200838410 Λ .九、發明說明： _【發明所屬之技術領域】 本發明係關於一種電子設備及散熱器。 【先前技術】 隨著電子元件高頻高速之發展，電子元件所產生之熱 量也越來越多，致使電子設備内部不斷升溫，嚴重影響了 中央處理器及其他電子元件運行穩定性。所以，電子設備 之機箱之侧板上對應設有通風孔及在機箱内配置系統風 馨扇，促進機箱内外之空氣對流以進行散熱，但這種方式僅 靠通風孔排熱和機箱側壁傳導熱量，並不能快速充分地將 電子設備内產生之熱量排出。 【發明内容】 鑒於以上内容，有必要提供一種充分散熱之散熱器及 電子設備。 一種電子設備，包括一機箱及一散熱器，該機箱之一 φ侧壁開設一通風口，該散熱器包括一固定於機箱之通風口 處之基板及複數自該基板之一侧延伸形成之相互平行之鰭 片，每兩相臨之鰭片之間形成一通道，該基板上設有複數 與對應通道相連通之通風孔。 一種散熱器，其包括一基板及複數自該基板之一侧延 伸形成之相互平行之鰭片，每兩相臨之鰭片之間形成一通 道，該基板上設有複數與對應通道相連通之通風孔。 相較習知技術，該散熱器裝設於該機箱之通風口處， 藉由該散熱器和該散熱器之基板之通風孔將該電子設備内 5 200838410 _產生之熱量快速排出，提高了散熱效率。 .【實施方式】 請參照圖1至圖3，本發明電子設備之第一較佳實施 方式包括一機箱10及一活動裝設於該機箱10之散熱器 20 ° 該機箱10包括一基座12及一蓋體14，該基座12之 一侧壁上開設一第一開口 102，該蓋體14於對應之側壁上 開設一第二開口 103,該第一開口 102與該第二開口 103 _共同形成一通風口，該機箱10於該通風口之附近處設有複 數固定孔105。 該散熱器20包括一基板22及複數自該基板22之一侧 延伸形成之鰭片220，該等鰭片220相互平行，每兩相臨 鰭片220之間形成一通道，該基板22上設有複數與對應通 道相連通之通風孔222。該基板22之另一侧設有一可固定 一熱管24之固定塊224，該固定塊224之中部設有一孔 隹2240，該熱管24呈L型，其一端緊密結合於該孔2240， 另一端連接一吸熱體26，該熱管24與該孔2240之間隙中 添入錫膏或錫箔等導熱介質，以降低該熱管24與該等鰭片 220之間之熱阻，從而提高該熱管24與該等鰭片220之間 之熱傳導性能，該吸熱體26可貼合於該機箱10内之電子 元件30上。該基板22之四角延伸形成複數設有通孔226 之固定片228。 組裝時，將該散熱器20之基板22對正該機箱10之通 風口，藉由四鎖固件2282分別穿過該散熱器20之基板22 6 200838410 ，之通孔226並鎖固於該機箱10之固定孔105，將該散熱器 20裝設於該機箱10，並使該散熱器20之鰭片220置於該. 機箱10外。藉由機箱内配置之系統風扇（圖未示）來促進機 箱内外之空氣對流，此時該機箱10内之電子元件（包括電 子元件30)產生之熱量經該散熱器20之通風孔222排出， 同時該等熱量也可經該吸熱體26及熱管24傳導至該散熱 器20，故可將熱量充分、快速地散發出去。 請參照圖4,本發明電子設備之第二較佳實施方式包 _括一機箱40及一活動裝設於該機箱40之散熱器20。該機 箱40之一侧壁上開設一通風口 404,該散熱器20透過複 數常用之鎖固件2282組設於該機箱40。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾 或變化，皆應涵蓋於以下之申請專利範圍内。 _【圖式簡單說明】 圖1係本發明電子設備之第一較佳實施方式之立體分 解圖。 圖2係圖1中之部分元件之立體組合圖。 圖3係圖1之立體組合圖。 圖4係本發明電子設備之第二較佳實施方式之立體分 解圖。 【主要元件符號說明】 12 機箱 10、40 基座 7 200838410 第一開口 102 固定孔 105 蓋體 14 第二開口 103 散熱器 20 基板 22 籍片 220 通風孔 222 固定塊 224 2240 通孔 226 固定片 228 鎖固件 2282 孰管 24 吸熱體 26 電子元件 30 通風口 404200838410 Λ. 9. Description of the invention: _ [Technical field to which the invention pertains] The present invention relates to an electronic device and a heat sink. [Prior Art] With the development of high-frequency and high-speed electronic components, the heat generated by electronic components is increasing, which causes the internal temperature of electronic devices to heat up, which seriously affects the operational stability of the central processing unit and other electronic components. Therefore, the side panel of the electronic device is provided with a vent hole and a system fan is arranged in the chassis to promote air convection inside and outside the chassis for heat dissipation, but this method only relies on the heat dissipation of the vent hole and the heat conduction of the side wall of the chassis. The heat generated in the electronic device cannot be quickly and fully discharged. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat sink and an electronic device that sufficiently dissipate heat. An electronic device includes a chassis and a heat sink. One of the side walls of the chassis defines a vent. The heat sink includes a substrate fixed to the vent of the chassis and a plurality of mutually extending from one side of the substrate. Parallel fins form a channel between each of the two adjacent fins, and the substrate is provided with a plurality of ventilation holes communicating with the corresponding channels. A heat sink includes a substrate and a plurality of mutually parallel fins extending from one side of the substrate, and a channel is formed between each of the two adjacent fins, and the substrate is provided with a plurality of corresponding channels. Vents. Compared with the prior art, the heat sink is installed at the vent of the chassis, and the heat generated by the heat sink and the substrate of the heat sink is quickly