TWI628018B - Processing method and processing machine and processing system using the same - Google Patents

Processing method and processing machine and processing system using the same Download PDF

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TWI628018B
TWI628018B TW106119684A TW106119684A TWI628018B TW I628018 B TWI628018 B TW I628018B TW 106119684 A TW106119684 A TW 106119684A TW 106119684 A TW106119684 A TW 106119684A TW I628018 B TWI628018 B TW I628018B
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processing
hole
drilling
image
size values
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TW106119684A
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TW201902602A (en
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徐德義
吳政惠
簡俊賢
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欣興電子股份有限公司
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Abstract

一種加工方法,包括下列步驟:使用加工機台對測試板體進行第一鑽孔製程,其中第一鑽孔製程包括使用不同的參數設定以形成複數個第一孔洞於測試板體上;使用加工機台對測試板體擷取第一影像;依據標準孔影像比對第一影像中之第一孔洞輪廓;分別量測第一孔洞輪廓的第一尺寸數值,其中第一尺寸數值包括以最小平方圓法所得到的孔徑大小及圓心座標,以及以最小環帶圓法所得到的真圓度;以及判斷第一尺寸數值是否與預設規格值相符。 A processing method comprising the steps of: performing a first drilling process on a test board body using a processing machine, wherein the first drilling process comprises using different parameter settings to form a plurality of first holes on the test board body; The machine captures the first image of the test board; compares the first hole profile in the first image according to the standard hole image; and respectively measures the first size value of the first hole profile, wherein the first size value includes the least square The aperture size and center coordinates obtained by the round method, and the roundness obtained by the minimum ring circle method; and whether the first size value matches the preset specification value.

Description

加工方法及其應用之加工機台與系統 Processing method and application processing machine and system thereof

本發明是有關於一種加工方法、加工機台及加工系統。 The invention relates to a processing method, a processing machine and a processing system.

隨著電子工業技術的發展,市場對印刷電路板的鑽孔品質要求越來越高,但目前由於檢測設備的限制,一般都是在加工機台鑽完孔後,再將印刷電路板拿到檢測設備所在之處進行量測,量測完後再依據量測結果決定要設定於加工機台上的適當參數。然而,這樣的作法所帶來的問題是,每當需要對印刷電路板進行量測的時候,都必須花費額外的時間與人力,將印刷電路板從加工機台拿到檢測設備所在之處進行量測,量測完後,還要再回到加工機台,才能將所得到的適當參數設定於加工機台上。在這一來一往之中,不但使得整個加工的過程費時費力,效率不彰,嚴重時還會影響交貨時間,會對企業造成較大的經濟損失和信譽損失。 With the development of electronic industry technology, the market demand for drilling circuit board drilling quality is getting higher and higher, but due to the limitations of testing equipment, the printed circuit board is usually taken after the hole is drilled in the processing machine. The measurement equipment is used for measurement, and after the measurement is completed, the appropriate parameters to be set on the processing machine are determined according to the measurement results. However, the problem with such an approach is that whenever it is necessary to measure the printed circuit board, it takes extra time and manpower to take the printed circuit board from the processing machine to where the testing equipment is located. After the measurement, after the measurement, it is necessary to return to the processing machine, in order to set the appropriate parameters obtained on the processing machine. In this process, not only makes the entire processing process time-consuming and laborious, the efficiency is not good, and in serious cases, it will affect the delivery time, which will cause greater economic losses and credit losses to the enterprise.

有鑑於此,本發明之一目的在於提出一種可解決上述問題的加工方法、加工機台及加工系統。 In view of the above, it is an object of the present invention to provide a processing method, a processing machine, and a processing system that can solve the above problems.

為了達到上述目的,依據本發明之一實施方式,一種加工方法,包括下列步驟:使用加工機台對測試板體進行第一鑽孔製程,其中第一鑽孔製程包括使用不同的參數設定以形成複數個第一孔洞於測試板體上;使用加工機台對測試板體擷取第一影像;依據標準孔影像比對第一影像中之第一孔洞輪廓;分別量測第一孔洞輪廓的第一尺寸數值,其中第一尺寸數值包括以最小平方圓法所得到的孔徑大小及圓心座標,以及以最小環帶圓法所得到的真圓度;以及判斷第一尺寸數值是否與預設規格值相符。 In order to achieve the above object, in accordance with an embodiment of the present invention, a processing method includes the steps of: performing a first drilling process on a test board using a processing machine, wherein the first drilling process includes using different parameter settings to form a plurality of first holes are bored on the test board body; the first image is captured by the processing machine body; the first hole contour in the first image is compared according to the standard hole image; and the first hole contour is respectively measured a size value, wherein the first size value includes a hole size and a center coordinate obtained by a least square circle method, and a true roundness obtained by a minimum ring circle method; and determining whether the first size value is a preset specification value Match.

於本發明之一或多個實施方式中,上述的加工方法更包括:當有任一第一尺寸數值與預設規格值相符時,以該相符者所對應之第一孔洞形成時所依據的參數設定進行第二鑽孔製程,其中第二鑽孔製程包括形成複數個第二孔洞於加工板體上。 In one or more embodiments of the present invention, the processing method further includes: when any of the first size values matches the preset specification value, the first hole corresponding to the conforming person is formed according to the The parameter setting performs a second drilling process, wherein the second drilling process includes forming a plurality of second holes on the processing plate body.

於本發明之一或多個實施方式中,上述的加工方法更包括:使用加工機台對加工板體擷取第二影像;依據標準孔影像比對第二影像中之第二孔洞輪廓;分別量測第二孔洞輪廓的第二尺寸數值,其中第二尺寸數值包括以最小平方圓法所得到的孔徑大小及圓心座標,以及以最小環帶圓法所得到的真圓度;判斷第二尺寸數值是否與預設規格值不符;以及當有任一第二尺寸數值與預設規格值不符時,進行一提醒程序。 In one or more embodiments of the present invention, the processing method further includes: capturing a second image from the processing board by using the processing machine; and comparing the second hole contour in the second image according to the standard hole image; Measuring a second size value of the second hole profile, wherein the second size value includes a hole size and a center coordinate obtained by a least square circle method, and a true circularity obtained by a minimum ring circle method; determining the second size Whether the value does not match the preset specification value; and when there is any second size value that does not match the preset specification value, a reminder procedure is performed.

於本發明之一或多個實施方式中,上述的提醒程 序係藉由警示燈、發聲器、人機介面之提醒訊息或其組合來進行。 In one or more embodiments of the present invention, the reminder process described above The sequence is performed by a warning light, a sounder, a reminder message of the human-machine interface, or a combination thereof.

於本發明之一或多個實施方式中,上述的加工方法更包括:當無任一第一尺寸數值與預設規格值相符時,調整參數設定,並以調整後之參數設定再次進行下列步驟:使用加工機台對測試板體進行第一鑽孔製程,其中第一鑽孔製程包括使用不同的參數設定以形成複數個第一孔洞於測試板體上;使用加工機台對測試板體擷取第一影像;依據標準孔影像比對第一影像中之第一孔洞輪廓;分別量測第一孔洞輪廓的第一尺寸數值,其中第一尺寸數值包括以最小平方圓法所得到的孔徑大小及圓心座標,以及以最小環帶圓法所得到的真圓度;以及判斷第一尺寸數值是否與預設規格值相符。 In one or more embodiments of the present invention, the processing method further includes: when no value of the first size matches the preset specification value, adjusting the parameter setting, and performing the following steps again with the adjusted parameter setting. : using a processing machine to perform a first drilling process on the test board body, wherein the first drilling process comprises using different parameter settings to form a plurality of first holes on the test board body; using the processing machine to test the test board body Taking the first image; comparing the first hole contour in the first image according to the standard hole image; respectively measuring the first size value of the first hole contour, wherein the first size value includes the aperture size obtained by the least square circle method And the center coordinates, and the roundness obtained by the minimum ring circle method; and determining whether the first size value matches the preset specification value.

依據本發明之另一實施方式,一種應用於上述的加工方法的加工機台包括:鑽孔裝置、數位攝像裝置、平台以及處理裝置。數位攝像裝置鄰近於鑽孔裝置而設置。平台承載測試板體。平台相對於鑽孔裝置移動。處理裝置耦接於數位攝像裝置。 According to another embodiment of the present invention, a processing machine for the above-described processing method includes: a drilling device, a digital camera, a platform, and a processing device. The digital camera is placed adjacent to the drilling device. The platform carries the test board body. The platform moves relative to the drilling device. The processing device is coupled to the digital camera.

於本發明之一或多個實施方式中,上述的加工機台更包括連接件,連接數位攝像裝置與鑽孔裝置。 In one or more embodiments of the present invention, the processing machine further includes a connecting member for connecting the digital camera device and the drilling device.

依據本發明之又一實施方式,一種使用上述的加工方法的加工系統包括:加工機台以及處理裝置。加工機台包括:鑽孔裝置、數位攝像裝置以及平台。數位攝像裝置鄰近於鑽孔裝置而設置。平台承載測試板體。平台相對於鑽孔裝置移動。處理裝置耦接於數位攝像裝置。 According to still another embodiment of the present invention, a processing system using the above processing method includes: a processing machine and a processing device. The processing machine includes: a drilling device, a digital camera device, and a platform. The digital camera is placed adjacent to the drilling device. The platform carries the test board body. The platform moves relative to the drilling device. The processing device is coupled to the digital camera.

於本發明之一或多個實施方式中,上述的加工機台更包括連接件,連接數位攝像裝置與鑽孔裝置。 In one or more embodiments of the present invention, the processing machine further includes a connecting member for connecting the digital camera device and the drilling device.

綜上所述,本發明的加工方法、加工機台及加工系統係將鑽孔裝置以及數位攝像裝置均設置於加工機台上,且將處理裝置耦接於數位攝像裝置,因此在鑽完孔後,可以現地(in-situ)直接進行自動量測,並快速地在機台前決定正確的參數設定,節省時間。此外,也可以在加工的過程當中,現地抽驗加工品質,進行品質監控,當發現有孔洞不符預設規格值時,隨時做調整,確保加工成品符合預設規格值。如此一來,不但省去了將印刷電路板拿到檢測設備量測,再將量測所得到的適當參數設定帶回到加工機台進行設定的來回奔波時間,還能夠在加工進行的過程中隨時進行監控,確保加工品質。 In summary, the processing method, the processing machine and the processing system of the present invention provide the drilling device and the digital camera device on the processing machine, and the processing device is coupled to the digital camera device, so that the hole is drilled. After that, you can directly perform automatic measurement in-situ and quickly determine the correct parameter settings in front of the machine to save time. In addition, it is also possible to check the processing quality and quality monitoring in the process of processing. When it is found that the hole does not conform to the preset specification value, make adjustments at any time to ensure that the finished product meets the preset specification value. In this way, not only the printing circuit board is taken to the testing equipment measurement, but the appropriate parameter setting obtained by the measurement is brought back to the processing machine for setting the back and forth running time, and can also be in the process of processing. Monitor at any time to ensure processing quality.

以上所述僅係用以闡述本發明所欲解決的問題、解決問題的技術手段、及其產生的功效等等,本發明之具體細節將在下文的實施方式及相關圖式中詳細介紹。 The above description is only for explaining the problems to be solved by the present invention, the technical means for solving the problems, the effects thereof, and the like, and the specific details of the present invention will be described in detail in the following embodiments and related drawings.

10‧‧‧加工系統 10‧‧‧Processing system

100‧‧‧加工機台 100‧‧‧Processing machine

102‧‧‧鑽孔裝置 102‧‧‧Drilling device

104‧‧‧數位攝像裝置 104‧‧‧Digital camera

106‧‧‧平台 106‧‧‧ platform

108‧‧‧連接件 108‧‧‧Connecting parts

110‧‧‧升降機構 110‧‧‧ Lifting mechanism

200‧‧‧處理裝置 200‧‧‧Processing device

H‧‧‧水平方向 H‧‧‧ horizontal direction

HP1‧‧‧第一孔洞輪廓 HP1‧‧‧ first hole contour

HP2‧‧‧第二孔洞輪廓 HP2‧‧‧ second hole contour

IM1‧‧‧第一影像 IM1‧‧‧ first image

IM2‧‧‧第二影像 IM2‧‧‧ second image

IMS‧‧‧標準孔影像 IMS‧‧‧ standard hole image

P1‧‧‧測試板體 P1‧‧‧ test board

P2‧‧‧加工板體 P2‧‧‧Processing plate

S10~S512‧‧‧步驟 S10~S512‧‧‧Steps

V‧‧‧鉛直方向 V‧‧‧ vertical direction

為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下:第1圖為本發明一實施方式之加工機台的配置示意圖。 The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt;

第2圖為本發明一實施方式之加工方法的流程圖。 Fig. 2 is a flow chart showing a processing method according to an embodiment of the present invention.

第3圖為第1圖之加工機台對測試板體所擷取的第一影像。 Figure 3 is the first image captured by the processing machine of Figure 1 on the test board.

第4圖為一標準孔影像。 Figure 4 shows a standard hole image.

第5圖為本發明一實施方式之加工系統的方塊圖。 Figure 5 is a block diagram of a processing system in accordance with an embodiment of the present invention.

第6圖為本發明另一實施方式之加工方法的流程圖。 Figure 6 is a flow chart of a processing method according to another embodiment of the present invention.

第7圖為第1圖之加工機台對加工板體所擷取的第二影像。 Figure 7 is a second image captured by the processing machine of Figure 1 on the processed board.

以下將以圖式揭露本發明之複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本發明。也就是說,在本發明部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。 The embodiments of the present invention are disclosed in the following drawings, and the details of However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

請參照第1圖。第1圖為本發明一實施方式之加工機台100的配置示意圖。加工機台100包括鑽孔裝置102、數位攝像裝置104、平台106、連接件108以及處理裝置200。於本實施方式中,連接件108連接數位攝像裝置104與鑽孔裝置102,使得數位攝像裝置104鄰近於鑽孔裝置102而設置。平台106承載測試板體P1,並且能夠在水平方向H上相對於鑽孔裝置102移動,使得鑽孔裝置102能夠對測試板體P1進行鑽孔,也可進一步將測試板體P1移動到數位攝像裝置104下方,利用數位攝像裝置104對測試板體P1擷取影像。在本實施方式中,平台106可為XY移動平台,測試板體P1可為印刷電路板,但本發明不以此為限。處理裝置200耦接於數位攝像裝置104以及鑽孔裝置102,因此,數位攝像裝置104可將所擷取到的影像傳遞至處理裝置200進行分析比對,而鑽孔裝置102所需的參數設定也可由處理裝置200進行輸入。在本實施方式中,處 理裝置200可為電腦,但本發明不以此為限。 Please refer to Figure 1. Fig. 1 is a schematic view showing the configuration of a processing machine table 100 according to an embodiment of the present invention. The processing machine 100 includes a drilling device 102, a digital camera device 104, a platform 106, a connector 108, and a processing device 200. In the present embodiment, the connector 108 connects the digital camera 104 to the drilling device 102 such that the digital camera 104 is disposed adjacent to the drilling device 102. The platform 106 carries the test plate body P1 and is movable relative to the drilling device 102 in the horizontal direction H, so that the drilling device 102 can drill the test plate body P1, and can further move the test plate body P1 to the digital camera. Below the device 104, the image of the test board P1 is captured by the digital camera 104. In this embodiment, the platform 106 can be an XY mobile platform, and the test board P1 can be a printed circuit board, but the invention is not limited thereto. The processing device 200 is coupled to the digital camera device 104 and the drilling device 102. Therefore, the digital camera device 104 can transmit the captured image to the processing device 200 for analysis and comparison, and the parameter setting required by the drilling device 102 Input can also be made by the processing device 200. In this embodiment, The device 200 can be a computer, but the invention is not limited thereto.

請繼續參照第1圖。鑽孔裝置102可為雷射裝置或是機械式的電動鑽孔機。一般而言,在進行鑽孔之前,需要對鑽孔裝置102輸入一些參數設定。當鑽孔裝置102為雷射裝置時,前述的參數設定可包括雷射脈衝的數量、能量和頻率等參數的設定;當鑽孔裝置102為機械式的電動鑽孔機時,前述的參數設定可包括鑽頭之切削速度、轉速和直徑尺寸等參數的設定。在鑽孔裝置102為雷射裝置的實施方式中,加工機台100更可包括升降機構110,升降機構110耦接於鑽孔裝置102,使鑽孔裝置102可相對於平台106升降,以利於調整雷射裝置對測試板體P1的焦距。數位攝像裝置104可為具備電荷耦合元件(Charge-coupled Device;CCD)或互補金屬氧化物半導體(Complementary Metal-Oxide Semiconductor;CMOS)的相機。連接件108可為兩端分別固定於鑽孔裝置102及數位攝像裝置104的連接柱。在其他實施方式中,連接件108也可包括滑軌及滑塊,使得數位攝像裝置104可藉由滑軌及滑塊的設計而在鉛直方向V上相對於鑽孔裝置102移動,也就是說,可在鉛直方向V上相對於平台106移動。舉例而言,滑軌及滑塊可分別設置於鑽孔裝置102及數位攝像裝置104相互面對的側邊,因此數位攝像裝置104便可藉由其側邊的滑塊而在鑽孔裝置102側邊的滑軌上移動。這樣設計的好處是可提供焦距調整的便利性,當鑽孔裝置102為雷射裝置時,雷射裝置與數位攝像裝置104對測試板體P1的焦距可能不同,此時可先將雷射裝置的焦距調整好後,數位攝像裝置104再藉由滑軌及滑塊於鉛 直方向V上移動,以進行數位攝像裝置104的焦距調整。 Please continue to refer to Figure 1. The drilling device 102 can be a laser device or a mechanical electric drill. In general, some parameter settings need to be entered into the drilling apparatus 102 prior to drilling. When the drilling device 102 is a laser device, the aforementioned parameter setting may include setting of parameters such as the number of laser pulses, energy and frequency; when the drilling device 102 is a mechanical electric drilling machine, the aforementioned parameter setting It can include the setting of parameters such as cutting speed, rotation speed and diameter size of the drill bit. In the embodiment in which the drilling device 102 is a laser device, the processing machine 100 further includes a lifting mechanism 110 coupled to the drilling device 102, so that the drilling device 102 can be raised and lowered relative to the platform 106 to facilitate Adjust the focal length of the laser device to the test board P1. The digital camera device 104 may be a camera including a charge-coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS). The connecting member 108 can be a connecting post that is fixed to the drilling device 102 and the digital camera device 104 at both ends. In other embodiments, the connector 108 can also include a slide rail and a slider such that the digital camera 104 can be moved relative to the drilling device 102 in the vertical direction V by the design of the slide rail and the slider, that is, It can move relative to the platform 106 in the vertical direction V. For example, the slide rails and the sliders can be respectively disposed on the sides of the drilling device 102 and the digital camera device 104 facing each other, so the digital camera device 104 can be in the drilling device 102 by the sliders on the side thereof. Move on the side rails. The advantage of such a design is that the focus adjustment can be provided. When the drilling device 102 is a laser device, the focal length of the laser device and the digital camera device 104 may be different for the test plate body P1, and the laser device may be first used. After the focal length is adjusted, the digital camera 104 is again guided by the slide rail and the slider. The straight direction V is moved to adjust the focal length of the digital camera 104.

請參照第2圖。第2圖為本發明一實施方式之加工方法的流程圖。加工方法包括步驟S10至步驟S502,其詳細說明請參見下文。 Please refer to Figure 2. Fig. 2 is a flow chart showing a processing method according to an embodiment of the present invention. The processing method includes steps S10 to S502, which are described in detail below.

步驟S10:使用加工機台100對測試板體P1進行第一鑽孔製程。 Step S10: Perform a first drilling process on the test board P1 using the processing machine 100.

請同時參照第1圖。具體而言,步驟S10係使用加工機台100對測試板體P1進行第一鑽孔製程。第一鑽孔製程進行之目的主要是為了找到能夠生產出符合加工成品所要求的規格的適當參數設定,因此第一鑽孔製程包括使用不同的參數設定以形成複數個第一孔洞於測試板體P1上。 Please also refer to Figure 1. Specifically, step S10 performs a first drilling process on the test board P1 using the processing machine 100. The purpose of the first drilling process is mainly to find an appropriate parameter setting capable of producing the specifications required for the finished product, so the first drilling process includes using different parameter settings to form a plurality of first holes in the test plate body. On P1.

步驟S20:使用加工機台100對測試板體P1擷取第一影像IM1。 Step S20: The first image IM1 is captured from the test board P1 using the processing machine 100.

請同時參照第1、3圖。在第一鑽孔製程完成後,藉由平台106將測試板體P1移動到數位攝像裝置104下方,利用數位攝像裝置104對測試板體P1擷取所形成之孔洞的第一影像IM1。 Please refer to Figures 1 and 3 at the same time. After the first drilling process is completed, the test board body P1 is moved under the digital camera device 104 by the platform 106, and the first image IM1 of the formed hole is extracted from the test board body P1 by the digital camera unit 104.

步驟S30:依據標準孔影像IMS比對第一影像IM1中之第一孔洞輪廓HP1。 Step S30: Align the first hole profile HP1 in the first image IM1 according to the standard hole image IMS.

請同時參照第1、3圖。處理裝置200耦接於數位攝像裝置104以及鑽孔裝置102,因此,數位攝像裝置104所擷取到的第一影像IM1可傳遞至處理裝置200,處理裝置200再依據一標準孔影像IMS(如第4圖所示)比對第一影像IM1中之第一孔洞輪廓HP1。從第3圖可以看出,由於第一鑽孔製程係 使用不同的參數設定而形成複數個第一孔洞於測試板體P1上,因此會產生輪廓形狀不同的第一孔洞輪廓HP1。 Please refer to Figures 1 and 3 at the same time. The processing device 200 is coupled to the digital camera device 104 and the drilling device 102. Therefore, the first image IM1 captured by the digital camera device 104 can be transmitted to the processing device 200, and the processing device 200 can be based on a standard aperture image IMS (eg, Figure 4 shows a comparison of the first hole profile HP1 in the first image IM1. As can be seen from Figure 3, due to the first drilling process A plurality of first holes are formed on the test plate body P1 using different parameter settings, so that a first hole profile HP1 having a different contour shape is produced.

步驟S40:分別量測第一孔洞輪廓HP1的第一尺寸數值。 Step S40: respectively measuring the first size value of the first hole contour HP1.

請同時參照第1、3圖。比對到第一孔洞輪廓HP1後,處理裝置200分別量測第一孔洞輪廓HP1的第一尺寸數值。在本實施方式中,第一尺寸數值包括以最小平方圓法所得到的孔徑大小及圓心座標,以及以最小環帶圓法所得到的真圓度,但本發明不以此為限。在其他實施方式中,第一尺寸數值也可以由最大內切圓法或最小外接圓法得到。 Please refer to Figures 1 and 3 at the same time. After comparing the first hole profile HP1, the processing device 200 measures the first size value of the first hole profile HP1, respectively. In the present embodiment, the first size value includes the aperture size and the center circle obtained by the least square circle method, and the roundness obtained by the minimum ring circle method, but the invention is not limited thereto. In other embodiments, the first size value can also be derived from the maximum inscribed circle method or the minimum circumscribed circle method.

步驟S50:判斷第一尺寸數值是否與預設規格值相符。 Step S50: determining whether the first size value matches the preset specification value.

量測完所有第一孔洞輪廓HP1的第一尺寸數值後,處理裝置200再判斷所得到的這些第一尺寸數值是否與加工成品所要求之預設規格值相符。根據判斷結果的不同,本實施方式之加工方法可更包括步驟S501或S502,說明如下。 After measuring the first size values of all the first hole profiles HP1, the processing device 200 determines whether the obtained first size values match the preset specification values required for the finished product. Depending on the result of the determination, the processing method of the present embodiment may further include step S501 or S502, as explained below.

步驟S501:當有任一第一尺寸數值與預設規格值相符時,以該相符者所對應之第一孔洞形成時所依據的參數設定進行第二鑽孔製程。 Step S501: When any of the first size values matches the preset specification value, the second drilling process is performed according to the parameter setting according to the formation of the first hole corresponding to the matching person.

請同時參照第1圖。當有任一第一尺寸數值與預設規格值相符時,表示該相符者所對應之第一孔洞在形成時所依據的參數設定能夠生產出符合加工成品所要求的規格,因此處理裝置200便將該相符者所對應之第一孔洞形成時所依據的參數設定傳遞至鑽孔裝置102,使得鑽孔裝置102能夠以該相 符者所對應之第一孔洞形成時所依據的參數設定進行第二鑽孔製程,以進行正式加工成品的鑽孔作業。第二鑽孔製程包括形成複數個第二孔洞於加工板體P2上。由於經過了第一鑽孔製程的測試,因此第二鑽孔製程所依據的參數設定能夠生產出符合加工成品所要求的規格。 Please also refer to Figure 1. When any of the first size values is consistent with the preset specification value, the parameter setting according to the first hole corresponding to the conforming person can be produced to meet the specifications required for the finished product, and thus the processing device 200 Passing the parameter setting according to the first hole corresponding to the conforming person to the drilling device 102, so that the drilling device 102 can adopt the phase The second hole drilling process is performed for the parameter setting according to the first hole formed by the symbol to perform the drilling operation of the finished product. The second drilling process includes forming a plurality of second holes on the processing plate P2. Since the first drilling process has been tested, the parameters of the second drilling process are based on the specifications required to produce the finished product.

在本實施方式中,處理裝置200係耦接於數位攝像裝置104以及鑽孔裝置102,但本發明不以此為限。在其他實施方式中,處理裝置200也可以只耦接於數位攝像裝置104。此時,處理裝置200可將前述相符者所對應之第一孔洞在形成時所依據的參數設定輸出給使用者,使用者再將這些參數設定輸入至鑽孔裝置102,以進行第二鑽孔製程。 In the present embodiment, the processing device 200 is coupled to the digital camera device 104 and the drilling device 102, but the invention is not limited thereto. In other embodiments, the processing device 200 may also be coupled to only the digital camera device 104. At this time, the processing device 200 can output the parameter settings according to the first hole corresponding to the aforementioned matching body to the user, and the user inputs the parameter settings to the drilling device 102 for the second drilling. Process.

如第1圖所示,在本實施方式中,測試板體P1與加工板體P2可為同一板體。具體而言,可將同一板體劃分為測試用的部分以及正式加工的部分,第一鑽孔製程可於測試用的部分進行,第二鑽孔製程可於正式加工的部分進行,待第二鑽孔製程進行完畢後,再將測試用的部分切割並移除即可。如此一來,在第一鑽孔製程進行完畢後,即可在同一板體上馬上進行第二鑽孔製程,達到快速生產的效果,但本發明不以此為限。在其他實施方式中,測試板體P1與加工板體P2也可為兩個不同的板體。 As shown in FIG. 1, in the present embodiment, the test plate body P1 and the processed plate body P2 may be the same plate body. Specifically, the same plate body can be divided into a part for testing and a part for formal processing, the first drilling process can be performed on the part for testing, and the second drilling process can be performed in the part of the formal processing, waiting for the second part. After the drilling process is completed, the test part can be cut and removed. In this way, after the first drilling process is completed, the second drilling process can be performed on the same plate body to achieve the effect of rapid production, but the invention is not limited thereto. In other embodiments, the test plate body P1 and the processed plate body P2 may also be two different plate bodies.

步驟S502:當無任一第一尺寸數值與預設規格值相符時,調整參數設定。 Step S502: Adjust the parameter setting when none of the first size values matches the preset specification value.

當無任一第一尺寸數值與預設規格值相符時,表示第一鑽孔製程所依據的參數設定均未能生產出符合加工成 品所要求的規格,因此處理裝置200將調整這些參數設定,並以調整後之參數設定再次進行前述的流程,也就是以調整後之參數設定再次進行步驟S10至S50,直到有任一第一尺寸數值與預設規格值相符為止。 When none of the first size values matches the preset specification value, it means that the parameter setting according to the first drilling process fails to produce a conforming process. The specifications required by the product, so the processing device 200 will adjust these parameter settings, and perform the foregoing process again with the adjusted parameter settings, that is, perform the steps S10 to S50 again with the adjusted parameter settings until there is any first The size value matches the preset specification value.

請參照第5圖。第5圖為本發明一實施方式之加工系統10的方塊圖。如第5圖所示,在本發明之一實施方式中,處理裝置200也可以是獨立於加工機台100之外,而與加工機台100共同組成加工系統10。換句話說,本發明一實施方式提供加工系統10,加工系統10包括加工機台100與處理裝置200,處理裝置200耦接於數位攝像裝置104以及鑽孔裝置102。有關加工機台100之架構可參照第1圖以及前述段落,在此不再贅述。 Please refer to Figure 5. Figure 5 is a block diagram of a processing system 10 in accordance with one embodiment of the present invention. As shown in FIG. 5, in one embodiment of the present invention, the processing apparatus 200 may be formed separately from the processing machine 100 in addition to the processing machine 100. In other words, an embodiment of the present invention provides a processing system 10 that includes a processing machine 100 and a processing device 200 coupled to the digital camera device 104 and the drilling device 102. For the structure of the processing machine 100, reference may be made to FIG. 1 and the foregoing paragraphs, and details are not described herein again.

因此,透過將鑽孔裝置102以及數位攝像裝置104均設置於加工機台100上,且將處理裝置200耦接於數位攝像裝置104,可以在鑽完孔後現地直接進行自動量測,並快速地在機台前決定正確的參數設定。在此要說明的是,這裡所說的「現地」,意思是鑽孔與量測的動作不需要分別在不同的兩地進行,而是可以在同一地點(也就是加工機台100處)直接進行。如此一來,不但節省時間與人力,也提升了加工的效率。 Therefore, by arranging the drilling device 102 and the digital camera device 104 on the processing machine 100 and coupling the processing device 200 to the digital camera device 104, the automatic measurement can be directly performed after the hole is drilled, and quickly The ground determines the correct parameter settings in front of the machine. What is to be explained here is that "local" as used herein means that the drilling and measuring operations do not need to be performed in two different places, but can be directly at the same place (that is, at the processing machine 100). get on. In this way, not only saves time and manpower, but also improves the efficiency of processing.

請參照第6圖以及第7圖。第6圖為本發明另一實施方式之加工方法的流程圖。第7圖為第1圖之加工機台100對加工板體P2所擷取的第二影像IM2。 Please refer to Figure 6 and Figure 7. Figure 6 is a flow chart of a processing method according to another embodiment of the present invention. Fig. 7 is a second image IM2 taken by the processing machine 100 of Fig. 1 on the processed board P2.

如第6圖所示,於本實施方式中,在步驟S501之後,加工方法更包括步驟S21至步驟S512,其詳細說明請參見 下文。 As shown in FIG. 6, in the present embodiment, after step S501, the processing method further includes steps S21 to S512, which are described in detail. Below.

步驟S21:使用加工機台100對加工板體P2擷取第二影像IM2。 Step S21: The second image IM2 is captured from the processing board P2 by using the processing machine 100.

請同時參照第1、7圖。在第二鑽孔製程完成後,藉由平台106將加工板體P2移動到數位攝像裝置104下方,利用數位攝像裝置104對加工板體P2擷取所形成之孔洞的第二影像IM2。 Please also refer to Figures 1 and 7. After the second drilling process is completed, the processing board P2 is moved below the digital camera 104 by the platform 106, and the second image IM2 of the formed hole is captured by the digital camera 104 from the processing board P2.

步驟S31:依據標準孔影像IMS比對第二影像IM2中之第二孔洞輪廓HP2。 Step S31: Align the second hole profile HP2 in the second image IM2 according to the standard hole image IMS.

請同時參照第1、7圖。處理裝置200耦接於數位攝像裝置104以及鑽孔裝置102,因此,數位攝像裝置104所擷取到的第二影像IM2可傳遞至處理裝置200,處理裝置200再依據前述標準孔影像IMS(如第4圖所示)比對第二影像IM2中之第二孔洞輪廓HP2。 Please also refer to Figures 1 and 7. The processing device 200 is coupled to the digital camera device 104 and the drilling device 102. Therefore, the second image IM2 captured by the digital camera device 104 can be transmitted to the processing device 200, and the processing device 200 is further configured according to the standard hole image IMS (eg, Figure 4 shows the second hole profile HP2 in the second image IM2.

步驟S41:分別量測第二孔洞輪廓HP2的第二尺寸數值。 Step S41: respectively measuring the second size value of the second hole profile HP2.

請同時參照第1、7圖。比對到第二孔洞輪廓HP2後,處理裝置200分別量測第二孔洞輪廓HP2的第二尺寸數值。在本實施方式中,第二尺寸數值包括以最小平方圓法所得到的孔徑大小及圓心座標,以及以最小環帶圓法所得到的真圓度,但本發明不以此為限。在其他實施方式中,第二尺寸數值也可以由最大內切圓法或最小外接圓法得到。 Please also refer to Figures 1 and 7. After comparing to the second hole profile HP2, the processing device 200 measures the second size value of the second hole profile HP2, respectively. In the present embodiment, the second size value includes the aperture size and the centroid coordinate obtained by the least square circle method, and the true circularity obtained by the minimum ring circle method, but the invention is not limited thereto. In other embodiments, the second size value can also be derived from the maximum inscribed circle method or the minimum circumscribed circle method.

步驟S51:判斷第二尺寸數值是否與預設規格值不符。 Step S51: determining whether the second size value does not match the preset specification value.

量測完所有第二孔洞輪廓HP2的第二尺寸數值後,處理裝置200再判斷所得到的這些第二尺寸數值是否與加工成品所要求之預設規格值不符。根據判斷結果的不同,本實施方式之加工方法可更包括步驟S511或S512,說明如下。 After measuring the second size values of all the second hole profiles HP2, the processing device 200 determines whether the obtained second size values do not match the preset specification values required for the finished product. Depending on the result of the determination, the processing method of the present embodiment may further include step S511 or S512, as explained below.

步驟S511:當有任一第二尺寸數值與預設規格值不符時,進行提醒程序。 Step S511: When any of the second size values does not match the preset specification value, the reminding program is performed.

當有任一第二尺寸數值與預設規格值不符時,表示該不符者無法滿足加工成品所要求的規格,為不良品,此時將進行提醒程序,提醒使用者有此不良品的存在,以便使用者能進行後續處理或調整。在本發明之一實施方式中,當有任一第二尺寸數值與預設規格值不符時,處理裝置200將啟動此提醒程序。提醒程序例如可藉由警示燈、發聲器、人機介面之提醒訊息或其組合來進行。舉例而言,當加工作業是在較吵雜的環境中進行時,處理裝置200可啟動一警示燈,以提醒使用者有不良品的存在。或是當使用者無法隨時待在加工機台100旁時,處理裝置200也可啟動一發聲器發出警示聲響,進行提醒。又或者是處理裝置200可將有不良品存在的資訊藉由一人機介面之提醒訊息傳達給使用者,例如可在一監控螢幕上跳出提醒視窗提醒使用者,以利進行後續處理或調整。 When any of the second size values does not match the preset specification value, it indicates that the non-conformity cannot meet the specifications required for the finished product, and is a defective product. At this time, a reminder program is issued to remind the user that the defective product exists. So that the user can carry out subsequent processing or adjustment. In an embodiment of the invention, when any of the second size values does not match the preset specification value, the processing device 200 will initiate the reminder. The reminder program can be performed, for example, by a warning light, a sounder, a reminder message of a human-machine interface, or a combination thereof. For example, when the processing operation is performed in a noisy environment, the processing device 200 can activate a warning light to alert the user to the presence of a defective product. Or when the user is unable to stay at the processing machine 100 at any time, the processing device 200 can also activate a sounder to sound a warning sound for reminding. Alternatively, the processing device 200 can transmit the information having the defective product to the user through a reminder message of the human-machine interface. For example, the reminder window can be displayed on a monitoring screen to remind the user for subsequent processing or adjustment.

藉由這樣的提醒機制,可以在加工進行的過程中隨時監控加工成品是否滿足所要求的規格,以確保加工品質。 With such a reminder mechanism, it is possible to monitor whether the finished product meets the required specifications at any time during the processing to ensure the processing quality.

步驟S512:當無任一第二尺寸數值與預設規格值不符時,結束判斷。 Step S512: When none of the second size values does not match the preset specification value, the judgment is ended.

當無任一第二尺寸數值與預設規格值不符時,表 示第二鑽孔製程所形成之複數個第二孔洞均滿足加工成品所要求的規格,此時將結束判斷,使得加工板體P2可以進行後續的其他製程。 When none of the second size values does not match the preset specification value, the table The plurality of second holes formed by the second drilling process satisfy the specifications required for the finished product, and the judgment is ended at this time, so that the processed plate P2 can be subjected to subsequent processes.

由以上對於本發明之具體實施方式之詳述,可以明顯地看出,本發明的加工方法、加工機台及加工系統係將鑽孔裝置以及數位攝像裝置均設置於加工機台上,且將處理裝置耦接於數位攝像裝置,因此在鑽完孔後,可以現地直接進行自動量測,並快速地在機台前決定正確的參數設定,節省時間。此外,也可以在加工的過程當中,現地抽驗加工品質,進行品質監控,當發現有孔洞不符預設規格值時,隨時做調整,確保加工成品符合預設規格值。如此一來,不但省去了將測試板體拿到檢測設備量測,再將量測所得到的適當參數設定帶回到加工機台進行設定的來回奔波時間,還能夠在加工進行的過程中隨時進行監控,確保加工品質。 From the above detailed description of the specific embodiments of the present invention, it can be clearly seen that the processing method, the processing machine and the processing system of the present invention both set the drilling device and the digital camera device on the processing machine, and The processing device is coupled to the digital camera device. Therefore, after the hole is drilled, the automatic measurement can be directly performed in the field, and the correct parameter setting can be quickly determined in front of the machine to save time. In addition, it is also possible to check the processing quality and quality monitoring in the process of processing. When it is found that the hole does not conform to the preset specification value, make adjustments at any time to ensure that the finished product meets the preset specification value. In this way, not only the test board is taken to the testing equipment measurement, but the appropriate parameter setting obtained by the measurement is brought back to the processing machine for setting the back and forth running time, and can also be processed during the process. Monitor at any time to ensure processing quality.

雖然本發明已以實施方式揭露如上,然其並不用以限定本發明,任何熟習此技藝者,在不脫離本發明的精神和範圍內,當可作各種的更動與潤飾,因此本發明的保護範圍當視後附的申請專利範圍所界定者為準。 The present invention has been disclosed in the above embodiments, and is not intended to limit the scope of the present invention, and the invention may be modified and modified in various ways without departing from the spirit and scope of the invention. The scope is subject to the definition of the scope of the patent application.

Claims (6)

一種加工方法,包括:(a)使用一加工機台對一測試板體進行一第一鑽孔製程,其中該第一鑽孔製程包括使用不同的參數設定以形成複數個第一孔洞於該測試板體上;(b)使用該加工機台對該測試板體擷取一第一影像;(c)依據一標準孔影像比對該第一影像中之第一孔洞輪廓;(d)分別量測該些第一孔洞輪廓的第一尺寸數值,其中該些第一尺寸數值包括以最小平方圓法所得到的孔徑大小及圓心座標,以及以最小環帶圓法所得到的真圓度;(e)判斷該些第一尺寸數值是否與一預設規格值相符;以及(f)當有任一該些第一尺寸數值與該預設規格值相符時,以該相符者所對應之第一孔洞形成時所依據的參數設定進行一第二鑽孔製程,其中該第二鑽孔製程包括形成複數個第二孔洞於一加工板體上。 A processing method comprising: (a) performing a first drilling process on a test board using a processing machine, wherein the first drilling process includes using different parameter settings to form a plurality of first holes in the test. (b) using the processing machine to capture a first image of the test panel; (c) comparing a first hole profile in the first image according to a standard hole image; Measure the first size values of the first hole profiles, wherein the first size values include a hole size and a center coordinate obtained by a least square circle method, and a roundness obtained by a minimum ring circle method; e) determining whether the first size values match a predetermined specification value; and (f) when any of the first size values matches the preset specification value, the first corresponding to the match The second drilling process is performed by the parameter setting according to the hole formation, wherein the second drilling process comprises forming a plurality of second holes on a processing plate body. 如請求項1所述之加工方法,更包括:使用該加工機台對該加工板體擷取一第二影像;依據該標準孔影像比對該第二影像中之第二孔洞輪廓;分別量測該些第二孔洞輪廓的第二尺寸數值,其中該些第二尺寸數值包括以最小平方圓法所得到的孔徑大小及圓心座標,以及以最小環帶圓法所得到的真圓度;判斷該些第二尺寸數值是否與該預設規格值不符;以及 當有任一該些第二尺寸數值與該預設規格值不符時,進行一提醒程序。 The processing method of claim 1, further comprising: using the processing machine to capture a second image of the processing board; according to the standard hole image ratio, the second hole contour in the second image; Measure the second size values of the second hole profiles, wherein the second size values include a hole size and a center coordinate obtained by a least square circle method, and a true circularity obtained by a minimum ring circle method; Whether the second size values do not match the preset specification values; When any of the second size values does not match the preset specification value, a reminder procedure is performed. 如請求項2所述之加工方法,其中該提醒程序係藉由警示燈、發聲器、人機介面之提醒訊息或其組合來進行。 The processing method of claim 2, wherein the reminding program is performed by a warning light, a sounder, a reminder message of a human machine interface, or a combination thereof. 如請求項1所述之加工方法,更包括:當無任一該些第一尺寸數值與該預設規格值相符時,調整該些參數設定,並以該些調整後之參數設定再次進行(a)至(e)之步驟。 The processing method of claim 1, further comprising: adjusting the parameter settings when none of the first size values matches the preset specification value, and performing the adjusted parameter settings again ( Steps a) to (e). 一種加工機台,包括:一鑽孔裝置;一數位攝像裝置,鄰近於該鑽孔裝置而設置;一平台,承載該測試板體,其中該平台相對於該鑽孔裝置移動;以及一處理裝置,耦接於該數位攝像裝置,其中該處理裝置配置以將不同的參數設定輸入至該鑽孔裝置,使該鑽孔裝置對一測試板體進行一第一鑽孔製程,其中該第一鑽孔製程包括形成複數個第一孔洞於該測試板體上,其中該處理裝置還配置以接收來自該數位攝像裝置所擷取到的一第一影像,其中該處理裝置還配置以依據一標準孔影像比對該第一影像中之第一孔洞輪廓, 其中該處理裝置還配置以分別量測該些第一孔洞輪廓的第一尺寸數值,其中該些第一尺寸數值包括以最小平方圓法所得到的孔徑大小及圓心座標,以及以最小環帶圓法所得到的真圓度,其中該處理裝置還配置以判斷該些第一尺寸數值是否與一預設規格值相符,其中當該處理裝置判斷任一該些第一尺寸數值與該預設規格值相符時,該處理裝置還配置以將該相符者所對應之第一孔洞形成時所依據的參數設定輸入至該鑽孔裝置,使該鑽孔裝置進行一第二鑽孔製程,其中該第二鑽孔製程包括形成複數個第二孔洞於一加工板體上。 A processing machine includes: a drilling device; a digital camera device disposed adjacent to the drilling device; a platform carrying the test board body, wherein the platform moves relative to the drilling device; and a processing device And coupled to the digital camera device, wherein the processing device is configured to input different parameter settings to the drilling device, and the drilling device performs a first drilling process on a test board body, wherein the first drilling process The hole process includes forming a plurality of first holes on the test board body, wherein the processing device is further configured to receive a first image captured by the digital camera device, wherein the processing device is further configured to follow a standard hole The image is compared to the first hole profile in the first image, The processing device is further configured to separately measure the first size values of the first hole contours, wherein the first size values include the aperture size and the center circle coordinate obtained by the least square circle method, and the minimum ring circle The roundness obtained by the method, wherein the processing device is further configured to determine whether the first size values match a predetermined specification value, wherein the processing device determines any of the first size values and the preset specifications When the values match, the processing device is further configured to input a parameter setting according to the first hole corresponding to the conforming person to the drilling device, so that the drilling device performs a second drilling process, wherein the The two drilling process includes forming a plurality of second holes on a processing plate. 如請求項5所述之加工機台,更包括一連接件,連接該數位攝像裝置與該鑽孔裝置。 The processing machine of claim 5, further comprising a connecting member connecting the digital camera device and the drilling device.
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