TW200901269A - Cluster management system, semiconductor manufacturing device and information processing method - Google Patents

Cluster management system, semiconductor manufacturing device and information processing method Download PDF

Info

Publication number
TW200901269A
TW200901269A TW097107524A TW97107524A TW200901269A TW 200901269 A TW200901269 A TW 200901269A TW 097107524 A TW097107524 A TW 097107524A TW 97107524 A TW97107524 A TW 97107524A TW 200901269 A TW200901269 A TW 200901269A
Authority
TW
Taiwan
Prior art keywords
information
available energy
semiconductor manufacturing
energy information
available
Prior art date
Application number
TW097107524A
Other languages
Chinese (zh)
Other versions
TWI390594B (en
Inventor
Kenji Matogawa
Noriaki Koyama
Masashi Takahashi
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200901269A publication Critical patent/TW200901269A/en
Application granted granted Critical
Publication of TWI390594B publication Critical patent/TWI390594B/en

Links

Classifications

    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/4183Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by data acquisition, e.g. workpiece identification
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/4184Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by fault tolerance, reliability of production system
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67276Production flow monitoring, e.g. for increasing throughput
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

A group management system, a semiconductor manufacturing device and an information processing method are provided. The existing group management system and other systems have the problem that the energy source check cannot be correctly executed in short time. The group management system is provided with more than one semiconductor manufacturing device and a server connected with the more than one semiconductor manufacturing device. The semiconductor manufacturing device is provided with an energy source acquiring part for acquiring energy source information which represents the information of the values of more than one energy source used in the semiconductor manufacturing technology, and a sending part which can sending the energy source information acquired by the energy source acquiring part. The server is provided with a receiving part for receiving the energy source information sent from the semiconductor manufacturing device, a server judging part for judging whether the energy source value represented by the energy source information received by the receiving part is a prescribed value, and a server output part for outputting the judge result of the server judging part.

Description

200901269 九、發明說明: 【發明所屬之技術領域】 本發明係關於-種在半導體製造過程中所使 系統等者。 理 【先前技術】 在半導體製造過程中係使用電或水或氣體等之各 能。在半導體製造裝置之運用現場,例如在工礙可用 要定期檢驗供給至裝置之可用能是否處於適於半導體激需 裝置之運用之狀態。通常,此等可用能之狀態係分^ 感測器(s_r)等之測定器來測定,於檢驗之際_由 或半導體製造裝置之管理者等定期性地例如 取此等測定結果所表示之值,而 疋寺地言貴 圍,藉此以監視可用能之異常。否為正常之範 另外,以習知之半導體製造裝置之群管理系統而、 知有接收從測定器傳送而來之各種資料已 (例如參照專利文獻1)。 丁貝科加工者 此外,自以往以來已知有用以檢測半 常之構成等(例如參照專利文獻2)。 &裝置之異 此外,以構成習知之群管理系統之製造 謂批次(batch)式縱型熱處理裝置(例如參 。,有所 利文獻4)。 >…、專利文獻3及專 —此外’以習知之半導體製造過程之管理 示有在故障被檢測出時,將電子郵、置而言’係揭 有人之構成等(例如參照專利文獻5)。、卫具(㈣)持 128454.doc 200901269 [專利文獻1]曰本特開平H—354395號公報(第1頁、 等) [專利文獻2]曰本特開2006_216920號公報(第1頁、圖 等) " [專利文獻3]日本專利3543996號公報(第、圖1等) [專利文獻4]日本特開2〇〇2_25997號公報(第1頁、 等) [專利文獻5]日本特表2〇〇6_5〇168〇號公報(第1頁、圖200901269 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to systems and the like that are employed in semiconductor manufacturing processes. [Prior Art] Electricity or water or gas is used in the semiconductor manufacturing process. At the application site of the semiconductor manufacturing apparatus, for example, it is possible to periodically check whether the usable energy supplied to the apparatus is in a state suitable for the operation of the semiconductor demanding apparatus. Usually, the state of the usable energy is measured by a measuring device such as a sensor (s_r), and is periodically represented by a manager such as a semiconductor manufacturing device, for example, by the measurement results. The value, and the temple of the temple, is used to monitor the available energy. In addition, it is known that a variety of materials transmitted from the measuring device are received by the group management system of the conventional semiconductor manufacturing apparatus (see, for example, Patent Document 1). In addition, it has been known to be useful for detecting a semi-conventional structure and the like (for example, refer to Patent Document 2). & Device Differences In addition, a batch type vertical heat treatment device is constructed to constitute a conventional group management system (for example, see Document 4). <..., the patent document 3 and the special-in addition, the management of the conventional semiconductor manufacturing process shows that the electronic mail is placed in a state where the fault is detected (for example, refer to Patent Document 5). .卫 卫 454 454 454 454 454 454 454 454 454 454 454 454 454 454 454 454 454 454 454 454 454 454 454 454 454 454 454 454 454 454 454 454 454 454 454 454 454 — — — — — — — — — — — — — — — — — — — — — — [Patent Document 3] Japanese Patent No. 3,543,996 (P. 1, etc.) [Patent Document 4] Japanese Laid-Open Patent Publication No. Hei. No. 2-25997 (page 1, etc.) [Patent Document 5] Japanese Special Table 2〇〇6_5〇168〇 Bulletin (page 1, picture

等) 【發明内容】 [發明所欲解決之問題] 習知係將用以涓J定可用能之狀態之感測器所表示之值, 由檢驗者以目視來確認而記錄於檢驗表等,且進行報告書 (report)之作成。然而’半導體裝置之製造通常大多以批次 處理來進订,而在進行半導體裝置之製造之工廠等中,為 了進行大量生產,大多設置有數百台左右相同之半導體製 以裝置。要每天進行分別供給至如此多之半導體製造裴置 之可用能之檢驗’會有非常耗費時間,並且亦容易發生測 定值等之記錄錯誤之問題。 、 一例如1耗費時間在檢驗,則在每—半導體製造裝置進 了可用能之檢驗之時間就會有極大不肖,因此難謂在幾乎 目:之定時(timing)進行了全部之可用能之檢㉟ = 於可用能之值產生參差不齊,亦」 Λ 不彳疋起因於可用能之異常、還是時間之偏 128454.do, 200901269 離’而難謂已進行了正確之檢驗。 此外廠中,由於並排複數台相同之半導體製造裝 置’因此根據檢驗方法笼* τ β 等之不同,檢驗者將會無法明瞭在 檢驗中已檢驗了使用於哪— 裝置之可用忐荨,或會將檢驗 結果錯誤記入’而無法獲得正確之記錄。 再者,根據供給至半導體製造裝置之可用能之不同,有 在半導體製造裝置之運轉時應測定者、及在半導體製造裝 置之非運轉時,亦即息轉(idling)時應測定者。例如,關於 供給至作為可用能之一夕女士 ;兹 ^之各丰導體製造裝置之電壓等,半 導體製造裝置運轉之際之值要在正常之範圍,此點在半導 體製程上極為重要’而於半導體製造裝置處於怠轉時之狀 態之情形下’即使值不在正f之範圍’亦會有判斷為沒有 問題之情形。反之,例如關於真空排氣壓等,#怠轉時之 壓力異常上升’則空氣會從真空排氣管逆流至半導體製造 裝置’因此半導體製造裝置内會有被粉塵污染之虞,因此 亦有以測定怠轉時之值為較佳之情形。然而,由於習知並 未考慮各半導體製造裝置是在運轉狀態或是在非運轉狀離、 等狀態,^單,純定期性進行檢驗,因此會有未充分進行^ 常運用半導體製造裝置所必須之檢驗之情形之問題。 [解決問題之技術手段] 本發明之群管理系統係包括:1個以上半導體製造穿 置,其係對於被處理基板執行特定之半導體製造過裎T2 伺服器裝置,其係與該1個以上半導體製造裝置連接者. 且前述半導體製造裝置係包括:可用能資訊取得部,其係 128454.doc 200901269 取得表示關於在半導體製造過程中所使用之】個以上之可 用月匕之值之貝。凡即可用能資訊;及發送部,其係將前述可 用能^訊取得部所取得之可用能資訊發送至前述㈣器裝 置;前述词服器裝置係包括:接收部,其係接收從前述半 導體製造裝置所發送之可用能資訊;飼服器側判斷部,盆 t'判斷前述接收部接收之可用能資訊所表示之可用能之值 时為特疋之值’及伺服器側輸出部’其係、進行與前述飼 服器側#斷部之判斷結果對應之輸出。 &依據此種構成,使用者不需再以目視等繞巡檢驗各可用 月b而可於短日守間且正確地進行利用於半導體製造裝置之 可用能是否產生異常等之檢驗。此外,可在預先設定之時 間幾乎同時進行利用於複數個半導體製造裝置之複數個可 用此之檢驗。此外,藉由將可用能之檢驗自動化,即可消 除可用能之測定值等之記入疏漏或記入錯誤等。 二卜本毛明之群管理系統,係在前述群管理系統令, =可用能資訊取得部係判斷本身裝置之狀態,且依據本 身裝置之狀態而取得前述各可用能資訊。 依據此種構成,可確實地檢驗對於各 之檢驗,且可進杆τ> 认 田狀態 驗。此外,依據半導體製造裝 置之狀久、’而取得可用At 次> ^ .. ^ , x 用月b之貝讯,藉此可等待可用能資料 之收集到半導體製造裝置成為特定之狀態。 貝科 儿此外,本發明之群管理系統,係在前述群管理系 則述可用能資訊取得部係在預先指定 本身置 之狀態為特定妝能+达 且不身震置 〜、@形下取得前述可用能資訊。 128454.doc 200901269 依據此種槿点',-r ▲ t 成 了在對於各可用能為適冬 實地進行指定了時列耸夕… 々週田之狀恶下,確 等,且可進行正I k之檢驗’例如定期性之檢驗 且』進仃正確之檢驗。 前=卜用ί發明之群管理系統,係在上述群管理系統中, " 咸貧訊取得部係於本身裝置為依各可用 指定之狀能之愔拟·1伙谷了用月匕貝矾所 心之^下取得該各可用能資訊。 依據此種構成,半導#匍、皮狀里p 科m ν 體製造裝置即可僅將檢驗所需之資 科發送至伺服器裝f, 且可減。、不為要之資料之發送。 —卜、·本發明之群管理系統’係在上述群管理系統中, 二述半導體製造裝置進一步包括狀態資訊取得部,其係取 :表不本身裝置狀態之資訊即狀態資訊;前述發送部係將 Γ述可用能資訊取得部所取得之可用能資訊及前述狀態資 取知。(5所取彳f之狀態資訊發送至前述伺服器裝置;前述 接收部係接收從前述半導體製造裝置所發送之可用能資訊 f狀態資訊;前述飼服器裝置進-步包括伺服器側取得 部’其係依據前述接枚部所接收之狀態資訊,而取得前述 接收部所接收之可用能資訊;前述伺服器裝置之伺服器側 判斷部係係判斷前述接收部所接收之可用能資訊中前述伺 、器側取取知之可用能資訊所表示之可用能之值是否 為特定之值。 依據此種構成’伺服器裝置可僅判斷檢驗所需之資料而 取仔’且不需要用卩選擇I半導體製造裝置所進行之檢驗 所而之資料之處理,而可減輕各半導體製造裝置所進行之 處理。此外,可省略用以選擇此種資料之構成。 128454.doc •10- 200901269 二此外’本發明之群管理系統,係在前述群管理系統中, 别=服器側取得部係取得各半導體製造褒置在預先指定 守斤取得之可用能資訊,且與表示各半導體製造裝置 為特定狀態之狀態資訊對應之可用能資訊。 依據此種構成’可在對於各可用能為適當之狀態確實地 ' 扣疋了時刻等之定時之檢驗,例如定期性之檢驗 等,且可進行正確之檢驗。此外,依據半導體製造裝置之 狀態,㈣得可用能之資訊,藉此可料可用能資料之收 集到半導體m置成為特定之狀態。 &此外,本發明之群管理系统,係、在前述群管理系統中, ^述伺服㈣取得料在各半導體製造裝置所發送之狀態 貝訊表不為依各可用能資訊所指定之狀態之情形下,取得 與該狀態資訊對應之各可用能資訊。 —依據此種構成’可依各可用能資訊而取得適當之可用能 資訊,且可進行正確之檢驗。 卜本發明之半導體製造裝置係對於被處理基板執行 特疋之半導體製造過程者,I包括:可用能資訊取得部, 其係取得表示關於在半導體製造過程中所使用之i個以上 之可用能之值之資訊即可用能資訊;判斷部,其係判斷前 述可用能資訊取得部取得之可用能資訊所表示之可用能之 值是否μ定之值,·及輸出部,其係進行與前述判 判斷結果對應之輸出。 处依據此種構成,使用者不需再以目視等繞巡檢驗各可用 此’而可於短時間且正確地進行利用於半導體製造裝置之 128454.doc 200901269 可用能是否產生異常等之檢驗。此外,可在預先設定之時 間f乎同時進行利用於複數個半導體製造裝置之複數個可 用此之檢驗。此外,藉由將可用能之檢驗自動化 除可用能之測定值等之記入疏漏或記入錯誤等。 此外’本發明之半導體製造裝置係在前述半導體製造裝 置中’别述可用能資訊取得部係判斷本身襄置之狀態,且 依據本身裝置之狀態而取得前述各可用能資訊。 依據此種構成,可確實地進行對於各可用能為適當狀態 檢驗且可進仃正確之檢驗。此外,依據半 置之:態’而取得可用能之資訊’藉此可等待可用能;; 之收集到半導體製造裝置成為特定之狀態。 此外’本發明之半㈣製料置係在前述 置中,前述可用能資訊取得部係在預先指定之定時 身裝置之狀態為特定狀態之情形下取得可用能資訊。 依據此種構成,可在對於各可用能為適當之㈣下 指定了時刻等之定時之檢驗,例如定期性之檢驗 寺’且可進行正確之檢驗。 此外:本發明之半導體製造裝置係在前述半導體 可用能資訊取得部係於本身裝置為依各可用能 貝π所^疋之狀態之情形下取得該各可用能資訊。 i依據此種構成’可依各可用能資訊取得適當之可用能資 汛,且可進行正確之檢驗。 b、 [發明之效果] 可於短時間且正確地進 依據本發明之半導體製造裝置 128454.doc 200901269 行可用能之檢驗。 【實施方式】 以下,參照圖式說明半導體製造裝置等之實施形態。另 外,在實施形態中賦予相同符號之構成要素係進行同樣之 動作,因此有時會省略再度之說明。 (實施形態1)[Summary of the Invention] [Problems to be Solved by the Invention] Conventionally, the value indicated by the sensor for determining the state of available energy is confirmed by the examiner by visual inspection and recorded in a checklist, etc. And the report is made. However, in the production of semiconductor devices, many of them are usually ordered by batch processing, and in a factory where semiconductor devices are manufactured, etc., in order to mass-produce, a plurality of semiconductor devices having the same number of semiconductors are often provided. It is very time consuming to perform the inspection of the available energy separately supplied to so many semiconductor manufacturing devices every day, and it is also prone to recording errors such as measurement values. For example, if it takes time to test, the time for each semiconductor manufacturing device to pass the test of available energy will be greatly unsatisfactory, so it is difficult to say that all the available energy can be checked at almost the timing: timing. 35 = The value of the available energy is uneven, and it does not cause the abnormality of the available energy, or the time offset 128454.do, 200901269. It is difficult to say that the correct test has been carried out. In addition, in the factory, due to the fact that several identical semiconductor manufacturing devices are arranged side by side, the inspector will not be able to determine where the device is used in the inspection according to the difference of the inspection method * τ β, etc. The test result was incorrectly recorded in 'and the correct record could not be obtained. Further, depending on the usable energy supplied to the semiconductor manufacturing apparatus, the person to be measured during the operation of the semiconductor manufacturing apparatus and the one to be measured when the semiconductor manufacturing apparatus is not in operation, i.e., idling. For example, regarding the supply of voltage to the semiconductor manufacturing device as a usable energy source, the value of the semiconductor manufacturing device is in a normal range, which is extremely important in the semiconductor process. In the case where the semiconductor manufacturing apparatus is in a state of being rotated, even if the value is not in the range of positive f, there is a case where it is judged that there is no problem. On the other hand, for example, regarding the vacuum exhaust pressure, etc., the pressure at the time of the turbulent rotation rises abnormally, and the air flows back from the vacuum exhaust pipe to the semiconductor manufacturing device. Therefore, there is a possibility that the semiconductor manufacturing device is contaminated by dust, so that it is also measured. The value at the time of twirling is better. However, since it is conventionally not considered that each of the semiconductor manufacturing apparatuses is in an operating state or in a non-operating state, and the like, the inspection is performed on a purely periodic basis, and therefore, it is necessary to sufficiently perform the semiconductor manufacturing apparatus. The problem of the situation of the inspection. [Technical means for solving the problem] The group management system of the present invention includes one or more semiconductor manufacturing through-holes, which are performed on a substrate to be processed by a specific semiconductor manufacturing T2 servo device, and the one or more semiconductors The manufacturing device connector. The semiconductor manufacturing device includes an available energy information acquisition unit, which is 128454.doc 200901269, which obtains a value indicating that more than one of the available months is used in the semiconductor manufacturing process. And the transmitting unit transmits the available energy information obtained by the available energy acquisition unit to the (4) device; the word processor device includes: a receiving unit that receives the semiconductor from the semiconductor The available energy information transmitted by the manufacturing device; the feeding device side determining unit, the basin t' determines the value of the available energy indicated by the available energy information received by the receiving unit, and is a special value 'and a server side output portion' And outputting the output corresponding to the judgment result of the above-mentioned feeding machine side #断部. According to this configuration, the user does not need to patrol the available usable months b by visual inspection or the like, and can perform the inspection for whether or not the usable energy used in the semiconductor manufacturing apparatus is abnormal or not in the short-term. Further, a plurality of tests which can be used for a plurality of semiconductor manufacturing apparatuses can be performed almost simultaneously at a predetermined time. Further, by automating the inspection of the available energy, it is possible to eliminate the omission or the error of the measurement value of the available energy or the like. The second Buben Maoming group management system is based on the group management system order, the available energy information acquisition department determines the state of the device itself, and obtains the aforementioned available energy information according to the state of the device itself. According to this configuration, the test for each can be surely checked, and the field can be entered τ> Further, depending on the state of the semiconductor manufacturing apparatus, the available At times > ^ .. ^ , x is used for the month b, whereby the collection of the usable energy data can be waited for the semiconductor manufacturing apparatus to be in a specific state. In addition, in the group management system of the present invention, in the group management system, the available energy information acquisition unit obtains the specific makeup energy + in the state specified in advance, and obtains the shape and does not vibrate. The aforementioned available energy information. 128454.doc 200901269 According to this kind of defect ', -r ▲ t has become a time when the field of the available energy is specified for the winter season... 々 田 之 之 , , 确 确 确 确 确 确 确 确 确 々 々 々 The test of k 'for example, the periodic test and the correct test. Former group management system, in the above group management system, " Salty Essence acquisition department in its own device for each of the available designation of the shape of the Get all the available energy information under your heart. According to this configuration, the semi-conductor and the skin-like p-m ν body manufacturing apparatus can transmit only the assets required for the inspection to the server device f, and can be reduced. , not the delivery of the required information. - the group management system of the present invention is in the group management system, and the semiconductor manufacturing apparatus further includes a state information acquisition unit that reads: information indicating the state of the device itself, that is, status information; The available energy information obtained by the available energy information acquisition unit and the state information will be described. (5) the status information of the f is sent to the server device; the receiving unit receives the available energy information f status information transmitted from the semiconductor manufacturing device; and the feeding device further includes a server side obtaining unit 'According to the status information received by the receiving unit, obtaining the available energy information received by the receiving unit; the server side determining unit of the server device determines the available energy information received by the receiving unit The server and the device side obtain the value of the available energy indicated by the available energy information. According to the configuration, the server device can only determine the data required for the inspection and take the vacancy, and does not need to select I. The processing of the data carried out by the semiconductor manufacturing apparatus can reduce the processing performed by each semiconductor manufacturing apparatus. Further, the configuration for selecting such data can be omitted. 128454.doc •10- 200901269 In the group management system of the invention, the server-side acquisition unit acquires each semiconductor manufacturing device in a predetermined designation The available energy information, and the available energy information corresponding to the state information indicating that each semiconductor manufacturing device is in a specific state. According to this configuration, the timing of the time and the like can be surely deduced for each available energy. The inspection, for example, the periodic inspection, etc., and the correct inspection can be performed. In addition, according to the state of the semiconductor manufacturing device, (4) the available energy information can be obtained, so that the available energy data can be collected to the semiconductor m to be in a specific state. In addition, in the group management system of the present invention, in the group management system, the status of the servo (four) acquisition material sent by each semiconductor manufacturing apparatus is not specified by each available energy information. In the case of the present, the available energy information corresponding to the status information is obtained. - According to the composition, the available energy information can be obtained according to the available energy information, and the correct test can be performed. For a semiconductor manufacturing process that performs a special process on a substrate to be processed, I includes: an available energy information acquisition unit, which obtains a representation The information for the value of the i or more usable energy used in the semiconductor manufacturing process can be used as the energy information; the judging unit judges whether the value of the available energy indicated by the available energy information obtained by the available energy information obtaining unit is μ. The fixed value and the output unit perform an output corresponding to the judgment result. According to the configuration, the user does not need to perform the inspection by visual inspection or the like, and can perform the short-time and correct operation. The use of the semiconductor manufacturing apparatus 128454.doc 200901269 can be used to test whether an abnormality or the like can be generated. Further, a plurality of tests usable for a plurality of semiconductor manufacturing apparatuses can be simultaneously performed at a predetermined time. In addition, the semiconductor manufacturing apparatus of the present invention is in the semiconductor manufacturing apparatus described above, and the available energy information acquisition unit determines that it is disposed. State, and obtain the aforementioned available energy information according to the state of the device itself. According to this configuration, it is possible to surely perform an inspection for the appropriate state for each available energy and to perform the correct test. Further, the information on the available energy is obtained based on the half state: the information can be used to wait for the usable energy; the collection of the semiconductor manufacturing device becomes a specific state. Further, the half (four) material preparation of the present invention is set as described above, and the available energy information acquisition unit acquires the available energy information when the state of the predetermined timed device is a specific state. According to this configuration, it is possible to specify the timing of the time or the like under the (4) appropriate for each available energy, for example, the periodic inspection of the temple and the correct inspection can be performed. Further, in the semiconductor manufacturing apparatus of the present invention, the available energy information is obtained in a state in which the semiconductor usable energy information acquisition unit is in a state in which the device itself is in accordance with each available energy. i Based on this composition, the appropriate available energy can be obtained based on the available energy information, and the correct test can be performed. b. [Effects of the Invention] The semiconductor manufacturing apparatus 128454.doc 200901269 according to the present invention can be tested for available energy in a short time and correctly. [Embodiment] Hereinafter, embodiments of a semiconductor manufacturing apparatus and the like will be described with reference to the drawings. In the embodiment, the same components are denoted by the same reference numerals, and the description thereof will be omitted. (Embodiment 1)

