CN101350249A - Method for manufacturing lead type high-voltage precision ceramic capacitor - Google Patents

Method for manufacturing lead type high-voltage precision ceramic capacitor Download PDF

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CN101350249A
CN101350249A CN 200710137022 CN200710137022A CN101350249A CN 101350249 A CN101350249 A CN 101350249A CN 200710137022 CN200710137022 CN 200710137022 CN 200710137022 A CN200710137022 A CN 200710137022A CN 101350249 A CN101350249 A CN 101350249A
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ceramic capacitor
metal
capacitance value
metal electrode
manufacturing
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CN 200710137022
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纪彦玨
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Abstract

The invention relates to a lead-type high-voltage precise ceramic capacitor manufacturing method comprising a capacitance value adjusting step, wherein in the capacitance value adjusting step, the capacitance value of each ceramic chip is measured firstly, if the capacitance value is larger than a set capacitance value, part of metal electrodes are removed, and the capacitance value adjusting step is repeated until the measured capacitance value is within the error range of the set capacitance value, therefore, the lead-type high-voltage precise ceramic capacitor manufacturing method can master the capacitance value precision of the ceramic capacitor, for example, the capacitance value precision can reach the requirement of a high-precision capacitor of +/-1 percent so as to provide an accurate capacitive reactance value of circuit design, and can effectively improve the product yield, avoid material waste and reduce the product cost.

