CN101350249A - Method for preparing leads type high voltage precision ceramics capacitor - Google Patents
Method for preparing leads type high voltage precision ceramics capacitor Download PDFInfo
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- CN101350249A CN101350249A CN 200710137022 CN200710137022A CN101350249A CN 101350249 A CN101350249 A CN 101350249A CN 200710137022 CN200710137022 CN 200710137022 CN 200710137022 A CN200710137022 A CN 200710137022A CN 101350249 A CN101350249 A CN 101350249A
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Abstract
The invention relates to a making method of a lead wire type accurate ceramic capacitor with high-pressure, which comprises the process of regulating the capacitance value, the regulating process of the capacitance value comprises the following steps: measuring the capacitance value of each ceramic sheet, if the capacitance value is larger than a set capacitance value, removing a part of metal electrodes, and then repeating the process of regulating the capacitance value until measuring the capacitance value in the error range of the set capacitance value, thereby the making method of the lead wire type accurate ceramic capacitor with high-pressure can gain the accuracy of the capacitance value of the ceramic capacitor, such as requirements of the capacitor with high accuracy of +-1% can be satisfied, and the accurate capacitive reactance value for the design of the circuit can be provided, and the making method can effectively improve the yield of products, can avoid the waste of materials and can reduce the cost of the products.
Description
Technical field
The present invention relates to a kind of method for preparing leads type high voltage precision ceramics capacitor, particularly a kind of method for preparing leads type high voltage precision ceramics capacitor that comprises a capacitance set-up procedure.
Background technology
Open electronic product shell, generally can see circuit board earlier, be full of electronic component miscellaneous above, comprising active member and passive device.Active member generally is meant transistor and integrated circuit, and integrated circuit is numerous transistorized assemblys, has the function that signal amplifies.Relative, passive device generally refers to resistor, capacitor and inductor.
Capacitor is a kind of energy-storage travelling wave tube, and its function is the electric energy in the temporary-storage circuit, and it is to come storage power with the form of electric charge.In circuit, that capacitor is usually used in is tuning, filtering, coupling, bypass, power conversion and time-delay.
The structure of capacitor is made of two very close electrode conductors, when the voltage in the circuit raises, can accumulate more electric charge on the electrode, therefore, voltage area high more or electrode conductor is big more, and the quantity of electric charge that can store is just many more, and capacitance is also big more; In addition, the distance between two plate electrodes also can influence capacitance with the dielectric property of its middle dielectric material (insulator), and electrode leans on closely more, because the relation that positive and negative charge attracts each other will be accumulated more electric charge on the electrode, so electric capacity is big more; As for the influence of dielectric material,, then can accumulate more electric charge on the electrode, so electric capacity is big more if dielectric constant is big more for electric capacity.
Lead type ceramic capacitor (wire-type ceramic capacitor) is as dielectric material with pottery, it is in ceramic matrix two sides spraying silver layer, burn till silver film then as electrode, burn-on metal lead wire (metal wire) with as the output/input terminal that can electrically connect with circuit board in electrode surface again.The characteristics of lead type ceramic capacitor are that volume is little, and good heat resistance, loss is little, insulation resistance is high and dielectric constant is big, therefore are applicable to high pressure and high-frequency circuit.
Development in science and technology is in recent years maked rapid progress, each electronic product is more prevalent, so need to use a large amount of capacitors, for example the power supply unit of LCD must use high-precision lead type ceramic capacitor, it is operated in the alternating voltage between 100 volts to 5000 volts, capacitance in number micromicrofarads (pF) between tens of micromicrofarads, and its error must be equal to or less than ± 1%.
Existing lead type ceramic capacitor manufacture method is difficult for grasping the precision of capacitor, general best error amount is ± 5%, if need be lower than ± 5% often need after capacitor fabrication is finished, utilize the method for screening (sorting) to select capacitor up to specification again, therefore the delivery date of product is wayward, and cause waste of material easily, make that product cost is difficult for reducing.
Summary of the invention
For addressing the above problem, one of the object of the invention is to propose a kind of lead type ceramic capacitor manufacture method that comprises a capacitance set-up procedure, can grasp the capacitance precision of ceramic capacitor, for example can reach ± requirement of 1% high precision capacitor to be providing the capacitor value accurately of circuit design, with effective raising product yield, material and reduce product cost avoids waste.
One of the object of the invention is to propose a kind of lead type ceramic capacitor manufacture method, utilizing a capacitance to adjust machine sprays except that the part metals electrode with the high-pressure metal powder, setting in the error range of capacitance reaching high-precision requirement up to measuring capacitance, and can remove the influence of the stray capacitance that produces between lead-in wire simultaneously for the capacitance of final requirement.
In order to achieve the above object, one embodiment of the invention provides a kind of lead type ceramic capacitor manufacture method, comprising: provide a plurality of potsherds, wherein, one upper surface tool, one first metal electrode of each potsherd, and a lower surface tool one second metal electrode of each potsherd; One combination step is assembled to potsherd on one support plate (carrier), and welds a plurality of metal lead wires in first metal electrode and second metal electrode, and wherein each first metal electrode and each second metal electrode weld a metal lead wire respectively; Reach a capacitance set-up procedure, measure the capacitance of each potsherd, then remove part first metal electrode or part second metal electrode if capacitance is set capacitance greater than one, and repeat this capacitance set-up procedure.
Cooperate appended graphic explanation in detail below by specific embodiment, when the effect that is easier to understand purpose of the present invention, technology contents, characteristics and is reached.
Description of drawings
Fig. 1 is the flow chart of steps of the lead type ceramic capacitor manufacture method of one embodiment of the invention;
Fig. 2 a to Fig. 2 d is each step schematic diagram of the lead type ceramic capacitor manufacture method of the embodiment of the invention;
Fig. 3 is the flow chart of steps of the lead type ceramic capacitor manufacture method of one embodiment of the invention.
Symbol description among the figure
10 potsherds
12 first metal electrodes
14 metal lead wires
16 scolding tin
18 parts, first metal electrode
20 capacitances are adjusted machine
22 high-pressure metal powder
30 thermosetting epoxy resins
S0 provides a plurality of potsherds
The S1 combination step
S2 capacitance set-up procedure
The S3 encapsulation step
S4 finished product test step
The S5 printing step
S6 finished product packing step
Embodiment
Be described in detail as follows, described preferred embodiment is only done an explanation but not in order to limit the present invention.
Fig. 1 is the flow chart of steps of the lead type ceramic capacitor manufacture method of one embodiment of the invention, and Fig. 2 a to Fig. 2 d is each step schematic diagram of the lead type ceramic capacitor manufacture method of the embodiment of the invention; See also graphicly, the lead type ceramic capacitor manufacture method of one embodiment of the invention comprises:
1.S0 provide a plurality of potsherds 10 (please in the lump a) with reference to figure 1 and Fig. 2, shown in Fig. 2 a, potsherd 10 shaping, sintering and formation metal electrode, one upper surface tool, one first metal electrode 12 of each potsherd 10, and a lower surface tool one second metal electrode (not shown) of each potsherd 10, in one embodiment, potsherd 10 can be rondelle, and the material of first metal electrode 12 and second metal electrode can be silver (Ag);
2.S1 combination step (please in the lump with reference to figure 1 and Fig. 2 b), potsherd 10 is assembled to (not shown) on the support plate, and weld a plurality of metal lead wires 14 in first metal electrode 12 and second metal electrode, wherein each first metal electrode 12 welds a metal lead wire 14 respectively with each second metal electrode, in one embodiment, the material of support plate can be paper, and as shown in the figure, utilizes scolding tin 16 to come weld metal lead-in wire 14 and first metal electrode 12 and second metal electrode; And
3.S2 capacitance set-up procedure (please in the lump with reference to figure 1 and Fig. 2 c) measures the capacitance of each potsherd 10, then removes part first metal electrode 18 or part second metal electrode if capacitance is set capacitance greater than one, and repeats this capacitance set-up procedure.Because the capacitance of lead type ceramic capacitor is determined by the effective area that first metal electrode of potsherd and second metal electrode occur simultaneously, so measure the initial capacitance value of ceramic capacitor earlier, if capacitance is greater than setting capacitance, behind the metal electrode area that calculating and decision desire are removed, can utilize a capacitance to adjust machine 20 sprays except that part first metal electrode 18 or part second metal electrode with high-pressure metal powder 22, repeat this capacitance set-up procedure, setting in the error range of capacitance to reach high-precision requirement up to measuring capacitance, for example reach ± requirement of 1% high precision capacitor, and this step also can be removed the influence for the capacitance of final requirement of the stray capacitance that produces between lead-in wire simultaneously.
Therefore, one of feature of lead type ceramic capacitor manufacture method of the present invention is to comprise a capacitance set-up procedure, can grasp the capacitance precision of ceramic capacitor, for example can reach ± requirement of 1% high precision capacitor to be providing the capacitor value accurately of circuit design, so can effectively improve the product yield, material and reduce product cost avoids waste.
Fig. 3 is the flow chart of steps of the lead type ceramic capacitor manufacture method of another embodiment of the present invention; compare with the steps flow chart of Fig. 1; the steps flow chart of Fig. 3 comprises that more a S3 seals (coating) step (please in the lump with reference to figure 3 and Fig. 2 d); with a thermosetting epoxy resin (epoxy) 30 coating ceramic sheets 10; first metal electrode 12; the part of second metal electrode and metal lead wire 14; high voltage withstanding property in order to protection potsherd 10 bodies and increase capacitor; in one embodiment, lead type ceramic capacitor manufacture method of the present invention can comprise more that a maturation (curing) step is with heating cure epoxy resin 30.
Please continue with reference to figure 3, in one embodiment, lead type ceramic capacitor manufacture method of the present invention can more comprise: S4 finished product test step; S5 prints (marking) step; Or S6 finished product packing (packing) step.In one embodiment, S4 finished product test step can comprise: a voltage-withstand test; The one dissipation factor (dissipation factor) test; One insulation impedance (insulationresistance) test; An or finished product capacitance test.
Above-described embodiment only is explanation technological thought of the present invention and characteristics, its purpose makes those skilled in the art can understand content of the present invention and is implementing according to this, when can not with qualification claim of the present invention, promptly the equalization of doing according to disclosed spirit generally changes or modifies, and must be encompassed in the claim of the present invention.
Claims (9)
1. a lead type ceramic capacitor manufacture method is characterized in that, comprises:
A plurality of potsherds are provided, wherein, a upper surface tool one first metal electrode of each this potsherd, and a lower surface tool one second metal electrode of each this potsherd;
One combination step is assembled to those potsherds on one support plate, and welds a plurality of metal lead wires in those first metal electrodes and those second metal electrodes, and wherein each this first metal electrode and each this second metal electrode weld this metal lead wire respectively; And
One capacitance set-up procedure measures the capacitance of each this potsherd, then removes this first metal electrode of part or this second metal electrode of part if this capacitance is set capacitance greater than one, and repeats this capacitance set-up procedure.
2. lead type ceramic capacitor manufacture method as claimed in claim 1, wherein, the material of this first metal electrode and this second metal electrode is a silver.
3. lead type ceramic capacitor manufacture method as claimed in claim 1, wherein, the material of this support plate is a paper.
4. lead type ceramic capacitor manufacture method as claimed in claim 1 wherein, utilizes a scolding tin to weld those metal lead wires and this first metal electrode and this second metal electrode.
5. lead type ceramic capacitor manufacture method as claimed in claim 1 wherein, is utilized a capacitance to adjust machine and is sprayed except that this first metal electrode of part or this second metal electrode of part with the high-pressure metal powder.
6. lead type ceramic capacitor manufacture method as claimed in claim 1 wherein, more comprises an encapsulation step, coats the part of each this potsherd, this first metal electrode, this second metal electrode and each this metal lead wire with a thermosetting epoxy resin.
7. lead type ceramic capacitor manufacture method as claimed in claim 6 wherein, more comprises a maturation step with this thermosetting epoxy resin of heating cure.
8. lead type ceramic capacitor manufacture method as claimed in claim 1 wherein, more comprises: a finished product test step; One prints step; An or finished product packing step.
9. lead type ceramic capacitor manufacture method as claimed in claim 8, wherein, this finished product test step comprises: a voltage-withstand test; The test of the one dissipation factor; The test of one insulation impedance; An or finished product capacitance test.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710137022 CN101350249A (en) | 2007-07-19 | 2007-07-19 | Method for preparing leads type high voltage precision ceramics capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710137022 CN101350249A (en) | 2007-07-19 | 2007-07-19 | Method for preparing leads type high voltage precision ceramics capacitor |
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| Publication Number | Publication Date |
|---|---|
| CN101350249A true CN101350249A (en) | 2009-01-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200710137022 Pending CN101350249A (en) | 2007-07-19 | 2007-07-19 | Method for preparing leads type high voltage precision ceramics capacitor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118098842A (en) * | 2024-04-26 | 2024-05-28 | 南通南铭电子有限公司 | Intelligent adjustment method and system for capacitor pins |
-
2007
- 2007-07-19 CN CN 200710137022 patent/CN101350249A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118098842A (en) * | 2024-04-26 | 2024-05-28 | 南通南铭电子有限公司 | Intelligent adjustment method and system for capacitor pins |
| CN118098842B (en) * | 2024-04-26 | 2024-07-02 | 南通南铭电子有限公司 | Intelligent adjustment method and system for capacitor pins |
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Open date: 20090121 |