TW200845413A - Surface light emitting diode module with a surface light emitting diode connected to a conductive substrate tightly - Google Patents

Surface light emitting diode module with a surface light emitting diode connected to a conductive substrate tightly Download PDF

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Publication number
TW200845413A
TW200845413A TW096116672A TW96116672A TW200845413A TW 200845413 A TW200845413 A TW 200845413A TW 096116672 A TW096116672 A TW 096116672A TW 96116672 A TW96116672 A TW 96116672A TW 200845413 A TW200845413 A TW 200845413A
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Taiwan
Prior art keywords
emitting diode
surface light
light emitting
hole
conductive substrate
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TW096116672A
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English (en)
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Chen-Hsiu Lin
Ming-Yen Chen
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Lite On Technology Corp
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Priority to TW096116672A priority Critical patent/TW200845413A/zh
Priority to US11/867,693 priority patent/US20080277684A1/en
Publication of TW200845413A publication Critical patent/TW200845413A/zh

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015Fastening arrangements intended to retain light sources
    • F21V19/0025Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969Apertured conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10409Screws
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10598Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10651Component having two leads, e.g. resistor, capacitor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Description

200845413 九、發明說明: 【發明所屬之技術領域】 本發明係提供一種表面發光二極體模組,尤指一種可 緊密接合表面發光二極體與導電基板之表面發光二極體模 組0 【先前技術】 ⑩ 近年來高亮度發光二極體的應用領域不斷地被開發。 不同於一般白熾燈泡,發光二極體係屬冷發光,具有耗電 量低、元件壽命長、無須暖燈時間、反應速度快等優點, 再加上其體積小、耐震動、適合量產,容易配合應用需求 製成極小或陣列式的元件,因此發光二極體已普遍使用於 資訊、通訊及消費性電子產品的指示燈與顯示裝置上。發 光二極體除應用於戶外各種顯示器及交通號誌燈外,在汽 ⑩車工業中也佔有一席之地,如汽車之煞車燈、方向燈等, 而一般大多使用表面發光二極體(如SNAP發光二極體)來 作為汽車之煞車燈、方向燈之光源。 於表面發光二極體與導電基板之接合工法方面,目前 大抵上是使用焊接或沖壓固定之方式,例如於美國專利 US5519596、US5404282、US7070418、US6335548、 US6521916、US6849867、US6828170、USD432095 係揭露 各種SNAP發光二極體之形狀與結構。然而使用雷射點焊 6 200845413 表面發光二極體至導電基板上之接合工法會有焊錫外露與 接合強度小之問題,且其係為一次性接合,故於接合後無 法分離表面發光二極體與導電基板,意即為一種無法回復 之結合方式,故當焊接於導電基板之表面發光二極體係為 不良品時亦無法進行更換,再者由於車用煞車燈與方向燈 係處於一高溫、高電流、高震動之運作環境,當表面發光 二極體之運作溫度過高而過熱時,會造成焊料熱熔以致使 φ 表面發光二極體與導電基板之揍合強度不足,再加上高震 動之環境而可能造成表面發光二極體脫離於導電基板,而 導致產品損壞;此外,沖壓表面發光二極體與導電基板之 接合工法則會造成表面發光二極體與導電基板形變,而無 法維持產品整體之平整性與一致性。故如何找出一良好之 表面發光二極體與導電基板之接合工法,便為現今所需努 力之課題。 * 【發明内容】 本發明係提供一種可緊密接合表面發光二極體與導電 基板之表面發光二極體模組,以解決上述之問題。 本發明之申請專利範圍係揭露一種表面發光二極體模 組,其包含有一導電基板,其包含有一第一電極區域,其 上係設有一第一孔洞;一表面發光二極體,安裝於該導電 基板上,該表面發光二極體包含有一第一電極接腳,用來 7 200845413 接觸該第一電極區域,該第一電極接腳上係設有 洞,設置於相對應該第一孔洞之位置;以及一第:孔 穿設於該第二孔洞與該第一孔洞,藉以固 :鱼 該表面發光二極體。 电暴板與 【實施方式】 請參閱第i圖與第2圖,第i圖為本發明—表面 二極體模組50之外觀示意圖,第2圖為本發明表^ 一 極體模組50之元件爆炸示意圖。表面發光二極體模 包含有-導電基板52,其包含有一第—電極區域52ι :第^電極區域522。第-電極區域521係可為_陽極區 =^電極區域522係可為—陰極區域,或第1極區 - 糸可為一陰極區域且第二電極區域係 一 521 〆V電土板52之第一電極區域521與第二電極區域切 係用來外接提供表面發光二極體模組5〇之電源。於 二極體模組50另包含有至少-表面發光二極體5:,安V =電基板52上,表面發光二極體54係 ^ 光二極體等,表面發光二極體54包含有一第 541,用來接觸第一電極區域521 ;以及一第—電腳 542 ,用爽桩錨笙—弟一電極接腳 過第一電鋪⑽: 電極接腳542與第一電極區域切之連接係可用來接 200845413 ^ 部電源所傳來之電力,進而發射出光線。此外,導電基板 52之第一電極區域521上係設有一第一孔洞5211,且第一 電極接腳541上係設有一第二孔洞mu,設置於相對應第 一孔洞5211之位置;而第二電極區域522上係設有一第三 孔洞5221 ’且第二電極接腳542上係設有一第四孔洞 5421 ’設置於相對應第三孔洞5221之位置。 ⑩ 表面發光二極體模組50另包含有一第一固定件56,穿 設於第二孔洞5411與第_孔洞5211 ;以及一第二固定件 58,穿設於第四孔洞5421與第三孔洞5221。請參閱第3 圖’第3圖為本發明第一固定件56與第二固定件58穿設 於導電基板52與表面發光二極體54間之示意圖,第一固 定件56與第二固定件58係可分別為一鉚釘,第一固定件 56係穿設於第一電極接腳541上之第二孔洞5411與第一 電極區域521上之第一孔洞5211,而第二固定件%係穿 設於第^電極接腳542上之第四孔洞5421與第二電極區域 522之第三孔洞5221,故第一固定件%與第二固定件% 可分別固定表面發光二極體54之第一電極接腳541與第二 電極接腳542於導電基板52之第一電極區域切斑第二電 極區域522上,以作為導電基板52與表面發光二極體M 接合之機構固定介面。而第一固定件56與第二固定件讣 係、可由導電材質所組成,例如由金屬材質所組成,如此〆 •來第—蚊件56與第二固定件58不僅可作為導電基板52 9 200845413 ^ 與表面發光二極體54之機構連接介面,亦可作為導電基板 52與表面發光二極體54之電性連接介面。 請參閱第4圖,第4圖為本發明另一實施例第一固定 件56與第二固定件58穿設於導電基板52與表面發光二極 體54間之示意圖,第一固定件56與第二固定件58係可分 別為一螺絲,例如為一導電螺絲,且導電基板52之第一孔 ^ 洞5211與第三孔洞5221之内側係分別設有一螺紋60,第 一固定件56係穿過第一電極接腳541上之第二孔洞5411 且鎖固於第一電極區域521上之第一孔洞5211内側之螺紋 60當中,而第二固定件58係穿過第二電極接腳542上之 第四孔洞5421且鎖固於第二電極區域522上之第三孔洞 5221内侧之螺紋60當中,如此一來第一固定件56與第二 固定件58可分別固定表面發光二極體54之第一電極接腳 541與第二電極接腳542於導電基板52之第一電極區域 ® 521與第二電極區域522上,以作為導電基板52與表面發 光二極體54接合之機構固定介面。當第一固定件56與第 二固定件58係分別為一導電螺絲時,第一固定件56與第 二固定件58不僅可作為導電基板52與表面發光二極體54 之機構連接介面,亦可作為導電基板52與表面發光二極體 54之電性連接介面。 而本發明之固定件不偈限於上述之鉚釘與螺絲,亦可 200845413 ,使用其他形式之機構件,且第一固定件56盘第二固定件 58亦可使用不同形式之機構件,例如第-固定件56係為 -鉚釘且第二固料58係為—螺絲等,而導電基板52與 ^面發光二極體54所設之孔洞亦需配合第-固定件56與 第-固S件58之結構形式,於此便不再詳述。 _於先前技術’本發明之表面發光二極體模組係利 _用S)疋件穿設於導電基板之電極區域與表面發光二極體之 “ β接腳藉以作為導電基板與表面發光二極體接合之機 構固定介面’且當固定件為導電材質時,其亦可作為導電 基板與表面發光二極體之電性連接介面。本發明之接合工 法可有效地提升表面發光二極體與導電基板間之接合強 度’且由於固定件係以可拆卸之方式安裝於導電基板與表 面發光二極體之孔洞内,故其係為—種可回復之結合方 _式’意即當安裝於導電基板上之表面發光二極體係為不良 品時’可拆卸固定件予以進行更換表面發光二極體之動 作。再者,本發明之接合工法可讓表面發光二極體模組適 用於車用煞車燈與方向燈等高溫、高電流、高震動之運作 壤境’且不會造成表面發光二極體與導電基板形變,故可 維持產品整體之平整性與-致性。綜上所述,本發明係提 供一良好之表面發光二極體與導電基板之接合工法。 以上所述僅為本發明之較佳實施例,凡依本發明申請 200845413 ^ 專利範圍所做之均等變化與修飾,皆應屬本發明專利之涵 蓋範圍。 【圖式簡單說明】 圖式之簡單說明 第1圖為本發明表面發光二極體模組之外觀示意圖。 第2圖為本發明表面發光二極體模組之元件爆炸示意圖。 φ 第3圖為本發明第一固定件與第二固定件穿設於導電基板 與表面發光二極體間之不意圖。 第4圖為本發明另一實施例第一固定件與第二固定件穿設 於導電基板與表面發光二極體間之示意圖。 【主要元件符號說明】 50 表面發光二極體 模組 52 導電基板 521 第一電極區域 5211 第一孔洞 522 第二電極區域 5221 第三孔洞 54 表面發光二極體 541 第一電極接腳 5411 第二孔洞 542 第二電極接腳 5421 第四孔洞 56 第一固定件 58 第二固定件 60 螺紋 12

Claims (1)

  1. 200845413 十、申請專利範圍: 1· 一種可緊密接合表面發光二極體與導電基板之表面發 光二極體模組,其包含有: 一導電基板,其包含有一第一電極區域,其上係設有一 第一孔洞; 一表面發光二極體,安裝於該導電基板上,該表面發光 二極體包含有一第一電極接腳,用來接觸該第一電 極區域,該第一電極接腳上係設有一第二孔洞,設 置於相對應該第一孔洞之位置;以及 一第一固定件,穿設於該第二孔洞與該第一孔洞,藉以 固定該導電基板與該表面發光二極體。 2. 如請求項1所述之表面發光二極體模組,其中該第一 電極區域係為一陽極區域或一陰極區域。 3. 如請求項1所述之表面發光二極體模組,其中該表面 發光二極體係為一 SNAP發光二極體。 4. 如請求項1所述之表面發光二極體模組,其中該第一 固定件係為一鉚釘。 5. 如請求項1所述之表面發光二極體模組,其中該第一 固定件係為一螺絲。 13 200845413 6. 如請求項5所述之表面發光二極體模組,其中該螺絲 係為一導電螺絲。 7. 如請求項5所述之表面發光二極體模組,其中該導電 基板之該第一孔洞内側係設有一螺紋,該螺絲係鎖固 於該螺紋中。 赢 8, 如請求項1所述之表面發光二極體模組,其中該導電 基板另包含有一第二電極區域,其上係設有一第三孔 洞,該表面發光二極體另包含有一第二電極接腳,用 來接觸該第二電極區域,該第二電極接腳上係設有一 第四孔洞,設置於相對應該第三孔洞之位置,以及該 表面發光二極體模組另包含有一第二固定件,穿設於 該第四孔洞與該第三孔洞,藉以固定該導電基板與該 表面發光二極體。 9. 如請求項8所述之表面發光二極體模組,其中該第二 電極區域係為一陽極區域或一陰極區域。 10. 如請求項8所述之表面發光二極體模組,其中該第二 固定件係為一鉚釘。 ’ 11.如請求項8所述之表面發光二極體模組,其中該第二 14 200845413 固定件係為一螺絲。 職 12. 如請求項11所述之表面發光二極體模組,其中該螺絲 係為一導電螺絲。 13. 如請求項11所述之表面發光二極體模組,其中該導電 基板之該第三孔洞内侧係設有一螺紋,該螺絲係鎖固 0 於該螺紋中。 14. 如請求項8所述之表面發光二極體模組,其中該第一 電極區域與該第二電極區域係彼此絕緣。
    十一、圖式: 15
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