TW200835817A - Electroplating apparatus capable of carrying out electroplating onto local area of workpiece and its method - Google Patents

Electroplating apparatus capable of carrying out electroplating onto local area of workpiece and its method Download PDF

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Publication number
TW200835817A
TW200835817A TW96106111A TW96106111A TW200835817A TW 200835817 A TW200835817 A TW 200835817A TW 96106111 A TW96106111 A TW 96106111A TW 96106111 A TW96106111 A TW 96106111A TW 200835817 A TW200835817 A TW 200835817A
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TW
Taiwan
Prior art keywords
workpiece
unit
plating
electroplating
anode
Prior art date
Application number
TW96106111A
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English (en)
Chinese (zh)
Other versions
TWI333987B (enExample
Inventor
Chun-Dao Zhong
Original Assignee
China Steel Corp
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Publication date
Application filed by China Steel Corp filed Critical China Steel Corp
Priority to TW96106111A priority Critical patent/TW200835817A/zh
Publication of TW200835817A publication Critical patent/TW200835817A/zh
Application granted granted Critical
Publication of TWI333987B publication Critical patent/TWI333987B/zh

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  • Electroplating Methods And Accessories (AREA)
TW96106111A 2007-02-16 2007-02-16 Electroplating apparatus capable of carrying out electroplating onto local area of workpiece and its method TW200835817A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96106111A TW200835817A (en) 2007-02-16 2007-02-16 Electroplating apparatus capable of carrying out electroplating onto local area of workpiece and its method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96106111A TW200835817A (en) 2007-02-16 2007-02-16 Electroplating apparatus capable of carrying out electroplating onto local area of workpiece and its method

Publications (2)

Publication Number Publication Date
TW200835817A true TW200835817A (en) 2008-09-01
TWI333987B TWI333987B (enExample) 2010-12-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW96106111A TW200835817A (en) 2007-02-16 2007-02-16 Electroplating apparatus capable of carrying out electroplating onto local area of workpiece and its method

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TW (1) TW200835817A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111032925A (zh) * 2017-09-07 2020-04-17 盛美半导体设备(上海)股份有限公司 电镀夹盘
TWI791785B (zh) * 2019-03-06 2023-02-11 大陸商盛美半導體設備（上海）股份有限公司 電鍍夾盤

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105350038B (zh) * 2014-08-22 2017-11-07 王元谷 局部电镀装置及局部电镀方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111032925A (zh) * 2017-09-07 2020-04-17 盛美半导体设备(上海)股份有限公司 电镀夹盘
US11469134B2 (en) 2017-09-07 2022-10-11 Acm Research (Shanghai) Inc. Plating chuck
TWI791785B (zh) * 2019-03-06 2023-02-11 大陸商盛美半導體設備（上海）股份有限公司 電鍍夾盤

Also Published As

Publication number Publication date
TWI333987B (enExample) 2010-12-01

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