Ο 圖1係為本實施形態之群管理系統之概念圖。群管理系 統係為例如管理半導體製造裝置、或液晶面板製造裝置等 之製造裝置之系統。此外,群管理系統係具有丨個以上半 導體製造裝置U(從半導體製造裝置lla至半導體製造裝置 lln)(惟η係表示任意數))、伺服器裝置12、及i個以上客戶 端(client)裝置13(客戶端裂置⑴至客戶端裝置—(惟爪係 表示任意數))。 1個以上半導體製造裝置丨丨與伺服器裝置12、及丨個以上 客戶端裝置13與伺服器裝置12係分別經由通信線路而連 接’可進行資訊之發送接收。各裝置例如可藉由網際網 路、無線或有線之L AN(Local Area Ν—,區域網路)等 之網路來連接,或亦可藉由藍芽⑽e t_h)(註冊商標)等 之近距離無線通信來連接。此外’亦可藉由咖卿⑽1 knal Bus,萬用串聯匯流排)或ieeei394(標準總線接口) 之匯流排等來連接。惟各裝置間之連接方法不予限定。此 外,資訊之發送接收之機構,可以是通信機構,亦可是傳 播機構。 得 128454.doc 200901269 半導體製造1係為對於被處理基板,例 體晶圓等進行特定之半導體製造過程之裝置。半導體 裝置11係例如對於成膜产理. 導體 丁於成膜處理、蝕刻處理、熱氧化處理 被處理基板進行各種處理。半導體製造裝置u係例 ^之專利文獻2、或專利文獻3等中之Μ式縱型熱處理裝 ,兹將本半導體製造裝置11之例表示於圖2。本半導妒 製造裝置U係為相對於其他室作成可密閉地以作為载入 1 (—g)室’且作成可供給•抽真空仏氣體作為惰性聲产 氣體之所謂作成預載(lGad lGek)室結構之裝置。半導體^ 造裳置U係由以下構成主要部:處理室之製程導管 ⑽其對於被處理體之晶圓评施以特定之處理;作為 載入至之預載至h,其具備用以插脫作為保持體之晶舟 (wafer b〇at)f之移送機構g,該保持體係相對於製程導管玨 收納有多數片例如100片之晶圓w;搬出入室心,其用以 相對於該預載室h搬出入晶圓w ; E盒(咖叫收容容哭 用埠(P〇rt)ac,其形成於該搬出人室ab;取入機構此,其用。 以將載置於該埠狀之厘盒收容容器以取入至搬出入室讣 :;容器保管平台(stage)af,其用以將所取入之g盒收容 容器ad暫時地保管;g盒取出平台叫,其用以將收容於匿 盒收容容器ad内之if各r名· iv & I a 匣孤C予以取出;容器移載機構ah,其 在搬出入室ab内進㈣盒收容容器ad之收付;及保持體收 容室ai’其將配置在預載室h與搬出入室ab之間之晶舟^ 以收容。另外,關於在圖2之半導體製造裝置W例中之 其他部位及動作’由於為公知技術(參照專利文獻”,故省 128454.doc •14- 200901269 略詳細之說明。此外,以構成半導體製造 (Chamber)而言,係以專利文獻4之圖!中之卜 1之腔室 外,在本實施形態中,"固以上 至為較佳。另 定,從半導體製造裝置lla至半導體^造裝/置^成不予限 仃不同處理之製造裝置,亦可 了以疋進 裝置。 疋匕括進仃相同處理之製造 此半㈣t造裝置n係例如料作相於對於 之特定之製程之資訊之製程參數(re 、'曰曰 參數進行控制。 而使用該製程 半導體製造裝置U係可具有用以處理半導體製 之測定資訊並檢測異常,戋將本 、置 訊發送至伺服器裝置12之構成 恶"曰+ Γ關於+導體製造裝 置11具有用以執行半導體製造 製造裝置η内之測定資訊並檢„:構:或處理半導體 置u内之敎資訊發送mm裝置以 == 省略說明。 寸隹此你 飼服裔裝置12係為用u, 于马用以^理複數個半導體製造裝置丨丨之 群之所謂構成群管理系統之飼服器裝置。飼服器裝置⑽ 可接收並儲存從⑽以上半導體製造裝置u所發送之各種 測定資訊等之資訊,且相對於該測定資訊具有進行里常檢 測之功能。飼服器裝置12可具有用以儲存或進行處理從半 導體製造裝置u所發送之半導體製造裝置u内之測定資 訊而檢測異吊之構成。另外,關於伺服器裝置12處理半 導體製造裝置U内之測定資訊而檢測異常之構成等,在此 128454.doc 200901269 係省略說明。 此外,客戶端裝置13係為田、, 送之異常於雙夕未 4用以接收從甸服器襄置12所發 k之異吊檢測專之處理結果, 出之資訊處理裝置。 且進订與處理結果對應之輸 :3係為本實施形態之群管理系統之區塊圖。另外,在 此為了方便說明,雖係舉半 ,„ 衷置11及客戶她驴署 13為一個之情形為例加以表首 义 、 惟半¥體製造農詈1〗;3完 戶端裝置13亦可為複數個。Ο FIG. 1 is a conceptual diagram of a group management system of the present embodiment. The group management system is, for example, a system for managing a manufacturing device such as a semiconductor manufacturing device or a liquid crystal panel manufacturing device. Further, the group management system includes one or more semiconductor manufacturing apparatuses U (from the semiconductor manufacturing apparatus 11a to the semiconductor manufacturing apparatus 11n) (only η means an arbitrary number), the server apparatus 12, and i or more clients (clients). Device 13 (client split (1) to client device - (only the claws represent any number)). One or more semiconductor manufacturing apparatuses 丨丨 and the server apparatus 12, and one or more of the client apparatus 13 and the server apparatus 12 are connected via a communication line, respectively, and information can be transmitted and received. Each device may be connected by, for example, a network such as an Internet, a wireless or wired L AN (Local Area Network), or may be connected by a Bluetooth (10) e t_h) (registered trademark) or the like. It is connected by wireless communication. In addition, it can be connected by a bus (10) 1 knal Bus, a universal bus bar, or an iieei 394 (standard bus interface). However, the connection method between the devices is not limited. In addition, the organization that transmits and receives information may be a communication organization or a communication organization. 128454.doc 200901269 Semiconductor Manufacturing 1 is a device for performing a specific semiconductor manufacturing process on a substrate to be processed, an exemplary wafer, or the like. The semiconductor device 11 is, for example, a film formation process. A conductor is subjected to various processes such as a film formation process, an etching process, and a thermal oxidation process. In the case of the semiconductor manufacturing apparatus u, the example of the semiconductor manufacturing apparatus 11 is shown in FIG. 2 in Patent Document 2, Patent Document 3, and the like. The semi-conductor manufacturing apparatus U is a so-called preload (lGad lGek) which is closably attached to the other chambers as a 1 (-g) chamber and is supplied with a vacuum gas as an inert sound producing gas. ) The device of the chamber structure. The semiconductor system is composed of the following main parts: a process chamber of the processing chamber (10) which is specially treated for the wafer of the object to be processed; and as a preload to h, it is provided for insertion and removal. As a transfer mechanism g of a wafer b of the holding body, the holding system accommodates a plurality of wafers w, for example, 100 wafers, with respect to the process conduit ;; and is carried out into the chamber core for relative to the preload The chamber h is moved out of the wafer w; the E box (the coffee box is called the 哭 容 埠 〇 (P〇rt) ac, which is formed in the unloading room ab; the take-in mechanism is used for this purpose. The box storage container is taken into the loading and unloading chamber: a container storage stage af for temporarily storing the taken-in box storage container ad; the box removing platform is called for receiving In the box storage container ad, if each r name · iv & I a 匣 C C is taken out; the container transfer mechanism ah, in the loading and unloading room ab into the (four) box storage container ad receiving and receiving; and the holder body The chamber ai' will be placed in the wafer boat between the preloading chamber h and the loading and unloading chamber a to accommodate. In addition, regarding the semi-guide in Fig. 2 The other parts and operations in the example of the manufacturing apparatus W are known in the prior art (refer to the patent literature), so the province 128454.doc • 14-200901269 is described in detail. In addition, in order to constitute a semiconductor manufacturing, it is patented. In the case of the outside of the chamber of the first embodiment, in the present embodiment, it is preferable that the above is not limited to the semiconductor manufacturing device 11a to the semiconductor device. The manufacturing device for processing may also be a feeding device. The manufacturing process of the same process is carried out, for example, the process parameters (re, '曰曰) for the information of the specific process. The parameter is controlled, and the semiconductor manufacturing device U system can be used to process the measurement information of the semiconductor device and detect the abnormality, and the device and the message are sent to the server device 12, which constitutes a bad "曰+ Γ about +conductor The manufacturing apparatus 11 has a measurement information for performing measurement in the semiconductor manufacturing and manufacturing apparatus n, and detects or processes the information in the semiconductor to send the mm device to == omit the description. The device 12 is a so-called group management system that uses a group of a plurality of semiconductor manufacturing devices, and the feeder device (10) can receive and store the semiconductor manufacturing device from (10) or more. u The information of various measurement information and the like transmitted, and has a function of performing frequent detection with respect to the measurement information. The feeder device 12 may have a semiconductor manufacturing device for storing or performing processing from the semiconductor manufacturing device u. In addition, the configuration in which the server device 12 processes the measurement information in the semiconductor manufacturing device U to detect an abnormality is described in the following description, and the description is omitted here, 128454.doc 200901269. In addition, the client device 13 is an information processing device that is sent to the field and is abnormally sent to receive the processing result of the different lifting detection issued by the device 12. And the order corresponding to the processing result is 3: The block diagram of the group management system of this embodiment. In addition, for the sake of convenience of explanation, although it is half-baked, „ 置 及 11 and the customer she signed 13 as a case for the first meaning, only half of the body to make farmland 1〗; 3 end of the device 13 Can be plural.

半導體製造裝置U係具備H 可用能資訊取得部112、發送部113。^一叫⑴、 感測器⑴係用以分別檢測在半導體製造過程中所使用 之1個以上之可用能。感測器丨u ° 係為铋測溫度、或壓力、 流量、電壓、電流等之物理量、 :r感測_係將表二檢:= 檢測量轉換為適當之資訊,例二:亦;;具有將此等 而加以輸出之構成。感測器⑴之輸出為值之資訊 亦可是數位信號。所謂可用自 i ^^類比仏唬’ 〇 用此係指在半導體製造過程中所 而要,供半導體製造裝置u 叫 < 電力或氣體、水等。在 此,供排氣用之排氣壓或供抽直 在 1 m ρ 〜用之抽吸壓等亦考庹為 可用此。通常’各感測器係檢一' 4,1 a ^ -T m Λ, 分千導體製造裝置11分別 j用可用月,,並將檢測量等發送至 體製造裝置Η。1個以上感測用…+導 J ^疋測定對象不同 同結構之感測器,亦可是包括相 、'、°構之感測器。通常, 128454.doc -16- 200901269 雖從感測器m在-定或不定期之特定之定時重複檢測變 化量,惟亦可依據檢測可用[身訊取得部ιΐ2等所輸出之 變化量之指示來檢測變化量。另外,由於感測器川之結 構作為電力儀、流量儀、壓力儀等已為一般所知,故在此 省略說明。The semiconductor manufacturing apparatus U includes an H available energy information acquisition unit 112 and a transmission unit 113. ^ One (1), sensor (1) is used to detect more than one of the available energy used in the semiconductor manufacturing process. The sensor 丨u ° is the measured physical temperature, or the physical quantity of pressure, flow, voltage, current, etc., :r sense _ is the second check: = the amount of detection is converted into appropriate information, example 2: also; It has the composition of outputting these. The output of the sensor (1) is a value information or a digital signal. The so-called available from i ^ ^ analog 仏唬 ' 〇 This refers to the semiconductor manufacturing process for the semiconductor manufacturing equipment called < electricity or gas, water and so on. Here, the exhaust pressure for supply and exhaust or the suction pressure for 1 m ρ ~ is also considered to be applicable. Usually, each sensor is inspected by a '4,1 a ^ -T m Λ, and the minute-conductor manufacturing apparatus 11 transmits the detected amount and the like to the body manufacturing apparatus, respectively. One or more sensing uses...+J J疋 The measuring object is different from the sensor of the same structure, and may also be a sensor including phase, ', and °. In general, 128454.doc -16- 200901269, although the sensor m repeatedly detects the amount of change at a specific timing of -determined or irregular, it can also be based on the indication that the amount of change outputted by the body acquisition unit ιΐ2 or the like is available. To detect the amount of change. Further, since the structure of the sensor is generally known as a power meter, a flow meter, a pressure gauge, etc., the description thereof is omitted here.

U 可用能資訊取得部112係用以取得作為表示關於在半導 體製造過程中所使用之⑽以上之可用能之值之資訊之可 用能資訊。具體而言,可用能資訊取得部112係用以取得 作為表不關於各感測器丨丨丨所檢測出之可用能之值之資訊 之可用能資訊。可用能資訊取得部112係例如接收用以表 不各感測器⑴所輸出之檢測量之資訊,且將此檢測量轉 換為表示可用能之值之資訊而獲得可用能資訊。此外,在 各感測器111輸出用以表示檢測值之資訊之情形下,亦可 直接取得此檢測值作為可用能資訊。此外,亦可設為可用 能資訊包括用以表示可用能資訊為何種可用能之值之識別 f訊:可用能資訊取得部112亦可將表示各感測器ln所取 /于之變化量之貧訊,直接從各感測器丨11取得,亦可讀取 ::表示各感測器m所輸出之變化量之資訊蓄積於記憶 …者。可用能資訊取得部112係依據預先指定之特定之 :%或特定之觸發(trigger)從感測器1"取得可用能資訊。 =用能資訊取得部112從感測器lu取得可用能資訊之定 太:觸發等並不予限定。可用能資訊取得部⑴係以判斷 =置之半導體製造裝置n之狀態,且依據本身裝置之 “而取侍各可用能資訊為較佳。所謂本身裴置之狀態, I28454.doc 200901269 ,體而言“本㈣置料運轉狀㈣是怠轉狀態之狀 ' 身I置在進行預先指定之特定之處理之狀態等。 所明依據本身農晉夕处、 被指定之狀離可以是在本身裝置之狀態成為 π 〜、清形下,進行或不進行可用能資訊之取 仔’亦:在本身裝置之狀態未成為被指定之狀態之情形 下’進行或不進行可用能資訊之取得。尤其是,可用能資 ===預先指定之定時,且本身裝置之狀態為 ,.〇 ^ 特疋之狀態之情形下,取得可用能資訊為較 此之疋時係為包括特定之時點(時刻),例如上午 19刀或特定之期間,例如上㈣時至上午 输之時期,例如上午1。時以後之時期等之概念。二 %了由工薇出f時等指^ ’亦可由使用者來指^。兹舉一 八Ί在可用能資訊取得部Π2設定為於預先指定之 時之上午6時以後之時期,本身裳置運轉之最初之時點取 付可用能資訊之情形下,在成為上午6時之時,本身襄置 =轉狀態之情形下’在該時點取得可用能資訊。料, 二、上午6時之時’若本身裝置非為運轉狀態,則在本身 、置成為運轉狀態之最初之時點取得可用能資訊, :用能資訊取得部112係在依各可用能資訊, 資訊之際之本身梦 J用月匕 裝置之狀4被個別指定之情形下,及本身 裝置依各可用能資訊被指定之狀態之情形下 用能資訊。此外,$時等可個別指定。上述㈣2 用半導f制、生壯 疋日寻係可使 之時刻之二ί = 1有之未圖示之時脈⑽叫等所輪出 、“來檢測。另外,亦可將使用者等操作輸入 128454.doc -38- 200901269 器件(device)等之時點,例如 指定之定時。可用#次1 之日守點等判斷為所 7用月匕貝訊取得部112以住 裝置之狀態均可。例如, 了方式檢測本身 裝置之未圖示之^^吿丨 亦可在將表示情況(status)之資 之控制体 蓴之運轉狀能 — 〇表不執行製程參數 等之運轉狀態之資訊加以輸 ^ 能、罗《韭-宣絲 出之障$下’判斷是為運轉狀 態還,轉狀態(怠轉狀態),或亦可判斷已明睁為= 狀態所輸出者之資訊是否從本身裝置判斷Ζ 為運轉狀態還是非運轉狀態。此外二斷疋否 1 1 ? -ή- όΓ Μ Α 了用月匕負訊取得部 112亦可藉由參照用以管 ^工作管理表(未圖示),來判斷本身裝置之狀態。可 -“ 牙衮置所執行之之工作(task) 用 能 貝訊取付部以任何方式來識別1個以上感測器⑴均可。例 二先^個以上輸入端子與感測器lu建立對應關係,而 ^用以表示從各輪人端子所輸人之檢測量之資訊等,判斷 二對於與該輸入端子建立對應關係之感測器⑴所輸人 之資訊,或亦可使用以識別感測器⑴之資訊包含在表示 j測Γ之資訊來進行發送。各感測器⑴與可用能資訊取 仔口 IU 12之連接可以是有線連接,亦可以是無線連接。此 在可用月t*貝Λ令係以包含用以表示經取得可用能資訊 Τ時刻之資訊、或先建立對應關係為較佳。此用以表示此 時刻之資訊係可從例如半導體製造裝置_之未圖示之區 塊等取得。此外’在可用能資訊中亦可包含用以識別作為 驗對象之可用能之識別資訊、或用以識別經檢測出可用 :之感測|§ 111之識別資訊等’或建立對應關係。可用能 資訊取得部112通常可從MPU(Micr〇_Pr〇cess〇r Unit,微處 128454.doc -19- 200901269 理器)或記憶體等來實現。可用能資訊取得部U2之處理順 序通常以軟體來實現,且該軟體係記錄於R〇M(ReadThe U available energy information acquisition unit 112 is configured to acquire available energy information as information indicating the value of the available energy of (10) or more used in the semiconductor manufacturing process. Specifically, the available energy information acquisition unit 112 is configured to acquire available energy information as information indicating the value of the available energy detected by each sensor. The available energy information acquisition unit 112 receives, for example, information indicating the detection amount output from each sensor (1), and converts the detection amount into information indicating the value of the available energy to obtain the available energy information. In addition, in the case where each sensor 111 outputs information for indicating the detected value, the detected value can be directly obtained as the available energy information. In addition, the available energy information may include an identifier for indicating the available energy information. The available energy information obtaining unit 112 may also indicate the amount of change taken by each sensor ln. The poor news is obtained directly from each sensor 丨11, and can also be read:: the information indicating the amount of change output by each sensor m is accumulated in the memory. The available energy information acquisition unit 112 obtains the available energy information from the sensor 1" according to a predetermined specific: % or a specific trigger. = The energy information acquisition unit 112 obtains the available energy information from the sensor lu. Too: Triggering or the like is not limited. The available energy information acquisition unit (1) is judged to determine the state of the semiconductor manufacturing device n, and it is preferable to take the available energy information according to the "device" itself. The state of the so-called self-disposal, I28454.doc 200901269, "This (4) stock operation mode (4) is the state of the tumbling state" The body I is placed in a state in which a predetermined treatment is performed in advance. According to the status of the farmer's day and night, it can be specified in the state of its own device to become π~, clear, with or without the available energy information. Also: in the state of its own device has not become In the case of the specified status, 'with or without the available energy information. In particular, when the energy can be === pre-specified timing, and the state of the device itself is, in the case of the state of the device, the available energy information is taken to be a specific time point (time) ), for example, 19 knives in the morning or a specific period, such as the period from the last (four) to the morning, such as 1 in the morning. The concept of time and later. 2% of the time when the worker Wei f and so on ^ ' can also be referred to by the user ^. In the case where the available energy information acquisition unit 2 is set to be at 6 o'clock in the morning before the time of the pre-designation, when the available energy information is taken at the initial time of the operation, it becomes 6 o'clock in the morning. In the case of the device itself = turn state, the available energy information is obtained at that time. 2. At 2 o'clock in the morning, if the device itself is not in operation, the available energy information is obtained at the beginning of the operation state, and the energy information acquisition unit 112 is based on the available energy information. In the case of the information, the dream J is used in the case where the shape of the monthly device is individually specified, and the information is used in the case where the device is designated according to the available energy information. In addition, $ hours, etc. can be specified individually. The above (4) 2 uses the semi-conductor f system, and the sturdy and sturdy day-to-day search system can make the time ί = 1 (the clock) (10), which is not shown, rotate, "to detect. In addition, users can also wait. Operation input 128454.doc -38- 200901269 The time of the device, etc., for example, the specified timing. It can be judged by the date of the #1 1 day, etc. For example, the method of detecting the device itself, which is not shown, can also be used to display the operational status of the control body of the status information, and the operation status of the process parameters. The input of the energy, the "韭-Xuansi's obstacle$$" is judged to be in the running state, the turning state (turning state), or it can be judged whether the information of the person who has been outputted as = state is from its own device. It is judged whether Ζ is in the running state or not in the running state. In addition, the second break is not 1 1 - ή - όΓ Α 用 用 用 用 匕 112 112 112 112 112 112 112 112 112 112 112 112 112 112 112 To determine the status of the device itself. - "The work performed by the gums (task) Pui pay information can take part in any way to identify one or more sensors can ⑴. In the second example, more than one input terminal is associated with the sensor lu, and ^ is used to indicate the information of the detection amount of the person input from each wheel terminal, and the second is determined to be associated with the input terminal. The information of the person input by the device (1) may also be used to identify that the information of the sensor (1) is included in the information indicating the test. The connection between each sensor (1) and the available energy information port IU 12 may be a wired connection or a wireless connection. It is preferable to include information for indicating the time at which the available energy information is obtained, or to establish a correspondence first, in the available month t*. The information for indicating the time is obtained from, for example, a block (not shown) of the semiconductor manufacturing apparatus. Further, the identification information of the available energy for identifying the object to be inspected may be included in the available energy information, or the identification information for detecting the available sensing: § 111 may be included or the correspondence may be established. The available energy information acquisition unit 112 can usually be implemented from an MPU (Micr〇_Pr〇cess〇r Unit, Micro Device 128454.doc -19-200901269) or memory. The processing order of the available energy information obtaining unit U2 is usually implemented in software, and the soft system is recorded in R〇M (Read

Memory,唯讀記憶體)等之記錄媒體。惟亦可以硬體(專用 電路)來實現。Recording media such as Memory, read only memory). However, it can also be implemented by hardware (dedicated circuit).

