200843575 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種印刷電路板鑽孔機全廠鑽孔品質監 控方法，該監控方法係採用一種創新的印刷電路板之鑽孔 品質分析方法，特別係關於一種應用統計製程管制 (statistical process control ; SPC )呈現鑽孑L 機鑽孑L 品質的 方法。 【先前技#f】 印刷電路板是電子、電腦及通信等產品之主要零組件，為能 因應消費市場上輕、薄、短、小之產品特性，及在高密度及高 可靠性的需求催化下，除了通孔之精密鑽孔需要外，高階印刷 電路板在目前的發展趨勢更多使用盲孔(blind hole或via)及埋 孔（buried hole)之鑽孔技術。該種盲孔及埋孔之印刷電路板，是 藉由盲孔將内部幾層之佈線板與表面之佈線連接，不須穿透整 個板子而浪費其他層佈線板之佈局空間，預估可較一般印刷電 路板之體積縮小20%。因此對電路板而言，無論是半成品或成 品’盲孔或通孔之品質檢測工作都變的非常重要，特別是關於 線寬、孔徑、孔垂直度、孔真圓度及銅墊尺寸等都需要進行量 測及規格判讀。 目前自動光學檢測（automatic optical inspection)機係分 別量測各片印刷電路板上鑽孔精度，並單獨以數據或圖表呈現 各片印刷電路板之鑽孔精度的量測結果。然同樣規格印刷電路 板之鑽孔品質常會因著不同鑽孔機或製造時間而變異，也就是 會因著鑽孔機之設定、廠牌或使用狀態而造成鑽孔品質變異， 200843575 或者是相同鑽孔機也會因著製造時間而產生鑽孔品質之變 異，例如··刀具磨損或定期保養之時間等。 很明顯現有自動光學檢測機並無法有效呈現或提示品質 變異之趨勢，往往是等到印刷電路板之量測結果發現異常或不 符規格，才開始提停止生產問題貨批及追查問題發生根源，因 此會造成生產中斷及無法有效預測品質異常之可能發生的問 題。 為了使鑽孔製程中鑽孔品質之變異均控制在管制狀態下， 因此實有需要將統計製程管制導入目前自動光學檢測機中， 俾使印刷電路板之鑽孔品質能有效被監控，並能預測異常 之可能發生時點而提前採取矯正措施。 【發明内容】 本發明之主要目的係提供一種印刷電路板鑽孔機全廠鑽 孔品質監控方法，該系統採用一種創新的印刷電路板之鑽 孔品質分析方法，其係將統計製程管制導入自動光學檢測機 〇 中，俾使印刷電路板之鑽孔品質能有效及即時被監控，並 能預測異常之可能發生時點而提前採取矯正措施。除此之 外’也评估出目前與未來某時間點各鑽孔機的狀態，且以 鑽孔機總覽圖標出目前與未來某段時間點之各鑽孔機的狀 態。 為達成上述目的，本發明揭示一種印，刷電路板鑽孔機全 廠鑽孔口口貝ι控方法，係用於監控全廠中各印刷電路板鑽 孔機之鑽孔品質，包含下列步驟··輸入印刷電路板上鑽孔 之没计貝料及實際量測資料；計算出各鑽孔機之各種鑽孔 200843575 精度分析資料；根據該鑽孔精度分析資料進行統計製程管 制；根據該統計製程管制產生之各該鑽孔機之鑽孔品質資 料，以預測各該鑽孔機異常發生之時間點；評估目前各該 鑽孔機之機台狀況，與未來某日各該鑽孔機之機台狀況； 以及以一總覽圖顯示各該鑽孔機於目前或未來某日的機台 狀況。 【實施方式】 圖1係本發明印刷電路板鑽孔機全廠鑽孔品質監控方法 之流程圖。如步驟11所示，將印刷電路板之原始設計資料及 成品量測資料輸入，例如：設計之理想孔位之座標、量測孔位 之座標、設計之鑽孔孔徑、量測之鑽孔孔徑、設計之鑽孔真圓 度及量測之鑽孔真圓度與座標等資料需要輸入。接著進行步驟 12，利用上述之各項輸入資料以計算各種鑽孔精度分析資 料，例如··孔位之偏差量、孔徑之偏差量及真圓度之偏差量， 並可同時計算出各項數值之平均值、標準差、製程準確度 (Capability of accuracy ; Ca )、製程精密度（以押印办 μ precision ;CP)以及製程能力指標（Cpk)等相關統計資料。 如步驟13所示，若連續收集複數個印刷電路板鑽孔精度分 析資料的數量或時間達到設定值要求，例如：已收集 數量之相同印刷電路板之鑽孔精度分析資料，或每日、$ 週及每月料自動賴收集《個印刷電路板魏精度Z 析資料進行步驟15之内容。實施統計製程管㈣指利S 計抽樣所得的鑽孔精度分析資料，對鑽孔製程狀態進行監 控。並在鐵孔製程中產品品質變易處於非管制狀態時，設 200843575 法進一步採取調整鑽孔製程的措施，以矯正鑽孔製程中影 響品質之非機遇變異（assignable variation)，其最終目的在 使鑽孔製程處在於管制狀態下。並進一步根據步驟16，將 鑽孔精度分析資料繪製成為管制圖，藉由管制圖可以容易 判定鑽孔製程是否在管制狀態下，或是可以預測鑽孔製程 變異之趨勢。 圖2係本务明鑽孔之真圓度之管制圖。圖中折線21及μ分 〇 別代表直徑及4mm兩種鑽頭（或主軸）隨著製造時間產生 之真圓度變化，CL(Central line)代表管制圖之中心值，又中心 值加上及減去三個標準差，即可分別得到管制圖的管制上限 (upper controi limit ; UCL)及管制下限〇〇wer⑺翻丨丨祕；200843575 IX. Description of the invention: [Technical field of invention] The present invention relates to a method for monitoring the quality of drilling of a whole circuit of a printed circuit board drilling machine, which adopts an innovative method for analyzing the quality of a printed circuit board. In particular, it relates to a method for applying statistical process control (SPC) to present the quality of the drill collar L machine. [Previous technology #f] Printed circuit boards are the main components of products such as electronics, computers and communications. They are responsive to the needs of light, thin, short and small products in the consumer market, and in the demand for high density and high reliability. In addition to the need for precision drilling of through-holes, high-order printed circuit boards are currently using more drilling methods for blind holes or vias and buried holes. The printed circuit board of the blind hole and the buried hole is connected with the wiring of the inner layer by the blind hole, and the layout space of the other layer wiring board is wasted without penetrating the entire board, and the estimated space can be compared. The size of a typical printed circuit board is reduced by 20%. Therefore, for the circuit board, whether it is a semi-finished or finished product, the quality inspection of blind holes or through holes becomes very important, especially regarding line width, aperture, hole verticality, hole roundness and copper pad size. Measurement and specification interpretation are required. At present, the automatic optical inspection system measures the drilling accuracy of each printed circuit board, and separately displays the measurement results of the drilling accuracy of each printed circuit board by data or a graph. However, the drilling