200906281 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種支援插卡式通訊設備的散熱裝 置，提供在通訊設備平台中，將插卡式通訊模組所產生 的熱能，傳導至通訊設備外殼，達到散熱效果。 【先前技術】 全球微波存取互通性（Worldwide Interoperability for Microwave. Access，Wi-Max)與無線寬頻（Wireless Fidelity，Wi-Fi)等無線通訊技術，可以在城市間建立無 線網路。一般來說，此類無通訊設備建置於戶外，且通 常並無内建風扇以利散熱。 而為了讓上述的無線通訊設備具有高度的彈性與擴 充性，在無線網路模組上可採用插卡式無線通訊模組(例 如，card bus、迷你週邊元件連接介面匯流排（Mini Peripheral Component Interconnect，Mini PCI)、通用序 列匯流排(USB)、週邊元件連接介面匯流排（peripheral Component Interconnect，PCI)、以及國際個人電腦記憶 卡協會(Personal Computer Memory Card International200906281 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device supporting a plug-in type communication device, which provides heat energy generated by a plug-in type communication module to a communication in a communication device platform The device casing achieves a heat dissipation effect. [Prior Art] Wireless communication technologies such as Worldwide Interoperability for Microwave. Access (Wi-Max) and Wireless Fidelity (Wi-Fi) can establish a wireless network between cities. In general, such non-communication equipment is built outdoors and there is usually no built-in fan for heat dissipation. In order to make the above wireless communication device have high flexibility and expandability, a plug-in wireless communication module can be used on the wireless network module (for example, card bus, mini peripheral component connection interface bus (Mini Peripheral Component Interconnect) , Mini PCI), Universal Serial Bus (USB), Peripheral Component Interconnect (PCI), and Personal Computer Memory Card International (Personal Computer Memory Card International)
Association ’ PCMCIA)等），如此，可適時更新無線網 路模組。 現階段建置在室外的無線通訊產品需承受外在環境 200906281 的考驗，紐日曬雨淋和溫度、濕度的急劇變化，都是 有可能發生的，其散熱能力麵統敎性成為關鍵。因 此’無線通訊設備内之插卡式無線通訊模組的散熱是一 個重要的課題，-般常辑法是在插核錄通訊模电 之無線晶壯黏貼散熱片來散熱。但是，因為插卡式無 線通訊模組係平械合於主電路板上，但通訊設備曝囉 於戶外且其_別_，導致插卡式鱗通訊模組所 產生的熱能’無法順利的傳導出去，散熱不良，易造成 系統當機或溫度過南導致電路損壞、電路效率降低等問 題。 【發明内容】 本發明提供一種支援插卡式通訊設備的散熱裝置。本 發明提供在一個通訊設備平台中，特別是支援插卡式通 訊模組的無線通訊設備，以利將插卡式通訊模組所產生 的熱能，傳導至通訊設備外殼，達到散熱效果。 本發明之插卡式通訊設備包含一主電路板、至少一個 插卡式通訊模組嵌合於主電路板上、一金屬外殼，主電 路板與插卡式通訊模組置於此金屬外殼内。支援此插卡 式通訊設備的散熱裝置包括一導熱橋。透過本發明之散 熱裝置’導熱橋置於插卡式通訊模組上方與之接觸，並 跨越主電路板將插卡式通訊模組產生的熱能傳導至導熱 橋’再透過導熱橋將熱能傳導至金屬外殼散熱出去。 6 200906281 本發明之散熱裝置更可以包括至少一個軟性導熱 片’軟性導熱片覆蓋於插卡式通訊模組之上表面，將插 卡式通訊模組上所有的晶片，其產生的熱能傳導至導熱 橋’再透過導熱橋將熱能傳導至金屬外殼散熱出去。 茲配合下列圖示、實施例之詳細說明及申請專利範 圍’將上述及本發明之其他目的與優點詳述於後。 【實施方式】 第一圖係本發明之支援插卡式通訊設備的散熱裝置 的一個分解示意圖。參考第一圖，此插卡式通訊設備至 少包含一主電路板;I、至少一個插卡式(咖处时car(j)通 訊模組2(例如’ mini PCI無線通訊模組)嵌合於主電路板 1上、一金屬外殼3，主電路板丨與插卡式通訊模組2置 於此金屬外殼3内。支援此插卡式通訊設備的散熱裝置 更包括一導熱橋4。 導熱橋4置於插卡式通訊模組2上方與之接觸，並 跨越主電路板1，導熱橋4的兩翼4A與金屬外殼3内側 相接觸，以利將插卡式通訊模組2所產生的熱能藉由導 熱橋4傳導至金屬外殼3後，藉由金屬外殼3散熱。 而本發明的散熱裝置中，更可以包括至少一個軟性 導熱片5，如第二圖所示。軟性導熱片5係介於插卡式 200906281 通減、、且2與導熱橋4之間，並覆蓋於插卡式通訊模組 2之上表面’如第三圖所示。如此，插卡式通訊模組2 所產生的熱能可藉由軟性導熱片5鱗熱橋傳4傳導至 金屬卜Λχ3後’藉由金屬外殼3散熱。第四圖為本發明 之支援插卡式通訊設備的散置的-她合示意圖。 八中軟導熱>} 5覆蓋且貼合於插卡式通訊模組2 之上表面，彻其倾特f，克服晶㈣彼此的高度差 實插卡式通訊模組2上所有的晶片產生的熱能傳導至 導熱橋4後，侧用導熱橋4傳導至金屬外殼3，以達 到最佳的散熱效果。透過此導熱方式僅 散發效果，且透過導熱橋4可以娜片插:= 組2的散發效果。當通訊設備欲更換插卡式通訊模組2， 則僅需將修敍性導糾5的外型，符合_插卡式通 訊模組即可。 、補充說明的是，軟性_片5係彈性具有高導熱之 ^熱石夕膠。導熱橋4之材質，係可以為導驗好之金屬， 如紹、铭合金、鋼金屬等材質。且導熱橋兩翼4A與金 屬外殼3之間係可以塗上導熱膠或料_膠(未顯示於 圖示中）’以利於導熱橋4將熱能傳導至金屬外殻3上。 導熱橋4係__定於金屬肢3或_於金屬外殼 3之間。 200906281 通訊設備為提高通訊品質，常會使用平板式天線板 6，此平板式天線板6蓋於金屬外殼上方，亦可作為通訊 設備的上蓋，如第五圖所示。此情況下，插卡式通訊模 組則無法透過金屬外殼3之平板式天線板6上蓋散熱。 但是，透過本發明之導熱橋，則可順利的將插卡式通訊 模組之熱能傳導至金屬外殼的周邊兩側散熱。 惟，以上所述者，僅為發明之最佳實施例而已，當不 能依此限定本發明實施之範圍。即大凡一本發明申請專 利範圍所作之均等變化與修飾，皆應仍屬本發明專利涵 蓋之範圍内。 200906281 【圖式簡單說明】 第一圖係本發明之支援插卡式通訊設備的散熱裝置的一 個分解示意圖。 第二圖係支援插卡式通訊設備的散熱裝置包括軟性導熱 片的一個分解示意圖。 第三圖係第二圖之支援插卡式通訊設備的散熱裝置之導 熱橋的一個分解示意圖。 第四圖係本發明之支援插卡式通訊設備的散熱裝置的一 個組合示意圖。 第五圖為平板式天線板為上蓋之通訊設備的一個示意 圖。 【主要元件符號說明】 1主電路板 2插卡式通訊模組 3金屬外殼 4導熱橋 4A導熱橋的兩翼 5軟性導熱片 6平板式天線板 10Association ’ PCMCIA), etc., so that the wireless network module can be updated in due course. The wireless communication products built at the current stage need to withstand the test of the external environment 200906281. The sun and rain and the drastic changes in temperature and humidity are all likely to occur, and the uniformity of heat dissipation capability becomes the key. Therefore, the heat dissipation of the plug-in wireless communication module in the wireless communication device is an important issue, and the conventional method is to insert a radio-coded communication die to disperse the heat sink. However, because the plug-in wireless communication module is integrated on the main circuit board, but the communication device is exposed to the outdoors and its _ _ _, resulting in the thermal energy generated by the plug-in scale communication module 'can not be smoothly conducted Going out, poor heat dissipation, easy to cause problems such as circuit damage or circuit efficiency caused by system crash or temperature over-sampling. SUMMARY OF THE INVENTION The present invention provides a heat sink that supports a plug-in type communication device. The present invention provides a wireless communication device for a plug-in communication module in a communication device platform, so as to facilitate the heat energy generated by the plug-in communication module to be transmitted to the communication device casing to achieve a heat dissipation effect. The plug-in type communication device of the present invention comprises a main circuit board, at least one plug-in type communication module is embedded on the main circuit board, and a metal casing, and the main circuit board and the plug-in type communication module are placed in the metal casing. . The heat sink that supports this plug-in communication device includes a thermal bridge. Through the heat dissipating device of the present invention, the heat conducting bridge is placed above the plug-in type communication module, and the thermal energy generated by the plug-in type communication module is transmitted to the heat conducting bridge across the main circuit board, and then the heat energy is transmitted to the heat conducting bridge to The metal case dissipates heat. 6 200906281 The heat dissipating device of the present invention may further comprise at least one flexible thermal conductive sheet covering the upper surface of the plug-in communication module, and transferring all the heat generated by the chip on the plug-in communication module to the heat conduction. The bridge's heat conduction through the heat-conducting bridge to the metal casing to dissipate heat. The above and other objects and advantages of the present invention will be described in detail below with reference to the accompanying drawings. [Embodiment] The first figure is an exploded view of a heat dissipating device supporting a plug-in type communication device of the present invention. Referring to the first figure, the plug-in communication device includes at least one main circuit board; I, at least one plug-in type (the car(j) communication module 2 (for example, 'mini PCI wireless communication module) is embedded in The main circuit board 1 , a metal casing 3 , a main circuit board 插 and a plug-in type communication module 2 are placed in the metal casing 3 . The heat sink supporting the plug-in type communication device further comprises a heat-conducting bridge 4 . 4 is placed above the plug-in communication module 2 and is in contact with the main circuit board 1. The two wings 4A of the heat-conducting bridge 4 are in contact with the inner side of the metal casing 3 to facilitate the heat generated by the plug-in communication module 2. After being conducted to the metal casing 3 by the heat-conducting bridge 4, the heat-dissipating device of the present invention further includes at least one flexible heat-conducting sheet 5, as shown in the second figure. The flexible heat-conducting sheet 5 is introduced. The plug-in type 200906281 is reduced, and 2 is between the heat-conducting bridge 4 and covers the upper surface of the plug-in type communication module 2 as shown in the third figure. Thus, the plug-in type communication module 2 generates The thermal energy can be transmitted to the metal dip 3 by the soft thermal conduction sheet 5 scale thermal bridge 4 'by gold The heat dissipation of the outer casing 3. The fourth figure is a schematic diagram of the intervening support of the plug-in type communication device of the present invention. The eight-phase soft heat conduction>} is covered and adhered to the upper surface of the plug-in communication module 2, The heat of all the wafers on the plug-in communication module 2 is transmitted to the heat-conducting bridge 4, and the side is conducted to the metal casing 3 by the heat-conducting bridge 4 to achieve the best. The heat dissipation effect is only transmitted through the heat conduction mode, and the heat transfer bridge 4 can be inserted into the film: = the emission effect of the group 2. When the communication device wants to replace the plug-in communication module 2, only the rehearsal guide is needed. Correct the appearance of the 5, in line with the _ plug-in communication module can be. Supplementary note is that the soft _ sheet 5 series elastic has high thermal conductivity ^ hot stone october. The material of the thermal bridge 4, can be a guide Good metal, such as Shao, Ming alloy, steel metal, etc., and between the two wings of the thermal bridge 4A and the metal shell 3 can be coated with thermal adhesive or material _ glue (not shown) to facilitate the thermal bridge 4 Conducting thermal energy to the metal casing 3. Thermal bridge 4 series __ fixed to the metal limb 3 or _ metal 200906281 Communication equipment In order to improve the communication quality, the flat antenna board 6 is often used. The flat antenna board 6 is placed over the metal casing and can also be used as the upper cover of the communication equipment, as shown in the fifth figure. The plug-in type communication module cannot transmit heat through the cover of the flat antenna plate 6 of the metal casing 3. However, the heat conducting bridge of the present invention can smoothly transfer the thermal energy of the plug-in type communication module to the metal casing. The heat dissipation on both sides of the periphery is only for the best embodiment of the invention, and the scope of the present invention cannot be limited thereto, that is, the equal variation and modification of the scope of the patent application of the invention should be It is still within the scope of the present invention. 200906281 [Simplified Schematic] The first figure is an exploded view of the heat sink of the present invention supporting the plug-in type communication device. The second figure is an exploded view of the heat sink of the plug-in type communication device including the flexible heat conductive sheet. The third figure is an exploded view of the heat transfer bridge supporting the heat sink of the plug-in type communication device of the second figure. The fourth figure is a combination diagram of the heat sink of the present invention supporting the plug-in type communication device. The fifth picture is a schematic view of the communication device in which the flat antenna board is the upper cover. [Main component symbol description] 1 main circuit board 2 plug-in communication module 3 metal case 4 heat-conducting bridge 4A heat-conducting bridge two wings 5 soft thermal conductive sheet 6 flat-panel antenna board 10