200842314 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種高精度之二維光電式角度檢測裝置，特 別指一種光電式量測架構，屬於非接觸式量測系統，不受電磁 場影響的以位置感測器及反射鏡配合雷射所建立的一套量測裝 置，可應用於二維角度定位、真直度、平行度、平坦度及垂直 度之量測。 【先前技術】 目前常見的商用光電角度式量測系統，以雷射干涉儀與自 動視準儀最為常見。雷射干涉儀是目前精度最高的商用量測系 統，但是其售價偏高、架設麻煩、單次只能量測單一誤差。自 動視準儀具有售價低於雷射干涉儀、架設容易及單次可量測兩 個軸向的角度等優點，但是其精度並不如雷射干涉儀。雷射干 涉儀的角度量測精度可達0.05 arc sec，自動視準儀的精度約為 0.5〜1 arc sec，本發明所建立的量測系統其量測精度至少可達 0.05 arc sec 〇 在近30年的光電式角度量測系統發展中，有許多人以偏振 干涉的技術來.建立光電式角度量測系統，但是偏振干涉技術與 雷射干涉儀一樣具有高成本、單次量測只能量測一維角度變 化.，且.其所建.立之系統_的精复並無法鹿.美干涉儀。 除了偏振干涉之外，尚有部分研究:使用遗鏡、光柵或者是 干涉條紋:等技術提升光_貧丈角:度量測系統、的系統精度及靈敏 200842314 度，但是其所建立的系統之精度依然無法娘美雷射干涉儀。 【發明内容】 本發明之目的即在於提供一種透過雷射光束的多重反射， 有效提高系統的量測精度之二維光電式高精度角度量測系統， 本發明之次一目的係在於提供一種分析二維位置感測器上 的光點變化，即可得到待測物的兩個軸向角度變化之二雄光電 式南精度角度量測糸統。 # 本發明之另一目的係在於提供一種可應用於二維角度定 位、真直度、平行度、平坦度及垂直度量測之二維光電式高精 度角度量測系統。 本發明之又一目的係在於提供一種光電式量測架構，屬於 非接觸式ϊ測糸統’不受電磁場影響之二維光電式尚精度角度 量測系統。 本發明之再一目的係在於提供一種光束多經一次反射，則 ® 角度改變前與角度改變後的位置差將增加一倍，因此透過簡單 的反射過程可達到有效提高系統的靈敏度及量測精度之二維光 電式而精度角度量測糸統。 可達成上述發明目的之二維光電式高精度角度量測系統， 係由一個雷射光.源、一個二維位置感測器、·及三面反射鏡所構 成；其中單面反射鏡固定於待測物上，而雷射先源〜二維位置 感測器及其餘兩面反射鏡均固定於系統.夾具之上；當雷舯光源 200842314 發出的光束被待測物上的反射鏡反射回系統時，雷射光束會在 系統的兩面反射鏡間多次反射，最後投射到二維位置感測器上。 【實施方式】 請參閱圖二，本發明所提供之二維光電式高精度角度量測 系統，主要包括有：一雷射光源3,該雷射光源3另可採用可見 光、微波、紅外光、紫外光、X射線，端視量測環境所需及精度 所需而進行更換且皆可應用於相對距離量測；一二維位置感测 器4以及三面反射鏡21〜23所構成。 其中單面反射鏡21固定於待測物1上，而雷射光源3、二 維位置感測器4及其餘兩面反射鏡22,23均固定於系統夾具5 之上。當雷射光源3發出的光束被待測物1上的反射鏡21反射 回系統時，雷射光束會在系統的兩面反射鏡22,23間多次反射， 最後投射到二維位置感測器4上。透過分析二維位置感測器4 上的光點變化，即可得到待測物1的兩個軸向角度變化。透過 雷射光束的多重反射，可有效提高系統的靈敏度及量測精度。 如圖一所示以一個經過三次反射的系統為例，當系統只經 過一次反射之時，則角度改變前與角度改變後於反射鏡22的入 射點位置差為： ·200842314 IX. INSTRUCTIONS: [Technical Field] The present invention relates to a high-precision two-dimensional photoelectric angle detecting device, in particular to a photoelectric measuring structure, belonging to a non-contact measuring system, which is not affected by an electromagnetic field A set of measuring devices built with position sensors and mirrors with lasers can be used for two-dimensional angular positioning, true straightness, parallelism, flatness and verticality measurement. [Prior Art] At present, the common commercial photoelectric angle measuring system is the most common with laser interferometer and automatic collimator. The laser interferometer is currently the most accurate commercial measurement system, but its price is high, the installation is troublesome, and a single error can only be measured in a single time. The automatic collimator has the advantages of lower price than the laser interferometer, easy installation and single axial measurement of the two axial angles, but its accuracy is not as good as that of the laser interferometer. The laser interferometer has an angular measurement accuracy of 0.05 arc sec, and the accuracy of the automatic collimator is about 0.5 to 1 arc sec. The measurement system established by the present invention has a measurement accuracy of at least 0.05 arc sec. In the development of 30-year photoelectric angle measurement system, many people use the technique of polarization interference to establish a photoelectric angle measurement system, but the polarization interference technology has the same high cost as the laser interferometer. Measuring the one-dimensional angle change. And the system built by the system is not able to deer. In addition to polarization interference, there are still some studies: the use of Mirrors, Gratings, or Interference Fringes: Techniques to Improve Light _ Poverty Angle: Measurement System, System Accuracy and Sensitivity 200842314 degrees, but the system established by it Accuracy is still not possible with Niangmei Laser Interferometer. SUMMARY OF THE INVENTION The object of the present invention is to provide a two-dimensional photoelectric high-precision angle measuring system that effectively improves the measurement accuracy of a system by multiple reflection of a laser beam, and the second object of the present invention is to provide an analysis. The change of the light spot on the two-dimensional position sensor can obtain the two-orientation angle measurement of the two axial angles of the object to be tested. Another object of the present invention is to provide a two-dimensional photoelectric high-precision angle measuring system which can be applied to two-dimensional angular positioning, true straightness, parallelism, flatness and vertical measurement. Another object of the present invention is to provide a photoelectric measuring architecture which belongs to a two-dimensional photoelectric type precision angle measuring system which is not affected by an electromagnetic field. A further object of the present invention is to provide a beam that is reflected once more, and the position difference between the angle before and after the angle change is doubled, so that the sensitivity and measurement accuracy of the system can be effectively improved by a simple reflection process. The two-dimensional photoelectric type and the precision angle measurement system. The two-dimensional photoelectric high-precision angle measuring system capable of achieving the above object is composed of a laser light source, a two-dimensional position sensor, and a three-sided mirror; wherein the single-sided mirror is fixed to be tested On the object, the laser source 2D position sensor and the remaining two mirrors are fixed on the system fixture; when the beam emitted by the Thunder light source 200842314 is reflected back to the system by the mirror on the object to be tested, The laser beam is reflected multiple times between the two mirrors of the system and finally projected onto the two-dimensional position sensor. [Embodiment] Please refer to FIG. 2 , the two-dimensional photoelectric high-precision angle measuring system provided by the present invention mainly includes: a laser light source 3, and the laser light source 3 can also adopt visible light, microwave, infrared light, The ultraviolet light and the X-ray are replaced by the required and precision required for the measurement environment, and can be applied to the relative distance measurement; a two-dimensional position sensor 4 and three-sided mirrors 21 to 23. The single-sided mirror 21 is fixed on the object to be tested 1, and the laser light source 3, the two-dimensional position sensor 4 and the remaining two-sided mirrors 22, 23 are fixed on the system fixture 5. When the light beam emitted by the laser light source 3 is reflected back to the system by the mirror 21 on the object to be tested 1, the laser beam is reflected multiple times between the two-sided mirrors 22, 23 of the system, and finally projected to the two-dimensional position sensor. 4 on. By analyzing the change of the spot on the two-dimensional position sensor 4, two axial angle changes of the object 1 can be obtained. Through the multiple reflection of the laser beam, the sensitivity and measurement accuracy of the system can be effectively improved. As shown in Fig. 1, taking a three-reflection system as an example, when the system has only reflected once, the difference between the position of the entrance point of the mirror 22 before the angle change and the angle change is:
Ax =L[siR0l -sin(92) 當光東經過第二次反射時，則角，度改.變前與角、度改變後.於反射-鏡面23的人射點位_置差為：. 200842314 Δ2 =A1 + l(sin^1 -*sin62) = 2A1 最後光束落於位置感測器4上的位置可寫成下式： △3 = Δ2 + i/sin(<92 -3) = 2Δ! + dsin(i92 一g) 由上式可知’每當光束多經一次反射，則角度改變前與角 度改變後的位置差將增加一倍，因此透過簡單的反射過程可達 到有效提南系統的靈敏度及量測精度之功能。 (一）系統架構及動作說明 本發明的系統架構如圖二所示，其架設方式及動作方式如 下所述： (a) 、將一面反射鏡21固定於待測物i之上； (b) 、將反射鏡22、反射鏡23、雷射光源3及二維位置感 測器4固定於系統夾具5之上； (c) 、雷射光源3發射一道雷射光源3到待測物丨上的反射 鏡21上； (d) 、調整待測物1上反射鏡21及量測系統治具5上的雷 射光源3的位置及角度，使雷射光最後投射在位置感測器*中 央； 0)、將位置感測器4·的輸出訊號線連接到位置感測器訊號 處理器·， (f)將位置感測益訊號處理||的輸出訊號線連接到個人電 腦上的類比/數位訊號轉換卡。 200842314 在完成系統的架設舆連接之後，當待測物i有繞著x軸或 Z軸旋轉時，則二維位置感測器4上的雷射光點會有相對應的 變化，透過分析二維位置感測器4上的光點位置變化，即可得 到待測物1繞著X軸或Z軸旋轉的角度變化。當待測物1繞著 Z軸旋轉時，則二維位置感測器4上的光點變化如圖三（a)所示， 會出現左右平移的現象，端視順時針方向或逆時針方向旋轉而 定；當待測物1沿著X軸旋轉時，則二維位置感測器4上的光 點變化如圖三（a)所示，會出現上下平移的現象，端視順時針方 向或逆時針方向旋轉而定。 本發明所建立的量測系統在進行實際量測前，必須對二維 位置感測器4校正及系統整體的校正。 (二）二維位置感測器校正： 二維位置感測器4用於量測前，必須先經過校正，如圖四 所示。將二維位置感測器4放置在線性微動平台8上，其上有 雷射光3打入反射鏡21，接著架設雷射干涉儀7，使雷射干涉 儀7可以量測線性微動平台8之移動量。最後將線性微動平台8 每隔固定距離定點來回移動數次，並且同步擷取二維位置感測 器4訊號與雷射干涉儀7之讀值，將此過程所擷取的資料，經 過最.小平方法計算後，即可#到此組.二維位置感測器4的故正 曲線。上述校.正流.程，如圖五*(a)所示。 二維位·置.感測器4-的校正分成X,軸校正與Y軸校正兩次， 200842314 在做X軸校正時，線性微動平台8移動方式為，讓線性微動平 台S之移動方向與二維位置感測器4之X軸平行，然後在二維 位置感测器4工作範圍内每隔固定距離來回移動數次；而Y軸 的校正則是將二維位置感測器4轉90度後，讓線性微動平台8 之移動方向與二維位置感測器4的Y軸平行，接著讓線性微動 平台8在二維位置感測器4工作範圍内每隔固定距離來回移動 數二欠。 • 上述校正流程，如圖五（b)所示，將上述兩個動作過程所擷 取的資料經由計算，即可得到二維位置感測器4的X軸及Y軸 校正曲線。透過上述的二維位置感測器4校正過程，即可得到 位置感測器訊號與位置感測器上光點位置的關係式。因此本發 明只要透過個人電腦及數位訊號/類比訊號轉換卡擷取二維位 置感測器4的訊號即可得到二維位置感測器4上光點的位置。 φ (三）系統校正： 本發明的系統校正架設如圖六所示，系統校正必須藉由旋 轉平台1’提供角度定位及自動視準儀9提供參考角度以進行校 正.。由於單一轉盤1”只能提供單一轴向的旋轉，因此系統校正 必須分成兩部份進行，校正流程如圖七所示。 第一部分梗正為，校正量測系紇量測.待測物1.繞X軸旋棒 之能_力，其擺設I式如圖六⑷所示·。反射鏡21及反射鏡2_丰分 別放.置於旋轉平合Γ的兩端，並於反射鏡2:1前放.置本發明所述 10 200842314 之系統，於反射鏡24前放置自動視準儀9。接著讓旋轉平台！， 每隔固定角位置定點來回旋轉數次，並同步擷取二維位置感測 器4訊號與自動視準儀9讀值，將此過程所擷取的資料，經過 最小平方法計算後，即可得到此系統量測待測物1繞X軸旋轉 之校正曲線。 第二部分校正為，校正量測系統量測待測物1繞Z軸旋轉 之志力’其擺設方式如圖六（b)所示。反射鏡21及反射鏡24分 馨 別放置於旋轉平台1，的兩端，並於反射鏡21前放置本發明，於 反射鏡24前放置自動視準儀9。接著讓旋轉平台丨，每隔固定角 位置疋點來回旋轉數次，並同步擷取二維位置感測器4訊號與 自動視準儀9讀值，將此過程所擷取的資料，經過最小平方法 5十异後，即可得到此系統量測待測物1繞Z軸旋轉之校正曲線。 經由上述校正程序，即可得到二維位置感測器4上光點變 修化與待測物1繞X軸或γ軸旋轉的轉換關係式。因此，本發明 要利用個人笔細透過類比/數位訊號轉換卡擷取二維位置减 測益4上的光點位置，即可計算出待測物j繞X軸或γ軸旋轉 的角度。 在疋成系統校正，本發明即可以應用角度量測，並可進一 乂應用於轉盤」”定位量測，機具直度量測、機具平行度量測、 機具平坦度量測。 (四）轉盤定仇量測 200842314 本發明應用於轉盤360度定位量测或校正之架設圖如圖八 所示：將一多面稜鏡10放置於待測轉盤1”之上，將轉盤1”歸 零，並將本發明對準多面稜鏡10的其中一面反射面，並調整本 發明的位置，使自多面稜鏡10反射回的雷射光束可投射到二維 位置感測器4的中央。首先讓本發明紀錄轉盤1”於零度時的角 位置丄接著讓轉盤1”隔固定角度旋轉，本發明並於轉盤1”旋轉 固定角度停止後記錄資料一次，系統紀錄完之後，轉盤1”繼續 隔固定角度旋轉，並重複上述旋轉及記錄流程直到轉盤1”旋轉 完3 60度。將上述的操作過程的系統紀錄加以整理，即可得到 旋轉平台的角定位性能。 (五） 機具直度量測 真直度量測一般用於導執之量測或者是長方形工件，本發 明應用於直度量測的系統架設如圖九所示：將一反射鏡25置放 於長形工件11上，並將長形工件11分成數個量測點（如圖十所 示）。然後，將反射鏡25移動到待測點上方，依序量測每一個 點的反射鏡25角度變化，將每一個點的量測結果整理在一起， 即可得到導軌或長形工件之真直度。 (六) 機具平行度量測 本發明所能做的平行度量測，通常是指扭轉方向的平行 度。假_設:要量測兩道滑軌的平行度”將兩道長形工件11分成.數 12 200842314 - ^. _ 個量測點（如圖十-所示），，然後，將反射鏡25移動到待測點上 方，依序量測每-個點的反射鏡25角度變化，將每—個點的量 測結果整理在一起，即可得到兩道導執之平行度。 (七）機具平坦度量測 平坦度量測大多應用於大型工件量測，如光學桌、花岗石 平台、鑄鐵平台、工具機床台及飛機機翼等長形工件。。本發 • 日月應用於平坦度量測的系統架設如圖十二所示：將-反射鏡25 置放於長形工件11上，並將長形卫件u分成數個量測點（如圖 十二所不)。然後，將反射鏡25移動到待測點上方，依序量測 每一個點的反射鏡角度變化，最後整理量測的結果，即可得到 長形工件11之平坦度。 綜上所述，本案不但在空間型態上確屬創新，並能較過去 運用於工具機之量測技術更增進上述多項功效，應已充分符合 _ 新穎性及進步性之法定發明專利要件，爰依法提出申請，懇請 貝局核准本件發明專利申請案，以勵發明，至感德便。 【圖式簡單說明】 圖一為系統反射鏡對位置感測器讀值影響示意圖；· 圖二為本發明二維光電式高精度角度量測系統架構示意 圖； 圖二⑷、圖三(b)為位置感測器上先點位置變化示意圖； 圖四為二維仪置感測器校正架構示意圖;. 13 200842314 圖五（a)、圖五（b)為本發明位置感測器校正流程圖； 圖/、（a)、圖六（b)為本發明系統校正設定示意圖； 圖七為本發明系統校正流程圖； 圖八為本發明高精度角度量測系統應用至轉盤量測示意 圖九為本發明高精度角度量測系統應用至平台直度量測示 意圖；Ax =L[siR0l -sin(92) When the light is reflected by the second time, the angle is changed. Before the change and the angle and degree are changed, the reflection point of the reflection-mirror 23 is _: 200842314 Δ2 =A1 + l(sin^1 -*sin62) = 2A1 The position of the last beam falling on the position sensor 4 can be written as follows: △3 = Δ2 + i/sin(<92 -3) = 2Δ! + dsin(i92 ag) From the above formula, 'When the beam is reflected once more, the position difference before the angle change and the angle change will be doubled, so the effective lifting system can be achieved through a simple reflection process. The sensitivity and measurement accuracy of the function. (1) System architecture and operation description The system architecture of the present invention is shown in FIG. 2, and the erection mode and operation mode are as follows: (a) Fixing one mirror 21 on the object to be tested i; (b) The mirror 22, the mirror 23, the laser source 3, and the two-dimensional position sensor 4 are fixed on the system fixture 5; (c) the laser source 3 emits a laser source 3 to the object to be tested. (d), adjusting the position and angle of the laser light source 3 on the mirror 21 on the object 1 and the measuring system fixture 5, so that the laser light is finally projected in the center of the position sensor*; 0) Connect the output signal line of the position sensor 4· to the position sensor signal processor·, (f) Connect the output signal line of the position sensing signal processing || to the analog/digital position on the personal computer. Signal conversion card. 200842314 After the erection of the system is completed, when the object to be tested i rotates around the x-axis or the z-axis, the laser spot on the two-dimensional position sensor 4 will have a corresponding change, and the two-dimensional analysis is performed. The position of the spot on the position sensor 4 is changed, and the angle of the rotation of the object 1 around the X-axis or the Z-axis is obtained. When the object 1 is rotated about the Z axis, the change of the spot on the two-dimensional position sensor 4 is as shown in FIG. 3(a), and the left and right translation phenomenon occurs, and the end direction is clockwise or counterclockwise. Depending on the rotation; when the object 1 is rotated along the X axis, the change in the spot on the two-dimensional position sensor 4 is as shown in Fig. 3(a), and the up and down translation occurs, and the end view is clockwise. Or depending on the rotation in the counterclockwise direction. The measurement system established by the present invention must correct the two-dimensional position sensor 4 and the overall system correction before performing the actual measurement. (2) Two-dimensional position sensor correction: Before the two-dimensional position sensor 4 is used for measurement, it must be corrected first, as shown in Figure 4. The two-dimensional position sensor 4 is placed on the linear micro-motion platform 8, on which the laser light 3 is driven into the mirror 21, and then the laser