TW200839980A - Pulsating cooling system - Google Patents
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- TW200839980A TW200839980A TW096145319A TW96145319A TW200839980A TW 200839980 A TW200839980 A TW 200839980A TW 096145319 A TW096145319 A TW 096145319A TW 96145319 A TW96145319 A TW 96145319A TW 200839980 A TW200839980 A TW 200839980A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Abstract
Description
200839980 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種脈動冷卻系統，亦即，一冷卻系統， 其中一傳感器誘發產生可被導向待冷卻之物件的脈動流體 流之振盪。以系統之諧振頻率或至少接近於其諧振頻率而 驅動系統以獲得較高流體速度可為有利的。 【先前技術】 歸因於因新近開發之電子裝置（例如）與傳統裝置相比較 r 為緊密及/或功率較大而產生的較高熱通量密度，在各種 應用中對於冷卻之需要已增加。該等改良之裝置之實例包 括（例如）諸如雷射器或發光二極體之較高功率半導體光 源、RF功率裝置及較高效能微處理器、硬碟機、如cdr、 DVD及藍光碟機之光碟機及諸如平坦τν及照明器具的大 面積裝置。 作為對藉由風扇而冷卻之替代，文獻WO 2005/008348揭 示用於冷卻目的之合成喷射流致動器及管。該管連接至諧 I/ 振腔，且脈動喷射流產生於管之遠端，且可用以冷卻物 件。空腔與管形成亥姆霍茲（Helmholtz)諧振器，亦即，空 腔中之空氣充當彈簧而管中之空氣充當質量之二階系統。 另一實例由 N. Beratlis 等人之 Optimization of synthetic jet cooling for microelectronics applications ， 19th SEMITHERM San Jose，2003給出。此處，將合成噴射流 裝置揭示為具有兩個振動膜，其各與同一孔口連通。 已發現此種類之脈動流體流（通常為氣流）對於冷卻比通 127163.doc 200839980 常用於習知冷卻系統（例如，冷卻風扇）中之層流有效。另 外’谐振冷卻糸統需要較少空間，且產生較小噪音。 然而，在例如揭示於WO 2005/008348中的先前提議之系 統中，與振盪氣流之頻率相關的某一聲級之聲音重現繼續 存在。 【發明内容】 本發明之目標為更進一步減小脈動冷卻系統中之。喿音 級。 根據本發明，此目標及其他目標由包含兩個空腔之冷卻 裝置達成，傳感器配置於兩個空腔之間以使得隔膜在該等 空腔之間形成不透流體之密封，每一空腔具有經調適以發 射脈動淨輸出流體流之至少一開口，其中該等空腔及開口 經形成以使得在工作頻率下，由該等空腔中之第一空腔的 開口發射之第一譜波流體流與由該等空腔中之第二空腔的 開口發射之第二諳波流體流處於反相關係，以使得來自該 等開口之諧波流體流之總和基本上為零。 配置於兩個空腔之間的傳感器將充當偶極，亦即，處於 反相關係之兩個聲源。本發明係基於以下構思：來自此等 兩個源的聲音之諧波部分將相互抵銷。表示冷卻效應之主 要部分的非諧波部分將不會相干地相加，且因此將不會相 互抵銷。 藉由此設計，藉由振盪氣流而達成改良之冷卻效應，而 同時’在工作頻率下之聲音重現因出口之反相而被大量地 消除，導致接近於零之遠場容積速度。因此，根據本發明 127163.doc 200839980 之冷卻系統具有與先前技術之”合成噴射流"冷卻裝置相比 顯著較低之聲音重現。 根據本發明之冷卻裝置可用於經由錢液態或氣態流體 (不僅為空氣）的定向流出而冷卻各種物件。然而，其對於 諸如電子電路之物件的空氣冷卻尤為有用。 每一空腔可僅具有一個開口，或具有一個以上開口。然 而，重要的是’來自所有開口之諧波貢獻之總和基本上為 零0BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pulsating cooling system, that is, a cooling system in which a sensor induces oscillation of a pulsating fluid flow that can be directed to an object to be cooled. It may be advantageous to drive the system to achieve a higher fluid velocity at or near the resonant frequency of the system. [Prior Art] Due to the higher heat flux density resulting from the recent development of electronic devices, for example, compared to conventional devices, r is tight and/or high power, the need for cooling has increased in various applications. Examples of such improved devices include, for example, higher power semiconductor light sources such as lasers or light emitting diodes, RF power devices and higher performance microprocessors, hard disk drives, such as cdr, DVD, and Blu-ray disc players. Optical disc drives and large-area devices such as flat τν and lighting fixtures. As an alternative to cooling by means of a fan, document WO 2005/008348 discloses a synthetic jet actuator and tube for cooling purposes. The tube is connected to the harmonic I/vibration chamber and the pulsating jet is generated at the distal end of the tube and can be used to cool the object. The cavity and tube form a Helmholtz resonator, i.e., the air in the cavity acts as a spring and the air in the tube acts as a second-order system of mass. Another example is given by N. Beratlis et al., Optimization of synthetic jet cooling for microelectronics applications, 19th SEMITHERM San Jose, 2003. Here, the synthetic jet flow device is disclosed as having two vibrating membranes each communicating with the same orifice. This type of pulsating fluid flow (typically a gas stream) has been found to be effective for cooling laminar flow in conventional cooling systems (e.g., cooling fans) 127163.doc 200839980. In addition, the resonant cooling system requires less space and produces less noise. However, in the previously proposed system, such as disclosed in WO 2005/008348, the sound reproduction of a certain sound level associated with the frequency of the oscillating airflow continues to exist. SUMMARY OF THE INVENTION The object of the present invention is to further reduce the pulsation cooling system. Arpeggio level. According to the invention, this and other objects are achieved by a cooling device comprising two cavities, the sensor being arranged between the two cavities such that the diaphragm forms a fluid tight seal between the cavities, each cavity having Adapted to emit at least one opening of the pulsating net output fluid stream, wherein the cavities and openings are formed such that at the operating frequency, the first spectral fluid emitted by the opening of the first cavity in the cavities The flow is in an inverse relationship with the second chopping fluid flow emitted by the openings of the second cavity in the cavities such that the sum of the harmonic fluid flows from the openings is substantially zero. The sensor disposed between the two cavities will act as a dipole, that is, two sound sources in an inverted relationship. The invention is based on the idea that the harmonic parts of the sound from these two sources will cancel each other out. The non-harmonic parts representing the main part of the cooling effect will not add together coherently and therefore will not offset each other. By this design, an improved cooling effect is achieved by oscillating the airflow, while at the same time the sound reproduction at the operating frequency is largely eliminated by the inversion of the exit, resulting in a far field volume velocity close to zero. Thus, the cooling system according to the invention 127163.doc 200839980 has a significantly lower sound reproduction than the prior art "synthetic jet stream" cooling device. The cooling device according to the invention can be used for liquid or gaseous fluids via money ( Various objects are cooled not only for directional outflow of air. However, it is particularly useful for air cooling of articles such as electronic circuits. Each cavity may have only one opening or more than one opening. However, it is important that 'from all The sum of the harmonic contributions of the openings is essentially zero
至-空腔中，而將另-傳感器之壓力波引導至另一空腔 中0 可在空腔之間配置一個以上傳感器。舉例而言，以反相 關係操作之兩個相反定位的傳感器將導致較大氣流。，，相 反定位”意謂-情形，#中將來自一傳感器之壓力波引導 "傳感器"在此處為能夠將輸入信號轉換為相應壓力波輸 出之裝置。輸入信號可為電信號、磁信號或機械信號。適 當之傳感H實例包括各種類型之隔膜、活塞、壓電&構等 等。特定言之，可使用適當尺寸之電動揚聲器來作為°傳感 八仰比應較短。對於 距彼此距離d處的具有強度A之兩個源（例如，兩個開口），、 距此等源距離r處的壓力p將為P = ” Γ ，其中k為波數 (ω/c)且Θ為觀測角。為了將此壓力保 示符為較小，根據較佳 實施例，距離d小於0.2 λ，且甚至更佳小於〇工入。 對工作頻率不具有絕對之要求。然而，較佳地選擇工作 127163.doc 200839980 :率以使得通過開口之氣流速度及排氣量具有局部最大 值，且此通常發生於裝置之諧振頻率附近，亦即 裝置（傳感器與空腔及開 f應於 及開口組合）之電輸入阻抗之局部最大 值的頻率。通常選擇最低的此種頻率。 或者，可選擇工作頻率以使得該傳感器之紙盆偏移 (晴e excursion)在此工作步員率下具有局部最小值。 此發士於裝置之反諧振頻率下’亦即，對應於裝置之電輸 入阻抗之局部最小值的頻率。To the cavity, the pressure wave of the other sensor is directed to the other cavity. 0 More than one sensor can be placed between the cavities. For example, two oppositely positioned sensors operating in an inverse relationship will result in a larger airflow. ", the opposite positioning" means - the situation, the pressure wave from a sensor is directed to "sensor", here is a device capable of converting an input signal into a corresponding pressure wave output. The input signal can be an electrical signal, a magnetic Signal or mechanical signals. Suitable examples of sensing H include various types of diaphragms, pistons, piezoelectrics, and the like. In particular, an appropriately sized electric speaker can be used as the sensing unit. For two sources (for example, two openings) having an intensity A at a distance d from each other, the pressure p from the source distance r will be P = Γ Γ , where k is the wave number (ω/c) And it is the observation angle. In order to make this pressure indicator small, according to a preferred embodiment, the distance d is less than 0.2 λ, and even better than the enthalpy. There is no absolute requirement for the operating frequency. However, it is preferred to select the operation 127163.doc 200839980: rate such that the airflow velocity and the amount of exhaust through the opening have a local maximum, and this typically occurs near the resonant frequency of the device, ie the device (sensor and cavity and open f should be at the frequency of the local maximum of the electrical input impedance of the combination of openings. Usually choose the lowest of these frequencies. Alternatively, the operating frequency can be selected such that the sensor's cone offset has a local minimum at this step rate. This is at the anti-resonant frequency of the device', i.e., the frequency corresponding to the local minimum of the electrical input impedance of the device.