Ο 發送部113係用以將可用能資訊取得部112所取得之可用 能資訊發送至伺服器農置12。細113亦可纟可用能資 戒取付部112 —取得可用能資訊之後就發送可用能資訊, 或在可用能貢訊取得部112取得關於所有感測器I。之可用 能資訊之時點發送,發送之定時等均不予限定。此外,發 送部113為了使飼服器袭置12可判別可用能資訊是由哪一 個半導體製造裝置所發送之可用能資訊,亦可將本身裝置 之識別資訊等從未圖示之儲存部進行讀取,^與可用能資 訊建立對㈣係進行料。料部113通㈣細無線或 有線之通信機構來實現,惟亦可以傳播機構來實現。 伺服器裝置12係具備:接收部121、飼服器側判斷部 122、及伺服器側輸出部123。 伺服器裝置U係經由網路等而與對於被處理基板執行特 定之半導體製造過程之"固以上之半導體製造裝置連接。 接收部121係用以接收從半導體製造裝置U所發送之可 用能資訊。所接收之可用能資訊係例如暫時記憶於記憶體 等。接收部m亦可從各半導體製造裝置u接收與可用能 貧訊建立對應關係所發送之半導體製造裝置u之識別資 訊。此情形下,亦可使可用能資訊與半導體製造裝置"之 識別資訊建立對應關係而⑽蓄積。接收部⑵通常係藉 128454.doc -20. 200901269 由無線或有線之通信機構來實現,惟亦可藉由接收傳播之 機構來實現。 伺服器侧判斷部122係判斷用以表示接收部121所接收之 可用能資訊之可用能之值是否為特定之值。所謂特定之值 具體而言係為表示按可用能資訊區別之可用能資訊為正常 之值之情形之值、或值之範圍之資訊。例如,指定該特定 之值之範圍之上限或下限、或雙方之臨限值,係預先蓄積 於未圖示之記憶體等之儲存部,且伺服器側判斷部122係 用以讀取與接收部121所接收之可用能資訊對應之臨限 值,且判斷接收部121所接收之可用能資訊是否落在該所 讀取之臨限值所表示之範圍内。該按可用能資訊區別之臨 限值亦可設定為按半導體製造裝置丨丨區別之不同之值。可 用能資訊S關於何種可用能者,例如係依據包含於可用能 資訊之可用能之識別資訊來判斷。另夕卜使用於上述之異 常谓測之臨限值並不以預先指定之特定之值為限。例如, 作為是否為上述m值之判斷處理,亦可將用以表示 接收部m所接收之可用能資訊之可用能之值,與關於從 其他1個以上半導體製造裝置所獲得之相同可用能之可用 能資訊進行⑽,且使帛㈣之運算(如咖)來進行判 斷該比較結果之任一者是否在顯示為正常之範圍内之判斷 處理。伺服器侧判斷部122通常係可從Mpu或記憶體等來 實現。飼服器側判斷部122之處理順序通常係以軟體來實 現’而該軟體係記錄於R〇M等之記錄媒體。惟亦可以硬體 (專用電路)來實現。 128454.doc •21 · 200901269 伺服器側輸出部12 3係依據伺服器側判斷部12 2之判斷結 果來進仃輸出。所謂依據判斷結果之輸出係為例如用以表 = 產生異常之警報等之表示。此外,依據判斷 》出亦可為用以指示依據關於可用能之異常之產 而令止半導體製造裝置!】之製造過程,或輸出警報等 導體製造裝置i 1之指令(c〇mmand)2發送等。此外 f吏用用以表示在可用能中產生異常之資訊之電子郵件” 貝科通信等發送給預先指定之客戶端裝置13。此外 :製k裝置11之狀態於製程執行中之際異常偵測之情 輸出,亦可是用以指示暫時停止對於半導體製 / 製程(晶圓待機)或中斷(晶圓排出)或裝置停:等:八1之 =等。此外,半導體製造裝置u之狀態於怠轉= U偵測之情形之輸出’亦可是用以指示 際 (i則〇ck)或裝置停止等之指令等之發 巧始連鎖 出部123係例如從與可用能資訊建立對應關传 置11之識別資訊,判斷被判斷可用能之異常之半= ^置11。在此所述之輸出係為包括對㈣ 丁 印表機之印字、聲音輪出、外部之筆置。 於客戶端裝置u或半導體製造裝置u之發Ύ例如對 服器側輸出部1 23亦可考慮包括戈σ 、等之概念。伺 揚聲器等之輸出器件。飼服器側輪可出!二=顯示器或 :::體、或輸出—動器軟體器件 件與通信器件之驅動器敕體等來實現 件、或 客戶端裝置13係包括客〜接收部 及客 128454.doc 及客戶端側 200901269 輸出部132。 客戶端側接收部131係用以接收從飼服H裝置12所發送 之則康飼服器側判斷部122之判斷結果之資訊。例如,客 戶端側接收部j 3 i係用以接收使用電子郵件所發送之表示 ^可用旎中產生異常之資訊。此外’亦可接收與判斷結果 同發达之由何者半導體製造裝置u所檢測出之是否為關 於何者可用能之異當之眘 、貝訊。在此所述之電子郵件係包括The transmitting unit 113 is configured to transmit the usable information obtained by the available energy information obtaining unit 112 to the server farmer 12. The fine 113 may also transmit the available energy information after obtaining the available energy information, or obtain all the sensors I at the available energy acquisition unit 112. The time when the available information can be sent, the timing of the transmission, etc. are not limited. Further, the transmitting unit 113 can determine the available energy information transmitted by the semiconductor manufacturing device by the feeding device 12, and can also read the identification information of the device or the like from a storage unit (not shown). Take, ^ and the available energy information to establish (4) system materials. The material part 113 is realized by a (four) fine wireless or wired communication mechanism, but can also be realized by a communication mechanism. The server device 12 includes a receiving unit 121, a feeder side determining unit 122, and a server side output unit 123. The server device U is connected to a semiconductor manufacturing device that performs a specific semiconductor manufacturing process for a substrate to be processed via a network or the like. The receiving unit 121 is configured to receive the usable information transmitted from the semiconductor manufacturing apparatus U. The available energy information received is, for example, temporarily stored in a memory or the like. The receiving unit m can also receive the identification information of the semiconductor manufacturing apparatus u transmitted in association with the usable energy-supplied information from each of the semiconductor manufacturing apparatuses u. In this case, the available energy information can also be correlated with the identification information of the semiconductor manufacturing device and (10). The receiving unit (2) is usually implemented by a wireless or wired communication mechanism by means of 128454.doc -20. 200901269, but it can also be realized by a mechanism for receiving and transmitting. The server side determining unit 122 determines whether or not the value of the available energy indicating the available energy information received by the receiving unit 121 is a specific value. The specific value is specifically the value indicating the value of the available energy information that is different from the usable energy information, or the range of the value. For example, the upper or lower limit of the range of the specific value or the threshold value of both of them is stored in advance in a storage unit such as a memory (not shown), and the server side determination unit 122 is used for reading and receiving. The threshold information corresponding to the available energy information received by the unit 121 is determined, and it is determined whether the available energy information received by the receiving unit 121 falls within the range indicated by the read threshold. The threshold value distinguished by the available energy information may also be set to a value different from that of the semiconductor manufacturing apparatus. The available information S is about which of the available energy sources, for example, based on the identification information of the available energy contained in the available energy information. Further, the threshold value for the above-mentioned abnormality is not limited to a specific value specified in advance. For example, as a determination process as to whether or not the m value is the same, the value of the usable energy for indicating the usable energy information received by the receiving unit m may be the same as that obtained from the other one or more semiconductor manufacturing devices. The energy information can be used to perform (10), and the operation of 帛(4) (such as coffee) is performed to determine whether or not any of the comparison results is within the range of the normal display. The server side determination unit 122 is usually implemented by Mpu, memory, or the like. The processing order of the feeding device side judging unit 122 is usually implemented by software, and the soft system is recorded on a recording medium such as R〇M. However, it can also be implemented by hardware (dedicated circuit). 128454.doc • 21 · 200901269 The server side output unit 12 3 is output based on the judgment result of the server side determination unit 12 2 . The output based on the judgment result is, for example, a representation of an alarm indicating that an abnormality has occurred. In addition, the judgment can be used to indicate that the semiconductor manufacturing device is terminated based on the abnormality of the available energy! 】 The manufacturing process, or the output of an alarm, etc., the command of the conductor manufacturing device i 1 (c〇mmand) 2 is transmitted. In addition, an e-mail indicating that an abnormality is generated in the available energy is transmitted to the pre-designated client device 13. In addition, the state of the k-device 11 is abnormally detected during the execution of the process. The output may be used to indicate that the semiconductor system/process (wafer standby) or interrupt (wafer discharge) or device stop: etc. is temporarily stopped. In addition, the state of the semiconductor manufacturing device u is 怠The output of the case of the transition = U detection can also be used to indicate the command (i 〇 ck) or the stop of the device, etc., such as the coincidence of the output chain 123, for example, from the correlation with the available energy information. The identification information determines the half of the abnormality of the judged usable energy = ^ set 11. The output described herein includes the printing of the (4) Ding printer, the sound wheel, and the external pen. For example, the output of the semiconductor manufacturing device u can be considered, for example, the concept of including the σ σ, etc. The output device of the speaker or the like. The side wheel of the feeding device can be output! II = display or ::: Body, or output-driver software device and The device driver or the like device or the client device 13 includes a guest-receiving portion and a guest 128454.doc and a client-side 200901269 output portion 132. The client-side receiving portion 131 is configured to receive the slave-feed device H. The information of the judgment result of the sent-on-service device side judging unit 122 is transmitted. For example, the client-side receiving unit j 3 i is configured to receive information indicating that an abnormality is generated in the available e-mail transmitted by using the e-mail. 'It is also possible to receive a testimony as to which of the semiconductor manufacturing devices u have developed, and whether it is a matter of concern about whether or not the available energy is available. The emails described herein include

所謂WEB郵件。宏冷,山,a, & |Λ_ A _客戶知側接收部⑶係藉由有線或無線之 步\ 來實現。此外’在異常通知資訊使用電子郵件 送:下’亦可包括電子郵件之軟體等、或用以執 订此之MPU或記憶體等。 客戶^則輸出部132係用以輸出客戶端側接收部⑶所接 收之異常通知資訊。在此所述 < 輸+ # & 之顯示、對於外部,置之對於顯示器 μ 置之發送、對於記憶媒體等之蓄積儲 存等之概念。例如,亦可暫 等之記憶…,通貧訊蓄積於硬碟 W罕體專,且進'—步依撼宜- 4、ΔΡ7 之異常通知資訊顯示於顯示器等發’將該蓄積 可考慮包括或可考岸不包括 Μ輸出部132亦 卞乜小a括顯不斋等之輸出器 端側輸出部〗32係可藉由輪出器件之 專客戶 器件之驅動器軟體與輸出器件等來實現/人體、或輸出 接著使用圖4之流程圖來說明半導體製造裝 此作為一例,茲設為半導體製造裝置〗21 可用能之叭以系丨以上之整數π、 /、有用以檢測 丄 < 正致)個之感測器 k(l gkgs)個感測器所檢二 使用由第 H 4可用能資訊取 I28454.doc -23- 200901269 得部112取得關於第k個之可用能之可用能資訊者。 (步驟S401)可用能資訊取得部112係將j代入於計數器 (counter)k。 (步驟S 4 0 2 )可用能資訊取得部丨丨2係判斷是否為取得第k 個可用能資訊之定時。例如,判斷是否已經過了作為用以 取得第k個可用能資訊之時刻所指定之時刻。若為取得第k 個可用能資訊之定時之情形下,前進至步驟S4〇3,若非為 定時之情形下,則前進至步驟84〇6。另外,在定期性或不 定期重複取得可用能資訊之情形等中,亦可在對於取得第 k個可用能資訊之定時一度取得第k個可用能資訊之後,直 至取得新的第k個可用能資訊之定時來到為止,判斷為非 為取得第k個可用能資訊之定時。 (步驟S403)可用能資訊取得部i丨2係判斷是否為由本身 裝置之半導體製造裝置1 1取得第k個可用能資訊之狀態。 例如,取得各可用能資訊之際,用以表示半導體製造裝置 11是否需為何種狀態之資訊係儲存於未圖示之記憶體等, 而將該記憶體等之資訊與表示本身|置之狀態乂資訊進行 比較’以判斷是否為要取得可用能資訊之狀態。若為要取 得第k個可用能資訊之狀態之情形下,則前進至步驟 S4〇4,右非為要取得之狀態之情形下,則前進至步 S406 〇 a (步驟S4〇4)可用能資訊取得部112係取得第让個可用能資 X、體而5,係取得用以表示第k個感測器111輸出之可 用此之檢測量之資訊,並將此所取得之資訊例如轉換為數 128454.doc -24 - 200901269 值等’而取得可用能資訊。在可用能資訊 表示第k個可用能資訊之資m 匕括用以 等之資訊、或建立對應關係。付可用此資訊之日時 (步驟S405)發送部113係將在步驟s4〇” 能資訊發送至伺服器裝置12。 侍之可用 (步驟S406)可用能資訊取得部112係將計數器咖】The so-called WEB mail. Macro cold, mountain, a, & |Λ_ A _ customer knowing side receiving unit (3) is realized by wired or wireless step\. In addition, 'in the abnormal notification information using e-mail: down' may also include e-mail software, etc., or to compose the MPU or memory. The client ^ output unit 132 is for outputting the abnormality notification information received by the client side receiving unit (3). Here, the display of < input + # &, externally, the concept of the transmission of the display, the storage of the memory medium, and the like. For example, you can wait for the memory..., the poverty alleviation is accumulated on the hard disk, and the abnormal notification information of the 'steps 撼 - - 4, ΔΡ 7 is displayed on the display, etc. 'This accumulation can be considered to include Or the test shore does not include the output part of the output unit 132, and the output side of the output side of the output unit is 32. It can be realized by the driver software and the output device of the dedicated device device of the device. The human body or the output will be described with reference to the flowchart of FIG. 4, and the semiconductor manufacturing device will be described as an example. It is assumed that the semiconductor manufacturing device can use the integer π or more of the system to detect 丄 < The sensor k (l gkgs) of the sensor is used by the second H 4 available energy information I28454.doc -23- 200901269 The department 112 obtains information about the available energy of the kth . (Step S401) The available energy information acquisition unit 112 substitutes j into the counter k. (Step S 4 0 2 ) The available energy information acquisition unit 2 determines whether or not the timing of acquiring the kth available energy information is obtained. For example, it is judged whether or not the time specified as the time for obtaining the kth available energy information has passed. If the timing of the kth available energy information is obtained, the process proceeds to step S4〇3, and if it is not the timing, the process proceeds to step 84〇6. In addition, in the case where the available energy information is repeatedly obtained periodically or irregularly, the kth available energy information may be obtained after the kth available energy information is obtained at the timing of obtaining the kth available energy information until a new kth available energy is obtained. When the timing of the information arrives, it is judged that it is not the timing for obtaining the kth available energy information. (Step S403) The available energy information acquisition unit i丨2 determines whether or not the state of the kth available energy information is obtained by the semiconductor manufacturing apparatus 1 1 of the own device. For example, when the available information is obtained, information indicating whether or not the state in which the semiconductor manufacturing apparatus 11 is required is stored in a memory or the like (not shown), and the information of the memory and the like and the state of the representation itself are set.乂Compare information to determine if it is the status of the available energy information. If the state of the kth available energy information is to be obtained, the process proceeds to step S4〇4, and if the right is not the state to be acquired, the process proceeds to step S406 〇a (step S4〇4). The information acquisition unit 112 obtains the first available energy X, the body 5, and obtains information indicating the available detection amount output by the kth sensor 111, and converts the obtained information into, for example, a number. 128454.doc -24 - 200901269 Value, etc., to obtain available energy information. In the available energy information, the information of the kth available energy information is included in the information, or the correspondence is established. When the date when the information is available is available (step S405), the transmitting unit 113 transmits the information to the server device 12 in step s4. The service is available (step S406) the available energy information obtaining unit 112 sets the counter.

(步驟S407)可用能資訊取得部112係判斷計數器J(Step S407) The available energy information acquisition unit 112 determines the counter J

大。若較s大之情形下,回到步驟剛,若為s以下:乂: 下,則回到步驟S402。 月形 另外’亦可使半導體製造裝Μ包括未圖示之接收 控制部等,且於從伺服器裝置12發送命令等之資訊之情形 下,由半導體製造裝置11之接收部等接收從飼服器裝置^ 所發送之命令等之資訊,且將依據此命令等之處理:由半 導體製造裝置11之控制部等來執行。例如,從伺服器裝置 12,將輸出用以表示在半導體製造裝置丨丨所利用之可用能 中產生異常之警報之命令發送之情形下,亦可藉由接收部 接收該命令,並藉由控制部之控制而使半導體製造裝置U 輸出警報。 此外,在此,雖係在取得各可用能資訊之時點,將所取 得之可用能資訊發送至伺服器裝置12,惟亦可在複數個可 用能貧訊齊備之時點,將所取得之可用能資訊批次地發送 給伺服器裝置12。 另外’在圖4之流程圖中,藉由電源切斷(〇ff)或處理終 了之中斷而終了處理。 128454.doc -25- 200901269 以下使用圖5之流程圖說明本實施形態之伺服器裝置之 具體之動作。 (步驟S501)接收部121係判斷是否接收了可用能資訊。 若為有接收之情形下,則前進至步驟S5〇2,若為未接收之 情形下’回到步驟S501。 η (步驟S502)伺服器側判斷部122係讀取預先儲存於未圖 不之記憶媒體等之在步驟S501中所接收之與可用能資訊對 應之臨限值之上限值、及下限值。僅指定上限值或下限值 之一方之情形下,僅讀取該—方。與可用能資訊對應之臨 限值係取得可用能資訊中所包含之用以表示可用能之識別 資訊、或半導體製造裝置U之識別資訊等作為檢索鍵等。 (步驟S503)祠服器側判斷部122係判斷在步驟s5〇i中所 接收之可用能資訊所表示之值是否為在步驟㈣中所讀取 之下限值以上。若為下限值以上之情形下,則前進至步驟 S504 ’若非為下限值以上主 工< h形下,則前進至步驟S5〇5。 另外,在步驟S502中未讀& π Λ u 木λ取下限值之情形下,此處Big. If it is larger than s, return to the step just now, if it is s or less: 乂: Next, return to step S402. In addition, the semiconductor manufacturing device may include a receiving control unit (not shown) and the like, and when receiving information such as a command from the server device 12, the receiving device of the semiconductor manufacturing device 11 or the like receives the feeding device. The information of the command or the like transmitted by the device is based on the processing of the command or the like: it is executed by the control unit of the semiconductor manufacturing apparatus 11 or the like. For example, in the case where the server device 12 outputs a command for indicating an alarm that an abnormality is generated in the usable energy used by the semiconductor manufacturing device, the receiving unit may receive the command and control it. The semiconductor manufacturing apparatus U outputs an alarm by the control of the part. In addition, here, although the available energy information obtained is sent to the server device 12 at the time of obtaining the available energy information, the available energy can be obtained at the time when the plurality of available energy is available. The information is sent to the server device 12 in batches. Further, in the flowchart of Fig. 4, the processing is terminated by the power-off (〇 ff) or the interruption of the processing. 128454.doc -25- 200901269 The specific operation of the server device of the present embodiment will be described below using the flowchart of Fig. 5. (Step S501) The receiving unit 121 determines whether or not the available energy information is received. If there is reception, the process proceeds to step S5〇2, and if it is not received, the process returns to step S501. η (Step S502) The server side determination unit 122 reads the upper limit value and the lower limit value of the threshold value corresponding to the available energy information received in step S501, which is stored in advance in a memory medium or the like that is not shown. . In the case where only one of the upper or lower limit is specified, only the square is read. The threshold corresponding to the available energy information is obtained by using the identification information indicating the available energy or the identification information of the semiconductor manufacturing apparatus U included in the available energy information as a search key or the like. (Step S503) The server side judging section 122 judges whether or not the value indicated by the usable energy information received in the step s5〇i is equal to or higher than the lower limit value read in the step (4). When the value is equal to or greater than the lower limit value, the process proceeds to step S504. If the process is not lower than the lower limit value, the process proceeds to step S5〇5. In addition, in the case where the unread & π Λ u wood λ is taken to the lower limit in step S502, here

