, R-604 (above 'Nippon Chemical Co., Ltd.), Viscoat 260, 312, 335 HP (above' The above-mentioned trifunctional or higher (meth) acrylate may, for example, be trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, or tris(( Methyl) propylene methoxyethyl) phosphate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, etc., and commercially available products are, for example, Aronix M - 309, M - 400, M - 405, M - 450, M - 7100, Μ - 803 0, Μ - 8 060 (above, East Asia Synthetic Co., Ltd.), KAYARAD TMPTA, DPHA, DPCA - 20, DPCA-30, DPCA-60, DPCA-1 20 (above, Nippon Kayaku Co., Ltd.), V Iscoat 295, 300, 360, GPT, 3PA, 400 (above, Osaka Organic Chemical Industry Co., Ltd.), etc. Among these, it is preferable to use a trifunctional or higher (meth) acrylate. Methylpropane tri(meth)acrylate, pentaerythritol tetra(meth)acrylate or dipentaerythritol hexa(meth)acrylate. -34- 200907569 These monofunctional, bifunctional or trifunctional or higher (meth)propionic acid esters may be used singly or in combination. The use ratio of the component [E] in the radiation sensitive linear resin composition of the present invention is preferably 50 parts by weight or less, more preferably 30 parts by weight or less based on the copolymer [A ] 1 〇 〇 by weight. By containing the [E] component in such a ratio, the heat resistance and surface hardness of the interlayer insulating film or microlens obtained from the sensitive radiation linear resin composition of the present invention can be improved. If the amount used exceeds 5 parts by weight, film roughness may occur in the step of forming a coating film of the radiation-sensitive linear resin composition on the substrate. The epoxy resin other than the above [F] copolymer [A] and the copolymer [C] (hereinafter sometimes referred to as "[F] component" is not limited as long as it does not affect compatibility, and is preferably limited. For example, bisphenol A type epoxy resin, phenol novolak type epoxy resin, cresol novolac type epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, heterocyclic epoxy Resin, glycidyl (meth) acrylate, (co)polymerized resin, etc. Among these, bisphenol A type epoxy resin, cresol novolac type epoxy resin, or glycidyl ester is particularly preferable. The use ratio of the [F] component in the radiation sensitive linear resin composition of the present invention is preferably 30 parts by weight or less based on 100 parts by weight of the copolymer [A]. By being contained in such a ratio The component [F] further improves the heat resistance and surface hardness of the protective film or the protective film obtained from the sensitive radiation linear resin composition of the present invention. If the ratio exceeds 30 parts by weight, a sensitive radiation linear resin is formed on the substrate. When the composition is coated, sometimes the film thickness of the coating film -35- 200907569 Uniformity is insufficient. Further, the above copolymerization [A] and copolymer [C] may also be referred to as "epoxy resin", but the "F" component does not have alkali solubility and is copolymerized. The substance [A] is different from the copolymer in that it does not have an alicyclic oxirane group. In the sensitive radiation linear resin composition of the present invention, the coating property may be improved to include a [G] interface. An active agent. Here, a fluorine-based surfactant, a polyoxyn surfactant, or a nonionic surfactant can be suitably used as the [G] surfactant. Specific examples of the fluorine-based surfactant include, for example, 1. 1,2,2-tetrafluorooctyl (1,1,2,2-tetrafluoropropyl)ether, 1,1,2,2-tetrafluorooctylhexyl ether, octaethylene glycol di(1,1 , 2,2-tetrafluorobutyl)ether, hexaethylene glycol (1,1,2,2,3,3-hexafluoropentyl)ether, octapropylene glycol di(i,l,2,2-tetrafluoro Butyl)ether, hexapropanediol bis(1,1,2,2,3,3-hexafluoropentyl)ether, sodium perfluorododecylsulfonate, 1,1,2,2,8,8, 9,9,10,10-decafluorododecan, 1,1,2,2,3,3-hexafluorodecane, etc., with sodium fluoroalkylbenzenesulfonate, An alkyl oxy vinyl ether, a fluoroalkyl ammonium iodide, a fluoroalkyl polyoxy vinyl ether, a perfluoroalkyl polyoxyethylene, a perfluoroalkyl alkoxy ester, a fluoroalkyl ester, etc. Commercially available products include, for example, BM-1000, BM-1100 (above, BM Chemie), Megafack F142D, F172, F173, F183, F178, F191, and F471 (above, manufactured by Dainippon Ink Chemical Industry Co., Ltd.). Fluorad FC - 170C, FC-171, FC-430, FC-431 (above, Sumitomo 3M (share) system), Sarflon S-112, S-113, S-131, S-141, S-145, S- 382, SC - -36- 200907569 101, SC-102, SC-103, SC-104, SC-105, SC-106 (above, Asahi Glass Co., Ltd.), Eftop EF301, 3 0 3, 3 5 2 ( Above, the new Akita Chemicals Co., Ltd.). The polyoxo-based surfactant may, for example, be DC3PA, DC7PA, FS-1265, SF-8428, SH11PA, SH21PA, SH28PA 'SH29PA, SH30PA, SH-190, SH-193, SZ-6032 (above, Toray Dow) Commercially available under the trade names of Corning Silicone Co., Ltd., TSF-4440, TSF-4300, TSF-4445, TSF-4446, TSF-4460, TSF-445 2 (above, Momentive Performance materials Japan contract company) . The nonionic surfactant may, for example, be a polyoxyethylene alkyl ether such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether or polyoxyethylene oleyl ether; polyoxyethylene octyl phenyl ether; a polyoxyethylene aryl ether such as polyoxyethylene nonylphenyl ether; a polyoxyethylene dialkyl ester such as polyoxyethylene dilaurate or polyoxyethylene distearate, or the like (meth) Acrylate copolymer Polyflow No. 57, 95 (above, Co., Ltd.). These surfactants can be used singly or in combination of two or more types. In the radiation sensitive linear resin composition of the present invention, the [G] surfactant is preferably used in an amount of 5 parts by weight or less, more preferably 2 parts by weight or less based on 100 parts by weight of the copolymer [A]. When the amount of the [G] surfactant used is more than 5 parts by weight and the coating film is formed on the substrate, the film feel of the coating film may easily occur. Further, in the sensitive radiation linear resin composition of the present invention, the adhesion to the substrate is improved, and [H] an adhesion aid can be used. The [H] adhesion aid is preferably a functional oxime coupling agent, and examples thereof include a decane coupling agent having a reactive substituent such as a carboxy 'methacryl fluorenyl group, an isocyanate group or an oxiranyl group. Specific examples thereof include trimethoxymethyl decyl benzoic acid, r - methacryloxypropyl trimethoxy decane, vinyl ethoxy decane, vinyl trimethoxy decane, and r - isocyanate propyl triethyl. Oxygen sands, 7-glycidoxypropyltrimethoxy sands, /3-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, and the like. In the sensitive radiation linear resin composition of the present invention, the [H] adhesion aid is preferably used in an amount of 20 parts by weight or less based on 100 parts by weight of the copolymer [A], more preferably 1 part by weight or less. . If the amount of the adhesion aid exceeds 2 parts by weight, development residue may easily occur in the development step. Sensitive Radiation Linear Resin Composition The sensitive radiation linear resin composition of the present invention can be prepared by uniformly mixing the above copolymer [A], [B] component and [C] component and the other components arbitrarily added as described above. In general, the radiation sensitive resin composition of the present invention is preferably dissolved in a suitable solvent and used in a solution state. For example, a photosensitive radiation-sensitive resin composition in a solution state is prepared by mixing the copolymer [A], [B] component, and [C] component and other components arbitrarily added at a specific ratio. -38- 200907569 The solvent used for the preparation of the sensitive radiation linear resin composition of the present invention can be uniformly dissolved using the copolymers [A], [B] and [C] components and optionally other components. And do not react with each component. Such a solvent may, for example, be the same as those exemplified for the solvent used for the production of the above copolymer [A]. Among such solvents, alcohol, glycol ether, ethylene ether alkyl ether acetate, ester or two are preferably used from the solubility of each component, the reactivity with each component, and the ease of formation of a coating film. Ethylene glycol. Among these, benzyl alcohol, 2-phenylethanol, 3-phenyl-1-propanol, ethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate are particularly preferably used. Ester, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol dimethyl ether, propylene glycol monomethyl ether, butanediol monomethyl ether acetate, methoxy Methyl propionate or ethyl ethoxypropionate. Further, in order to improve the in-plane uniformity of the solvent and the film thickness, a high boiling point solvent can also be used. Examples of the high-boiling solvent which can be used include N-methylformamide, hydrazine, hydrazine-dimethylformamide, N-methylformamide, hydrazine-methylacetamide, ν, Ν- Dimethylacetamide, Ν-methylpyrrolidone, dimethyl hydrazine, benzyl ethyl ether, dihexyl ether, acetonyl acetone, isophorone, hexanoic acid, octanoic acid, 1-octanol, 1 - decyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, 7-butyrolactone, ethylene carbonate, propylene carbonate, phenyl cellosolve acetate, and the like. Among these, it is preferably N-methylpyrrolidone, butyrolactone or N,N-dimethylacetamide. In the solvent of the sensitive radiation linear resin composition of the present invention, when the high-boiling solvent of -39-200907569 is used, the amount thereof is preferably 50% by weight or less, preferably 40% by weight or less, based on the total amount of the solvent. More preferably, it is 30% by weight or less. If the amount of the solvent used in the barrel boiling point exceeds the amount used, the film thickness uniformity, sensitivity, and residual film ratio of the coating film may be lowered. When the sensitive radiation linear resin composition of the present invention is prepared as a solution, components other than the solvent occupied in the solution (that is, the copolymer [A], [B] component, and [C] component, and other components added arbitrarily The ratio (solid content concentration) may be arbitrarily set depending on the purpose of use or the desired film thickness, but is preferably 5 to 50% by weight, more preferably 10 to 40% by weight. Most preferably 1 5 to 3 5 wt%. The composition solution prepared in this manner is filtered by using a micropore filter having a pore size of about 0.2 μm or the like and then supplied. Formation of Interlayer Insulating Film and Microlens Next, a method of forming the interlayer insulating film and the microlens of the present invention will be described using the sensitive radiation linear resin composition of the present invention. The method of forming the interlayer insulating film or the microlens of the present invention comprises the following steps in the following order. (1) a step of forming a coating film of the sensitive radiation linear resin composition of the present invention on a substrate; (2) a step of irradiating radiation on at least a portion of the coating film; (3) a developing step; and (4) ) heating step. The following describes the steps of the method for forming the interlayer insulating film or microlens of the present invention -40-200907569. (1) a step of forming a coating film of the sensitive radiation linear resin composition of the present invention on a substrate. In the step (1) above, the composition solution of the present invention is applied to the surface of the substrate, preferably pre-baked. Bake to remove the solvent to form a coating film of the radiation sensitive linear resin composition. The type of the substrate that can be used is, for example, a glass substrate, a tantalum substrate, or a substrate on which various metals are formed on the surface. The coating method of the composition solution is not particularly limited, and for example, a spray coating method, a roll coating method, a spin coating method (spin coating method), a die coating method, a rod coating method, an inkjet method, or the like can be employed. A suitable method, in particular, is preferably a spin coating method or a die coating method. The pre-baking conditions vary depending on the type of each component contained in the composition solution, the use ratio, and the like, but may be, for example, 60 to 110 ° C for 30 seconds to 15 minutes. The film thickness of the formed coating film is pre-baked, and the interlayer insulating film is, for example, 3 to 6 // m, and the microlens is, for example, 〇. 5~3 // m 〇(2) The step of irradiating at least a portion of the coating film with radiation is performed by using the developing liquid after the formed coating film is irradiated with radiation through a mask having a specific pattern in the step (2). The treatment is performed to remove the irradiated portion of the radiation, and the pattern is patterned. The light rays to be used at this time may, for example, be ultraviolet rays, far ultraviolet rays, X-rays, charged particle beams -41 - 200907569, and the like. The ultraviolet rays may, for example, be a g-line (wavelength of 43 6 nm), an i-line (wavelength of 3 65 nm), or the like. The far ultraviolet ray may, for example, be a KrF excimer laser or the like. The X line may be, for example, a synchrotron radiation. The charged particle beam may, for example, be an electron beam or the like. Among these, ultraviolet rays are preferable, and it is preferable to contain radiation of at least one of the g-line and the i-line. When the exposure amount is formed as an interlayer insulating film, it is preferably from 50 to 1 500 J/m2, and when the microlens is formed, it is preferably from 50 to 200 0 J/m2. (3) Developing step The developing liquid used for developing treatment may use, for example, sodium hydroxide, potassium hydroxide, sodium carbonate, sodium citrate, sodium citrate, ammonia, ethylamine, n-propylamine, diethylamine. , diethylaminoethanol, di-n-propylamine, triethylamine, methyldiethylamine, dimethylethanolamine, triethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, pyrrole, hexahydropyridine An aqueous solution of a base (basic compound) of 1,8-diazobicyclo[5.4.0]-7-undecene, 1,5-diazobicyclo[4.3.0]-5-decane or the like . Further, an aqueous solution of a water-soluble organic solvent such as methanol or ethanol or an aqueous solution of an interfacial surfactant or various organic solvents which dissolve the composition of the present invention may be added to the aqueous solution of the above-mentioned alkali as a developing solution. As the developing method, a suitable method such as a liquid-filling method, a dipping method, a shaking dipping method, a spraying method, or the like can be used. The preferred development time varies depending on the composition of the composition, but may be, for example, 30 to 1 20 seconds. -42- 200907569 In addition, the known radiation-sensitive linear resin composition has a development time of more than 20 to 25 seconds from the optimum ' 'Because of the formed pattern, the peeling must be strictly controlled. In the case of the inductive radiation linear resin composition of the invention, even if it is more than 30 seconds from the optimum imaging time, a good pattern can be formed, which has the advantage of product yield. (4) The heating step is carried out after the (3) development step as described above, and the patterned film is preferably subjected to a cleaning treatment such as washing with running water, and further preferably by a high pressure mercury lamp. After the total irradiation (post-exposure) radiation is applied, the ruthenium is subjected to decomposition treatment of the 1,2-quinonediazide compound remaining in the film, and then the film is heated by a suitable heating device such as a hot plate or an oven ( After the post-baking treatment, the film is subjected to a hardening treatment. The exposure amount in the above post-exposure step is preferably from 2,000 to 5,000 Å/m2. Further, the heating temperature