discharged, thereby improving heat dissipation. effectiveness. [Embodiment] Referring to FIG. 1 to FIG. 3, a first preferred embodiment of the electronic device of the present invention includes a chassis 10 and a heat sink 20 movably mounted on the chassis 10. The chassis 10 includes a base 12 And a cover body 14 , a first opening 102 is defined in a sidewall of the base 12 , the cover body 14 defines a second opening 103 on the corresponding sidewall, the first opening 102 and the second opening 103 _ Together, a vent is formed, and the chassis 10 is provided with a plurality of fixing holes 105 in the vicinity of the vent. The heat sink 20 includes a substrate 22 and a plurality of fins 220 extending from one side of the substrate 22. The fins 220 are parallel to each other, and a channel is formed between each of the two adjacent fins 220. There are a plurality of venting holes 222 communicating with the corresponding passages. The other side of the substrate 22 is provided with a fixing block 224 for fixing a heat pipe 24. The middle of the fixing block 224 is provided with a hole 2240. The heat pipe 24 is L-shaped, one end of which is tightly coupled to the hole 2240, and the other end is connected. a heat absorbing body 26, a heat conductive medium such as solder paste or tin foil is added to the gap between the heat pipe 24 and the hole 2240 to reduce the thermal resistance between the heat pipe 24 and the fins 220, thereby improving the heat pipe 24 and the like. The heat transfer between the fins 220 can be applied to the electronic components 30 in the chassis 10. The four corners of the substrate 22 extend to form a plurality of fixing pieces 228 provided with through holes 226. During assembly, the substrate 22 of the heat sink 20 is aligned with the vent of the chassis 10, and the through holes 226 of the substrate 20 of the heat sink 20 are respectively passed through the four locks 2282 and locked to the chassis 10 . The fixing hole 105 is mounted on the chassis 10, and the fin 220 of the heat sink 20 is placed outside the chassis 10. The air convection inside and outside the chassis is promoted by a system fan (not shown) disposed in the chassis. At this time, heat generated by the electronic components (including the electronic components 30) in the chassis 10 is discharged through the ventilation holes 222 of the heat sink 20. At the same time, the heat can also be conducted to the heat sink 20 through the heat absorbing body 26 and the heat pipe 24, so that the heat can be sufficiently and quickly dissipated. Referring to FIG. 4, a second preferred embodiment of the electronic device of the present invention includes a chassis 40 and a heat sink 20 movably mounted to the chassis 40. A vent 404 is defined in one of the side walls of the casing 40. The heat sink 20 is disposed in the casing 40 through a plurality of commonly used fasteners 2282. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective exploded view of a first preferred embodiment of an electronic device of the present invention. Figure 2 is a perspective assembled view of some of the components of Figure 1. Figure 3 is a perspective assembled view of Figure 1. Figure 4 is a perspective exploded view of a second preferred embodiment of the electronic device of the present invention. [Main component symbol description] 12 Chassis 10, 40 Base 7 200838410 First opening 102 Fixing hole 105 Cover 14 Second opening 103 Heat sink 20 Substrate 22 Blank 220 Ventilation hole 222 Fixing block 224 2240 Through hole 226 Fixing piece 228 Lock 2282 manifold 24 heat absorber 26 electronic component 30 vent 404