200841163 (1) 九、發明說明 【發明所屬之技術領域】 本發明係關於薄型的液冷（水冷）系統，特別是關於適 用於筆記型電腦之液冷系統。 . 【先前技術】 本申請人正在開發用來冷卻筆記型電腦的發熱源 φ (CPU)之液冷系統。在零件的收納空間有限之筆記型電腦 ，如日本特開2000-323880、日本特開2004-6563、日本特 開2004-95 89 1號等所示，係要求整體呈薄型且單元性高之 液冷系統。 習知製品，爲了將泵、吸熱部、散熱部等各別具備之 各要素予以連接，必須使用管體，因此缺乏一體性（單元 性），而存在組裝性的問題。又關於有效將發熱源（CPU)冷 卻以進行散熱（使局部發熱的部分消失）這點，尙有改良的 m 餘地。 【發明內容】 本發明的目的，是爲了提供一種整個系統都不用管體 ’全部的要素都設置在散熱片上之單元性優異的液冷系統 。又本發明的目的，是爲了提供一種能讓散熱片高效率地 進行散熱而不容易產生局部發熱的部分之液冷系統。 本發明之液冷系統，係具備：具有相疊合之一對傳熱 性金屬板，且在該一對傳熱性金屬板之間設有循環流路之 -4- 200841163 (2) 散熱片； 開口於該散熱片表面，且位於循環流路的兩端部之入 口孔和出口孔； 具有連通於該入口孔和出口孔之排出口和吸入口，設 ’置於該散熱片上之泵； .設定於散熱片上之受熱區和散熱區；以及 透過傳熱材料構成之散熱器而設置於該受熱區上之發 • 熱體； 循環流路係具備：位於受熱區的散熱器的下面之吸熱 流路、以及位於散熱區且其流路長度比吸熱流路的流路長 度長非常多之散熱流路。 具體而言，散熱流路的流路長度宜爲吸熱流路的流路 長度之1 〇倍以上。200841163 (1) Description of the Invention [Technical Field] The present invention relates to a thin liquid-cooled (water-cooled) system, and more particularly to a liquid-cooling system suitable for a notebook computer. [Prior Art] The applicant is developing a liquid cooling system for cooling the heat source φ (CPU) of the notebook computer. A notebook computer having a limited storage space for parts, such as Japanese Laid-Open Patent Publication No. 2000-323880, Japanese Patent Application Laid-Open No. 2004-6563, and No. 2004-95 89 No. 1, the entire disclosure of which is required to be a thin and highly unitary liquid. Cold system. In order to connect the respective elements provided in the pump, the heat absorbing portion, and the heat dissipating portion, it is necessary to use the tube body. Therefore, the integral product (unitary) is lacking, and there is a problem of assemblability. Further, there is room for improvement in that the heat source (CPU) is effectively cooled to dissipate heat (the portion where local heat is generated disappears). SUMMARY OF THE INVENTION An object of the present invention is to provide a liquid cooling system which is excellent in unitiness in which all the elements of the entire system are not provided on the heat sink. Still another object of the present invention is to provide a liquid cooling system which allows a heat sink to efficiently dissipate heat without causing local heat generation. The liquid cooling system of the present invention comprises: a pair of heat transfer metal plates stacked one on another, and a circulation flow path provided between the pair of heat transfer metal plates -4- 200841163 (2) heat sink An inlet hole and an outlet hole opening at the both ends of the circulation flow path and having a discharge port and a suction port connected to the inlet hole and the outlet hole, and a pump disposed on the heat sink; a heat receiving zone and a heat radiating zone disposed on the heat sink; and a heat generating body disposed on the heat receiving zone through a heat sink formed of a heat transfer material; the circulation flow path having: heat absorption under the heat sink located in the heat receiving zone The flow path and the heat dissipation flow path which are located in the heat dissipation zone and whose flow path length is much longer than the flow path length of the heat absorption flow path. Specifically, the flow path length of the heat dissipation flow path is preferably 1 or more times the length of the flow path of the heat absorption flow path.
