JP5259042B2 - Semiconductor manufacturing system, semiconductor manufacturing apparatus logging method, management apparatus, and management apparatus program - Google Patents

Description

  The present invention relates to a semiconductor manufacturing system having a logging function.

  The semiconductor manufacturing system manages a semiconductor manufacturing apparatus that performs processing such as film formation on a wafer with a centralized management apparatus via a network. A conventional centralized management device collects logging data (for example, furnace temperature and gas flow rate) from a semiconductor manufacturing device via a network, stores it in a storage unit, and stores various types of logging data as necessary. Output to the display screen.

  However, the logging function of the conventional centralized management apparatus has a fixed logging condition, and simply records material supply information (gas flow rate and furnace temperature) under the fixed condition. The purpose of these logging is limited to the purpose of confirming the quality of film formation, as long as it is used as a confirmation means for estimating the quality after film formation (has a stable material supplied during the process?). It was.

  Therefore, from these data, the gas flow rate actually consumed during processing such as film formation, the power consumption amount, etc. could not be obtained. The obtained logging data is only a guide for various consumptions, and was not useful data. In particular, since the logging conditions are fixed, it is possible to obtain only data under the fixed conditions, and it is not possible to flexibly meet a wide range of requests from users such as semiconductor manufacturers.

For example, in order to maintain a predetermined device status, it is necessary to constantly supply equipment resources (gas, power, etc.) for that purpose to the equipment, and the equipment resource consumption at that time (hereinafter, equipment consumption) However, since it is difficult to set a predetermined device status as a logging condition, it was not possible to easily know the facility resource consumption at that time.
In addition, since the logging condition is limited to the processing such as film formation, the data during processing can be obtained, but the data during non-processing cannot be obtained. As an example, since it is difficult to determine the flow rate of inert gas that flows at idle (IDLE) when no cassette is inserted in the device, it is easy to know how much gas is wasted when idle. Could not know.

  In addition, in the fixed logging method having no versatility, for example, when the calculation method of the equipment consumption of the apparatus is different for each user, it is necessary to make a specification individually. Therefore, the specification creation work is complicated, and it is difficult to realize a logging function common to all users.

  An object of the present invention is to provide a semiconductor manufacturing system capable of solving the above-described problems of the prior art and realizing a general-purpose logging mechanism.

According to a first aspect of the present invention, there is provided a semiconductor manufacturing method comprising: integrating a time when the logging condition is satisfied, using a combination of arbitrary device statuses as a logging condition among a plurality of apparatus statuses indicating a state of the semiconductor manufacturing apparatus. System. Here, as the device status, there are “RESET”, “RUN”, “END” and the like in the device operation mode indicating the operation status, and “REMOTE” in the mechanical mode indicating the state of the transfer machine. , “LOCAL”, and “HOME”, “LOADING”, “CAP”, etc. in the boat mode indicating the state of the boat, and the valve number serial number ( # 1 to # 64).
Unlike the case where the logging conditions are fixed, the logging conditions can be arbitrarily set according to the combination of the device status, so that a general-purpose logging function can be realized.

According to a second aspect of the present invention, in the semiconductor manufacturing system in which the semiconductor manufacturing apparatus is managed by the management apparatus, the management apparatus arbitrarily selects a logging condition of the semiconductor manufacturing apparatus from a plurality of apparatus statuses indicating the state of the semiconductor manufacturing apparatus A condition setting unit that is set by selecting the device status, a detection unit that detects a device status of the semiconductor manufacturing apparatus, a device status that is set by the condition setting unit, and a device status that is detected by the detection unit A semiconductor manufacturing system comprising: a control unit that compares and determines that the logging condition is established when they match, and accumulates the established time.
The condition setting unit sets a logging condition as an arbitrary combination of device statuses. The detection unit detects a plurality of device statuses of the semiconductor manufacturing apparatus. The detected device status is input to the control unit and compared with the device status set as the logging condition. When the comparison results match, the control unit determines that the logging condition has been established, and integrates the established time.
Since the accumulated time during the period in which the logging condition is established is known, logging data including this accumulated time can be obtained quantitatively. Therefore, a useful logging function can be realized.

According to a third invention, in the second invention, the control unit stores an arbitrary device status set by the setting unit, and stores a device status of the semiconductor manufacturing apparatus detected by the detection unit. The device status set by the condition setting unit stored in the first storage unit and the device status detected by the detection unit are compared and the establishment of the logging condition is determined when they match. A condition determining unit, a calculating unit for obtaining a time when the logging condition determined by the condition determining unit is established, and a second storage unit for saving the time obtained by the calculating unit. It is a semiconductor manufacturing system.
Since the control unit includes the first storage unit, the condition determination unit, the calculation unit, and the second storage unit, a general-purpose logging function can be easily realized.

According to a fourth aspect, in the second aspect, the logging condition includes a start condition and an end condition, and the detection unit detects a device status of the semiconductor manufacturing apparatus, and the condition determination unit sets the device status and the detection device. Comparison with status is performed at predetermined time intervals, and the condition determination unit sets a condition flag when the start condition is satisfied, and when an end condition is satisfied with the flag set, It is a semiconductor manufacturing system in which the condition flag is dropped and the establishment of the logging condition is determined based on the presence or absence of the condition flag.
Whether or not the logging condition is established can be determined based on the presence or absence of the condition flag. Therefore, the establishment of the logging condition can be easily determined, and a general-purpose logging function can be easily realized.

According to a fifth invention, in the second to third inventions, an output request for logging data is made, an input / output unit for displaying and outputting the logging data on a screen, and an output request for logging data from the input / output unit. In this case, the semiconductor manufacturing system includes an output control unit that reads the logging data from the second storage unit and outputs the logging data to the input / output unit.
When the logging data output is requested, the input / output unit outputs the logging data to the display screen, so that the logging data can be easily referred to as necessary.

A sixth invention is a semiconductor manufacturing system according to any one of the first to fifth inventions, wherein a plurality of the semiconductor manufacturing apparatuses are connected to the management apparatus via a network.
Since a plurality of semiconductor manufacturing apparatuses are connected to the management apparatus via a network, a general-purpose logging function can be realized for a plurality of semiconductor manufacturing apparatuses.

According to a seventh invention, in the second invention to the sixth invention, the facility consumption of the semiconductor manufacturing apparatus per unit time under the logging condition set by the condition setting unit, and the time when the logging condition is established A semiconductor manufacturing system characterized in that, by integrating, the equipment consumption of the semiconductor manufacturing apparatus can be converted.
Since the equipment consumption of the semiconductor manufacturing apparatus can be converted, a general-purpose logging function capable of managing the equipment consumption of the semiconductor manufacturing apparatus can be realized.

An eighth invention is a semiconductor manufacturing system according to the first to seventh inventions, wherein a plurality of the logging conditions can be registered.
Since more than one logging condition can be registered with any combination of device statuses, a more versatile logging function can be realized.

  Ninth invention is a semiconductor manufacturing system capable of logging the integrated value of the time when the logging condition is satisfied or the integrated value of the gas flow rate flowing through the valve, using the valve status of the pipe connected to the processing chamber as a logging condition. System.

  In a tenth aspect based on the ninth aspect, an integrated value of the time when the logging condition is satisfied, with the valve status of the gas pipe supplying the material connected to the processing chamber for processing the substrate as the logging condition, or This is a semiconductor manufacturing system capable of logging the integrated value of the gas flow rate flowing through the valve.

  In an eleventh aspect based on the ninth aspect, the valve status of the exhaust pipe connected to the pump exhausting the processing chamber is used as a logging condition, and the integrated value of the time when the logging condition is satisfied or the gas flowing through the valve This is a semiconductor manufacturing system capable of logging the integrated value of the flow rate.

  A twelfth aspect of the invention is a semiconductor manufacturing system in which an integrated value of a time when the logging condition is satisfied can be logged using a mode of a transfer machine for transferring a substrate to a processing chamber as a logging condition.

  A thirteenth aspect of the invention is a semiconductor manufacturing system capable of logging an integrated value of time when the logging condition is satisfied, using a boat mode of a substrate holder that holds a plurality of substrates in a horizontal posture in multiple stages as a logging condition.

According to the present invention, since any combination of device statuses is used as a logging condition, a general-purpose logging mechanism can be realized.
In addition, since the user can freely select and create an arbitrary logging condition, when the user requests a logging condition that does not currently exist, it can be realized without software modification.

Embodiments of the present invention will be described below.
[Outline of the embodiment]
In the present embodiment, various device statuses held by the semiconductor manufacturing apparatus are periodically detected, and when the detected device status satisfies a specific combination of device statuses set as logging conditions, The system is equipped with a logging function that accumulates the time during which the specific device status is maintained and records it on a daily basis.

In equipment operation, in order to maintain a specific equipment status, it is necessary to constantly supply equipment resources. Resources include, for example, power supply for maintaining the furnace temperature, and N ₂ gas supply for preventing pipe clogging due to adhesive gas. A value obtained by integrating the time during which the specific device status is maintained can be used for conversion into the consumption of the facility resource for maintaining the specific device status.

For example, a case of converting how much SiH ₂ Cl ₂ (DCS) gas is consumed when the apparatus operating state is RUN (film formation) will be described with reference to FIG. FIGS. 8A and 8B show two types of gas piping patterns. A square mark on the piping means a mass flow controller (MFC), and a circle mark means an on-off valve. The number assigned to the MFC is the channel number, and the # number assigned to the valve is the valve number. For example, MFC has 16 channels and 64 valves. In general, since the gas flow rate controlled by each MFC is fixed, the gas flow rate can be designated by selecting MFC Nos. 1-16. Note that the gas piping pattern and the numbers assigned to the MFC and the valve are not fixed and differ depending on the user.

When SiH ₂ Cl ₂ is supplied using a gas piping pattern, the consumption of SiH ₂ Cl ₂ can be converted when the gas piping pattern is different as shown in FIG. 8 (a) and FIG. 8 (b). The logging conditions need to be different. That is, it is necessary to combine the channel number of the MFC for controlling the flow rate of SiH ₂ Cl ₂ and the valve number for opening and closing the gas pipe leading from the SiH ₂ Cl ₂ source to the MFC to be used as the logging condition.

If the flow rate of SiH ₂ Cl ₂ controlled by the MFC and the time during which the valve is open are known, the gas consumption can be determined.
The gas flow rate controlled by each MFC is usually fixed and known. The open / close state of the valve is determined by comparing the device status detected by the change of the valve state with the start trigger (start condition) and end trigger (end condition), and whether or not the condition is satisfied. The start trigger detects the open state of the valve, and the end trigger detects the closed state of the valve. The start trigger and the end trigger are compared with the detected device status at every predetermined time interval, and the time during which the valve is open is obtained from the result, and this is integrated. Thus, the duration time during which SiH ₂ Cl ₂ flows through the MFC of the channel number via the valve of the number is obtained. Since the gas flow controlled by the MFC is known, the consumption of SiH ₂ Cl ₂ can be calculated by multiplying this known flow by the duration. That is, the consumption amount of SiH ₂ Cl ₂ can be converted from the duration time.
The flow rate of SiH ₂ Cl ₂ controlled by MFC is ₂ slm or 3 slm when a nitride film is formed using, for example, SiH ₂ Cl ₂ and NH ₃ .

The apparatus status as a logging condition for obtaining the time during which SiH ₂ Cl ₂ is supplied is a combination of MFC No. 5 and valves # 8 and # 28 in FIG. (B) is a combination of MFC No. 3 and valve # 7.

In the example of FIG. 8B, even when MFC No. 3 is selected, SiH ₂ Cl ₂ is not necessarily supplied to MFC No. 3, but is replaced with SiH ₂ Cl ₂ and N There are times when you are playing ₂ . This N ₂ logging condition must be a combination of MFC No. 3 and valve # 6.

  In the device operation mode, the logging condition for converting the waste gas amount at the time of IDLE is not only the combination of the MFC channel number and the valve number, but also the device operation mode parameter “IDLE” is used as the logging condition. Need to be combined.

  In order to convert the power consumption during operation of the apparatus, since the exhaust pump is always turned on during operation, the ON / OFF state of the exhaust pump may be used as the logging condition as the apparatus status.

  Further, in order to convert the time required for the maintenance of the apparatus, the parameter “LOCAL” in the apparatus status column “Trans Mode” may be used as a condition. This is because the transformer mode indicates the operation mode of the wafer transfer device, and among the parameters in the operation mode of the wafer transfer device, the maintenance is performed after the transfer device is always set to the LOCAL mode.

  As described above, in the embodiment, a combination of a plurality of device statuses can be freely set as a logging condition by the user, so that a general-purpose logging mechanism can be realized. Further, since the equipment consumption for maintaining the device status can be converted from the integration result of the time during which the device status is maintained, a general-purpose logging mechanism can be realized.

[Details of the embodiment]
The semiconductor manufacturing system of the embodiment will be described in detail below.

FIG. 9 shows a semiconductor manufacturing system for controlling a semiconductor manufacturing apparatus. The semiconductor manufacturing system includes a plurality of semiconductor manufacturing apparatuses 10, a centralized management apparatus 20, and a network 30 that connects the plurality of semiconductor manufacturing apparatuses 10 to the centralized management apparatus 20.
The centralized management device 20 holds recipes used in each semiconductor manufacturing device 10, performs management such as editing of each recipe and storage of a history of used production recipes, and production to be executed via the network 30. The recipe is delivered to each semiconductor manufacturing apparatus 10. The central management apparatus 20 has a logging function for recording the processing data of each semiconductor manufacturing apparatus 10 and collects various apparatus statuses of each semiconductor manufacturing apparatus 10 via the network 30.

  The semiconductor manufacturing apparatus 10 is operated based on a recipe, and processing data such as temperature, pressure, gas flow rate, and changes with time thereof are transferred as logging data to the centralized management apparatus 20 via the network 30.

FIG. 10 shows a schematic configuration of a semiconductor manufacturing apparatus according to the embodiment.
A cassette stage 105 is provided on the front side of the inside of the housing 101 as a holder transfer member that transfers the cassette 100 as a substrate storage container to and from an external transfer device (not shown). Is provided with a cassette elevator 115 as lifting means, and a cassette transfer machine 114 as a conveying means is attached to the cassette elevator 115. Further, a cassette shelf 109 as a means for placing the cassette 100 is provided on the rear side of the cassette elevator 115, and a spare cassette shelf 110 is also provided above the cassette stage 105. A clean unit 118 is provided above the spare cassette shelf 110 so that clean air is circulated inside the housing 101.

  A processing furnace 202 is provided above the rear portion of the housing 101, and a boat 217 as a substrate holding unit that holds the wafers 200 as substrates in a horizontal posture in multiple stages is raised and lowered to the processing furnace 202 below the processing furnace 202. A boat elevator 121 as an elevating means is provided, and a seal cap 219 as a lid is attached to the tip of an elevating member 122 attached to the boat elevator 121 to support the boat 217 vertically. Between the boat elevator 121 and the cassette shelf 109, a transfer elevator 113 as an elevating means is provided, and a wafer transfer machine 112 as a transfer means is attached to the transfer elevator 113. Further, a furnace port shutter 116 as a shielding member that has an opening / closing mechanism and closes the lower surface of the processing furnace 202 is provided beside the boat elevator 121.

  The cassette 100 loaded with the wafers 200 is carried into the cassette stage 105 from an external transfer device (not shown) in an upward posture, and is rotated by 90 ° on the cassette stage 105 so that the wafer 200 is in a horizontal posture. Further, the cassette 100 is transported from the cassette stage 105 to the cassette shelf 109 or the spare cassette shelf 110 by cooperation of the raising / lowering operation of the cassette elevator 115, the transverse operation, the advance / retreat operation of the cassette transfer machine 114, and the rotation operation.

  The cassette shelf 109 has a transfer shelf 123 in which the cassette 100 to be transferred by the wafer transfer device 112 is stored. The cassette 100 to which the wafer 200 is transferred is transferred by the cassette elevator 115 and the cassette transfer device 114. Transferred to the transfer shelf 123.

When the cassette 100 is transferred to the transfer shelf 123, the wafer 200 is transferred from the transfer shelf 123 to the lowered boat 217 by the cooperation of the advance / retreat operation, the rotation operation of the wafer transfer device 112, and the lifting / lowering operation of the transfer elevator 113. Is transferred.
When a predetermined number of wafers 200 are transferred to the boat 217, the boat 217 is inserted into the processing furnace 202 by the boat elevator 121, and the processing furnace 202 is airtightly closed by the seal cap 219. The wafer 200 is heated in the hermetically closed processing furnace 202 and a processing gas is supplied into the processing furnace 202 to process the wafer 200.

  When the processing on the wafer 200 is completed, the wafer 200 is transferred from the boat 217 to the cassette 100 of the transfer shelf 123 by the reverse procedure of the above-described operation, and the cassette 100 is transferred from the transfer shelf 123 by the cassette transfer machine 114. It is transferred to the cassette stage 105 and carried out of the housing 101 by an external transfer device (not shown). The transport operation of the cassette transfer machine 114 and the like is controlled by the transport control means 124. The above-described operation of the semiconductor manufacturing apparatus is performed based on a recipe.

  FIG. 1 shows a configuration of a centralized management apparatus 20 according to the embodiment. The centralized management apparatus includes an internal storage unit (hereinafter referred to as internal memory) 21 as a first storage unit, an inter-device communication unit 22 as a detection unit, an input / output unit 23, a condition setting unit 24, a condition determination unit 25, and a calculation unit 26. And an external storage unit 27 as a second storage unit, and a display control unit 28. The internal memory 21, the condition determination unit 25, the calculation unit 26, and the external storage unit 27 constitute a control unit that determines the establishment of the logging condition and integrates the established time. The control unit (excluding the storage unit), the inter-device communication unit 22, and the condition setting unit 25 are configured by a CPU that realizes each function by a program.

  The internal memory 21 stores various device statuses detected from each semiconductor manufacturing device, device statuses set by the condition setting unit 24, condition flags, and the like. The set device status includes a setting device status that is a logging start condition and a setting device status that is a logging end condition. The internal memory 21 is composed of a RAM or the like.

  The inter-device communication unit 22 is connected to the network 30, detects various device statuses of the respective semiconductor manufacturing devices 10 sent via the network 30 at predetermined time intervals, and stores them in the internal memory 21. The saved device status becomes the detection device status.

  The input / output unit 23 includes a keyboard or mouse (keyboard or the like) 23a serving as input means, and a display device 23b serving as output means. While viewing the display screen (described later) when logging conditions are set to be displayed on the display device 23b, a specific device status is selected from a plurality of device statuses from the keyboard 23a, and the logging start condition and end condition are set. Or the integrated control unit 28 is requested to display the accumulated time from the keyboard 23a or the like, or the output result of the logging data is displayed on the display device 23b.

  The condition setting unit 24 stores in the internal memory 21 a logging start condition and an end condition composed of a combination of a plurality of device statuses set by the input / output unit 23. The stored device status becomes the set device status.

  The condition determination unit 25 compares the detection device status and the setting device status in the internal memory 21 at predetermined time intervals to determine whether the logging start condition or the logging end condition is satisfied.

  The calculation unit 26 includes a calculation unit and a storage execution unit. The calculation unit accumulates the duration time during which the condition determined by the condition determination unit 25 is established, and gives a storage command to the storage execution unit after the integration. Configured as follows.

  The external storage unit 27 receives a storage command from the storage execution unit of the calculation unit 26 and stores the integration result. An example of the external storage unit 27 is a hard disk (HD). Hereinafter, the external storage unit is referred to as a hard disk (HD) 27.

  When there is an integration time display request from the keyboard 23a or the like of the input / output unit 23, the display control unit 28 reads the integration result from the hard disk (HD) 27 and gives an integration time monitor display command to the display device 23b.

  The functions of the condition setting unit 24 and the condition determination unit 25 will be described using the flowchart of FIG. There are four types of logging processing by the condition determination unit 25: (a) device status development, (b) logging condition setting, (c) logging data display processing, and (d) device status monitoring.

(A) Device status development The condition determination unit 25 determines whether or not the detection device status stored in the internal memory 21 has changed (step 21), and does nothing when there is no change. When there is a change in the device status, the latest detection device status is saved (developed) in the internal memory 21 (step 22).

(B) Condition setting The condition setting unit 24 determines whether or not a new logging condition is set from the input / output unit 23 (step 31), and when the new logging condition is set, the latest apparatus status that has been set is stored internally. The data is expanded in the memory 21 (step 32). If a new logging condition is not set from the input / output unit 23, the condition setting ends.

(C) Display processing The condition setting unit 24 determines whether a new logging condition is set from the input / output unit 23 (step 31). When the new logging condition is set, the display control unit 28 receives an accumulated time display request from the keyboard 23a by a user operation, and acquires the accumulated time from the hard disk (HD) 27 (step 42). The display control unit 28 displays the logging data including the acquired accumulated time on the display screen of the display device 23b (step 43). If no new logging condition is set, the display process ends.

(D) Monitoring This will be described with reference to the timing chart of FIG.
In order to monitor the establishment of the logging condition, the condition determination unit 25 periodically displays the device status of the internal memory 21 according to the condition flag state of the internal memory 21 and (a) the logging start condition or (b) the logging end condition. In comparison, if the logging start condition is satisfied and the condition flag is not set (ON), (c) the condition flag is set (steps 52 and 53). Conversely, the logging end condition is satisfied and the condition flag is set. If so, the condition flag is cleared (OFF) (steps 54 and 55).

  In addition, the condition determination unit 25 (c), if the condition flag is continuously set from the previous periodic check, causes the calculation unit 26 to accumulate the duration and update the contents of the hard disk (HD) 27 (step) 56).

  After the condition flag is turned off (step 55) and the accumulated time is added (step 56), as in the case of the condition flag is turned on (step 53), after waiting for a certain time (step 57), the condition flag is judged (steps 51 and 52). )repeat. Here, the fixed time is a period of the start trigger, and is 2 seconds if the interval between the start trigger and the end trigger is 1 second, for example. The predetermined time interval for comparing the setting device status and the detection device status is 1 second. In this embodiment, the comparison is performed every second, but the periodic comparison may be performed every several seconds.

  Whether or not the logging condition set in this way is met is constantly monitored, and only when the logging condition is met, the time during which the specific device status corresponding to the logging condition is maintained is accumulated. , You can know the resource consumption of equipment that is consumed at that time.

  Next, the above-described logging condition setting screen and logging data display screen will be described with reference to FIGS.

  FIG. 4 is a diagram showing an input display screen 300 when logging conditions are set on the display device 23b of the centralized management device 20. This display screen will be described.

  In the upper part of the input display screen 300, “GENERAL LOGGING PARAMETER” is displayed as a screen title, and on the right side thereof, “MENU”, “COPY”, and “EXIT” buttons 301, 302, and 303 are displayed.

  The “MENU” button 301 is switched to a menu screen by touching the button. The “COPY” button 302 copies the displayed logging condition to a floppy disk or the like by touching the button. The “EXIT” button 303 is touched to exit the logging setting screen and return to the initial screen.

At the bottom of the title, the final edit (user Last Edit User) and the edit time (MM / DD / YY: MM'SS ") can be entered. In the illustrated example," HANA ", and "(111/21/03) 16: 52'26""is entered respectively.
Further, a logging condition name (Comment) column 304 is provided at the lower part thereof, and a name and a comment can be entered in the logging condition. In the illustrated example, “RUN-END” and “T: hana” are respectively entered. On the right side, “PARAM.CLEAR”, “PREV”, and “NEXT” buttons 305, 306, and 307 are displayed.

  By clicking the “PARAM.CLEAR” button 305, the selected device status (parameter) is cleared and the display of the inverted parameter is restored. The “PREV” button 306 displays the previous screen by clicking the button. The “NEXT” button 307 displays the next screen by clicking the button.

  The number “01/10” displayed between “PARAM.CLEAR” and “PREV” represents the number of pages, that is, “display page / maximum page”. Since there are many start / end patterns, logging conditions can be created from 1 to 10 pages. In this way, a more general-purpose logging function is realized by allowing a plurality of logging conditions to be registered.

  Logging conditions are displayed in the main part of the screen. The main part is a logging start condition setting unit 308 that is divided into two parts in the top and bottom, the upper part is titled “Start Trigger”, and the lower part is a logging end condition setting part 309 titled “End Trigger”, Logging start / end conditions can be set and registered individually.

  The upper logging start condition setting unit 308 displays five device status columns 311 to 315 arranged side by side. The titles assigned to the five columns are, in order from the left, “Tube Status” column 311, “Trans Mode” column 312, “Boat Mode” column 313, “Step Name” column 314, and “Valve Number” (pipe number). Valve status) column 315. Each of these has a plurality of device statuses (parameters), and these can be selected and set.

  “Tube Status” is called an apparatus operation mode, and can specify an operation status of the apparatus. “Trans Mode” is an operation mode of the transfer machine, and the status of the transfer machine can be designated. “Boat Mode” is an operation mode of the boat, and a boat status can be designated. “Step Name” is a step name of the recipe, and a step name being executed in the recipe can be designated. “Valve Number” is a sequence number (# 1 to # 64) of the valve number, and the corresponding valve number can be designated.

  In the lower logging end condition setting unit 309, five device status columns 321 to 325 having the same title and the same contents as the logging start condition setting unit 308 are displayed side by side, and their column names are also “tube status” and “ “Trans Mode”, “Boat Mode”, “Step Name”, and “Valve Number”.

  “Tube Status” (apparatus operation mode) includes “NO SELECT”, “RESET”, “GO STNBY”, “STANBY”, “RUN”, “END”, “MANUAL”, “IDLE”, “ERR END”. There are selectable parameters.

  “NO SELECT” indicates that a specific parameter is not selected and the parameter is arbitrary. “RESET” indicates a state immediately after the apparatus is started up and the operation of the apparatus is in a dormant state. “GO STNBY” is a state in the middle of the transition to “STANBY”, and “STANBY” represents a state in which the cassette 100 (see FIG. 10) has been put into the semiconductor manufacturing apparatus and the recipe can be started. “RUN” indicates that the recipe is being executed, that is, the film is being formed, and “END” indicates that the recipe has been completed. “MANUAL” indicates a state in which maintenance is in progress, and “IDLE” indicates a state before “STANDBY” in which no processing cassette is inserted. “ERR END” represents the same state as “END” but “END” due to an abnormality occurring in “RUN”. The plurality of device mode parameters 321a can be freely selected when logging start / end conditions are set. The selected mode changes its color (for example, inversion).

When the nitride film is formed using SiH ₂ Cl ₂ and NH ₃ , the furnace temperature set by the recipe is, for example, 600 ° C. during IDLE and 700 ° C. to 740 ° C. during film formation.

  “Trans Mode” (transfer machine operation mode) includes “LOCAL” and “REMOTE” in addition to “NO SELECT”. “REMOTE” is a mode during operation of the wafer transfer device 112 (see FIG. 10), and “LOCAL” is a mode during maintenance.

  “Boat Mode” (boat operation mode) includes “HOME”, “LOADING”, “UNLOADING”, and “CAP”. In “HOME”, the boat 217 (see FIG. 10) is positioned below the processing furnace (quartz tube) 202 (see FIG. 10), “LOADING” is in the ascending boat, “UNLOADING” is in the descending boat It is. “CAP” means a state in which the processing furnace is closed by the seal cap 219 of the boat (see FIG. 10).

In “Step Name” (recipe step name), step names (STEP 32, STEP 02, STEP 11...) Are displayed.
A plurality of recipes to be executed in the target apparatus of the semiconductor manufacturing apparatus 10 are arranged with step names, and these step names can be selected.

  The valve number (02CH, 30CH, 64CH ...) is displayed in “Valve Number” (valve number serial number), and these valve numbers 125a can extract and select up to 10 valve numbers at the same time. ing. Note that CH means a channel.

  Note that the device status column not displayed in FIG. 4 can be arbitrarily added.

  In the empty area on the right side of the main part of the input display screen 300 described above, a “Target Tube” field 326 is displayed so that the target device can be selected. Here, “J3” is displayed in No. 01.

  There is a display in the “Accumulation Type” (accumulation format) column 327 at the bottom of the screen. In the Accumulation Type, not only “TIME” (see accumulation of time) but also “MFC02” (MFC02 is an example. 16 is selected, and the flow rate accumulation of the selected MFC No. is checked), which allows the gas flow rate to be specified. In the illustrated example, when the “TIME” display portion is clicked, the integration format is selected as “time”. Clicking on the display section of “MFC02” indicates that the integration format has been selected as “gas flow rate”. Specifically, when “MFC02” is clicked, a list BOX appears, and “MFC01” to “MFC16” can be selected.

  A “SET” button 328 is displayed at the right end of the lower part of the screen so that the logging condition selected on the display screen can be set and registered.

In the input display screen 300 shown in FIG. 4, as the equipment consumption, for example, the flow rate of SiH ₂ Cl ₂ , the flow rate of waste gas at the time of IDLE, the power consumption amount, and the time required for maintenance are obtained respectively. A combination as exemplified in (1) to (4) may be set as the logging condition.

(1) In order to obtain the flow rate of SiH ₂ Cl ₂ during film formation, the logging condition is a combination of valve # 7 and MFC No. 3 in the case of the piping pattern example of FIG. .
That is, in “Start Trigger” and “End Trigger” displayed on the input display screen 300, “07CH” in “Valve Number” is selected, and “TIME” and “MFC03” are selected in “Accumulation Type”. . Also, “RUN” in “Tube Status” is selected as “Start Trigger”, and “END” is selected as “End Trigger”.
Assume that the accumulated time during which valve # 7 is open is 10 min when an accumulated time display request is made under this logging condition. When the flow rate of SiH ₂ Cl ₂ controlled by MFC No. 3 is ₂ slm, the output display screen 400 displays the accumulated number “000000: 10′00” ”in“ Time ”of“ Total ”, and gas “20 l” will be displayed in the conversion value column (not shown) of consumption.

(2) In order to obtain the flow rate of wasted gas during IDLE, in the case of the piping pattern of FIG. 8B, the logging condition is a combination of valve # 6, MFC No. 3, and IDLE mode.
That is, in “Start Trigger” and “End Trigger” displayed on the input display screen 300, select other than “IDLE” in “Tube Status”, and select “TIME” in “Accumulation Type”, or “06CH” in “Valve Number” is selected, and “TIME” and “MFC03” are selected in “Accumulation Type”. By setting in this way, the integration is started when 06CH is opened by IDLE, and the integration can be terminated when the device mode is other than IDLE or when 06CH is closed. This is because the amount of N ₂ gas flowing through MFC No. 3 during IDLE becomes the waste gas flow rate.

  (3) In order to obtain the power consumption for a device in which the exhaust pump is always in the ON state during operation, the ON state of the dry pump (not shown) is set as the logging condition. Generally, since the ON / OFF state of the dry pump corresponds to the opening / closing of a specific valve, the ON / OFF state of the dry pump can be specified by the valve number. Therefore, it is only necessary to select the valve number in “Valve Number” in both “Start Trigger” and “End Trigger” displayed on the input display screen 300.

(4) When “Trans Mode” is “LOCAL”, it indicates the maintenance of the transfer machine. In particular, in order to obtain the time required for the maintenance of the sudden transfer machine during automatic production, for example, the start condition and The transfer time is calculated from the transfer machine “LOCAL” mode and the apparatus “RUN” mode to the transition time to the transfer machine “REMOTE” mode, which is an end condition. During maintenance, the transfer machine must be switched to the “LOCAL” mode. However, if the device fails during the “RUN” of “Tube Status”, the “Tube Status” does not return to the “RESET” mode. In general, the maintenance is performed by switching to the “LOCAL” mode as it is.
Therefore, in this case, in “Start Trigger” displayed on the input display screen 300, “RUN” in “Tube Status” and “LOCAL” in “Trans Mode” are selected, and in “End Trigger”, “ Select “REMOTE” in “Trans Mode”.

FIG. 5 is a diagram showing an output display screen 400 at the time of logging data output in the display device 23b. The output display screen 400 will be described.
In the upper part of the output display screen 400, “GENERAL LOGGING DATA” is shown as the title of the display screen, and on the right side, “MENU”, “COPY”, and “EXIT” buttons are displayed as in FIG. .

  Below that, there is a column 401 titled “History Data”, in which a logging condition name and a comment defined by the user can be input.

  On the right side, there is a “CURRENT DATA” button 402. By clicking this button, history data other than that currently displayed is displayed.

  Logging data of a predetermined device is displayed on an output display unit 403 that is a main part of the screen. The predetermined device is exemplified by tube01 as “Tube ID”.

  The logging data includes a “No.” column 404, a “Date” column 405, a “Start Date” column 406, a “Total” column 407, and a “Day Base” column 411. The “Total” column 407 further includes an “Off Time” column 408, a “Count” column 409, and a “Time” column 410. Similarly, the “Day Base” column 411 includes an “Off Time” column 401, a “Count” column 413, and a “Time” column 414.

  The “No.” column 404 is a serial number of logging data. In the “Date” column 405, a date 405a is displayed, and records are listed for each day. In the “Start Date” column 406, the logging start date and time 406a is displayed. In the “Off Time” column 408 of the “Total” column 407, a loss time 407a considering the disconnection of communication between the centralized management device 20 and the semiconductor manufacturing apparatus 10 performed via the inter-device communication unit 22 is displayed. . In the “Count” column 409, the accumulated number 409a from the start of logging is displayed as the number of times the logging start condition is satisfied. In the “Time” column 410, the accumulated number 410a from the start of logging is displayed as the elapsed time while the logging condition is established. The “Day Base” column 411 displays the same difference as the “Total” column 407 on the left side, but a day-based difference 411a. As a result, it is easy to determine which number of accumulated days is requested by the user. These logging data are scrolled by a scroll bar 417. At the bottom of the output display screen 400, the number of records 415 is displayed on the left side. Here, “XXXX / 1095” is exemplified. On the right side is a CSV button 416 for outputting logging data as a CSV file.

  Here, a specific example of the output display screen in the case of integrating the time from RUN to END in the apparatus operation mode is shown. As shown in FIG. 6, the log name is set to “RUN-END” and the comment is set to “hana” on the display screen when the logging condition is set, and the device operation mode (tube status) is set to the logging start condition (Start Trigger). “RUN” of “”) is reversed, the character display is reversed, “END” of the device operation mode (tube status) is selected as the logging end condition (End Trigger), and the character display is reversed. Set to “During film formation”. In “Accumulation Type”, “TIME” is selected, and the time from the device mode to RUN → END is integrated under the above conditions. “Trans Mode” is both “NO SELECT”. In the illustrated example, 17 semiconductor manufacturing apparatuses 10 including Target Tube “J3” are connected to the centralized management apparatus 20 via the network 30.

  The logging data obtained under the above logging conditions is displayed on the logging data display screen as shown in FIG. From the numerical values on the screen, the device with Tube ID “J3” has 45 film formation events with “RUN” and “END” as one cycle from 2003/11/21 to now (2004/7/29). It was found that 410: 3: 38 hours (410 hours, 3 minutes and 38 seconds), and the time satisfying the conditions continued.

  As described above, according to the present embodiment, unlike the case where the logging condition is fixed, the logging condition can be set by any combination of device statuses, so that the user interface becomes general-purpose, A general-purpose logging function can be realized. Therefore, it is possible to eliminate a risk of overlooking the apparatus abnormality, and it is possible to quickly perform an appropriate treatment as necessary. In addition, the cause of the failure can be investigated.

  In addition, according to the embodiment, in the centralized management system for managing the semiconductor manufacturing apparatus group, the combination of all the apparatus statuses collected from the apparatus at every predetermined time interval can be used as the logging condition. Management of facility consumption performed by the manufacturer can be strongly supported, leading to reduction of wasteful facility consumption and maintenance time, and obtaining an economic effect.

  Specifically, by setting the IDLE state of the device (the state that the user thinks is useless) as the logging start condition, and starting and operating logging, it can be seen that the device with many integration results has poor production efficiency. This is an opportunity to review the operation method of the device.

  In addition, multiple “logging start / end” can be registered, and names suitable for each can be assigned, so that all statuses possessed by the device can be selected as conditions. A general-purpose logging mechanism can be realized.

  In addition, the system status is monitored at predetermined time intervals from the logging “start condition” to the “end condition”, and the result of integrating the time and status values (gas flow value, etc.) when the same status continues is logged. As a result, the daily difference is displayed in the result list, and it becomes possible to statistically analyze the daily difference value, and wasteful equipment consumption resources occur at any time. You can explore the tendency of being easy.

  Further, since the sum of the device usage time and the number of failures can be known, it is possible to know the MTBF (mean failure interval) of a device that could not be obtained with a conventional device.

It is also possible to know the thermal history of the quartz tube. For example, “CAP” of the device status “Boat Mode” is set as a start condition and “HOME” is set as an end condition, and monitoring is performed every second. If the apparatus status is “CAP”, the heating is being continued, and if “HOME”, the heating is stopped. By integrating the time during the heating, the thermal history of the quartz tube can be converted. This is because the thermal history is considered to be an important factor in knowing the life of the quartz tube.
In addition, since a plurality of logging conditions can be registered, the above embodiments (1) to (4) can be set simultaneously for each page.

  The semiconductor manufacturing system of the present invention can be applied not only to a single wafer apparatus but also to a vertical apparatus or a horizontal apparatus. Furthermore, the process of the semiconductor manufacturing apparatus is not limited to film formation, and can be widely applied to other processes such as oxidation, diffusion, and annealing.

It is a block diagram of the centralized management apparatus by embodiment. It is a flowchart explaining the function of the centralized management apparatus by embodiment, (a) shows apparatus status expansion, (b) shows condition setting, (c) shows display processing, (d) shows monitoring. It is a timing chart figure of monitoring by an embodiment. It is a figure which shows the input display screen which inputs the logging conditions by embodiment. It is a figure which shows the output display screen which outputs the logging data by embodiment. It is a figure which shows the input display screen by a specific example. It is a figure which shows the output display screen by a specific example. It is explanatory drawing of the gas piping pattern by embodiment. It is a block diagram of the semiconductor manufacturing system by embodiment. It is a schematic structure 9 figure of the semiconductor manufacturing apparatus by embodiment.

Explanation of symbols

300 Logging condition input display screen 308 Logging start condition setting unit 309 Logging end condition setting units 311 and 321 “Tube Status” column (device status column)
312 and 322 “Trans Mode” column (device status column)
313, 323 “Boat Mode” column (device status column)
314, 324 “Valve Number” column (device status column)
315, 325 “Step Name” column (device status column)
327 “Accumulation Type” field (accumulation format field)

Claims (11)

A semiconductor manufacturing system comprising a semiconductor manufacturing device and a management device for managing the semiconductor manufacturing device,
The management device
The logging condition of the semiconductor manufacturing apparatus is set by selecting an arbitrary apparatus status including an idle state in which a cassette is not inserted in the semiconductor manufacturing apparatus among a plurality of apparatus statuses indicating the state of the semiconductor manufacturing apparatus. A condition setting section;
A detection unit for detecting an apparatus status of the semiconductor manufacturing apparatus;
The apparatus status set by the condition setting unit and the apparatus status detected by the detection unit are compared, and when they match, the establishment of the logging condition is determined, and the gas flow that flows during the established time and the established time A semiconductor manufacturing system comprising: a control unit for integrating The control unit is
A first storage unit that stores an arbitrary device status set by the setting unit, and stores a device status of the semiconductor manufacturing apparatus detected by the detection unit;
A condition for comparing the device status set by the condition setting unit stored in the first storage unit with the device status detected by the detection unit and determining the establishment of the logging condition when they match. A determination unit;
A calculation unit for obtaining a time when the logging condition determined by the condition determination unit is established;
The semiconductor manufacturing system according to claim 1, further comprising: a second storage unit that stores the time obtained by the calculation unit. The logging condition is composed of a start condition and an end condition,
The detection of the device status of the semiconductor manufacturing apparatus by the detection unit, and the comparison of the device status set by the condition setting unit and the device status detected by the detection unit is performed at predetermined time intervals,
The condition setting unit sets a condition flag when the start condition is satisfied, drops a condition flag when the end condition is satisfied with the flag set, and determines whether the logging is performed depending on the presence or absence of the condition flag. 2. The semiconductor manufacturing system according to claim 1, wherein establishment of conditions is determined. An input / output unit that requests output of logging data and displays and outputs logging data on the screen;
An output control unit that reads out the logging data from the second storage unit and outputs the logging data to the input / output unit when there is a logging data output request from the input / output unit; The semiconductor manufacturing system according to claim 1. By integrating the equipment consumption of the semiconductor manufacturing apparatus per unit time under the logging conditions set by the condition setting unit and the time when the logging conditions are established, the equipment consumption of the semiconductor manufacturing apparatus can be converted. The semiconductor manufacturing system according to claim 1, wherein the semiconductor manufacturing system is configured as described above.   The valve status of the gas pipe connected to the processing chamber is used as a logging condition, and the integrated value of the time when the logging condition is satisfied or the integrated value of the gas flow rate flowing through the valve can be logged. The semiconductor manufacturing system according to 1. 2. The semiconductor manufacturing system according to claim 1, wherein a mode of a transfer machine for transferring a substrate to a processing chamber is set as a logging condition, and an integrated value of a time when the logging condition is satisfied can be logged. 2. The semiconductor according to claim 1, wherein an integrated value of a time when the logging condition is satisfied can be logged using a boat mode of a substrate holder that holds a plurality of substrates in a horizontal posture in multiple stages as a logging condition. Manufacturing system. A logging condition of the semiconductor manufacturing apparatus is set by selecting an arbitrary apparatus status including an idle state in which a cassette is not inserted in the semiconductor manufacturing apparatus among a plurality of apparatus statuses indicating the state of the semiconductor manufacturing apparatus , The device status set by the condition setting unit is compared with the device status detected by the detection unit for detecting the device status of the semiconductor manufacturing apparatus, and when they match, the establishment of the logging condition is determined and established. A logging method for a semiconductor manufacturing apparatus, characterized by integrating the flow rate of gas flowing in time and established time. A management device for managing semiconductor manufacturing equipment,
The logging condition of the semiconductor manufacturing apparatus is set by selecting an arbitrary apparatus status including an idle state in which a cassette is not inserted in the semiconductor manufacturing apparatus among a plurality of apparatus statuses indicating the state of the semiconductor manufacturing apparatus. A condition setting section;
A detection unit for detecting an apparatus status of the semiconductor manufacturing apparatus;
The apparatus status set by the condition setting unit and the apparatus status detected by the detection unit are compared, and when they match, the establishment of the logging condition is determined, and the gas flow that flows during the established time and the established time And a control unit that accumulates the control values. A management device program for managing semiconductor manufacturing equipment,
The logging condition of the semiconductor manufacturing apparatus is set by selecting an arbitrary apparatus status including an idle state in which a cassette is not inserted in the semiconductor manufacturing apparatus among a plurality of apparatus statuses indicating the state of the semiconductor manufacturing apparatus. A condition setting section;
A detection unit for detecting an apparatus status of the semiconductor manufacturing apparatus;
The device status set by the condition setting unit and the device status detected by the detection unit are compared, and when they match, the establishment of the logging is determined, and the established time and the gas flow rate flowing during the established time are determined. A management apparatus program that implements a control unit for integration in the management apparatus.

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