interferometer 7 is mounted, so that the laser interferometer 7 can measure the linear micro-motion platform 8 The amount of movement. Finally, the linear micro-motion platform 8 is moved back and forth several times at fixed distances, and the two-dimensional position sensor 4 signal and the reading value of the laser interferometer 7 are synchronously captured, and the data extracted by the process passes through the most. After the calculation of the small flat method, it can be # to this group. The positive curve of the two-dimensional position sensor 4. The above-mentioned school. Positive flow, as shown in Figure 5 * (a). The calibration of the two-dimensional position sensor 4 is divided into X, the axis correction and the Y-axis correction twice, 200842314. When performing the X-axis correction, the linear micro-motion platform 8 moves in such a manner that the moving direction of the linear micro-motion platform S is The X-axis of the two-dimensional position sensor 4 is parallel, and then moves back and forth several times at a fixed distance within the working range of the two-dimensional position sensor 4; and the correction of the Y-axis is to rotate the two-dimensional position sensor 4 to 90 After the degree, the moving direction of the linear micro-motion platform 8 is parallel to the Y-axis of the two-dimensional position sensor 4, and then the linear micro-motion platform 8 is moved back and forth every fixed distance within the working range of the two-dimensional position sensor 4. . • The above calibration process, as shown in Figure 5(b), calculates the X-axis and Y-axis calibration curves of the two-dimensional position sensor 4 by calculating the data acquired by the above two motion processes. Through the above-mentioned two-dimensional position sensor 4 calibration process, the relationship between the position sensor signal and the position of the spot on the position sensor can be obtained. Therefore, the position of the light spot on the two-dimensional position sensor 4 can be obtained by the present invention by taking the signal of the two-dimensional position sensor 4 through the personal computer and the digital signal/analog signal conversion card. φ (3) System Correction: The system calibration erection of the present invention is shown in Figure 6. The system calibration must provide angular reference by the rotary platform 1' and the reference angle provided by the automatic collimator 9 for correction. Since the single turntable 1" can only provide a single axial rotation, the system calibration must be divided into two parts. The calibration process is shown in Figure 7. The first part is positive, the calibration measurement system is measured. The object to be tested 1 The energy of the X-axis rotating rod is shown in Figure 6 (4). The mirror 21 and the mirror 2_ are placed separately. They are placed at the two ends of the rotating flat, and the mirror 2 The system of 10 200842314 according to the present invention is arranged with an automatic collimator 9 placed in front of the mirror 24. Then, the rotating platform!, is rotated back and forth several times at regular fixed angle positions, and synchronously captures two dimensions. The position sensor 4 signal and the automatic collimator 9 read the value, and the data acquired by the process is calculated by the least square method, and then