TW200835413A - Portable memory devices and method therefor - Google Patents

Abstract

Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention concerns covering test contacts (e.g., test pins) provided with the integrated circuit products using printed ink. Once covered with the ink, the test contacts are no longer electrically exposed. Hence, the integrated circuit products are not susceptible to accidental access or electrostatic discharge. Moreover, the integrated circuit products can be efficiently produced in a small form factor without any need for additional packaging or labels to electrically isolate the test contacts.

Description

200835413 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to integrated circuit products, and more particularly to removable peripheral cards containing one or more integrated circuits. [Prior Art] As the memory bulk circuit (1C) package tends to be smaller and its memory density tends to be larger, an advance in integrated circuit packaging is required. A recent advancement involves stacking multiple integrated circuit dies within a single 1C package. This internal package stack involves stacking a smaller die on a larger die. Each of the wires is bonded to a substrate. e (for example) uses this type of stack in the same way as functional dies (e.g., two flash memory dies) or different functional dies (e.g., a flash memory die and a SRAM die). On the other hand, for the stacked Chip Scale package (stacked cSP) and stacked thin small package I (Thin smaii

Package, TSOP), the stacking of two or three dies has been completed. Memory cards are commonly used to store digital bodies for use with a variety of products, such as electronics. These memory cards are increasingly required to store an ever-increasing amount of information. C memory cards usually provide non-volatile data storage, and therefore these memory cards are very popular and have (4), which keeps the bedding even after the power is turned off. An example of a memory card is a flash card that stores a flash material using a flash type memory unit or an EEPROM type memory unit. Flash cards have a relatively small form factor and have been used to store products (such as cameras:, electricity: (handheld computers, laptops and desktops), video converters - handheld or other small audio players Digital data for the /recorder (for example, delete 125911.doc 200835413) and medical monitors. The main supplier of flash cards is

Sanpit Corporation, Milpitas, CA. In some cases, the memory card is conventionally provided with a set of test pins that enable the memory card to be tested. Typically, test pins are used at the manufacturing site to test the internal portion of the memory card. However, when the memory card is tested and ready to be distributed to the end user, the test pins should not be exposed to the end user. In the past, these test pins have been covered by plastic housings for relatively expensive memory cards. Recently, for memory cards with test pins that were originally exposed, labels have been provided on the test pins. The tag is effective in shielding the test pins from electrostatic discharge. The label also effectively hides the test pins. However, labels do have some drawbacks. The application of the label to the memory card is a time consuming processing operation. In addition, the tag can be a relatively expensive part of the entire memory card. Further, since the memory card is usually inserted into or removed from the slot in the consumer electronic device, the memory card needs to be reliably inserted and withdrawn. Typically, the extraction process is mechanically assisted (for example, spring biased assistance. However, in some cases, the label may have substantial friction that is resistant to the spring-based extraction of the memory card. The label also has line edges that can also block The memory card is removed or extracted. Therefore, there is a need for an improved method of manufacturing a memory card having test pins. SUMMARY OF THE INVENTION The present invention is generally directed to an improved technique for fabricating integrated circuit products. Smaller and less expensive manufacturing of circuit products. The present invention relates to the use of printing ink to cover test contacts (e.g., test pins) provided to integrated product 125911.doc 200835413. Once covered by ink Then, the test contacts are no longer exposed to electricity. Therefore, the integrated circuit is produced to be susceptible to accidental access or electrostatic discharge. In addition, the shape and shape can effectively manufacture integrated circuit products without additional packaging or The label is electrically isolated to test any need for the contact. The integrated circuit product can be formed using semiconductor assembly technology. A removable peripheral card or other removable media. One type of removable peripheral card is called a memory card. The memory card is usually a product based on the integrated power supply 35 that provides data storage. These memory cards can be highly Portable or plugged into a cymbal or connector on an electronic device or received by a cymbal or connector on an electronic device, including a computer, a camera, a mobile phone, and a pda. The invention can be implemented in a number of ways, including as (4) Apparatus, apparatus, or method. Several embodiments of the present invention are discussed below. As a memory card, embodiments of the present invention include at least: a circuit board having a front side and a rear side, the front side