CN101350249A - Method for manufacturing lead type high-voltage precision ceramic capacitor - Google Patents
Method for manufacturing lead type high-voltage precision ceramic capacitor Download PDFInfo
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- CN101350249A CN101350249A CN 200710137022 CN200710137022A CN101350249A CN 101350249 A CN101350249 A CN 101350249A CN 200710137022 CN200710137022 CN 200710137022 CN 200710137022 A CN200710137022 A CN 200710137022A CN 101350249 A CN101350249 A CN 101350249A
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- ceramic capacitor
- metal
- capacitance value
- metal electrode
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- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 66
- 239000002184 metal Substances 0.000 claims abstract description 66
- 239000000919 ceramic Substances 0.000 claims abstract description 13
- 238000012360 testing method Methods 0.000 claims description 13
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000003466 welding Methods 0.000 claims 1
- 239000003990 capacitor Substances 0.000 abstract description 18
- 239000000463 material Substances 0.000 abstract description 6
- 239000002699 waste material Substances 0.000 abstract description 4
- 238000013461 design Methods 0.000 abstract description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
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Abstract
The invention relates to a lead-type high-voltage precise ceramic capacitor manufacturing method comprising a capacitance value adjusting step, wherein in the capacitance value adjusting step, the capacitance value of each ceramic chip is measured firstly, if the capacitance value is larger than a set capacitance value, part of metal electrodes are removed, and the capacitance value adjusting step is repeated until the measured capacitance value is within the error range of the set capacitance value, therefore, the lead-type high-voltage precise ceramic capacitor manufacturing method can master the capacitance value precision of the ceramic capacitor, for example, the capacitance value precision can reach the requirement of a high-precision capacitor of +/-1 percent so as to provide an accurate capacitive reactance value of circuit design, and can effectively improve the product yield, avoid material waste and reduce the product cost.
Description
Technical field
The present invention relates to a kind of method for preparing leads type high voltage precision ceramics capacitor, particularly a kind of method for preparing leads type high voltage precision ceramics capacitor that comprises a capacitance set-up procedure.
Background technology
Open electronic product shell, generally can see circuit board earlier, be full of electronic component miscellaneous above, comprising active member and passive device.Active member generally is meant transistor and integrated circuit, and integrated circuit is numerous transistorized assemblys, has the function that signal amplifies.Relative, passive device generally refers to resistor, capacitor and inductor.
Capacitor is a kind of energy-storage travelling wave tube, and its function is the electric energy in the temporary-storage circuit, and it is to come storage power with the form of electric charge.In circuit, that capacitor is usually used in is tuning, filtering, coupling, bypass, power conversion and time-delay.
The structure of capacitor is made of two very close electrode conductors, when the voltage in the circuit raises, can accumulate more electric charge on the electrode, therefore, voltage area high more or electrode conductor is big more, and the quantity of electric charge that can store is just many more, and capacitance is also big more; In addition, the distance between two plate electrodes also can influence capacitance with the dielectric property of its middle dielectric material (insulator), and electrode leans on closely more, because the relation that positive and negative charge attracts each other will be accumulated more electric charge on the electrode, so electric capacity is big more; As for the influence of dielectric material,, then can accumulate more electric charge on the electrode, so electric capacity is big more if dielectric constant is big more for electric capacity.
Lead type ceramic capacitor (wire-type ceramic capacitor) is as dielectric material with pottery, it is in ceramic matrix two sides spraying silver layer, burn till silver film then as electrode, burn-on metal lead wire (metal wire) with as the output/input terminal that can electrically connect with circuit board in electrode surface again.The characteristics of lead type ceramic capacitor are that volume is little, and good heat resistance, loss is little, insulation resistance is high and dielectric constant is big, therefore are applicable to high pressure and high-frequency circuit.
Development in science and technology is in recent years maked rapid progress, each electronic product is more prevalent, so need to use a large amount of capacitors, for example the power supply unit of LCD must use high-precision lead type ceramic capacitor, it is operated in the alternating voltage between 100 volts to 5000 volts, capacitance in number micromicrofarads (pF) between tens of micromicrofarads, and its error must be equal to or less than ± 1%.