the system can measure the calibration curve of the object 1 to be rotated around the X axis. The second part is corrected as: the calibration measurement system measures the ambition of the object 1 to be rotated around the Z axis. The arrangement is shown in Figure 6(b). The mirror 21 and the mirror 24 are placed on the rotating platform. The two ends of the 1, and placed in front of the mirror 21, placed in front of the mirror 24 placed automatic collimator 9. Then let the rotating platform 丨, rotate back and forth several times every fixed angle position, and simultaneously capture the two-dimensional position sensor 4 signal and the automatic collimator 9 reading value, the data obtained by this process, After the minimum plane method is 5 different, the system can measure the calibration curve of the object 1 to be rotated around the Z axis. Through the above calibration procedure, the spot correction of the two-dimensional position sensor 4 can be obtained. The conversion relationship of the object 1 to be rotated around the X-axis or the γ-axis. Therefore, the present invention can calculate the position of the light spot on the two-dimensional position minus the benefit 4 by using a personal pen to transmit the analog/digital signal conversion card. The angle at which the object to be tested j rotates around the X-axis or the γ-axis. In the system calibration, the present invention can apply the angle measurement, and can be applied to the turntable "" positioning measurement, the machine direct measurement, the machine tool Parallel metric measurement, machine flat measurement Measure. (4) Turntable venge measurement 200842314 The erection diagram of the invention applied to the 360 degree positioning measurement or correction of the turntable is shown in Figure 8: placing a multi-faceted 稜鏡10 Above the turntable 1" to be tested, zero the turntable 1" and Aligning one of the reflecting surfaces of the multi-faceted cymbal 10 and adjusting the position of the present invention so that the laser beam reflected back from the multi-faceted cymbal 10 can be projected to the center of the two-dimensional position sensor 4. First, the present invention records The angular position of the turntable 1" at zero degrees is then rotated by the fixed angle of the turntable 1". The present invention records the data once after the rotation of the turntable 1" is stopped. After the system is recorded, the turntable 1" continues to rotate at a fixed angle. The above rotation and recording process is repeated until the turntable 1" is rotated by 3 60 degrees. By arranging the system records of the above operation process, the angular positioning performance of the rotating platform can be obtained. (5) Machine straight measurement true straight measurement is generally used for the measurement of the guide or rectangular workpiece. The system is applied to the system measurement of the direct measurement as shown in Figure 9: placing a mirror 25 on The elongated workpiece 11 is divided into a plurality of measuring points (as shown in FIG. 10). Then, the mirror 25 is moved above the point to be measured, and the angle change of the mirror 25 of each point is sequentially measured, and the measurement results of each point are put together to obtain the true straightness of the guide rail or the elongated workpiece. . (vi) Machine parallel measurement The parallel measurement that can be done by the present invention generally refers to the parallelism of the torsion direction. False _ set: to measure the parallelism of the two rails" divide the two long workpieces 11 into . 