較佳爲，在吸熱流路設置：位於發熱體的正下方之主 吸熱流路、以及與該主吸熱流路鄰接之至少一個吸熱U • 字狀流路。又較佳爲，在從該吸熱U字狀流路連通到散 熱區之散熱流路，在再度返回受熱區之前，係設有在該散 熱區進行複數次往返之散熱往返流路 ' 主吸熱流路，可在入口部和出口部形成1條，在發熱 - 源正下方分支成複數條。 主吸熱流路之一態樣，是在通過該主吸熱流路後，連 接至通過散熱片之最外周再返回上述出口孔之最外周散熱 流路。 散熱片的面積，具體而言，可爲散熱器的面積之10倍 200841163 (3) 以上。 實際上，循環流路之上述入口孔和出口孔，係以筒狀 突起的方式形成於散熱片；泵之排出口和吸入口，係連通 於該入口孔筒狀突起之排出流路孔和連通於出口孔筒狀突 • 起之吸入口孔。 ， 泵是採用壓電泵時，可謀求小型薄型化。 可在泵和散熱片之間挾持間隔塊，在該間隔塊形成循 φ 環流路之注水孔。 本發明之液冷系統，係適用於將筆記型電腦的CPU 予以冷卻。在一態樣，可將本液冷系統全體收納於具有鍵 盤之本體內部。這時，若將本液冷系統之散熱片沿著鍵盤 的表面設置，則可提昇散熱性。 本發明之液冷系統，係將泵、散熱器以及發熱源全部 都裝載在散熱片上，因此具有高單元性。又散熱片內之循 環流路係包含：位於散熱器下方（吸熱區）之吸熱流路以及 Φ 位於散熱區之散熱流路，且散熱流路的流路長度比吸熱流 路的流路長度長非常多，因此能獲得有效的散熱及較均等 的熱分布。 【實施方式】 第1圖係本發明的液冷系統單元1 00之一實施形態之全 體的俯視圖。該液冷系統單元1 〇〇，如第8圖所示，係收納 於筆記型電腦101之具有鍵盤102的本體部103內，用來將 發熱源之CPU 104予以冷卻。本實施形態之液冷系統單元 200841163 (4) 100，與可相對本體部103進行開閉之LCD(顯示部）1〇5完 全無關。 液冷系統單元1 〇〇，如第2圖至第4圖所示’係具備： 散熱片10、裝載於該散熱片10上之壓電泵20、以及由傳熱 -性金屬材料構成之散熱器40。在散熱器40上裝載CPU104 - 。蓋體41是位於CPU104上（用散熱器40和蓋體41來挾持 CPU1 04)，在散熱片10和壓電泵20之間設置間隔件42。壓 φ 電泵20、散熱器40及CPU104，雖是設置於散熱片10的背 面（鍵盤102的背面側），但爲了圖示的方便，第1圖、第2 圖及第5圖中，係顯示從背面觀察本液冷系統1〇〇的狀態。 散熱片1 〇，係由一對之相重疊的傳熱性金屬板（硬焊 片）1 0U及1 0L所構成，在一方的硬焊片1 0L上，形成用來 構成循環流路1 1之流路凹部1 1 a。流路凹部1 1 a的深度例 如爲0.2mm左右。硬焊片如周知般，是在金屬材料（一般 爲鋁合金）構成之片芯材的表裏附著焊材後，藉由衝壓加 φ 工來形成流路凹部1 1 a，並將其一對抵接後，在加壓下進 行加熱，使焊材熔融而互相接合。一般之硬焊片l〇U( 10 L) ，係具有0.4mm左右的厚度，本發明之散熱片10(硬焊片） 的材料和厚度並沒有特別的限定。 ^ 第1圖係顯示散熱片1 〇的循環流路1 1之全體形狀。該 循環流路1 1，係在入口部lib和出口部1 lc(參照第2圖、第 5圖）之間進行循環，在硬焊片1 1 U，突出形成與流路凹部 Ha的兩端部（入口部1 lb、出口部1 lc)連通之入口突起（入 口孔）12和出口突起（出口孔）13。入口突起12和出口突起 200841163 (5) 13，係透過間隔件42而分別連通（嵌合）於壓電泵20之排出 口（孔）3 4和吸入口（孔）35。更詳細的說，如第7圖所示，在 間隔件42形成有中繼孔42a、42b，在該中繼孔42a、42 b 嵌合散熱片1〇(硬焊片10U)之入口突起12、出口突起13， ’ 與中繼孔42a、42b呈同軸突出之環狀突起42a’、42b’，係 嵌合於壓電泵20之排出口 34和吸入口 35。 在間隔件42，進一步設有與硬焊片10U之注液孔14連 φ 通之注液栓42c。也能將注液栓42c設置在其他部分，而 將間隔件42省略。亦即，可將散熱片10之入口突起12和出 口突起13直接嵌合於壓電泵20之排出口 34和吸入口 35。這 些嵌合部分之液密構造並未圖示。環狀突起42a’、42b’與 壓電泵2 0之排出口 3 4和吸入口 3 5的嵌合部，可透過Ο型 環來連接，這時可獲得更確實的密封性。 本發明之泵（壓電泵）20的構造並沒有特別的限定，在 此用第6圖及第7圖來說明實施形態的壓電泵20。該壓電泵 • 20，由下至上依序設有下殼體21和上殼體22。 在下殻體21，以與該殻體之板厚平面正交的方式穿設 有互相平行的上述排出口 34和吸入口 35。在下殼體21和上 " 殼體22之間，透過Ο型環29將壓電振動元件（隔膜）28挾持 • 支承成液密狀態，在該壓電振動元件2 8和下殼體2 1之間構 成泵室P。在壓電振動元件28和上殻體22之間形成大氣室 A 〇 壓電振動元件28，係具有中心部的薄片材（Shim)28a 、以及積層形成於薄片材28a的表裏其中一面（第7圖的上 -8- 200841163 (6) 面）之壓電體28b而構成之單壓電體型式。薄片材28a係面 向泵室P而和液體接觸。薄片材28a，係由導電性金屬薄 板材料，例如厚度50〜3 00 /zm左右之不銹鋼、42合金等 所形成之金屬製薄板所構成。壓電體28b，例如是由厚度 3 00 # m左右之PZT(Pb(Zr、Ti)03)所構成，在其表裏方向 實施極化處理。這種壓電振動元件屬周知者。 在下殼體2 1之排出口 34和吸入口 3 5，分別設有止回閥 φ (傘形閥）32、33。止回閥32，係容許流體從吸入口 35流向 泵室P但不容許與其逆向的流體流之吸入側止回閥；止回 閥3 3，係容許流體從泵室P流向排出口 3 4但不容許與其逆 向的流體流之排出側止回閥。 止回閥32、3 3係採用同一形態，是在接合固定於流路 之穿孔基板32a、33a上，裝設彈性材料構成之傘形閥32b 、3 3 b而成。這種止回閥（傘形閥）本身屬周知者。 以上的壓電泵20，當壓電振動元件28朝正反方向產生 φ 彈性變形（振動）時，在泵室P的容積擴大的行程，由於吸 入側止回閥32打開且排出側止回閥33關閉，故液體會從吸 入側35(散熱片10的出口突起13)流入泵室P內。另一方面 * ，在泵室P的容積縮小的行程，由於排出側止回閥3 3打開 -且吸入側止回閥32關閉，液體會從泵室P朝排出口 34(散 熱片10之入口突起12)流出。因此，藉由使壓電振動元件 28朝正反方向連續進行彈性變形（振動），可得到泵作用。 液體會從散熱片1 〇的循環流路1 1之入口部1 1 b流向出口部 1 1c。在第7圖’爲了說明方便係顯示在散熱片1〇上配置壓 200841163 (7) 電泵20的狀態，但實際上，散熱片10是位於上方’而在其 背面、亦即散熱片1 0之與電腦1 0 1的鍵盤1 02側相反側的面 上設置壓電泵20。 散熱片1 〇的表面’散熱器4 0 (蓋體4 1)之設置部分成爲 ， 受熱區，除了散熱器40(蓋體41)和間隔件42(壓電泵20)以 外的區域是成爲散熱區。散熱片10全體的面積設定成散熱 器4 0面積的1 〇倍以上（本實施形態爲約1 7倍）。位於散熱器 4 0下面的吸熱流路之循環流路1 1的合計流路長度係設定成 β ，比位於散熱區的散熱流路之循環流路1 1的合計流路長度 長非常多（1 〇倍以上，本實施形態爲約2 0倍）° 上述構成之本液冷系統單元100 ’係在散熱片10上裝 載散熱器40(CPU 1 04)和泵20，不須使用軟性管體即可形成 整體循環流路。 從壓電泵20之排出口 34(入口突起12、入口部Ub)流 出而返回吸入口 35(出口突起13、出口部11c)之本實施形 φ 態的循環流路11的流路’用第1圖之循環流路11內所賦予 的符號i f〜3 8 f而依其流動順序來作說明。從入口部1 1 b 在散熱直進流路1 f、2f直線前進之循環流路1 1，在散熱ϋ ， 字狀流路3 f呈U字狀折返’在散熱直進流路4f直線前進 . .後，進入散熱器40下面（吸熱區）而在吸熱U字狀流路5f折 返。通過該吸熱U字狀流路5 f時，藉由通過液體對散熱 器40(CPU104)的熱量進行一次吸熱。 接著，循環流路1 1，是從散熱器40的下面流出後，在 散熱直進流路6f直線前進後在散熱U字狀流路7f折返， -10- 200841163 (8) 並不是流入散熱器40正下方，而是在散熱U字狀流路9f 折返。接著在散熱直進流路1 Of直線前進後，在散熱直角 流路Ilf、12f向外繞，在散熱直進流路13f直線前進後， 在散熱U字狀流路1 4f折返。在此時點，尙未流入散熱器 40的正下方而是在散熱區往返流動。接著在散熱直進流路 - 15f直線前進，在散熱U字狀流路16折返，在散熱直進流 路17f直線前進後，到達散熱器40正下方之吸熱區。如此 φ 般，從吸熱U字狀流路5f連通到散熱區之散熱流路，在 再度返回散熱器40(吸熱區）之前，會在該散熱區進行複數 次往返，在這期間能將在散熱器40(CPU104)吸熱而昇溫之 液體予以充分冷卻。 到達吸熱區之循環流路11，在吸熱U字狀流路18f折 返而進行吸熱後，朝散熱區流出。