including a die attach profile, And the rear side includes (10) a contact piece and a test contact piece; at least one semiconductor die attached to a front side of the circuit board, the at least one semiconductor die is electrically connected to the circuit board, and the at least one semiconductor film is sealed to the at least the semiconductor The die-side molding compound of the die and the board; and - the ink coating, which is provided behind the board. The test contacts on the board are not provided after the board On the 1/0 contact on the side. As a method of manufacturing a memory card by S, an embodiment of the present invention includes at least a plurality of memory cards, each of the memory cards having an exposed type 4 contact Testing the memory card using the exposed test contact; and printing the ink on the exposed test contact on the 125911.doc 200835413 memory card. As an electrical t system, the embodiment of the present invention includes at least - data acquisition = ::: The storage device is capable of storing the tribute obtained by the data acquisition device. The data storage device comprises at least: a circuit board having a side and a second side, the first side comprising a die attach pad and The second side includes a 1/0 contact and a test contact; at least a semiconductor wafer attached to the first side, the at least semiconductor die electrically connected to the die attach pad of the circuit board; - sealing the at least a semiconductor compound and a molding compound on a first side of the circuit board; and an ink coating: the test contact for feeding on the second side of the circuit board is provided on the circuit board: I on the second side /O contact on the piece. According to another embodiment, the integrated circuit product can be mass-produced by at least the following steps: providing multiple executions with a plurality of execution entities: a body lead frame or a substrate, a lead frame or each of the execution entities of the substrate Each having a test contact and an input/output (10)m contact; attaching _ or a plurality of dies to each of the execution individuals on at least one side of the individual leadframe or substrate; Each of the plurality of execution entities electrically connected to the 7-wire frame or the substrate; thereafter sealing the plurality of execution individuals of the at least one side of the plurality of individual lead frames or substrates together with the molding compound, wherein the test The contact member and the Ϊ/O contact member remain exposed; then each of the plurality of execution centers is adapted to use the exposed test contact member 2 for each of the plurality of execution individuals; and at the plurality of executions The ink is printed on the test contact exposed on the individual. At least one of the plurality of execution entities manufactured by the operations is the integrated circuit product. χ 125911.doc -9 - 200835413 As an integrated circuit product, the present invention has at least: a circuit board having a front side and a rear side, the front side including a die attach pad: And the rear side comprises an I/O contact and a thirst contact; at least one half of the front side of the circuit board is attached to the front side of the circuit board, and the at least one semiconductor die is electrically connected to the crystal of the circuit board. a fine-grained adhesion liner, a molding compound on the front side of the semiconductor die and the circuit board; and an ink coating provided on the κ contact on the rear side of the circuit board but not provided On the I/O contacts on the back side of the board.

Other aspects and advantages of the present invention will be described by way of example with reference to the accompanying drawings in which: FIG. [Complex Mode] The present invention relates to an improved technique for manufacturing an integrated circuit product. These improved techniques result in smaller and less expensive manufacturing of integrated circuit products. One aspect of the present invention relates to (d) printing ink covering test contacts (e.g., test pins) provided to an integrated circuit product. Once covered by the ink, the test contacts are no longer electrically exposed. Therefore, integrated circuit products are not susceptible to random access or electrostatic discharge. In addition, the small form factor can be used to efficiently fabricate the product circuit without the need for additional packages or tags to electrically isolate the test contacts. Half-body assembly technology can be used to form integrated circuit products. Integrated circuit production. The port can also have a reduced form factor. The reduced form factor can be of the wafer and package type. Additionally, the form factor can be defined at the semiconductor assembly level of semiconductor fabrication. 125911.doc -10- 200835413 , - Circuit production can be related to the removable peripheral card. The removable peripheral card allows you to apply and perform many different functions. One type of removable peripheral card is called a § recall card. A memory card is usually a product based on an integrated circuit that provides data storage. The memory cards are inserted into or connected to a cassette or connector on the electronic device, such as a computer, a camera, a mobile phone, and a pDA. The memory card can be a non-volatile memory card. In one embodiment, the memory card may contain a plurality of integrated circuit chips stacked on one or both sides of a substrate or lead frame. Although the various figures are discussed below with reference to a memory card, other integrated circuit products can be formed therefrom. Embodiments of this aspect of the invention are discussed below with reference to Figures 1 through 12. However, those skilled in the art will readily appreciate that, as the invention extends beyond these limited embodiments, the embodiments described herein are for illustrative purposes. 