省略。 J (步驟S504)伺服器你丨主丨i ^ / J斷β 122係判斷在步驟S5〇丨中 接收之可用能資訊所表示 <值疋否為在步驟S502中所讀取 之上限值以上。若為上限, s^〇1 ? ^ 下之情形下,則回到至步驟 ,右非為上限值以下之τ .^ 之清形下,則前進至步驟S505。 另外,在步驟S502中未讀取, 省略。 未為取上限值之情形下,此處理予以 (步驟S505)伺服器側輪 邛12 3係例如藉由電子郵件等 128454.doc *26- 200901269 將與在步驟S5CU中所接收之可用能資訊對應之半導體製造 裝置11所利用之可用能中產生異常之資訊,發送至預先所 指定之客戶端裝置。 (步驟S506)伺服盗側輸出部〗23係對於與在步驟S5〇1中 所接收之可用能資訊對應之半導體製造装置丨丨,發送用以 執行與在該半導體製造裝置_制之可職中產生異常 之情形對應之特定之處理之命令等之資訊。該命令係例如 為用以輸出表示在半導體製造裝置u產生了異常之警報之 命令、或用以使半導體製造裝置u停止異常之命令等。然 後’回到步驟S501。 另外,在圖5之流程圖_,藉由電源切斷或處理終了之 中斷而終了處理。 、 /簡單說明客戶端裝置13之動作。客戶端側接收部131 係重複判斷是否已接收了從伺服器裝置12所發送之與伺服 器側判斷部122之判斷結果對應之資訊,若有接收之情形 下,客戶端側輸出部〗32係輸出客戶端側接收部131所接收 、常通知貝訊。另外,客戶端側接收部13 1例如藉由電 子郵件等接收㈣服器裝置12所發送之資訊之情形;,亦 :使客戶制輸出部132顯示用以表示接收了電子郵件之 貝广且於其後在由未圖示之接收部等接受了由使用者之 ^不之情形下’顯示從伺服器裝置12所發送之資訊。 接著說明本實施形態之群管理系統之具體例。至於群管 理系統之概略圖係與圖1同樣。 百先’在此係設為i個半導體製造裝置u具有複數個感 128454.doc 27· 200901269 測器111者。此等各感測器nl係設為以特定之時間間隔, 例如1秒間隔重複進行在半導體製造裝置11中所利用之可 用月b之測定,且將用以表示所檢測之可用能之量之資訊, 在一檢測之後就輸出至可用能資訊取得部U2等。 圖6係為用以管理複數個感測器⑴與各感測器⑴所測 定之可用能之對應關係之可用能管理表。可用能管理表係 具有作為各感測11111之識射訊之「感測H名」、各感測 °r° 1斤測^之可用能之識別資訊、在此係為可用能之名稱之 可用此名」、作為從各感測器所輸出之可用能所獲得之 可用能之值之單位之Γ I 乂六 Ώ μ 羊位」、及作為分別連接有各感測 益in之輸入端子(未圖示 ;w編唬之「輸入端子編 號」’來作為屬性。 ^此外’圖7係為用以指定取得可用能資訊之定時、及取 得可用能資訊之際之半導體製 裝置11之狀態之取得定時 狀I s理表。取得定時狀態管 夕 ^ ^ 表係具有上述之「感測器 名」、作為要取得之定時之「 疋寺」'及作為指定要取得之 (V、之+導體製造裝置丨丨 屬性。之狀態之貪訊之「狀態」,來作為 屬〖生。「定時」在此係為每日拄 ㈡之時刻。此外,「狀能,将為 該取得定時狀態管理表中,— "’、 離类-你/曰 個圮錄之「定時」及「狀 〜、」表不取侍用以表示從與「 111所鈐山> 盗名」對應之各感測器 所輸出之可用能之量之資 11之狀能如 貝訊之定時及半導體製造裝置 之狀怨。另外,在此係作為 :«· 4 , Λ 5哉別要測疋之可用能之 貝汛,雖係使用在可用能之 J用月匕之 么,也 列天中所使用之「感測哭 名」,惟只要可識別可用能, ^°° 則亦可使用上述之「可用能 128454.doc -28· 200901269 名」、或「輸入端子編號,篝,,v & 峒十、釉现」寻,U取代「感測器 庠會士,可用能資訊取得部112係針對圖7所示之各 複判斷目前之時刻是否與「定時」屬性所表_ :依 一致或為已經過「定時」屬性所表_ 不之時刻 总去「6 才」屬Γ生所表不之時刻之時刻。 ,疋時」屬性所表示之時刻係於與 致或已經過時刻之情形下,取得表示目=刻- 置11之運轉狀態之資訊,且比較該記錄造袭 表示之狀態、及表示所取得之運轉狀態之資屬性所 具體而言,目前之時刻若設為「 取:部"2首先將取得定時狀態管理表:’最可用能資訊 「定時」屬性與目前之時刻進 :初之5己錄之 」之記錄之「定時感測器 可用::丰導體製造裝置11目前不執行製程參數, 了用犯貝訊取得部112所取得之目前之半 而表示 之運轉狀態之資訊若設為「 裝置u 幺达「 心得尹」’則判斷「 性:二s:°:」之記錄之「狀態」屬性是否為〜Γ11 注亦即「怠轉申,。扃士及I, 々致之屬 「S001之1 '、飞斷「感測器名 -之半導體製造裝置u之運轉狀態轉中」’與表示目 用能資訊取得部⑴即決定取得「感^生名—致。轉此,可 之感:器⑴所輸出之可用能之檢測量/」為「S00lj 接著,從圖6所示之管理表,冑 名J為「S001」之記錄 W。檢測「感測器 端子編號」之「_ 記錄所包含之「於入 I28454.doc 」 _」。再者,經由輪八端子、輪2 -29- 200901269 :得用以表示連接於該「P001」之編號之輸入端子之感測 盗111所輪出之可用能之檢測量之資訊。再者,將表示該 檢測量之資訊’轉換成相同記錄t「單位」屬性所表示之 單位之檢測值。在此,例如將藉由檢測量之轉換所獲得之 檢測值設4「95」。再者,構成包含下列之可用能資訊: 該檢測值·’相同記錄之「感測器名」I性;及目前之日時 ,「2_5/22 G9: GG:1G」之資訊。藉此,即取得關於 議」之感測器111之可用能資訊。可用能資訊取得部 112所取侍之可用能資訊係被發送至伺服器裝置12。另 外’兹設為在可用能資訊中附加有作為發送目的地之半導 體製造裝置η之識別資訊之「TE5G1」而發送者。在此, 作為一例1說明在可取得各可用能資訊之時點,將各可 發送至伺服器裝置12之情形。惟亦可在將複數個 訊暫且蓄積於記憶體等之後,批次將複數個可用 月匕貧讯發送至伺服器裝置丨2 〇 :著二可用能資訊取得部112係比較取得定時狀態管理 ^I個a錄之「定時」屬性與目前之時刻,並判斷 瞎列― 」之°己錄之「定時」屬性與目前之 接著半導體製造裝置11§前不執行製程參數, 不可用旎身訊取得部112所之 裝置U之運轉狀態之資訊若設為 』之二=造 測器名」為「咖」之記錄之‘;^則判斷感 屬性、亦即「怠轉中 h 」屬性是否為一致之 「S002 , 」在 係判斷「感測器名」為 …己錄之「狀態」屬性為「怠轉中」,與表示目 128454.doc -30· 200901269 前之半導體製造裝置n之運轉狀態之屬性不一致。藉此, 可用能資訊取得部112即決定目前時點不取得「感測器 名」為「S002」之感測器1U所輸出之可用能之檢測量。 接著’可用能資訊取得部112係比較取得料狀態管理 表之下一個記錄之「定B车 Μ M a ^ 疋日f」屬性與目前之時刻,判斷「感 測器名」4「S003」之記錄之「定時」屬性與目前之時刻 不-致,亦非為較目前之時刻更之前之時刻。藉此,可用 能貧訊取得部112即決定在目前時點不取得「感測器名」 為「S〇〇3」之感測器lu所輸出之可用能之檢測量。 同樣之處理針對取得定時狀態管理表之各記錄整個重 複之後’再度針對未取得之可用能資訊之記錄重複同樣之 處理。 在此,或設為時間經過而時刻成為「9 : 〇5」,且在此時 點半導體製造農置i!開始製程參數之執行。Omitted. J (step S504) the server 丨 丨 i ^ / J 断 β 122 is judged that the available energy information received in step S5 所 is represented by < value 疋 is the upper limit value read in step S502 the above. If it is the upper limit, in the case of s^〇1 ? ^, the process returns to the step, and if the right is not the upper limit of the upper limit value, the process proceeds to step S505. In addition, it is not read in step S502, and is omitted. In the case where the upper limit is not taken, the process is (step S505) that the server side rim 12 is to be able to receive the available energy information in step S5CU, for example, by e-mail or the like 128454.doc *26-200901269. The information on the abnormality of the usable energy used by the corresponding semiconductor manufacturing apparatus 11 is transmitted to the client device specified in advance. (Step S506) The servo thief-side output unit 23 transmits the semiconductor manufacturing apparatus corresponding to the available energy information received in step S5〇1 for execution and execution in the semiconductor manufacturing apparatus. The information of the specific processing order, etc., in the case of an abnormality. The command is, for example, a command for outputting an alarm indicating that an abnormality has occurred in the semiconductor manufacturing apparatus u, or a command for causing the semiconductor manufacturing apparatus u to stop an abnormality. Then, it returns to step S501. Further, in the flowchart of Fig. 5, the processing is terminated by the interruption of the power supply or the interruption of the processing. / / Briefly explain the action of the client device 13. The client side receiving unit 131 repeatedly determines whether or not the information corresponding to the determination result of the server side determining unit 122 transmitted from the server device 12 has been received, and if there is reception, the client side output unit is 32. The output client side receiving unit 131 receives and frequently notifies the beacon. In addition, the client side receiving unit 13 1 receives the information transmitted by the server device 12 by, for example, an e-mail or the like; and: causes the client system output unit 132 to display the message indicating that the e-mail has been received. Thereafter, the information transmitted from the server device 12 is displayed when the user or the like is received by a receiving unit or the like (not shown). Next, a specific example of the group management system of the present embodiment will be described. The schematic diagram of the group management system is the same as that of Fig. 1. In this case, it is assumed that i semiconductor manufacturing apparatuses u have a plurality of senses 128454.doc 27· 200901269 detector 111. Each of the sensors n1 is configured to repeat the measurement of the usable month b utilized in the semiconductor manufacturing apparatus 11 at specific time intervals, for example, at intervals of one second, and to indicate the amount of available energy detected. The information is output to the available energy information acquisition unit U2 and the like after a detection. Figure 6 is an energy management table for managing the correspondence between the plurality of sensors (1) and the available energy measured by each of the sensors (1). The available energy management table has the identification information of the "sensing H name" as the sensing information of each sensing 11111, and the available energy of each sensing °r ° 1 kg test, which is available as the name of the available energy. "This name", as a unit of the usable energy value obtained from the available energy output from each sensor, I 乂6Ώ μ sheep position", and as input terminals respectively connected with respective sensing benefits in (not The "input terminal number" is compiled as an attribute. ^In addition, FIG. 7 is the acquisition of the state of the semiconductor device 11 for specifying the timing of obtaining the available energy information and obtaining the available energy information. The timing state is obtained. The timing state is obtained. The system has the above-mentioned "sensor name", the "疋寺" as the timing to be obtained, and the designation (V, + conductor manufacturing). The "state" of the state of the device is attributed to the "state" of the greed, as the genus of the genus. The "timing" is the time of the daily 拄 (2). In addition, the "characteristic energy" will be in the obtained timing state management table. , — "', from the class - you / 曰 圮 之 之 之 之 「 及The "form ~," table is not used to indicate the amount of available energy output from each sensor corresponding to "111 钤山> 偷 ”, such as the timing and semiconductor of Beixun. In the case of manufacturing equipment, it is also called: «· 4 , Λ 5 哉 Do not want to measure the available energy of the shellfish, although it is used in the available energy of the moon, it is also listed in the center. Use "sense crying", but as long as the available energy can be identified, ^°° can also use the above-mentioned "available energy 128454.doc -28· 200901269 name", or "input terminal number, 篝, v &峒10, glaze is now found, U replaces the “sensor 庠 庠 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , For the time when the "timed" attribute has been _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ , obtaining information indicating the operating state of the target = engraving - 11 and comparing the status of the recording instructing representation and the table Specifically, the current time of the asset status is set to "take: part" and 2 will first obtain the timing status management table: 'the most available energy information' "timing" attribute and the current time: "The recording of the first time has been recorded" "Timed sensor available:: The Feng conductor manufacturing device 11 does not currently execute the process parameters, and the information on the operating state indicated by the current half obtained by the Bayer acquisition unit 112 If it is set to "Device u 「 "心得尹", then it is judged whether the "status" attribute of the record "Sex: two s: °:" is ~Γ11 Note, that is, "怠转申,.扃士和I, 々 In the case of "S001 1", the "sensor state of the semiconductor device manufacturing device u" is broken, and the target energy information acquisition unit (1) determines that the "sensory name" is obtained. In this case, the detection amount of the available energy outputted by the device (1) is "S00lj. Next, from the management table shown in Fig. 6, the name J is the record W of "S001". Detect "Into I28454.doc" in the "_ Record" of the "Sensor Terminal Number". Further, via the eight-terminal terminal, the wheel 2 -29-200901269: information indicating the amount of detection of the available energy that is detected by the thief 111 connected to the input terminal of the number of the "P001". Further, the information indicating the detected amount is converted into the detected value of the unit indicated by the "record" attribute of the same record t. Here, for example, the detection value obtained by the conversion of the detection amount is set to 4 "95". Furthermore, the composition includes the following available energy information: the detection value · 'the sensor name of the same record I'; and the current date, "2_5/22 G9: GG: 1G" information. Thereby, the available energy information of the sensor 111 is obtained. The available energy information of the available energy information acquisition unit 112 is transmitted to the server device 12. In addition, it is assumed that "TE5G1" which is the identification information of the semiconductor manufacturing apparatus η as the transmission destination is added to the available energy information. Here, as an example 1, a case will be described in which each of the available energy information can be acquired and transmitted to the server device 12. However, after a plurality of messages are temporarily accumulated in the memory or the like, the batch transmits a plurality of available monthly information to the server device 丨2: The second available energy information obtaining unit 112 compares the acquired timing state management^ I have recorded the "timing" attribute and the current time, and judged that the "timing" attribute of the column "" has not been executed before the semiconductor manufacturing device 11 §, and is not available. If the information of the operating state of the device U in the unit 112 is set to "the second = the name of the tester" is the record of "the coffee", and the judgment attribute, that is, the "h" attribute is consistent. "S002," determines that the "sensor name" is... the "status" attribute of the record is "turning to the middle", and the operating state of the semiconductor manufacturing device n before the display 128454.doc -30·200901269 Inconsistent attributes. Thereby, the available energy information acquisition unit 112 determines the detection amount of the available energy output from the sensor 1U whose "sensor name" is "S002" at the current time point. Then, the available energy information acquisition unit 112 compares the attribute of the "fixed car Μ M a ^ 疋 day f" of the next record of the material state management table with the current time, and determines the "sensor name" 4 "S003". The "timing" attribute of the record is not related to the current moment, nor is it a moment before the current moment. Thereby, the usable energy acquisition unit 112 determines that the detection amount of the usable energy output from the sensor lu having the "sensor name" of "S〇〇3" is not obtained at the current time. The same process repeats the same process for the record of the available energy information that has not been acquired after the entire record of the obtained timing state management table is repeated. Here, it is assumed that the time has elapsed and the time is "9: 〇5", and at this time, the semiconductor manufacturing facility is started!

U ^茲°又為在此疋蚪,藉由重複由可用能資訊取得部 112進仃之上述之處理,以進行取得定時狀態管理表之 士感測态名」^ r s〇〇2」之記錄之「定時」屬性與目前之 才」之比幸父。可用能資訊取得部112係判斷該「定時」屬 L所表不之%刻與目前之時刻一致。接著,由於半導體製 以裝置U目W執行製程參數,因此表示可用能資訊取得部 112所取传之目前之半導體製造裝置11之運轉狀態之資訊 係成為「運轉中」。再者,判斷「感測器名」為「s〇〇= 之6己錄之「狀態」屬性是否為—致之屬性、亦即「運轉 中」在此,係判斷「感測器名」為「S002」之記錄之 I28454.doc • 31 - 200901269 狀態」屬性為「運轉φ 一 置u之運轉狀態之屬性」致與目前之半導體製造裝 112即決定在目前時 3 了用能資訊取得部 f』取侍「感測器名 測器111所輸出之可用自為S002」之感 j用此之檢測量。 接著,從圖6所示之管 名」為「_2」之纪錄表藉由檢索檢測「感測器 端子替之「/ 取得在該記錄所包含之「輸入 …號」之「Ρ002」β再者, 俶ί口 ra - + 吨于丨P002」而 取什用以表不連接於該「 ^ n, ^ . 」之、扁#u之輸入端子之感測 為m所輸出之可用能之檢 拾韦,丨旦夕1 3 再者,將表示該 檢測里之貝訊’轉換成相 %认, 乂相冋s己錄之早位」屬性所表示之 早位之檢測值。在此,例 ^將藉由檢測置之轉換所獲得之 檢測值設為「19」。再去,视> A人 者構成包含下列之可用能資訊: 該檢測值;相同記錄之「咸 、 4利尧名」屬性之屬性值;及目 前之日時之「2007/05/22 〇9 . · η ^ z⑽.〇5 . 15」之資訊。藉此,即 取得關於「S002」之感、、目,丨gg ,,,Λ m 您琢測盗111之可用能資訊。可用能資Further, in this case, by repeating the above-described processing by the available energy information acquisition unit 112, the record of the sense state name "^ rs〇〇2" of the acquisition timing state management table is obtained. The "timing" attribute is better than the current one. The available energy information acquisition unit 112 determines that the % of the "timing" genre L matches the current time. Then, since the semiconductor manufacturing apparatus U is configured to execute the process parameters, the information indicating the operating state of the semiconductor manufacturing apparatus 11 currently received by the usable information acquiring unit 112 is "in operation". Furthermore, it is judged whether the "sensor name" is "s" = the "status" attribute of the recorded status is "the attribute", that is, "in operation", the "sensor name" is determined as I28454.doc of the record "S002" • 31 - 200901269 The state of the operation is "the attribute of the operation state of the operation φ, and the operating state of the operation state" is determined by the current semiconductor manufacturing equipment 112. The detection amount of the "supplied from S002" outputted by the sensor name detector 111 is used. Then, from the record list of the pipe name "_2" shown in FIG. 6, the "sensor terminal is replaced by the search sensor" and the "input code number" included in the record is obtained. , 俶 口 mouth ra - + ton in 丨 P002" and used to indicate that the input terminal of the "^ n, ^ . ”, flat #u is sensed as the output of the available energy output of m Wei, 丨 夕 1 1 3 Furthermore, the detection value of the early position indicated by the property of Beixun 'converted to phase % recognition, 乂 冋 s recorded early position' in the test. Here, the example ^ is set to "19" by detecting the detection value obtained by the conversion. Going again, the subject> A person constitutes the following available energy information: the detected value; the attribute value of the "salty, 4 nickname" attribute of the same record; and the current date of "2007/05/22 〇9 · η ^ z(10).〇5 . 15" information. In this way, you can get the information about "S002", the purpose, 丨 gg,,, Λ m. Available energy

L 訊取得部112所取得之可心資訊隸發送至飼服哭裝置 12 ° 此外,若設為時間經過而在時刻成為「9: 1〇」之時 點,半導體製造裝置11持續製程參數之執行’則與上述同 樣,取得關於「S003」之感測器lu之可用能資訊,且發 送至伺服器裝置1 2。 在伺服器裝置12中’首先係由接收部121接收包括從半 導體製造裝置11所發送之「讓」之感測器名之可用能資 訊。然後從記憶豸等讀取與所接收之可用㉟資訊對應之用 128454.doc -32· 200901269 以指定可用能資訊所表示之值之正常值之範圍之上限值盘 下限值。此上限值等係設為藉由使用者等而預先指定者y 圖8係為管理用以指定正常值之範圍之資訊之正 管理表。正常範圍管理表係具有作為半導體製造農置Μ 識別資訊之「裳置識別資訊」、上述之 為正常值之範圍之下限值之「下限 」作為正常值之範 圍之上限值之「上限值」、作為可用能之單位之「 而作為屬性。 」’ 伺服器側判斷部122係檢索正常範圍管 i固g理表之附加在接 收部121所接收之可用能資訊之半 卞等體製造裝置Π之識別 貝訊,在此係「TE501」與「裝置識 J貝汛」一致之記錄 之中’在可用能資訊中所包含之感 级捌益名之屬性與「感測 器名」一致之記錄。再者,讀取該 必π£*錄之「下限值」與 上限值」。在此’首先由於接收包括「s 琴 名之可用能資訊,因此讀取「9〇」 / 口 」F兩下限值、「125 |作 為上限值。 祠服器側判斷部122係比較所讀 〜 卩限m」之 90」與接收部1 2 1所接收之可用能 』用月b貝矾所表示之值之 95」。在此,係判斷為下限值以上。 接著,伺服器側判斷部122係比 权所5賣取之「上限值」 之1 25」與接收部12 1所接收之可用次 队< j用迠貪訊所表示之值之 95」。在此係判斷為下限值以下。 藉此,即判斷為接收部121所接收之可用能資訊所表示 之值為正常之值。因此,結果即藉由伺服器側判斷部122 128454.doc -33、 200901269 判斷為與半導體製造裝置11之感測器名「S001」對應之感 測1§ 111所檢測出之可用能為正常。 伺服1§側輸出部丨23係在未圖示之儲存部等蓄積接收部 1所接收之可用能資訊、及伺服器側判斷部122對於該可 用能資訊之判斷結果。 圖9係為表示接收部121所接收之可用能資訊、及用以管 理飼服器側_部122對於該可用&資訊之判冑結果之判The information obtained by the L acquisition unit 112 is transmitted to the feeding device 12°. Further, when the time is set to "9:1", the semiconductor manufacturing apparatus 11 continues the execution of the process parameters. Then, as described above, the available energy information of the sensor lu for "S003" is obtained and transmitted to the server device 12. In the server device 12, the available energy information including the sensor name of "Give" transmitted from the semiconductor manufacturing device 11 is first received by the receiving portion 121. Then, the memory corresponding to the received available 35 information is read from the memory 豸, etc. 128454.doc -32· 200901269 to specify the upper limit value of the upper limit value of the value indicated by the available energy information. The upper limit value or the like is set to be pre-designated by the user or the like. Fig. 8 is a positive management table for managing information for specifying a range of normal values. The normal range management table has the "spot identification information" as the identification information of the semiconductor manufacturing industry, and the "lower limit" of the lower limit of the range of the normal value as the upper limit of the upper limit of the range of the normal value. The "value" is used as the unit of the usable energy. The server side determining unit 122 searches for the half-turn manufacturing of the usable energy information received by the receiving unit 121, which is added to the normal range pipe. In the record of "TE501" and "Device J", the attribute of the sensory benefit name included in the available energy information is the same as the "sensor name". Record. Furthermore, the "lower limit value" and the upper limit value of the record must be read. Here, the first step is to read the "9 〇" / port "F two lower limit values and "125 | as the upper limit value" by receiving the information of the available energy of the s piano name. The server side judgment unit 122 is a comparison unit. Read the value of "90" of the limit m" and the usable energy received by the receiving unit 1 2 1 by 95" of the value indicated by the month b. Here, it is judged that it is a lower limit or more. Next, the server side determining unit 122 compares the "upper limit value" of the discounted item 5 with the "25" of the available second team received by the receiving unit 121. . Here, it is judged that it is below the lower limit. Thereby, it is judged that the value indicated by the available energy information received by the receiving unit 121 is a normal value. Therefore, the server side judging sections 122 128454.doc - 33 and 200901269 judge that the usable energy detected by the sensing 1 § 111 corresponding to the sensor name "S001" of the semiconductor manufacturing apparatus 11 is normal. The servo 1 s side output unit 丨 23 is an available energy information received by the storage unit 1 and stored in a storage unit (not shown), and a determination result of the usable energy information by the server side determination unit 122. Figure 9 is a diagram showing the available energy information received by the receiving unit 121 and the judgment of the result of the judgment of the available &

:結果管理表。判斷結果管理表係具有作為附加於可用能 資訊之半導體製造裝置之識別資訊之「裝置識別資訊」、 在可用能資訊中所包含之上述之「感測器名」、作為在可 用迠資讯中所包含之表示取得了可用能資訊之日時之資訊 之日時」、作為可用能資訊所表示之可用能之值之 「值」、及作為表示可用能資訊所表示之值是否為正常值 之範圍之資訊之「評價」,而作為屬性。另外,「評價」為 正雨」係表不可用能資訊所表示之值為正常值之範圍, 而》平4貝」A「異常」係表示可用能資訊所表示之值不在 正常值之範圍。 次此外j以同樣方式,對於接收部i2i依序接收之可用能 貪訊,藉由伺服器側判斷部122繼續進行同樣之判斷。 關於包括接收部121所接收之「则」之感測器名之可 用能f訊’係針對可用能資訊所表示之值為「4(SCcm), =為從正常範圍管理表所獲得之下限值為「5」,而可用能 資訊所表示之值非為正常範圍。 此情形下,词服器側輸出部123係如圖9所示,蓄積關於 128454.doc •34· 200901269 該可用能資訊之伺服哭 當*日茲a !斷部122之判斷結果之「显 吊」,並且藉由電子番)μ ^吳 牛,將半導體製造裝置「ΤΕ501 ^ 感測器「S003」檢測出里 ΤΕ5〇1」之 13。 以“發运至預先指定之客戶端裝置 在客戶端裝置13中,传由旁 通知該異常之產生at 收部131接收用以 ⑽該電子郵件,如圖:件_,並且由客戶端側輸出部 圖10所示顯示在未圖示之: Results management table. The judgment result management table has "device identification information" as identification information attached to the semiconductor manufacturing device capable of enabling information, and the above-mentioned "sensor name" included in the available energy information, as the available information. The "date" of the information on the date of the available energy information, the "value" of the available energy as the available energy information, and the value indicating whether the value indicated by the usable energy information is normal. The "evaluation" of information, and as an attribute. In addition, the "evaluation" is the positive rain. The value indicated by the unavailable energy information is the normal value range, and "flat 4" and "abnormal" indicate that the value indicated by the available energy information is out of the normal range. In the same manner, in the same manner, the server side judging unit 122 continues the same judgment with respect to the available energy corruption sequentially received by the receiving unit i2i. The available energy information of the sensor name including the "received" received by the receiving unit 121 is "4 (SCcm) for the available energy information, and = is the lower limit obtained from the normal range management table. The value is "5", and the value indicated by the available energy information is not the normal range. In this case, the word server side output unit 123 is as shown in FIG. 9 and accumulates the result of the judgment of the servo-cry when the usable information of 128454.doc • 34· 200901269 is available. And the semiconductor manufacturing device "ΤΕ501 ^ sensor "S003" detects the ΤΕ5〇1" of 13 by the electronic )). The "send to the pre-designated client device in the client device 13 is transmitted by the side notification to the exception generating portion 131 for receiving (10) the email, as shown in the figure: and output by the client side. The part shown in Figure 10 is shown in the figure.

