TW200844683A - Positioning apparatus, exposure apparatus, and device manufacturing method - Google Patents
Positioning apparatus, exposure apparatus, and device manufacturing method Download PDFInfo
- Publication number
- TW200844683A TW200844683A TW096138890A TW96138890A TW200844683A TW 200844683 A TW200844683 A TW 200844683A TW 096138890 A TW096138890 A TW 096138890A TW 96138890 A TW96138890 A TW 96138890A TW 200844683 A TW200844683 A TW 200844683A
- Authority
- TW
- Taiwan
- Prior art keywords
- repulsive force
- gantry
- stator
- thrust
- magnets
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000000758 substrate Substances 0.000 claims description 4
- 230000001846 repelling effect Effects 0.000 description 39
- 230000001133 acceleration Effects 0.000 description 36
- 235000012431 wafers Nutrition 0.000 description 25
- 230000002940 repellent Effects 0.000 description 14
- 239000005871 repellent Substances 0.000 description 14
- 239000004065 semiconductor Substances 0.000 description 13
- 238000003780 insertion Methods 0.000 description 12
- 230000037431 insertion Effects 0.000 description 12
- 230000003287 optical effect Effects 0.000 description 12
- 238000012545 processing Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 230000008859 change Effects 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000005286 illumination Methods 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000001427 coherent effect Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052770 Uranium Inorganic materials 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
- H02K41/02—Linear motors; Sectional motors
- H02K41/03—Synchronous motors; Motors moving step by step; Reluctance motors
- H02K41/031—Synchronous motors; Motors moving step by step; Reluctance motors of the permanent magnet type
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70766—Reaction force control means, e.g. countermass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K16/00—Machines with more than one rotor or stator
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K2201/00—Specific aspects not provided for in the other groups of this subclass relating to the magnetic circuits
- H02K2201/18—Machines moving with multiple degrees of freedom
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K7/00—Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
- H02K7/10—Structural association with clutches, brakes, gears, pulleys or mechanical starters
- H02K7/106—Structural association with clutches, brakes, gears, pulleys or mechanical starters with dynamo-electric brakes
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K7/00—Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
- H02K7/10—Structural association with clutches, brakes, gears, pulleys or mechanical starters
- H02K7/118—Structural association with clutches, brakes, gears, pulleys or mechanical starters with starting devices
- H02K7/1185—Structural association with clutches, brakes, gears, pulleys or mechanical starters with starting devices with a mechanical one-way direction control, i.e. with means for reversing the direction of rotation of the rotor
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Combustion & Propulsion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Linear Motors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006293154A JP5020597B2 (ja) | 2006-10-27 | 2006-10-27 | 位置決め装置、露光装置、及びデバイス製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200844683A true TW200844683A (en) | 2008-11-16 |
Family
ID=39329275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096138890A TW200844683A (en) | 2006-10-27 | 2007-10-17 | Positioning apparatus, exposure apparatus, and device manufacturing method |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7804207B2 (enExample) |
| JP (1) | JP5020597B2 (enExample) |
| KR (1) | KR20080038015A (enExample) |
| TW (1) | TW200844683A (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5020597B2 (ja) * | 2006-10-27 | 2012-09-05 | キヤノン株式会社 | 位置決め装置、露光装置、及びデバイス製造方法 |
| US7932646B2 (en) * | 2007-01-15 | 2011-04-26 | Canon Kabushiki Kaisha | Exposure apparatus with a stage, driving unit,and force applying unit having a separate magnetic shield |
| KR20130015864A (ko) * | 2011-08-05 | 2013-02-14 | 삼성전기주식회사 | 리니어진동장치 |
| US9298106B1 (en) * | 2011-09-07 | 2016-03-29 | Kla-Tencor Corporation | Wafer stage with reciprocating wafer stage actuation control |
| CN104704625B (zh) * | 2012-10-09 | 2018-03-06 | 皇家飞利浦有限公司 | 定位设备、控制设备和控制方法 |
| CN104049472B (zh) * | 2014-06-30 | 2016-03-30 | 清华大学 | 一种电磁弹射启动式掩模台系统 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3614181A (en) * | 1970-07-02 | 1971-10-19 | Us Air Force | Magnetic bearing for combined radial and thrust loads |
| US4890023A (en) * | 1985-02-19 | 1989-12-26 | Hinds Walter E | Linear induction motor systems |
| JP3363662B2 (ja) * | 1994-05-19 | 2003-01-08 | キヤノン株式会社 | 走査ステージ装置およびこれを用いた露光装置 |
| JP3720593B2 (ja) * | 1998-09-09 | 2005-11-30 | キヤノン株式会社 | ステージ装置、露光装置および露光方法 |
| US6144118A (en) * | 1998-09-18 | 2000-11-07 | General Scanning, Inc. | High-speed precision positioning apparatus |
| JP3849932B2 (ja) * | 2002-08-12 | 2006-11-22 | キヤノン株式会社 | 移動ステージ装置 |
| JP2004172557A (ja) * | 2002-11-22 | 2004-06-17 | Canon Inc | ステージ装置及びその制御方法 |
| JP2007258356A (ja) * | 2006-03-22 | 2007-10-04 | Canon Inc | ステージ装置 |
| JP2008010643A (ja) * | 2006-06-29 | 2008-01-17 | Canon Inc | ステージ装置 |
| JP5020597B2 (ja) * | 2006-10-27 | 2012-09-05 | キヤノン株式会社 | 位置決め装置、露光装置、及びデバイス製造方法 |
| US20080170213A1 (en) * | 2007-01-12 | 2008-07-17 | Canon Kabushiki Kaisha | Stage apparatus, exposure apparatus, and device manufacturing method |
| US7932646B2 (en) * | 2007-01-15 | 2011-04-26 | Canon Kabushiki Kaisha | Exposure apparatus with a stage, driving unit,and force applying unit having a separate magnetic shield |
-
2006
- 2006-10-27 JP JP2006293154A patent/JP5020597B2/ja not_active Expired - Fee Related
-
2007
- 2007-10-17 TW TW096138890A patent/TW200844683A/zh unknown
- 2007-10-17 KR KR1020070104450A patent/KR20080038015A/ko not_active Abandoned
- 2007-10-18 US US11/874,482 patent/US7804207B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR20080038015A (ko) | 2008-05-02 |
| US20080100149A1 (en) | 2008-05-01 |
| JP5020597B2 (ja) | 2012-09-05 |
| JP2008112757A (ja) | 2008-05-15 |
| US7804207B2 (en) | 2010-09-28 |
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