Description

Method for preparing leads type high voltage precision ceramics capacitor
Technical field
The present invention relates to a kind of method for preparing leads type high voltage precision ceramics capacitor, particularly a kind of method for preparing leads type high voltage precision ceramics capacitor that comprises a capacitance set-up procedure.
Background technology
Open electronic product shell, generally can see circuit board earlier, be full of electronic component miscellaneous above, comprising active member and passive device.Active member generally is meant transistor and integrated circuit, and integrated circuit is numerous transistorized assemblys, has the function that signal amplifies.Relative, passive device generally refers to resistor, capacitor and inductor.
Capacitor is a kind of energy-storage travelling wave tube, and its function is the electric energy in the temporary-storage circuit, and it is to come storage power with the form of electric charge.In circuit, that capacitor is usually used in is tuning, filtering, coupling, bypass, power conversion and time-delay.
The structure of capacitor is made of two very close electrode conductors, when the voltage in the circuit raises, can accumulate more electric charge on the electrode, therefore, voltage area high more or electrode conductor is big more, and the quantity of electric charge that can store is just many more, and capacitance is also big more; In addition, the distance between two plate electrodes also can influence capacitance with the dielectric property of its middle dielectric material (insulator), and electrode leans on closely more, because the relation that positive and negative charge attracts each other will be accumulated more electric charge on the electrode, so electric capacity is big more; As for the influence of dielectric material,, then can accumulate more electric charge on the electrode, so electric capacity is big more if dielectric constant is big more for electric capacity.
Lead type ceramic capacitor (wire-type ceramic capacitor) is as dielectric material with pottery, it is in ceramic matrix two sides spraying silver layer, burn till silver film then as electrode, burn-on metal lead wire (metal wire) with as the output/input terminal that can electrically connect with circuit board in electrode surface again.The characteristics of lead type ceramic capacitor are that volume is little, and good heat resistance, loss is little, insulation resistance is high and dielectric constant is big, therefore are applicable to high pressure and high-frequency circuit.
Development in science and technology is in recent years maked rapid progress, each electronic product is more prevalent, so need to use a large amount of capacitors, for example the power supply unit of LCD must use high-precision lead type ceramic capacitor, it is operated in the alternating voltage between 100 volts to 5000 volts, capacitance in number micromicrofarads (pF) between tens of micromicrofarads, and its error must be equal to or less than ± 1%.
Existing lead type ceramic capacitor manufacture method is difficult for grasping the precision of capacitor, general best error amount is ± 5%, if need be lower than ± 5% often need after capacitor fabrication is finished, utilize the method for screening (sorting) to select capacitor up to specification again, therefore the delivery date of product is wayward, and cause waste of material easily, make that product cost is difficult for reducing.
Summary of the invention
For addressing the above problem, one of the object of the invention is to propose a kind of lead type ceramic capacitor manufacture method that comprises a capacitance set-up procedure, can grasp the capacitance precision of ceramic capacitor, for example can reach ± requirement of 1% high precision capacitor to be providing the capacitor value accurately of circuit design, with effective raising product yield, material and reduce product cost avoids waste.
One of the object of the invention is to propose a kind of lead type ceramic capacitor manufacture method, utilizing a capacitance to adjust machine sprays except that the part metals electrode with the high-pressure metal powder, setting in the error range of capacitance reaching high-precision requirement up to measuring capacitance, and can remove the influence of the stray capacitance that produces between lead-in wire simultaneously for the capacitance of final requirement.
In order to achieve the above object, one embodiment of the invention provides a kind of lead type ceramic capacitor manufacture method, comprising: provide a plurality of potsherds, wherein, one upper surface tool, one first metal electrode of each potsherd, and a lower surface tool one second metal electrode of each potsherd; One combination step is assembled to potsherd on one support plate (carrier), and welds a plurality of metal lead wires in first metal electrode and second metal electrode, and wherein each first metal electrode and each second metal electrode weld a metal lead wire respectively; Reach a capacitance set-up procedure, measure the capacitance of each potsherd, then remove part first metal electrode or part second metal electrode if capacitance is set capacitance greater than one, and repeat this capacitance set-up procedure.
Cooperate appended graphic explanation in detail below by specific embodiment, when the effect that is easier to understand purpose of the present invention, technology contents, characteristics and is reached.
Description of drawings
Fig. 1 is the flow chart of steps of the lead type ceramic capacitor manufacture method of one embodiment of the invention;