Existing lead type ceramic capacitor manufacture method is difficult for grasping the precision of capacitor, general best error amount is ± 5%, if need be lower than ± 5% often need after capacitor fabrication is finished, utilize the method for screening (sorting) to select capacitor up to specification again, therefore the delivery date of product is wayward, and cause waste of material easily, make that product cost is difficult for reducing.
Summary of the invention
For addressing the above problem, one of the object of the invention is to propose a kind of lead type ceramic capacitor manufacture method that comprises a capacitance set-up procedure, can grasp the capacitance precision of ceramic capacitor, for example can reach ± requirement of 1% high precision capacitor to be providing the capacitor value accurately of circuit design, with effective raising product yield, material and reduce product cost avoids waste.
One of the object of the invention is to propose a kind of lead type ceramic capacitor manufacture method, utilizing a capacitance to adjust machine sprays except that the part metals electrode with the high-pressure metal powder, setting in the error range of capacitance reaching high-precision requirement up to measuring capacitance, and can remove the influence of the stray capacitance that produces between lead-in wire simultaneously for the capacitance of final requirement.
In order to achieve the above object, one embodiment of the invention provides a kind of lead type ceramic capacitor manufacture method, comprising: provide a plurality of potsherds, wherein, one upper surface tool, one first metal electrode of each potsherd, and a lower surface tool one second metal electrode of each potsherd; One combination step is assembled to potsherd on one support plate (carrier), and welds a plurality of metal lead wires in first metal electrode and second metal electrode, and wherein each first metal electrode and each second metal electrode weld a metal lead wire respectively; Reach a capacitance set-up procedure, measure the capacitance of each potsherd, then remove part first metal electrode or part second metal electrode if capacitance is set capacitance greater than one, and repeat this capacitance set-up procedure.
Cooperate appended graphic explanation in detail below by specific embodiment, when the effect that is easier to understand purpose of the present invention, technology contents, characteristics and is reached.
Description of drawings
Fig. 1 is the flow chart of steps of the lead type ceramic capacitor manufacture method of one embodiment of the invention;
Fig. 2 a to Fig. 2 d is each step schematic diagram of the lead type ceramic capacitor manufacture method of the embodiment of the invention;
Fig. 3 is the flow chart of steps of the lead type ceramic capacitor manufacture method of one embodiment of the invention.
Symbol description among the figure
10 potsherds
12 first metal electrodes
14 metal lead wires
16 scolding tin
18 parts, first metal electrode
20 capacitances are adjusted machine
22 high-pressure metal powder
30 thermosetting epoxy resins
S0 provides a plurality of potsherds
The S1 combination step
S2 capacitance set-up procedure
The S3 encapsulation step
S4 finished product test step
The S5 printing step
S6 finished product packing step
Embodiment
Be described in detail as follows, described preferred embodiment is only done an explanation but not in order to limit the present invention.
Fig. 1 is the flow chart of steps of the lead type ceramic capacitor manufacture method of one embodiment of the invention, and Fig. 2 a to Fig. 2 d is each step schematic diagram of the lead type ceramic capacitor manufacture method of the embodiment of the invention; See also graphicly, the lead type ceramic capacitor manufacture method of one embodiment of the invention comprises:
1.S0 provide a plurality of potsherds 10 (please in the lump a) with reference to figure 1 and Fig. 2, shown in Fig. 2 a, potsherd 10 shaping, sintering and formation metal electrode, one upper surface tool, one first metal electrode 12 of each potsherd 10, and a lower surface tool one second metal electrode (not shown) of each potsherd 10, in one embodiment, potsherd 10 can be rondelle, and the material of first metal electrode 12 and second metal electrode can be silver (Ag);
2.S1 combination step (please in the lump with reference to figure 1 and Fig. 2 b), potsherd 10 is assembled to (not shown) on the support plate, and weld a plurality of metal lead wires 14 in first metal electrode 12 and second metal electrode, wherein each first metal electrode 12 welds a metal lead wire 14 respectively with each second metal electrode, in one embodiment, the material of support plate can be paper, and as shown in the figure, utilizes scolding tin 16 to come weld metal lead-in wire 14 and first metal electrode 12 and second metal electrode; And
3.S2 capacitance set-up procedure (please in the lump with reference to figure 1 and Fig. 2 c) measures the capacitance of each potsherd 10, then removes part first metal electrode 18 or part second metal electrode if capacitance is set capacitance greater than one, and repeats this capacitance set-up procedure.Because the capacitance of lead type ceramic capacitor is determined by the effective area that first metal electrode of potsherd and second metal electrode occur simultaneously, so measure the initial capacitance value of ceramic capacitor earlier, if capacitance is greater than setting capacitance, behind the metal electrode area that calculating and decision desire are removed, can utilize a capacitance to adjust machine 20 sprays except that part first metal electrode 18 or part second metal electrode with high-pressure metal powder 22, repeat this capacitance set-up procedure, setting in the error range of capacitance to reach high-precision requirement up to measuring capacitance, for example reach ± requirement of 1% high precision capacitor, and this step also can be removed the influence for the capacitance of final requirement of the stray capacitance that produces between lead-in wire simultaneously.
Therefore, one of feature of lead type ceramic capacitor manufacture method of the present invention is to comprise a capacitance set-up procedure, can grasp the capacitance precision of ceramic capacitor, for example can reach ± requirement of 1% high precision capacitor to be providing the capacitor value accurately of circuit design, so can effectively improve the product yield, material and reduce product cost avoids waste.
Fig. 3 is the flow chart of steps of the lead type ceramic capacitor manufacture method of another embodiment of the present invention; compare with the steps flow chart of Fig. 1; the steps flow chart of Fig. 3 comprises that more a S3 seals (coating) step (please in the lump with reference to figure 3 and Fig. 2 d); with a thermosetting epoxy resin (epoxy) 30 coating ceramic sheets 10; first metal electrode 12; the part of second metal electrode and metal lead wire 14; high voltage withstanding property in order to protection potsherd 10 bodies and increase capacitor; in one embodiment, lead type ceramic capacitor manufacture method of the present invention can comprise more that a maturation (curing) step is with heating cure epoxy resin 30.
Please continue with reference to figure 3, in one embodiment, lead type ceramic capacitor manufacture method of the present invention can more comprise: S4 finished product test step; S5 prints (marking) step; Or S6 finished product packing (packing) step.In one embodiment, S4 finished product test step can comprise: a voltage-withstand test; The one dissipation factor (dissipation factor) test; One insulation impedance (insulationresistance) test; An or finished product capacitance test.
Above-described embodiment only is explanation technological thought of the present invention and characteristics, its purpose makes those skilled in the art can understand content of the present invention and is implementing according to this, when can not with qualification claim of the present invention, promptly the equalization of doing according to disclosed spirit generally changes or modifies, and must be encompassed in the claim of the present invention.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710137022 CN101350249A (en) | 2007-07-19 | 2007-07-19 | Method for manufacturing lead type high-voltage precision ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710137022 CN101350249A (en) | 2007-07-19 | 2007-07-19 | Method for manufacturing lead type high-voltage precision ceramic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101350249A true CN101350249A (en) | 2009-01-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710137022 Pending CN101350249A (en) | 2007-07-19 | 2007-07-19 | Method for manufacturing lead type high-voltage precision ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101350249A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118098842A (en) * | 2024-04-26 | 2024-05-28 | 南通南铭电子有限公司 | Intelligent adjustment method and system for capacitor pins |
-
2007
- 2007-07-19 CN CN 200710137022 patent/CN101350249A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118098842A (en) * | 2024-04-26 | 2024-05-28 | 南通南铭电子有限公司 | Intelligent adjustment method and system for capacitor pins |
| CN118098842B (en) * | 2024-04-26 | 2024-07-02 | 南通南铭电子有限公司 | Intelligent adjustment method and system for capacitor pins |
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Open date: 20090121 |