200828723 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種電能供應系統，特別關於一種整合 電路基板之電能供應系統。 . 【先前技術】 由於電子、資訊及通訊等3C產品均朝向無線化、可 鼉 _ 攜帶化方向發展，應用於各種產品的各項高性能元件除了 往輕、薄、短、小的目標邁進外，近年來，可撓式電子產 品的技術發展也逐漸受到重視，因此，對於體積小、重量 輕、能量密度高的電池需求係相當地迫切。 首先，以電池系統的使用特性為例，為了延長電池使 用的時間、提昇電池的能量密度，過去無法重複使用的一 次電么系統係已無法滿足現今電子產品的需求，而目前應 用於電子產品中的電池系統多以可重複充、放電的二次電 ⑩ 池系統為主流，例如：鋰電池系統、燃料電池系統、太陽 能電池系統…等等，然而，因為在現今的技術發展下，燃 料電池仍面臨有最小尺寸的限制，而太陽能電池系統則是 ， 基於材料的限制而無法獲得較為理想的能源轉換效率，因 ^ 此，在上述的二次電池系統中能夠達到小體積、高能量密 度的要求者係為技術較為成熟之經電池系統，請參考圖1 所示之鋰電池系統之電池芯結構示意圖，此電池芯之結構 係由過去的堆疊式結構演進至現今較常見的捲繞式結 構，然而，無論是堆疊式結構或是捲繞式結構的電池芯， 200828723 主要的結構係由一正極極板與一負極極板之間夾設一隔 離層所構成，而在正極極板與負極極板的集電層上係分別 焊接一導電柄結構以為外部電極，使得電池系統可藉由此 二外部電極與周邊電子元件進行電性連接。如圖1所示， 電池1包括一隔離層11、一第一活性材料層12、一第二 活性材料層13、一第一集電層14、一第二集電層15以及 一封裝單元16。如圖1所示，第一活性材料層12設置於 隔離層11上，第一集電層14設置於第一活性材料層12 上，而第二活性材料層13設置於隔離層11下，第二集電 層15設置於第二活性材料層13下，最後，封裝單元16 將此堆疊結構密封，僅露出導電柄141、151。如上所述， 若電池1要提供電能至一電子裝置2(圖1係僅顯示一電路 板）時，必須將導電柄141、151與電子裝置2之電源輸入 端子21、22電性連接，藉以將電池1所儲存的電能輸出 至電子裝置2，之後，可再藉由導線將電能傳輸至電子裝 置2之元件區23，其中，元件區23可以包括邏輯電路、 主動元件、被動元件等，其可以是電路佈局或是表面黏著 元件（SMT)。 然而，因為隔離層11與第一活性材料層12及第二活 性材料層13之間的接觸界面是否具有良好的接觸係對於 整體電池系統的電性與安全性表現有相當直接且嚴重的 影響，因此，在習知的鋰電池技術中為了維持此些界面的 良好接觸，無論是堆疊式結構或是捲繞式結構的電池芯， 在完成電池的組裝後其整體結構的撓折性係相當地低，甚 7 200828723 至是無法撓折，以避免因為撓折而產生的應力導致隔離層 11與第一活性材料層12及第二活性材料層13之間的界面 受到破壞，因而降低了電池系統的電性與安全性表現。 再以電池系統的封裝結構而論，無論是上述的一次電 池系統或是二次電池系統，習知的所有電池系統包裝多是 . 以硬金屬外殼（包括傳統圓柱形與方形）的外觀型態呈現， • 除了可避免電池4受到外界應力的破壞，也可以降低外界 _ 因子對於電池内部化學系統的影響。以二次鋰電池為例， 其最常見的電池外觀係為方形結構，因此，對於終端電子 產品而言，雖然二次鋰電池係可提供較佳的電性表現與使 用壽命，但由於其固定的尺寸設計與堅硬的外殼材質而使 得大部分電子產品在進行電路設計時係受到相當大的限 制；雖然後續的二次電池系統係發展出以金屬軟包裝的形 式取代習知硬金屬外殼的封裝技術，因此可降低二次電池 系統在電子產品應用中的困難度，然而，相對於習知的硬 • 金屬外殼來說，金屬軟包裝的封裝結構係利用熱壓封合的 方式貫現，·因此金屬軟包裝在上述之導電柄之封合界面 上，因為導電柄之金屬與金屬軟包裝的熱封聚合物係為兩 . 異質材料，所以其間的封合效果不佳，因而在阻氣、阻水 ， 的效果表現上係較習知以焊接封合的硬金屬外殼為差，且 又當一次電池不斷地進行充、放電後會引起電池系統在整 體尺寸上產生體積肪服與收縮的問題’此時’由於金屬軟 包裝本身係無法提供足夠的材料應力，因此係無法有效地 維持二次電池的尺寸，而導致電子產品在進行電路設計時 200828723 面臨到惱人的困難。 另外，就更微觀的電化學系統來說，請再次參考圖1 所示，第一活性材料層12及第二活性材料層13之間設置 隔離層11，此隔離層11係主要用避免第一電極基板（包括 第一活性材料層12及第一集電層14)與第二電極基板（包 • 括第二活性材料層13及第二集電層15)發生直接的接觸而 在電池1内發生内部短路妁問題，但同時卻又必須能夠提 供電池1中離子遷移所需的路徑，因此，此隔離層11的 ® 材料必須兼顧有不導電與多孔性之特徵，常見的隔離層11 係利用聚乙烯、聚丙烯等聚合物材料以製成，此外，依據 不同聚合物或同一聚合物但不同分子量的玻璃轉化與軟 化溫度更可在一定的溫度範圍内改變局部聚合物的結 構，故，當電池系統因内部短路、外部短路或任何因素而 導致其内部的溫度上升時，透過隔離層11結構的改變而 封閉電池1中離子遷移的路徑以避免電池1在高溫下繼續 φ 進行電化學反應，可降低電池1發生爆炸的機率。 然而，若電池1因故仍舊持續昇溫，一旦電池内部達 到150°C〜180°c，基於習知技術中隔離層11之物理特性， 其隔離層11仍會整體性融化崩潰，造成全面短路並進而 產生嚴重起火或爆炸，同時因為隔離層11本身不具有導 / 電性，且聚合物係呈現交錯糾結的結構，因此，對於微觀 的離子遷移反應而言，過於複雜且交錯糾結的結構會造成 離子在進行遷移時，因為過長或是過為彎曲的路徑而提高 了離子遷移時的障礙，也因此降低了整體電池系統的離子 9 200828723 導電度。 除了上述的種種缺失以外，由於在可撓式電子產品中 多數的電路設計皆已達到可撓曲的設計要求，惟，就現有 的電池系統而言，無論上述的何種電池系統皆無法在維持 良好的電性與安全性表現下同時提供可撓曲的特性，另 ^ 外，也由於電子產品的體積逐漸微小化，但其所應用之電 池系統卻未能相對應地縮小其體積之設計併同時兼顧良 好的電性表現，因而使得大部分的電子產品必須犧牲部分 ® 的結構空間以用來設置所需之電池系統，也因此讓電子產 品在尺寸的設計上受到相當的限制。 再者，電池1的隔離層11的材料無法耐受高溫製程， 所以其製造無法與電路板(如印刷電路板、可撓式電路板等) 的製程進行整合，因此，對於電子裝置2而言，電池1必 然是外接的元件，如此不僅提高電子裝置2的成本，而且 對於電子裝置2的小型化、薄型化皆有一定的限制；此外， φ 電子裝置2必須設計容納電池1的容置空間，此容置空間 將無法有效地運用在電路佈局上，至為可惜。 因此，如何提供一種能夠解決上述問題的電能供應系 ^ 統，正是當前電子產業的重要課題之一。 【發明内容】 有鑑於上述課題，本發明之目的為提供一種能夠整合 於電路板及其製程的電能供應系統。 緣是，為達上述目的，依本發明之一種電能供應系統 200828723 包括一電路基板、一^ J.-T 1 ^ ^ ⑽ 弟電極基板、一弟二電極基板、一 第封裝單元、以及一第二封裝單元。在本發明中，電路 系匕括至夕隔離區域，第一電極基板係位於電路基 板之一侧，且第—電極基板係包括一第一集電層及一第一 /舌f生材料層n —活性材料層係位於隔離區域與第一集電 3層之間、亚與隔離區域相對而設；第二電極基板係位於電 =基板之另一側，且第二電極基板包括一第二集電層及一 ⑩ 弟一/舌性材料層，第二活性材料層係位於隔離區域與第二 ^ 〗並與隔離區域相對而設；第一封裝單元係位 於苐氣極基板與電路基板之間、並環設於第一活性材料 層周圍，而第二封裝單元係位於第二電極基板與電路基板 之間、並環設於第二活性材料層周圍。 承上所述’因依本發明之電能供應系統係採用電路基 板來分隔第一活性材料層及第二活性材料層，亦即可以將 電池單兀直接整合於電路板中，所以能夠將電能供應系統 • 與電路板進行有效地整合，甚至可以應用電路板的製程條 件來製造本發明之電能供應系統。與習知技術相較，依本 發明之電能供應系統可以與電路板的製程整合，電能供應 . 系統可以視為一種表面黏著元件（SMT)，因此，可以有效 ， 降低產品的製造成本，而且還可以使得產品更加的小型 化、薄型化；此外，第一電極基板及第二電極基板之外側 可以更設置有其他電路基板，因此可以有效利用電能供應 系統的區域進行電路佈局上，藉以使得產品更加小型化。 11 200828723 【實施方式】 以下將參照相關圖式，說明依本發明較佳實施例之電 能供應系統。 為了能直接將電能供應單元整合於—般可撓性，非可 撓性電路板上’並同時提供具有成本低、大容量、高熱穩 定性與額外機械特性（如可多:欠撓折特性）之電能供應系 統，本發明係提出-種可撓式邏輯電能系統，利用此項發 明設計，不僅使得-般產品之電路設計可以直接將電能供 應單元整合於電路基㈣’不需絲外之賴與焊點，同 時利用電路基板作為隔離層之用，其中，電路基板之敎穩 定溫度超過以上，可執行純錫回焊製程以進行^ 表面黏著技術(SMT)、甚錢行晶片（IC)之金金共晶製程以 達成直接整合電能供應彡統與（可触/非可祕）電路板 之大受量產可能性，㈣此系統亦提供相當於現行二次經 電池之體積能量料與低單位電容量生產成本，但大^改 善現行二次㈣池無法具有高熱穩定且無法直接田 板整合成-體成型之特性。以下，係提供本發明之實施能 樣’並佐以K式詳加說明，關述本發明之主要技。 請參考圖2所示，其中，圖2係為本發明較佳實^例 之電此供應线之結構剖面示意圖。如圖2所示，電‘ 應系統3包含-電路基板31、—第1極基板^= 極基板33、一第一封裝單元34、以及一第 几35、、中，電路基板31係包括至少—隔離區域 第-電極基板32係㈣電路基板31之—側，且第—電極 12 200828723 基板32係包括一第一集電層321及一第一活性材料層 322弟活性材料層322係位於隔離區域Μ〗與第一集 電層321之間、並與隔離區域311相對而設；第二電極基 板33係位於電路基板31之另—側，^第二電極基板％ 包括-第二集電層331及一第二活性材料層332，第二活 f生材料層332係位於隔離區域3Π與第二集電層331之 間、並與隔離區域311相對而設；第一封裝單元％係位 於第-電極基板32與電路基板31之間、並環設於第一活 性材料層322周圍，而第二封裝單元35係位於第二電極 基板33與電路基板31之間、並環設於第二活性 周圍。 T 9 Μ/ ^本實施例中，電路基板31係可為—非可撓式 =或-可撓式電路基板，於此，電路基板31係以 參:式電路基板為例。由圖2可知，電路基板31係 二結構’其包含了-第-金屬層313、—基板聚合物層314 第一=金屬層M5。在本實施例中，第一金屬層313斑 弟-孟屬層315可為單層❹層結構，其中第— 「 與第二金屬層M5之主要組成材料係選自銅、銘、缚: =壬:^紅合錢均錄金叙合金。基板聚合 3H係介於第—金屬層313與第二金屬層315之間，复二 為早層或多層結構，其中基板聚合物層314包含至少二 ^支撐層或二膠層（圖未示），其中，基板支料之主要二 2料！㈣亞隨胺(ΡΙ)、聚對苯二甲酸乙二醇: )、聚奈-曱酸乙二醇_(ΡΕΝ)、玻璃纖維或液晶型高 13 200828723 分子，而膠層之主要組成材料係選自聚亞醯胺、環氧樹脂 或壓克力樹脂。 另外，電路基板31更包括一邏輯電路區域312，其係 鄰設於隔離區域311、並形成有至少一邏輯電路，邏輯電 路係與第一集電層321及第二集電層331電性連接。如圖 , 2所示’隔離區域311在垂直轴上是介於第一電極基板32 與第二電極基板33之間，在水平轴上是介於第一封裝單 _ 元34或第二封裝單元35之間；而邏輯電路區域312在水 平軸上之位置是位在第一封裝單元34或第二封裝單元35 之外，其中，電路基板31之主要功能有三項，第一項功 能：其上之隔離區域311是將第一電極基板32之第一活 性材料層322與第二電極基板33之第二活性材料層332 進行電子絕緣與離子導通，第二項功能：其上之邏輯電路 區域312可以將由内部電能單元所產生之電量直接利用蝕 刻線路與外部電路與元件直接連接，無須其他焊點，第三 • 項功能：由於其上之隔離區域311可視為其他内部電能單 元之載體或組合母體，故整體電能供應系統可藉由電路基 板31上之邏輯電路區域312將外部電路與元件完整地與 • 電路基板31整合，不僅如此，由於電路基板31之熱穩定 性極佳，可耐純錫回焊溫度，甚至1C共晶製程溫度，故 當電路基板31完成其邏輯電路區域312之外部電路與連 續元件上件製程後，可再與其他熱穩定度較低之電能單元 進行組合，故整體可撓式邏輯電能供應系統可以進行自動 上件製程，其量產價值不言可喻！ 14 200828723 在本實施财，單元34在垂直轴上之位置 分佈是介於第-電極基板32與電路基板31之間，且在水 平軸上之位置分佈則是介於第—電極基板^之第一活性 材料層322與邏輯電路區域312之間；此外，相同於第一 封裝單元34，第二封裝單元35在垂錄上之位置分佈是 ^介於第二電極基板33與電路基板31之間，且在水平轴上 -之位置分佈則是介於第二電極基板33之第二活性材料層 ⑩332與避輯電路區域312之間。需注意者，因圖2為電能 ，應系=之剖面圖’故看似第一活性材料層似位於第 封，單7L 34之間’而第二活性材料層332位於第二封 ^單元35之間，然實際上，第一封裝單元34係環設於第 一活性材料層322周圍，而第二封裝單元％係環設於第 一活性材料層332周圍。 立請同時參照圖3與圖4所示，其中圖3係為圖2之局 部結構放大示意® ’其主要放大之區域在於第—電極基板 32與所相對應之電路基板31及第二電極基板33，在圖3 中，第一電極基板32與第二電極基板33顯示三種必要結 構，其中，第一電極基板32包含了第一聚合物層3D •—集電層321、第一活性材料層322,第二電極基板33包 ’含了第二聚合物層333、第二集電層331、第二活性材料 層332。在圖4中，第一電極基板32具有三項必要社構， 與其他三項充要結構，其中，第一電極基板32包含了第 一聚合物層323、第一集電層321、第一活性材料層322、 複數個第一分隔元件3 24、g 一黏著加強層3 25與曰第一電 15 200828723 路佈局層326，而第二電極基板33包含了第二聚人物# 333、第二集電層331、第二活性材料層332、複數個第二 分隔元件334、第二黏著加強層335與第二電路佈局層 336。 ° 曰200828723 IX. Description of the Invention: [Technical Field] The present invention relates to an electric energy supply system, and more particularly to an electric energy supply system integrating a circuit substrate. [Prior Art] Since 3C products such as electronics, information and communication are all oriented toward wireless and portable, the high-performance components used in various products are moving toward light, thin, short and small targets. In recent years, the technological development of flexible electronic products has also received increasing attention. Therefore, the demand for batteries with small size, light weight, and high energy density is quite urgent. First, taking the use characteristics of the battery system as an example, in order to prolong the battery use time and increase the energy density of the battery, the system that cannot be reused in the past has been unable to meet the demand of today's electronic products, and is currently used in electronic products. The battery system is mostly dominated by rechargeable secondary and secondary battery systems, such as lithium battery systems, fuel cell systems, solar cell systems, etc. However, because of the current technological development, fuel cells are still Faced with the limitation of the smallest size, and the solar cell system is based on the material limitation, the ideal energy conversion efficiency cannot be obtained, because of the small volume and high energy density requirements in the above secondary battery system. The battery system is a relatively mature technology. Please refer to the schematic diagram of the battery core structure of the lithium battery system shown in Figure 1. The structure of the battery core has evolved from the past stacked structure to the more common winding structure. However, whether it is a stacked structure or a wound cell structure, 200828723 The structure is composed of a separator layer sandwiched between a positive electrode plate and a negative electrode plate, and a conductive handle structure is respectively welded on the collector layer of the positive electrode plate and the negative electrode plate to serve as an external electrode, so that the battery The system can be electrically connected to the peripheral electronic components by the two external electrodes. As shown in FIG. 1 , the battery 1 includes an isolation layer 11 , a first active material layer 12 , a second active material layer 13 , a first collector layer 14 , a second collector layer 15 , and a package unit 16 . . As shown in FIG. 1, the first active material layer 12 is disposed on the isolation layer 11, the first collector layer 14 is disposed on the first active material layer 12, and the second active material layer 13 is disposed under the isolation layer 11, The second collector layer 15 is disposed under the second active material layer 13. Finally, the package unit 16 seals the stacked structure to expose only the conductive handles 141, 151. As described above, if the battery 1 is to supply electric energy to an electronic device 2 (only one circuit board is shown in FIG. 1), the conductive handles 141 and 151 must be electrically connected to the power input terminals 21 and 22 of the electronic device 2, thereby The electrical energy stored in the battery 1 is output to the electronic device 2, and then the electrical energy can be transmitted to the component region 23 of the electronic device 2 by wires, wherein the component region 23 can include logic circuits, active components, passive components, etc. It can be a circuit layout or a surface mount component (SMT). However, whether the contact interface between the isolation layer 11 and the first active material layer 12 and the second active material layer 13 has a good contact system has a relatively direct and serious influence on the electrical and safety performance of the overall battery system. Therefore, in order to maintain good contact of such interfaces in the conventional lithium battery technology, whether the battery structure of the stacked structure or the wound structure, the overall structural flexibility of the assembled battery is equivalent. Low, even 7 200828723 It is impossible to flex to avoid the stress caused by the deflection, causing the interface between the isolation layer 11 and the first active material layer 12 and the second active material layer 13 to be damaged, thereby reducing the battery system. Electrical and safety performance. In terms of the package structure of the battery system, whether it is the above-mentioned primary battery system or secondary battery system, all of the conventional battery system packages are mostly. The appearance of a hard metal casing (including a conventional cylindrical shape and a square shape) Presentation, • In addition to avoiding damage to the battery 4 from external stresses, it can also reduce the influence of external factors on the internal chemical system of the battery. Taking a secondary lithium battery as an example, its most common battery appearance is a square structure. Therefore, for terminal electronic products, although the secondary lithium battery system can provide better electrical performance and service life, it is fixed due to its The size of the design and the hard shell material make most of the electronic products subject to considerable limitations in circuit design; although the subsequent secondary battery system developed a packaging technology that replaces the conventional hard metal casing in the form of a metal flexible package. Therefore, the difficulty of the secondary battery system in the application of the electronic product can be reduced. However, compared with the conventional hard metal housing, the packaging structure of the metal flexible packaging is formed by means of heat sealing, and thus the metal The flexible packaging is on the sealing interface of the above-mentioned conductive handle, because the metal of the conductive handle and the heat-sealing polymer of the metal flexible packaging are two different materials, so the sealing effect between them is not good, and thus the gas barrier and water blocking are The effect is better than the conventional hard metal casing that is welded and sealed, and it is introduced when the primary battery is continuously charged and discharged. The problem that the battery system produces volume and shrinkage in the overall size 'at this time' is that the metal flexible package itself cannot provide sufficient material stress, so the size of the secondary battery cannot be effectively maintained, and the electronic product is in the circuit. Design time 200828723 faced annoying difficulties. In addition, for a more microscopic electrochemical system, please refer to FIG. 1 again, an isolation layer 11 is disposed between the first active material layer 12 and the second active material layer 13, and the isolation layer 11 is mainly used to avoid the first The electrode substrate (including the first active material layer 12 and the first collector layer 14) is in direct contact with the second electrode substrate (including the second active material layer 13 and the second collector layer 15) in the battery 1 The internal short-circuit problem occurs, but at the same time it must be able to provide the path required for ion migration in the battery 1. Therefore, the material of the spacer 11 must have both the characteristics of non-conduction and porosity, and the common isolation layer 11 is utilized. Polypropylene, polypropylene and other polymer materials are made, in addition, according to different polymers or the same polymer but different molecular weight glass conversion and softening temperature can change the structure of the local polymer within a certain temperature range, so when When the internal temperature of the battery system rises due to an internal short circuit, an external short circuit or any factor, the path of ion migration in the battery 1 is blocked by the change of the structure of the isolation layer 11 to avoid electricity. Φ 1 continues the electrochemical reaction at a high temperature, can reduce the chances of an explosion of the battery. However, if the battery 1 continues to heat up for a reason, once the interior of the battery reaches 150 ° C ~ 180 ° C, based on the physical characteristics of the isolation layer 11 in the prior art, the isolation layer 11 will still melt and collapse completely, resulting in a complete short circuit and In turn, a severe fire or explosion occurs, and because the isolation layer 11 itself does not have conductivity/conductivity, and the polymer system exhibits a staggered entanglement structure, an excessively complicated and staggered structure may cause a microscopic ion migration reaction. When ions migrate, they are too long or too curved to increase the barrier of ion migration, thus reducing the conductivity of the ion system of the overall battery system. In addition to the above-mentioned various kinds of defects, since most circuit designs in flexible electronic products have reached flexible design requirements, no matter which battery system is used, the existing battery system cannot be maintained. Good electrical and safety performance provides flexibility at the same time. In addition, due to the gradual miniaturization of electronic products, the battery system used has not been able to reduce the size of the design. At the same time, good electrical performance is taken into account, so that most of the electronic products must sacrifice part of the structural space of the ® to set up the required battery system, and thus the electronic product is limited in size design. Moreover, the material of the isolation layer 11 of the battery 1 cannot withstand the high temperature process, so its manufacture cannot be integrated with the process of the circuit board (such as a printed circuit board, a flexible circuit board, etc.), and therefore, for the electronic device 2 The battery 1 is inevitably an external component, which not only increases the cost of the electronic device 2, but also limits the miniaturization and thinning of the electronic device 2. In addition, the φ electronic device 2 must be designed to accommodate the accommodation space of the battery 1. It is a pity that this space cannot be effectively used in the circuit layout. Therefore, how to provide an electric energy supply system that can solve the above problems is one of the important topics in the current electronics industry. SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide an electric energy supply system that can be integrated in a circuit board and a process thereof. In order to achieve the above object, an electric energy supply system 200828723 according to the present invention includes a circuit substrate, a J.-T 1 ^ ^ (10) dipole electrode substrate, a second electrode substrate, a first package unit, and a first Two package units. In the present invention, the circuit system includes an isolation region, the first electrode substrate is located on one side of the circuit substrate, and the first electrode substrate includes a first collector layer and a first/tongue material layer n An active material layer is disposed between the isolation region and the first collector 3 layer, and is disposed opposite to the isolation region; the second electrode substrate is located on the other side of the electric=substrate, and the second electrode substrate includes a second set An electric layer and a 10th layer/tongue material layer, wherein the second active material layer is located in the isolation region and opposite to the isolation region; the first package unit is located between the xenon electrode substrate and the circuit substrate And surrounding the first active material layer, and the second packaging unit is located between the second electrode substrate and the circuit substrate, and is disposed around the second active material layer. According to the above invention, the electric energy supply system according to the present invention uses a circuit substrate to separate the first active material layer and the second active material layer, that is, the battery unit can be directly integrated into the circuit board, so that the electric energy can be supplied. System • Effective integration with the board, and even the process conditions of the board can be applied to fabricate the power supply system of the present invention. Compared with the prior art, the power supply system according to the present invention can be integrated with the process of the circuit board, and the power supply can be regarded as a surface mount component (SMT), thereby effectively reducing the manufacturing cost of the product, and also The product can be further miniaturized and thinned. In addition, the other electrode substrate can be further disposed on the outer side of the first electrode substrate and the second electrode substrate, so that the area of the power supply system can be effectively utilized for circuit layout, thereby making the product more miniaturization. 11 200828723 [Embodiment] Hereinafter, an electric energy supply system according to a preferred embodiment of the present invention will be described with reference to the related drawings. In order to be able to directly integrate the power supply unit into the general flexible, non-flexible circuit board 'at the same time provide low cost, large capacity, high thermal stability and additional mechanical properties (such as more: underflexive characteristics) The invention provides a flexible logic power system, and the invention design not only enables the circuit design of the general product to directly integrate the power supply unit into the circuit base (4) Simultaneously with the solder joint, the circuit substrate is used as the isolation layer, wherein the stable temperature of the circuit substrate exceeds the above, and the pure tin reflow process can be performed to perform the surface adhesion technology (SMT) and the chip (IC). The gold-gold eutectic process achieves the possibility of mass production of directly integrated power supply systems and (touchable/non-secretable) boards. (4) This system also provides volume energy equivalent to current secondary battery cells and low Unit capacity production cost, but the improvement of the current secondary (four) pool can not have high heat stability and can not directly integrate the characteristics of the body into a body. Hereinafter, the performance of the present invention will be provided, and the main features of the present invention will be described with reference to the K formula. Please refer to FIG. 2, which is a cross-sectional view showing the structure of the supply line of the preferred embodiment of the present invention. As shown in FIG. 2, the electrical system 3 includes a circuit board 31, a first pole substrate ^= a pole substrate 33, a first package unit 34, and a third 35. The circuit board 31 includes at least The isolation region first-electrode substrate 32 is (four) the side of the circuit substrate 31, and the first electrode 12 200828723 substrate 32 includes a first collector layer 321 and a first active material layer 322. The second electrode substrate 33 is located on the other side of the circuit substrate 31, and the second electrode substrate % includes a second collector layer. 331 and a second active material layer 332, the second active material layer 332 is located between the isolation region 3Π and the second collector layer 331, and is opposite to the isolation region 311; the first package unit is located at the first The electrode substrate 32 and the circuit substrate 31 are disposed around the first active material layer 322, and the second package unit 35 is located between the second electrode substrate 33 and the circuit substrate 31 and is disposed in the second active region. around. T 9 Μ / ^ In the present embodiment, the circuit board 31 may be a non-flexible = or - flexible circuit board. Here, the circuit board 31 is exemplified by a circuit board. As is apparent from Fig. 2, the circuit board 31 is a two-layer structure which includes a -metal layer 313, a substrate polymer layer 314, and a first metal layer M5. In this embodiment, the first metal layer 313, the zealand-Mulberry layer 315, may be a single-layer bismuth layer structure, wherein the first component material of the first metal layer M5 is selected from the group consisting of copper, inscriptions, and bindings:壬: ^红合钱都金金合金. The substrate polymerization 3H is between the first metal layer 313 and the second metal layer 315, the second is an early layer or a multilayer structure, wherein the substrate polymer layer 314 contains at least two ^Support layer or two-layer layer (not shown), wherein the main material of the substrate support is two materials! (4) Sub-amine (ΡΙ), polyethylene terephthalate: ), poly-naphthalene Alcohol _ (ΡΕΝ), glass fiber or liquid crystal type high 13 200828723 molecules, and the main constituent material of the rubber layer is selected from polyamine, epoxy resin or acrylic resin. In addition, the circuit substrate 31 further includes a logic circuit The area 312 is disposed adjacent to the isolation area 311 and is formed with at least one logic circuit. The logic circuit is electrically connected to the first collector layer 321 and the second collector layer 331. As shown in FIG. 311 is between the first electrode substrate 32 and the second electrode substrate 33 on the vertical axis, and is on the horizontal axis. Between the first package unit 34 or the second package unit 35; and the position of the logic circuit region 312 on the horizontal axis is outside the first package unit 34 or the second package unit 35, wherein the circuit substrate 31 There are three main functions, the first function: the isolation region 311 thereon is electrically insulated and ion-conducting the first active material layer 322 of the first electrode substrate 32 and the second active material layer 332 of the second electrode substrate 33. The second function: the logic circuit area 312 can directly connect the power generated by the internal power unit directly to the external circuit and the component by using the etched line, without other solder joints, and the third function: due to the isolation region thereon 311 can be regarded as a carrier or a combination of other internal power units, so that the overall power supply system can integrate the external circuits and components with the circuit substrate 31 through the logic circuit region 312 on the circuit substrate 31, not only that, but also because of the circuit substrate. 31 has excellent thermal stability, can withstand pure tin reflow temperature, and even 1C eutectic process temperature, so when circuit board 31 completes its logic circuit area After the external circuit of 312 and the continuous component upper part process, it can be combined with other power units with lower thermal stability, so the overall flexible logic power supply system can perform automatic upper part process, and its mass production value is self-evident. 14 200828723 In this implementation, the positional distribution of the unit 34 on the vertical axis is between the first electrode substrate 32 and the circuit substrate 31, and the positional distribution on the horizontal axis is between the first electrode substrate ^ Between the first active material layer 322 and the logic circuit region 312; further, similar to the first package unit 34, the position distribution of the second package unit 35 on the recording is between the second electrode substrate 33 and the circuit substrate 31. The positional distribution between and on the horizontal axis is between the second active material layer 10332 of the second electrode substrate 33 and the escaping circuit region 312. It should be noted that, because FIG. 2 is electrical energy, it should be a cross-sectional view of 'therefore, it seems that the first active material layer is located between the first seal and the single 7L 34' and the second active material layer 332 is located at the second seal unit 35. Actually, the first package unit 34 is disposed around the first active material layer 322, and the second package unit is disposed around the first active material layer 332. Referring to FIG. 3 and FIG. 4 simultaneously, FIG. 3 is an enlarged view of the partial structure of FIG. 2 'the main enlarged area is the first electrode substrate 32 and the corresponding circuit substrate 31 and the second electrode substrate. 33. In FIG. 3, the first electrode substrate 32 and the second electrode substrate 33 display three necessary structures, wherein the first electrode substrate 32 includes the first polymer layer 3D, the collector layer 321, and the first active material layer. 322, the second electrode substrate 33 includes 'the second polymer layer 333, the second collector layer 331, and the second active material layer 332. In FIG. 4, the first electrode substrate 32 has three essential structures, and the other three essential structures, wherein the first electrode substrate 32 includes the first polymer layer 323, the first collector layer 321, and the first The active material layer 322, the plurality of first partitioning members 3 24, g, the adhesive reinforcing layer 3 25 and the first electric 15 200828723 road layout layer 326, and the second electrode substrate 33 includes the second poly character # 333, the second The collector layer 331, the second active material layer 332, the plurality of second spacer elements 334, the second adhesion enhancement layer 335, and the second circuit layout layer 336. ° 曰
