TW200847248A - Substrate treating apparatus and method of treating substrate - Google Patents

Substrate treating apparatus and method of treating substrate Download PDF

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Publication number
TW200847248A
TW200847248A TW096148999A TW96148999A TW200847248A TW 200847248 A TW200847248 A TW 200847248A TW 096148999 A TW096148999 A TW 096148999A TW 96148999 A TW96148999 A TW 96148999A TW 200847248 A TW200847248 A TW 200847248A
Authority
TW
Taiwan
Prior art keywords
region
substrate
chemical liquid
liquid
processing
Prior art date
Application number
TW096148999A
Other languages
English (en)
Chinese (zh)
Other versions
TWI380355B (https=
Inventor
Hiroshi Tanaka
Takao Inada
Yuji Kamikawa
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006344875A external-priority patent/JP4829094B2/ja
Priority claimed from JP2006344806A external-priority patent/JP4842794B2/ja
Priority claimed from JP2006344911A external-priority patent/JP5063103B2/ja
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200847248A publication Critical patent/TW200847248A/zh
Application granted granted Critical
Publication of TWI380355B publication Critical patent/TWI380355B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0426—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
TW096148999A 2006-12-21 2007-12-20 Substrate treating apparatus and method of treating substrate TW200847248A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006344875A JP4829094B2 (ja) 2006-12-21 2006-12-21 基板処理装置、基板処理方法、基板処理プログラム、および、プログラム記録媒体
JP2006344806A JP4842794B2 (ja) 2006-12-21 2006-12-21 基板処理装置、基板処理方法、基板処理プログラム、および、プログラム記録媒体
JP2006344911A JP5063103B2 (ja) 2006-12-21 2006-12-21 基板処理装置、基板処理方法、プログラムおよび記録媒体

Publications (2)

Publication Number Publication Date
TW200847248A true TW200847248A (en) 2008-12-01
TWI380355B TWI380355B (https=) 2012-12-21

Family

ID=39536273

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096148999A TW200847248A (en) 2006-12-21 2007-12-20 Substrate treating apparatus and method of treating substrate

Country Status (2)

Country Link
TW (1) TW200847248A (https=)
WO (1) WO2008075643A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111785623B (zh) * 2020-06-15 2022-11-04 上海华虹宏力半导体制造有限公司 湿法刻蚀方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0475341A (ja) * 1990-07-18 1992-03-10 Fujitsu Ltd 半導体基板洗浄方法及び洗浄装置
JP2000183005A (ja) * 1998-12-10 2000-06-30 Sony Corp ウエハの洗浄方法及び洗浄装置
JP3810968B2 (ja) * 1999-12-03 2006-08-16 東京エレクトロン株式会社 液処理装置および液処理方法
JP2001223193A (ja) * 2000-02-08 2001-08-17 Smt:Kk 基板の洗浄方法およびその装置
JP2006019350A (ja) * 2004-06-30 2006-01-19 Dainippon Screen Mfg Co Ltd 基板処理装置

Also Published As

Publication number Publication date
TWI380355B (https=) 2012-12-21
WO2008075643A1 (ja) 2008-06-26

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees