200840440 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種印刷電路板之組件固定方法，且 特別是有關於一種雙面印刷電路板之組件固定方法。 【先前技術】 可攜式產品朝向輕薄短小、數位化、多功能整合發展 已是毋庸置疑的三大趨勢，隨著多元化可攜式產品發展， # 這些裝置往往也愈來愈耗電，更需要高度整合的電源管理 解決方案，以便儘可能在最小的印刷電路板（PCB )面積 中，滿足最長電池壽命的設計要求，也成為未來半導體廠 商爭相競逐的主戰場。而在輕薄短小的殘酷競爭中，印刷 電路板（PCB : printed circuit board )的面積使用遂成為各 個零組件彼此爭相角逐的舞台。 印刷電路板在線路設計、CAD/CAM '製程技術以及 基材板上的變革，主要是受到電子系統產品設計面的變化 _ 所致。此外，組裝元件的構裝技術，其進展亦是促使電路 — 板產生變革的最大推動力，PCB市場技術動態如圖一所 V 示。為能符合來自下游應用產品的要求，印刷電路板產業 在技術層次的提昇上，不得不加緊腳步朝輕薄短小、高密 度、低價格化的方向進展。 隨著可攜性電子產品需求日增，PCB廠商為滿足下游 應用產品對輕薄短小、高功能、高密度、高可靠性、低成 本的需求，因此HDI增層板、構裝載板' TAB、C0F、被 200840440 動元件埋入式基板、光迴路基板及環保基板等具高技術與 高附加價值的電路板產品因應而生。為能在最小尺寸的印 刷電路板上發揮最大的可用面積，同時使科刷電路板的 兩面成為一不得不的選擇。 然而，在將例如晶片、連接器等組件以錫膏、銀膏等 桿料蟬接於印刷祕板㈣—面後，在進行印刷電路板第 二面焊接工程時，熱製程將會使第一面的焊料熔融，進而 鬆動組件與印刷電路板間的目著。較輕微麻況是在組件 與㈣電路板間產生缝隙，熔融的焊料會鑽人缝隙而使組 件斤置於印刷電路板之上，或是使針腳間短路，嚴重的情 =下會使組件脫離印刷電路板。不論是發生冑者狀況，均 而進-步去純此祕，而修復的過程巾辭無法避免部 分印刷電路板的損壞。這進而造成良率的下降及成本的增 加0 【發明.内容】 因此本發明提供一種雙面印刷電路板之組件固定方 法，可以避免雙面印刷電路板於第二面進行熱製程時不僅 不影響印刷電路板第-面已完工的焊接製程，甚至能更進 -步產生額外的固著機制，將焊接於印刷電路板第一面的 組件更進一步的固著。、 根據本發明所提出印刷電路板之組件固定方法，該方 法至少包含：係將組相錫膏料在印刷電路板的第一面 上後，在印刷f路板及組㈣點塗上物， 200840440 熱固性塑膠前驅物至少附著於組件的侧面及緊鄰的印刷電 路板的第一面上。當在印刷電路板的第二面進行熱製程 時’熱固性塑膠前驅物會受熱而聚合成熱固性塑膠以固著 組件於印刷電路板之上。 在本發明中所使用的熱固性塑膠例如可為酚甲醛樹 酯、尿素樹酯、環氧樹酯、矽酯、三聚氰氨、聚醯胺等等， 或疋珀述之熱固性塑膠的任意組合。而熱固性塑膠前驅物 可以為溶解於有機溶劑中的單體、預聚物或聚合物，在印 刷電路板第二面的熱製程，例如焊接製程時，熱固性塑膠 前驅物中的單體或是預聚物聚合或是聚合物固化而形成熱 固性塑膠，進而進一步固著組件於印刷電路板的第一面之 上。 在本發明中所採用的熱固性塑膠並不受限制，唯一必 須注意的是在於熱固性塑膠前驅物中的單體、預聚物或聚 合物的聚合溫度或固化溫度需低於第一面焊接點所使用的 焊料的熔融溫度，熱固性塑膠前驅物中的單體、預聚物或 聚合物在焊料熔融之前已先聚合或固化，進而固著組件於 印刷電路板的第-面之上。即令焊料產生溶融的現象，亦 無法使組件與印刷電路板間的固著鬆動，進而避免了習知 組件因與印刷電路板鬆脫而產生的問題。 、本發明提供一種組件固著於印刷電路板之上之結構， 包括：一印刷電路板；一焊料層位於印刷電路板的焊墊上； 汲件，固著於焊料層上；以及一熱固性塑膠層，至少黏 著於組件的側壁及相鄰印刷電路板的表面上，其中熱固性 200840440 塑膠層固著組件於印刷電路板的表面上。 【實施方式】200840440 IX. Description of the Invention: [Technical Field] The present invention relates to a method of fixing a component of a printed circuit board, and more particularly to a method of fixing a component of a double-sided printed circuit board. [Prior Art] The development of portable products towards light, short, digital, and multi-functional integration is undoubtedly the three major trends. With the development of diversified portable products, # these devices are often more and more power-hungry. A highly integrated power management solution is required to meet the design requirements of the longest battery life in the smallest printed circuit board (PCB) area possible, and it is also the main battleground for future semiconductor manufacturers competing for competition. In the light and short cruel competition, the area of printed circuit board (PCB) is used as a stage for each component to compete with each other. The changes in printed circuit boards in circuit design, CAD/CAM 'process technology, and substrate boards are mainly due to changes in the design of electronic system products. In addition, the advancement of the assembly technology of the assembled components is also the biggest driving force for the transformation of the circuit board. The technical development of the PCB market is shown in Figure 1. In order to meet the requirements of products from downstream applications, the printed circuit board industry has to step up its efforts in the direction of light, thin, high density and low price. With the increasing demand for portable electronic products, PCB manufacturers are meeting the needs of downstream applications for light, thin, high-performance, high-density, high-reliability, and low-cost. Therefore, HDI build-up boards and load-carrying boards 'TAB, C0F It is produced by high-tech and high-value-added circuit board products such as 200840440 mobile component embedded substrate, optical circuit substrate and environmental protection substrate. In order to maximize the available area on the smallest printed circuit board, both sides of the board are an option. However, after the components such as wafers, connectors, etc. are soldered to the printing secret board (four)-face by solder paste, silver paste, etc., the thermal process will make the first process when performing the second surface soldering process of the printed circuit board. The solder on the surface melts, which in turn loosens the component and the printed circuit board. The slighter condition is that there is a gap between the component and the (4) circuit board. The molten solder will drill the gap and place the component on the printed circuit board, or short-circuit the pins. In severe cases, the component will be separated. A printed circuit board. Regardless of the situation of the leader, the process is pure and secret, and the repair process can not avoid the damage of some printed circuit boards. This in turn causes a decrease in yield and an increase in cost. [Invention. Content] Therefore, the present invention provides a method for fixing a component of a double-sided printed circuit board, which can prevent the double-sided printed circuit board from not affecting the hot process on the second side. The first-to-be-finished soldering process of the printed circuit board can even further create an additional fixing mechanism to further secure the components soldered to the first side of the printed circuit board. According to the method for fixing a component of a printed circuit board according to the present invention, the method comprises the following steps: after the phase solder paste is applied to the first side of the printed circuit board, the printed material of the printed circuit board and the group (4) are applied. 200840440 A thermoset plastic precursor is attached to at least the side of the component and the first side of the adjacent printed circuit board. When the thermal process is performed on the second side of the printed circuit board, the thermoset plastic precursor is heated to polymerize into a thermoset plastic to secure the component over the printed circuit board. The thermosetting plastic used in the present invention may be, for example, phenol formaldehyde resin, urea resin, epoxy resin, decyl ester, melamine, polyamide, or the like, or any combination of thermosetting plastics. . The thermosetting plastic precursor may be a monomer, a prepolymer or a polymer dissolved in an organic solvent, or a monomer in the thermosetting plastic precursor or a preheating process in a thermal process on the second side of the printed circuit board, such as a soldering process. Polymer polymerization or polymer curing forms a thermoset plastic that further secures the component over the first side of the printed circuit board. The thermosetting plastic used in the present invention is not limited, and the only thing to be noted is that the polymerization temperature or curing temperature of the monomer, prepolymer or polymer in the thermosetting plastic precursor is lower than that of the first surface solder joint. The melting temperature of the solder used, the monomer, prepolymer or polymer in the thermoset plastic precursor is