以下是針對三項必要結構與·三項充要結構進行實施 悲樣说明，弟一^種必要結構·以第一聚合物層3 2 3為例 該層是處在第一電極基板32之最外圍區域，其中主要之 功能有二項，第一項係為保護第一集電層321在高溫狀熊 下不受氧化，第二係為加強第一集電層321之耐撓折之能 力’其實施之方式係為利用對位貼膠與熱壓合，將第一聚 合物層323完整覆蓋於第一集電層321之外，或是利用網 版印刷直接將防焊綠漆印刷於第一集電層321之上並經過 烘烤熟化後，完整將第一聚合物層323覆蓋於第一集電層 321之外，其中，第一聚合物層之材料係為PI、PET、PS、 PP、歷、PVC、壓克力樹脂與環氧樹脂。第二種必要結 構：以第一集電層321為例’該層是處在第一聚合物層323 與第-活性材料層322之間，其中主要之功能有二項，第 -項，為將第-活性材料層322所產生之電荷，藉由第一 封衣單元3 4或疋其他導電結構(如|電線)傳至外部之邏輯 電路區域312，第二項係為利用第-集電層321為金屬之 =!·生m氣錢至第—活性材料層似之速度與數 量，其中’第一集電層321之材料係為銅、鋁、鎳、錫、 金等金屬或金屬合金。第三種必要結構：以第一活性 材料層322為例，該層是處在第一電極基板32與對應之 16 200828723 電路基板31之隔離區域311之間，其中主要之功能係為 利用第-活性材料層322之活性材料將化學能轉成電能使 用或將電能轉換成化學能儲存於系統之中。 另外’第-種充要結構：以第—分隔元件324為例， 遠結構是處在第-集電層321與對應之電路基板3 離區域311之間，並將處於同位置之第一活性 网 精分隔，其中主要之功能有二項，第—項係為加_定 弟-活性材料層322與第—集電層切之相對位置，心 是糸統處在-般環境或是高溫環境下之撓折狀態，第: 係=加強固，電路基板31與第—集電層321之相對位置 =元===利，貼膠與熱壓合，將第 料層322之Η ^ 集電層321上與第—活性材 隹電揉321 S Ί利用網版印刷直接將膠框印刷於第- 元件324,、、^產生化學架橋結構後，藉以形成第—分隔 第-集電層：由Γ=件324所產生之強黏著力將 ㈣之隔離區二 體之耐撓折度，复中，第一：之黏著固定’增強整 力樹脂與環氧樹月1第一二“件324之材料係為壓克 325為例，充要結構：以第一黏著加強層 層功之間，复1處在弟一集電層321與第一活性材料 與第m i要之功能係為加強第—活性材料層322 佈、轉印‘刷321 了著力，其實施之方式係為利用塗 、】之方式’將第-黏著加強層325形成在於 17 200828723 第一集電層321與第— 黏著加強層325將盘帛^^層322之間，其中，第-纏機構，並且同時因摩弟::舌峨4層322產生較強物理交 著加強㈣與分子助黏劑含量而使第-黏 而增加電能供應=產生較大的勸著力，進 承、死3整體耐撓折性，苴中， 強層325之材料為係為高 電^黏者加 要結構：以第1 位子。弟三種充 取人此a 局層3%為例’該結構是虚^笛 聚合物層323之外，其中 =處在弟- 一从 文刀此你马1接將正、負電極、 = 體整合於第-電路佈局層326上，：第 一電極基板32成為雷玫^ 使弟 j： 板之基板；舉兩個例子_， 々々义44壯触社包柽基板32上之第一電路佈局層326,可 :衣肢積與成本，其二為軟性可撓折顯示器產品，將 』不圖樣直接形成於第-電路佈局層326,利用内部電性 、、接去使頌示圖樣直接帶負電，並利用外部電性連接法 將顯不為上之透明電極與第一電路佈局層326上之正電極 連接控制電極之電壓或電流大小而產生不同灰階顯示， 亦可節省顯示ϋ封裝體積與成本，最重要的是直接將電能 供應系統3與可撓式顯示器基板—體整合。其實施之方式 係可分為内部電性連接法與外部連接法 ，其中，内部連接 法有多種作法’例如利用盲孔與填塞銀漿之技術，或是盲 孔加上在盲孔表面鍍金屬層方式，透過第一聚合物層323 將第一集電層321與第一電路佈局層326做電性連接，當 然若第一聚合物層323之材料為導電高分子或是高分子層 18 200828723 力入^ 1粒子’則無須經由導電盲孔之技術，可直接將兩 層，私11連接。另外，外部連接法亦有多種作法，例如將The following is a description of the implementation of the three necessary structures and the three essential structures. The necessary structure of the younger one. Taking the first polymer layer 3 2 3 as an example, the layer is the most in the first electrode substrate 32. In the peripheral area, there are two main functions, the first is to protect the first collector layer 321 from oxidation under high temperature bears, and the second is to enhance the ability of the first collector layer 321 to resist flexing. The method is implemented by using the alignment adhesive and the thermal compression to completely cover the first polymer layer 323 outside the first collector layer 321 or directly printing the solder resist green paint by screen printing. After the first collector layer 323 is completely covered by the first collector layer 321 and the first polymer layer 321 is covered by the first collector layer 321 , the material of the first polymer layer is PI, PET, PS, PP, calendar, PVC, acrylic resin and epoxy resin. The second necessary structure: taking the first collector layer 321 as an example, the layer is between the first polymer layer 323 and the first active material layer 322, wherein the main function has two items, the first item, The charge generated by the first active material layer 322 is transferred to the external logic circuit region 312 by the first sealing unit 34 or other conductive structures (such as | wires), and the second term is to utilize the first collector. The layer 321 is a metal =! · raw m gas to the first active material layer like speed and quantity, wherein 'the first collector layer 321 material is copper, aluminum, nickel, tin, gold and other metals or metal alloys . A third necessary structure: taking the first active material layer 322 as an example, the layer is between the first electrode substrate 32 and the corresponding isolation region 311 of the circuit substrate 31 of the 2008 20082823, wherein the main function is to utilize the first The active material of the active material layer 322 converts chemical energy into electrical energy or converts electrical energy into chemical energy for storage in the system. In addition, the 'first-type supplementary structure: taking the first-dividing element 324 as an example, the far-structure is between the first-collector layer 321 and the corresponding circuit substrate 3 away from the region 311, and the first activity in the same position Separation of nets, the main function has two items, the first item is the relative position of the _Dingdi-active material layer 322 and the first collector layer, and the heart is in the general environment or high temperature environment. The lower deflection state, the first: the system is strengthened, the relative position of the circuit substrate 31 and the first collector layer 321 = yuan ===, the glue is glued to the heat, and the first layer 322 is collected. The layer 321 and the first active material 揉 揉 揉 揉 揉 揉 Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί Ί 产生 产生 产生 产生Γ = the strong adhesion generated by the piece 324 will be the toughness of the two parts of the isolation zone of (4), the first: the adhesion is fixed 'enhanced the whole force resin and the epoxy tree month 1 second two pieces 324 The material is the gram 325 as an example, the necessary structure: the first adhesion between the layers of work, the first one in the brothers a collector layer 321 and the first live The material and the function of the mith are to strengthen the first active material layer 322, transfer 'brush 321 ', and the way to implement it is to form the first adhesive adhesion layer 325 by means of coating, in 2008 200828723 The first collector layer 321 and the first adhesion enhancement layer 325 will be between the disk layer 322, wherein the first-wrap mechanism, and at the same time, the strong physical interaction is enhanced by the Modi:: tongue layer 4 layer 322 (4) With the content of molecular adhesion promoter, the first-viscosity increases the power supply = produces greater persuasion, and the overall resistance to flexion and tear is improved. In the middle, the material of the strong layer 325 is high-electricity. Add the structure: take the first position. The younger three kinds of people take this a layer of 3% as an example. The structure is a virtual ^ 笛 polymer layer 323, where = is in the brother - a knife from this knife you 1 The positive electrode, the negative electrode, and the body are integrated on the first circuit layout layer 326, and the first electrode substrate 32 becomes the substrate of the Leimei^Jianji: board; for example, 々々, 44々々 The first circuit layout layer 326 on the substrate 32 can be: clothing and cost, and the second is a flexible flexible display product. The sample is directly formed on the first circuit layout layer 326, and the internal pattern is electrically connected, and the display pattern is directly negatively charged, and the transparent electrode and the first circuit layout layer 326 are displayed by an external electrical connection method. The positive electrode is connected to the voltage or current of the control electrode to produce different gray scale display, which can also save display, package volume and cost, and most importantly, directly integrate the power supply system 3 with the flexible display substrate. The method can be divided into internal electrical connection method and external connection method. Among them, the internal connection method has various methods, such as the technique of using blind holes and filling silver paste, or blind holes plus metal plating on the surface of blind holes. The first collector layer 321 is electrically connected to the first circuit layout layer 326 through the first polymer layer 323. Of course, if the material of the first polymer layer 323 is a conductive polymer or a polymer layer 18 200828723 ^ 1 particle' does not need to pass the conductive blind hole technology, can directly connect two layers, private 11 connection. In addition, the external connection method also has a variety of methods, such as
線利用焊接或是ACF(異方向導電膠)製程黏接 於兩層之上、外部軟性電路排線利用焊減是ACF(異方 向導電，)製程黏接於於兩層之上之技術、依據第一集電層 321與第一電路佈局層326之延伸結構基於自身可撓折特 |生利，焊接或是ACF(異方向導電膠)製程互相黏接技 疋直接黏合或印刷可導電之高分子以連接兩層。此 、弟電路佈局層326亦可經由以上所述之外部電極連接 S’、:'在立屯路基板31上之邏輯電路區土或312做電性連 二一主思者，第二電極基板33更具有第二聚合物層333、 二刀隔兀件334、第二黏著加強層335、及第二電路佈 三、-/、功此與結構係與前述之第一聚合物層323、 :分隔兀件324、第—黏著加強層325、及第一電路佈 局層326相同，故此不再贅述。 一再者明同日守茶照圖3與圖4所示，在電路基板 =離區域311内係移除第一金屬層313與第二金屬 ’且更於基板聚合物層314上形成複數微孔洞 3141 微孔洞3141係貫穿位於電路基板31之隔離區 上之基板聚合㈣314，該些微孔洞3i4i之主要之 ::=Γ電極基板32與第二電極基板33之電子心 v通層’同時為了避免開口結構造成微短路狀; /、局。卩電極活性區域負載過大造成第—活性 ‘ 化過快，故需在此微孔洞3141上覆蓋上^ 322 ^ π 一層電子隔離^ 19 200828723 316、317，其主要之功能不僅在避免以上之問題，同時亦 可加強第一活性材料層322與第二活性材料層332與相對 應之電路基板31之隔離區域311之黏著力，同時因為覆 蓋上此電子隔離層316、317，亦相對會影響離子導電度， 同時材料之機械強度亦是考慮之重點，基本上微孔洞3141 . 之大小與開口率需做一定設計，其中，電子隔離層316、 317之主要材料係為高分子材料與支撐微體，其支撐微體 之功能在於增加電子隔離層316、317之離子導電度尤其 ® 是離子穿越電子隔離層316、317之距離長短，同時此支 撐微體亦可增加含吸電解液能力。其中，此支撐微體之材 料可為二氧化矽、二氧化鈦與二氧化鋁等氧化金屬，表面 經過疏水性處理。 、 請同時參照圖5與圖6所示，其中圖5係為圖2之局 部結構放大示意圖，其主要放大之區域在於第一封裝單元 34、第二封裝單元35與其鄰接之其他電能供應系統之結 φ 構，在圖5中，該區域只顯示第一封裝單元34及第二封 裝單元35此一必要結構，而圖6亦係為圖2之局部結構 放大示意圖，其主要放大之區域亦為第一封裝單元34、第 二封裝單元35與其鄰接之其他電能供應系統之結構。在 圖6中，除了第一封裝單元34及第二封裝單元35為必要 ‘ 結構之外，另外增加了兩項充要結構，其包含了第一鈍性 單元341及第二鈍性單元351與第一成型單元342及第二 成型單元352。以下是針對第一封裝單元34與其鄰接之其 他電能供應系統結構進行實施態樣說明；第一種必要結 20 200828723 構乂第封裝單元34為例：由圖面之垂直轴上察， 第-封裝單元34是處在第—電極基板32之第〜集電層 321與相對應之電路基板31之隔離區域3ιι之間，=再細 分結構丄第-封裝單元34又可分為第—上封裝，其 係位在第-集電層321上，與第一下封款元件，其係位在 相對應於第一電極基板32之電路基板31上，其中，第一 封裝料34可以全部是第—上封裝元件或是第1封裝 元件，或是由兩者所共同形成，不僅如此，當由第一上封 裝兀件及第一下封裝元件共同形成第一封裝單元％時， :以利用數種特別排列加強其功能，如第—上封裝元件與 第一下封裝元件交錯排列或上下重疊排列，以增加黏著 力:導電能力與阻氣效果。由圖面水平軸向觀察，第〆対 裝早兀34是介於第一活性材料層322與邏輯電路區域312 之巧其中主要之功能有三項，第—項係將第—電極基板 32之第-活性材料層322密封在第一集電層321、所對應 之電路，板3i之隔離區域311與第一封裝單元％之内， 其主要是為了避免電練外料是外部水氣參人 係 為透過第一封裝單元34所 ’、 % ^ ^ . 夕风心艮好黏者力於第一電極 S性如板31之_加強整體電能供應系統之機 =二曲特性等’第三項係為透過第-封裝單元 將电能供應系統内部所產生之電能傳至電路其π 其中，第-:=4:=使用外部電性連接方法， 料係選自膠體、金屬 “疋件）之材 ^圾瑀域維或二者混用。其中，若第 21 200828723 一封裝單元34 (包含第一上、下封裝元件）之材料係為膠 體時，其膠體種類可為單純膠體結構或是含阻氣性材料 (如玻璃纖維）之混和性膠體，或更可以是含有第一導電 粒子之混和性膠體，其實施方法為對位貼合或是網印，將 膠體黏合於第一電極基板32與其相對應之電路基板31之 上，最後進行壓合製程後形成，其中，該膠體之主要材料 係選自於PI、環氧樹脂或壓克力樹脂，而阻氣性材料可為 數種材料，例如：金屬粒子或是玻璃纖維，至於第一導電 粒子，其材料可係選自於金、銀、錫、鎳、銘、銅、銘或 導電碳粉。另外，若第一封裝單元34 (包含第一上、下封 裝元件）之材料係為金屬，其實施方法為選鍍金屬或蝕刻 金屬，其意義在於形成銅凸框或是銅凹槽於第一集電層 321與所對應之電路基板31之第一金屬層313上，並利用 該結構增強黏著力、導電能力與阻氣效果。其中金屬材料 係選自於銅、鋁、鎳、金、銀或錫，基本上第一上、下封 裝元件之材料可以相同也可以不相同，亦即是第一上、下 封裝元件皆可為膠體，或是第一上、下封裝元件皆可以為 金屬，亦或者是第一上、下封裝元件可以分別為膠體或金 屬。需注意者，第二封裝單元35之功能與結構係與前述 之第一封裝單元34相同，故此不再贅述。 第一種充要結構，以第一鈍性單元341為例：由圖面 之垂直軸上觀察，第一鈍性單元341是處在第一電極基板 32與其相對應之電路基板31之隔離區域311之間，若再 細分結構，第一鈍性單元341又可分為第一上鈍性元件， 22 200828723 第一集電層321上’與第-下鈍性元件，其係位 ;電路基板〜其中，第一鈍性單元34、= ::疋弟一上純性元件或是第一下二 所共同形成，不僅如此，當由 1疋由兩者 成第一铀±田由弟一上、下鈍性元件共同形 功能，如Π ^可:利用數種特別排咖 以增力，著力、阻液效果上下咖 察，第-鈍性單元341==絲。賴面水平軸向觀 一電極其虹π夕筮、胥之功此有二項，第一項係將第 π '舌性材料層322密封在第一集電層 心所對應之電路基板31之隔離區域3 純 ^之内’其主要是為了避免電 丄一 ^ 早兀34之黏著能力下降， ，、风弟釕衣 析出之可能性，第三項料㈣降⑽金屬於邊框 ，成離子溶解於電能供應系統3之中，其中， 單兀341(包含第一上、下鈍性元件 ；阳 !:，電化學穩定材料或三者混用。其中二膠= 早兀341(包含第一上、下鈍性元件 、 ^膠體種類可為單_體結構或是含電 璃纖維)之混和性膠體，其實施方法位:戈是 印，將膠體黏合於第-集電層321或其相對二2= 3i之上並且介於在第一活性材料層322與“ 土 34之間，再進行最後壓合製程 ' ―封裝单兀 材料係選自於pi、環氧樹脂或壓克力樹脂:：:體之主要 兄刀树舳而電化學穩定 23 200828723 材料可為數種材料，例如：破璃鐵維。 包含第-™元件)之材料係為金：二 細方法為選驗屬，其意義在㈣麟凸 奶或其相對應之電路基板31之第—金屬層:上 =在第—活性材料層322與苐一封裝單元34之間，同時 行金屬表面純化處理，如氧化處理。其中金屬材 ，自於鋼、1呂、鎳、金、銀或錫，基本上第一上、下 純之材料可以相同也可以不相同、亦可以不同於第 之材料，其組合只能為第-上、下鈍性元 、、主音者二’或弟一上、下纯性元件至少一個為膠體。需 1二鈍性單元351之功能與結構係與前述之第一 單凡341相同，故此不再贅述。 第二種充要結構，以第一成型單 之垂直轴上觀臾，第㈣卜 2為例.由圖面 肩上嬈祭，弟一成型早元342 =相對應巧_31之隔離_ 34盥產1 向夕^祭’弟一成型單元342是介於第一封裝單元 曰Λ 邊線（即第一電極基板32之邊界週緣）之 與相對雍主ί之功能有二項，第一項係將第一集電層321 ㈣二ίΐ路基板31之第一金屬層313隔絕，故可在 +凰=5時避免第—集電層321與電路基板31之第一 鱼3接觸造成短路發生。第二項係將第一集電層321 ::::電層如隔絕，故可在成型或壓合時避免第一集. =曰、321與弟二集電層331接觸造成短路發生。其中，第 一成型單元342之實施方法係將第-集電層321與其相對 24 200828723 應之電路基板31之第一金屬層313，利用化學侧將其二 者’丨於第爿衣單元34與產品外型邊線（即第—電極基板 32之邊界週緣)之金屬餘去人亦即是在第-成型單元342 ^内並無第一集電層321而僅有第-聚合物層323，且在 第成型單το 342 0，亦可能是無電路基板31之第一金 屬層313而僅有基板聚合物層314。需注意者，第二成型 單元352之功能與結構係與前述之第一成型單元如相The wire is bonded to the two layers by soldering or ACF (transverse conductive paste) process, and the external flexible circuit cable is soldered and reduced by ACF (transverse conductive,) process bonding on the two layers. The extension structure of the first collector layer 321 and the first circuit layout layer 326 is directly bonded or printed to be electrically conductive based on the self-flexible, soldering or ACF (transverse conductive paste) process bonding technology. The molecules are connected to two layers. The circuit layout layer 326 can also be connected to the external electrode via the above-mentioned external electrodes S',: 'the logic circuit region on the vertical circuit substrate 31 or 312 for the electrical connection, the second electrode substrate 33 further has a second polymer layer 333, a second knife spacer 334, a second adhesion enhancement layer 335, and a second circuit cloth three, - /, and the structure and the first polymer layer 323, The separation member 324, the first adhesion enhancement layer 325, and the first circuit layout layer 326 are the same, and thus will not be described again. Again and again, as shown in FIG. 3 and FIG. 4, the first metal layer 313 and the second metal are removed in the circuit substrate=offer region 311, and a plurality of microvias are formed on the substrate polymer layer 314. The 3141 micro-hole 3141 is penetrated through the substrate polymerization (four) 314 located on the isolation region of the circuit substrate 31. The main holes of the micro-holes 3i4i are: := the electron-electrode v-layer of the electrode substrate 32 and the second electrode substrate 33 simultaneously The opening structure causes a micro-short circuit; /, board. If the load on the active area of the yttrium electrode is too large, the first activity is too fast, so it is necessary to cover the micropores 3141 with a layer of 322 ^ π. One layer of electronic isolation ^ 19 200828723 316, 317, its main function is not only to avoid the above problems. At the same time, the adhesion between the first active material layer 322 and the second active material layer 332 and the corresponding isolation region 311 of the circuit substrate 31 can be strengthened, and at the same time, because the electronic isolation layers 316 and 317 are covered, the ions are relatively affected. Conductivity, and the mechanical strength of the material is also the focus of consideration. Basically, the size and aperture ratio of the micropores 3141 are designed. The main materials of the electronic isolation layers 316 and 317 are polymer materials and support micros. The function of the supporting micro-body is to increase the ionic conductivity of the electronic isolation layers 316, 317, especially the distance between the ions passing through the electronic isolation layers 316, 317, and the supporting micro-body can also increase the ability to absorb electrolyte. The material supporting the micro-body may be an oxidized metal such as cerium oxide, titanium dioxide or aluminum oxide, and the surface is subjected to hydrophobic treatment. Please refer to FIG. 5 and FIG. 6 at the same time, wherein FIG. 5 is an enlarged schematic view of a partial structure of FIG. 2, and the main enlarged area thereof is that the first package unit 34 and the second package unit 35 are adjacent to other power supply systems. In FIG. 5, this area only shows the necessary structure of the first package unit 34 and the second package unit 35, and FIG. 6 is also an enlarged schematic view of the partial structure of FIG. 2, and the main enlarged area thereof is also The structure of the first power supply system adjacent to the first package unit 34 and the second package unit 35. In FIG. 6, in addition to the first package unit 34 and the second package unit 35 being the necessary structure, two additional structures are added, including the first passive unit 341 and the second passive unit 351. The first molding unit 342 and the second molding unit 352. The following is an implementation of the first package unit 34 and other power supply system structures adjacent thereto; the first necessary structure 20 200828723 constitutes the package unit 34 as an example: from the vertical axis of the drawing, the first package The unit 34 is disposed between the first collector layer 321 of the first electrode substrate 32 and the corresponding isolation region 3 ι of the circuit substrate 31, and the sub-packaging unit 34 can be further divided into a first package. The first encapsulant 34 can be located on the first collector substrate 31, and the first encapsulant 34 can be all the first. The upper package component or the first package component is formed by the combination of the two, and when the first package component is formed by the first upper package component and the first lower package component, The special arrangement enhances its function, such as the first-up package component and the first lower package component are staggered or overlapped to overlap each other to increase the adhesion: conductivity and gas barrier effect. Viewed from the horizontal axial direction of the drawing, the first armor 34 is between the first active material layer 322 and the logic circuit region 312. The main function has three items, and the first item is the first electrode substrate 32. - the active material layer 322 is sealed in the first collector layer 321, the corresponding circuit, the isolation region 311 of the board 3i and the first package unit%, mainly for avoiding the external environment of the electric water In order to pass through the first package unit 34, '%^^. 夕风心艮 is good at the first electrode S as the board 31 _ strengthens the overall power supply system machine = two-curve characteristics, etc. 'third line In order to transmit the electric energy generated inside the electric energy supply system to the circuit through the first package unit, the first::=4:= uses an external electrical connection method, and the material is selected from the group consisting of colloid and metal “pieces” ^ If the material of the package unit 34 (including the first upper and lower package components) is a colloid, the colloid type may be a simple colloidal structure or contain gas barrier properties. a hybrid colloid of materials (such as fiberglass), or more The mixed colloid containing the first conductive particles is carried out by alignment or screen printing, and the colloid is adhered to the first electrode substrate 32 and the corresponding circuit substrate 31, and finally formed by a pressing process. Wherein, the main material of the colloid is selected from PI, epoxy resin or acrylic resin, and the gas barrier material may be several materials, such as metal particles or glass fibers, as for the first conductive particles, the material thereof may be The material is selected from the group consisting of gold, silver, tin, nickel, indium, copper, or conductive carbon powder. In addition, if the material of the first package unit 34 (including the first upper and lower package components) is metal, the implementation method is The metal plating or the etching metal is selected to form a copper bump or a copper recess on the first collector layer 321 and the corresponding first metal layer 313 of the circuit substrate 31, and the structure is used to enhance adhesion and conductivity. Capacitance and gas barrier effect, wherein the metal material is selected from copper, aluminum, nickel, gold, silver or tin, and the materials of the first upper and lower package components may be the same or different, that is, the first upper layer, Lower package element The components may be colloidal, or the first upper and lower package components may be metal, or the first upper and lower package components may be respectively colloidal or metal. Note that the function and structure of the second package unit 35 It is the same as the first package unit 34 described above, and therefore will not be described again. The first necessary structure is exemplified by the first passive unit 341: the first passive unit 341 is viewed from the vertical axis of the drawing. Between the first electrode substrate 32 and the isolation region 311 of the corresponding circuit substrate 31, if the structure is further subdivided, the first passive unit 341 can be further divided into a first upper passive element, 22 200828723 first collector layer 321 Upper 'and the first-lower passive element, its position; the circuit substrate ~ wherein the first passive unit 34, = :: the younger one is a pure element or the first two are formed together, not only when From 1疋, the first uranium is added to the first uranium. The upper and lower blunt elements have the common shape function, such as Π ^ can: use several special arranging coffee to increase the force, focus on the effect of blocking liquid, the first - blunt Sex unit 341 == silk. The horizontal axis of the upper surface of the electrode is the same as that of the magnetic circuit, and the first item is to seal the π 'thin material layer 322 in the isolation region of the circuit substrate 31 corresponding to the first collector layer. 3 pure ^ inside 'the main reason is to avoid the electric 丄 ^ 兀 34 early adhesion of 34, the possibility of the wind brother 钌 clothing, the third item (four) drop (10) metal in the frame, the ions dissolved in electrical energy In the supply system 3, wherein the single 兀 341 (including the first upper and lower passive elements; yang!:, electrochemically stable material or a mixture of the three. Among them, the second glue = early 341 (including the first upper and lower blunt The sexual component, the colloid type may be a single-body structure or a mixed colloid containing a glass fiber, and the method of implementation is as follows: Ge is printed, the colloid is bonded to the first collector layer 321 or its relative two 2 = 3i Above and between the first active material layer 322 and the "soil 34, and then the final pressing process" - the package material is selected from the group consisting of pi, epoxy resin or acrylic resin::: body The main brother is a tree and the electrochemical stability 23 200828723 The material can be several materials, for example: broken iron The material containing the -TM element is gold: the second method is a test genus, and its meaning is in (four) sacral milk or its corresponding circuit substrate 31 - metal layer: on the first active material layer 322 Between the package unit 34 and the package unit 34, the metal surface is purified at the same time, such as oxidation treatment. The metal material, from steel, 1 Lu, nickel, gold, silver or tin, basically the first upper and lower pure materials can be The same may be different or different from the first material, and the combination may only be a first-upper, a lower-blown element, a lead-one, or a lower-one pure element, at least one of which is a colloid. The function and structure of the passive unit 351 are the same as those of the first unit 341 described above, and therefore will not be described again. The second necessary structure is viewed on the vertical axis of the first forming sheet, and the fourth (4) is taken as an example. From the shoulder of the figure, the sacred sacrifice, the younger one formed the early 342 = the corresponding _31 of the isolation _ 34 盥 production 1 夕 ^ sacrifice 'di brother a molding unit 342 is between the first package unit 边 edge line (ie the first There is two functions of the edge of the boundary of an electrode substrate 32, and the first item is the first item. The collector layer 321 (4) is separated from the first metal layer 313 of the substrate 31, so that the contact between the first collector layer 321 and the first fish 3 of the circuit substrate 31 can be avoided when + phosing = 5. If the first collector layer 321 :::: electrical layer is isolated, the first set can be avoided during molding or pressing. = 曰, 321 contact with the second collector layer 331 causes a short circuit to occur. The molding unit 342 is implemented by the first collector layer 321 and the first metal layer 313 of the circuit substrate 31 corresponding to the same, and the chemical side is used to slap the two sides of the first garment unit 34 and the product outline. The metal remaining in the boundary of the boundary of the first electrode substrate 32 is that there is no first collector layer 321 and only the first polymer layer 323 in the first molding unit 342^, and in the first molding sheet. Το 342 0 may also be the first metal layer 313 of the circuitless substrate 31 and only the substrate polymer layer 314. It should be noted that the function and structure of the second molding unit 352 is the same as the first molding unit described above.
同，故此不再贅述。 、、’T、上所述，因依本發明之電能供應系統係採用電路基 板來分隔第—活性材料層及第二活性材料層，亦即可以將 電池單元錢整合於電路板+，_能祕電能供應系統 與電路板進行有效地整合，甚至可以應用電路板的製程條 件來製造本發明之電能供應“。與f知技術相較，依本 發明之電能供應系統可讀電路板的製程整合，電能供應 系統可以視為-種表面黏著元件⑽T)，因此，可以械 降低產品的製造成本，而且還可以使得產品更加的小型 型化，此外，第—電極基板及第二電極基板之外側 可以更設置有其他電路基板，0此可以有效_電能供岸 糸統的區域進行電路佈局上，藉以使得產品更加小魏了 Μ上所述僅為舉例性，而非為限制性者。任何未 本發明之精神與射，㈣其進行之等效修改或變更，均 應包含於後附之申請專利範圍中。 【圖式簡單說明】 25 200828723 圖i為一示意圖，顯示習知電池之結構剖面示意圖； 圖2為一示意圖，顯示依本發明較佳實施例之電能供 應系統之結構剖面示意圖； 圖3為一示意圖，顯示依本發明較佳實施例之電能供 應系統之局部結構剖面示意圖，其係主要顯示電路基板之 隔離區域； 圖4為一示意圖，顯示依本發明較佳實施例之電能供 應糸統之結構剖面不意圖？其係主要顯不電路基板之隔離 區域的必要結構及充要結構， 圖5為一示意圖，顯示依本發明較佳實施例之電能供 應系統之結構剖面示意圖，其係主要顯示第一封裝單元、 第二封裝單元及其鄰近結構；以及 圖6為一示意圖，顯示依本發明較佳實施例之電能供 應系统之結構剖面示意圖，其係主要顯示第一封裝單元、 第二封裝單元及其鄰近的必要結構及充要結構。 元件符號說明： I 電池 II 隔離層 12 第一活性材料層 13 第二活性材料層 14 第一集電層 141 導電柄 15 第二集電層 26 200828723The same, therefore no longer repeat them. As described above, the power supply system according to the present invention uses a circuit substrate to separate the first active material layer and the second active material layer, that is, the battery unit money can be integrated into the circuit board +, The power supply system is effectively integrated with the circuit board, and even the process conditions of the circuit board can be used to manufacture the power supply of the present invention. Compared with the technology of the present invention, the process integration of the power supply system readable circuit board according to the present invention is integrated. The electric energy supply system can be regarded as a kind of surface adhesive element (10)T), so that the manufacturing cost of the product can be reduced, and the product can be further miniaturized. In addition, the outer side of the first electrode substrate and the second electrode substrate can be There are other circuit boards, 0 can be effective _ electric power supply area for circuit layout, so that the product is even smaller. The above description is only an example, not a limitation. The spirit and the invention of the invention, (4) the equivalent modification or modification of the invention shall be included in the scope of the patent application attached. [Simple description of the diagram] 25 20082 FIG. 2 is a schematic cross-sectional view showing a structure of a conventional battery; FIG. 2 is a schematic cross-sectional view showing a structure of a power supply system according to a preferred embodiment of the present invention; FIG. 3 is a schematic view showing a comparison according to the present invention. FIG. 4 is a schematic view showing a structural section of a power supply system according to a preferred embodiment of the present invention. FIG. 4 is a schematic view showing a structural section of a power supply system according to a preferred embodiment of the present invention; FIG. 5 is a schematic cross-sectional view showing the structure of the power supply system according to the preferred embodiment of the present invention, which mainly shows the first package unit and the second The package unit and its adjacent structure; and FIG. 6 is a schematic cross-sectional view showing the structure of the power supply system according to the preferred embodiment of the present invention, which mainly shows the necessary structure of the first package unit, the second package unit and its adjacent And the necessary structure. Symbol description: I Battery II isolation layer 12 first active material layer 13 second Material layer 14 of the first collector layer 141, a second collector layer conductive shank 15 26 200 828 723
151 導電柄 16 封裝單元 2 電子裝置 21 電源輸入端子 22 電源輸入端子 23 元件區 3 電能供應糸統 31 電路基板 311 隔離區域 312 迦輯電路區域 313 第一金屬層 314 基板聚合物層 3141 微孔洞 315 第二金屬層 316 電子隔離層 317 電子隔離層 32 第一電極基板 321 第一集電層 322 第一活性材料層 323 第一聚合物層 324 第一分隔元件 325 第一黏著加強層 326 第一電路佈局層 33 第二電極基板 200828723 331 第二集電層 332 第二活性材料層 333 第二聚合物層 334 第二分隔元件 335 第二黏著加強層 336 第二電路佈局層 34 第一封裝單元 341 第一鈍性單元 342 第一成型單元 35 第二封裝單元 351 第二鈍性單元 352 第二成型單元151 Conductor shank 16 Package unit 2 Electronics 21 Power input terminal 22 Power input terminal 23 Component area 3 Power supply system 31 Circuit board 311 Isolation area 312 Circuit area 313 First metal layer 314 Substrate polymer layer 3141 Micro-hole 315 second metal layer 316 electronic isolation layer 317 electronic isolation layer 32 first electrode substrate 321 first collector layer 322 first active material layer 323 first polymer layer 324 first spacer element 325 first adhesion enhancement layer 326 first Circuit layout layer 33 second electrode substrate 200828723 331 second collector layer 332 second active material layer 333 second polymer layer 334 second spacer element 335 second adhesion enhancement layer 336 second circuit layout layer 34 first package unit 341 First passive unit 342 first molding unit 35 second packaging unit 351 second passive unit 352 second molding unit