12 200842314 - ^. _ measuring points (as shown in Figure 10), and then, the mirror 25 Move to the top of the point to be measured, measure the angle change of the mirror 25 at each point in sequence, and sort the measurement results of each point together to obtain the parallelism of the two guides. Flatness measurement Flatness measurement is mostly used for large workpiece measurement, such as optical tables, granite platforms, cast iron platforms, tool machine tables, and aircraft wings, etc.. This issue • Sun and Moon apply to flatness The measurement system is erected as shown in Fig. 12: the mirror 25 is placed on the elongated workpiece 11, and the elongated guard u is divided into several measuring points (as shown in Fig. 12). Then, Move the mirror 25 above the point to be measured, measure the change of the mirror angle of each point in sequence, and finally sort the result of the measurement to obtain the flatness of the elongated workpiece 11. In summary, the case is not only The space type is indeed innovative, and can be more enhanced than the measurement technology used in the past. Efficacy, should have fully complied with the _ novelty and progressive statutory invention patent requirements, 提出 apply in accordance with the law, please ask the Bay Bureau to approve the invention patent application, in order to invent invention, to the sense of virtue. [Simple diagram] Figure 1 Schematic diagram of the influence of the system mirror on the position sensor reading; · Figure 2 is a schematic diagram of the two-dimensional photoelectric high-precision angle measuring system architecture; Figure 2 (4), Figure 3 (b) is the first point on the position sensor Schematic diagram of position change; Figure 4 is a schematic diagram of the calibration structure of the two-dimensional sensor; 13 200842314 Figure 5 (a), Figure 5 (b) is a flow chart of the position sensor correction of the present invention; Figure /, (a), Figure 6 (b) is a schematic diagram of the system calibration setting of the present invention; Figure 7 is a flowchart of the system calibration of the present invention; Figure 8 is a schematic diagram of the high-precision angle measuring system applied to the turntable of the present invention. Apply to the platform direct measurement schematic;
圖十為本發明真直度及傾斜度量測路徑圖； 圖^ 為本發明平行度量測路徑圖； 圖十二為本發明高精度角度量測系統應用至平台平坦度量 圖十二為本發明平坦度量測路徑圖。 【主要元件符號說明】 1待測物 Γ 旋轉平台 1” 轉盤 21〜25 反射鏡 3 雷射光源 4 二維位置感測器 5 系統失具 7 雷射干涉儀 8 線性崔支動平·台: 自，動視厚儀 9 200842314 ίο 多面稜鏡 11 長形工件Figure 10 is a schematic diagram of the true straightness and tilt measurement path of the present invention; Figure 2 is a parallel measurement path diagram of the present invention; Figure 12 is a high-precision angle measurement system applied to the platform flatness measurement chart of the present invention. Flat measurement path diagram. [Description of main component symbols] 1 Object to be tested 旋转 Rotating platform 1” Turntable 21~25 Mirror 3 Laser light source 4 Two-dimensional position sensor 5 System missing 7 Laser interferometer 8 Linear Cui supporting flat table: Self-moving thick gauge 9 200842314 ίο Multi-faceted 稜鏡 11 long workpiece