WO2008051838A3 - Portable memory devices and method therefor - Google Patents
Portable memory devices and method therefor Download PDFInfo
- Publication number
- WO2008051838A3 WO2008051838A3 PCT/US2007/081924 US2007081924W WO2008051838A3 WO 2008051838 A3 WO2008051838 A3 WO 2008051838A3 US 2007081924 W US2007081924 W US 2007081924W WO 2008051838 A3 WO2008051838 A3 WO 2008051838A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- integrated circuit
- circuit products
- test contacts
- memory devices
- method therefor
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10159—Memory
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007800390316A CN101542507B (en) | 2006-10-20 | 2007-10-19 | Portable memory devices and method therefor |
KR1020097010131A KR101121422B1 (en) | 2006-10-20 | 2007-10-19 | Portable memory devices and method therefor |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/551,402 US7928010B2 (en) | 2006-10-20 | 2006-10-20 | Method for producing portable memory devices |
US11/551,423 US8013332B2 (en) | 2006-10-20 | 2006-10-20 | Portable memory devices |
US11/551,402 | 2006-10-20 | ||
US11/551,423 | 2006-10-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2008051838A2 WO2008051838A2 (en) | 2008-05-02 |
WO2008051838A3 true WO2008051838A3 (en) | 2008-06-12 |
Family
ID=39267447
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2007/081924 WO2008051838A2 (en) | 2006-10-20 | 2007-10-19 | Portable memory devices and method therefor |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR101121422B1 (en) |
TW (1) | TWI407860B (en) |
WO (1) | WO2008051838A2 (en) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4713298A (en) * | 1985-03-15 | 1987-12-15 | M&T Chemicals Inc. | Printed circuit boards having improved adhesion between solder mask and metal |
EP0581284A2 (en) * | 1992-07-30 | 1994-02-02 | Mitsubishi Denki Kabushiki Kaisha | Non-contact IC card and manufacturing and testing methods of the same |
US5512712A (en) * | 1993-10-14 | 1996-04-30 | Ibiden Co., Ltd. | Printed wiring board having indications thereon covered by insulation |
US20020131251A1 (en) * | 2001-03-16 | 2002-09-19 | Corisis David J. | Semiconductor card and method of fabrication |
US20040259291A1 (en) * | 2003-06-23 | 2004-12-23 | Sandisk Corporation | Method for efficiently producing removable peripheral cards |
US20050013106A1 (en) * | 2003-07-17 | 2005-01-20 | Takiar Hem P. | Peripheral card with hidden test pins |
WO2005091811A2 (en) * | 2004-03-03 | 2005-10-06 | Markem Corporation | Jettable ink |
EP1624001A1 (en) * | 2003-05-09 | 2006-02-08 | Taiyo Ink Manufacturing Co. Ltd | Photocuring/thermosetting inkjet composition and printed wiring board using same |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4649009B2 (en) * | 2000-03-08 | 2011-03-09 | 株式会社東芝 | Information processing apparatus having a card interface, card-type electronic equipment that can be mounted on the apparatus, and operation mode setting method in the apparatus |
TWI249712B (en) * | 2001-02-28 | 2006-02-21 | Hitachi Ltd | Memory card and its manufacturing method |
US7410240B2 (en) * | 2004-03-04 | 2008-08-12 | Fujifilm Corporation | Inkjet recording head and inkjet recording apparatus |
US20060020469A1 (en) * | 2004-07-08 | 2006-01-26 | Rast Rodger H | Apparatus and methods for static and semi-static displays |
KR100761991B1 (en) | 2006-11-06 | 2007-09-28 | (주) 한맥 Eng | Rfid tag for sealing using slot antenna |
-
2007
- 2007-10-19 TW TW096139339A patent/TWI407860B/en not_active IP Right Cessation
- 2007-10-19 KR KR1020097010131A patent/KR101121422B1/en active IP Right Grant
- 2007-10-19 WO PCT/US2007/081924 patent/WO2008051838A2/en active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4713298A (en) * | 1985-03-15 | 1987-12-15 | M&T Chemicals Inc. | Printed circuit boards having improved adhesion between solder mask and metal |
EP0581284A2 (en) * | 1992-07-30 | 1994-02-02 | Mitsubishi Denki Kabushiki Kaisha | Non-contact IC card and manufacturing and testing methods of the same |
US5512712A (en) * | 1993-10-14 | 1996-04-30 | Ibiden Co., Ltd. | Printed wiring board having indications thereon covered by insulation |
US20020131251A1 (en) * | 2001-03-16 | 2002-09-19 | Corisis David J. | Semiconductor card and method of fabrication |
EP1624001A1 (en) * | 2003-05-09 | 2006-02-08 | Taiyo Ink Manufacturing Co. Ltd | Photocuring/thermosetting inkjet composition and printed wiring board using same |
US20040259291A1 (en) * | 2003-06-23 | 2004-12-23 | Sandisk Corporation | Method for efficiently producing removable peripheral cards |
US20050013106A1 (en) * | 2003-07-17 | 2005-01-20 | Takiar Hem P. | Peripheral card with hidden test pins |
WO2005091811A2 (en) * | 2004-03-03 | 2005-10-06 | Markem Corporation | Jettable ink |
Also Published As
Publication number | Publication date |
---|---|
KR20090086220A (en) | 2009-08-11 |
WO2008051838A2 (en) | 2008-05-02 |
TWI407860B (en) | 2013-09-01 |
TW200835413A (en) | 2008-08-16 |
KR101121422B1 (en) | 2012-03-22 |
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