TW200847350A - Package structure and electronic device using the same - Google Patents

Abstract

A package structure and an electronic device using the same are provided. The package structure includes a chip module and a cover. The chip module covered by the cover is for receiving an external signal. The cover has a window element. The external signal passes through the window element to contact with the chip module.

Description

200847350

TECHNICAL FIELD The present invention relates to a package structure and an electronic device device using the same, and more particularly to a package structure for receiving an external signal and an electronic device using the same . [Prior Art] Currently, the form of the projector on the market includes a liquid crystal (Hquid crystal display (LCD) projector, a digital optical processing (DLP) projector, and a cathode ray tube (CRT) projector. Wait. Taking digital optical processing projectors as an example, digital micromirror components are the key components of projection imaging. Please refer to Fig. 1, which shows a schematic diagram of a conventional digital micromirror device. The digital micromirror device 100 includes a substrate 110, a heat sink 120, an adhesive 130, and a glass structure 160 and a wafer 14A. The substrate has an opening 113. The heat sink 120 covers the opening 113. The heat sink, sheet 120 is used to carry the wafer 140 and conduct heat generated by the wafer 140 away from the wafer 140. The glass structure 160 is disposed above the wafer 140. The sealant 130 covers the wafer 140, the glass structure 160, and the substrate 11A. Light 150 is passed through sealant 130 and glass structure 160 to contact wafer 140. However, limited by the material properties of the sealant 130, the surface of the sealant 130 is typically a non-smooth surface. When the light 150 passes through the sealant 130 and the glass structure 160, scattering and reflection tend to occur. As a result, the effect on imaging is affected. 5 200847350

The present invention relates to a package structure and an electronic device using the same, which utilizes an external signal to penetrate through a mask to avoid reflection or scattering of external signals, thereby improving the package structure and applying the same. Optical performance of electronic devices. According to one aspect of the invention, a package structure is proposed. The package structure includes a wafer set and a mask. The chip module is configured to receive an external number. The mask is covered on the wafer module. The mask has a window piece. The outer f-signal penetrates through the window member to contact the wafer module. According to an aspect of the invention, an electronic device is proposed. The electronic device includes an external signal source and a package structure. The external signal source is used to provide an external signal. The package structure includes a wafer module and a mask. The chip module is used to receive external signals. The mask is covered on the wafer module. The mask has a window member. The external signal penetrates through the window member to contact the wafer module. In order to make the above-mentioned contents of the present invention more comprehensible, a preferred embodiment will be described below in detail with reference to the accompanying drawings, in which: FIG. 2 and FIG. 2 is a schematic view of an electronic device according to a preferred embodiment of the present invention; and FIG. 3 is a schematic view showing a package structure of FIG. 2. The electronic device 2 includes an external signal source 3A and a package structure 400. The external signal source 3 is used to provide an external signal 310. The package structure 4 includes a wafer module 41 and a mask 43 (shown in FIG. 3). The chip module 4 is configured to receive an external signal 6 200847350

CONFIDENTIAL 310. The mask 430 is covered on the wafer module 4i and has a window member 432. The external signal 310 penetrates through the window member 432 to contact the wafer module 410. In the present embodiment, the window member 432 is a flat plate-like structure having a smooth surface. Therefore, the embodiment of the embodiment can prevent the external signal 310 from being reflected or scattered when passing, so as to increase the utilization of the external signal 310. In addition, in this embodiment, the external signal source 300 is a light source, and the external signal 310 is a light. 1 The electronic device 200 described above is exemplified by a digital projector. As shown in FIG. 3, the wafer module 410 of the package structure 400 includes a substrate 415, a heat sink 413, a first wafer 411, and a second wafer 412. The substrate 415 has a first surface 415a, a second surface 415b, and an opening 415c. The first surface 415a is relative to the second surface 415b. The opening 415c extends through the first surface 415a and the second surface 415b. In the present embodiment, the substrate 415 can be a printed circuit board (PCB) or a bismaleimide triazine (BT) plate. In addition, the package structure 400 is, for example, a land grid array (LGA) package structure or a ball grid array (BGA) package structure. The heat sink 413 is disposed on the first surface 415a of the substrate 415, and the heat sink 413 covers the opening 415c. The first wafer 411 is disposed on the heat sink 413 and is located in the opening 415c. The lower surface 411a of one of the first wafers 411 is flat on the heat sink 413. The heat sink 413 is used to conduct heat generated by the first wafer 411 away. 7 200847350

In the present embodiment, the first wafer 411 is bonded to the substrate 15 , and the first wafer 411 has at least one first electrical connection pad 441 . The first electrical connection pad 441 is disposed on the first wafer 411 . . The substrate 415 has at least one second electrical connection pad 443, and the second electrical connection pad 443 is disposed on the second surface 415b. The first electrical connection pad 441 is connected to the second electrical connection pad 443 ′ by a wire 442 to make the first wafer 411 and the substrate 415 electrically connected to the substrate 415 to have a plurality of third electrical connections 445, the third The sexual connection pad 445 is disposed on the first surface. The third electrical connection is used to electrically connect the substrate 415 and other electronic components (not shown). Further, the second crystal #412 of the present embodiment is disposed on the first wafer and the second wafer is electrically connected to the first wafer. Preferably, the second wafer 412 is electrically connected to the first wafer 411 in a flip chip manner, that is, as shown in FIG. 3, the H-'Dingdi 曰 片 412 utilizes at least one flip chip (mP chlp). The bumP) 447 is electrically connected to the first wafer 411. Of course, the first wafer 4U and the second wafer 412 can also be electrically connected to each other by, for example, wire bonding. The first slice 412 of the present example receives the external signal 31 and transmits a signal to the first wafer 411. The first wafer is received = this sensing signal, and the step is based on the output of the peach - electrical signal. The electrical signal can be output to the NAND on the substrate 415 = other actions such as arithmetic or storage. The s-window member 432 corresponds to the second 曰曰/chip-like position, and the window member 432* preferably has a size greater than or equal to the size of the second wafer 412. In addition, the firmware 432 is a light-transmitting material, for example, an infrared filter, for 8 200847350

When the CUNF1DJbNTIAL external signal 310 penetrates through the window member 423, the external signal 310 is moderately filtered. In the present embodiment, the window member 432 is a flat-shaped flat surface structure. Therefore, when the external signal 310 penetrates through the window member 423, reflection or scattering is prevented, thereby increasing the overall wear of the external signal 310. The penetration rate improves the utilization of the external signal 310. In summary, when the external signal 310 penetrates through the window member 432, it contacts the second wafer 412 of the wafer module 410. The second wafer 412 receives the external signal 310 and outputs a sensing signal to the first wafer 411. The first wafer 411 outputs an electrical signal according to the sensing signal to perform an operation or storage of the electrical signal. In addition, the first chip 411 can also transmit the electrical signal after the processing to the second wafer 412, and the second chip 412 reflects the reflected signal 550 according to the external signal 310 and the electrical signal. The reflection signal 550 is further projected on a screen (not shown) by a projection lens (not shown) of the electronic device 200 (shown in FIG. 2) to display the surface. The package structure and the electronic device using the same according to the above embodiments of the present invention provide an external signal by an external signal source, and the external signal contacts the second wafer via the window member penetrating through the mask, thereby causing the wafer die The group received an external signal. The window member is a flat-shaped flat surface with a smooth surface, which avoids the scattering and reflection of external signals passing through the window member, improves the receiving efficiency of the chip module for external signals, and further improves the utilization of external signals. The invention has been described above in terms of a preferred embodiment, and is not intended to limit the invention. Those skilled in the art having the knowledge of the present invention can make various kinds without departing from the spirit and scope of the present invention.

Change and retouch of CONFIDENTIAL >. Therefore, the scope of the invention is defined by the scope of the appended claims. 200847350

UUNJhiJJbJNTIAL ' [Simple description of the diagram] Figure 1 shows a schematic diagram of a conventional digital micromirror component. 2 is a schematic diagram of an electronic device in accordance with a preferred embodiment of the present invention. FIG. 3 is a schematic view showing the package structure of FIG. 2. [Main component symbol description] 100: Digital micromirror device 110, 415: Substrate 113: Opening 120, 413: Heat sink 130: Sealant 140: Wafer 150: Light 160: Glass structure 200: Electronic device 300: External signal source 310 : External signal 400 : package structure 410 : wafer module 411 : first wafer 411a : lower surface 412 : second wafer 415a · first surface 11 200847350

CUNtlDbNTIAL 415b: second surface 415c: opening 430: mask 432 window piece 441 first electrical connection pad 442 wire 443 second electrical connection pad 445 third electrical connection pad 447 flip chip bump 550 : : reflection signal 12

Claims (1)

200847350 CUiNnDJtiNTIAL X. Patent Application Range: L A package structure comprising: a chip module for receiving an external signal; and a mask covering the wafer module, the mask having a window member, The external signal penetrates through the window member to contact the wafer module. 2. The package structure of claim 1, wherein the window member is a flat plate-like structure having a smooth surface. The package structure of claim 1, wherein the window member is a light transmissive material. 4. The package structure of claim 3, wherein the window member is an infrared filter. 5. The package structure of claim 1, wherein the external signal is a light. The package structure of claim 1, wherein the wafer module comprises: a substrate having a first surface, a second surface, and an opening, the first surface being opposite to the second a surface, the opening is through the first surface and the second surface; a heat sink is disposed on the first surface of the substrate, and the heat sink covers the opening; a first wafer is disposed on the heat dissipation And a second wafer is disposed on the first wafer, and the second wafer is electrically connected to the first wafer. A wafer. The package structure of claim 6, wherein the window member corresponds to the second wafer, wherein the package structure is as described in claim </ RTI> The first wafer is wire bonded to the substrate. 9. The package structure of claim 2, wherein the substrate is a printed circuit board (PCB) or a bismuth bromideimide triazine (BT). board. The package structure of claim 6, wherein the second chip receives the external signal and outputs a sensing signal to the first wafer. The package structure of claim 10, wherein the first chip outputs an electrical signal according to the sensing signal. The package structure of claim 6, wherein the first wafer is wire bonded to the first wafer or electrically connected to the first wafer in a flip chip manner. 13. The package structure of claim 1, wherein the structure is a land grid array (LGA) package structure or a ball grid array (BGA) package structure. An electronic device comprising: an external signal source for providing an external signal; and a package structure comprising: a chip module 'for receiving the external signal; and a mask for covering the outer cover The wafer module is mounted on the wafer module, and the external signal penetrates through the window member to contact the wafer mold 200847350 CONFIDENTIAL group. 15. The electronic device of claim 14, wherein the window member is a flat plate-like structure having a smooth surface. 16. The electronic device of claim 14, wherein the window member is a light transmissive material. 17. The electronic device of claim 16, wherein the window member is an infrared filter. 18. The electronic device of claim 14, wherein the external signal is a light. 19. The electronic device of claim 14, wherein the wafer core assembly comprises a substrate having a first surface, a second surface, and an opening, the first surface being opposite the second surface, The opening is formed through the first surface and the second surface; a heat sink is disposed on the first surface of the substrate, and the heat sink covers the opening; and a first wafer is disposed on the heat sink And located in the opening, a lower surface of the first wafer is flatly attached to the heat sink; and a second wafer is disposed on the wafer, and the second wafer is electrically connected to the first Wafer. 20. The electronic device of claim 19, wherein the window member corresponds to a location of the second wafer. 21. The electronic device of claim 19, wherein the first wafer is wire bonded to the substrate. The electronic device of claim 19, wherein the substrate is a printed circuit board or a triazine bis-maleimide resin board. The electronic device of claim 19, wherein the two chips receive the external signal and output a sensing signal to the first wafer. The electronic device of claim 23, wherein the chip outputs an electrical signal based on the sensing signal. The electronic device of claim 19, wherein the second wafer is wire bonded to the first wafer or electrically connected to the first wafer in a flip chip manner. 26. The electronic device of claim 14, wherein the package structure is a plain grid array package structure or a ball grid array package structure. The electronic device of claim 14, wherein the electronic device is a digital projector. 16