流到散熱區後，在散熱 直進流路19f直線前進，在散熱U字狀流路20f折返，在 散熱直進流路2 1 f直線前進，在散熱U字狀流路22f折返 φ ，在散熱直進流路23f直線前進，在散熱U字狀流路24f 折返，然後在散熱直進流路25f直線前進。在此期間，完 全沒有流入散熱器40正下方之吸熱區。亦即，從吸熱U ' 字狀流路1 8f連通到散熱區之散熱流路，在再度返回散熱 * 器40(吸熱區）之前，會在該散熱區進行複數次往返。藉由 在散熱區進行複數次往返，同樣地，能將在散熱器 40(CPU104)吸熱而昇溫之液體予以充分冷卻。 在散熱直進流路25f直線前進之循環流路1 1，在吸熱 入口部26f再度流入散熱器40下方。從該吸熱入口部26f -11 - 200841163 (9) 經由分支流路27f連通到吸熱出口部28f之流路，係位於 散熱器40上的CPU 104正下方之主吸熱流路。該主吸熱流 路，係位於吸熱U字狀流路5f和18f之間。分支流路27f ，係將在吸熱入口部2 6f和出口部2 8 f之原爲1條的流路， ‘ 在CPU104正下方分支成複數條（合計流路面積加大）’能 .在CPU104下方使流速降低，而將CPU104的發熱予以高效 率地吸熱。 φ 離開散熱器40(CPU104)的正下方之循環流路1 1，係連 通至通過散熱片10的最外周之外周流路29f〜3 4f。通過 CPU 104正下方之昇溫至最高溫的液體，藉由通過散熱片 1 〇的最外周、亦即與外氣的溫度差更大的部分，能高效率 地進行冷卻。接著，在散熱U字狀流路34f向內側折返後 ，在散熱直進流路35f直線前進，在散熱U字狀流路36f 折返後，在散熱直進流路37f、3 8f直線前進，再返回吸入 口 35(出口突起13、出口部11c)。 φ 第9圖及第1 0圖係顯示散熱片1 0的循環流路1 1之其他 例。第9圖，係在硬焊片1 0U和1 0L之對向面分別用壓模 加工來形成流路凹部1 1 a。第1 0圖，係僅在一方的硬焊片 ’ 1 0L上形成同樣的流路凹部1 1 a的例子。 - 上述實施形態所示之循環流路1 1的態樣僅是一例，可 加以變更。又散熱片10上之散熱器40和泵20的位置也能變 更。 【圖式簡單說明】 -12- 200841163 (10) 第1圖係將本發明之液冷系統應用於筆記型個人電腦 (PC)的液冷系統之一實施形態之俯視圖。 第2圖係第1圖之局部放大俯視圖。 第3圖係第2圖之右側視圖。 第4圖係第3圖之IV-IV線截面圖。 _ 第5圖係第2圖之局部分解立體圖。 第6圖係第1圖之液冷系統中之壓電泵之俯視圖。 φ 第7圖係第6圖之VII-VII線之截面圖。 第8圖係將第1圖的液冷系統組裝於筆記型pC的狀態 之截面圖。 第9圖係顯示散熱片的其他流路構成例，係對應於第4 圖之截面圖。 第10圖係顯示散熱片的其他流路構成例，係對應於第 4圖之截面圖。 【主要元件符號說明】Preferably, the heat absorbing flow path is provided with a main heat absorbing flow path directly below the heat generating body and at least one heat absorbing U • word flow path adjacent to the main heat absorbing flow path. Further preferably, in the heat dissipating flow path that communicates from the endothermic U-shaped flow path to the heat dissipating area, before returning to the heat receiving area again, there is a plurality of reciprocating heat-dissipating flow paths in the heat dissipating area. The road can be formed in one at the entrance and exit portions, and branches into a plurality of strips directly under the heat source. In one aspect of the main heat absorbing flow path, after passing through the main heat absorbing flow path, it is connected to the outermost heat dissipation flow path which passes through the outermost periphery of the heat sink and returns to the above exit hole. The area of the heat sink, specifically, can be 10 times the area of the heat sink 200841163 (3) or more. Actually, the inlet hole and the outlet hole of the circulation flow path are formed on the heat sink by a cylindrical protrusion; the discharge port and the suction port of the pump are connected to the discharge flow path hole and the communication of the cylindrical protrusion of the inlet hole. The suction port hole in the outlet hole. When the pump is a piezoelectric pump, it can be made thinner and thinner. A spacer block may be held between the pump and the heat sink, and a water injection hole that follows the φ loop flow path is formed in the spacer block. The liquid cooling system of the present invention is suitable for cooling a CPU of a notebook computer. In one aspect, the entire liquid cooling system can be housed inside a body having a keyboard. At this time, if the heat sink of the liquid cooling system is placed along the surface of the keyboard, heat dissipation can be improved. In the liquid cooling system of the present invention, the pump, the heat sink, and the heat source are all loaded on the heat sink, and thus have high unit characteristics. The circulating flow path in the heat sink includes: an endothermic flow path located below the heat sink (the heat absorption area) and a heat dissipation flow path of the Φ located in the heat dissipation area, and the flow