Fig. 2 a to Fig. 2 d is each step schematic diagram of the lead type ceramic capacitor manufacture method of the embodiment of the invention;
Fig. 3 is the flow chart of steps of the lead type ceramic capacitor manufacture method of one embodiment of the invention.
Symbol description among the figure
10 potsherds
12 first metal electrodes
14 metal lead wires
16 scolding tin
18 parts, first metal electrode
20 capacitances are adjusted machine
22 high-pressure metal powder
30 thermosetting epoxy resins
S0 provides a plurality of potsherds
The S1 combination step
S2 capacitance set-up procedure
The S3 encapsulation step
S4 finished product test step
The S5 printing step
S6 finished product packing step
Embodiment
Be described in detail as follows, described preferred embodiment is only done an explanation but not in order to limit the present invention.
Fig. 1 is the flow chart of steps of the lead type ceramic capacitor manufacture method of one embodiment of the invention, and Fig. 2 a to Fig. 2 d is each step schematic diagram of the lead type ceramic capacitor manufacture method of the embodiment of the invention; See also graphicly, the lead type ceramic capacitor manufacture method of one embodiment of the invention comprises:
1.S0 provide a plurality of potsherds 10 (please in the lump a) with reference to figure 1 and Fig. 2, shown in Fig. 2 a, potsherd 10 shaping, sintering and formation metal electrode, one upper surface tool, one first metal electrode 12 of each potsherd 10, and a lower surface tool one second metal electrode (not shown) of each potsherd 10, in one embodiment, potsherd 10 can be rondelle, and the material of first metal electrode 12 and second metal electrode can be silver (Ag);
2.S1 combination step (please in the lump with reference to figure 1 and Fig. 2 b), potsherd 10 is assembled to (not shown) on the support plate, and weld a plurality of metal lead wires 14 in first metal electrode 12 and second metal electrode, wherein each first metal electrode 12 welds a metal lead wire 14 respectively with each second metal electrode, in one embodiment, the material of support plate can be paper, and as shown in the figure, utilizes scolding tin 16 to come weld metal lead-in wire 14 and first metal electrode 12 and second metal electrode; And
3.S2 capacitance set-up procedure (please in the lump with reference to figure 1 and Fig. 2 c) measures the capacitance of each potsherd 10, then removes part first metal electrode 18 or part second metal electrode if capacitance is set capacitance greater than one, and repeats this capacitance set-up procedure.Because the capacitance of lead type ceramic capacitor is determined by the effective area that first metal electrode of potsherd and second metal electrode occur simultaneously, so measure the initial capacitance value of ceramic capacitor earlier, if capacitance is greater than setting capacitance, behind the metal electrode area that calculating and decision desire are removed, can utilize a capacitance to adjust machine 20 sprays except that part first metal electrode 18 or part second metal electrode with high-pressure metal powder 22, repeat this capacitance set-up procedure, setting in the error range of capacitance to reach high-precision requirement up to measuring capacitance, for example reach ± requirement of 1% high precision capacitor, and this step also can be removed the influence for the capacitance of final requirement of the stray capacitance that produces between lead-in wire simultaneously.
Therefore, one of feature of lead type ceramic capacitor manufacture method of the present invention is to comprise a capacitance set-up procedure, can grasp the capacitance precision of ceramic capacitor, for example can reach ± requirement of 1% high precision capacitor to be providing the capacitor value accurately of circuit design, so can effectively improve the product yield, material and reduce product cost avoids waste.
Fig. 3 is the flow chart of steps of the lead type ceramic capacitor manufacture method of another embodiment of the present invention; compare with the steps flow chart of Fig. 1; the steps flow chart of Fig. 3 comprises that more a S3 seals (coating) step (please in the lump with reference to figure 3 and Fig. 2 d); with a thermosetting epoxy resin (epoxy) 30 coating ceramic sheets 10; first metal electrode 12; the part of second metal electrode and metal lead wire 14; high voltage withstanding property in order to protection potsherd 10 bodies and increase capacitor; in one embodiment, lead type ceramic capacitor manufacture method of the present invention can comprise more that a maturation (curing) step is with heating cure epoxy resin 30.
Please continue with reference to figure 3, in one embodiment, lead type ceramic capacitor manufacture method of the present invention can more comprise: S4 finished product test step; S5 prints (marking) step; Or S6 finished product packing (packing) step.In one embodiment, S4 finished product test step can comprise: a voltage-withstand test; The one dissipation factor (dissipation factor) test; One insulation impedance (insulationresistance) test; An or finished product capacitance test.
Above-described embodiment only is explanation technological thought of the present invention and characteristics, its purpose makes those skilled in the art can understand content of the present invention and is implementing according to this, when can not with qualification claim of the present invention, promptly the equalization of doing according to disclosed spirit generally changes or modifies, and must be encompassed in the claim of the present invention.

