TW200830340A - Coating layer material of electronic device - Google Patents

Abstract

This invention relates to a coating layer material of an electronic device. The coating layer material comprises organic materials which have high malleability and mechanical buffering capability, and electrically conductive material; therefore, the electronic device can be manufactured with low cost and low temperature. The organic material comprises thermosetting resins and organic additives. The electrically conductive material comprises conductive metal powder and inorganic mixtures. Since this invention uses the thermosetting resins, a low temperature manufacturing method can be applied to the electronic device, thereby reducing the cost of the electronic device. In addition, low temperature manufacture can avoid the heat stress damage caused by the high temperature operation. The malleability and mechanical buffering capability of the electronic device are improved so that the electronic device can be combined with other electronic device stably and be resistive to the outside stress.

Description

200830340 IX. Description of the Invention: [Technical Field] The present invention relates to a coating material of an electronic component, in particular to a coating material of an electronic component having the same ductility and mechanical buffering property, so that the electronic component can Manufacturing at low temperatures to reduce costs. [Prior Art]

An electronic component such as a laminated ceramic capacitor disposed on a circuit board includes a stacked body and a coating layer coated on the stacked body. The stacked system is formed by stacking a plurality of ceramic layers and a plurality of internal electrode layers. Adjacent internal electrode layers are respectively E for the stack, and 涂, the coating layer is coated on both ends of the stack to contact the internal electrode layer, thereby forming a parallel circuit.

The traditional internal electrode material is expensive silver, palladium and other precious metals, but due to cost considerations, the precious metal is replaced by a cheaper recording or copper, and the coating layer is made of copper which can be melted and alloyed with nickel. The material, the electron conduction of the electronic component is smoother. Then, the coating layer of the copper material is applied to both ends of the stack by a high-temperature combustion method, and the high-temperature combustion method requires only a high temperature of 60 generations or more. And the finished coating layer becomes very rigid' and is subjected to external impact and easily breaks or causes damage to the electronic component. ^Otherly, the coating layer of silver series polymer material is applied to the steel material or the silver material coating on both ends of the stack in a low I manner, so that the coating layer can be improved and the mechanical buffer can be improved. Sex, but because the conventional technology uses silver series polymer materials, _ can be processed after coating the silver material at the two ends of the stack, so there are high materials and manufacturing costs; however, 5 200830340 If the silver series polymer materials directly use the stack On the other hand, in addition to the high cost of the material itself, there is also a problem of poor compatibility between the film and the recording on the stack. Therefore, the coated reed using the silver-based polymer material cannot effectively function as an electronic component. Performance.曰 [Summary of the Invention] The present inventors have a high cost of using conventional electronic component materials, and "the performance of the two electronic components themselves or affecting them and other electronic components = constantly testing different materials, finally inventing the electronic The coating layer material of the present invention. The object of the present invention is to provide a coating of an electronic component which can be cooled at a low temperature and can be cooled at a low temperature to reduce the cost and improve the utility, :, = = The electric element=the component is directly connected as the external electrical component of the coating layer, so as to omit the electrode layer to reach the above (4), the coating of the electronic component of the invention has high ductility and mechanical cushioning property: electrical material::俾To make electricity... low-material and operating cost, low-temperature system: The above-mentioned low-temperature process means that the coating layer material can be cured at m temperature. The 380 C = machine waste system includes thermosetting resin and organic additives. Moreover, the low temperature = electrical material includes cold metal powder and inorganic blend. : The thermosetting resin material is used for the second, so that the electronic component can be replaced, thereby reducing the manufacturing cost of the electronic component. The 0830340 process avoids thermal stress damage caused by high temperature curing of electronic components and improves the ductility and mechanical cushioning of the electronic components, enabling them to be firmly bonded to other electronic components while resisting external stresses. [Embodiment]

The coating layer material of the electronic component of the invention has 10~60wt% organic material with high ductility and mechanical cushioning property and 4导电~9〇wt% of conductive material, so that the electronic component can be low cost And in the environment of 25t: less than 8xl 〇 1 ohm / cm (〇hm / cm) body resistance and low temperature process, the optimal weight ratio of the machine material is 15~45%, and the conductive material The most important range of weight ratio is 55~85%, and the better the body resistance is less than 5xl (T2 ohm/cm (〇hm/cm) in the Μ% worry, the best is the low in the C environment. 3xl (T3 ohm / cm (〇hm / cm). The above electronic components include capacitors such as ceramic capacitors or crystal: resistors, the ceramic capacitors also include laminated ceramic capacitors and circular plates:;卜' The ceramic capacitor can also be BME-MLCC, s.: The low temperature process means that the coating layer material can be cured in mm and the degree of the dish. Magical = organic material includes thermosetting Resin and organic additives, including Buqun urea-formaldehyde resin, epoxy epoxide, melamine-曱骏 resin , at least one of the phenolic-formaldehyde phthalic acid T-residue resin, the unsaturated polyester, and the styrene-acrylic resin, the sorghum sorghum or its grafted copolymer, and the gossip organic additive are selected from at least # u τ Plasticizer, ,, heart - group below · tackifier, wetting agent, solvent, dispersant, defoamer and organic antioxidant 7 200830340 The conductive material includes conductive metal powder and inorganic blend The conductive metal powder is selected from the group consisting of at least one of copper powder, copper-containing material, copper-containing organic composite material, silver powder, silver-containing gold powder, silver-containing compound, and silver-containing compound. The organic composite material, the nickel powder, the nickel-containing Q gold powder, the nickel-containing compound, the nickel-containing organic composite material, and the raw material of the above copper, silver or nickel alloy powder, in addition to copper, silver or nickel, includes at least Group of metal powders: su, silver, tin, steel, rhodium, money, snake, magnesium, aluminum, lead and alloys thereof or compounds thereof; the conductive metal powder may be spheres, powders, tablets & powders or Other irregular powders; 〇.〇1515, the preferred particle size range is: the average particle size range of the dimorphic powder is 0. Bu 5〇μιη, preferably the average particle range is also D.3~30 called; and the irregularity The average particle size range of the powder is 0·〇1~30μιη, and the preferred average particle size range is 〇.11〇(4). It is selected from the group consisting of gallium, §, and its alloys or their compounds and inorganic The blend is a low-melting point metal, a surface, tin, indium, zinc, cadmium, bismuth, magnesium, and a mineral. The coating layer material of the present invention has a weight percentage of the material of the coating layer, and can be expressed as an organic material and a conductive material.

8 200830340 Lead (inorganic blend) 〇· 1 - R sesame oil brain (organic additive 1) ------ -------- \J "------ _ 3-7 Bonding Agent (Special 1 Additive 2) ----- __Li5 Dispersant (Organic Additive 3) ~-----~~-^-_ Example 1 Please refer to the figure-picture, which has a four-layer a laminated Tauman capacitor (1〇) of the outer electrode layer outside the structure, comprising a stack (work 1) and an outer end electrode i disposed at the # end of the stack (1 1), the stack body (11), The at least three dielectric layers (112) and the at least two internal electrode layers (1 1 1 ) are alternately stacked, and the adjacent internal electrode layers (1 1 1 ) are respectively exposed at the ends of the stacked body (ii). The outer electrode layer includes an electrode layer (1 2 ), a resin metal I (1 3 ), a protective layer ("), and a conductive layer (15), and the electrode layer (12) is wrapped in the stacked body (1 1 Both ends are in contact with the inner electrode layer (1), and the resin metal layer (i 3 ) is coated on the outer side of the electrode layer (work 2), and the resin metal f (13) is thermoset. Resin and metal composite material, and the metal composite material The proportion is 30% by weight to 70% by weight of the entire resin metal layer (3), and the protective layer (丄4) is disposed on the outer side of the resin metal layer (13). The protective layer (丨4) can be recorded. a metal material, and the conductive layer (15) is soldered to the outside of the protective layer (14), which may be a tin metal material, and is characterized by: a material of the electrode layer (12) The coating layer material of the present invention is used, and the thickness thereof is 0. 卜 800 μιη, the preferred thickness range is jjoo (4), and the optimum thickness range of 9 200830340 is 5 to 400 _.

Referring to the second figure, a multilayer ceramic capacitor (20) having a terminal electrode layer including a three-layer structure is substantially the same as that of Embodiment 1 above, and includes a stacked body (2i) and a setting. An outer electrode layer at both ends of the stack (2 1 ), the stack (2 i ) is composed of at least two dielectric layers (2 1 2) and at least two inner electrode layers (2丄丄) And each adjacent internal electrode layer (2丄丄) is exposed at both ends of the stack S body (2]_), but in order to reduce the thickness of the outer end electrode layer and the manufacturing cost of the laminated ceramic capacitor (2 〇) Therefore, the outer electrode layer includes a resin metal layer (2 2 ) having a ductility and conductivity, a good layer (23), and a conductive layer (24) coated on the stack. Both ends of the body (2 1 ) are in contact with the inner electrode layer, the protective layer (23) is disposed outside the resin metal layer (2 2 ) and the conductive layer (2 4 ) is soldered. Wrapped on the outer side of the protective layer (23), characterized in that the resin metal layer (2 2 ) is a coating layer material of the present invention. , the thickness range is 0. 卜 800 叩, the preferred thickness range is 5 〇〇 _, and the optimum thickness range is 5 to 400 μπι. In the embodiment of the present invention, not only the thickness of the outer electrode layer but also the cost can be reduced, and the coating layer of the present invention can be used to reduce the thermal stress damage caused by the high temperature curing of the laminated ceramics (20). And the "ductility" and mechanical cushioning of the laminated Tauman capacitor (20) enables::: 200830340 to be firmly combined with other electronic components such as circuit boards, and at the same time resist external stress. [Simplified description] 1 is a schematic view of another embodiment of the present invention. The second drawing is a schematic view of another embodiment of the present invention. [Description of Main Components] (10) (20) Stacked Ceramic Capacitor (1 1 ) ( 2 1 ) Stack • ( 1 1 1 ) ( 2 1 1 ) Internal electrode layer (112) (212) Dielectric layer (12) Electrode layer (13) ( 2 2 ) Resin metal layer (14) ( 2 3 ) Protective layer (15) ( 2 4 ) Conductor layer ❿ 11

Claims (1)

200830340 X. Patent application scope: A coating material for an electronic component, an organic material, which comprises a thermosetting system, comprising: a resin and an organic additive 2 material, a conductive material. • In the scope of claim 1, wherein the electrically conductive material comprises the coated electronically conductive metal powder of the electronic component and the inorganically doped laminate. 3. A coating material of an electronic component as described in claim 2 or 2 wherein the weight percentage of the organic material is in the range of Μ, . And the weight percentage of the conductive material ranges from 4G to 9Qwt% to form a coating layer material having a weight of 100% by weight. 4. The coating layer material of the electronic component according to claim 3, wherein the organic material weight percentage ranges from 15 to 45 wt%, and the weight percentage of the wrap material ranges from 55 to 85 wt%. Weight 100% by weight of the coating layer material. 5. The coating layer material for an electronic component according to claim 1, wherein the thermosetting resin is selected from the group consisting of urea-formaldehyde resin, epoxy resin, melamine-formaldehyde resin, and phenol-furfural resin. At least one compound of unsaturated polyester and diacrylic acid acrylate resin or a blend thereof or a copolymer thereof. The coating layer material of the electronic component according to claim 1, wherein the organic additive is selected from the group consisting of at least one of the following: a tackifier, a plasticizer, a wetting agent, a solvent, a dispersant , defoamer and organic 12 200830340 antioxidants. 7. The coating material of the electronic component according to claim 2, wherein the electric metal powder is selected from the group consisting of at least one of: steel, copper alloy powder, copper-containing compound, copper-containing Organic house materials. The coating layer material for an electronic component according to claim 2, wherein the conductive metal powder is selected from the group consisting of at least one of the following: silver enamel 3 silver & gold ruthenium, silver-containing compound, Silver organic composite. 9. The coating layer material of an electronic component according to claim 2, wherein the conductive metal powder is selected from the group consisting of at least one of the following: nickel s nickel & Meng Qin, nickel-containing compound, nickel-containing Organic composite material. The coating layer material of the electronic component according to claim 7 or 8 or 9, wherein the alloy powder further comprises at least one of the following groups: genus gallium, germanium, tin, indium, Zinc, cadmium, bismuth, magnesium, aluminum, lead and alloys thereof or compounds thereof. The coating material of the electronic component according to the second aspect of the invention, wherein the inorganic blend is a low melting point metal. 1 2 · The coating material of the electronic component as described in claim 1 wherein the 5H inorganic conjugate is selected from the group consisting of: silk, zinc, recorded, inscription, 鎭, Ming, and Alloy or its compound. The coating material of the electronic component according to claim 1 or 2, wherein the electronic component is a capacitor. The coating layer material of the electronic component according to claim 1 or 2, wherein the electronic component is a wafer resistor. 1 5 · Coating of electronic components as described in claim 13 of the patent application 13 200830340 wherein the capacitor is a ceramic capacitor. The coating of the electronic component described in claim 15 wherein the electric grid is a laminated ceramic capacitor. The coating of the electronic component according to claim 15 wherein the capacitor is a circular ceramic capacitor. Coating of an electronic component as described in claim i. 6 wherein the laminated ceramic capacitor is a tantalum ceramic capacitor 1 9 · The electronic component of the electronic component, the coating material, and the coating layer of the electronic component, wherein the electronic component has a terminal electrode layer including a four-layer structure. The laminated ceramic capacitor comprises: a stacked body and an outer electrode layer disposed at an end of the stacked body, the far outer end electrode layer comprising an electrode layer disposed on both sides of the stacked body, & disposed on the outer side of the electrode layer The resin metal layer, the protective layer disposed outside the metal layer, and the conductive layer disposed outside the protective layer. Layering material 16 Layering material 17 Layering material 18 Layering material. The coating layer material of the electronic component according to claim 1 or 2, wherein the coating layer is a resin metal layer of the electronic component, the electronic component having a three-layer structure outer end The laminated ceramic capacitor of the electrode layer 1 'the integrated ceramic E capacitor system includes a stacked body and an outer end electrode layer disposed at both ends of the stacked body'. The outer end electrode layer includes resin metal disposed on both sides of the stacked body [Setting a protective layer on the outer side of the resin metal layer and a conductive layer disposed on the outer side of the protective layer. Schema: 14