path length of the heat dissipation flow path is longer than the flow path length of the heat absorption flow path. Very much, so you can get effective heat dissipation and a more even heat distribution. [Embodiment] Fig. 1 is a plan view showing the entire embodiment of a liquid cooling system unit 100 of the present invention. The liquid cooling system unit 1 is housed in the main body portion 103 of the notebook computer 101 having the keyboard 102 as shown in Fig. 8 for cooling the CPU 104 of the heat source. The liquid cooling system unit 200841163 (4) 100 of the present embodiment is completely independent of the LCD (display unit) 1〇5 that can be opened and closed with respect to the main body unit 103. The liquid cooling system unit 1 〇〇, as shown in FIGS. 2 to 4, has a heat sink 10, a piezoelectric pump 20 mounted on the heat sink 10, and heat dissipation composed of a heat-transfer metal material. 40. The CPU 104 - is loaded on the heat sink 40. The cover 41 is located on the CPU 104 (the CPU 104 is held by the heat sink 40 and the cover 41), and a spacer 42 is provided between the heat sink 10 and the piezoelectric pump 20. The pressure φ electric pump 20, the heat sink 40, and the CPU 104 are provided on the back surface of the heat sink 10 (on the back side of the keyboard 102), but for convenience of illustration, in the first, second, and fifth figures, The state in which the liquid cooling system is 1 观察 is observed from the back side. The heat sink 1 is composed of a pair of heat transfer metal plates (hard plates) 10 0 and 10 L which are superposed on each other, and is formed on one of the brazing pieces 10 L to form a circulation flow path 1 1 The flow path recess 1 1 a. The depth of the flow path concave portion 1 1 a is, for example, about 0.2 mm. As is well known, the brazing sheet is formed by attaching a consumable material to the surface of a core material composed of a metal material (generally an aluminum alloy), and forming a flow path concave portion 1 1 a by pressing and adding a φ, and a pair of them are formed. After the connection, heating is performed under pressure to melt the welding materials and join each other. The general brazing sheet l〇U (10 L) has a thickness of about 0.4 mm, and the material and thickness of the heat sink 10 (hard soldering sheet) of the present invention are not particularly limited. ^ Fig. 1 shows the overall shape of the circulation path 1 1 of the fin 1 。. The circulation flow path 161 is circulated between the inlet portion lib and the outlet portion 1 lc (see FIGS. 2 and 5), and is formed at both ends of the flow path concave portion Ha at the brazing sheet 1 1 U. The inlet portion (inlet hole) 12 and the outlet protrusion (outlet hole) 13 communicate with each other (the inlet portion 1 lb and the outlet portion 1 lc). The inlet projection 12 and the outlet projection 200841163 (5) 13 are respectively communicated (fitted) through the spacer 42 to the discharge port (hole) 34 and the suction port (hole) 35 of the piezoelectric pump 20. More specifically, as shown in Fig. 7, the spacers 42 are formed with the relay holes 42a and 42b, and the entrance protrusions 12 of the heat sink 1 (hardness piece 10U) are fitted to the relay holes 42a and 42b. The outlet projections 13, 'the annular projections 42a' and 42b' projecting coaxially with the relay holes 42a and 42b are fitted to the discharge port 34 of the piezoelectric pump 20 and the suction port 35. The spacer 42 is further provided with a liquid injection plug 42c which is connected to the liquid injection hole 14 of the brazing sheet 10U. It is also possible to arrange the liquid injection plug 42c in other portions, and the spacer 42 is omitted. That is, the inlet projection 12 and the outlet projection 13 of the fin 10 can be directly fitted to the discharge port 34 and the suction port 35 of the piezoelectric pump 20. The liquid-tight structure of these fitting portions is not shown. The fitting portions of the annular projections 42a' and 42b' and the discharge port 34 of the piezoelectric pump 20 and the suction port 35 can be connected through the Ο-shaped ring, and a more reliable sealing property can be obtained. The structure of the pump (piezoelectric pump) 20 of the present invention is not particularly limited, and the piezoelectric pump 20 of the embodiment will be described with reference to Figs. 6 and 7 . The piezoelectric pump 20 is provided with a lower casing 21 and an upper casing 22 in this order from bottom to top. In the lower casing 21, the discharge ports 34 and the suction ports 35 which are parallel to each other are bored so as to be orthogonal to the plane of the plate thickness of the casing. Between the lower casing 21 and the upper casing 22, the piezoelectric vibration element (separator) 28 is held in a liquid-tight state through the Ο-ring 29, and the piezoelectric vibration element 28 and the lower casing 2 1 are held. The pump chamber P is formed between. An air chamber A 〇 piezoelectric vibration element 28 is formed between the piezoelectric vibration element 28 and the upper casing 22, and is a sheet material (Shim) 28a having a center portion, and a laminated layer formed on one side of the sheet 28a (7th) A single piezoelectric type formed by the piezoelectric body 28b of the upper-8-200841163 (6) surface. The sheet material 28a is in contact with the liquid in the pump chamber P. The sheet material 28a is made of a metal thin plate made of a conductive metal sheet material, for example, stainless steel having a thickness of about 50 to 300 m/zm, or a 42 alloy. The piezoelectric body 28b is made of, for example, PZT (Pb(Zr, Ti)03) having a thickness of about 300 m, and is subjected to polarization treatment in the front and back directions. Such piezoelectric vibration elements are well known. A check valve φ (umbrella valve) 32, 33 is provided at the discharge port 34 and the suction port 35 of the lower casing 2, respectively. The check valve 32 is a suction side check valve that allows fluid to flow from the suction port 35 to the pump chamber P but does not allow reverse flow of the fluid; the check valve 33 allows fluid to flow from the pump chamber P to the discharge port 34. The discharge side check valve of the fluid flow opposite thereto is not allowed. In the same manner, the check valves 32 and 3 are formed by attaching the umbrella valves 32b and 3 3 b made of an elastic material to the perforated substrates 32a and 33a fixed to the flow path. Such a check valve (umbrella valve) is known per se. In the piezoelectric pump 20 described above, when the piezoelectric vibration element 28 is elastically deformed (vibrated) in the forward and reverse directions, the stroke of the pump chamber P is expanded, and the suction side check valve 32 is opened and the discharge side check valve is opened. 33 is closed, so that liquid flows into the pump chamber P from the suction side 35 (the outlet protrusion 13 of the fin 10). On the other hand, in the stroke in which the volume of the pump chamber P is reduced, since the discharge side check valve 3 is opened - and the suction side check valve 32 is closed, the liquid is directed from the pump chamber P toward the discharge port 34 (the inlet of the heat sink 10) The protrusion 12) flows out. Therefore, the pumping action can be obtained by continuously deforming (vibrating) the piezoelectric vibration element 28 in the forward and reverse directions. The liquid flows from the inlet portion 1 1 b of the circulation passage 1 1 of the fin 1 to the outlet portion 1 1c. In the seventh drawing, the state of the electric pump 20 is placed on the heat sink 1 为了 for the convenience of explanation, but in reality, the heat sink 10 is located above and on the back side, that is, the heat sink 10 The piezoelectric pump 20 is provided on the surface opposite to the side of the keyboard 102 of the computer 101. The surface of the heat sink 1 'the surface of the heat sink 40 (the cover body 4 1) becomes a heat receiving area, and the area other than the heat sink 40 (the cover body 41) and the spacer 42 (piezoelectric pump 20) becomes heat dissipation. Area. The area of the entire heat sink 10 is set to be 1 〇 or more of the area of the radiator 40 (about 17 times in the present embodiment). The total flow path length of the circulation flow path 1 1 of the heat absorption flow path located below the radiator 40 is set to β, which is much longer than the total flow path length of the circulation flow path 1 1 of the heat dissipation flow path located in the heat dissipation zone (1) 〇 times or more, this embodiment is about 20 times). The liquid cooling system unit 100' having the above configuration is provided with a heat sink 40 (CPU 104) and a pump 20 on the heat sink 10, and it is not necessary to use a flexible tube. An integral circulation flow path can be formed. The flow path of the circulation flow path 11 of the present embodiment in the form of the φ state which flows out from the discharge port 34 of the piezoelectric pump 20 (the inlet projection 12 and the inlet portion Ub) and returns to the suction port 35 (the outlet projection 13 and the outlet portion 11c) The symbols if~3 8 f given in the circulation flow path 11 of Fig. 1 are described in terms of their flow order. The circulation flow path 1 1 that linearly advances from the inlet portion 1 1 b in the heat-radiating straight-in flow paths 1 f and 2 f is cooled in the heat-dissipating manner, and the word-shaped flow path 3 f is folded in a U-shape to advance linearly in the heat-dissipating straight flow path 4f. Thereafter, it enters the lower surface of the heat sink 40 (the heat absorbing area) and is folded back in the heat absorbing U-shaped flow path 5f. When the U-shaped U-shaped flow path 5f is passed through, the heat of the heat sink 40 (CPU 104) is absorbed by the liquid once. Then, the circulation flow path 1 1 flows out from the lower surface of the heat sink 40, and then linearly advances in the heat dissipation straight flow path 6f, and then folds back in the heat dissipation U-shaped flow path 7f, -10- 200841163 (8) is not flowing into the heat sink 40 Just below, it is folded back in the heat-dissipating U-shaped flow path 9f. Then, after the straight line of the heat-dissipating straight flow path 1 Of is linearly advanced, the heat-dissipating right-angle flow paths 11f and 12f are wound outward, and after the straight-line heat-producing flow path 13f is linearly advanced, the heat-dissipating U-shaped flow path 14f is folded back. At this point, the crucible does not flow directly under the radiator 40 but flows back and forth in the heat