1 and 2 illustrate a memory card 1 according to an embodiment of the present invention. In Fig. 1, 'mainly depicts § 忆 卡 card 1 〇 〇 behind the side 1 〇 2. In Figure 2, the front side 108 of the memory card 100 is primarily depicted. The memory card 100 includes a plurality of input/output (1/〇) contacts 1〇4 (e.g., 1/〇 pin) on the side 102 of the memory card 1〇〇. Typically, as illustrated in Figure 1, an I/O contact 104 is provided toward one end of the memory card 1 . Further, the memory card 1 has an ink coating 1〇6. As illustrated in Figure 1, an ink coating 106 is provided on the back side of the memory card 1 〇 2 . Although not illustrated in FIG. 1, the memory card 100 rear side 102 includes a plurality of test contacts (not shown). Once the plurality of test contacts are assembled, 125911.doc -11- 200835413

It is exposed on the back side 102 of the memory card 100. These test contacts are used to test the memory card 100 after the ancient memory card 100 has been assembled. After the test of the memory card has been completed, it is usually no longer necessary to access the test contacts. Thus, according to one embodiment of the invention, an ink coating x 106 is provided on the test contact. The ink coating 106 provides electrical isolation to the test contacts, otherwise the test contacts will be exposed. The ink coating 106 prevents damage to electrical components within the memory card 100 or loss of stored data due to electrostatic discharge. The ink coating 106 prevents accidental access or damage to data stored in the memory card 100. Since the end user typically does not need to utilize the test contacts, the test contacts need to be invisible to the user. Thus, in some embodiments, an ink coating 1 〇 6 can be used to conceal the test contacts. Example = In other words, if the color of the rear side 102 of the memory card 1 is black, the ink coating + layer ι 6 can be used to coat the electrical contacts with black ink. As a result, the presence of the test contacts will be hidden or obscured to make the terminal of the memory card undetectable. Test contacts are conventionally used to test the internal function of a mad mania of a memory card. For example, when the memory card includes a controller integrated circuit (control 1 § wafer / die) and a separate memory volume circuit (remember - version of the day / month / die) and the two wafers For internal connections, it may be necessary to monitor the communication between the ports or the controller chip to release control of such connections to an external tester. This can be accomplished by issuing a special test command to the controller wafer via the 1/0 pin of the memory card. Next, the tester can issue appropriate commands directly to the memory die and test the functionality of the memory die, such as 125911.doc -12-200835413 writes to and from the memory die.

Vl ^ ^ 'Bi Δ lb 兀 and the controller chip is separately accessed via pins (for example) to perform the test. This test pin can also be used to store the memory content of the memory and this makes the content available to the end user. . In some embodiments, 2 is performed using a standard 1/〇 contact, because the interface to the memory of the day can be a parallel interface, and the host interface of the ## interface can be achieved: = 2 is possible Data transfer faster than ^Beko transfer. In his embodiment, such as when the memory chip is a program in a programmable device U, the environment may be greatly different from the user environment, it may require high dust or power or draw higher current (with standard operation). The ability to compare them during the period. Portable latches such as memory cards are well known in the art, and the devices can be of various sizes, shapes and forms. The present invention can be used to electrically isolate and/or hide such test contacts insofar as any of these types of memory cards utilize test contacts on the surface of the card. 3 and 4 illustrate a memory card in accordance with an embodiment of the present invention. The memory card illustrated in Figures 3 and 4 is a memory card in which the card is fully formed (i.e., 'assembled) except that the test connector (4) remains exposed. That is, the memory card 300 includes a rear side 3G2 and a front side pass. The rear side 3〇2 includes (10) a contact 306 and a test contact 3〇8. As shown in Figure 3, test contacts 308 can be arranged in a two-dimensional array of test contacts. FIG. 4 illustrates a cross-sectional view of the memory card 300. The rear side 3〇2 of the memory card is formed by the rear side of the circuit board 31〇. A 1/〇 contact is provided on the back side and a test contact 308 is tested. Circuit board 310 also includes a front side 312. The semiconductor die 3 14 can be attached to the front side 312 of the circuit board 3 1 . In addition, a plurality of wire bonds 316 electrically connect the semiconductor die 314 to the bond pads 318 provided on the front side 312 of the circuit board 3. Although wire bonding 3丨6 is utilized in Fig. 4, in other embodiments, electrical connections may be formed by other components (e.g., solder balls).

The memory card 300 illustrated in Figures 3 and 4 is assembled but not completely formed. The test contacts in the memory card 3 of FIG. 3 and FIG. 4 are exposed to be exposed, so that the assembly can be performed. After the post-assembly test, as detailed in 2, an ink coating is provided on the test contacts 3〇8. The ink coating can be a uniform area surrounding all of the test contacts 3〇8. Alternatively, the ink coating can be concentrated on individual test contacts 3〇8. The ink coating can be formed, for example, by an inkjet printing action. The ink jet printing action operates (via a series of nozzles) to eject small ink drops onto a surface with high precision. The nozzles are part of a printhead that is reciprocally movable relative to the surface to be printed (e.g., by a step-by-step motor). The surface to be printed can also be moved relative to the print head. The ink can be printed in high resolution and in - or multiple colors. Ink jet printing actions can be facilitated by various techniques, such as piezoelectric or thermal ink jet printers, such as are known in the art. For example, t, a suitable inkjet print can be obtained via a supplier such as Keene, NHuarkem~Caf (10). Although the test contact fans can be arranged as a two-dimensional array of test contacts as illustrated in Figure 3, it should be understood that the test contacts can be more generally arranged in any aspect of the memory card or in any of a wide variety of configurations. ―On the surface. Test contact 125911.doc -14- 200835413 pieces may also be provided on more than one side or surface of the memory card. The number of test contacts can also vary depending on the implementation (e.g., test needs or requirements). 5 and 6 illustrate a memory card 5 in accordance with an embodiment of the present invention. The memory card 500 has a rear side 502 and a front side 504. In Figure 5, the back side 502 of the memory card 500 is depicted. In Fig. 6, a cross-sectional view of the memory card 5A is depicted. The back side 502 of the memory card 500 includes an I/O contact 506 and an ink-coated region 508. As shown in Figure 6, the ink-coated region 508 coats all of the test contacts 510 in a single continuous ink zone. Test contact 51 is provided at rear side 502 of circuit board 512. I/O contact 506 is also provided at rear side 502 of circuit board 512. Circuit board 502 also includes a front side 5 14 . The semiconductor die 5 16 is attached to the front side 514 of the circuit board 5 12 . A plurality of wire bonds 518 can be used to electrically connect the semiconductor die 516 to the circuit board 512 via bond pads 520 provided at the front surface 514 of the circuit board 512. A plate compound 522 can be formed around the semiconductor die 516 and the wire bond 518 to form the front side 504 of the memory card 500. As shown in FIG. 6, the edges of the ink coating region 508 are circular. Assuming that a memory card such as memory card 500 is typically inserted into and removed from various consumer electronic devices, the presence of the rounded edge of ink coating 5〇8 is advantageous because of A comparison of technical methods not only results in less frictional resistance to insertion or withdrawal but is less likely to cause obstruction or interference. The front side 504 of the memory card 500 is a formed molding compound 522 that surrounds the semiconductor die 516, the wire bond 518, and the remainder of the front surface 514 of the circuit board 512. Molding compound 522 thus forms the front of memory card 500 (including front side 504). Circuit board 512 forms the rear of memory card 500 (including the back side 125911.doc -15-200835413 502). Figure 7 illustrates a cross-sectional view of a memory card 700 in accordance with an embodiment of the present invention. It is said that the 5th memory card 7〇〇 in the middle of the month is substantially similar to the note L card illustrated in FIG. 6 , and the 5 card memory card 7 further includes an attached to the semiconductor die 5 16 . A second semiconductor die 524 of the surface. For example, an adhesive layer (not shown) may be provided between the semiconductor germanium 5 16 and the second semiconductor die 524. The wire bond 518 electrically charges the semiconductor die 516 Connected to a die pad 52A provided on a front surface 514 of the circuit board 512. The wire bond 526 electrically connects the semiconductor die 524 to a die pad 528 provided on the front surface 514 of the circuit board 512. In an embodiment The semiconductor die 516 can be associated with a memory array that provides data storage, and the second semiconductor die 524 can provide a controller for controlling access to the memory array via the I/O contact 506. Figure 9 illustrates a memory card 8 in accordance with another embodiment of the present invention. Memory card 800 has a rear side 802 and a front side 804. Memory card 800 rear side 802 is illustrated in Figure 8. In Figure 9, illustrated A cross-sectional view of memory card 800. Memory card 800 rear side 802 includes a plurality of I/Os Contact 806. Further, memory card 800 rear side 802 includes a plurality of ink deposits 808. Ink deposits 808 are provided on electrical contacts 810, respectively. For example, electrical contacts 810 provided below ink deposits 808 can be similar to the figures. The electrical contacts 308 are arranged as described in 3. The memory card 800 rear side 802 is the rear side of the circuit board 812. The front side 814 of the circuit board 812 has semiconductor die 816 attached thereto. The semiconductor die 816 is bonded by wires 818. Connected to a die pad 820 provided on front surface 814 of circuit board 8 12. 125911.doc • 16- 200835413 Memory card 800 front side 804 is formed molding compound 822 that surrounds semiconductor die 816, wire bond 818 And the remainder of the front surface 814 of the circuit board 812. The molding compound 822 thus forms the front of the memory card 8 (including the front side 804). The circuit board 812 forms the rear of the memory card 800 (including the back side 802). The ink deposits 808 are deposited on the respective test contacts 81A on the back side 802 of the memory card 800. By controlling the amount of ink applied to each of the electrical contacts 810, the back side 8〇 The surface of 2 may be substantially π flat, especially when the test contact 81 is slightly recessed within the back side 802 of the circuit board $12. It may vary depending on the embodiment of the ink utilized to provide ink coating or ink deposition. In one embodiment, the test contact is formed of a conductive metal such as gold or copper. In this case, an example of a mouth-to-ink that provides an ink that adheres to the metal is commercially available from Markem Corporation of Keene, 且, and It can be called uv curing ink. In one embodiment, the ink may comprise 40-60% by weight of a cycloaliphatic epoxy resin. Alternatively, a less expensive ink can be utilized by providing a preliminary coating on the test contact. The preliminary coating will be designed to adhere to the test contact and thus permit the ink to adhere to the preliminary coating. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a flow diagram of a final assembly process in accordance with an embodiment of the present invention. The final assembly process 1000 provides an assembly station 1〇〇2. At the assembly station 1002, a plurality of memory cards can be assembled in the automatic batch processing. In this regard, a circuit board having I/O contacts and test contacts can be provided, one or more semiconductor dies can be placed in contact with the first side of the circuit board, and a 125911.doc -17- 200835413 A molding compound can be formed on at least one side of the circuit board to seal the or the semiconductor dies. The second side of the board provides 1/〇 contacts (for example, I/O pins) and test contacts (for example, test pins). Once the assembly has been completed at the assembly station 1002, the assembled memory card is directed to the split table. The memory card can be divided into individual memory cards by deleting it at the split table. Usually, the memory card is assembled as a memory card strip at the assembly station H)〇2. The dividing station 1GG4 is operable to cut the memory card strip into individual memory cards. In the knife. After 1004, test benches 1〇〇6 can be provided to test individual memory cards. Here, the test station 1 〇 06 can utilize the test contacts that have been formed on the memory card for testing. Assuming that the test is successfully completed for the memory card, the memory card is then directed to the printing station 1〇〇8. At the printing station (10) 8, ink is printed on the back side of the memory card to cover the test contacts.纟 The ink has been printed on the back side of the card to cover the test contact, and the memory card is guided to the ultraviolet (UV) stage 1010. At UV^1G1(), the ink that has been applied to the back side of the memory card is exposed to uv radiation to chemically activate the curing of the ink. In this embodiment, the ink is a uv-cured ink. Thereafter, the memory card is supplied to #, , , port 1 〇 12. At the hot stage J 〇 J 2, the force σ heat (or baking) is stored for a predetermined period of time to accelerate the solidification of the dispensed ink. Figure 11 is a diagram showing the capture of an electronic device card manufacturing process 1100 in accordance with an embodiment of the present invention. The electronic device card manufacturing process initially provides a plurality of electronic device cards having exposed test contacts. The plurality of electronic device cards provided (10) can be provided as an array of individual electronic device cards, adjacent electronic device cards, or an array of electronic device cards. The strip or array of electronic devices can then be segmented into individual electronic device cards. 125911.doc -18- 200835413 At this stage of manufacture of the electronic device card, the electronic device card is substantially complete and has been successfully tested. Therefore, the exposed test contacts no longer need to be exposed and can now be protected. Therefore, the electronic device card manufacturing process 11 is then coated with an ink coating on the exposed test contacts of the electronic device card. Thereafter, the cured ink 1106 has been coated with 1104 ink on the electronic device card. The curing process changes depending on the composition of the ink. In one embodiment, the ink is a uv curable ink. In this case, the curing enthalpy of the ink 6 can be chemically activated by the UV radiation, and the curing treatment can be followed by a (or baking) treatment to accelerate the curing treatment. For example, uv exposure can last from 4 to 20 seconds and the baking process can take about twenty (2 inches) minutes at about 14 Torr. After block 1106, the electronic device card manufacturing process 11 ends, wherein an electronic device card in the final form of the electronic device card is generated. Figure 12 is a flow diagram of a memory card manufacturing process 12A in accordance with an embodiment of the present invention. The memory card manufacturing process 1200 is, for example, an embodiment of the electronic device card manufacturing process 1100 illustrated in FIG. Memory card manufacturing process 1200 initially manufactures 1202 **Recall card strips with exposed test contacts. Then, the knee is poor, 4 is over, and her is A.

Mask the test contacts. L ink. The printed ink can be used to hide or otherwise, the printed ink can carry text and/or graphics for labeling, marking, sales, and the like. In the case of κ, the ink printed on the memory card 1208 is 11¥cured 12591I.doc -19- 200835413 ink. Thus, in this embodiment, the 1210 ink is cured by first applying uv radiation to the ink printed on the memory card and then applying heat to the ink to accelerate the curing process. Included within the scope of the present invention is the possibility of performing the various steps of Figures 11 and 12 at different times and at different physical locations. Additional information regarding the peripheral card is provided in (1) U.S. Patent Application Publication No. 2005_0013106 A1, entitled "PERIPHERAL CARD WITH HIDDEN TEST PINS", incorporated herein by reference; and (ii) incorporated by reference. </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> <RTIgt; These features and advantages will be apparent to those skilled in the art, and the invention is not limited to the precise construction and operation as illustrated and described. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 and FIG. 2 illustrate a memory card in accordance with an embodiment of the present invention. FIGS. 3 and 4 illustrate an implementation in accordance with an embodiment of the present invention. Example of a memory card. Figures 5 and 6 illustrate a memory card in accordance with an embodiment of the present invention. Figure 7 illustrates a memory card in accordance with the present invention. A cross-sectional view of a memory card of an embodiment. Figures 8 and 9 illustrate a memory card in accordance with another embodiment of the present invention. Figure 10 is a flow diagram of a final assembly process in accordance with an embodiment of the present invention. 125911.doc • 20-200835413 Figure 11 is a flow chart showing the manufacturing process of an electronic device card according to an embodiment of the present invention. - Figure 12 is a flow chart showing the process of manufacturing a memory card according to an embodiment of the present invention. [Description of Main Components] 100 Memory Card 102 Rear side • 104 Input/output (I/O) contacts 106 Ink coating 108 Front side 3 00 Memory card 302 Rear side 3 04 Front side 306 I/O contact 308 Test contact — 310 Front side of circuit board 312. 314 Semiconductor die 316 wire bond 318 bond pad, 500 00 memory card 5 02 rear side 504 front side I25911.doc -21- 200835413 506 I/O contact 508 ink coating zone 510 test contact 512 circuit board 514 front side 516 Semiconductor die 518 Wire bond 520 Bond pad 522 Mold compound 524 Second semiconductor die 526 Wire bond 528 Grain profile 700 Memory card 800 Memory card 802 Rear Side 804 Front Side 806 I/O Contact 808 Ink Deposition 810 Electrical Contact 812 Circuit Board 814 Front Side 816 Semiconductor Die 818 Wire Bonding 820 Grain Overview 125911.doc -22- 200835413 822 Molding Compound 1002 Assembly Table 1004 split table 1006 test stand 1008 printing station 1010 ultraviolet (UV) station 1012 hot station 125911.doc .23-

Claims (1)

200835413 X. Patent Application Scope 1. A memory card comprising: a circuit board having a front side and a rear side, the front side comprising at least one die attach pad, and the rear side comprising 1/0 contact And (4) a contact member; at least one semiconductor die attached to the front side of the circuit board, the at least one semiconductor die electrically connected to the die attach pad of the circuit board; sealing the at least one semiconductor die and a molding compound on the front side of the circuit board; and an ink coating provided on the test contacts on the rear side of the circuit board but not on the rear side of the circuit board These contacts are on. 2. A memory card as claimed, wherein the ink coating is printed on the test contacts on the rear side of the circuit board. 3. The memory card of claim 1, wherein the ink coating is printed on the test contacts after the test contacts have been used to test the memory card. (^ The memory card of claim i, in the case where the test contacts have been used to test the memory card, the ink coating is printed on a region surrounding the test contacts. The memory card of claim 4, wherein the ink coating printed on the area has a rounded edge. 6. The memory card of any of items 1 to 5, wherein the ink coating is isolated The test contact is electrically coupled to any external one. 7. The memory card of any one of clauses 1 to 5, wherein the ink coating is protected by 125911.doc 200835413 The test contacts are not affected by electrostatic discharge. The memory card of any one of claims 1 to 5, wherein the rear side of the circuit board has a first color, and wherein the ink for the ink coating has the first color. The memory card of any one of 1 to 5, wherein the ink coating protects the test contacts from electrostatic discharge, and wherein the ink coating is provided in a plurality of different colors to provide - or more on the memory card Mark 0 10. The memory card of claim 9, wherein the target name or one or more of the trademarks. 11 · If you want to use any of items 1 to 5 ★ one, σ思卡', the ink coating uses a UV curable ink. 1: A method for manufacturing a memory card, the method comprising: manufacturing a plurality of memory cards, test contacts in the memory cards; and - having an exposure test for the exposure contacts Memory card on the memory card _ # Α _ ~, water. ...the method of printing ink on the test contact of the exposure method, such as the method of claim 12, +, the method, wherein the printing will be on the area of the exposed test contact. The μ P is brushed around a 14. The method of claim 12, the first side and the - the first (four) card each have a - contact and an I/O contact. For /, there is a test for this special exposure 15 · as in the case of claim 14 'where the printing will be 125911.doc 3 ink is printed on the second 200835413 side to cover at least the exposed test contacts but contact Pieces. The method of claim 12, the method of claim 12, the manufacturing of the basin, and the manufacture of the card comprises: manufacturing the memory card as a memory card strip; and striping the strip Split into individual memory cards. 17. The method of claim 12, wherein the method further comprises: curing the ink that has been printed on the exposed test contacts. The method of claim 17, wherein the curing comprises: printing the ink Exposure to ultraviolet radiation; and subsequent heating of the ink. The method of any one of claims 12 to 18, which is carried out using a plurality of different color inks. 20. The method of any one of claims 12 to 18, wherein the ink delivery is performed. Wherein the printing of the ink, wherein the printing uses a spray 21, as in the method of claim 20 Wherein each of the memory cards has a first side 'where the second side has the exposed test connectors, and one side and a second contact and I/O contact wherein the printing prints ink The printing of the second exposed test contact but not surrounding the 1/0 of the ink comprises: 22. The method of claim 12, wherein the liquid is on the memory card; and the side is at least around an area of the one of the exposed contacts. Printing the ink on the liquid and the exposed test contacts 125911.doc 200835413 23. The method of claim 22, wherein the first liquid adheres to at least the exposed test contacts, and the ink Adhered to the first liquid. An electronic data system comprising: a data acquisition device; and a data storage device detachably coupled to the data acquisition device, the data storage device storing data obtained by the data acquisition device, and the tribute The storage device includes at least: a circuit board having a first side and a second side, the first side includes a die attach pad, and the second side includes a 1/0 contact and a test contact; At least one semiconductor die on the first side of the circuit board, the at least-semiconductor die being electrically connected to the die attach pads of the circuit board; the at least one semiconductor die and the first of the circuit board a molding compound on one side; and an ink coating provided on the test contacts on the second side of the circuit board but not on the second side of the circuit board /O contact on the piece. The electronic system of claim 24, wherein the at least one semiconductor die comprises a memory array, the memory array comprising a plurality of data storage elements. The electronic system of claim 24, wherein the data storage device is Data storage device. High 27· The electronic system of claim 24, wherein the data storage device is a 911 125911.doc 200835413 type memory card. 28. An electronic system memory element as claimed in claim 27. 29. An electronic device electronic device as claimed in claim 27. Wherein the data storage component is non-volatile, wherein the data acquisition device is a consumer electronic device, such as the electronic system of claim 29, wherein the electronic device is one of: - network card or web application, - Handheld computer or notebook computer, video converter, a handheld or other small media device and a medical monitor. 3 1 - an integrated circuit product by operating a bank in a batch, the operations comprising at least: ... a plurality of execution individual individual lead frames or substrates having a plurality of execution entities, the 5 turns wire frame or substrate Each of the execution entities has test contacts and input/output (1/〇) contacts; one or more die attaches to the 引线 仃 individual lead frame or substrate Each of the execution entities on at least one side; electrically connecting the I-I female of the or the dies to the respective execution individual of the lead frame or substrate; Forming the compound together to seal the plurality of execution individuals of the plurality of individual lead frames or plates to Vf, wherein the test contacts and the 1/0 contacts remain exposed; then dividing the plurality of execution entities Each of the plurality of execution individuals is tested using the exposed test contacts; and 125911.doc 200835413 Printing ink on the exposed test contacts on the plurality of execution individuals' By this For the manufacture of the plurality of instances of the at least one integrated circuit for the products. 32. If the product of the claim 31 is obtained, the operation further comprises: The ink that has been printed on the test contacts is cured. 33. The integrated circuit product of claim 32, wherein the curing comprises exposing the printed ink to ultraviolet radiation; and subsequently heating the ink. Wherein the printing of the ink is performed using a plurality of different color inks using an ink jet transfer, such as the integrated circuit product of claim 31. 35. If the integrated circuit product of claim 31 is delivered, it is executed. The integrated circuit of the present invention is a memory card. The integrated circuit product circuit product of any one of claims 31 to 35 is a memory card. 37. The integrated circuit product circuit product of any one of claims 31 to 35, which is a removable peripheral card. 3 8 - an integrated circuit product comprising: a circuit board having a front side and a rear side, the lower side includes a die attach pad, and the rear side includes a 1/0 contact and a test contact Attached to the at least one semiconductor die of the front side of the circuit board, the at least one semiconductor die electrically connected to the #double <4 die attach pad of the circuit board; 125911.doc 200835413 a molding compound sealing the at least one semiconductor die and the front side of the circuit board; and an ink coating provided on the test contacts on the rear side of the circuit board but not provided on the circuit The I/O contacts on the back side of the board. 125911.doc