確保氣流速度具有基本上相等之大小且處於反相關係之 -方式為對所有氣流提供相等環境。舉例而言，可將空腔 形成為具有相等容積，且可將開口形成為具有相等橫截面 積。然而’此並非必要條件，且不同大小之空腔及/或開 口亦可達成消除氣流。 根據一實施例，開口經由通道（或管路）而連接至各別空 腔。此允許較大的設計自由，因為通道可經形成以朝向相 同位置且以所要方向而引導若干氣流。出於與以上原因相 同之原因，可將通道形成為具有相等長度及橫截面積。 根據一實施例，此等通道係足夠長以在較大程度上充當 官式諧振器。根據替代實施例，通道之長度反而係足夠短 以允許空腔充當習知亥姆霍茲（Helmh〇ltz)諧振器。 連接第一空腔之至少一開口的通道可延伸通過第二空 月工使彳寸此開口位於該裝置之與第二空腔之開口相同之面 上。在空腔具有基本上平坦之延伸部分且配置於彼此之頂 部（亦即，如同在彼此頂部上之兩個圓盤）的狀況下，該設 127163.doc -10- 200839980 計將所有開口定位於裳置之頂面或底面上。 根據本發明，可έ人 之倍數個開口之〆卻二 個以上裝置以形成具有二 裝置之門…配置。既而，第-裝置之開口與第二 ^的龍口之間的平均距離受到與每—裝置之兩個開口之 之要求相同之要求，且因此應較佳地小於02λ， 且更佳小於0.1入。Ensure that the airflow velocities are of substantially equal magnitude and in an inverted relationship - in a way that provides an equal environment for all airflows. For example, the cavities can be formed to have equal volumes, and the openings can be formed to have equal cross-sectional areas. However, this is not a requirement, and cavities and/or openings of different sizes can also achieve elimination of airflow. According to an embodiment, the openings are connected to the respective cavities via channels (or conduits). This allows for greater design freedom because the channels can be formed to face the same position and direct several air flows in the desired direction. For the same reasons as above, the channels can be formed to have equal lengths and cross-sectional areas. According to an embodiment, the channels are sufficiently long to function as official resonators to a greater extent. According to an alternative embodiment, the length of the channel is instead short enough to allow the cavity to act as a conventional Helmh〇ltz resonator. A passage connecting at least one opening of the first cavity may extend through the second hollow to position the opening on the same face of the device as the opening of the second cavity. In the case where the cavities have substantially flat extensions and are disposed on top of each other (ie, as two discs on top of each other), the design 127163.doc -10- 200839980 positions all openings in On the top or bottom of the skirt. According to the present invention, more than two openings can be used to form a door having two devices. Thus, the average distance between the opening of the first device and the second opening is subject to the same requirements as the two openings of each device, and should therefore preferably be less than 02λ, and more preferably less than 0.1.
=此設計’將四個（或四個以上）出口配置成彼此接近 目=工作頻率下之波長）。此導致在冷卻配置之操作期 “音之進—步減小。此部分歸因於由於兩個(成鏡面 々糸仁相同)傳感器之存在的幾何形狀之較為完全的對 稱’且部分歸因於對由兩個相同揚聲器產生之非線性失真 的較佳補償。 【實施方式】 抑圖1中之冷卻系統包含配置於外殼2中之傳感器丨。傳感 恭1經配置以將外殼劃分為分別具有容積¥1及¥2之兩個空 腔4。每一空腔分別經由兩個通道（此處為具有長度ίρ1 及Lp2以及橫截面積Spl及Sp2之管路5、6)而連接至環境大 氣。官路5、6具有定位於距彼此距離d處之出口 7及8。將 開口說明為具有圓形形狀，但本發明不限於此形狀。相反 地’開口可具有任何形狀，且亦可成錐形而以所要方式譽 響氣流。 ' 選擇容積VI與V2及管路5、6之形狀，以使得在使用 中’傳感器將充當壓力波偶極，使得存在於空腔中之流體 的脈動流通過基本上相等且處於反相關係之出口。當在工 127163.doc 11 200839980 :頻！下驅動傳感器日寺’兩個流體流將因此彼此起反作 ’猎t抑餘何壓力波自偶極逃逸（亦即，干擾聲音）。 r n不限於任何特S流體，但本發明之描述 將基於在空氣中操作之裝置，亦即，產生㈣氣流之裝 置0= This design 'configures four (or more than four) outlets to be close to each other at the source = wavelength at the operating frequency). This results in a "sound-to-step reduction" during the operation of the cooling configuration. This is due in part to the more complete symmetry of the geometry due to the presence of two (mirror-like harem) sensors and is partly due to Better compensation for nonlinear distortion produced by two identical speakers. [Embodiment] The cooling system of Figure 1 includes a sensor 配置 disposed in the housing 2. The sensing 1 is configured to divide the housing into Two cavities 4 of volume ¥1 and ¥2. Each cavity is connected to the ambient atmosphere via two channels, here pipes 5, 6 having lengths ίρ1 and Lp2 and cross-sectional areas Spl and Sp2. The official roads 5, 6 have outlets 7 and 8 positioned at a distance d from each other. The opening is illustrated as having a circular shape, but the invention is not limited to this shape. Conversely the 'opening can have any shape and can also be tapered Shape the airflow in the desired way. 'Select the shape of the volume VI and V2 and the lines 5, 6 so that in use the sensor will act as a pressure wave dipole, allowing the pulsating flow of the fluid present in the cavity to pass Basically equal and In the opposite phase of the export. When in the work 127163.doc 11 200839980: frequency! Drive the sensor Riji's two fluid flows will therefore reverse each other 'hunting t suffocating the pressure wave from the dipole escape (ie, Interference sound) rn is not limited to any special S fluid, but the description of the invention will be based on a device that operates in air, that is, a device that produces (iv) airflow.
根據所說明之實例 士 M J此糟由分別使6與h與及 與具有相同值而得以確保。According to the illustrated example, the J J is ensured by having 6 and h and having the same value, respectively.
藉由將距離d保持為與波長相比較短，例#，小於οι λ (八中λ為在工氣中對應於卫作頻率之波長），自偶極轄射之 氣壓被保持為非常小。 可選擇容積％與％及管路5、6之形狀（自圖υ，以使得 存在特定頻率，對於該頻率，通過每一出口 7、8之氣流速 度、及V2具有一致的局部最大值且處於反相關係。接著可 選擇工作頻率以與此頻率一致來確保最大氣流速度且藉此 確保冷卻效應。通常，此等局部最大值與頻率標度上之最 左側電輸入阻抗峰值一致。此對應於裝置之諧振頻率。 根據例示實施例，裝置可具有以下性質： 移動質量=〇.57 g 諧振頻率=3 70 Hz B1 因數=2.57 N/A 有效直徑=24 mm DC電阻=6.63 Ω 容積： V 1 = 3.77 cm3 127163.doc -12- 200839980 V2=3.65 cm3 口大小：By keeping the distance d short compared to the wavelength, Example #, less than οι λ (the λ in 八 is the wavelength corresponding to the servo frequency in the process gas), the air pressure from the dipole is kept very small. The volume % and % and the shape of the lines 5, 6 can be selected (from the figure υ so that there is a specific frequency for which the gas flow rate through each of the outlets 7, 8 and V2 have a consistent local maximum and are at Inverting relationship. The operating frequency can then