quality of the same specification printed circuit board often varies due to different drilling machines or manufacturing time, that is, the drilling quality variation may occur due to the setting, brand or use state of the drilling machine, 200843575 or the same The drilling machine also produces variations in the quality of the drill due to manufacturing time, such as the wear of the tool or the time of regular maintenance. Obviously, the existing automatic optical inspection machine can not effectively present or prompt the trend of quality variation. It is often waited until the measurement results of the printed circuit board find abnormal or inconsistent specifications, and then start to stop the production problem and trace the root cause of the problem, so Problems that may cause production disruptions and the inability to effectively predict quality anomalies. In order to control the variation of the drilling quality in the drilling process under the control state, it is necessary to introduce the statistical process control into the current automatic optical inspection machine, so that the drilling quality of the printed circuit board can be effectively monitored and Corrective measures are taken in advance to predict when an abnormality may occur. SUMMARY OF THE INVENTION The main object of the present invention is to provide a drilling circuit quality monitoring method for a printed circuit board drilling machine, which adopts an innovative drilling quality analysis method for printed circuit boards, which introduces statistical process control automatically. In the optical inspection machine, the quality of the drilled circuit board can be effectively and instantly monitored, and the corrective action can be taken in advance to predict the possible occurrence of an abnormality. In addition, the status of each drilling machine at the current and future time points is also evaluated, and the status of each drilling machine at the current and future time points is displayed by the drilling machine overview icon. In order to achieve the above object, the present invention discloses a method for controlling the drilling of a printed circuit board drilling machine in a whole factory, which comprises the following steps. · Input the blanks and actual measurement data of the drilled holes on the printed circuit board; calculate the 200843575 precision analysis data of each drill hole of each drilling machine; perform statistical process control according to the drilling precision analysis data; according to the statistical process Control the drilling quality data of each drilling machine to predict the time point of each abnormality of the drilling machine; evaluate the current condition of each drilling machine, and the machine of the drilling machine in the future The status of the station; and an overview map showing the status of each of the drills on the current or future day. [Embodiment] Fig. 1 is a flow chart showing a method for monitoring the quality of drilling of a whole circuit of a printed circuit board drilling machine of the present invention. As shown in step 11, input the original design data and finished measurement data of the printed circuit board, for example, the coordinates of the ideal hole position, the coordinates of the measurement hole position, the designed drilling hole diameter, and the measured drilling hole diameter. The design of the hole roundness and the measured roundness and coordinates of the hole need to be input. Then proceed to step 12, using the above input data to calculate various drilling accuracy analysis data, such as · the deviation of the hole position, the deviation of the aperture and the deviation of the true roundness, and can calculate the values simultaneously Relevant statistics such as mean value, standard deviation, process accuracy (Ca), process precision (by impeding μ precision; CP), and process capability index (Cpk). As shown in step 13, if the number or time of drilling precision analysis data of a plurality of printed circuit boards is continuously collected to meet the set value requirements, for example, the collected precision analysis data of the same printed circuit board, or daily, $ Weeks and monthly materials automatically collect the contents of step 15 of the "Printed Circuit Board". The implementation of the statistical process tube (4) refers to the drilling accuracy analysis data obtained from the sampling of the S-meter, and monitors the state of the drilling process. And in the iron hole process, when the product quality becomes easy to be in an unregulated state, the 200843575 method is further adopted to adjust the drilling process to correct the non-interest variation of the quality in the drilling process, and the ultimate goal is to make the drill The hole process is under control. Further, according to step 16, the drilling accuracy analysis data is drawn into a control chart, and the control chart can easily determine whether the drilling process is under control or predict the tendency of the drilling process variation. Figure 2 is a control chart for the true roundness of the drill hole. In the figure, the fold line 21 and μ points represent the true roundness change of the diameter and 4mm drill bit (or spindle) with the manufacturing time. CL (Central line) represents the central value of the control chart, and the center value plus and minus By going to three standard deviations, you can get the upper limit of the control chart (upper controi limit; UCL) and the lower limit of control 〇〇wer(7).
之鑽針或更換磨損嚴重之主軸。 圖3係本發明鑽孔之良率管制圖。鑽 量規格之孔數與總孔數之比率。圖Drill the needle or replace the worn spindle. Figure 3 is a graph showing the yield control of the borehole of the present invention. The ratio of the number of holes in the drill specification to the total number of holes. Figure
因此需要採取矯正行動。 率。圖中折線31代表某機台上 孔良率，管制上限 下限值。若折線上 製程不在管制狀態 。折線3 1樣組點子已分別漸趨 200843575 管制下限’因此可預測纖 、鑽孔良率將要進入非管制狀態，同 樣需要提前採取矯正行動。 圖4係本發明鑽孔之偏移量製程能力（Cpk)指標之管制 圖圖中折線41代表某機台某個主轴所製造印刷電路板， 且隨著製造時間量測的偏移量製程能力指標之變化。選擇 其中某時間區段進一步分析’並找出回歸直線。若製程能 力指標漸趨管制下限，則可算出該回歸直線42與管制下 Γ 限的交點P及其對應之時間點為日期η，並於該交點發 生之時間，點前m日通知操作人員進行機台維修。此預測功 旎同樣可應用於圖2及圖3中真圓度管制圖與鑽孔良率管 制圖，或是孔徑製程能力指標管制圖等。 圖5係單一鑽孔機狀態之評估與預測示意圖。首先使用 者需先設定監控燈號，管制指數落於不同界定之範圍内就 顯示不同色燈，而達到顏色管理之效果。如圖所示，管制 上限以上之範圍定義為綠燈區，又管制上限及管制下限間 1/ 之範圍定義為黃燈區，以及管制下限以下之範圍定義為紅 燈區。若鑽孔精度記錄資料51的回歸直線52對應於今曰 的數值落於黃燈區，則今日鑽孔機狀態的狀態則可設為普 燈。同理，若回歸線對應於某段時間後的某日之數值落於 紅燈區，則未來某日的鑽孔機狀態狀態則可設為黃燈。以 圖5為例，今天鑽孔機狀態的燈號為黃燈，未來某日鑽孔 機狀態的燈號為紅燈。 圖6係全廠所有鑽孔機的總覽圖。此圖6係依據圖5所 述之方法，來評估及預測出各鑽孔機目前與未來某設定日 200843575 的狀態，並進而繪製成此一能易於管控之總覽圖。在本總 覽圖中，-個方格代表一台鑽孔機，在一個方格中可以同 時顯示鑽孔機今曰的狀態與未來某曰的狀態，例如··方格 中左上方三角形代表今日的狀態及右下方三角形代表未 來某日的狀恶。使用者可以依據各方格所顯示的燈號掌握 各機台目前與預測未來的狀態。圖中最上列及最左列之數 子係代表機台編號或擺放位置編號，因此編號（〇,〇)代表圖 f^ 中最左上角方格所對應之鑽孔機。該方格中左上方三角形 為綠燈，亦即鑽孔機今日的狀態為落於圖5之綠燈區内； 該方格中右下方三角形為紅燈，亦即鑽孔機未來某日的狀 態為落於圖5之紅燈區内。 本發明之技術内容及技術特點巳揭示如上，然而熟悉本項 技術之人士仍可能基於本發明之教示及揭示而作種種不背離 本發明精神之替換及修飾。因此，本發明之保護範圍應不限 於實施例所揭示者，而應包括各種不背離本發明之替換及修 G 飾，並為以下之申請專利範圍所涵蓋。 【圖式簡單說明】 圖1係本發明印刷電路板鑽孔機全廠鑽孔品質監控方法之 流程圖； 圖2係本發明鑽孔之真圓度之管制圖； 圖3係本發明鑽孔之良率管制圖； 圖4係本發明鑽孔之偏移量製程能力指標之管制圖； 圖5係單一鑽孔機狀態之評估與預測示意圖；以及 圖6係全廠所有鑽孔機的總覽圖。 200843575 【主要元件符號說明】 21、 22 折線 31 折線 41 折線 42 回歸直線 51 鑽孔精度記錄資料 52 回歸直線 ί -11-Therefore, corrective action is needed. rate. In the figure, the broken line 31 represents the hole yield and the upper limit of the upper limit of the control. If the process is not in the control state. The line 3 1 sample group has gradually become the 200843575 lower limit of control, so it can be predicted that the fiber and drilling yield will enter the non-regulated state, and corrective actions need to be taken in advance. 4 is a control diagram of the offset process capability (Cpk) index of the drill hole of the present invention. The fold line 41 represents a printed circuit board manufactured by a certain spindle of a certain machine, and the offset process capability measured with the manufacturing time is shown. Changes in indicators. Select one of the time segments for further analysis' and find the regression line. If the process capability index is gradually lowering the control limit, the intersection point P of the regression line 42 and the control lower limit and the corresponding time point may be calculated as the date η, and the operator is notified at the time of the intersection point at the m day before the point. Machine maintenance. This prediction function can also be applied to the true roundness control chart and the borehole yield chart in Figure 2 and Figure 3, or the aperture process capability index control chart. Figure 5 is a schematic diagram of the evaluation and prediction of the state of a single drill. First of all, the user needs to set the monitoring light number first, and the control index falls within different defined ranges to display different color lights to achieve the effect of color management. As shown in the figure, the range above the upper limit of control is defined as the green light zone, and the range between the upper limit of control and the lower limit of control is defined as the yellow light zone, and the range below the lower control limit is defined as the red light zone. If the regression line 52 of the drilling accuracy record data 51 corresponds to the current value falling in the yellow light zone, the state of the drilling machine state can be set as a general light. Similarly, if the regression line corresponds to a certain day after a certain period of time, the value of the drilling machine can be set to a yellow light. Taking Figure 5 as an example, today the status of the drilling machine is yellow, and the status of the drilling machine in the future is red. Figure 6 is an overview of all the drills in the entire plant. This Figure 6 is based on the method described in Figure 5 to evaluate and predict the current and future setting of each of the drilling machines 200843575, and then draw an overview map that can be easily controlled. In this overview map, a square represents a drilling machine. In one square, the state of the drilling machine and the state of the future can be displayed at the same time. For example, the triangle in the upper left of the square represents today. The state and the lower right triangle represent the future of the day. Users can grasp the current and predicted future status of each machine based on the lights displayed by the parties. The number of the top and leftmost columns in the figure represents the machine number or the position number, so the number (〇, 〇) represents the drill machine corresponding to the top left corner of the figure f^. The triangle in the upper left of the square is a green light, that is, the state of the drilling machine today is in the green light area of Figure 5. The triangle in the lower right corner of the square is a red light, that is, the state of the drilling machine in the future is It falls in the red light area of Figure 5. The technical content and technical features of the present invention are disclosed above, but those skilled in the art can still make various substitutions and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the present invention should be construed as being limited to the scope of the invention, and should be construed as being limited by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flow chart of a method for monitoring the quality of drilling of a printed circuit board drilling machine of the present invention; FIG. 2 is a control chart of the roundness of the drilling of the present invention; Figure 4 is a control chart of the offset process capability index of the borehole of the present invention; Figure 5 is a schematic diagram of the evaluation and prediction of the state of a single drill machine; and Figure 6 is an overview of all the drills of the entire plant. 200843575 [Description of main component symbols] 21, 22 Polyline 31 Polyline 41 Polyline 42 Regression line 51 Drilling accuracy record data 52 Regression line ί -11-