Claims (9)

1.一种引线式陶瓷电容器制作方法,其特征在于,包含:1. A method for manufacturing a leaded ceramic capacitor, characterized in that it comprises: 提供多个陶瓷片,其中,每一该陶瓷片的一上表面具一第一金属电极,且每一该陶瓷片的一下表面具一第二金属电极;providing a plurality of ceramic sheets, wherein an upper surface of each ceramic sheet has a first metal electrode, and a lower surface of each ceramic sheet has a second metal electrode; 一组合步骤,将该些陶瓷片组装至一载板上,并焊接多个金属引线于该些第一金属电极与该些第二金属电极,其中每一该第一金属电极与每一该第二金属电极分别焊接一该金属引线;及An assembling step, assembling the ceramic sheets on a carrier board, and welding a plurality of metal leads to the first metal electrodes and the second metal electrodes, wherein each of the first metal electrodes and each of the second metal electrodes two metal electrodes are respectively welded to one of the metal leads; and 一电容值调整步骤,量测每一该陶瓷片的电容值,若该电容值大于一设定电容值则去除部分该第一金属电极或部分该第二金属电极,并重复该电容值调整步骤。A capacitance value adjustment step, measuring the capacitance value of each of the ceramic sheets, if the capacitance value is greater than a set capacitance value, removing part of the first metal electrode or part of the second metal electrode, and repeating the capacitance value adjustment step . 2.如权利要求1所述的引线式陶瓷电容器制作方法,其中,该第一金属电极与该第二金属电极的材质为银。2. The method for manufacturing a leaded ceramic capacitor according to claim 1, wherein the first metal electrode and the second metal electrode are made of silver. 3.如权利要求1所述的引线式陶瓷电容器制作方法,其中,该载板的材质为纸。3. The method for manufacturing a leaded ceramic capacitor as claimed in claim 1, wherein the carrier is made of paper. 4.如权利要求1所述的引线式陶瓷电容器制作方法,其中,利用一焊锡焊接该些金属引线与该第一金属电极及该第二金属电极。4 . The method for manufacturing a leaded ceramic capacitor as claimed in claim 1 , wherein a solder is used to weld the metal leads and the first metal electrode and the second metal electrode. 5.如权利要求1所述的引线式陶瓷电容器制作方法,其中,利用一电容值调整机以高压金属粉末来喷除部分该第一金属电极或部分该第二金属电极。5 . The method for manufacturing a leaded ceramic capacitor as claimed in claim 1 , wherein a capacitance adjustment machine is used to spray off part of the first metal electrode or part of the second metal electrode with high-voltage metal powder. 6.如权利要求1所述的引线式陶瓷电容器制作方法,其中,更包含一包封步骤,以一热固型环氧树脂包覆每一该陶瓷片、该第一金属电极、该第二金属电极及每一该金属引线的部分。6. The method for manufacturing a leaded ceramic capacitor as claimed in claim 1, further comprising an encapsulation step of encapsulating each of the ceramic chip, the first metal electrode, and the second ceramic chip with a thermosetting epoxy resin. Metal electrodes and portions of each of the metal leads. 7.如权利要求6所述的引线式陶瓷电容器制作方法,其中,更包含一熟成步骤以加温固化该热固型环氧树脂。7. The method for manufacturing a leaded ceramic capacitor as claimed in claim 6, further comprising a curing step to cure the thermosetting epoxy resin by heating. 8.如权利要求1所述的引线式陶瓷电容器制作方法,其中,更包含:一成品测试步骤;一打印步骤;或一成品包装步骤。8. The manufacturing method of a leaded ceramic capacitor as claimed in claim 1, further comprising: a finished product testing step; a printing step; or a finished product packaging step. 9.如权利要求8所述的引线式陶瓷电容器制作方法,其中,该成品测试步骤包含:一耐压测试;一消散因子测试;一绝缘阻抗测试;或一成品电容值测试。9 . The method for manufacturing a leaded ceramic capacitor as claimed in claim 8 , wherein the finished product testing step comprises: a withstand voltage test; a dissipation factor test; an insulation resistance test; or a finished product capacitance test.
CN 200710137022 2007-07-19 2007-07-19 Method for manufacturing lead type high-voltage precision ceramic capacitor Pending CN101350249A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200710137022 CN101350249A (en) 2007-07-19 2007-07-19 Method for manufacturing lead type high-voltage precision ceramic capacitor

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Application Number Priority Date Filing Date Title
CN 200710137022 CN101350249A (en) 2007-07-19 2007-07-19 Method for manufacturing lead type high-voltage precision ceramic capacitor

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CN101350249A true CN101350249A (en) 2009-01-21

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118098842A (en) * 2024-04-26 2024-05-28 南通南铭电子有限公司 Intelligent adjustment method and system for capacitor pins

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118098842A (en) * 2024-04-26 2024-05-28 南通南铭电子有限公司 Intelligent adjustment method and system for capacitor pins
CN118098842B (en) * 2024-04-26 2024-07-02 南通南铭电子有限公司 Intelligent adjustment method and system for capacitor pins

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Open date: 20090121