TW200833198A - Flexible printed wiring board - Google Patents

Flexible printed wiring board

Info

Publication number
TW200833198A
TW200833198A TW96143126A TW96143126A TW200833198A TW 200833198 A TW200833198 A TW 200833198A TW 96143126 A TW96143126 A TW 96143126A TW 96143126 A TW96143126 A TW 96143126A TW 200833198 A TW200833198 A TW 200833198A
Authority
TW
Taiwan
Prior art keywords
wiring board
flexible printed
printed wiring
metal foil
reinforcement
Prior art date
Application number
TW96143126A
Other languages
Chinese (zh)
Other versions
TWI347156B (en
Inventor
Katsuyoshi Iizuka
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW200833198A publication Critical patent/TW200833198A/en
Application granted granted Critical
Publication of TWI347156B publication Critical patent/TWI347156B/zh

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

An object of the present invention is to prevent air bubble from remaining in reinforcement patterns of a waste part provided around a product portion, when a reinforcement member is bonded to one side of a double-sided flexible printed wiring board with press equipment. The solution of the present invention is that a flexible printed wiring board in accordance with the present invention is provided with a product portion 51 in which wiring patterns are formed with a metal foil; and a waste part 52 provided around the product portion 51 and forming reinforcement patterns 10 of metal foil, wherein with one side of the flexible printed wiring board being put in contact with a reinforcement member 53 and a release-type member 59 abutting and superimposed on the other side, a press equipment is used to carry out pressing to bond the reinforcement member 54 so as to form the flexible printed wiring board. The reinforcement patterns 10 of the waste part 52 provide in some places metal foil removal parts 11 in front and rear sides of the flexible printed wiring board in an opposite manner, and a metal foil removal part 11A on one side bonding the reinforcement member 53 is formed to be wider than a metal foil removal part 11B on the other side.
TW96143126A 2007-01-19 2007-11-15 Flexible printed wiring board TW200833198A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007010631A JP4874818B2 (en) 2007-01-19 2007-01-19 Flexible printed wiring board

Publications (2)

Publication Number Publication Date
TW200833198A true TW200833198A (en) 2008-08-01
TWI347156B TWI347156B (en) 2011-08-11

Family

ID=39704221

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96143126A TW200833198A (en) 2007-01-19 2007-11-15 Flexible printed wiring board

Country Status (3)

Country Link
JP (1) JP4874818B2 (en)
CN (1) CN101227795B (en)
TW (1) TW200833198A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5379710B2 (en) * 2010-01-29 2013-12-25 日東電工株式会社 Method for manufacturing flexible printed circuit board with reinforcing layer
CN113611214B (en) * 2021-08-04 2023-07-18 京东方科技集团股份有限公司 Support structure, flexible display device and attaching method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001326429A (en) * 2000-05-17 2001-11-22 Sony Corp Printed wiring board
JP2002289984A (en) * 2001-03-26 2002-10-04 Olympus Optical Co Ltd Double-sided flexible board and camera having the same
JP4381864B2 (en) * 2004-03-31 2009-12-09 信越ポリマー株式会社 Substrate fixing jig
JP4511401B2 (en) * 2005-03-29 2010-07-28 日本メクトロン株式会社 Flexible printed circuit board and manufacturing method thereof

Also Published As

Publication number Publication date
CN101227795B (en) 2012-03-21
TWI347156B (en) 2011-08-11
CN101227795A (en) 2008-07-23
JP4874818B2 (en) 2012-02-15
JP2008177433A (en) 2008-07-31

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees