200903542 九、發明說明： 【發明所屬之技術領域】 本發明係有關一種引線式陶皆 關於-種包括-電容值調整步驟=作方法，特別是 法。 冑m陶t電容器製作方 【先前技術】 打開電子產品的外殼，1會先 各樣的電？料，其巾包括主動 &’上面充滿了各式 電晶體和積體電路，積體電路是眾多二牛二主動元件-般是指 的功能。相對的，被動元件-她體，具有訊號放大 7疋倾③、電容ϋ和電感器。 …電容器是-種儲能元件，其功用在於暫時儲存電路中的電妒， 二以=的形式來儲存能量。在電路中，電容器常用 ‘ 耦合、旁路、能量轉換和延時。 槐反 的電壓 賴造是！^非㈣獅雜输稱成，當電路中 體的面積越大，可以儲存的電荷量便越多，電容值也越大； 片電，之間的距離與其中間之介電物f(絕緣體）的介電特性也會影 響電谷值’電極靠得越近’由於正負電荷相互吸引的關係，電極上就 積較多的電荷，所以電容越大；至於介電物質對於電容的影響， 右介電常數越大，則電極上會累積較多的電荷，所以電容越大。 弓丨線式陶竟電容器(wire_type ceramic capacitor)是以陶兗作為介 電物質’其係於陶瓷基體兩面噴塗銀層，然後燒成銀質薄臈作為電 極再於電極表面焊上金屬引線(metalwire)以作為可與電路板電性連 200903542 ^年來科技發展日新月異，各類電子產品日益普遍 所以需要 量的電容器’例如液晶顯示器的電源供應^ 引線式陶e電容器，其工作在刚伏特至5 精度的 爾雖數她法拉·=== 田習知之.式喊電容器製作方法不㈣握電容器 之交貨期不―==== 【發明内容】 為解決上述問題，本發明目的 之 係提供一種自技一 Φ 容值調整步驟之引線式陶t電容器製作方法，可以掌握陶究電容 ㈣電容值精密度’例如可達到±1%之高精度電容⑽要求以提 以及降低產品成本。 了纽“ W、避免浪費材料、 本發月目的之係、提供一種引線式陶竟電容器製作方 法’利用-電容值調整機以高壓金屬粉末來喷除部分金屬電極 到量測電容值在設"容值的誤差範圍内以達到高精度之要求，而= 可同時去除引制產生之雜散電容躲最終要求之電容值的影響。 —為了達到上述目的，本發明—實施例之—到線式陶 谷益製作方法，包括：提供複數陶^，其中，每_喊片之一上 面具一第-金屬電極，且每—陶B之—τ表面具_第二金屬電極: -組合步驟’將喊版n餘(earr㈣上，鱗接複數金屬^ 200903542 線於第-金屬電極與第二金屬電極，其中每-第〜金屬電極與每一第 -金屬電極分別焊接-金眉引線；及-電容_整步驟，量測每一陶 究片之電容值，若電容值大於-設定電容值則去除部分第:金屬電極 或部分第二金屬電極，並重複此電容值調整步驟。 底下藉由具體實施例配合所附的圖式詳加說明，當更容 易了解本發明之目的、技術内容、義及其所達成之二效。 【實施方式】 說明而非用以限 詳細說明如下，所述較佳實施例僅做— 定本發明。 A第1圖是本發明—實補之引線式_電容器製作方法的步驟 流程圖’第2a圖至第2d圖是本發明實施例之引200903542 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a lead-type ceramic-related method, including a capacitance value adjustment step, a method, and particularly a method.胄m Tao t capacitor manufacturer [Prior Art] Open the outer casing of the electronic product, 1 will be the first power? The material, including the active &' is filled with various types of transistors and integrated circuits, and the integrated circuit is a function of many two-two active components. In contrast, the passive component - her body, has a signal amplification of 7 疋 3, capacitor ϋ and inductor. ... Capacitor is an energy storage component whose function is to temporarily store the electricity in the circuit, and to store energy in the form of =. In circuits, capacitors are often used for 'coupling, bypassing, energy conversion, and delay. The reverse voltage is built! ^ Non-fourth lions are called, when the area of the body in the circuit is larger, the more the amount of charge that can be stored, the larger the capacitance value; the distance between the sheets, the distance between them and the dielectric f (insulator) in the middle The dielectric properties also affect the electric valley value 'the closer the electrode is closer'. Because of the positive and negative charge attraction, the electrode accumulates more charge, so the capacitance is larger. As for the influence of the dielectric material on the capacitance, The larger the electrical constant, the more charge will accumulate on the electrode, so the larger the capacitance. The wire_type ceramic capacitor is a ceramic material that is coated with a silver layer on both sides of the ceramic substrate, and then fired into a silver thin crucible as an electrode and then soldered to the electrode surface. As a circuit that can be electrically connected to the circuit board 200903542 ^ The technology is developing with each passing day, various types of electronic products are becoming more and more common, so the required amount of capacitors such as liquid crystal display power supply ^ lead type ceramic e capacitors, which work from just volts to 5 precision Although the number of her is Farah === Tian Xizhizhi. The method of making shout capacitors is not (4) The delivery period of the holding capacitor is not -==== [Summary of the Invention] In order to solve the above problems, the object of the present invention is to provide a self The method of manufacturing a lead-type ceramic t-capacitor with a capacitance-adjusting step can grasp the precision of the ceramic capacitor (4), and the high-precision capacitor (10), which can achieve ±1%, to reduce the product cost. New "W, avoid waste of materials, the purpose of this month's purpose, provide a lead-type ceramic capacitor manufacturing method" use - capacitance value adjustment machine to high-pressure metal powder to spray part of the metal electrode to measure the capacitance value in the setting The tolerance of the capacitance value is required to achieve high precision, and = the effect of the capacitance value of the final required stray capacitance can be removed at the same time. - In order to achieve the above object, the present invention - the embodiment - the line The method of making Tao Guyi includes: providing a plurality of ceramics, wherein each of the _ shouting tablets has a first-metal electrode on the mask, and each of the ceramics - the surface of the τ has a second metal electrode: - the combination step 'will shout Version n (earr (four), scale connected to a plurality of metal ^ 200903542 line between the first metal electrode and the second metal electrode, wherein each - the first metal electrode and each of the first metal electrodes are respectively welded - gold eyebrow lead; and - capacitance _ In the whole step, the capacitance value of each ceramic tablet is measured, and if the capacitance value is greater than - the set capacitance value, part of the metal electrode or part of the second metal electrode is removed, and the capacitance value adjustment step is repeated. The purpose of the present invention, the technical content, the meaning and the two effects achieved by the present invention are more easily understood. The embodiments are described as follows, but are not intended to limit the details as follows. The present invention is only for the purpose of the invention. A first embodiment is a flow chart of the steps of the method for manufacturing a lead-type capacitor of the present invention. Figs. 2a to 2d are diagrams of an embodiment of the present invention.
，^步驟示意圖；請參閱圖式，本發明—實施例之J二J U0提供複數喊片1〇 (請一併參考第i圖及第&剛，如第 2a圖所示，陶竟片1G係已成形、燒結及形成金料極，每一陶究片 10之二上表面具-第—金屬電極12，且每—陶^ 1G之—下表面具 =-金屬電極(圖中未示），在—實施例中，陶以1G可為圓板型， 且第-金屬電極12與苐二金屬電極的材f可為銀(Ag); ㈣一Y1組合步驟(請一併參考第1圖及第2b圖），將陶堯片心 絲==中未示）’並焊接複數金屬引線14於第—金屬電極 ’、一、屬书極，其中每一第一金屬電極12與每一第二金屬畲4 分別谭接-金剌線14，在—實施财，載板的材f可魏 所示’係利用銲錫16來焊接金屬引線14與第-金屬電極12及第: 金屬電極；及 — 200903542 3. S2電容值調整步驟(請—併參考第丨圖及第 陶究片H)之電容值’若電容值大於—蚊電容 極二，二金屬電極，並重複此電容值調整At IS 線式誠電㈣之電容值是由陶竟片之第—金屬電極與第 極交集的纽面積所決定，所以先制喊電容器之初 值 電容值大於奴電，計算錢魏絲之金輕_ 用-電容值調整機20以高壓金屬粉末22來噴除部分第_金屬電3 或部分第二金屬電極，重複此電容值調整步驟，直到量測^ 定電容值的誤差範圍内以達到高精度之要求，例如達到±1%之高精= 電容器的要求，而且’此步驟亦可同時絲引線間產生 於最終要求之電容值的影響。 因此，本發明之引線式陶:是電容器製作方法的特徵之一係包括 -電容值調整步驟，可以掌握陶竟電容器的電容值精密度，例如可達 到±1%之高精度電容器的要求以提供電路設計之準確的容抗值，所以 可有效提高產品良率、避免浪費材料、以及降低產品成本。 第3圖是本發明另一實施例之引線式陶瓷電容器製作方法的步 驟流程圖，與第1圖之步驟流程比較，第3圖之步驟流程更包括一 S3包封(coating)步驟(請一併參考第3圖及第2d圖），以一熱固型環氧 樹脂(epoxy)30包覆陶瓷片1〇、第一金屬電極12'第二金屬電極及金 屬引線14的部分，用以保護陶瓷片1〇本體及增加電容器的耐高電壓 性，在一實施例中，本發明之引線式陶瓷電容器製作方法可更包括一 熟成(curing)步驟以加溫固化環氧樹脂30。 請繼續參考第3圖’在一實施例中，本發明之引線式陶瓷電容 器製作方法可更包括.S4成品測試步驟；；§5打印(marking)步驟；或 S6成品包裝(packing)步驟。在一實施例中，S4成品測試步驟可包括： 一耐壓測試；一消散因子(dissipation factor)測試；一絕緣阻抗 (insulationresistance)測試；或一成品電容值測試。 200903542 以上所述之實施例僅係為說明本發明之技術思神 點’其目的在使熟習此項技藝之人士能夠了解本發明:内& 並據以實施，當不能以之限定本發明之專利範圍，即大凡= 本發明所揭示之精神所作之均等變化或修飾，仍應涵蓋在^ 發明之專利範圍内。 【圖式簡單說明】 第1圖是本發明一實施例之引線式陶瓷電容器製作方法的步驟流程 圖； 第2a圖至第2d圖是本發明實施例之引線式陶瓷電容器製作方法的 各步驟不意圖；及 第3圖是本發明一實施例之引線式陶瓷電容器製作方法的步驟流程 圖0 【主要元件符號說明】 10 陶瓷片 12 第一金屬電極 14 金屬引線 16 銲錫 18 部分第一金屬電極 20 電容值調整機 22 高壓金屬粉末 30 熱固型環氧樹脂 9 200903542 so 提供複數陶瓷片 SI 組合步驟 S2 電容值調整步驟 S3 包封步驟 S4 成品測試步驟 S5 打印步驟 S6 成品包裝步驟 10, step diagram of the steps; please refer to the drawings, the present invention - the J 2 J U0 of the embodiment provides a plurality of screams 1 (please refer to the i-th image and the & just, as shown in Figure 2a, Tao Jing tablets The 1G system has been formed, sintered and formed into a gold material pole. Each of the upper surfaces of the ceramic sheet 10 has a -metal electrode 12, and each of the ceramics 1G has a mask of the following = metal electrode (not shown) In the embodiment, the ceramic 1G can be a circular plate type, and the material f of the first metal electrode 12 and the second metal electrode can be silver (Ag); (4) a Y1 combination step (please refer to the first reference) Figure and Figure 2b), the ceramic core wire == not shown) and