dissipation zone. Then, the heat-dissipating straight flow path - 15f advances linearly, and the heat-dissipating U-shaped flow path 16 is folded back, and the heat-radiating straight flow path 17f linearly advances to reach the heat absorbing zone directly below the heat sink 40. In this way, the heat-dissipating flow path from the heat-absorbing U-shaped flow path 5f to the heat-dissipating area is subjected to a plurality of round trips in the heat-dissipating area before returning to the heat sink 40 (heat-absorbing area) again, during which heat dissipation can be performed. The liquid that is heated by the heat sink 40 (CPU 104) is sufficiently cooled. The circulation flow path 11 that has reached the endothermic area is folded in the endothermic U-shaped flow path 18f to absorb heat, and then flows out toward the heat dissipation area. After flowing to the heat dissipation zone, the heat dissipation straight flow path 19f linearly advances, and the heat dissipation U-shaped flow path 20f is folded back, and the heat dissipation straight flow path 2 1 f linearly advances, and the heat dissipation U-shaped flow path 22f is folded back to φ, and the heat dissipation is straight forward. The flow path 23f advances linearly, is folded back in the heat radiating U-shaped flow path 24f, and then linearly advances in the heat radiating straight flow path 25f. During this time, there is absolutely no heat absorption zone flowing directly under the radiator 40. That is, the heat-dissipating flow path that communicates from the heat-absorbing U'-shaped flow path 1 8f to the heat-dissipating area is subjected to a plurality of round trips in the heat-dissipating area before returning to the heat-dissipating unit 40 (the heat absorbing area). By repeating a plurality of round trips in the heat radiating zone, the liquid which is heated by the heat sink 40 (CPU 104) and heated up can be sufficiently cooled. The circulation flow path 1 1 that linearly advances in the cooling straight flow path 25f flows into the lower portion of the heat sink 40 again at the heat absorption inlet portion 26f. The flow path that communicates from the heat absorption inlet portion 26f -11 - 200841163 (9) to the heat absorption outlet portion 28f via the branch flow path 27f is a main heat absorption flow path directly below the CPU 104 on the heat sink 40. The main endothermic flow path is located between the endothermic U-shaped flow paths 5f and 18f. The branch flow path 27f is a flow path that is originally one of the heat absorption inlet portion 26f and the outlet portion 28f, and is branched into a plurality of pieces (the total flow path area is increased) directly under the CPU 104. In the CPU 104 The flow rate is lowered below, and the heat generation of the CPU 104 is efficiently absorbed. The circulation flow path 161 which is located immediately below the radiator 40 (CPU 104) is connected to the outer peripheral peripheral flow paths 29f to 34f passing through the outermost periphery of the fins 10. The liquid heated to the highest temperature immediately below the CPU 104 can be efficiently cooled by passing through the outermost circumference of the fin 1 , that is, the portion having a larger temperature difference from the outside air. Then, after the heat-dissipating U-shaped flow path 34f is folded inward, the heat-dissipating straight flow path 35f advances linearly, and after the heat-dissipating U-shaped flow path 36f is folded back, the heat-dissipating straight-flow passages 37f and 38f are linearly advanced, and then