be selected to coincide with this frequency to ensure maximum airflow velocity and thereby ensure cooling effect. Typically, these local maxima coincide with the peak of the leftmost electrical input impedance on the frequency scale. This corresponds to Resonant frequency of the device. According to an exemplary embodiment, the device may have the following properties: Moving mass = 〇.57 g Resonant frequency = 3 70 Hz B1 factor = 2.57 N/A Effective diameter = 24 mm DC resistance = 6.63 Ω Volume: V 1 = 3.77 cm3 127163.doc -12- 200839980 V2=3.65 cm3 Port size:
Lpi==Lp2=8 cm SPi = Sp2=7i · (0.0025)2 m2 電輸入：2.83 V(標稱1瓦特） 對於此裝置，圖2a)至圖2d)分別展示電輸入阻抗、氣流 速度心及”、空氣粒子在出口 7及8中之位移以及傳感器紙 盆位移之頻率響應。清楚的是，在此說明之狀況下，Vi及 V2曲線之最大值與系統之第一諧振頻率（輸入阻抗之第一局 部最大值）一致。應注意，為了清楚起見，已將容積％與 V2選擇為稍有不同，以使得圖2中之曲線不完全一致。 圖3中說明另一實施例，其中使管5及6經彎曲以最小化 佔據面積’且最小化距離d。單元由兩個螺旋形元件丨丨組 成’在該等螺旋形元件之間夾入中間板12，且以端板13在 該等螺旋形元件之上側及下側進行封閉。將傳感器1之隔 膜14配置於中間板12之中央。每一螺旋形物之最内部空間 15對應於圖1中之容積Vl&v2。 圖4中描繪又一實施例，其中將兩個空腔2丨、22配置於 彼此之頂部，兩個空腔以具有隔膜23之中間板隔開。在所 說明之實例中，無管路連接該等空腔與環境空氣，僅在端 板26、27中存在兩個孔或非常短之管24、乃。在使用中， 聲波將以反相關係而自孔24、25輻射，進而導致處於非常 適度之聲級的組合。 無需將孔24、25配置於該等空腔之相反側上。如圖5所 127163.doc -13- 200839980 不，其亦可位於每一空腔之側面上。在所說明之實例中， 孔24a至24d及2 5a至25d成對地位於各別空腔上。、 十匕分布 取決於所得冷卻喷射流之所要取向（在圖 明）。 5中由箭頭A說Lpi==Lp2=8 cm SPi = Sp2=7i · (0.0025)2 m2 Electrical input: 2.83 V (nominal 1 watt) For this device, Figure 2a) to Figure 2d) show the electrical input impedance, airflow velocity and The displacement of the air particles in the outlets 7 and 8 and the frequency response of the sensor cone displacement. It is clear that, under the conditions described here, the maximum value of the Vi and V2 curves and the first resonant frequency of the system (input impedance) The first partial maximum is consistent. It should be noted that for clarity, the volume % and V2 have been chosen to be slightly different so that the curves in Figure 2 are not completely identical. Another embodiment is illustrated in Figure 3, where The tubes 5 and 6 are bent to minimize the footprint 'and minimize the distance d. The unit consists of two spiral elements '' sandwiching the intermediate plate 12 between the spiral elements, and with the end plate 13 The upper side and the lower side of the spiral element are closed. The diaphragm 14 of the sensor 1 is disposed in the center of the intermediate plate 12. The innermost space 15 of each spiral corresponds to the volume Vl & v2 in Fig. 1. A further embodiment is depicted in which two cavities 2, 22 are configured At the top of each other, the two cavities are separated by an intermediate plate having a diaphragm 23. In the illustrated example, there is no conduit connecting the cavities to ambient air, only two holes are present in the end plates 26, 27. Or a very short tube 24. In use, the sound waves will radiate from the apertures 24, 25 in an inverted relationship, resulting in a combination of very modest sound levels. It is not necessary to dispose the apertures 24, 25 in the cavities. On the opposite side, as shown in Fig. 5, 127163.doc -13- 200839980, it may also be located on the side of each cavity. In the illustrated example, the holes 24a to 24d and 25a to 25d are located in pairs. On the other cavity, the Shiyan distribution depends on the desired orientation of the resulting cooling jet (in the figure).
在圖4中之裝置的另一變體中’可引導來自兩個空腔 21、22之空氣通過端板26中之一者中的孔。如圖6所示， 此可藉由提供自上部空腔21經由下部空腔22通向底部端板 26中之孔28的通道27而完成。底板26中之其他孔29通向下 部空腔22。為了自每一空腔提供類似通道，孔29亦經由長 度及橫截面類似於通道27的通道30而連接至下部空腔22。 作為一般註釋，應注意，來自每一空腔的通道之數目不 必相等。舉例而言，在圖5及圖6中之實施例中，來自空腔 中之一者的孔可多於來自另一者之孔。然而，重要的是f 來自一空腔之總氣流與來自另一空腔之氣流相比大小相等 且處於反相關係。 圖7展示本發明之又一實施例。在此狀況下，兩個空腔 31、32由支撐兩個相反配置之傳感器“、35(其以反相關 係操作）的壁33隔開。此設計之優勢在於由傳感器引起的 任何幾何結構差異得到補償（見（例如）圖i，其中傳感器在 月二4中耗用較大谷積）。返回至圖7，此實施例亦以被劃 分為通向各別空腔之兩個通道37、38之一管路36為特徵。 根據說明於圖8中之又一實㈣，根據先前描述之實施 例中之一者的兩個裝置組合而使用，在此處為根據圖3中 之實施例的裒置41、42。兩個裝置形成具有兩個傳感器丄 127163.doc • 14- 200839980 及四個開口 7a、7b、8a、8b之冷卻系統。如上文所述，所 有四個開口較佳地應被配置成緊密接近，最佳地在小於 〇·2 λ之距離D内。另外，只要距離足夠小，來自各個開口 之乳流的方向便不重要。因此應認識到，開口無需如在圖 8之實例中_樣而平行且處於同—平面中，而是相反地， 其可以許多其他組態配置。亦應注意，兩個裝置“及“無 需如在當前實例中-樣而相同。相反地，可有利地組合任 何兩個偶極裝置。 ΓIn another variation of the apparatus of Figure 4, air from the two cavities 21, 22 can be directed through a hole in one of the end plates 26. This can be accomplished by providing a passage 27 from the upper cavity 21 to the aperture 28 in the bottom end plate 26 via the lower cavity 22, as shown in FIG. The other holes 29 in the bottom plate 26 open into the lower cavity 22. In order to provide a similar passage from each cavity, the aperture 29 is also connected to the lower cavity 22 via a channel 30 having a length and cross-section similar to that of the channel 27. As a general note, it should be noted that the number of channels from each cavity is not necessarily equal. For example, in the embodiment of Figures 5 and 6, the aperture from one of the cavities may be more than the aperture from the other. However, it is important that the total airflow from one cavity is equal and in an inverse relationship to the airflow from the other cavity. Figure 7 shows yet another embodiment of the present invention. In this case, the two cavities 31, 32 are separated by a wall 33 that supports two oppositely configured sensors ", 35 (which operate in an inverted relationship). The advantage of this design is that any geometrical differences caused by the sensor Compensation is obtained (see, for example, Figure i, where the sensor consumes a large grain product on month 2). Returning to Figure 7, this embodiment is also divided into two channels 37, 38 that lead to the respective cavities. One of the conduits 36 is characterized. According to yet another embodiment (four) illustrated in Figure 8, a combination of two devices according to one of the previously described embodiments, here a device according to the embodiment of Figure 3 41, 42. The two devices form a cooling system having two sensors 丄127163.doc • 14- 200839980 and four openings 7a, 7b, 8a, 8b. As mentioned above, all four openings should preferably be configured In close proximity, optimally within a distance D of less than 〇·2 λ. In addition, as long as the distance is sufficiently small, the direction of the milk flow from each opening is not important. Therefore, it should be recognized that the opening does not require an example as in Figure 8. Medium-like and parallel and in the same plane But instead, it may be configured in many other configuration should also be noted, two devices "and" no need as in the present example - the same sample and conversely, may be advantageously combined any two dipole means Gamma]..
沾驾此項技術者認識到本發明決不限於上文描述之較佳 實施例。相反地，許多修改及變化在隨附申請專利範圍之 範嘴内為可能的。舉例而言，傳感器之數目可進一步增 加，且開口及通道之置放及形狀可視應用而變化。 另外，傳感器可在微機電系統（MEMS)技術中實施，亦 即：在非常小之規模下實現。更特定言之，在該較小規模 ^ 傳感器、空腔、開口及任何通道之整個冷卻裝置 可错由使用(例如)蝕刻技術而完全實施於矽中。該裝置可 :利地與例如微處理器的待冷卻之ic整合。藉由經由與待 "部之物件處於㈣規模的冷卻裝置來提供冷卻，可使得 :::為有效。當然’梦裝置可與連接至石夕基板之額外通 【圖式簡單說明】 ㈤展不根據本發明之第一實施例之冷卻系統。 ^ m 2d)^ ^ ^ ^ ^ 排虱1及紙盆位移之頻率響應的實例。 127163.doc 15 200839980 圖3展示根據本發明之第二實施例之冷卻系統。 圖4展示根據本發明之第三實施例之冷卻系統。 圖5展示根據本發明之第三實施例之變體的冷卻系統。 圖6展示根據本發明之第三實施例之另一變體的冷卻系 統。 圖7展示根據本發明之第四實施例之冷卻系統。 圖8展示根據本發明之第五實施例之冷卻系統。 