polymerized or cured prior to solder melting, thereby fixing the component on the first side of the printed circuit board. Even if the solder is melted, the fixing between the component and the printed circuit board cannot be loosened, thereby avoiding the problem that the conventional component is loosened from the printed circuit board. The present invention provides a structure in which an assembly is fixed on a printed circuit board, comprising: a printed circuit board; a solder layer on the solder pad of the printed circuit board; a solder member fixed on the solder layer; and a thermosetting plastic layer , at least adhered to the side wall of the component and the surface of the adjacent printed circuit board, wherein the thermosetting 200840440 plastic layer is fixed on the surface of the printed circuit board. [Embodiment]
為了能使本發明的特徵更為清楚，以下將揭露本發明 各種實施例，例如各種特徵的實施方式，而所描述的特定 元件與女排僅為簡化本案說明，然其並非用以限定本發 月另外’本案會於各種實施例中重複使用參考標號與文 字，重複的目的在於簡化與清楚說明，並非用以指定各種 實施例及/或所述架構之間的關係。 請參照第1圖，第丨圖其係繪示依照本發明一第一較 佳實施例的一部分立體示意圖。如第J圖所示，印刷電路 板100上具有焊墊102,焊料層1〇4位於焊墊1〇2之上。一 組件106的針腳108藉由焊料層1〇4固著於印刷電路板ι〇〇 之上。熱固性塑膠層110位於組件1〇6的側壁购及緊鄰 之印刷電路板10G的表面1G()a上，熱固性塑膠層削可加 強組件⑽與印刷電路板1⑽間的固著。組件1()6可以為 μ片連接為 '被動元件等等。焊料層1〇4係可以例如錫 '印刷機印刷於焊墊102之上。熱固性塑膠層可將熱 固性塑膠的單體或預聚物以例如點膠機點在組件〗⑽的側 壁l〇6a及印刷電路板1〇〇的表面1〇如之間，在印刷電路 板1〇〇的表® l_a的對側面（未繪示）進行熱製程，例如 焊接製程時，熱固性塑膠的單體、預聚物或聚合物會聚合 或固化而形成熱固性塑膠層11G以固著組件1(>6於印刷電 板100的表面l〇〇a上。當然，熱固性塑膠的單體、預聚 200840440 物或聚合物的聚合溫度或固化溫度會低於焊料層104的炼 融溫度，以在焊料層104熔融之前先行聚合以固著組件1〇6 於印刷電路板1〇〇表面l〇〇a上而避免當焊料層1〇4溶融時 使組件106自印刷電路板1〇〇表面1〇〇a上鬆脫而產生浮置 的現象，或是脫開，甚至產生脫落的現象。在本實施例中 所使用的熱固性塑膠的單體、預聚物或聚合物為紅膠，紅 膠的主要内含物為環氧樹酯，其熱固化的溫度約高於攝氏 瞻 100度’ 一般约是攝氏150度加熱90秒至120秒，在本實 轭例中則為攝氏18 〇度，以縮短紅膠固化所需的時間。據 此，紅膠的固化溫度遠低於錫膏的熔融溫度攝氏25〇度。 第2圖係繪示本發明一實施例之剖面示意圖。如第2 圖所示，印刷電路板200具有一上表面2〇〇a及一下表面 200b。組件206藉由焊料（未繪示）電性連結於印刷電路 板200上表面200a的焊墊（未繪示）上。熱固性塑膠層21〇 可如第1圖所示位於組件2〇6的側壁2〇仏及緊鄰之印刷電 _ 路板200的上表面2〇〇公上，亦或可如第2圖右侧所示，熱 □ f生塑膠層m不僅位於組件2〇6的侧壁2〇如及緊鄰之印 刷電路板2GG的上表面·^，亦覆蓋組件鳩的部分上 表面2〇6b，進而可加強組件2〇6固著於印刷電路板2〇〇的 上表面200a上的強度。 熱固14塑膠層21〇或212的形成方法將熱固性塑膠的 單體或預聚物以例如點膝機點在如第2圖所示熱固性塑膠 層210或212的位置，當在印刷電路板雇的下表面2〇的 上進行熱製程，例如以—坪接製程將組件2〇6，固著於印刷 200840440 電路板200的下表面200b時，位於印刷電路板2〇〇的上表 面200a的熱固性塑膠的單體或預聚物會聚合而形成熱固性 塑膠層210或212以固著組件2〇6於印刷電路板1〇〇的上 矛面上‘然，熱固性塑膠的單體或預聚物的聚合溫 度亦如前一實施例所述會低於焊料層的熔融溫度。In order to make the features of the present invention clearer, various embodiments of the present invention, such as various features, are described below, and the specific elements and women's volleyballs described are merely illustrative of the present invention, but are not intended to limit the present invention. In addition, the reference numerals and characters are repeatedly used in the various embodiments, and the repetitive purpose is to simplify and clearly explain the various embodiments and/or the relationship between the structures. Referring to Figure 1, there is shown a partial perspective view of a first preferred embodiment of the present invention. As shown in Fig. J, the printed circuit board 100 has a pad 102 thereon, and the solder layer 1〇4 is placed over the pad 1〇2. The pins 108 of a component 106 are secured to the printed circuit board by solder layer 1〇4. The thermosetting plastic layer 110 is located on the surface 1G()a of the printed circuit board 10G adjacent to the side wall of the component 1〇6, and the thermosetting plastic layer is used to strengthen the fixing between the component (10) and the printed circuit board 1 (10). Component 1 () 6 can be connected as a 'passive component' or so on. The solder layer 1 4 can be printed on the pad 102, for example, by a tin 'printer. The thermosetting plastic layer can be used to place the monomer or prepolymer of the thermosetting plastic between the side wall l〇6a of the component (10) and the surface of the printed circuit board 1〇〇, for example, on the printed circuit board. The surface of the crucible® l_a is thermally processed on the side (not shown). For example, in the soldering process, the monomer, prepolymer or polymer of the thermosetting plastic is polymerized or cured to form the thermosetting plastic layer 11G to fix the assembly 1 ( >6 on the surface 10a of the printed circuit board 100. Of course, the polymerization temperature or curing temperature of the monomer of the thermosetting plastic, the prepolymerized 200840440 or the polymer may be lower than the melting temperature of the solder layer 104 to Before the solder layer 104 is melted, it is first polymerized to fix the component 1〇6 on the surface 1〇〇a of the printed circuit board to avoid the component 106 from the surface of the printed circuit board 1 when the solder layer 1〇4 is melted. 〇a is loosened to cause floating phenomenon, or is disengaged or even peeled off. The monomer, prepolymer or polymer of the thermosetting plastic used in this embodiment is red plastic, red plastic The main inclusion is epoxy resin, the temperature of its heat curing Above 100 degrees Celsius' is generally about 150 degrees Celsius for 90 seconds to 120 seconds, and in the actual yoke case, it is 18 degrees Celsius to shorten the time required for the red glue to cure. According to this, the red glue is cured. The temperature is much lower than the melting temperature of the solder paste by 25 degrees Celsius. Fig. 2 is a schematic cross-sectional view showing an embodiment of the present invention. As shown in Fig. 2, the printed circuit board 200 has an upper surface 2〇〇a and a lower surface. The surface of the component 200b is electrically connected to the pad (not shown) of the upper surface 200a of the printed circuit board 200 by solder (not shown). The thermosetting plastic layer 21 can be located in the component 2 as shown in FIG. The side wall 2 of 6 and the adjacent printed circuit _ the upper surface 2 of the road board 200 is 〇〇 or, as shown on the right side of Fig. 2, the hot plastic layer m is not only located in the assembly 2〇6 The side wall 2, for example, and the upper surface of the printed circuit board 2GG, also covers a portion of the upper surface 2〇6b of the component ,, and the reinforced component 2〇6 is fixed to the upper surface 200a of the printed circuit board 2〇〇. The strength of the thermosetting 14 plastic layer 21 or 212 is formed by using a thermosetting plastic monomer or prepolymer. If the knee-tapping machine is positioned at the position of the thermosetting plastic layer 210 or 212 as shown in FIG. 2, when the thermal processing is performed on the lower surface of the printed circuit board, for example, the assembly 2〇6 is performed by the ping process. When the lower surface 200b of the printed circuit board 200 is fixed, the thermosetting plastic monomer or prepolymer located on the upper surface 200a of the printed circuit board 2 is polymerized to form a thermosetting plastic layer 210 or 212 to fix the assembly 2 The coating temperature of the monomer or prepolymer of the thermosetting plastic is also lower than the melting temperature of the solder layer as described in the previous embodiment.
在第1圖中所示之針腳108僅係為描述組件106如何 與印刷電路板1GG上焊墊1(>2電性連接，並㈣來限制本 I明’舉凡組件中適用於以表面黏著技術（如也⑶施耐The pin 108 shown in FIG. 1 is only for describing how the component 106 is electrically connected to the pad 1 on the printed circuit board 1GG (>2, and (4) to limit the present invention. Technology (such as also (3) Shi Nai
Technology，SMT) t ^ ^ ^ 本發明所提供之方法與結構於印刷電路板的背面進行熱製 程時，避免已於印刷電路板的正面固著之組件受到影響。 另外’在第1圖及第2圖中所示之熱固性塑膠層11〇、21〇 或212’可以為至少一點的固著或數點的固著，當然亦可以 為線开^的固著’亦即沿著組件與印刷電路板的接合線塗佈 :段或數段熱目性塑膠的單體或㈣物，以在後續熱製程 時形成熱固性塑膠層以固著組件與印刷電路板。 雖然本發明已峰佳實_«如上，然其並非用r 限Ϊ本發明，任何熟習此技藝者，在不脫離本發明之精矛 ί軛圍内’當可作各種之更動與潤飾，因此本發明之保f 範圍當視後附之中請專利範圍所界定者為準。 j 【圖式簡單說明】 特徵、優點與實施例 如下： 為讓本發明之上述和其他目的、 能更明顯易个董，所附圖式之詳細說明 200840440 第1圖其係繪示依照本發明一第一較佳實施例的一部 分立體示意圖。 第2圖係繪示本發明一實施例之剖面示意圖。 【主要元件符號說明】 100、200 :印刷電路板Technology, SMT) t ^ ^ ^ The method and structure provided by the present invention avoids the effects of components that have been fixed on the front side of the printed circuit board during thermal processing on the back side of the printed circuit board. In addition, the thermosetting plastic layer 11〇, 21〇 or 212' shown in Figs. 1 and 2 may be at least one point of fixation or a few points of fixation, and of course may be a line fixation. That is, a single or a plurality of segments of heat-sensitive plastic or (four) are applied along the bonding wires of the component and the printed circuit board to form a thermosetting plastic layer to fix the component and the printed circuit board during the subsequent thermal process. Although the present invention has been described above, it is not limited to the present invention, and anyone skilled in the art can make various changes and retouchings without departing from the fine yoke of the present invention. The scope of the present invention is defined by the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS [0012] Features, advantages and implementations are as follows: In order to make the above and other objects of the present invention more obvious, the detailed description of the drawings 200840440 is shown in accordance with the present invention. A partial perspective view of a first preferred embodiment. Figure 2 is a schematic cross-sectional view showing an embodiment of the present invention. [Main component symbol description] 100, 200: printed circuit board
100a、200a、206b :上表面 200b :下表面 102 :焊墊 104 :焊料層 106、206 〜206、··組件 106a、206a :嫌面 108 :針腳 110、210、212 :熱固性塑膠層 11100a, 200a, 206b: upper surface 200b: lower surface 102: pad 104: solder layer 106, 206 to 206, ... 106a, 206a: face 108: pins 110, 210, 212: thermosetting plastic layer 11