in the hardening treatment is, for example, 120 to 250 °C. The heating time varies depending on the type of the heating machine, but is, for example, 5 to 30 minutes for heat treatment on a hot plate and 30 to 90 minutes for heat treatment in an oven. In this case, a stage baking method in which the heating step is performed twice or more may be used. In this way, a patterned film corresponding to the purpose of the interlayer insulating film or the microlens can be formed on the surface of the substrate. The interlayer insulating film and the microlens system formed as described above are excellent in various properties such as adhesion, heat resistance, solvent resistance, transparency, and the like from the examples described later. The interlayer insulating film of the present invention formed as described above has good adhesion to a substrate, is excellent in solvent resistance and heat resistance, has high transmittance, and has a low dielectric constant, so that it can be suitably used. It is used as an interlayer insulating film for electronic parts. The microlens of the present invention formed as described above is excellent in adhesion to a substrate, excellent in solvent resistance and heat resistance, and has high transmittance and good melt shape, so that it can be suitably used as a microlens. Solid photographic element. The shape of the microlens of the present invention is a semi-convex mirror shape as shown in Fig. 1(a). EXAMPLES Synthesis Example of Copolymer [A] Synthesis Example A - 1 In a flask equipped with a cooling tube and a stirrer, 2,2'-azobis(2,4-dimethylvaleronitrile) was fed. 7 parts by weight and 220 parts by weight of diethylene glycol ethyl methyl ether. Then, 20 parts by weight of methacrylic acid, 15 parts by weight of tricyclo[5.2.1.〇2'6]nonane-8-yl methacrylate, and 20 parts by weight of N-cyclohexylmaleimide were fed. Glycidyl methacrylate 30 -44 - 200907569 parts by weight, 15 parts by weight of the present invention, and 3 parts by weight of the ?-methylstyrene coupler, after the nitrogen substitution, the stirring was started slowly. The temperature of the solution was raised to 70 ° C. This temperature was maintained for 4 hours, and a polymer solution containing the copolymer [a - j ] was obtained. The solid content concentration of the polymer solution (that is, the ratio of the weight of the polymer occupied by the total weight of the polymer solution, the same below) was 3 2.0% by weight. The polystyrene-equivalent weight average molecular weight (Mw) of the copolymer [A-1] was 10,000' molecular weight distribution (Mw/Mn) of 2.3. Synthesis Example 2 In a flask equipped with a cooling tube and a stirrer, 8 parts by weight of 2,2,-azobis(2,4-dimethylvaleronitrile) and 220 parts by weight of diethylene glycol ethyl methyl ether were fed. . Then, '20 parts by weight of methacrylic acid, 45 parts by weight of 3,4-epoxycyclohexylmethylmethylpropionate, 1 part by weight of styrene, and 3 ring [5.2.1.02'6]癸After 25 parts by weight of the alk-8-yl methacrylate and 3 parts by weight of the α-methylstyrene coupler, after nitrogen substitution, stirring was slowly started. The temperature of the solution was raised to 70 ° C, and the temperature was maintained for 4 hours to obtain a polymer solution containing the copolymer [A - 2 ]. The polymer solution had a solid concentration of 31.9% by weight. The polystyrene-equivalent weight average molecular weight (Mw) of the copolymer [A-2] was 8,800, and the molecular weight distribution (Mw/Mn) was 2.4. Synthesis Example of Copolymer [C] Synthesis Example C - 1 -45- 200907569 In a flask equipped with a cooling tube and a stirrer, 8 parts by weight of 2,2,-azobis(2,4-diisobutyronitrile) was fed. And diethylene glycol ethyl methyl ether 22 parts by weight. Then, after feeding 5 parts by weight of 3,4-epoxycyclohexylmethyl methacrylate, 50 parts by weight of p-vinylbenzyl glycidyl ether and 4 parts by weight of methyl styrene. 'After the nitrogen substitution, the stirring started slowly. The temperature of the solution was raised to 80 ° C, and the temperature was maintained for 4 hours to obtain a polymer solution containing the copolymer [C - 1 ]. The solid solution concentration of the polymer solution was 1.8% by weight. The copolymer [C-1] had a polystyrene-equivalent weight average molecular weight (Mw) of 8,000 and a molecular weight distribution (Mw/Mn) of 2.4. Synthesis Example C-2 In a flask equipped with a cooling tube and a stirrer, 8 parts by weight of 2,2,-azobis(2,4-diisobutyronitrile) and 220 parts by weight of diethylene glycol ethyl methyl ether were fed. Share. Then, 50 parts by weight of 3,4-epoxycyclohexylmethyl methacrylate, 50 parts by weight of p-hydroxyphenyl methacrylate, and 4 parts by weight of α-methylstyrene, were fed. After the nitrogen is replaced, the stirring is slowly started. The temperature of the solution was raised to 80 ° C, and the temperature was maintained for 4 hours to obtain a polymer solution containing the copolymer [C - 2 ]. The polymer solution had a solid concentration of 32.1% by weight. The copolymer [C-2] had a polystyrene-equivalent weight average molecular weight (Mw) of 8,400 and a molecular weight distribution (Mw/Mn) of 2.4. Synthesis Example C - 3 -46 - 200907569 In a flask equipped with a cooling tube and a stirrer, 8 parts by weight of 2,2'-azobis(2,4-diisobutyronitrile) and diethylene glycol ethyl group were fed. 220 parts by weight of the ether. Then, after feeding 50 parts by weight of 3,4-epoxycyclohexylmethyl methacrylate, 50 parts by weight of styrene, and 4 parts by weight of α-methylstyrene, 'the nitrogen substitution is started slowly. Stir. The temperature of the solution was raised to 80 ° C, and the temperature was maintained for 4 hours to obtain a polymer solution containing the copolymer [C - 3]. The solid solution concentration of the polymer solution was 31. 1% by weight. The copolymer [C-3] had a polystyrene-equivalent weight average molecular weight (Mw) of 8,000 and a molecular weight distribution (Mw/Mn) of 2.4. <Preparation of Sensitive Radiation Linear Resin Composition> Example 1 For the copolymer [A], the solution containing the polymer [A-1] synthesized in the above Synthesis Example A-1 corresponds to a polymer [A - 1] 100 parts by weight (solids), for the component [B], is 4,4' - [1 - [4- [4-[4-hydroxyphenyl]-1- Condensate of methylethyl]phenyl]p-ethyl]bisphenol (1.0 mol) with 1,2-naphthoquinonediazide-5-sulfonic acid (2.0 mol) [B - 1]25 In the case of the component [C], the solution containing the copolymer [C-1] synthesized in the above Synthesis Example C-1 corresponds to 30 parts by weight of the polymer [C-1] (solid content). The amount is mixed, and after diluting with diethylene glycol ethyl methyl ether in such a manner that the solid content concentration is 30% by weight, it is filtered by a filtration membrane having a diameter of 〇. 2 # m to modulate the linear composition of the radiation sensitive resin. Solution (s - 1 ). -47-200907569 Examples 2 to 4 and Comparative Examples 1 to 3 In Example 1, except for the types and amounts described in Tables, the components [A], [B], and [C] were used. The rest were carried out in the same manner as in Example 1 to modulate the solutions (S-2) to (S-4) and (sl) to (s-3) of the radiation-sensitive linear resin composition. Further, in Example 4, Further, in addition to the components [A], [B] and [C] of the polymer, an adhesion aid of [H] of the type and amount described in Table 1 is further added. The description of the component [B] in Example 4 indicates two types of 1,2-quinonediazide compounds. Further, in Comparative Example 3, the components [A] and [B] were added to the components [A] and the components [F] described in Table 1. Example 5 In Example 1, a mixed solution of [G]SH-28PA (manufactured by Toray Dow Corning Silicone Co., Ltd.) and diethyldiethylmethyl ether/propylene glycol monomethyl ether acetate was further added ( The solution (S - 5 ) of the radiation-sensitive linear resin composition was prepared in the same manner as in Example 1 except that the weight ratio was 6/4) as the diluent solvent and the solid content concentration of the solution was 2% by weight. -48- 200907569 1嗽Other components (parts by weight) 1 1 1 Τ—Η 1 1 Type 1 1 1 g 〇1 1 Ξ [C Cheng component (parts by weight) 1 1 1 Type [C-1] [C -2] f-1 m 1 U [C —4] 1 1 r—Η 1 υ 1 1 1 [B] component (parts by weight) <N in CM (N 10/10 (N m (N tn ( N (N species 1 1 '1 r - Η ώ 1 1 1 - 1 ώ rT ώ 1-1 ώ [Bl] [Bl] [B-ll 『B-ll quantity (parts by weight) 100 ο O ο o 〇100 o Species ΓΑ-11 11-1 < ι· ·π < 1 < r-1 1 H-lt; [A-ll ΓΑ-21 ΓΑ-11 The name of the composition (S-1) r? (S -3) (S-4) (n (s-1) (s-2) Example 1 Example 2 Example 3 Example 4 Example 5 Comparative Example 1 Comparative Example 2 Comparative Example 3 -49- 200907569 Table 1 The abbreviations of the 'components' are as follows. Copolymer [A] [A - 1]: Copolymer [A - 1] [A - 2] synthesized in Synthesis Example A - 1 : Synthesis Example A - 2 synthesized copolymer [A - 2] [B] component [B - 1]: chlorinated 4,4' - [1 - [4 - [bu [4 - hydroxyphenyl]-1 - methyl b Phenyl]p-ethyl]bisphenol (1.0 mol) and 1,2-naphthoquinonediazide-5-sulfonic acid ( 2.0 molar) condensate [B-2]: 2,3,4,4'-tetrahydroxybenzophenone (1.0 mol) and 1,2-naphthoquinonediazide-5-sulfonic acid (2.44 mole) condensate [C] component [C-1]: copolymer synthesized in Synthesis Example C-1 [C-1] [C-2]: copolymerization synthesized in Synthesis Example C-2 [C - 2] [C - 3]: Copolymer synthesized in Synthesis Example C-3 [C - 3] [C - 4] : Epolead GT401 (made by Daicel Chemical Industry Co., Ltd.) Other Ingredients [F ]: Phenolic novolac type ring type epoxy resin EP152 (made by Japan Epoxy Resin Co., Ltd.) [G] : SH - 28PA (made by Toray Dow Corning Co., Ltd.) -50- 200907569 [Η] : 7 -epoxy Oxypropyl dimethoxy sand litter <performance evaluation as interlayer insulating film> Examples 6 - 10, Comparative Examples 4 to 6 Using the sensitive radiation linear resin composition prepared as described above, it was evaluated as interlayer insulation. Various properties of the film. [Evaluation of Sensitivity] The compositions described in Table 2 were applied to the substrates of Examples 6 to 9 and Comparative Examples 4 to 4, respectively, and then prebaked at 90 ° C for 2 minutes to form a film. A coating film of 3.0/m thick. 1 〇 was coated by a die-stitch coater, vacuum-dried in 15 seconds to reach the < method, and pre-baked on a hot plate at 90 ° C to form a film thickness of 3.0/zm. membrane.

The coating film obtained in each case was exposed to the exposure time as an exposure variable by a PLA-501 F exposure machine (silver lamp) manufactured by Cannon, having a specific pattern mask, and then subjected to exposure. The concentration of the aqueous solution of tetramethylammonium hydroxide was 80 seconds at a moderate concentration of 0.4% by weight of the developer solution at 25 ° C, and 50 seconds after the use of a concentration of 2.38 developer solution, and development was carried out by a liquid-filling method. After the water was washed with running water for 1 minute, it was dried and baked on a substrate-shaped film. At this time, look at the line and gap of 3.0 // m (1 〇 gap / pattern to complete the minimum exposure required for dissolution. This is shown in Table 2. It can be said that the sensitivity is 1000 J/m2 or less. For example, if the 6 series is used for the heating plate, the example).51 〇rr is used for 2 minutes, and the type of ultra-high pressure water is described as the sensitivity thin after forming the figure pair 1) on the ultra-pure after using the concentrated weight%. good. -51 - 200907569 [Evaluation of development edge] On the substrate, the compositions described in Table 2 were applied to the spin coaters of Examples 6 to 9 and Comparative Examples 4 to 6, respectively, and then preliminarily applied at 90 °C. After baking for 2 minutes, the crucible was formed into a film having a film thickness of 3.0/zm. In the case of Example 1, the enamel was coated by a die-stitch coater, vacuum-dried after reaching the practice in 15 seconds, and pre-baked on a hot plate at 90 ° C;):: clock, forming a film thickness of 3.0 //m coating film. The coating film obtained in each case was passed through a mask having a pattern of 3.0 / zm (10 to 1) and a 50 1 F exposure machine (ultra-high pressure mercury lamp) made of Cannon. The exposure was carried out at the exposure amount of the sensitivity measured by the above evaluation, and the aqueous solution of tetramethylammonium hydroxide in the concentration shown in Table 2 was used as a variable at a temperature of 25 ° C as a variable. Visualization. Then, it was washed with a running water for 1 minute, dried, and a film was formed on the substrate. At this time, the image required for the width of the line to be 3.0 // m is shown in Table 2 as the optimum development time. Further, when the development is further continued from the optimum, the "measurement of the line of 3 · 0 / m / the time when the pattern is peeled off" is shown in Table 2 as the development edge. When the development edge is more than 1 second, the development edge is good. [Evaluation of Solvent Resistance] The compositions described in Table 2 were applied to the spinners of Examples 6 to 9 and Comparative Examples 4 to 6 on the substrate, and then the heating plates were used at 9 〇〇c. Implement 0.5t〇rr f 2 split line and inter-PLA - "[Sensitivity use note, pure water enters the pattern shape time, when the image is displayed, it is straightforwardly 3 0. Use the heating plate -52- 200907569 to pre-bake 2 minutes to form a coating film. About Example 1 The enamel was coated by a die-stitch coater, vacuum-dried after reaching 15 Torr for 15 seconds, and then pre-baked on a hot plate at 90 ° C. 2 minutes to form a coating film. The coating film obtained in each case was exposed to light by using a PLA- 5 01 F exposure machine (ultra-high pressure mercury lamp) manufactured by Cannon and integrating the irradiation amount to 3000 J/m 2 . The film was heated at 220 ° C for 1 hour in an oven to form a cured film having a film thickness of about 3. Ομιη on the substrate. The film thickness of the cured film was measured (Τ 1 ). Then, the ruthenium substrate on which the cured film was formed was immersed in After measuring the temperature of the dimethyl sulfoxide at 70 ° C for 20 minutes, the film thickness of the cured film was measured (11) The film thickness change rate {|tl - ΤΙ | / Τ 1 } χ 100 [%] obtained by immersion was calculated. The results are shown in Table 2. When the 値 is 5% or less, the solvent resistance is good. In the evaluation, the patterning of the formed film is not required. Therefore, the radiation irradiation step and the development step are omitted, and only the coating film forming step, the post-exposure step, and the heating step are performed for evaluation. [Evaluation of heat resistance] A cured film was formed on the substrate in the same manner as in the above [Evaluation of Solvent Resistance], and the film thickness (T2) of the obtained cured film was measured. Then, the cured film substrate was added at 240 ° C in a clean oven. After baking for 1 hour, the film thickness (t2) of the cured film was measured, and the film thickness change rate {|t2 - T2|/T2} xl00 [%] by additional baking was calculated. The results are shown in Table 2. When the amount is 5 % or less, the solvent resistance is good. -53- 200907569 - In the evaluation of heat resistance, the patterning of the formed film is not required. Therefore, only the coating film forming step, the post-exposure step, and the heating step are performed. Evaluation. [Evaluation of transparency] In the above [Evaluation of Solvent Resistance] A glass substrate (Corning 7059 (manufactured by Corning)) was used instead of the ruthenium substrate, and a cured film was formed on the glass substrate in the same manner as [evaluation of solvent resistance]. The light transmittance of the glass substrate having the cured film was obtained. The measurement was carried out at a wavelength in the range of 400 to 800 nm by a spectrophotometer "1 50 - 20 type double beam (manufactured by Hitachi, Ltd.)". The 光线 of the lowest light transmittance at that time is shown in Table 2. When the enthalpy is 90% or more, the transparency is good. Further, in the evaluation of the transparency, the patterning of the formed film was not required. Therefore, only the coating film forming step, the post-exposure step, and the heating step were carried out for evaluation. [Evaluation of specific resistivity] On the SUS substrate of honing, Examples 6 to 9 and Comparative Examples 4 to 6 were applied to the compositions described in Table 2 using a spin coater, and then 90 ° C was applied. It was prebaked on a hot plate for 2 minutes to form a coating film having a film thickness of 3.0 // m. Example 10 was coated by a die-stitch coater, vacuum-dried after reaching a 0.5 torr method for 15 seconds, and then pre-baked on a hot plate at 90 ° C for 2 minutes to form a film thickness. 3 · 〇# m coating film. -54- 200907569 The film obtained in each case was exposed in a clean oven using a PLA-501 F exposure machine (Ultra High Pressure Mercury Lamp) manufactured by Cannon and an integral irradiation amount of 3 000 J/m2. (The rc was heated for 1 hour, and a film thickness-hardened film was formed on the substrate. A Pt/Pd electrode pattern was formed by vapor deposition on the cured film, and a dielectric constant measurement sample was prepared. For each substrate, Yokogawa was used. The Hewlett-Packard HP16451B electrode and HP4284A, precison LCR measured the specific dielectric ratio by the CV method at a frequency of l〇kHz. The results are shown in Table 2. When the 値 is 3 _ 5 % or less, the specific dielectric ratio is Good. Moreover, in the evaluation of the specific dielectric ratio, the patterning of the formed film is not required. Therefore, only the coating film forming step, the post-exposure step, and the heating step are performed for evaluation. -55- 200907569 (N« ratio Dielectric ratio Ο rn ΓΟ Transparency (%) σν <N ON ON m 〇\ ON Heat resistance film thickness change rate (%) (Ν (N < N CN (N 00 solvate film thickness change rate ( %) mmmmm 00 ο image edge 丨 edge (seconds) IT) ^T) iTi CN in (N Optimum imaging time (seconds) § § § § g § Sensitivity evaluation sensitivity (J/m2) 500 550 450 550 500 700 1,200 550 Imaging liquid concentration (% by weight) Inch o inch o 1 2.38 inch o inch o inch inch o inch Ο composition name (S1) (S-3) (S-4) (n 1 /-s (s-2) cn Example 6 Example 7 Example 8 Example 9 Example 10 Comparative Example 4 Comparative Example 5 Comparative Example 6 - 56 - 200907569 <As performance evaluation of microlenses> Example 1 1 to 1 4, Comparative Examples 7 to 9 Using the sensitive radiation linear resin composition prepared as described above, as follows, Evaluation of various characteristics as microlenses. Further, evaluation of solvent resistance, evaluation of heat resistance, and evaluation of transparency are referred to as results of performance evaluation of the above interlayer insulating film. [Evaluation of sensitivity] on a substrate The composition described in Table 3 was applied separately using a spin coater, and then prebaked on a hot plate at 90 ° C for 2 minutes to form a coating film having a film thickness of 2.0 " m. On the obtained coating film The projection exposure machine is reduced by NSR 1 75 5i7A made by Nikon via a pattern mask with a specific pattern (ΝΑ = 0.50, λ = 3 65 nm) Exposure was carried out using the exposure time as a variable. The development was carried out by a liquid-filling method at 25 ° C for 1 minute using an aqueous tetramethylammonium hydroxide solution having a concentration shown in Table 3. Then, it is washed with water and dried to form a pattern-like film on the substrate. At this time, the gap line width of the line of 0.8 β m and the gap (1 pair of 丨) is considered to be the minimum exposure amount required by # 8 # m. This enthalpy is shown in Table 3 as sensitivity. It can be said that the sensitivity is good when the 値 is 2000 J/m 2 or less. [Evaluation of development edge] On the substrate, the composition described in Table 3 was applied by using a spin coater, and then pre-baked on a hot plate at 9 ° C for 2 minutes to form a film thickness of 2.0. The coating film of m. On the obtained coating film, a NSRl 75 5i7A NSKl 75 5i7A reduction projection projection machine (ΝΑ = 0.50, λ = 3 65 nm ) was used in a mask of the type -57-200907569 having a specific pattern. Exposure was carried out on the exposure amount of the sensitivity measured by the above-mentioned "[Evaluation of Sensitivity]", and the aqueous solution of tetramethylammonium hydroxide having the concentration shown in Table 3 was used to carry out the liquid phase method at 25 ° C. Like 1 minute. Then, it is washed with water and dried to form a pattern-like film on the substrate. At this time, the gap line width between the line and the gap (1 to 1) of 〇·8 " m becomes 〇. 8 // m The required development time is shown in Table 3 as the optimum development time. Further, when the development was continued from the optimum development time, the time until the pattern of 0.8 // m was peeled off (developing edge) was measured, and it is shown in Table 3 as the development edge. When the 値 is more than 30 seconds, the development edge is good. [Formation of Microlens] The composition described in Table 3 was applied onto a tantalum substrate by a spin coater, and then prebaked on a hot plate at 90 ° C for 2 minutes to form a coating film having a film thickness of 2.0. On the obtained coating film, NSR 1 75 5 i7A made by Nikon was used to reduce the projection exposure machine through a pattern mask having a 4.0/zm dot/2.0 #m gap pattern (ΝΑ = 0·50, λ =3 6 5 nm ), and exposure is performed at an exposure amount equivalent to the sensitivity measured by the above [[Evaluation of Sensitivity], and the hydrogen peroxide described is used for the concentration of the developing liquid in the sensitivity evaluation of Table 3. The aqueous solution of tetramethylammonium was used for development for 1 minute at 25 ° C in a liquid-filled method. Then, it is washed with water, dried, and formed on a substrate to form a pattern-like film. Exposure was carried out by using a PLA-501 F exposure machine (ultra-high pressure mercury lamp) manufactured by Cannon and integrating the irradiation amount to 3 000 J/m2. -58- 200907569 Then, the plate was heated at 160 ° C for 10 minutes, and further heated at 230 ° C for 1 minute to melt the pattern to form a microlens. The dimensions (diameter) and cross-sectional shape of the bottom of the formed microlens (the surface in contact with the substrate) and the cross-sectional shape are shown in Table 3. The size of the bottom of the microlens exceeds 4.0/im, which is good when it is less than 5.0/zm. Further, if the size is 5.0 / z m or more, the state of contact between adjacent lenses is not good. Further, the cross-sectional shape is good when it is in the shape of a semi-convex lens as shown in (a) in the pattern diagram of Fig. 1, and the case of a trapezoid on (b) is bad. -59- 200907569 £ Micro-lens shape cross-sectional shape $ bottom size (//m) cn inch · (N inch * inch · inch · — (N development edge edge (seconds) 〇〇yr) cn ο (N optimum Imaging time (seconds) § § Ο § § Sensitivity evaluation sensitivity (J/m2) 1,000 1,100 900 ι___ 1,100 1,400 2,400 1,100 Imaging liquid concentration (% by weight) Inch inch 〇1 2.38 ι_ inch Ο inch o inch Ο inch ο Name of the composition (S-1) (S-2) (S-3) (S-4) (s-1) I cn Example 11 Example 12 Example 13 Example 14 Comparative Example 7 Comparative Example 8 Comparison Example 9 -60-200907569 Effect of the Invention The sensitive radiation linear resin composition of the present invention has high radiation sensitivity and has a good pattern shape even if the optimum development time is exceeded in the developing step. The pattern-like film which is excellent in adhesion can be easily formed on the edge. The interlayer insulating film of the present invention formed from the above composition has good adhesion to the substrate, and is excellent in solvent resistance and heat resistance. Transmittance, low dielectric constant, so it can be used as an interlayer of electronic parts The microlens of the present invention formed from the above composition is excellent in adhesion to a substrate, excellent in solvent resistance and heat resistance, and has high transmittance and good melt shape, and thus is suitable. It is used as a microlens such as a solid photographic element. [Simplified illustration of the drawing] Fig. 1 is a schematic view showing the cross-sectional shape of the microlens.

Claims (1)

200907569 X. Patent application scope 1. A sensitive radiation linear resin composition comprising: [A] containing (ai) at least one selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic anhydrides, and (a2) a copolymer of an unsaturated compound having an unsaturated compound selected from the group consisting of at least one of an oxiranyl group and an oxetanyl group, [B] 1,2-quinonediazide compound And [C] a compound having an alicyclic oxiranyl group and having no carboxyl group. 2. The sensitive radiation linear resin composition as claimed in claim 1 wherein [C] has an alicyclic oxiranyl group and has no sulfhydryl group, and the other compound (cl) has an alicyclic epoxy An unsaturated compound having an alkyl group and no carboxyl group, and (c2) a copolymer having no alicyclic epoxy group and an unsaturated compound having no mercapto group, or the following formulas (6) to (8) -62- 200907569 H2 cl a. CH H2 c όό όό- - - Γ c=〇c=〇cyo cyo H2) (c 5 H (c 5 H2) (c 5 H (c c-=oc-^oc- Yoc-yo ο ο ο ο /Λ/Λνχ/Λ 2 2 2 2 CHCHCHCH -ca-(b-(o-(d 8 (a compound in which a, b, c, and d in the formula (7) are each independently an integer of 1 to 20). 3. The radiation sensitive linear resin composition of claim 1 or 2, which is used for the formation of an interlayer insulating film. 4. A method of forming an interlayer insulating film, comprising the steps of: (1) forming a coating film of a radiation-sensitive linear resin composition according to claim 1 or 2 on a substrate; a step of (2) irradiating radiation on at least a portion of the coating film; (3) a developing step; -63-200907569 (4) a heating step. 5. An interlayer insulating film is formed by the method of claim 4 of the patent application. 6. The sensitive radiation linear resin composition of claim 1 or 2, which is used for the formation of a microlens. 7. A method of forming a microlens, comprising the steps of: (1) forming a coating film of a radiation sensitive linear resin composition according to claim 1 or 2 on a substrate; And (2) a step of irradiating at least a portion of the coating film with radiation; (3) a developing step; and (4) a heating step. 8. A microlens formed by the method of claim 7 of the patent application. -64-