ϋ 即可對於操作客戶«置U之㈣半導 「TE501」之感測器 之可用能中產生里常…* 在作為檢測對象 /、吊另外,亦可預先使可用能資訊中包 Η用能名等,且料服„置12表示異常之資訊一同將 檢測出該異常之可“資对所包含之可用能名等發送至 客戶端裝置13 ’藉此而使在哪一可用能產生了異常顯示於 客戶端裝置。 ' 此外’飼服器側輸出部123係針對與附加在該可用能資 訊,識別資訊對應之半導體製造裝置u,發送由感測器名 為S003」之感測器111用以輸出檢測出可用能之異常之 舅訊,例如指令。 在半導體製造裝置! i中,係將從該伺服器裝置12所發送 之指令在未圖示之接收部接收,且由未圖示之控制部執行 此命令,而使感測器名為「S003」之感測器U1將表示檢 J出了用此之異常之警告顯示,顯示於控制面板等,藉此 即可對於操作半導體製造裝置〗丨之使用者,通知感測器 S003」在作為檢測對象之可用能中產生異常。 128454.doc -35· 200901269 以上’依據本實施之形態,設為由…以上半導體製造 裝置U取得可用能之資訊,且由伺服器裝置12使用1個以 上+導體製造裳置_取得之可用能之資訊來判斷在可用 能中是否產生了異常而將判斷結果輪出,藉此使用者即可 不需再以目視等繞巡檢驗各可用能’而可於短時間 地進行利用在半導體製造裝置之可用能之檢m =製:工薇等中’由於有配置2。。台左右半導體製造 Ο υ 情形,因此若使用者以目視等繞巡檢驗各可用 能,則幾乎不可能同時檢驗各可用能, ::形態之構成,即可在預先設定之時間幾乎同= =檢驗。此外’藉由將可用能之檢驗自動化’:; 消除可用能之測定值等之記入疏漏或記入錯誤等。 此外,依據半導體製造裝置 貧訊,藉此即可確實地進行對各可用能而^之 態下之檢驗。例如,針對本 、在適备之狀 形下之值為重要之可用…裝置在運轉狀態之情 運轉狀態之情形下之可 了牛導體I造裝置為 造裝置U之狀態,以取得可b :之二:外拉依據半導體製 用能之資料收隼,一直到"b 藉此即可等待可 此外,直到裝置成為特定之狀態為止。 :由㈣器裝置12即可判斷〗個以 】之可用能之狀態,藉此即 ^ 灯可用能之狀態之判斷處理裝置12集中進 之構成簡化。此外,由 字各+導體製造裝置】】 11-面將取得可用能之定時 ¥體1農置 叹疋等一一設定於各半導體 128454.doc -36 - 200901269 製造裝置,而可在一個伺服器裝置1 2中設定,因此可簡化 設定之麻煩等。 此外,藉由設為可由各半導體製造裝置U進行本身裝置 所利用之可用能之測定之構成,即可與半導體製造裴置i i 之設置同時,將用以自動地測定可用能之本實施形態之構 成導入’因此即容易導入用以測定可用能之構成。即可 It can be used for the operation of the customer's "fourth" semi-conductor "TE501" sensor. * In the test object /, hang, you can also use the available energy information in advance. Name, and the service „12 indicates that the abnormal information together will detect the abnormality, and the available energy name included in the pair can be sent to the client device 13', thereby making an abnormality in which available energy. Displayed on the client device. The 'feeder side output portion 123 is for transmitting the detected energy to the semiconductor manufacturing device u corresponding to the available energy information and the identification information, and transmitting the sensor 111 named by the sensor named S003. An abnormal message, such as an instruction. In semiconductor manufacturing equipment! In the case of i, the command transmitted from the server device 12 is received by a receiving unit (not shown), and the control unit (not shown) executes the command to make the sensor named "S003". U1 indicates that the warning display using the abnormality is displayed on the control panel or the like, whereby the user operating the semiconductor manufacturing apparatus can notify the sensor S003" of the available energy as the detection target. An exception was generated. 128454.doc -35· 200901269 The above is based on the aspect of the present embodiment, the information on the usable energy is obtained from the semiconductor manufacturing device U, and the server device 12 uses one or more + conductors to manufacture the available energy. The information is used to determine whether an abnormality has occurred in the available energy, and the determination result is rotated, so that the user can use the semiconductor manufacturing device in a short time without having to patrol the available energy without visual inspection or the like. Available energy test m = system: Gong Wei, etc. 'Because there is configuration 2. . In the case of Taiwan's left and right semiconductor manufacturing , ,, if the user checks the available energy by visual inspection, it is almost impossible to simultaneously test the available energy, the formation of the :: form, which can be almost the same as the = = test at the preset time. . In addition, by "automating the inspection of available energy":; eliminating the omission of the measured value of the available energy, etc., or the error or the like. In addition, according to the semiconductor manufacturing device, it is possible to reliably perform the test for each available energy. For example, for the present, the value in the shape of the appropriate shape is important. In the case of the operating state of the device, the device can be made in the state of the device U to obtain the b: The second: the external pull is based on the data of the semiconductor manufacturing energy, until the "b" can wait for it to be available until the device becomes a specific state. The state of the available energy can be judged by the (four) device 12, whereby the judgment processing means 12 of the state of the available energy of the lamp is simplified. In addition, the word + conductor manufacturing device]] 11-face will obtain the available energy timing ¥ body 1 agricultural sigh, etc. set one by one in each semiconductor 128454.doc -36 - 200901269 manufacturing device, but in a server Since the setting is set in the device 12, the trouble of setting and the like can be simplified. Further, by configuring the semiconductor manufacturing apparatus U to perform the measurement of the usable energy used by the own apparatus, it is possible to automatically measure the usable energy at the same time as the setting of the semiconductor manufacturing apparatus ii. The composition is imported 'so that it is easy to introduce the composition for measuring the usable energy.

以下使用圖11說明本實施形態之變形例。此變形例係設 為在上述實施形態中,省略伺服器裝置12,並且在上述之 半導體製造裝置11中’進—步設置用以進行與伺服器裝置 12之伺服器側判斷部122同樣之判斷之判斷部124 ,且設置 與伺服器側輸出部123同樣之輸出部125以取代發送部113 者0 此判斷部124係針對可用能資訊取得部112所取得之可用 能資訊而進行與伺服器側判斷部同樣之判斷者,關於其他 判斷之方法或構成等,係與飼服器侧判斷部同樣。 此判斷部m係用以判斷可用能f訊取得部⑴所取得之可 用能資訊所表示之刊能之值是否為特定 二,輸出物係與伺服器側輸出部123同樣:二 之判斷結果對應,、對於顯二: 之里常之通::、或藉由電子郵件對於例如客戶端褒置U 之異…知荨者,關於其他之構 部123同樣。惟輪出部125係由 ' :、何服器側輸出 感測器】1之半導體製造裝置為本身置斷=测出異常之 感測器!】檢測出可用能之異常之因此只要將表示 。。顯不,顯示於控制面 128454.doc -37- 200901269 板等即可。亦即, 結果對應之輪出二進侧^ 置11之狀H於製程執彳1 部125係可在半導體製造褒 本身裝置用以進行異㈣測之情形下,將 排出)或褒置停止等之止(晶圓待機)或中斷(晶圓 外,半導體製指令等對本身裝置輸出。此 ^ 11之狀態於怠轉中之際進行里常偵、、則 之情形下,亦可將太I括里 /、㊉偵測 停止等之於-十人執行製程開始連鎖或裝置 4 U或命令等對本身裝置輸出。 在此種變形例中,亦可衾 丌了達成與上逑實施形態1同樣之效 果。此外,由於不需要伺服器裝置,因此將無法 體製造裝置之集中式管理,惟可將設置半導體製造裝置之 際用以通信之設定等簡化’並且可容易導入用以偵測此種 可用能之異常之架構。 (實施形態2) 本實施形態之群管理系統係設為在上述實施形態之群管 理系統中,由半導體製造裝置從用以檢測可用能之感測= 依序輸出之資訊,依序取得可用能資訊,並發送至伺服器 裝置,且由伺服器裝置從此等可用能資訊之中,取得在特 定之定時所取得之可用能資訊之中,由半導體製造裝置在 特定之狀態之情形下所取得之可用能資訊,且使用此可用 能資訊’而檢測半導體製造裝置之異常者。 圖12係為表示本實施形態之群管理系統之構成區塊圖。 本實施形態之群管理系統係與上述實施形態1同樣,具 有1個以上半導體製造裝置2 1、伺服器裝置22、及}個以上 128454.doc -38- 200901269 穿置13准在此為了簡化說明,因此半導體製造裝 及客戶為裝置丨3係分別以一個情形為例進行說明。 至於客戶端裝置13之構成係與上述實施形態1同樣,故 說明予以省略。 I導體製造裝置21係、具備1個以上感測器111、可用能資 訊取得部212、發送部213、及狀態資訊取得部214。 關於感測器111之構成係與上述實施形態i同樣因此說 明予以省略。 f -ί 用此為訊取;f于部212係取得用以表示關於在半導體製 造過程中所使用之Hgl以上可用能之值之資訊之可用能資 訊者,具有與上述實施形態1之可用能資訊取得部112同樣 構成ΙΊ可用資訊取得部不是在特定之定時從各感測 器111所輸出之資訊選擇性地取得可用能資訊,而是從用 以檢測可用能之各感測器1 Η依各感測器在特定之定時依 序輸出之資訊而依序取得可用能資訊之點, y態丨之可用«訊取得和2有所不同。此外,在 可判斷已取得可用能資訊之定時,係使表示已取得可用能 資訊之時刻之資訊包含在可S能資訊,或先建立對應關 • 孫'。除此不同之外,係與上述實施形態i同樣,因此說明 - 予以省略。 狀態資訊取得部2U係用以取得表示本身裝置,亦即半 導體製造裝置21之狀態之資訊之狀態資訊。狀態資訊具體 而言係在各可用能資訊藉由可用能資訊取得部212所取得 之定時中,可表示半導體製造裝置21是何種狀態之資訊。 128454.doc -39· 200901269 狀態資訊例如係將表示半導體製造裝置2】之狀態之資訊、 及表示判斷了該狀態之時刻之資訊建立對應關係之資訊。 判斷了狀態之時刻之資訊係可從未圖示之時脈等來取得。 或=可使狀態資訊取得部214取得在可用能資訊取得部2^ 取:可用能貧訊之時點之表示本身裝置之狀態之資訊之狀 2資訊’並將表示可用能資訊取得部212所取得之可用能 貝^及取侍了該可用能資訊之時點之半導體製造 之狀態之狀態資訊建立對應關係而進行發送。所謂^導體 製造裳置21之狀態係與在上述實施形態K所說明之半導 體製w裝置之狀態同樣。狀態資訊取得部214亦可在一定 或不疋之特定之定時取得重複狀態資訊,亦可將半導體製 造装置21之狀態變化作為觸發,以取得狀態資訊。此外, 亦可取得在可用能資訊取得部212取得可用能資訊之時里占 =狀悲錢。亦可使可用能資訊取得部212以任何方式取 侍表示本身裝置之站、能+一 不身裝置之狀態之貧訊。例如,亦可在本身裝 未:示之控制部等輸出表示情況之資訊,例如表示= ΓΗ等之運轉狀態之資訊之情形下,判斷是否為運轉狀 :或:運轉狀態(急轉狀態),且取得表示該狀態之 ^亦可判斷已明瞭為運轉狀態所輸:本 =付表示該狀態之狀態資訊。狀態資訊取得二 係可從MPU或記憶體等來 吊 理順序通常係以軟體來實現見。狀態資訊取得部214之處 記錄媒體…准亦可以且該軟體係記錄於繼等之 氓兀了从硬體(專用電路)來實現。 128454.doc 200901269 發送部21 3係設為在上述實施形態丨中所說明之發送部 1 13中,除可用能資訊之外,再加上將狀態資訊發送至伺 服益襞置1 2者,關於其他構成係與上述實施形態丨同樣, 因此說明予以省略。 伺服器裝置22係具備接收部221、伺服器側取得部224、 祠服器側判斷部222、及伺服器側輸出部丨23。A modification of this embodiment will be described below with reference to Fig. 11 . In this modification, in the above-described embodiment, the server device 12 is omitted, and in the above-described semiconductor manufacturing device 11, the same judgment as that of the server side determining unit 122 of the server device 12 is performed. The determination unit 124 is provided with an output unit 125 similar to the server side output unit 123 instead of the transmission unit 113. The determination unit 124 performs the information on the available information with respect to the available energy information acquisition unit 112 and the server side. The same judgement of the judgment unit is the same as the method of determining the other means, the configuration, and the like. The determining unit m is configured to determine whether the value of the published energy indicated by the available energy information obtained by the available energy acquisition unit (1) is specific two, and the output object is the same as the server side output unit 123: , for the second: in the usual::, or by e-mail for example, the client is not the same as the other, the same as the other structure 123. However, the wheel-out unit 125 is a sensor that is ':, what is the output side of the sensor side sensor'. The semiconductor manufacturing device of the device 1 is itself turned off = the sensor that detects the abnormality!] The abnormality of the available energy is detected as long as it is indicated. . Displayed on the control surface 128454.doc -37- 200901269 board, etc. That is, the result corresponds to the rounded-out side of the shape 11 of the process H in the process of the first part of the 125 system can be used in the semiconductor manufacturing device itself for the case of the (four) test, the discharge or stop, etc. (wafer standby) or interrupt (out-of-wafer, semiconductor command, etc. output to the device itself. The state of this ^ 11 is constantly detected during the transition, and in the case of In the case of the above-mentioned tenth, the detection of the stop, etc., is performed by the ten-person execution process chain or the device 4 U or the command, etc. In the modification, the same as in the first embodiment In addition, since the server device is not required, centralized management of the device cannot be performed, but the setting for communication at the time of setting the semiconductor manufacturing device can be simplified and can be easily introduced to detect such (Embodiment 2) The group management system according to the present embodiment is configured to detect the available energy from the semiconductor manufacturing apparatus in the group management system according to the above embodiment. Information, in order The available energy information is sent to the server device, and the server device obtains the available energy information obtained at a specific timing from among the available energy information, and the semiconductor manufacturing device is in a specific state. The abnormality of the semiconductor manufacturing apparatus is detected using the available energy information. Fig. 12 is a block diagram showing the group management system of the present embodiment. In the same manner as in the first embodiment, one or more semiconductor manufacturing apparatuses 21, server apparatus 22, and more than 128454.doc-38-200901269 are placed 13 in order to simplify the description. Therefore, the semiconductor manufacturing equipment and the customer are devices. The configuration of the client device 13 will be described as an example. The configuration of the client device 13 is the same as that of the first embodiment, and the description thereof will be omitted. The first conductor manufacturing device 21 includes one or more sensors 111 and usable energy information. The acquisition unit 212, the transmission unit 213, and the status information acquisition unit 214. The configuration of the sensor 111 is the same as that of the above-described embodiment i. This is omitted. f - ί uses this as the information acquisition; f is used to indicate the available energy information for the information about the value of the available energy above Hgl used in the semiconductor manufacturing process, and has the same embodiment 1 above. The available energy information acquisition unit 112 is similarly configured. The available information acquisition unit does not selectively acquire the available energy information from the information output from the respective sensors 111 at a specific timing, but from the respective sensors for detecting the available energy. 1 According to the information that each sensor outputs in order at a specific timing, the available energy information is sequentially obtained. The available information of y state is different from that of 2. In addition, it can be judged that the available energy information has been obtained. The timing is such that the information indicating the moment when the available energy information has been obtained is included in the information, or the corresponding Guan·Sun' is established first. Other than this, it is the same as that of the above-described embodiment i, and therefore, it will be omitted. The status information acquisition unit 2U is for acquiring status information indicating the status of the own device, that is, the state of the semiconductor manufacturing device 21. Specifically, the status information indicates the state of the state in which the semiconductor manufacturing apparatus 21 is in the timing at which the available energy information is acquired by the available energy information acquiring unit 212. 128454.doc -39· 200901269 The status information is, for example, information indicating the state of the semiconductor manufacturing apparatus 2 and the information indicating the correspondence between the information at the time when the state is determined. The information at the time when the state is judged can be obtained from a clock or the like not shown. Or = the status information acquisition unit 214 can obtain the information 2 of the information indicating the state of the device itself at the time when the available energy information acquisition unit 2 can use the available energy information acquisition unit 212. The available energy and the state information of the state of the semiconductor manufacturing at the time when the available energy information is available are transmitted and transmitted. The state in which the conductors are formed 21 is the same as the state of the semiconductor device w described in the above-described embodiment K. The status information acquisition unit 214 can also obtain the repeated status information at a specific timing that is constant or not, and can also use the state change of the semiconductor manufacturing apparatus 21 as a trigger to acquire the status information. In addition, it is also possible to obtain the amount of money that is lost when the available energy information acquisition unit 212 obtains the available energy information. The available energy information acquisition unit 212 can also be used to access the information indicating the station of the device itself and the state of the device. For example, it is also possible to output information indicating the situation, such as information indicating the operation state of =, etc., in the control unit or the like, for example, to determine whether it is an operation state or an operation state (rapid state). If the state is obtained, it can be judged that it is clear that it is the operating state: this = pay indicates the state information of the state. The status information acquisition system can be viewed from the MPU or the memory, etc. The order is usually implemented in software. The status information acquisition unit 214 is the same as the recording medium. The soft system is recorded in the hardware (dedicated circuit). 128454.doc 200901269 The transmitting unit 21 3 is configured to transmit the status information to the server unit 1 13 in addition to the available energy information in the transmitting unit 1 13 described in the above embodiment. The other configuration is the same as that of the above-described embodiment, and therefore the description thereof will be omitted. The server device 22 includes a receiving unit 221, a server side acquiring unit 224, a server side determining unit 222, and a server side output unit 丨23.