【主要元件符號說明】 ΓThose skilled in the art will recognize that the present invention is in no way limited to the preferred embodiments described above. On the contrary, many modifications and variations are possible within the scope of the appended claims. For example, the number of sensors can be further increased, and the placement and shape of the openings and channels can vary depending on the application. In addition, the sensor can be implemented in microelectromechanical systems (MEMS) technology, ie on a very small scale. More specifically, the entire cooling device of the smaller scale sensor, cavity, opening and any channel can be completely implemented in the crucible using, for example, etching techniques. The device can be advantageously integrated with an ic to be cooled, such as a microprocessor. By: providing cooling by means of a cooling device on the (fourth) scale of the item to be ", ::: is effective. Of course, the 'dream device can be connected with the extra connection to the Shixi substrate. [Simplified description of the drawing] (5) A cooling system according to the first embodiment of the present invention is not shown. ^ m 2d)^ ^ ^ ^ ^ Examples of frequency response of drain 1 and cone displacement. 127163.doc 15 200839980 Figure 3 shows a cooling system in accordance with a second embodiment of the present invention. Figure 4 shows a cooling system in accordance with a third embodiment of the present invention. Figure 5 shows a cooling system in accordance with a variation of the third embodiment of the present invention. Figure 6 shows a cooling system in accordance with another variation of the third embodiment of the present invention. Figure 7 shows a cooling system in accordance with a fourth embodiment of the present invention. Figure 8 shows a cooling system in accordance with a fifth embodiment of the present invention. [Main component symbol description] Γ
1 傳感器 2 外殼 3 空腔 4 空腔 5 管路/管 6 管路/管 7 出口 7a 開口 7b 開口 8 出口 8a 開口 8b 開口 11 螺旋形元件 12 中間板 13 端板 14 隔膜 127163.doc -16- 200839980 Γ1 sensor 2 housing 3 cavity 4 cavity 5 pipe / tube 6 pipe / tube 7 outlet 7a opening 7b opening 8 outlet 8a opening 8b opening 11 spiral element 12 intermediate plate 13 end plate 14 diaphragm 127163.doc -16- 200839980 Γ
15 最内部空間 21 空腔 22 空腔 23 隔膜 24 管/孔 24a 子L 24b 孔 24c 孔 24d 孔 25 管/孔 25a 孔 25b 孔 25c 孔 25d 孔 26 端板/底板 27 端板/通道 28 孔 29 孔 30 通道 31 空腔 32 空腔 33 壁 34 傳感器 35 傳感器 127163.doc -17- 200839980 Γ 36 管路 37 通道 38 通道 41 裝置 42 裝置 A 箭頭 d 距離 D 距離 Lp 1 長度 LP2 長度 Spl 橫截面積 Sp2 橫截面積 V! 容積 V2 容積 127163.doc -18 -15 innermost space 21 cavity 22 cavity 23 diaphragm 24 tube / hole 24a sub L 24b hole 24c hole 24d hole 25 tube / hole 25a hole 25b hole 25c hole 25d hole 26 end plate / bottom plate 27 end plate / channel 28 hole 29 Hole 30 Channel 31 Cavity 32 Cavity 33 Wall 34 Sensor 35 Sensor 127163.doc -17- 200839980 Γ 36 Line 37 Channel 38 Channel 41 Device 42 Device A Arrow d Distance D Distance Lp 1 Length LP2 Length Spl Cross-sectional area Sp2 Cross-sectional area V! Volume V2 Volume 127163.doc -18 -
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| TW096145319A TW200839980A (en) | 2006-11-30 | 2007-11-28 | Pulsating cooling system |
Country Status (7)
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| US (1) | US20100018675A1 (en) |
| EP (1) | EP2089902A1 (en) |
| JP (1) | JP2010511142A (en) |
| KR (1) | KR20090085700A (en) |
| CN (1) | CN101542724A (en) |
| TW (1) | TW200839980A (en) |
| WO (1) | WO2008065602A1 (en) |
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| WO2007034344A2 (en) * | 2005-09-20 | 2007-03-29 | Koninklijke Philips Electronics N.V. | Band- pass transducer system with long port |
| EP1999381B1 (en) * | 2006-03-21 | 2017-11-22 | Philips Lighting Holding B.V. | Cooling device and electronic device comprising such a cooling device |
| WO2008075245A2 (en) * | 2006-12-15 | 2008-06-26 | Koninklijke Philips Electronics N.V. | Pulsating fluid cooling with frequency control |
