CN104103421A - Multilayer ceramic capacitor with buffer layer - Google Patents
Multilayer ceramic capacitor with buffer layer Download PDFInfo
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- CN104103421A CN104103421A CN201310127521.9A CN201310127521A CN104103421A CN 104103421 A CN104103421 A CN 104103421A CN 201310127521 A CN201310127521 A CN 201310127521A CN 104103421 A CN104103421 A CN 104103421A
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Abstract
The invention provides a multilayer ceramic capacitor with a buffer layer. The multilayer ceramic capacitor contains a stack body and two external electrode assemblies which are respectively arranged at two end portions of the stack body. Each external electrode assembly contains an electrode layer, a resin buffer layer, an electrode protective layer and an electrode conducting layer, wherein the resin buffer layer contains a thermosetting resin and a first conductive additive and also contains a second conductive additive. Thus, thickness of the electrode protective layer coated on the surface of the resin buffer layer by an electroplating mode is reduced. The multilayer ceramic capacitor has excellent resistance to external stress and has good soldering characteristics to solve damage to the capacitor due to external stress. In addition, the defect that a product catches fire or fails due to thermal expansion coefficient difference of the layers is also avoided.
Description
Technical field
The present invention relates to a kind of monolithic ceramic capacitor, especially a kind of structure with resin resilient coating, to be adapted to apply after external member the stress producing because of external environment condition or machining, to avoid producing the damaged or inner function of application external member or the reliability of causing from splitting of the outward appearance of described assembly and lose.
Background technology
Refer to shown in Fig. 2, traditional monolithic ceramic capacitor comprises storehouse body 30 and is coated on the external electrode assembly 40 at described storehouse body 30 two ends, described storehouse body 30 is made up of multiple dielectric layers 31 and the mutual storehouse of many inner electrode layers 32, each adjacent inner electrode layer 32 is exposed to respectively storehouse body 30 two ends, each external electrode assembly 40 contacts with corresponding inner electrode layer 32 respectively, and be respectively equipped with electrode layer 41 from storehouse body 30 direction outwardly, electrode protecting layer 42 and electrode conductive layer 43, form parallel circuits by contacting between electrode layer 41 and inner electrode layer 32, described electrode protecting layer 42 is coated on the another side of electrode layer 41 with respect to storehouse body 30, with avoid electrode layer 41 after melted erosion in the process of welding electrode conductive layer 43, and described electrode conductive layer 43 is coated on the opposite side of described electrode protecting layer 42 with respect to electrode layer 41 in the mode of electroplating, on itself and substrate, other electronic building brick is electrically connected.
In the process of electronic building brick encapsulation, first described monolithic ceramic capacitor is arranged on substrate, again other electronic building brick is arranged on described substrate, but, can make curved substrate distortion installing in the process of other electronic building brick, make monolithic ceramic capacitor bear external stress and cause storehouse body 30 to produce breaking, thereby destroy inner electrode layer 32, or make to produce and cause from splitting opening circuit between external electrode assembly 40 and storehouse body 30, cause product to catch fire or lost efficacy.
For fear of producing the problems referred to above, as shown in Figure 3, Taiwan patent provides a kind of for No. M381157 and has resilient coating to increase ductility and the elasticity of its external electrode assembly 50, and adapts to curved substrate and avoid producing fracture or the monolithic ceramic capacitor of flaw.Described external electrode assembly 50 is respectively equipped with electrode layer 51, resin resilient coating 52, electrode protecting layer 53 and electrode conductive layer 54 from its storehouse body 60 direction outwardly; Wherein, resin resilient coating 52 makes monolithic ceramic capacitor be arranged in application external member with being connected medium of electrode protecting layer 53 as electrode layer 51, and the material of described application external member can be aluminum substrate, epoxy glass fiber substrate (as FR-4) etc.
Because resin resilient coating 52 solidify to form through suitable heat treatment for paste or jelly that conductivity or non-conductive thermosetting resin hybrid conductive additive become, therefore can make monolithic ceramic capacitor possess good resistance for external stress, and there is good scolding tin characteristic, the breakage being produced because bearing external stress to solve capacitor, also avoids the shortcoming that between each layer, the difference because of thermal coefficient of expansion causes product to catch fire or lost efficacy.
But, in described Patent Case, if when the electrode protecting layer in its external electrode assembly 50 53 is implemented with plating mode with electrode conductive layer 54, because the conductivity of resin resilient coating 52 is poor than the electrode layer 41 of traditional monolithic ceramic capacitor, therefore in the time that its electrode protecting layer 53 forms with electrode conductive layer 54, the thickness of its electrode protecting layer 53 and electrode conductive layer 54 need be thicker than the thickness of the electrode protecting layer of traditional monolithic ceramic capacitor 42 and electrode conductive layer 43, to avoid the problem of scolding tin bad characteristic, but, instead thicker electrode protecting layer 53 makes the structure of described Patent Case decline for the shock-absorbing capacity of stress with electrode conductive layer 54, be difficult to adapt to external stress, as the phenomenon such as curved substrate or temperature change, easily produce fracture or flaw.
Wherein, utilizing and reduce thermosetting resin ratio or change metal species, implement the described patent structure of gained for the shock-absorbing capacity of stress to improve by plating mode, is all current known possible technique, but makes on the contrary the scolding tin deterioration in characteristics of described capacitor.
Therefore a kind of mode of the predicament that solves current technology urgently.
Summary of the invention
Because the monolithic ceramic capacitor of the structure with resin resilient coating of above-mentioned prior art; when its electrode protecting layer in external electrode assembly and electrode conductive layer are implemented with plating mode; the thickness of electrode protecting layer and electrode conductive layer is thicker, and the shortcoming that causes this structure to decline for the shock-absorbing capacity of stress.
The object of the present invention is to provide a kind of monolithic ceramic capacitor with resilient coating; it is under the prerequisite of conductive additive kind that need not change resin resilient coating; can there is better conductivity; and be minimized electrode protecting layer and the electrode conductive layer thickness of external electrode assembly; to adapt to external stress as the phenomenon such as curved substrate or temperature change, and then avoid producing fracture or flaw.
In order to reach aforesaid goal of the invention, the technological means that the present invention takes, for a kind of monolithic ceramic capacitor with resilient coating is provided, wherein comprises:
Storehouse body, it is made up of at least three dielectric layers and at least two mutual storehouses of inner electrode layer, and each adjacent inner electrode layer is exposed to respectively described storehouse body two ends; And,
Two external electrode assemblies, described two external electrode assemblies are arranged at respectively two ends of described storehouse body, and each external electrode assembly comprises electrode layer, resin resilient coating, electrode protecting layer and electrode conductive layer;
Described electrode layer is at least coated on the end of described storehouse body, contacts with the inner electrode layer that is exposed to described storehouse body opposite end;
Described resin resilient coating is coated on the outer surface of described electrode layer, it includes thermosetting resin, the first conductive additive and the second conductive additive, described the second conductive additive is metal, and the curing temperature of described thermosetting resin is higher than the fusing point of described the second conductive additive;
The coated outer surface that forms in described resin resilient coating of described electrode protecting layer;
The coated outer surface that forms in described electrode protecting layer of described electrode conductive layer.
Preferably, the content of described thermosetting resin is 12 to 50 percentage by weights (wt%), taking resin resilient coating total weight as basis.
Preferably, taking the weight summation of described the first conductive additive and described the second conductive additive as basis, the content of described the first conductive additive between 50 to 95wt%.
Preferably, the size of described the second conductive additive between 0.1 micron (μ m) to 100 microns (μ m) between.
Preferably, the fusing point of described the second conductive additive is between 100 to 300 DEG C.
Preferably, the thickness of described resin resilient coating between 0.1 micron (μ m) to 100 microns (μ m) between.
Preferably, the thickness of described electrode protecting layer between 0.1 micron (μ m) to 30 microns (μ m) between.
Preferably, described thermosetting resin is electroconductive resin, and described electroconductive resin comprises at least one and be selected from the thermosetting resin of the group being made up of polyacetylene class, polythiophene class, polypyrrole class, polyaniline compound and polyaromatic hydrocarbon ethene.
Selectively, described thermosetting resin is non-conductive resin, and described non-conductive resin system comprises at least one and be selected from the thermosetting resin of the group being made up of epoxy resin, phenolic resinoid, urea resin, the U.S. resin of resistance to ware, unsaturated polyester resin, silicone grease resin and polyurethane.
Preferably, described the first additive is selected from the group being made up of the conductive additive of metal species powder, metal species paillon foil, metal species fiber, carbon fiber and carbon class form; Wherein metal species powder, metal species paillon foil, metal species fiber comprise at least one and are selected from the material in the group being made up of nickel, silver, copper, palladium, its mixture and alloy thereof; Wherein the conductive additive of carbon fiber and carbon class form comprises at least one and is selected from the material in the group being made up of activated carbon, carbon fiber and carbon nano-tube.
Preferably, described the second conductive additive comprises at least one and selects the conducting objects in the group that free metal species powder, metal species paillon foil, metal species fiber form; Wherein the constituent of metal species powder, metal species paillon foil, metal species fiber is selected from least one material in the group being made up of tin, bismuth, lead, indium, its mixture and alloy thereof.
Preferably, described inner electrode layer be selected from by the powder of nickel, copper, silver, palladium, alloy, compound with and the group that formed of combination.
Preferably, described dielectric layer is formed by ceramic material.
Preferably, described electrode layer is formed by metal dust or its mixture of glass and copper, silver, nickel.
Preferably, described electrode protecting layer is made up of nickel.
Preferably, described electrode conductive layer is made up of tin.
The present invention by adding the second additive in resin resilient coating; can reduce the thickness of the electrode protecting layer of external electrode assembly; make thus monolithic ceramic capacitor according to the present invention possess comparatively good resistance for external stress; and there is good scolding tin characteristic; the breakage being produced because bearing external stress to solve capacitor, also avoids the shortcoming that between each layer, the difference because of thermal coefficient of expansion causes product to catch fire or lost efficacy.
Brief description of the drawings
Fig. 1 is the local side-looking generalized section of the monolithic ceramic capacitor with resilient coating of the present invention.
Fig. 2 is the local side-looking generalized section of the monolithic ceramic capacitor of prior art.
Fig. 3 is the local side-looking generalized section of the monolithic ceramic capacitor with resilient coating of prior art.
Symbol description
10 storehouse body 11 dielectric layers
12 inner electrode layer 20 external electrode assemblies
21 electrode layer 22 resin resilient coatings
23 electrode protecting layer 24 electrode conductive layers
30 storehouse body 31 dielectric layers
32 inner electrode layer 40 external electrode assemblies
41 electrode layer 42 electrode protecting layers
43 electrode conductive layer 50 external electrode assemblies
51 electrode layer 52 resin resilient coatings
53 electrode protecting layer 54 electrode conductive layers
60 storehouse bodies.
Embodiment
Refer to shown in Fig. 1, its preferred embodiment that is monolithic ceramic capacitor of the present invention, it comprises storehouse body 10 and is arranged at the external electrode assembly 20 of two ends of described storehouse body 10.
Refer to shown in Fig. 1, described storehouse body 10 is made up of at least three dielectric layers 11 and at least two mutual storehouses of inner electrode layer 12, and each adjacent inner electrode layer 12 is exposed to respectively the two ends of described storehouse body 10, described dielectric layer 11 is made up of ceramic material, the group that the group of the metal composition of described inner electrode layer 12 selects free nickel, nickeliferous alloy, nickel compound containing and nickeliferous organic composite material to form; Or the group that selects the organic composite material of alloy, copper-containing compound and the cupric of free copper, cupric to form; Or the group that selects free palladium, forms containing the alloy of palladium, containing palladium compound and containing the organic composite material of palladium.Preferably, the material of described inner electrode layer 12 is the paste that ceramic powders mixes with nickel metal powder.Preferably, described electrode layer 21 is formed by copper.
Refer to shown in Fig. 1, described external electrode assembly 20 comprises the four-layer structure of electrode layer 21, resin resilient coating 22, electrode protecting layer 23 and electrode conductive layer 24.
Refer to shown in Fig. 1, described electrode layer 21 is at least coated on the end of described storehouse body 10, contact with the inner electrode layer 12 that is exposed to described storehouse body 10 opposite ends, the constituent of described electrode layer 21 comprises at least one and is selected from the metal in the group being made up of copper, silver, platinum, palladium and gold; Furthermore, described electrode layer 21 is formed by metal dust or its mixture of glass and copper, silver, nickel.
Refer to shown in Fig. 1, described resin resilient coating 22 is coated on the outer surface of described electrode layer 21, and it mixes the first conductive additive by thermosetting resin and the second conductive additive is formed.Described thermosetting resin is electroconductive resin or non-conductive resin, and preferably, it is formed with printing or the form such as attach, and its thickness is 0.1 micron, and ((μ m) for m)～100 microns of μ.
Described electroconductive resin comprises at least one and selects the thermosetting resin of the group that free polyacetylene class, polythiophene class, polypyrrole class, polyaniline compound and polyaromatic hydrocarbon ethene forms.Described non-conductive resin comprises at least one and selects the thermosetting resin of the group that free epoxy resin, phenolic resinoid, urea resin, the U.S. resin of resistance to ware, unsaturated polyester resin, silicon resinoid and polyurethane form.
The group that described the first conductive additive selects the conducting objects of free metal species powder, metal species paillon foil, metal species fiber, carbon fiber and carbon form to form; Wherein metal species powder, metal species paillon foil, metal species fiber comprise at least one and select the material in the group that free nickel, silver, copper, palladium, its mixture and alloy thereof form; Wherein the conducting objects of carbon fiber and carbon form comprises at least one and is selected from the material in the group being made up of activated carbon, carbon fiber and carbon nano-tube.
Described the second conductive additive is a kind of low-melting-point metal, and it comprises at least one group that selects the conducting objects of free metal species powder, metal species paillon foil, metal species fiber to form; Wherein metal species powder, metal species paillon foil, metal species fiber comprise at least one and select the material in the group that free tin, bismuth, lead, indium, its mixture and alloy thereof form, furthermore, the characteristic requirements of described the second conductive additive is that melting range is between 100 to 300 DEG C, and wherein the melting range of preferred the second conductive additive is 130～250 DEG C; Size is 0.1 micron, and ((μ m),, for meeting the dimensions of external electrode, wherein preferred size is 1.0 microns ((μ m) for m)～60 microns of μ for m)～100 microns of μ.
Preferably, described resin resilient coating 22 is first conductive additive by the thermosetting resin of 12 to 50 percentage by weights, 25 to 83.6 percentage by weights, and the second conductive additive of 4.4 to 63.0 percentage by weights forms; Described thermosetting resin is made by epoxy resin and phenolic resinoid; Described the first conductive additive is metal species paillon foil and for copper, described the second conductive additive is metal species powder and is sn-bi alloy.More preferably, taking the weight summation of described the first conductive additive and described the second conductive additive as basis, the content of described the first conductive additive between 50 to 95wt%.
Refer to shown in Fig. 1; the coated outer surface that forms in described resin resilient coating 22 of described electrode protecting layer 23; its thickness is 0.1 micron, and ((μ m), optimum thickness is 2 microns ((μ m) for m)～20 microns of μ for m)～30 microns of μ.Preferably, described electrode protecting layer 23 is selected from the group being made up of nickel, nickeliferous alloy, nickel compound containing and nickeliferous organic composite material.
Refer to shown in Fig. 1; the coated outer surface that forms in described electrode protecting layer 23 of described electrode conductive layer 24; its thickness is 0.1 micron, and ((μ m), optimum thickness is 3 microns ((μ m) for m)～8 microns of μ for m)～10 microns of μ.Preferably, described metal conductive layer is selected from the group being made up of tin, stanniferous alloy, sn-containing compound and stanniferous organic composite material.
The following example is in order to the present invention to be described, but not in order to the present invention is done to any substantial restriction.
Embodiment mono-
The present embodiment relatively uses plating mode to make respectively the monolithic ceramic capacitor with resilient coating of prior art as shown in Figure 3; And the monolithic ceramic capacitor of prior art as shown in Figure 2, the conductivity of the conductance of the former resin resilient coating 52, the latter's electrode layer 41, both thickness of electrode protecting layer 42,53, and both stress buffer performances; Wherein, stress buffer performance represents with bending test failure rate, and the former resin resilient coating 52 is made by epoxy resin (epoxy) and copper (Cu).Above-mentioned test result is shown in table 1, table 2 and table 3, and table 1 is to table 3, and existing product refer to the monolithic ceramic capacitor with resilient coating of prior art; Tradition product are the monolithic ceramic capacitor of prior art.
According to test result, in the time that the electrode protecting layer 53 of the monolithic ceramic capacitor with resilient coating of prior art is coated on the outer surface of its resin resilient coating 52 in the mode of electroplating, because its conductivity is than the electrode layer 41 poor (as table 1) of the monolithic ceramic capacitor of prior art, therefore in the time that the former electrode protecting layer 53 forms with plating mode, its thickness need be than the latter's electrode protecting layer 42 thicker (as table 2), although make the former structure can better than the latter (as table 3) for the shock-absorbing capacity of stress, and requirement up to specification and belong to tolerance interval, but still not enough to some extent, the risk that product is still had catch fire or lost efficacy.
The monolithic ceramic capacitor with resilient coating of the monolithic ceramic capacitor of table 1 prior art and prior art, both Conductivity Ratios
With electroconductive glue materials film forming, the dry and rear mensuration of sclerosis
The monolithic ceramic capacitor with resilient coating of the monolithic ceramic capacitor of table 2 prior art and prior art, the Thickness Ratio of both electrode protecting layers
Taking 0805 chip size as example
The monolithic ceramic capacitor with resilient coating of the monolithic ceramic capacitor of table 3 prior art and prior art, both stress buffer Performance Ratios
* 1maximum bending test is 15mm, sample number 15pcs
* 2 permissible present situation specification Wei≤2mm
Embodiment bis-
The present embodiment relatively uses plating mode to make respectively the monolithic ceramic capacitor with resilient coating of the present invention as shown in Figure 1; And the monolithic ceramic capacitor with resilient coating of prior art as shown in Figure 3, the thickness (T) of both external electrode assemblies 20,50, and thickness (Tb), the thickness (Tc) of electrode protecting layer 23,53 and the thickness (Td) of electrode conductive layer 24,54 of the thickness (Ta) of both electrode layers 21,51, resin resilient coating 22,52; Wherein external electrode assembly 20,50 thickness (T) are the summation of thickness (Tb), the thickness (Tc) of electrode protecting layer 23,53 and the thickness (Td) of electrode conductive layer 24,54 of thickness (Ta), the resin resilient coating 22,52 of electrode layer 21,51.Above-mentioned test result is shown in Table 4.
Table 4 monolithic ceramic capacitor of the present invention and existing monolithic ceramic capacitor, the Thickness Ratio of both external electrode layers
Taking 0805 chip size as example
According to test result; with regard to the thickness (T) of external electrode assembly 20,50; the present invention is less than existing product; further learn more afterwards; the difference of the thickness (T) of both external electrode assemblies 20,50 comes from; the thickness (Tc) of electrode protecting layer 23,53 and the thickness (Td) of electrode conductive layer 24,54, the thickness of the thickness of electrode protecting layer 23 of the present invention (Tc) and electrode conductive layer 24 (Td) is all less than the thickness (Td) of the thickness of existing electrode protecting layer 53 (Tc) and electrode conductive layer 54.
Embodiment tri-
The present embodiment relatively uses plating mode to make respectively the monolithic ceramic capacitor with resilient coating of the present invention as shown in Figure 1; And existing monolithic ceramic capacitor as shown in Figure 3, both conductivity, thickness (Tc) and the stress buffer performance (bending test failure rate) of electrode protecting layer 23,53; Composition proportion and the test result of both resin resilient coatings 22,52 are as shown in table 5.In addition, the method for testing of the present embodiment is identical with embodiment mono-, and adjusts the ratio of curable resin simultaneously, to confirm the improvement of characteristic of the present invention.
In table 5, experimental example #1～#7 is the present invention, and comparative example #1～#3 is existing monolithic ceramic capacitor.
The test result * 1 of table 5 embodiment tri-
* 1: with electroconductive glue materials film forming, the dry and rear mensuration of sclerosis
* 2: maximum bending test 15mm
* 3: in 6mm and 9mm failure
* 4: in 11mm failure
* 5: in 11mm failure
* 6: in 6mm and 7mm
* 7: in 5mm*3pcs and 6mm*3pcs
Wherein, the resin resilient coating 22 of experimental example #1～#7, its thermosetting resin uses epoxy resin, and its first conductive additive is copper powder/copper sheet, and its second conductive additive is sn-bi alloy powder; The resin resilient coating 22 of comparative example #1～#3, its resin uses thermosetting resin equally, and its conductive additive is copper powder and copper sheet.
As shown in table 5, in experimental example #1～#5, in the time that the thickness that maintains fixing resin resilient coating 22 is 70～90um; And under the condition of the ratio of thermosetting resin, along with the ratio of the second conductive additive reduces, conductivity can progressively rise, but arrive certain addition (experimental example #3) afterwards, because Conductivity Ratio first conductive additive (being copper powder/copper sheet in the present embodiment) of the second conductive additive (being sn-bi alloy powder in the present embodiment) is lower, thereby cause conductivity to decline.Experimental example #6～#7 has reduced the addition of curable resin, and makes conductivity have the trend of obvious lifting, starts to have inefficacy product to occur but bend test.In addition, with respect to the conductivity of comparative example #1～#3 and the thickness of electrode protecting layer 53, the conductivity of experimental example #1～#7 has obvious lifting, and has the electrode protecting layer 23 of less thickness.
In addition; as shown in table 5; according to the difference of the component ratio of resin resilient coating 22; comparative experiments example #1 and comparative example #1, experimental example #6 and comparative example #3 respectively; and the thickness of the bending test failure rate of experimental example #7 and comparative example #2 and electrode protecting layer 23,53; the bending test result that demonstrates experimental example #1, #6, #7 is better than respectively its corresponding comparative example, also has the electrode protecting layer 23 thinner than its corresponding comparative example.
Embodiment tetra-
The present embodiment uses plating mode to make the monolithic ceramic capacitor with resilient coating of the present invention as shown in Figure 1; Difference according to the size of the second conductive additive of its resin resilient coating 22 is divided into experimental example #8～#12, and test result is as shown in table 6.Wherein, the method for testing of the present embodiment is identical with embodiment mono-, and the kind of thermosetting resin, the first conductive additive and the second conductive additive that the resin resilient coating 22 of the present embodiment uses is identical with experimental example #1～#7 of embodiment tri-.
As shown in table 5 and table 6; experimental example #8～#12; in the time that the thickness that maintains fixing resin resilient coating 22 is 70～90um and under the condition of the ratio of thermosetting resin, the first conductive additive, the second conductive additive; (conductivity of 1～20 μ the second conductive additive (being sn-bi alloy powder in the present embodiment) m) is all better than comparative example #1～#3 of embodiment tri-for different size; and experimental example #8～#12 has thinner electrode protecting layer 23, and then reach good bending test result.
Embodiment five
The present embodiment uses plating mode to make the monolithic ceramic capacitor with resilient coating of the present invention as shown in Figure 1; The component ratio of fixing resin resilient coating 22 and kind; according in resin resilient coating 22 forming processes, it being heated to the different temperature points between its resin solidification; be divided into embodiment #13～#21; carry out the conductivity of resin resilient coating 22, thickness and stress buffer performance (bending test failure rate) test of electrode protecting layer 23, its test result and composition ratio are as shown in table seven.Wherein, the method of testing of the present embodiment is identical with embodiment mono-, and the kind of the resin that the resin resilient coating 22 of the present embodiment uses, the first conductive additive and the second conductive additive is identical with aforesaid experimental example #1～#7 and #8～#12, furthermore, thermosetting resin is epoxy resin, its curing temperature is 260 ° of C, and the second conductive additive is sn-bi alloy powder, and its fusing point is 139 ° of C.
As shown in table 7, experimental example #13～#16 not yet reaches the curing temperature of thermosetting resin, without the numerical value of conductivity, thickness and the bending test failure rate of electrode protecting layer 23.Although the temperature of experimental example #17～#19 not yet reaches the curing temperature of thermosetting resin, its conductivity has reached the condition of electrodepositable, but in bending test, because thermosetting resin is completely not curing, therefore the characteristic of bending test there is no obvious improvement.#20～#21 reaches the curing temperature of thermosetting resin, and therefore the mortality of bending test obviously declines.
Wherein, due to the second conductive additive metal that is low melting point, its melt temperature is lower than the curing temperature of thermosetting resin, and in the time that thermosetting resin does not solidify completely, the second conductive additive starts to have the phenomenon of melting, and can conducting the first conductive additive; Therefore on guiding path, thermosetting resin curedly cause the first conductive additive densification and conducting, also increased the second guiding path except original, promote thus conductivity.
From the above; the present invention by adding the second additive in resin resilient coating 22; improve the conductivity of resin resilient coating 22; and then the thickness of reduction electrode protecting layer 23; to promote the pooling feature of monolithic ceramic capacitor; and solve its inner electrode layer 12 and storehouse body 10 because of external stress cause the breaking problem of short circuit, therefore monolithic ceramic capacitor of the present invention can possess good resistance for external stress.
The test result of table 6 embodiment tetra-
The test result of table 7 embodiment five
Claims (16)
1. a monolithic ceramic capacitor with resilient coating, wherein comprises:
Storehouse body, it is made up of at least three dielectric layers and at least two mutual storehouses of inner electrode layer, and each adjacent inner electrode layer is exposed to respectively described storehouse body two ends; And,
Two external electrode assemblies, described two external electrode assemblies are arranged at respectively two ends of described storehouse body, and each external electrode assembly comprises electrode layer, resin resilient coating, electrode protecting layer and electrode conductive layer;
Described electrode layer is at least coated on the end of described storehouse body, contacts with the inner electrode layer that is exposed to described storehouse body opposite end;
Described resin resilient coating is coated on the outer surface of described electrode layer, it includes thermosetting resin, the first conductive additive and the second conductive additive, described the second conductive additive is metal, and the curing temperature of described thermosetting resin is higher than the fusing point of described the second conductive additive;
The coated outer surface that forms in described resin resilient coating of described electrode protecting layer;
The coated outer surface that forms in described electrode protecting layer of described electrode conductive layer.
2. the monolithic ceramic capacitor with resilient coating according to claim 1, the content of wherein said thermosetting resin is 12 to 50 percentage by weights (wt%), taking resin resilient coating total weight as basis.
3. the monolithic ceramic capacitor with resilient coating according to claim 1, wherein taking the weight summation of described the first conductive additive and described the second conductive additive as basis, the content of described the first conductive additive between 50 to 95wt%.
4. the monolithic ceramic capacitor with resilient coating according to claim 1, the size of wherein said the second conductive additive between 0.1 micron (μ m) to 100 microns (μ m) between.
5. the monolithic ceramic capacitor with resilient coating according to claim 1, the fusing point of wherein said the second conductive additive is between 100 DEG C to 300 DEG C.
6. the monolithic ceramic capacitor with resilient coating according to claim 1, the thickness of wherein said resin resilient coating between 0.1 micron (μ m) to 100 microns (μ m) between.
7. the monolithic ceramic capacitor with resilient coating according to claim 1, the thickness of wherein said electrode protecting layer between 0.1 micron (μ m) to 30 microns (μ m) between.
8. according to the monolithic ceramic capacitor with resilient coating described in any one in claim 1 to 7, wherein said thermosetting resin is electroconductive resin, and described electroconductive resin comprises at least one and be selected from the thermosetting resin of the group being made up of polyacetylene class, polythiophene class, polypyrrole class, polyaniline compound and polyaromatic hydrocarbon ethene.
9. according to the monolithic ceramic capacitor with resilient coating described in any one in claim 1 to 7, wherein said thermosetting resin is non-conductive resin, and described non-conductive resin comprises at least one and be selected from the thermosetting resin of the group being made up of epoxy resin, phenolic resinoid, urea resin, the U.S. resin of resistance to ware, unsaturated polyester resin, silicone grease resin and polyurethane.
10. according to the monolithic ceramic capacitor with resilient coating described in any one in claim 1 to 7, wherein said the first additive is selected from the group being made up of the conductive additive of metal species powder, metal species paillon foil, metal species fiber, carbon fiber and carbon class form; Wherein metal species powder, metal species paillon foil, metal species fiber comprise at least one and are selected from the material in the group being made up of nickel, silver, copper, palladium, its mixture and alloy thereof; Wherein the conductive additive of carbon fiber and carbon class form comprises at least one and is selected from the material in the group being made up of activated carbon, carbon fiber and carbon nano-tube.
11. according to the monolithic ceramic capacitor with resilient coating described in any one in claim 1 to 7, and wherein said the second conductive additive comprises at least one and selects the material in the group that the conducting objects of free metal species powder, metal species paillon foil, metal species fiber forms; Wherein the constituent of metal species powder, metal species paillon foil, metal species fiber comprises at least one and selects the material in the group that free tin, bismuth, lead, indium, its mixture and alloy thereof form.
12. according to the monolithic ceramic capacitor with resilient coating described in any one in claim 1 to 7, wherein said inner electrode layer be selected from by the powder of nickel, copper, silver, palladium, alloy, compound with and the group that formed of combination.
13. according to the monolithic ceramic capacitor with resilient coating described in any one in claim 1 to 7, and wherein said dielectric layer is formed by ceramic material.
14. according to the monolithic ceramic capacitor with resilient coating described in any one in claim 1 to 7, and the material of wherein said electrode layer is formed by metal dust or its mixture of glass and copper, silver, nickel.
15. according to the monolithic ceramic capacitor with resilient coating described in any one in claim 1 to 7, and wherein said electrode protecting layer is made up of nickel.
16. according to the monolithic ceramic capacitor with resilient coating described in any one in claim 1 to 7, and wherein said electrode conductive layer is made up of tin.
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| CN111128494A (en) * | 2019-12-31 | 2020-05-08 | 广东爱晟电子科技有限公司 | Thermosensitive chip with stress buffering metal electrode structure |
| CN111199831A (en) * | 2018-11-16 | 2020-05-26 | 三星电机株式会社 | Multilayer ceramic electronic component |
| CN112447398A (en) * | 2019-09-04 | 2021-03-05 | 三星电机株式会社 | Multilayer electronic component |
| CN113161149A (en) * | 2021-04-26 | 2021-07-23 | 深圳市三炎科电子科技有限公司 | Production method of MLCC (multilayer ceramic capacitor) patch capacitor with crack-resistant design |
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| CN109036844A (en) * | 2018-07-12 | 2018-12-18 | 成功工业（惠州）有限公司 | A kind of ceramic condenser encapsulating structure |
| CN111199831A (en) * | 2018-11-16 | 2020-05-26 | 三星电机株式会社 | Multilayer ceramic electronic component |
| CN111199831B (en) * | 2018-11-16 | 2023-02-17 | 三星电机株式会社 | Multilayer ceramic electronic component |
| CN112447398A (en) * | 2019-09-04 | 2021-03-05 | 三星电机株式会社 | Multilayer electronic component |
| US11189424B2 (en) * | 2019-09-04 | 2021-11-30 | Samsung Electro-Mechanics Co., Ltd. | Multilayer electronic component |
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| US11735364B2 (en) | 2019-09-04 | 2023-08-22 | Samsung Electro-Mechanics Co., Ltd. | Multilayer electronic component |
| CN111128494A (en) * | 2019-12-31 | 2020-05-08 | 广东爱晟电子科技有限公司 | Thermosensitive chip with stress buffering metal electrode structure |
| CN111128494B (en) * | 2019-12-31 | 2021-12-10 | 广东爱晟电子科技有限公司 | Thermosensitive chip with stress buffering metal electrode structure |
| CN113161149A (en) * | 2021-04-26 | 2021-07-23 | 深圳市三炎科电子科技有限公司 | Production method of MLCC (multilayer ceramic capacitor) patch capacitor with crack-resistant design |
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