ϋ 關於伺服器側輸出部123之構成除了進行與伺服器側判 斷部222之判斷結果對應之輸出之點以外,均與上述實施 形態1同樣’因此說明予以省略。 接收部221係設為在上述實施形態丨所說明之接收部12丄 中,除可用能資訊之外,再加上接收狀態資訊者。接收部 所接收之狀態資訊係例如依序蓄積於記憶媒體等。關 於其他構成,係與上述實施形態丨同樣,因此說明予以省 略。 伺服器側取得部2 2 4係依據接收部2 2丨所接收之狀態資 訊,取得接收部221所接收之可用能資訊。所謂依據狀^ 資訊取得,係從狀態資訊判斷各半導體製造裝置21取得各 狀態資訊之時點之狀態,且依據各半導體製造裝置幻之狀 態而取得。具體^,㈣器側取得部224係取得接收部 221所接收之可用能資訊之中, /、衣不各+導體製造裝置 為預先指定之特定之狀態之狀態資 、 〜貝汛對應之可用能資訊。 在此所述之與狀態資訊對應之 太十,k j用肊肓矾,係例如所取得 之時刻與狀態資訊相同,或幾乎 ^ 丄^ J用忐資訊。例 如’由伺服器側取得部224取得表干蛊姓… 侍表不為特定之狀態之狀態 128454.doc -41 · 200901269 貝訊所具有之,表示該狀態資訊被取得之時刻之資訊、及 致之時刻之資訊建立對應關係之可用能資訊。或者在將 可用肊貝訊、及在取得該可用能資訊之時刻所取得之狀熊 資訊建立對應關係之情形下,亦可取得與表示為特定之狀 悲之狀態資訊建立對應關係之可用能資訊。此外,尤其伺 服器側取得部224亦可設為取得各半導體製造裝置丨1在預 先指定之定時所取得之可用能資訊’且與表示為各半導體 製造裝置為特定之狀態之狀態資訊對應之可用能資訊。在 此所述之定時係為與在上述實施型態丨中可用能資訊取得 部U2之說明#中所說明之定日寺等相$。伺服器侧取得部 224通常係可從MPU或記憶體等來實現。伺服器側取得部 224之處理順序通常係以軟體來實現,而該軟體係記錄於 ROM專之記錄媒體。惟亦可以硬體(專用電路)來實現。 伺服器側判斷部222係除判斷伺服器側取得部224所取得 之可用能資訊所表示之可用能之值是否為特定之值之點之 外,均具有與上述實施形態!之伺服器側判斷部】22同樣之 構成’因此在此說明予以省略。 接著使用圖13之流程圖來說明半導體製造裝置之動作。 在此,係設為具有用以檢測可用能之3(3係丨以上之整數)個 之感測器111 ,且各感測器〗u在預先設定之定時,重複輸 出用以表示檢測量之資訊者。 (步驟SI301)可用能資訊取得部212係!代入於計數器让。 (步驟S1302)可用能資訊取得部212係判斷是否接受表示 第k個感測器111所輸出之可用能之檢測量之資訊。在接受 128454.doc •42- 200901269 情形下,前進至步驟sl3〇3’而於未接受之情形下 至步驟S1306 (步驟⑽3)可用能資訊取得部212係將在步驟⑽2所 接受之資訊例如轉換為數值等,並取得可用能資訊。在此 係設為使可用能資訊中包含取得可用能資訊之日時等之資 訊。此外,亦可設為使可用能資訊令包含表示第k個可用 能資訊之資訊等或建立對應關係。 (步驟S1304)狀態資訊取得部214係取得狀態資訊。再 者’在此作為-例’係將所取得之狀態資訊暫時記憶在與 在步驟S1303所取得之可用能資訊建立對應關係之記憶體 等。例如’以用以管理資訊之資料庫之相同記錄來管理狀 態資訊與可用能資訊。另外,在此雖設為於取得可用能資 訊之際,亦取得狀態資訊,惟亦可判斷是否為要取得狀態 資訊之時期,並在要取得可用能資訊之時期不同之時期取 得可用能資訊。 (步驟S1305)發送部213係將在步驟sn〇3中所取得之可 用旎貧訊、及在步驟S1304中所取得之狀態資訊發送至伺 服器裝置22。在此係將可用能f訊與狀態f訊建立對應關 係進行發送。 (步驟S1306)可用能資訊取得部212係將計數器k遞增i ^ (步驟S1 307)可用能資訊取得部112係判斷計數器k是否 較s大。較s大之情形下,回到步驟S4〇1,若為s以下之情 形下,回到步驟S402。 另外,半導體製造裝置21亦可設為與上述實施形態}之 128454.doc -43- 200901269 半導體製造裝置同樣,包括未圖示之接收部或控制部等。 卜在此雖係叹為在取得各可用能資訊與狀態資訊之 時點,將所取得之可用能資訊與狀態資訊發送至伺服器裝 置22,惟亦可在複數個可用能資訊或狀態資訊齊備之時 .•點’將所取得之可用能資訊及狀態資訊批次發送至伺服器 裝置22。 此外,只要可判斷可用能資訊與狀態資訊之對應關係, 則亦可將可用能資訊與狀態資訊個別地發送。 另外,在圖13之流程圖中’係藉由電源切斷或處理終了 之中斷而使處理終了。 、下使用圖14之流程圖來說明本實施形態中之伺服器裝 置之具體之動作。 (步驟S14G1)接收部221係判斷是否接收了可用能資訊及 狀態資訊。在接收之情形下,將可用能資訊與狀態資訊蓄 積於未圖示之記憶媒體等,且前進至步驟S1402,在未接 收之情形下’回到步驟S】4〇 1。 (步驟S 1402)伺服器側取得部224係從未圖示之記憶媒體 等讀取與在步驟S1401中所接收之可用能資訊對應之表示 取得可用I資汛之定時之資訊、及表示取得可用能資訊之 之半導體製造m之狀態之資m。在未圖示之記憶媒 體中,係设為儲存有與各可用能或各感測器11 1對應之表 不預先取得可用能資訊之定時之資訊、及表示取得可用能 資訊之際之半導體製造裝置21之狀態之資訊者。 (步驟S1403)伺服器側取得部224係判斷在步驟Si4〇i中 128454.doc -44- 200901269 所接收之可用能資訊所具有之表示取得可用能資訊之時刻 之資訊所表示之時刻是否為表示取得在步驟S1402中所取 得之可用能資訊之定時之資訊所表示之定時内之時刻,亦 即是否為在表示定時之資訊所表示之定時所取得之可用能 >訊若為定時内之4刻之情形下,前進至步驟s 1404 , 若非為定時内之時刻之情形下,回到步驟sl4〇1。另外, 在疋期性或不定期性重複取得可用能資訊之情形等中,亦 叮對於取付一個可用能資§孔之定時,一度於取得可用能資 訊之後,直至重新取得可用能資訊之定時來到為止,判斷 為非為取得可用能資訊之定時。 (步驟S1404)伺服器側取得部224係判斷與在步驟sl4〇i 中所接收之可用能資訊對應之狀態資訊所表示之半導體製 造裝置2 1之狀態,與表示取得在步驟s丨4〇2中所取得之可 用能資訊之際之半導體製造裝置21之狀態之資訊所表示之 狀態是否一致,亦即是否為在表示狀態之資訊所表示之狀 邊所取得之可用能資訊。此一致係可設為部分一致等。一 致之情形下’前進至步驟S14〇5,若為不一致之情形下, 回到步驟S 1 4 01。 (步驟S1405)伺服器側取得部224係取得在步驟SH〇i所 接收之可用能資訊。 (步驟S 1406)伺服器側判斷部222係讀取在未圖示之記憶 媒體等預先儲存之與在步驟s 14〇1所接收之可用能資訊對 應之臨限值之上限值、及下限值。僅指定上限值或下限值 之一方之情形下,僅讀取該一方。與可用能資訊對應之臨 128454.doc -45- 200901269 限值係取得可用能資訊中所包含之用以表示可用能之識別 資訊、或半導體製造裝置π之識別資訊等作為檢索鍵=/ (步驟S1407)伺服器側判斷部222係判斷在步驟si4〇5中 所取得之可用能資訊所表示之值是否為在步驟si4〇6中所 讀取之下限值以上。在下限值以上之情形下,前進至步驟 S1408,在下限值以上之情形下,前進至步驟§14〇9。另 外,在步驟S1406未讀取下限值之情形下,此處理予以省 略。The configuration of the server-side output unit 123 is the same as that of the first embodiment except that the output corresponding to the determination result of the server-side determination unit 222 is performed. The receiving unit 221 is configured to receive the status information in addition to the available energy information in the receiving unit 12A described in the above embodiment. The status information received by the receiving unit is stored, for example, in a memory medium or the like. The other configurations are the same as those of the above-described embodiment, and therefore the description will be omitted. The server side acquisition unit 2 2 4 acquires the available energy information received by the receiving unit 221 based on the status information received by the receiving unit 2 2 . The information acquisition is based on the state information, and the state in which each of the semiconductor manufacturing apparatuses 21 acquires each state information is determined based on the status information, and is obtained in accordance with the state of each semiconductor manufacturing apparatus. Specifically, the (4) device side acquisition unit 224 obtains the state energy of the specific state that is specified in advance by the receiving unit 221, and the usable energy corresponding to the state in which the device is not specified in advance. News. In this case, the information corresponding to the status information is too ten, k j is used, for example, the acquired time is the same as the status information, or almost ^ 丄 ^ J is used for information. For example, 'the server side acquisition unit 224 obtains the name of the stem of the table... The status of the waiter is not the specific state 128454.doc -41 · 200901269 The information of the time when the status information is obtained, and The information of the moment establishes the available energy information of the corresponding relationship. Or, in the case of establishing a correspondence between the available information and the information obtained at the time of obtaining the available energy information, the available energy information corresponding to the state information indicated as the specific state of sadness may also be obtained. . Further, in particular, the server side acquisition unit 224 may be configured to acquire available energy information 'obtained at a predetermined timing of each semiconductor manufacturing apparatus 丨1 and to correspond to status information indicating that each semiconductor manufacturing apparatus is in a specific state. Can information. The timing described here is the same as that of the Dingri Temple described in the description # of the usable information acquisition unit U2 in the above-described embodiment. The server side acquisition unit 224 is usually implemented from an MPU, a memory, or the like. The processing sequence of the server side acquisition unit 224 is usually implemented by software, and the soft system is recorded on a ROM-specific recording medium. However, it can also be implemented by hardware (dedicated circuit). The server side determination unit 222 has the above-described embodiment except that it is determined whether or not the value of the available energy indicated by the available energy information acquired by the server side acquisition unit 224 is a specific value! The server side determining unit 22 has the same configuration. Therefore, the description will be omitted here. Next, the operation of the semiconductor manufacturing apparatus will be described using the flowchart of FIG. Here, it is assumed that there are three sensors (3 integers or more) for detecting the available energy, and each sensor is repeatedly outputted at a preset timing to indicate the detection amount. Information person. (Step SI301) The available energy information acquisition unit 212 is connected! Substitute in the counter. (Step S1302) The available energy information acquisition unit 212 determines whether or not the information indicating the detection amount of the available energy output by the kth sensor 111 is received. In the case of accepting 128454.doc • 42- 200901269, proceeding to step sl3〇3' and in the case of not accepting to step S1306 (step (10) 3), the available energy information obtaining unit 212 converts the information accepted in step (10) 2, for example. For numerical values, etc., and obtain available energy information. In this case, the information is set such that the available energy information includes the date when the available energy information is obtained. In addition, it may be set such that the available energy information order includes information indicating the kth available energy information or the like, or a correspondence relationship is established. (Step S1304) The status information acquisition unit 214 acquires status information. Further, 'here as an example' temporarily stores the acquired status information in a memory or the like which is associated with the available energy information acquired in step S1303. For example, 'status information and available energy information are managed by the same record of the database used to manage the information. In addition, although it is set to obtain status information at the time of obtaining the available energy information, it is also possible to determine whether it is the period in which the status information is to be obtained, and to obtain the available energy information at different times when the available energy information is to be obtained. (Step S1305) The transmitting unit 213 transmits the available information received in step sn3 and the status information acquired in step S1304 to the servo device 22. In this case, the available energy can be sent to the corresponding state. (Step S1306) The available energy information acquisition unit 212 increments the counter k by i ^ (step S1 307). The available energy information acquisition unit 112 determines whether or not the counter k is larger than s. If it is larger than s, the process returns to step S4〇1, and if it is s or less, the process returns to step S402. In addition, the semiconductor manufacturing apparatus 21 may include a receiving unit, a control unit, and the like (not shown), similarly to the semiconductor manufacturing apparatus of the above-described embodiment, 128454.doc-43-200901269. Although it is hereby sighing that the available energy information and status information are sent to the server device 22 at the time of obtaining the available energy information and status information, it is also possible to provide a plurality of available energy information or status information. The hour point is sent to the server device 22 for the available energy information and status information batches obtained. In addition, as long as the correspondence between the available energy information and the status information can be judged, the available energy information and the status information can also be separately transmitted. Further, in the flowchart of Fig. 13, the processing is terminated by the interruption of the power supply or the end of the processing. The specific operation of the server device in the present embodiment will be described using the flowchart of Fig. 14. (Step S14G1) The receiving unit 221 determines whether or not the available energy information and the status information have been received. In the case of reception, the available energy information and the status information are accumulated in a memory medium or the like (not shown), and the process proceeds to step S1402, and in the case of non-receiving, the process returns to step S4. (Step S1402) The server side acquisition unit 224 reads the information indicating the timing of obtaining the available I information corresponding to the available energy information received in step S1401 from a memory medium or the like (not shown), and indicates that the acquisition is available. The information on the status of semiconductor manufacturing m. In a memory medium (not shown), it is assumed that information indicating the timing at which the available energy information is not obtained in advance corresponding to each available energy or each sensor 11 1 and semiconductor manufacturing indicating that the available energy information is obtained are stored. The information of the status of the device 21. (Step S1403) The server side acquisition unit 224 determines whether or not the time indicated by the information indicating the time at which the available energy information is obtained by the available energy information received in 128454.doc - 44 - 200901269 in step Si4〇i is represented. The time at which the timing indicated by the information of the timing of the available energy information obtained in step S1402 is obtained, that is, whether the available energy is obtained at the timing indicated by the information indicating the timing. In the case of engraving, the process proceeds to step s 1404, and if it is not the time within the timing, the process returns to step s14. In addition, in the case of recurring or non-scheduled repetitive access to available energy information, etc., the timing of obtaining an available energy § hole is once obtained after the available energy information is obtained, until the time when the available energy information is regained. Up to now, it is judged that it is not the timing for obtaining the available energy information. (Step S1404) The server side acquisition unit 224 determines the state of the semiconductor manufacturing apparatus 2 indicated by the status information corresponding to the available energy information received in step sl4〇i, and indicates that the acquisition is performed in step s丨4〇2. Whether the state indicated by the information of the state of the semiconductor manufacturing apparatus 21 at the time of the usable energy information obtained is the same, that is, whether it is the usable energy information obtained by the state indicated by the information indicating the state. This agreement can be set to be partially consistent, and the like. In the case of consistency, the process proceeds to step S14〇5, and if it is inconsistent, the process returns to step S1 4 01. (Step S1405) The server side acquisition unit 224 acquires the available energy information received in step SH〇i. (Step S1406) The server side determining unit 222 reads the upper limit value of the threshold corresponding to the available energy information received in step s 14〇1, which is stored in advance in a memory medium (not shown), and the like. Limit. In the case where only one of the upper limit value or the lower limit value is specified, only one party is read. The corresponding 128454.doc -45- 200901269 limit corresponding to the available energy information is obtained by using the identification information for indicating the available energy or the identification information of the semiconductor manufacturing device π included in the available energy information as the search key =/ (step S1407) The server side determination unit 222 determines whether or not the value indicated by the available energy information acquired in step si4〇5 is equal to or greater than the lower limit value read in step si4〇6. If the value is equal to or greater than the lower limit value, the process proceeds to step S1408. If the value is equal to or greater than the lower limit value, the process proceeds to step §14〇9. Further, in the case where the lower limit value is not read in step S1406, this processing is omitted.

C Ο (步驟S1408)伺服器側判斷部222係判斷在步驟Si4〇5中 所接收之可用能資訊所表示之值是否為在步驟s 5 〇 2中所讀 取之上限值以下。在上限值以下之情形下,回到步驟 SM〇1,在上限值以下之情形下,前進至步驟si4〇9。另 外’在步驟S1406中未讀取上限值之情形下,此處理予以 省略。 (步驟S1409)伺服器側輸出部123係例如藉由電子郵件等 將表示在與在步驟S刚中所接收之可用能資訊對應之半 導體製造裝置所利用之可用能中產生異常之資訊發送至 預先指定之客戶端裝置。 (步驟SMiO)伺服器側輸出部123係對於與在步驟§1彻 所接收之可用能資訊對應之半導體製造裝㈣,發送用 與在該半導體製造裝置21所利用之可用能中產生異 如為:形:應之特疋之處理之命令等之資訊。該命令係例 二以輸出表示在半導體製造裝置n產生了異常之警報 …或用以使半導體製造裳置21停止異常之命令等。 128454.d〇i •46- 200901269 然後,回到步驟S1401。 另外,在上述流程圖中,在步驟8〗401中,亦可在步驟 S1401中針對接收部221蓄積於記憶媒體等之可用能資訊, 依序重複從步驟81402至1410之處理等來進行,以b取^對 於接收部221接收之可用能資訊等進行判斷等。 另外,在圖14之流程圖中,係藉由電源切斷或處理終了 之中斷而使處理終了。 Γ 接著說明本實施形態之群管理系統之具體例。群管理系 統之概略圖係與在圖〗所示之群管理系統中,將半導體製 造裝置置換為半導體製造裝置21、及將飼服器裝置置換為 伺服器裝置22者同樣。 首先’在此係設為與上述實施形態卜具體例同樣,一 個半導體製造裝置21具有以特定之時間間隔,例如幻秒 ^隔重複進行在半導體製造裝置11中所利用之可用能之測 疋之複數個感測器1 1 1者。 首=T用能資訊取得部212係依序從各感測器⑴判斷 二不可用能之檢測量之資訊是否已輸出,且於輸出之 二’使用所輪出之資訊,構成表示可用能之值之資 訊、表示取得可田At次 、 量之資訊輸出之:刻之資訊、包括將表示檢測 得。所取得二之感測器111之識別資訊之可用能資訊而取 叩用能資訊係例如暫時記憶於記憶體等。 訊之時刻得部214係取得表示在構成可用能資 成作為表示運轉製造裝置21之運轉狀態之資訊,而構 轉狀態之資訊之狀態資訊。再者,將同時取 128454.doc •47- 200901269 知·之可用能資訊與在步驟SI303中所取得之可用能資訊建 立對應關係而將該狀態資訊暫時記憶在記憶體等。 發送部213係讀取暫時記憶於記憶體等之可用能資訊、 及與該可用能資訊建立對應關係之狀態資訊,且與作為半 導體製造裝置21之識別資訊之裝置識別資訊一同發送至伺 服器裝置22。例如,如圖15所示’亦可以保有對應關係之 方式將建立對應關係之可用能資訊、及狀態資訊加以組合 之資訊發送至伺服器裝置22。 ( 在伺服器裝置22中,係由接收部22〗接收從半導體製造 裝置21所發送之可用能資訊、與該可用能資訊建立對應關 係之狀態資訊、及半導體製造裝置21之識別資訊,且以此 等保有對應關係之方式暫時記憶於未圖示之記憶體等。在 此茲設為所接收之可用能資訊所表示之可用能之值為 「95」、可用能資訊中所包含之感測器丨丨丨之識別資訊為 S001」、取得可用能資訊表示之可用能之時刻為「9: u 〇〇. 〇〇」,狀態資訊所表示之半導體製造裝置21之狀態為 「怠轉中」。此外,在此係設為該半導體製造裝置21之裝 置識別資訊為「TE 5 01」。 接著,伺服器側取得部224係取得與最初接收部22ι所接 _ 收之可用能資訊建立對應關係之半導體製造裝置21之裝置 識別資訊「TE501」、及接收部221所接收之可用能資訊中 所包含之檢測出與該可用能資訊對應之可用能之感測器 111之識別資訊「S001」。 圖16係為依儲存於伺服器裝置22内之未圖示之儲存部之 128454.doc -48- 200901269 半導體製造裝置與該半導體製造裝置21所具有之感測器 ⑴之每-組合,表示預先所準備之表示要取得可用能資 訊之定時之資訊、及表示要取得可用能資訊之際 體 製造裝置21之狀態之資訊之對應㈣之㈣n侧取得定時 狀態管理表。伺服器側取得定時狀態f理表係具有 識別資訊」、「感測器名」、「定時」、「狀態」之屬性。;裝 置識別資tfL」係為製造裝置之識別資訊。關於「感測器 名」、疋時」、及「狀態」係與圖7所示之取得定時狀態管 理表同樣。 伺服器側取得部224係在圖16所示之伺服器側取得定時 狀態管理表中,藉由檢索檢測「裳置識別資訊」為 丁咖」、厂感測器名」為「_」之記錄。再者,取得 所檢測出之記錄之「定時」屬性值、及「狀態」屬性值。 在此係獲得「定時」屬性值之「9:⑽」& 值之「怠轉令」之屬性值。 屬! 再者’伺服n側取得部224首先係比較表示接收部221所 =收之可用能資訊中所包含之時刻之資訊之「9 : 〇〇 ·· _」「及攸圖1 6所示之伺服器側取得定時狀態管理表所取 付之「定時」屬性值之「9: 〇〇」,並判斷為一致。另外, 可用能資訊中所包含之時刻是否$「定時」屬性 不之時刻以後之時刻,以取代進行判斷是否—致。 判此舉其—例針對未達1秒之時間,係設為不進行—致之 中者接著比較接收部22 1所接收之狀態資訊之「怠轉 」及攸圖1 6所示之伺服器側取得定時狀態管理表所取 128454.doc •49- 200901269 得之「狀態」屬性值之「怠轉中」,並判斷為一致。藉 此,伺服器側取得部224結果即判斷接收部221所接收之可 用能育訊為各半導體製造裝置丨丨在預先指定之定時所取得 之可用能資訊’且為與表示為各半導體製造裝置為特定之 狀態之狀態資訊對應之可用能資訊。伺服器側取得部 係取得接收部22 1所接收之可用能資訊。 接著,伺服器側判斷部222係使用與該可用能資訊對應 所接收之半導體製造裝置21之裝置識別資訊之「te5〇i」: 及可用能資訊中所包含之感測器ln之識別資訊之 「SOiH」,而與上述實施形態之具體例同樣取得關於伺服 器側取得部224所取得之可用能資訊所表示之值之上限值 。下限值。再者’使用所取得之上限值與下限值,與上述 實施形態之具體例同樣地從伺服器側取得部所取得之 可用能資訊所表示之值’進行在可用能中是否已產生了異 常之判斷等。另外,關於伺服ϋ㈣斷部222所進行之處 理以後之處理等’係與上述具體例㈣,因此在此省略說 接著,兹設為接收部221從半導體製造裝置_接收之 可用能資訊所表示之可用能之值為「19」、可用能資訊中 所包含之感測器⑴之識別資訊為「綱2」、取得可用能資 :所表不之可用能之時刻為「9:〇〇:〗4」,而狀態資訊所 表示之半導體製造裝置21之狀態為「怠轉中」。 之==部224係取得與可用能資訊建立對應關係 以、置21之裝置識別資訊「TE5G1」、在接收部 128454.doc •50- 200901269 22i所接收之可用能資訊中所包含之檢 田興孩可用能資 訊對應之可用能之感測器lu之識別資訊「s〇〇2」。 、 伺服器側取得部224係藉由檢索檢測在 牧圖16所不之伺服 器側取得定時狀態管理表中,「震置識別資飞 「删!」、「感測器名」為「_」之記錄。再者,取得 所檢測出之記錄之「定時」屬性值、及「 狀態」屬性值。 在此係獲得「定時」屬性值之「9 : 「 值之「運轉中」之屬性值。 、、」屬性 再者,伺服器側取得部224首先係比較表示接收部221所 接收之可用能資訊中所包含之時刻之資訊之「9 .C Ο (Step S1408) The server side determination unit 222 determines whether or not the value indicated by the available energy information received in the step Si4〇5 is equal to or less than the upper limit value read in the step s 5 〇 2 . When the value is equal to or lower than the upper limit value, the process returns to step SM〇1, and if it is equal to or lower than the upper limit value, the process proceeds to step si4〇9. Otherwise, in the case where the upper limit value is not read in step S1406, this processing is omitted. (Step S1409) The server-side output unit 123 transmits information indicating an abnormality in the available energy used by the semiconductor manufacturing apparatus corresponding to the available energy information received in step S, for example, by e-mail or the like to the advance. The specified client device. (Step SMiO) The server side output unit 123 generates a difference between the transmission and the available energy used in the semiconductor manufacturing apparatus 21 for the semiconductor manufacturing apparatus (4) corresponding to the available energy information received in step §1. : Shape: Information such as the order of handling of special features. The command example 2 shows an alarm indicating that an abnormality has occurred in the semiconductor manufacturing apparatus n or an instruction to stop the semiconductor manufacturing apparatus 21 from stopping an abnormality. 128454.d〇i • 46- 200901269 Then, it returns to step S1401. Further, in the above-described flowchart, in step S401, the available information of the storage medium or the like may be accumulated in the receiving unit 221 in step S1401, and the processing from steps 81402 to 1410 may be sequentially repeated to perform the processing. b is judged by the available energy information received by the receiving unit 221, and the like. Further, in the flowchart of Fig. 14, the processing is terminated by the interruption of the power supply or the interruption of the processing.具体 Next, a specific example of the group management system of the present embodiment will be described. The schematic diagram of the group management system is the same as that of the group management system shown in the figure, in which the semiconductor manufacturing apparatus is replaced with the semiconductor manufacturing apparatus 21 and the feeder apparatus is replaced with the server apparatus 22. First, in this case, as in the specific embodiment of the above-described embodiment, a semiconductor manufacturing apparatus 21 has a variable measurement of the usable energy used in the semiconductor manufacturing apparatus 11 at a specific time interval, for example, a pseudo second. A plurality of sensors 1 1 1 . The first/T energy information acquisition unit 212 sequentially determines whether the information of the detection amount of the two unavailable energy has been output from each sensor (1), and uses the information that is rotated in the output two to constitute the available energy. The information of the value indicates that the information output of the Ketian At times and the quantity is obtained: the information of the engraving, including the detection of the indication. The available energy information of the identification information of the sensor 111 obtained by the sensor 111 is obtained, for example, temporarily stored in a memory or the like. At the time of the news, the department 214 obtains status information indicating that the available energy is used as the information indicating the operational state of the operational manufacturing device 21 and the information of the state of the configuration. Furthermore, the status information of 128454.doc •47-200901269 is simultaneously established with the available energy information obtained in step SI303, and the status information is temporarily memorized in the memory or the like. The transmitting unit 213 reads the available energy information temporarily stored in the memory or the like, and the status information associated with the available energy information, and transmits the status information to the server device together with the device identification information as the identification information of the semiconductor manufacturing device 21. twenty two. For example, as shown in Fig. 15, the information of the available energy information and the state information for establishing the correspondence relationship may be transmitted to the server device 22 in a manner of maintaining the correspondence relationship. (In the server device 22, the receiving unit 22 receives the available energy information transmitted from the semiconductor manufacturing device 21, the status information associated with the available energy information, and the identification information of the semiconductor manufacturing device 21, and The manner in which the corresponding relationship is maintained is temporarily stored in a memory or the like (not shown). Here, it is assumed that the available energy value indicated by the received usable energy information is "95", and the sensing included in the available energy information is included. The identification information of the device is S001", and the time at which the usable energy information is available is "9: u 〇〇. 〇〇", and the status of the semiconductor manufacturing device 21 indicated by the status information is "turning to the middle" In addition, the device identification information of the semiconductor manufacturing apparatus 21 is "TE 5 01." Next, the server side acquisition unit 224 obtains a correspondence relationship with the available energy information received by the first receiving unit 22i. The device identification information "TE501" of the semiconductor manufacturing device 21 and the usable energy information received by the receiving unit 221 and detecting the available energy corresponding to the available energy information 1 Identification information "S001" of Fig. 16. Fig. 16 is a semiconductor manufacturing apparatus and a sensor of the semiconductor manufacturing apparatus 21, which are stored in a storage unit (not shown) stored in the server device 22. (1) Each-combination indicates the information indicating the timing at which the available energy information is to be obtained in advance, and the correspondence indicating the state of the body manufacturing device 21 to obtain the available energy information. (4) The n-side acquisition timing state management table The server side acquires the timing state, and the device has the attributes of "identification information", "sensor name", "timing", and "state". The device identification value tfL" is the identification information of the manufacturing device. The server name acquisition unit 224 is the same as the acquisition timing state management table shown in Fig. 7. The server side acquisition unit 224 is in the server side acquisition timing state management table shown in Fig. 16 . By searching for the record of "spot identification information" as "Ding coffee" and "factory sensor name" as "_", the "time" attribute value and the "status" attribute value of the detected record are obtained. . In this case, the attribute value of the "9:(10)"& value of the "timer" attribute value is obtained. The genus! The servo n-side acquisition unit 224 first compares and indicates that the receiving unit 221 = "9: 〇〇·· _", which is the information of the time included in the energy information, and the "timing" attribute value of the timing status management table obtained by the server side shown in Fig. 16. "9: 〇 〇 , , , , , , , 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The time is set to not be performed - the middle is then compared with the "turn" of the status information received by the receiving unit 22 1 and the server side acquisition timing state management table shown in Fig. 16 is taken as 128454.doc. • 49- 200901269 The "status" attribute value is "in transit" and is judged to be consistent. As a result, the server side acquisition unit 224 determines that the available energy information received by the receiving unit 221 is the available energy information 'obtained at a predetermined timing of each semiconductor manufacturing apparatus' and is expressed as each semiconductor manufacturing apparatus. The available energy information corresponding to the status information of a specific state. The server side acquisition unit acquires the available energy information received by the receiving unit 22 1 . Next, the server side determination unit 222 uses the device identification information "te5〇i" of the received semiconductor manufacturing device 21 corresponding to the available energy information: and the identification information of the sensor ln included in the available energy information. In the same manner as the specific example of the above-described embodiment, the upper limit value of the value indicated by the available energy information acquired by the server side acquisition unit 224 is obtained. lower limit. In addition, the use of the obtained upper limit value and the lower limit value, similar to the specific example of the above-described embodiment, is whether the value indicated by the available energy information obtained by the server side acquisition unit has been generated in the available energy. Judgment of abnormality, etc. In addition, the processing after the processing performed by the servo 四(4)-breaking unit 222 is the same as the above-described specific example (4), and therefore, the description is omitted here, and the receiving unit 221 is represented by the usable energy information received from the semiconductor manufacturing apparatus_ The available energy value is "19", the identification information of the sensor (1) included in the available energy information is "class 2", and the available energy is available: the time at which the available energy is not available is "9: 〇〇: 4", and the state of the semiconductor manufacturing apparatus 21 indicated by the status information is "turning to the middle". The == part 224 is configured to establish a correspondence relationship with the available energy information, and the device identification information "TE5G1" of the device 21 is available in the available energy information received by the receiving unit 128454.doc • 50-200901269 22i. The identification information "s〇〇2" of the sensor lu that can be used for the information. The server side acquisition unit 224 is configured to acquire the timing state management table on the server side of the map 16 by the search, and the "spot identification "flying" is deleted and the "sensor name" is "_". Record. Furthermore, the "timing" attribute value and the "status" attribute value of the detected record are obtained. In this case, you get the attribute value of "9:" value of "Time" attribute value. Further, the server side acquisition unit 224 first compares the information indicating the time included in the available energy information received by the receiving unit 221.

J 15」、及從圖16所示之伺服器側取得定時狀態管理表=取 得之「定時」屬性值之「9: 00」’並判斷為定時—致。在 此舉其一例針對未達一秒之時間,係設為不進行—致之判 斷者。另夕卜,在此,亦可在顯示「定時」屬性值為「9 : 〇〇」以前之時刻者之情形下,判斷為定時一致。另外,在 此,在「定時」屬性值表示「9: 01」以後之時刻者之情 形下,判斷為定時不一致’且對於接收部221所接收之該 可用能資訊之其後之判斷處理等即終了。 ^ 接著比較接收部221所接收之狀態資訊之「怠轉中」、及 從圖16所示之伺服器側取得定時狀態管理表所取得之J「狀 態」屬性值之「運轉中」,並判斷為不一致。藉此,即判 斷非為半導體製造裝置21在料之狀態之時點所取得之可 用能資訊,且對於接收部221所接收之該可用能資訊 後之判斷處理等即終了。 ^ 128454.doc -51- 200901269 接著設為接收部221從半導體製造 能資訊所表示之可難之值為「19 1所接收之可用 含之感測器⑴之識別資訊為「咖2」:^能資对所包 表示之可用能之時刻為「9 ·· Q5」#可用能貧訊所 之半導體製造裝置21之狀態為「運轉中」而狀態資訊所表示 伺服器側取得部224係使用圖16 = g± ^ m ^ ^ * 不之伺服器側取得定 “理表,與上述同樣獲得「定時」屬性值之「9: 〇〇」及「狀態」屬性值之「運轉中」之屬性值。 再者,飼服器側取得部224首先係比較表示接收部221所 接收之可用能資訊中所包含之時刻之資訊之「9 n 15」、及從圖16所示之伺服器側取得定時狀態管理表所取 付之:定時」屬性值之「9:⑻」,並判斷定時一致。 接著比較接收部221所接收之狀態資訊之「怠轉中」、及 :圖16所示之飼服器侧取得定時狀態管理表絲得之」「狀 態」屬性值之「運轉中」,並判斷為一致。藉此,飼服器 側取得部224結果即判斷接收部221所接收之可用能資訊為 各半導體製造裝置U在預先指定之定時所取得之可用能資 且為與表示為各半導體製造裝置為特定之狀態之狀態 資訊對應之可用能資訊。伺服器側取得部…係取得接^ 部221所接收之可用能資訊。 再者,使用該可用能資訊’與上述同樣,由伺服器側判 斷部222進行判斷在可用能中是否產生了異常。 其後重複同樣之處理,並進行可用能之異常之判斷、戋 異常之通知等。 128454.doc •52- 200901269 以上,依據本實施形態,係設為由!個以上之半導體製 造裝置取得可用能之資訊,並由飼服器裝置_斷在可 用能中是否產生了異常並輸出判斷結果,藉此使用者即可 不再需要以目視等繞巡各可用& 寻現、谷了用牝,而可於短時間且正確地 進行利用於半導體製造裝置之可用能之檢驗。 此外’藉由設輕料導體製造裝置21之㈣,而取得 Z用能=資訊,即可確實地進行對於各可用能而言為在適 田狀,。下之檢驗。此外,藉由設為依據半導體製造裝置 u之狀態而取得可用能之資訊,即可等待可用能之資料收 集,直到半導體製造裝置21成為特定之狀態為止。 此外,設Μ㈣服器裝置22,取得在預先Μ之定時 所取传之可用能資訊’且與表示為各半導體製造裝置為特 定之狀態之狀態資訊對應之可用能資訊,即可在祠服器裝 置地進行用以取得可用能資訊之判斷處理、或可用 能之狀態之判斷處理等,且可簡化各半導體製造裝置η之 構成。 f外’在上述實施形態1中,與上述實施形態2同樣,亦 ° 帛月匕貝Λ取知部112從檢測可用能之各感測器111 Γ序2之貝訊依序取得可用能資訊,且藉由與該取得之 ^用月二訊之中之取得上述之可用能資訊之處理同樣之處 制、土 /纟特定之定時所取得之可用能資訊,且為半導體 用& I置在特疋之狀態之情形下所取得之可用能資訊之可 貝汛依序取得之可用能資訊亦可例如蓄 未圖示 之記憶體等。 128454.doc -53 · 200901269 此情形下,與上述實施形態2同樣,亦可將取得表示本 身裝置,亦即半導體製造裝置丨〗之狀態之資訊之狀態資訊 之狀態資訊取得部2 1 4設於半導體製造裝置丨丨,且將該狀 態資訊取得部214所取得之狀態資訊與可用能資訊建立對 應關係,並使用該狀態資訊,以進行判斷可用能資訊取得 部112所取得之可用能資訊是否為半導體製造裝置在特定 之狀態之情形下所取得之可用能資訊。J 15", and the timing state management table = "9: 00" of the "timing" attribute value obtained from the server side shown in Fig. 16 and judged as timing. In this case, an example is given for a period of less than one second, which is set to be a failure to make a judgment. In addition, in the case where the time when the "timing" attribute value is "9: 〇〇" is displayed, it is determined that the timing is the same. Here, in the case where the "timing" attribute value indicates the time after "9: 01", it is determined that the timing is not coincident, and the determination processing for the available energy information received by the receiving unit 221 is the same. end. ^ Then, the "in progress" of the status information received by the receiving unit 221 and the "in operation" of the J "status" attribute value obtained from the server side as shown in FIG. 16 are compared, and it is judged. Inconsistent. Thereby, the usable information obtained at the time when the semiconductor manufacturing apparatus 21 is in the state of the material is judged, and the judgment processing of the available energy information received by the receiving unit 221 is completed. ^ 128454.doc -51- 200901269 Next, it is assumed that the receiving unit 221 has a difficult value from the semiconductor manufacturing energy information. "The identification information of the available sensor (1) received by 19 1 is "Caf 2": ^ The time at which the available energy is indicated by the package is "9 ·· Q5" # The state of the semiconductor manufacturing device 21 that can be used by the company is "in operation", and the state information indicates the use of the server side acquisition unit 224 16 = g± ^ m ^ ^ * If the server side does not obtain the "table", the "in-time" attribute value of the "9: 〇〇" and "status" attribute values of the "timing" attribute value is obtained in the same manner as above. . Further, the feeder side acquisition unit 224 first compares "9 n 15" indicating the information of the time included in the available energy information received by the receiving unit 221, and acquires the timing state from the server side shown in FIG. The management table takes the "time:" attribute value of "9: (8)" and judges that the timing is the same. Then, the "in progress" of the status information received by the receiving unit 221 is compared, and the "state" attribute value obtained by the feeding device side of the feeding device side shown in Fig. 16 is "in operation", and is judged. For consistency. As a result, the feeder-side acquisition unit 224 determines that the available energy information received by the receiving unit 221 is the available energy that is obtained by each semiconductor manufacturing apparatus U at a predetermined timing, and is specific to each semiconductor manufacturing apparatus. The state information of the state corresponds to the available energy information. The server side acquisition unit ... obtains the available energy information received by the interface unit 221. In the same manner as described above, the server side judgment unit 222 determines whether or not an abnormality has occurred in the available energy. Thereafter, the same processing is repeated, and the judgment of the abnormality of the usable energy, the notification of the abnormality, and the like are performed. 128454.doc •52- 200901269 Above, according to this embodiment, it is set to! More than one semiconductor manufacturing device obtains the information of the available energy, and whether the abnormality is generated by the feeding device _ breaking in the available energy and outputting the judgment result, so that the user can no longer need to patrol the available & The sourcing and the use of the enamel can be performed in a short time and correctly for the usability of the semiconductor manufacturing device. Further, by setting (4) of the light-weight conductor manufacturing apparatus 21 and obtaining the Z energy = information, it is possible to surely perform the appropriate field for each available energy. The next test. Further, by setting the information of the available energy in accordance with the state of the semiconductor manufacturing apparatus u, it is possible to wait for the collection of the available energy until the semiconductor manufacturing apparatus 21 is in a specific state. In addition, the (four) server device 22 is configured to obtain the available energy information that is transmitted at a predetermined timing and that is available in the state information indicating that the semiconductor manufacturing device is in a specific state. The device performs judgment processing for obtaining available energy information, determination processing of the state of available energy, and the like, and simplifies the configuration of each semiconductor manufacturing apparatus η. In the first embodiment, as in the second embodiment, the 匕月匕贝Λ知知112 receives the available energy information sequentially from the sensors of the respective sensors 111 that detect the available energy. And by using the same information as the processing of obtaining the above-mentioned available energy information in the obtained monthly information, the available energy information obtained by the specific timing of the soil/纟, and is used for the semiconductor & The usable energy information obtained in the case of the state of the special state can be stored, for example, in a memory not shown. 128454.doc -53 - 200901269 In this case, as in the second embodiment, the status information acquisition unit 2 1 4 that acquires status information indicating the status of the device itself, that is, the state of the semiconductor manufacturing device can be provided. The semiconductor manufacturing apparatus establishes a correspondence relationship between the state information acquired by the state information obtaining unit 214 and the available energy information, and uses the state information to determine whether the available energy information obtained by the available energy information acquiring unit 112 is The information available on the semiconductor manufacturing equipment in the case of a particular state.

再者,本實施形態之處理亦可以軟體來實現。再者,亦 可藉由軟體下載等來發布該軟體。此外,亦可將該軟體記 錄於CD_RQM等之記錄媒體而發布。另外,此點在本說明 書之其他實施形態中亦相同。 另外’用以實現本實施形態之資訊處理裝置之軟體係為 以下之程式。換言之,該程式係為使電腦執行對於被處理 基板執行㈣之半導體製造過料導體製造裝置所進行之 處之程式為使電腦進行取得表示關於在半導體製造 裝置中所使用d個以上之可用能之值之資訊之可用能資 訊之可用能資訊取得步驟、及將在前述可用能資訊取得步 驟中所取得之可用能資訊發送至伺服器裝^發送”。 此外’該程式係為使電職行與料被處絲板執行特 定之半導體製造裝置之㈤以上之半導體製造裝置連接之 伺服^裝賴料之處理之程式,且為使«執行下列步 驟之程式·接收從前述1個以卜坐播 疋1個以上丰導體製造裝置所發送之 可用=訊之㈣步驟;判斷在前述接收步驟中所接收之Furthermore, the processing of this embodiment can also be realized by software. Furthermore, the software can also be distributed by software download or the like. Further, the software may be recorded on a recording medium such as CD_RQM. In addition, this point is also the same in other embodiments of the present specification. Further, the soft system for realizing the information processing apparatus of the present embodiment is the following program. In other words, the program is a program for causing a computer to execute the semiconductor manufacturing over-conductor manufacturing device for performing (4) on the substrate to be processed, so that the computer obtains the value of the d or more usable energy used in the semiconductor manufacturing device. The available information of the available information of the information can be obtained, and the available information obtained in the step of obtaining the available energy information can be sent to the server for transmission. Further, the program is for the electric service. The program for processing the servo device connected to the semiconductor manufacturing device of the semiconductor manufacturing device of the specific semiconductor manufacturing device, and the program for performing the following steps is received from the aforementioned one. The steps of (a) available for transmission by more than one of the abundance conductor manufacturing devices; determining the received in the aforementioned receiving step

可用此資訊所表示之可用能夕伯e T 了用此之值疋否為特定之值之伺服器 128454.doc -54- 200901269 侧判斷步驟; 斷結果對應之輸出之伺服器側輸出步驟。 此外,該程式係為使電腦執行對於被處理基板執行特a 之半導體製造裝置之半導體製造裝置所進行之處:之= 式’且為使電腦執行下列步驟之程式:取得作為表示關: 在半導體製造過程中所使用之"固以上可用能之值之資訊 之可用能資訊之可用能資訊取得步驟;判斷在前述可用处 Γ 資訊取得步驟中所取得之可用能資訊所表示之可用能之= 是否為特定之值之判斷步驟;及進行與前述判斷步^之判 斷結果對應之輸出之輪出步驟。 單各㈣形態中’各處理(各功能)係可藉由 分散處理來實現。 …藉由稷數個裝置 ▲另外,在上述程式中,發送f訊之發送步驟 讯之接收步驟等中’不包含藉由硬 : ^ Jt. l . , _ 丁 '^處理’例如由 I送步驟中之數據機或介 所進行之處理)。 Μ所進订之處理(僅由硬體 卜執订上述程式之電腦可以是單數 個。亦即,可進行集 疋複數 此外,在上述各實施形態广=行”處理。 上通信機構(發送部等)係可物理性::-:*置… 此自不待言。 地以—個媒體來實現, 本發明並不限定於以上之 等亦包含於本發明之範、H,可作各種變更’該 <靶圍内,此自不待言。 128454.doc •55- 200901269 (產業上之可利用性) 如上所述,本發明之群營 w g理系统等係 利用於半導體製造裝置之可用处 ’、用作為用以檢驗 系統箸,1 用以檢驗分別利用在多數個 尤其適用作為 系統等。 I造褒置中之可用能之 【圖式簡單說明】 圖1係為本實施形態之群管 外耳埋糸統之概余 圖2係為表示同群^ 。The server can use the value indicated by the information to determine whether the value is a specific value of the server 128454.doc -54- 200901269 side judgment step; the server side output step of the output corresponding to the break result. In addition, the program is a program for causing a computer to execute a semiconductor manufacturing device that performs a semiconductor manufacturing device for a substrate to be processed: the following formula: and a program for causing the computer to perform the following steps: obtaining as a representation: in the semiconductor The available energy information acquisition step of the available energy information of the information available in the manufacturing process; determining the available energy represented by the available energy information obtained in the above-mentioned available information acquisition step = Whether it is a judgment step of a specific value; and a rotation step of output corresponding to the judgment result of the aforementioned judgment step ^. In the single (four) form, each process (each function) can be realized by a dispersion process. ...by a number of devices ▲ In addition, in the above program, the receiving step of transmitting the f-message step, etc. 'does not include by hard: ^ Jt. l . , _ Ding '^ processing', for example, sent by I The processing performed by the data machine or mediator in the step).处理The processing of the order (the computer that only binds the above program by the hardware can be singular. That is, the ensemble can be performed in addition to the above-mentioned various embodiments.) The upper communication unit (transmission unit) Etc.) Physicality::-:*Settings This is self-evident. The ground is implemented by a medium, and the present invention is not limited to the above, and is also included in the scope of the present invention, H, and can be variously changed' In the <target range, this is self-evident. 128454.doc • 55- 200901269 (Industrial Applicability) As described above, the group operation system of the present invention is utilized in a semiconductor manufacturing apparatus. , used to test the system 箸, 1 to test the use of the most applicable ones, especially for the system, etc. The available energy in the I 褒 【 【 【 简单 简单 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图The balance of the buried system is shown in Figure 2 as the same group ^.

j w g攻糸統之本半 例之圖。 導體复造裴置11之一 圖3係為同群管理系統之區塊圖。 _為說明同群管理系統之半 流程圖。 每展置之動作之 圖圖5係為說明同群管理系統之词服器裝置之動作之流程 圖6係為表示同群管理系統之可用能管理表j w g attack the system of this half of the example. One of the conductor reconstitution devices 11 is a block diagram of the same group management system. _ is a half flow chart illustrating the same group management system. Figure 5 of each action of the exhibition is a flow illustrating the action of the vocabulary device of the same group management system. Figure 6 is a chart showing the available energy management table of the same group management system.