| US7768779B2 (en) * | 2007-06-04 | 2010-08-03 | Nuventix, Inc. | Synthetic jet ejector with viewing window and temporal aliasing |
| CN101680623B (en) * | 2007-06-14 | 2014-09-24 | 皇家飞利浦电子股份有限公司 | Lighting device with pulsating fluid cooling |
| US7990705B2 (en) * | 2008-05-09 | 2011-08-02 | General Electric Company | Systems and methods for synthetic jet enhanced natural cooling |
| RU2011119607A (en) * | 2008-10-17 | 2012-11-27 | Конинклейке Филипс Электроникс Н.В. | COOLING DEVICE |
| US8496049B2 (en) * | 2009-04-09 | 2013-07-30 | General Electric Company | Heat sinks with distributed and integrated jet cooling |
| US10274263B2 (en) | 2009-04-09 | 2019-04-30 | General Electric Company | Method and apparatus for improved cooling of a heat sink using a synthetic jet |
| US9615482B2 (en) | 2009-12-11 | 2017-04-04 | General Electric Company | Shaped heat sinks to optimize flow |
| US8776871B2 (en) | 2009-11-19 | 2014-07-15 | General Electric Company | Chassis with distributed jet cooling |
| CH703357A1 (en) * | 2010-06-25 | 2011-12-30 | Alstom Technology Ltd | HEAT-LOADED, COOLED COMPONENT. |
| US8602607B2 (en) | 2010-10-21 | 2013-12-10 | General Electric Company | Lighting system with thermal management system having point contact synthetic jets |
| US8529097B2 (en) | 2010-10-21 | 2013-09-10 | General Electric Company | Lighting system with heat distribution face plate |
| US9027702B2 (en) * | 2013-10-16 | 2015-05-12 | The Boeing Company | Synthetic jet muffler |
| CN104501646B (en) * | 2014-12-26 | 2016-08-31 | 李达 | Jet cooling mechanism and jet radiator |
| US11910568B2 (en) * | 2020-04-20 | 2024-02-20 | Cisco Technology, Inc. | Heat dissipation system with microelectromechanical system (MEMS) for cooling electronic or photonic components |
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| US6123145A (en) * | 1995-06-12 | 2000-09-26 | Georgia Tech Research Corporation | Synthetic jet actuators for cooling heated bodies and environments |
| US5758823A (en) * | 1995-06-12 | 1998-06-02 | Georgia Tech Research Corporation | Synthetic jet actuator and applications thereof |
| GB0114222D0 (en) * | 2001-06-12 | 2001-08-01 | Pulsar Light Of Cambridge Ltd | Lighting unit with improved cooling |
| US6848631B2 (en) * | 2002-01-23 | 2005-02-01 | Robert James Monson | Flat fan device |
| JP4677744B2 (en) * | 2003-11-04 | 2011-04-27 | ソニー株式会社 | Jet generating device, electronic device and jet generating method |
| JP4572548B2 (en) * | 2004-03-18 | 2010-11-04 | ソニー株式会社 | Gas ejection device |
| US7140753B2 (en) * | 2004-08-11 | 2006-11-28 | Harvatek Corporation | Water-cooling heat dissipation device adopted for modulized LEDs |
| JP4747657B2 (en) * | 2005-04-21 | 2011-08-17 | ソニー株式会社 | Jet generator and electronic device |
| JP2006310586A (en) * | 2005-04-28 | 2006-11-09 | Sony Corp | Air current generator and electronic apparatus |
| EP1722412B1 (en) * | 2005-05-02 | 2012-08-29 | Sony Corporation | Jet generator and electronic device |
-
2007
- 2007-11-27 EP EP07849261A patent/EP2089902A1/en not_active Withdrawn
- 2007-11-27 CN CNA2007800438438A patent/CN101542724A/en active Pending
- 2007-11-27 WO PCT/IB2007/054796 patent/WO2008065602A1/en active Application Filing
- 2007-11-27 JP JP2009538820A patent/JP2010511142A/en not_active Withdrawn
- 2007-11-27 US US12/515,999 patent/US20100018675A1/en not_active Abandoned
- 2007-11-27 KR KR1020097013612A patent/KR20090085700A/en not_active Application Discontinuation
- 2007-11-28 TW TW096145319A patent/TW200839980A/en unknown
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| WO2008065602A1 (en) | 2008-06-05 |
| EP2089902A1 (en) | 2009-08-19 |
| CN101542724A (en) | 2009-09-23 |
| KR20090085700A (en) | 2009-08-07 |
| JP2010511142A (en) | 2010-04-08 |
| US20100018675A1 (en) | 2010-01-28 |
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