returned to the suction. Port 35 (outlet projection 13, outlet portion 11c). φ Fig. 9 and Fig. 1 show other examples of the circulation flow path 1 1 of the fin 10 . In Fig. 9, the flow path concave portion 1 1 a is formed by press working on the opposing faces of the hard pads 10U and 10L, respectively. Fig. 10 shows an example in which the same flow path concave portion 1 1 a is formed only on one of the brazing sheets '10L. - The aspect of the circulation flow path 1 1 shown in the above embodiment is merely an example and can be changed. Also, the positions of the heat sink 40 and the pump 20 on the heat sink 10 can be changed. BRIEF DESCRIPTION OF THE DRAWINGS -12- 200841163 (10) Fig. 1 is a plan view showing an embodiment of a liquid cooling system of the present invention applied to a liquid cooling system of a notebook personal computer (PC). Fig. 2 is a partially enlarged plan view of Fig. 1. Figure 3 is a right side view of Figure 2. Fig. 4 is a sectional view taken along line IV-IV of Fig. 3. _ Fig. 5 is a partially exploded perspective view of Fig. 2. Figure 6 is a plan view of the piezoelectric pump in the liquid cooling system of Figure 1. φ Fig. 7 is a cross-sectional view taken along line VII-VII of Fig. 6. Fig. 8 is a cross-sectional view showing a state in which the liquid cooling system of Fig. 1 is assembled to a notebook type pC. Fig. 9 is a cross-sectional view showing the other flow path configuration of the heat sink, corresponding to Fig. 4. Fig. 10 is a view showing another configuration of the flow path of the heat sink, which corresponds to the sectional view of Fig. 4. [Main component symbol description]
If、 2f、 4f、 6f、 8f、 10f、 13f、 15f、 17f、 19f、 21f、 23f' 25f、35f、37f、38f:散熱直進流路 3f、7f、9f、14f、16f、20f、22f、24f、36f ：散熱 U 字 狀流路 5f :吸熱U字狀流路 i 〇 _·散熱片 l〇L、10U :硬焊片 11 :循環流路 -13- 200841163 (11) 1 1 a :流路凹部 1 lb :入口部 1 lc :出口部 1 If、12f :散熱直角流路 • 12 :入口突起 . 13 :出口突起 1 4 :注液孔 φ 18f :吸熱U字狀流路 21 :下殼體 22 :上殼體 26f :吸熱入口部 27f :分支流路 2 8 :壓電振動元件 2 8 a :薄片材 28b :壓電體 φ 28f :吸熱出口部 2 9 : Ο型環 29f〜34f :外周流路 • 3 2、3 3 :止回閥 ' 32a、3 3a :穿孔基板 3 2b、3 3b：傘形閥 3 4 :排出口 3 5 :吸入口 4〇 :散熱器 -14- 200841163 (12) 41 :蓋體 42 :間隔件 42a、42b :中繼孔 42a’、42b’ ：環狀突起 5 42c :注液栓 . 100 :液冷系統單元 1 〇 1 :筆記型電腦 φ 102 :鍵盤 103 :本體部If, 2f, 4f, 6f, 8f, 10f, 13f, 15f, 17f, 19f, 21f, 23f' 25f, 35f, 37f, 38f: heat dissipation straight flow paths 3f, 7f, 9f, 14f, 16f, 20f, 22f, 24f, 36f: heat-dissipating U-shaped flow path 5f: heat-absorbing U-shaped flow path i 〇_·heat sink l〇L, 10U: hard-weld piece 11: circulation flow path-13- 200841163 (11) 1 1 a : flow Road recess 1 lb : inlet portion 1 lc : outlet portion 1 If, 12f : heat dissipation right angle flow path • 12 : inlet protrusion. 13 : outlet protrusion 1 4 : liquid injection hole φ 18f : heat absorption U-shaped flow path 21 : lower case Body 22: upper casing 26f: heat absorption inlet portion 27f: branch flow path 2 8 : piezoelectric vibration element 2 8 a : sheet material 28b: piezoelectric body φ 28f : heat absorption outlet portion 2 9 : Ο type ring 29f to 34f: Peripheral flow path • 3 2, 3 3 : Check valve ' 32a, 3 3a : perforated substrate 3 2b, 3 3b: umbrella valve 3 4 : discharge port 3 5 : suction port 4〇: radiator-14- 200841163 ( 12) 41: cover 42: spacers 42a, 42b: relay holes 42a', 42b': annular projection 5 42c: liquid injection plug. 100: liquid cooling system unit 1 〇1: notebook computer φ 102: keyboard 103: body part
104 ： CPU 105 : LCD(顯示部） A :大氣室 P :泵室104 : CPU 105 : LCD (display section) A : Atmospheric chamber P : Pump room
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