soldering the plurality of metal leads 14 to the first metal electrode, one, the book pole, wherein each of the first metal electrodes 12 and each The second metal crucible 4 is respectively connected to the tantalum-golden wire 14, and the material of the carrier plate can be used to weld the metal lead 14 and the first metal electrode 12 and the metal electrode; And — 200903542 3. S2 capacitance value adjustment step (please - refer to the figure and the ceramic film H) the capacitance value 'if the capacitance value is greater than - the mosquito capacitor pole two, two metal electrodes, and The capacitance value of the At IS line is determined by the area of the metal electrode and the pole intersection. Therefore, the initial value of the capacitor is greater than the slave, and the money is calculated. Weiss's Golden Light _ Use the -capacitance value adjustment machine 20 to spray part of the _metal electric 3 or part of the second metal electrode with the high-pressure metal powder 22, repeat the capacitance value adjustment step until the error of the capacitance value is measured In order to achieve high precision requirements, for example, to achieve high precision = capacitor requirements of ± 1%, and 'this step can also be caused by the final required capacitance value between the wire leads. Therefore, the lead type ceramic of the present invention is one of the characteristics of the capacitor manufacturing method, which includes a capacitance value adjustment step, which can grasp the precision of the capacitance value of the ceramic capacitor, for example, the requirement of a high precision capacitor of ±1% can be provided. The accurate capacitance value of the circuit design can effectively improve product yield, avoid waste of materials, and reduce product cost. 3 is a flow chart showing the steps of a method for fabricating a lead type ceramic capacitor according to another embodiment of the present invention. Compared with the step flow of FIG. 1, the step flow of FIG. 3 further includes an S3 sealing step (please Referring to FIGS. 3 and 2d, a portion of the ceramic sheet 1 , the first metal electrode 12 ′, the second metal electrode and the metal lead 14 is covered with a thermosetting epoxy 30 for protection. The ceramic chip 1 body and the high voltage resistance of the capacitor are added. In an embodiment, the lead ceramic capacitor manufacturing method of the present invention may further comprise a curing step to heat cure the epoxy resin 30. Continuing to refer to FIG. 3' In one embodiment, the lead ceramic capacitor manufacturing method of the present invention may further include a .S4 finished product testing step; a § 5 marking step; or an S6 finished packaging step. In an embodiment, the S4 finished product testing step may include: a withstand voltage test; a dissipation factor test; an insulation resistance test; or a finished capacitance value test. 200903542 The above-described embodiments are merely illustrative of the technical idea of the present invention. The purpose of the present invention is to enable those skilled in the art to understand the present invention: & </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flow chart showing the steps of a method for fabricating a lead type ceramic capacitor according to an embodiment of the present invention; FIGS. 2a to 2d are diagrams showing steps of a method for manufacturing a lead type ceramic capacitor according to an embodiment of the present invention. FIG. 3 is a flow chart of a method for fabricating a lead type ceramic capacitor according to an embodiment of the present invention. [Main element symbol description] 10 ceramic sheet 12 first metal electrode 14 metal lead 16 solder 18 portion first metal electrode 20 Capacitance value adjustment machine 22 High-pressure metal powder 30 Thermosetting epoxy resin 9 200903542 so Provides a plurality of ceramic sheets SI Combination step S2 Capacitance value adjustment step S3 Encapsulation step S4 Finished product test step S5 Print step S6 Finished packaging step 10