之圖。 態管理表之 圖7係為表示同群管理系統之取得定時狀 圖。 ' 圖8係為表示同群f理系統之正常範圍管理表之圖。 圖9係為表示同群管理系統之判斷結果管理表之圖。 圖1〇係為表*同群管理系統之客戶料置13之顯示例之 圖1丨係為同群管理系統之變形例之區塊圖。 圖12係為實施形態2之群管理系統之區塊圖。 圖1 3係為說明同群管理系統之半導體製造裝置之動作之 128454.doc -56- 200901269 流程圖。 圖14係為說明同群您 圖。 鮮s理系統之伺服器裝置之動作之流程 圖15係為表示同群管 資訊之模式圖。 圖16係為表示同群管 理表之圖。 理系統之半導體製造裝置所發送 之 理系統之伺服器側取得定時狀態管 【主要元件符號說明】 13 客戶端裝置 11、21 半導體製造裝置 12、22 伺服器裝置 112 、 212 可用能資訊取得部 111 感測器 113 、 213 發送部 121 、 221 接從部 122 、 222 伺服器側判斷部 123 伺服器側輸出部 124 判斷部 125 輸出部 131 客戶端側接收部 132 客戶端側輸出部 214 狀態資訊取得部 224 伺服器側取得部 128454.doc -57-Picture. Fig. 7 is a timing chart showing the acquisition of the same group management system. FIG. 8 is a diagram showing a normal range management table of the same group f system. Fig. 9 is a view showing a judgment result management table of the same group management system. Fig. 1 is a display example of a customer material set 13 of the same group management system. Fig. 1 is a block diagram of a variant of the same group management system. Figure 12 is a block diagram of the group management system of the second embodiment. Fig. 13 is a flow chart showing the operation of the semiconductor manufacturing apparatus of the same group management system, 128454.doc - 56 - 200901269. Figure 14 is a diagram illustrating the same group. Flow of the operation of the server device of the fresh system Fig. 15 is a schematic diagram showing the information of the same group of tubes. Figure 16 is a diagram showing the same group management table. The server side acquisition timing state tube of the processing system transmitted by the semiconductor manufacturing device of the control system [Description of main component symbols] 13 client device 11, 21 semiconductor manufacturing device 12, 22 server device 112, 212 available energy information obtaining portion 111 Sensors 113 and 213 Transmitting units 121 and 221 Connecting units 122 and 222 Serving side judging unit 123 Serving side output unit 124 Judging unit 125 output unit 131 Client side receiving unit 132 Client side output unit 214 Status information acquisition Part 224 Server side acquisition unit 128454.doc -57-

Claims (1)

200901269 十、申請專利範圍: 1. 一種群管理系統,其包括·· 1個以上之半導體製造枣 置,其係對於被處理基板執行特定之半導體製造過=广 及飼服器裝置,其係與該丨個以上之半導體製造裝置遠 接;且 # ' 前述半導體製造裝置係包括: . 可用㈣訊取得部,其係取得表㈣於在半導體製 造過程中所使用之1個以上之可用能之值之資訊即可用 能資訊;及 發送部,其㈣前料絲得料取得之可 用能資訊發送至前述伺服器裝置; 前述伺服器裝置係包括: 接收部’其係接收從前述半導體製造裝置所 可用能資訊; < 伺服器側判斷部,其俏划义 斷别这接收部接收之可用 代所表示之可用能之值是否為特定之值,·及 伺服器側輸出部,发係 ‘ 之判斷結果對應之輸出 W述伺服器側判斷部 2.如:求項1之群管理系統,其中 :述可用能資訊取得部係判斷本 據本身裳置之狀態而取 穿置之狀悉,且依 3.如請失瑁。 向取侍則述各可用能資訊。 如:求項2之群管理系統,其中 裝置之狀態為預先f定之定時’且本身 月形下取得前述可用能資訊。 128454.doc 200901269 4.如請求項2或3之群管理系統,1中 前述可用能資訊取得部係於i身震置為依各可用能資 訊所指定之狀態之情形I了用靶貝 5. 如㈣求項1之群管理系統,其中 前述半導體製造裝置進 係取得表示本 π括狀悲-貝訊取得部,其 身裝置狀態之資訊即狀態資訊; :述發送部係將前述可用能資訊取 能貧訊及前述狀能資邙 付乞Ύ用 〜η 貝迅取得部所取得之狀態資訊發送至 刖述伺服器裝置; 货之主 前述接收部係接收從前 用能資訊與狀態資訊;導體製造裝置所發送之可 前述伺服器裝置進一步包 Μ Α、+、括 7匕括伺服器側取得部,其係依 據刖述接收部所接收 接收之可用能資訊; 而取得前述接收部所 前述伺服器裝置之伺服器 所接收之可用能資1 ^ +辦”糸判斷珂述接收部 犯貝訊中丽述伺服器側取 能資訊所表示之可用处夕伯a 取传4取付之可用 J用此之值疋否為特定 6.如請求項5之群管理系統,其中 之值。 前述飼服器側取得部係取得各半 指定之定時所取得之可用能資訊,且盘表 在預先 造裝置為特定狀態之狀態資訊對應之^表1各半導體製 7·如^求項5或6之群管理系統,其巾用…。 前述伺服器側取得部係在各半 狀態資訊表干^ , ϋ造農置所發送之 不為依各可用能資訊所指定之狀態之情形 128454.doc 200901269 下取得與該狀態資訊對應之各可用能資訊。 半導體製造裝置,其係對於被處理基板執行特定之 半導體製造過程,且包括: 、σ 資nfL取得部,其係取得表示關於在半導體製造 .中所使用之1個以上之可用能之值之資訊即可用能 資訊; & ^’纟係判冑前述可用㉟資訊取得部取得之可用 能資訊所表示之可用能之值是否為特定之值;及 '卩其係進行與前述判斷部之判斷結果對應之輸 9.如清求項8之半導體製造裝置,其中 引述可用咸貧訊取得部係判斷本身裝置之狀態,且依 據本身裝置之狀態而取得前述各可用能資訊。 10·如請求項9之半導體製造裝置,其中 种前述可用能資訊取得部係在預先指定之定時,且本身 衣置之狀態為特定狀態之情形下取得可用能資訊。 11· ★ π求項9或10之半導體製造裝置,其中 •前述可用能資訊取得部係於本身裝置為依各可用能資 訊所^疋之狀態之情形下取得該各可用能資訊。 、^訊處理方法’其係在對於被處理基板執行特定之 半導體製造過程之半導體製造裝置中所執行者,且包括 下列步驟: 、了用能貧訊取得步驟,其係取得表示關於在半導體製 仏過程中所使用之個以上之可用能之值之資訊即可用 128454.doc 200901269 能資訊;及 發送步驟,其係將在前述次 得之环田At 一 用此貝訊取得步驟中所取 付之可用症貧訊發送至飼服器褒置。 13. —種資訊處理方法,A 之半導俨# ” 在,、對於被處理基板執行特定 之牛導體製造過程之1個 m^n^Wxb 上丰導體製造裝置連接之伺 服為益裝置中所執行者, 且包括下列步驟: 接收步驟,其係接收從俞、^ ^ ^ ^ -r 述】個以上半導體製造裝置 所發送之可用能資訊; ^ 伺服器側判斷步驟,Α ^ m ^ ,一、#斷在則述接收步驟中接收 用月匕負sil所表示之可用At々社β , 用此之值疋否為特定之值;及 飼服器側輸出步驟,盆 _么 ,、係進仃與則述伺服器側判斷步 驟之判斷結果對應之輸出。 14 · 一種資訊處理方法, 在對於被處理基板執行特定之 半導體製造過程之半導,劁 +導體製造裝置中所執行者,且包括 下列步驟: 可用能資訊取得步驟,苴椋 造過程中所使用之_、關於在半導體製 能資訊. 以上之可用能之值之資訊即可用 判斷步驟,J:你生丨i & ^ /糸判斷在則述可用能資訊取得步驟中取 得之可用能資訊所表 表不之可用能之值是否為特定之值;及 … 驟〃係進行與前述判斷步驟之判斷結果對庫 之輸出。 小町應 15· "種s己錄體,甘β 上4 其係記錄有使電腦執行由對於被處理美 板執行特定之半暮 ^ 牛導體製造過程之半導體製造裝置所進行 128454.doc 200901269 之處理之%式,且該程式係用以使電腦執行下列步驟: 可用能資訊取得㈣,其絲得表示關於在半導體製 ^程中所使用之1個以上之可用能之值之資訊即可用 能資訊;及 /送步驟’其係將在前料用能資訊取得步驟中所取 得之可用能資訊發送至伺服器裝置。 16. -種記錄媒體’其係記錄有使電腦執行由與對於被處理 r 基板執行特定之半導體製造過程之i個以上半導體製造 裝置連接之健H裝置料行之處理之程式,且該程式 係用以使電腦執行下列步驟: 接收步驟,其係接收從前述i個以上半導體製造裝置 所發送之可用能資訊; 伺服器側判斷步驟,其係判斷在前述接收步驟中接收 之可用能資訊所表示之可用能之值是否為特定之值;及 伺服器側輸出步驟,其係進行與前述飼服器側判斷步 〇 驟之判斷結果對應之輸出。 17_ 一種記錄《’其係記錄有使電腦執行由對於被處理基 板執彳τ特&之半導體製造過程之半導體製造裝置所進行 之處理之程式’且該裎式係、用以使電腦執行下列步驟: 、可用I M 5fl取传步驟,其係取得表示關於在半導體製 以過私中所使用之1個以上之可用能之值之資訊即可用 能資訊; …判斷步驟’其係判斷在前述可用能資訊取得步驟中取 付之可用能責訊所表示之可用能之值是否為特定之值;及 128454.doc 200901269 輸出步驟,其係進行與前述判斷步驟之判斷結果對應 之輸出。 ( 128454.doc200901269 X. Patent application scope: 1. A group management system, which includes more than one semiconductor manufacturing jujube, which performs specific semiconductor manufacturing on the substrate to be processed, and the device is attached to the device. The plurality of semiconductor manufacturing apparatuses are remotely connected; and the semiconductor manufacturing apparatus includes: (a) information acquisition unit, which obtains the value of one or more available energy used in the semiconductor manufacturing process. The information can be used as the energy information; and the transmitting unit, (4) the available energy information obtained by the front feed is sent to the server device; the server device includes: the receiving portion is received from the semiconductor manufacturing device. [Information]; < The server side judgment unit determines whether the value of the available energy indicated by the available unit received by the receiving unit is a specific value, and the judgment of the server side output unit and the sender system The output corresponding to the server side judgment unit 2. For example, the group management system of item 1, wherein: the available energy information acquisition unit determines the data itself The state of the dress is taken and the situation is worn, and according to 3. Please fail. The available energy information is described to the escort. For example, the group management system of the item 2, wherein the state of the device is a predetermined timing, and the aforementioned available energy information is obtained under the shape of the moon. 128454.doc 200901269 4. In the group management system of claim 2 or 3, the above-mentioned available energy information acquisition unit is in the case where the body is set to the state specified by each available energy information. (4) The group management system of claim 1, wherein the semiconductor manufacturing device obtains information indicating that the device is in a state of state, that is, status information; The information obtained by the Department of Access is sent to the server device; the recipient of the goods receives the previous energy information and status information; The server device may further include a server side acquisition unit, wherein the server side acquisition unit receives the available energy information received and received by the receiving unit, and obtains the servo of the receiving unit. The available energy of the server is received by the server. The judgment is received by the receiving department. The available information indicated by the server side of the data is displayed on the server side. J uses this value to determine whether it is a specific 6. The group management system of claim 5, wherein the value is obtained. The above-mentioned feeding machine side acquisition department obtains the available energy information obtained at the timing specified by each half, and the disk table is in advance. The state information of the device is in a specific state. Table 1 is a semiconductor system. The group management system of the item 5 or 6 is used for the towel. The server side acquisition unit is in each half state information table. The information on the available energy corresponding to the status information is obtained under the condition that the status is not specified by the available energy information. 128454.doc 200901269 Obtains the available energy information corresponding to the status information. The semiconductor manufacturing device performs specific processing on the processed substrate. The semiconductor manufacturing process includes: σ n nfL acquisition unit, which obtains information on the value of one or more available energy used in semiconductor manufacturing. The information can be used; & ^' Whether the value of the available energy indicated by the available energy information obtained by the 35 information acquisition unit is a specific value; and 'the department performs the input corresponding to the judgment result of the foregoing judgment unit. The semiconductor manufacturing apparatus of claim 8, wherein the available salt-to-acquisition acquisition unit determines the state of the device itself, and obtains the aforementioned available energy information according to the state of the device itself. 10. The semiconductor manufacturing device of claim 9, wherein The available energy information acquisition unit obtains the available energy information at a predetermined timing and the state of the own clothing is in a specific state. 11· ★ π-item 9 or 10 semiconductor manufacturing apparatus, wherein the aforementioned available energy information The acquisition unit obtains the available energy information in a state in which the device is in accordance with the state of the available energy information. The processing method is a semiconductor manufacturing device that performs a specific semiconductor manufacturing process on the substrate to be processed. Executed by the executor, and includes the following steps: Steps to obtain the information about the available energy used in the semiconductor manufacturing process can be obtained by using the information of 128454.doc 200901269 And the sending step, which will be paid in the above-mentioned second round of Atta At. The available information is sent to the feeding device. 13. A kind of information processing method, A semi-conducting 俨#", in the m-n^Wxb of the specific bobconduct manufacturing process for the substrate to be processed, the servo-connected device is connected to the servo device. The executor includes the following steps: a receiving step of receiving available energy information transmitted by more than one semiconductor manufacturing device from the ^^^^-r; ^ server side determining step, Α ^ m ^ , one In the receiving step, the receiving At 々 表示 所 所 , , , , , , , sil sil sil sil sil sil sil sil sil sil sil sil sil sil sil sil sil sil sil sil sil sil sil sil sil sil sil sil sil sil sil sil sil sil sil sil And an output corresponding to the judgment result of the server side judging step. 14 · An information processing method, performed on a semi-conductor performing a specific semiconductor manufacturing process on a substrate to be processed, performed in a 劁+conductor manufacturing apparatus, and including The following steps: The available information can be used to obtain the steps, the _ used in the manufacturing process, and the information on the value of the available energy in the semiconductor. The judgment step can be used. J: You are born i &am p; ^ /糸 determines whether the value of the available energy information obtained in the available energy information obtaining step is not a specific value; and... The output of Xiaomachi should be 15 · " kind of recorded, Gan β 4 is recorded in the system to enable the computer to perform a specific manufacturing process for the processing of the US board for the semiconductor manufacturing process of 128454. Doc 200901269 is a % of the processing, and the program is used to enable the computer to perform the following steps: The available information can be obtained (4), which is indicative of information about the value of more than one available energy used in the semiconductor manufacturing process. That is, the available energy information; and / send step 'the system will send the available energy information obtained in the pre-material energy information obtaining step to the server device. 16. - The recording medium 'is recorded to enable the computer to execute A program for processing a H device that is connected to one or more semiconductor manufacturing devices that perform a specific semiconductor manufacturing process on a processed r substrate, and the program is used to make a computer The following steps are: receiving a step of receiving the available energy information transmitted from the i or more semiconductor manufacturing apparatuses; and a server side determining step of determining the available energy indicated by the available energy information received in the receiving step Whether the value is a specific value; and a server side output step, which is an output corresponding to the judgment result of the aforementioned feeding machine side judgment step. 17_ A record "There is a record that causes the computer to execute by being processed The substrate is executed by the semiconductor manufacturing device of the semiconductor manufacturing process, and the program is used to cause the computer to perform the following steps: The semiconductor system can use the information of the value of more than one available energy used in the private use; the determining step is to determine the available energy indicated by the available energy blame in the aforementioned available energy information obtaining step. Whether the value is a specific value; and 128454.doc 200901269 output step, which is performed with the judgment result of the foregoing judgment step Corresponding output. (128454.doc
TW097107524A 2007-06-29 2008-03-04 A group management system, a semiconductor manufacturing apparatus, an information processing method, and a recording medium TWI390594B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007172988A JP4504400B2 (en) 2007-06-29 2007-06-29 Group management system, semiconductor manufacturing apparatus, information processing method, and program

Publications (2)

Publication Number Publication Date
TW200901269A true TW200901269A (en) 2009-01-01
TWI390594B TWI390594B (en) 2013-03-21

Family

ID=40197302

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097107524A TWI390594B (en) 2007-06-29 2008-03-04 A group management system, a semiconductor manufacturing apparatus, an information processing method, and a recording medium

Country Status (4)

Country Link
JP (1) JP4504400B2 (en)
KR (1) KR100933001B1 (en)
CN (1) CN101334665B (en)
TW (1) TWI390594B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9400794B2 (en) 2012-07-17 2016-07-26 Hitachi Kokusai Electric Inc. Group management apparatus, substrate processing system and method of managing files of substrate processing apparatus
CN113448414A (en) * 2020-03-27 2021-09-28 奇景光电股份有限公司 Normally open system with multi-tier power management
TWI753379B (en) * 2020-03-12 2022-01-21 奇景光電股份有限公司 Always-on system with multi-layer power management

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6133164B2 (en) 2013-08-12 2017-05-24 東京エレクトロン株式会社 Group management system and program
JP6645993B2 (en) * 2016-03-29 2020-02-14 株式会社Kokusai Electric Processing device, device management controller, program, and method of manufacturing semiconductor device
CN107240564B (en) * 2016-03-29 2021-01-05 株式会社国际电气 Processing device, device management controller, and device management method
JP6745673B2 (en) 2016-08-05 2020-08-26 東京エレクトロン株式会社 Semiconductor system
JP6616347B2 (en) * 2017-03-29 2019-12-04 ファナック株式会社 Management system
JP7059105B2 (en) * 2018-05-18 2022-04-25 キヤノン株式会社 Data processing equipment, data processing methods, programs, and data processing systems
CN109801479A (en) * 2018-12-12 2019-05-24 西安电子科技大学 A kind of monitoring of semiconductor processes and early warning system and its control method
US11670154B2 (en) 2020-10-06 2023-06-06 Nanya Technology Corporation System and method for controlling semiconductor manufacturing apparatus

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5476000A (en) * 1977-11-30 1979-06-18 Toshiba Corp Process alarm unit
JPH04170619A (en) * 1990-11-05 1992-06-18 Hitachi Ltd Controller for semiconductor manufacture equipment
JPH09305202A (en) * 1996-05-16 1997-11-28 Kokusai Electric Co Ltd Monitor controller for gas flow rate
JP2001332463A (en) * 2000-05-24 2001-11-30 Tokyo Electron Ltd Apparatus and method for management of apparatus for semiconductor manufacture
JP4764552B2 (en) * 2001-01-22 2011-09-07 株式会社日立国際電気 Semiconductor manufacturing apparatus, semiconductor manufacturing apparatus control program providing system, semiconductor manufacturing apparatus control program providing method, semiconductor manufacturing apparatus control program management server, semiconductor manufacturing apparatus controller, and semiconductor device manufacturing method
JP2002280278A (en) * 2001-03-15 2002-09-27 Toshiba Corp Method and system for controlling semiconductor manufacturing apparatus
WO2006016436A1 (en) * 2004-08-11 2006-02-16 Tokyo Electron Limited Control system, control method, processing system, computer readable storing medium and computer program
JP4384093B2 (en) * 2004-09-03 2009-12-16 株式会社東芝 Process state management system, management server, process state management method, and process state management program
JP5259042B2 (en) * 2004-09-24 2013-08-07 株式会社日立国際電気 Semiconductor manufacturing system, semiconductor manufacturing apparatus logging method, management apparatus, and management apparatus program
KR20060077561A (en) * 2004-12-30 2006-07-05 삼성전자주식회사 Methode for controling semiconductor manufacture equipment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9400794B2 (en) 2012-07-17 2016-07-26 Hitachi Kokusai Electric Inc. Group management apparatus, substrate processing system and method of managing files of substrate processing apparatus
TWI753379B (en) * 2020-03-12 2022-01-21 奇景光電股份有限公司 Always-on system with multi-layer power management
CN113448414A (en) * 2020-03-27 2021-09-28 奇景光电股份有限公司 Normally open system with multi-tier power management

Also Published As

Publication number Publication date
JP2009016379A (en) 2009-01-22
TWI390594B (en) 2013-03-21
KR100933001B1 (en) 2009-12-21
KR20090004423A (en) 2009-01-12
CN101334665B (en) 2011-12-07
JP4504400B2 (en) 2010-07-14
CN101334665A (en) 2008-12-31

Similar Documents

Publication Publication Date Title
TW200901269A (en) Cluster management system, semiconductor manufacturing device and information processing method
TWI338824B (en)
CN106301884B (en) Control device, network system, and server
JP4290190B2 (en) Group management system, server device, and program
TW200841189A (en) Technique for accurately detecting system failure
TW201140096A (en) Test device and test method
JP2018139075A (en) Sensor management module, sensor management system, sensor management method, program, and recording medium
JP6534692B2 (en) Order management apparatus, order management method and order management system
US20210073775A1 (en) Support system and method for the management of beverages bars in points of sale
JP2001312394A (en) Image terminal equipment
JP5107056B2 (en) Substrate processing apparatus management method, substrate processing system, and centralized management apparatus
JP6510764B2 (en) Server, control method, program, and management system
TW200813879A (en) Server and program
CN113014640B (en) Request processing method, request processing device, electronic equipment and storage medium
JP6013385B2 (en) Electricity meter and watt-hour meter verification system
JP2004040302A (en) Network facsimile machine
US20070073432A1 (en) System and method for capturing manufacturing data automatically
JP2009070257A (en) Contained chemical substance information management system, supplier terminal, contained chemical substance information management method, and contained chemical substance information management program
JP5054551B2 (en) Standby power reduction support system, management server, and standby power reduction support method
CN111201573A (en) Portable medical data concentrator
JP2017027173A (en) Method, system and program for determining decease, and message providing system using the same
JP3963726B2 (en) Earthquake waveform data collection device and earthquake observation system
JP2011053793A (en) Article information management apparatus and program
JP7267039B2 (en) measuring system
JP5593133B2 (en) Information management system, terminal device, and operation method of terminal device

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees