1323541 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種電能供應系統，特別關於一種整合 電路基板之電能供應系統。 【先前技術】 由於電子、資訊及通訊等3C產品均朝向無線化、可 攜帶化方向發展，應用於各種產品的各項高性能元件除了 ® 往輕、薄、短、小的目標邁進外，近年來，可撓式電子產 品的技術發展也逐漸受到重視，因此，對於體積小、重量 輕、能量密度高的電池需求係相當地迫切。 首先，以電池系統的使用特性為例，為了延長電池使 用的時間、提昇電池的能量密度，過去無法重複使用的一 次電池系統係已無法滿足現今電子產品的需求，而目前應 用於電子產品中的電池系統多以可重複充、放電的二次電 φ 池系統為主流，例如：鋰電池系統、燃料電池系統、太陽 能電池系統...等等，然而，因為在現今的技術發展下，燃 料電池仍面臨有最小尺寸的限制，而太陽能電池系統則是 基於材料的限制而無法獲得較為理想的能源轉換效率，因 ' 此，在上述的二次電池系統中能夠達到小體積、高能量密 -- 度的要求者係為技術較為成熟之鋰電池系統，請參考圖1 所示之鋰電池系統之電池芯結構示意圖，此電池芯之結構 係由過去的堆疊式結構演進至現今較常見的捲繞式結 構，然而，無論是堆疊式結構或是捲繞式結構的電池芯， 1323541 主要的結構係由一正極極板與一負極極板之間夾設一隔 離層所構成，而在正極極板與負極極板的集電層上係分別 焊接一導電柄結構以為外部電極，使得電池系統可藉由此 二外部電極與周邊電子元件進行電性連接。如圖1所示， 電池1包括一隔離層11、一第一活性材料層12、一第二 活性材料層13、一第一集電層14、一第二集電層15以及 一封裝單元16。如圖1所示，第一活性材料層12設置於 隔離層11上，第一集電層14設置於第一活性材料層12 上，而第二活性材料層13設置於隔離層11下，第二集電 層15設置於第二活性材料層13下，最後，封裝單元16 將此堆疊結構密封，僅露出導電柄141、151。如上所述， 若電池1要提供電能至一電子裝置2(圖1係僅顯示一電路 板）時，必須將導電柄141、151與電子裝置2之電源輸入 端子21、22電性連接，藉以將電池1所儲存的電能輸出 至電子裝置2，之後，可再藉由導線將電能傳輸至電子裝 置2之元件區23，其中，元件區23可以包括邏輯電路、 主動元件、被動元件等，其可以是電路佈局或是表面黏著 元件（SMT)。 然而，因為隔離層11與第一活性材料層12及第二活 性材料層13之間的接觸界面是否具有良好的接觸係對於 整體電池系統的電性與安全性表現有相當直接且嚴重的 影響，因此，在習知的裡電池技術中為了維持此些界面的 良好接觸，無論是堆疊式結構或是捲繞式結構的電池芯， 在完成電池的組裝後其整體結構的撓折性係相當地低，甚 1323541 至是無法撓折，以避免因為撓折而產生的應力導致隔離層 11與第一活性材料層12及第二活性材料層13之間的界面 受到破壞，因而降低了電池系統的電性與安全性表現。 再以電池系統的封裝結構而論，無論是上述的一次電 池系統或是二次電池系統，習知的所有電池系統包裝多是 Λ 以硬金屬外殼（包括傳統圓柱形與方形）的外觀型態呈現， 除了可避免電池芯受到外界應力的破壞，也可以降低外界 因子對於電池内部化學系統的影響。以二次鋰電池為例， 籲 其最常見的電池外觀係為方形結構，因此，對於終端電子 產品而言，雖然二次鋰電池係可提供較佳的電性表現與使 用壽命，但由於其固定的尺寸設計與堅硬的外殼材質而使 得大部分電子產品在進行電路設計時係受到相當大的限 制，雖然後續的二次電池系統係發展出以金屬軟包裝的形 式取代習知硬金屬外殼的封裝技術，因此可降低二次電池 系統在電子產品應用中的困難度’然而，相對於習知的硬 φ 金屬外殼來說，金屬軟包裝的封裝結構係利用熱壓封合的 方式實現，因此金屬軟包裝在上述之導電柄之封合界面 上，因為導電柄之金屬與金屬軟包裝的熱封聚合物係為兩 異質材料，所以其間的封合效果不佳，因而在阻氣、阻水 -- 的效果表現上係較習知以焊接封合的硬金屬外殼為差，且 又當一次電池不斷地進4亍充、放電後會引起電池系統在整 體尺寸上產生體積膨服與收縮的問題，此時，由於金屬軟 包裝本身係無法提供足夠的材料應力，因此係無法有效地 維持二次電池的尺寸，而導致電子產品在進行電路設計時 1323541 面臨到惱人的困難。 另外，就更微觀的電化學系統來說，請再次參考圖i 所不，第一活性材料層12及第二活性材料層13之間設置 -隔離層u ’此隔離層丨1係主要用避免第一電極基板（包括 P活性㈣層12及第-集電層14)與第二電極基板（包 括第二活性材料層13及第二集電層15)發生直接的接觸而 在電池1内發生内部短路的問題，但同時卻又必須能夠提 供電池1中離子遷移所需的路徑，因此，此隔離層u的 材料必須兼顧有不導電與多孔性之特徵，常見的隔離層u 係利用聚乙稀、聚丙烯等聚合物材料以製成，此外，依據 不同聚合㈣同-聚合物但不同分子量的玻璃轉化與軟 化溫度更可在-定的溫度範圍内改變局部聚合物的結 構，故’當電池系統因内部短路、外部短路或任何因素而 導致其内部的溫度上升時，透過隔離層η結構的改變而 封閉電池1中離子遷移的路徑以避免電池丄在高溫下繼續 鲁進行電化學反應，可降低電池丨發生爆炸的機率。 然而，若電池1因故仍舊持續昇溫，一旦電池内部達 到mum：，基於習知技術中隔離層η之物理特性， 其隔，層11仍會整體性融化崩潰，造成全面短路並進而 --產生嚴重起火或爆炸，同時因為隔離層u本身不具有導 ..電性，且聚合物係呈現交錯糾結的結構，因此，對於微觀 的離子遷移反應而言，過於複雜且交錯糾結的結構會造成 離子在進行遷移時，因為過長或是過為彎曲的路徑而提高 了離子遷料的障礙，也因此降低了整體電池线的離子 1323541 導電度。 除了上述的種種缺失以外，由於在可撓式電子產品中 多數的電路設計皆已達到可撓曲的設計要求，惟，就現有 的電池系統而言，無論上述的何種電池系統皆無法在維持 良好的電性與安全性表現下同時提供可撓曲的特性，另 外，也由於電子產品的體積逐漸微小化，但其所應用之電 池系統卻未能相對應地縮小其體積之設計併同時兼顧良 好的電性表現，因而使得大部分的電子產品必須犧牲部分 的結構空間以用來設置所需之電池系統，也因此讓電子產 品在尺寸的設計上受到相當的限制。 再者，電池1的隔離層11的材料無法耐受高溫製程， 所以其製造無法與電路板(如印刷電路板、可撓式電路板等) 的製程進行整合，因此，對於電子裝置2而言，電池1必 然是外接的元件，如此不僅提高電子裝置2的成本，而且 對於電子裝置2的小型化、薄型化皆有一定的限制；此外， 電子裝置2必須設計容納電池1的容置空間，此容置空間 將無法有效地運用在電路佈局上，至為可惜。 因此，如何提供一種能夠解決上述問題的電能供應系 統，正是當前電子產業的重要課題之一。 【發明内容】 有鑑於上述課題，本發明之目的為提供一種能夠整合 於電路板及其製程的電能供應系統。 緣是，為達上述目的，依本發明之一種電能供應系統 2-電路基板、—第—電極基板一第二電極基板、一 封裝單it、以及H裝單S。在本發明中，電路 2板係包括至少一隔離區域，第一電極基板係位於電路基 之側，且第一電極基板係包括一第一集電層及一第一 活性材料層，第一活性材料層係位於隔離區域與第一集電 層之間、並與隔離區域相對而設；第二電極基板係位於電 路基板之另一側，且第二電極基板包括一第二集電層及一 第/舌性材料層，第二活性材料層係位於隔離區域與第二 集電層之間、並與隔離區域相對而設；第一封裝單元係位 於第一電極基板與電路基板之間、並環設於第一活性材料 層周圍，而第二封裝單元係位於第二電極基板與電路基板 之間、並環設於第二活性材料層周圍。 承上所述，因依本發明之電能供應系統係採用電路基 板朿刀隔第一活性材料層及第二活性材料層，亦即可以將 電池單元直接整合於電路板中，所以能夠將電能供應系統 與電路板進行有效地整合，甚至可以應用電路板的製程條 件來製造本發明之電能供應系統。與習知技術相較，依本 發明之電能供應系統可以與電路板的製程整合，電能供應 系統可以視為一種表面黏著元件（SMT)，因此，可以有效 降低產品的製造成本，而且還可以使得產品更加的小型 化、薄塑化；此外，第一電極基板及第二電極基板之外側 可以更設置有其他電路基板，因此可以有效利用電能供應 系統的區域進行電路佈局上，藉以使得產品更加小型化。 1323541 【實施方式】 以下將參照相關圖式，說明依本發明較佳實施例 能供應系統。 為了能直接將電能供應單元整合於一般可撓性/非可 撓性電路板上，並同時提供具有成本低、大容量、高熱穩 疋性與額外機械特性（如可多次撓折特性）之電能供應^ 統，本發明係提出一種可撓式邏輯電能系統，利用此項發 明設計，不僅使得一般產品之電路設計可以直接將電能^ 應單元整合於電路基板内’不需要額外之載體與焊點，门 時利用電路基板作為隔離層之用，其中，電路基板之熱穩 定溫度超過300°C以上，可執行純錫回焊製程以進行連續 表面黏著技術(SMT)、甚至進行晶片（ic)之金金共晶製程以 達成直接整合電能供應系統與（可撓性/非可撓性）電路板 之大型置產可能性’同時此系統亦提供相當於現行二次鍾 電池之體積能量密度與低單位電容量生產成本，但大巾备改 善現行二次鋰電池無法具有高熱穩定且無法直接與電路 板整合成一體成型之特性。以下，係提供本發明之實施熊 樣’並佐以圖式詳加說明’以闡述本發明之主要技術特行 請參考圖2所示’其中’圖2係為本發明較佳實施例 之電能供應系統之結構剖面示意圖。如圖2所示， 电月b供 應系統3包含一電路基板31、一第一電極基板32、一苐 二電極基板33、一第一封裝單元34、以及一第二封筆时 元35。其中，電路基板31係包括至少一隔離區域 第一電極基板32係位於電路基板31之一側，且第— 電極 12 Π23541 =板Μ係包括—第一集電層321及一第一活性材料層 第一活性材料層322係位於隔離區域311與第一集 拓曰321之間、並與隔離區域311相對而設；第二電極基 勹係位於電路基板31之另一側，且第二電極基板33 二括Γ第二集電層331及一第二活性材料層332，第二活 材料層332係位於隔離區域如與第二集電層之 間：並與隔離區域311相對而設；第一封裝單元34係位1323541 IX. Description of the Invention: [Technical Field] The present invention relates to an electric energy supply system, and more particularly to an electric energy supply system integrating a circuit substrate. [Prior Art] Since 3C products such as electronics, information and communication are moving toward wireless and portable, various high-performance components used in various products are not only the light, thin, short, and small targets, but also in recent years. The technological development of flexible electronic products has also received increasing attention. Therefore, the demand for batteries with small size, light weight and high energy density is quite urgent. First, taking the use characteristics of the battery system as an example, in order to prolong the battery use time and increase the energy density of the battery, the primary battery system that could not be reused in the past has been unable to meet the demand of today's electronic products, and is currently used in electronic products. The battery system is mostly dominated by secondary electric φ pool systems that can be recharged and discharged, such as lithium battery systems, fuel cell systems, solar cell systems, etc. However, because of the development of today's technology, fuel cells Still facing the limitation of the smallest size, the solar cell system is unable to obtain the ideal energy conversion efficiency based on the material limitation, because 'the small volume and high energy density can be achieved in the above secondary battery system-- The requirement is for a more mature lithium battery system. Please refer to the schematic diagram of the battery core structure of the lithium battery system shown in Figure 1. The structure of the battery core has evolved from the past stacked structure to the more common winding today. Structure, however, whether it is a stacked structure or a wound cell structure, 1323541 The structure is composed of a separator layer sandwiched between a positive electrode plate and a negative electrode plate, and a conductive handle structure is welded on the current collector layer of the positive electrode plate and the negative electrode plate to serve as an external electrode, so that the battery system The two external electrodes can be electrically connected to the peripheral electronic components. As shown in FIG. 1 , the battery 1 includes an isolation layer 11 , a first active material layer 12 , a second active material layer 13 , a first collector layer 14 , a second collector layer 15 , and a package unit 16 . . As shown in FIG. 1, the first active material layer 12 is disposed on the isolation layer 11, the first collector layer 14 is disposed on the first active material layer 12, and the second active material layer 13 is disposed under the isolation layer 11, The second collector layer 15 is disposed under the second active material layer 13. Finally, the package unit 16 seals the stacked structure to expose only the conductive handles 141, 151. As described above, if the battery 1 is to supply electric energy to an electronic device 2 (only one circuit board is shown in FIG. 1), the conductive handles 141 and 151 must be electrically connected to the power input terminals 21 and 22 of the electronic device 2, thereby The electrical energy stored in the battery 1 is output to the electronic device 2, and then the electrical energy can be transmitted to the component region 23 of the electronic device 2 by wires, wherein the component region 23 can include logic circuits, active components, passive components, etc. It can be a circuit layout or a surface mount component (SMT). However, whether the contact interface between the isolation layer 11 and the first active material layer 12 and the second active material layer 13 has a good contact system has a relatively direct and serious influence on the electrical and safety performance of the overall battery system. Therefore, in the conventional battery technology, in order to maintain good contact of such interfaces, whether it is a stacked structure or a wound-structured battery core, the overall structural flexibility of the battery after assembly is completed. Low, even 1323541, can not be flexed to avoid stress caused by the deflection, causing the interface between the isolation layer 11 and the first active material layer 12 and the second active material layer 13 to be damaged, thereby reducing the battery system Electrical and safety performance. Further, in terms of the package structure of the battery system, all of the conventional battery system packages of the above-mentioned primary battery system or secondary battery system are mostly in the appearance of a hard metal casing (including a conventional cylindrical shape and a square shape). In addition to avoiding the damage of the battery core by external stress, it can also reduce the influence of external factors on the internal chemical system of the battery. Taking a secondary lithium battery as an example, the most common battery appearance is a square structure. Therefore, for the terminal electronic product, although the secondary lithium battery system can provide better electrical performance and service life, The fixed size design and the hard shell material make most of the electronic products subject to considerable limitations in circuit design, although the subsequent secondary battery system developed a package that replaces the conventional hard metal case in the form of a metal flexible package. Technology, therefore, can reduce the difficulty of the secondary battery system in the application of electronic products. However, compared with the conventional hard φ metal casing, the packaging structure of the metal flexible packaging is realized by means of heat sealing, so the metal flexible packaging In the sealing interface of the above-mentioned conductive handle, since the metal of the conductive handle and the heat-sealing polymer of the metal flexible package are two heterogeneous materials, the sealing effect between them is not good, and thus the effect of blocking gas and blocking water is achieved. The performance is better than the conventional hard metal casing that is welded and sealed, and when the primary battery is continuously charged and discharged, it will be introduced. The battery system has the problem of volume expansion and shrinkage in the overall size. At this time, since the metal flexible package itself cannot provide sufficient material stress, the size of the secondary battery cannot be effectively maintained, and the electronic product is in circuit design. When 1323541 faced annoying difficulties. In addition, for a more microscopic electrochemical system, please refer to FIG. 1 again. The first active material layer 12 and the second active material layer 13 are provided with an isolation layer u'. The isolation layer 丨1 is mainly used to avoid The first electrode substrate (including the P active (four) layer 12 and the first collector layer 14) is in direct contact with the second electrode substrate (including the second active material layer 13 and the second collector layer 15) and occurs in the battery 1 The problem of internal short circuit, but at the same time it must be able to provide the path required for ion migration in battery 1. Therefore, the material of this isolation layer u must take into account the characteristics of non-conductivity and porosity. The common isolation layer u uses polyethylene. It is made of polymer materials such as dilute and polypropylene. In addition, according to different polymerization (tetra) homo-polymer but glass transition and softening temperature of different molecular weights, the structure of the local polymer can be changed within a certain temperature range. When the internal temperature of the battery system rises due to internal short circuit, external short circuit or any factor, the path of ion migration in the battery 1 is blocked by the change of the structure of the isolation layer η to prevent the battery crucible from continuing at a high temperature. The electrochemical reaction of Lu can reduce the probability of explosion of the battery. However, if the battery 1 continues to heat up for some reason, once the interior of the battery reaches mum:, based on the physical characteristics of the isolation layer η in the prior art, the layer 11 will still melt and collapse completely, resulting in a complete short circuit and further generation. Severe fire or explosion, and because the isolation layer u itself does not have electrical conductivity, and the polymer system exhibits a staggered entanglement structure, for the microscopic ion migration reaction, the structure is too complicated and staggered and entangled to cause ions. During the migration, the obstacles of ion migration are increased because of too long or too curved paths, thereby reducing the conductivity of the ion 1335541 of the overall battery line. In addition to the above-mentioned various kinds of defects, since most circuit designs in flexible electronic products have reached flexible design requirements, no matter which battery system is used, the existing battery system cannot be maintained. Good electrical and safety performance provides flexibility at the same time. In addition, due to the gradual miniaturization of electronic products, the battery system used has not been able to reduce the size of the design and at the same time Good electrical performance, so that most of the electronic products must sacrifice part of the structural space to set up the required battery system, and thus the electronic product is limited in size design. Moreover, the material of the isolation layer 11 of the battery 1 cannot withstand the high temperature process, so its manufacture cannot be integrated with the process of the circuit board (such as a printed circuit board, a flexible circuit board, etc.), and therefore, for the electronic device 2 The battery 1 is inevitably an external component, which not only increases the cost of the electronic device 2, but also has a certain limitation on the miniaturization and thinning of the electronic device 2; in addition, the electronic device 2 must be designed to accommodate the accommodation space of the battery 1. It is a pity that this space cannot be effectively used in the circuit layout. Therefore, how to provide an electric energy supply system that can solve the above problems is one of the important topics in the current electronics industry. SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide an electric energy supply system that can be integrated in a circuit board and a process thereof. In order to achieve the above object, according to the present invention, an electric energy supply system 2-circuit substrate, a first electrode substrate, a second electrode substrate, a package unit it, and a H package S are provided. In the present invention, the circuit board 2 includes at least one isolation region, the first electrode substrate is located on the side of the circuit substrate, and the first electrode substrate includes a first collector layer and a first active material layer, the first active layer The material layer is located between the isolation region and the first collector layer and opposite to the isolation region; the second electrode substrate is located on the other side of the circuit substrate, and the second electrode substrate includes a second collector layer and a a first/tongue material layer, the second active material layer is located between the isolation region and the second collector layer, and is opposite to the isolation region; the first package unit is located between the first electrode substrate and the circuit substrate, and The ring is disposed around the first active material layer, and the second package unit is located between the second electrode substrate and the circuit substrate and is disposed around the second active material layer. As described above, the power supply system according to the present invention uses a circuit substrate to separate the first active material layer and the second active material layer, that is, the battery unit can be directly integrated into the circuit board, so that the power can be supplied. The system is effectively integrated with the circuit board, and even the process conditions of the circuit board can be applied to manufacture the power supply system of the present invention. Compared with the prior art, the power supply system according to the present invention can be integrated with the process of the circuit board, and the power supply system can be regarded as a surface mount component (SMT), thereby effectively reducing the manufacturing cost of the product, and also making The product is further miniaturized and thinned; in addition, other circuit boards can be further disposed on the outer side of the first electrode substrate and the second electrode substrate, so that the area of the power supply system can be effectively utilized for circuit layout, thereby making the product smaller. Chemical. 1323541 [Embodiment] Hereinafter, an energy supply system according to a preferred embodiment of the present invention will be described with reference to the related drawings. In order to directly integrate the power supply unit on a general flexible/non-flexible circuit board, it also provides low cost, large capacity, high thermal stability and additional mechanical properties (such as multiple flexural characteristics). The present invention provides a flexible logic power system. With the invention design, not only the circuit design of the general product can directly integrate the power unit into the circuit substrate, and no additional carrier and welding are required. Point, the door uses the circuit substrate as the isolation layer, wherein the thermal stability temperature of the circuit substrate exceeds 300 ° C, the pure tin reflow process can be performed for continuous surface adhesion technology (SMT), or even wafer (ic) The gold-gold eutectic process to achieve direct integration of power supply systems and large-scale production possibilities for (flexible/non-flexible) boards. This system also provides volume energy density equivalent to current secondary clock batteries. Low unit capacity production cost, but the large-area equipment to improve the current secondary lithium battery can not have high thermal stability and can not be directly integrated with the board characteristic. The following is a description of the main technical features of the present invention to illustrate the main technical features of the present invention. Please refer to FIG. 2, where FIG. 2 is an electrical energy according to a preferred embodiment of the present invention. Schematic diagram of the structure of the supply system. As shown in FIG. 2, the electric moon b supply system 3 includes a circuit substrate 31, a first electrode substrate 32, a second electrode substrate 33, a first package unit 34, and a second seal time unit 35. The circuit substrate 31 includes at least one isolation region. The first electrode substrate 32 is located on one side of the circuit substrate 31, and the first electrode 12 Π 23541 = the plate 包括 includes a first collector layer 321 and a first active material layer. The first active material layer 322 is located between the isolation region 311 and the first concentrator 321 and opposite to the isolation region 311; the second electrode is located on the other side of the circuit substrate 31, and the second electrode substrate 33 a second collector layer 331 and a second active material layer 332, the second material layer 332 is located between the isolation region and the second collector layer: opposite to the isolation region 311; Package unit 34 system
於第一電極基板32與電路基板31之間 '並環設於第一活 性材料層322周圍’而第二封裝單元％係位於第二電極 基板33肖電路基板31之間、並環設於第二活性材料層332 周圍。 在本實施例中，電路基板31係可為一非可撓式電路 基板或一可撓式電路基板，於此，電路基板31係以一可 挽式電路基板為例。由圖2可知，電路基板31係為一多 層結構’其包含了 一第一金屬層313、一基板聚合物層州 與一第二金屬層3…在本實施例中，第—金屬層313與 第,金屬層315可為單層或多層結構，其中第一金屬層313 與第二金屬層315之主要組成材料係選自銅、链、錄、上 迷任-金屬之合金或上述多種金屬之合金。基板聚合物層 3丄4係介於第一金屬層313與第二金屬層315之間，其可 為單層或多層結構，其中基板聚合物層314包含至少一基 板支稽層或二膠層（圖未示）’其中，基板支撐層之主要組 成材料係選自聚亞醯胺（PI)、聚對苯二曱酸乙二醇酯 (pET)、聚茶二曱酸乙二醇醋(pEN)、玻璃纖維或液晶型高 13 1323541 分子，而膠層之主要組成材料係選自聚亞醯胺、環氧樹脂 或壓克力樹脂。 另外，電路基板31更包括一邏輯電路區域312，其係 鄰設於隔離區域311、並形成有至少一邏輯電路，邏輯電 路係與第一集電層321及第二集電層331電性連接。如圖 ' 2所示，隔離區域311在垂直轴上是介於第一電極基板32 與第二電極基板33之間，在水平軸上是介於第一封裝單 元34或第二封裝單元35之間；而邏輯電路區域312在水 * 平軸上之位置是位在第一封裝單元34或第二封裝單元35 之外，其中，電路基板31之主要功能有三項，第一項功 能：其上之隔離區域311是將第一電極基板32之第一活 性材料層322與第二電極基板33之第二活性材料層332 進行電子絕緣與離子導通，第二項功能：其上之邏輯電路 區域312可以將由内部電能單元所產生之電量直接利用蝕 刻線路與外部電路與元件直接連接，無須其他焊點，第三 φ 項功能：由於其上之隔離區域311可視為其他内部電能單 元之載體或組合母體，故整體電能供應系統可藉由電路基 板31上之邏輯電路區域312將外部電路與元件完整地與 電路基板31整合，不僅如此，由於電路基板31之熱穩定 -- 性極佳，可耐純錫回焊溫度，甚至1C共晶製程溫度，故 -_ 當電路基板31完成其邏輯電路區域312之外部電路與連 續元件上件製程後，可再與其他熱穩定度較低之電能單元 進行組合，故整體可撓式邏輯電能供應系統可以進行自動 上件製程，其量產價值不言可喻！ 1323541 在本實施例中’第一封裝 分佈是介於第一電極基板 1兀34在垂直軸上之位置 双與電路其 平軸上之位置分佈則是介於第一-土板31之間，且在水 材料層322與邏輯電路區^電極基板32之第一活性 封裝單元34，第二封裝單元35〈間，此外，相同於第一 介於第二電極基板33與電路爲5在垂直軸上之位置分佈是 之位置分佈則是介於第二電極^義板31之間，且在水平軸上 332與邏輯電路區域312 板33之第二活性材料層 供應系統3之剖面圖，故看 ，思者，因圖2為電能 一封裝單元34之間，而第—活性材料層322位於第 裝單元35之間，然實際上H材;^说位=第二封 一活性材料層322周圍， 、又早凡34係％6又於第 二活性材料層332周圍。而红封裝單元35係環設於第 請同時參照圖3與圖4 部結構放大示意圖，其1為圖2之局 32與所相對應之電路基板 在於第—電極基板 中，笫一及弟一電極基板33，在圖3 乐電極基板32與第-發托甘』 構，1巾，第f基板33顯示三種必要結 -集電Li:板32包含了第-聚合物層心第 含了第^人弟舌性材料層322，第二電極基板33包 了第一合物層333、第-隹_番@ q μ 3λ?如㈤ 弟一集電層331、第二活性材料 層332。在圖4中，第—雷炻 盥1 罨極基板32具有三項必要結構， 興具他二項充要結構，t中 一聚合物層323、第-隹^ 板32包含了第 ^ ^ 集電層321、第一活性材料層322、 第—分隔元件324、第—黏著加強層325與第-電The first package substrate 32 is disposed between the first electrode substrate 32 and the circuit substrate 31 and is disposed around the first active material layer 322. The second package unit % is located between the second electrode substrate 33 and the schematic circuit substrate 31. The second active material layer 332 is surrounded. In the present embodiment, the circuit substrate 31 can be a non-flexible circuit substrate or a flexible circuit substrate. Here, the circuit substrate 31 is exemplified by a pullable circuit substrate. As can be seen from FIG. 2, the circuit substrate 31 is a multilayer structure comprising a first metal layer 313, a substrate polymer layer state and a second metal layer 3... In this embodiment, the first metal layer 313 And the metal layer 315 may be a single layer or a multi-layer structure, wherein the main constituent materials of the first metal layer 313 and the second metal layer 315 are selected from the group consisting of copper, chain, recorded, upper-metal alloy or the above various metals. Alloy. The substrate polymer layer 3丄4 is interposed between the first metal layer 313 and the second metal layer 315, which may be a single layer or a multi-layer structure, wherein the substrate polymer layer 314 includes at least one substrate layer or a second layer (not shown) 'wherein, the main constituent material of the substrate supporting layer is selected from the group consisting of polyacrylamide (PI), polyethylene terephthalate (pET), and polyglycolic acid ethylene glycol vinegar ( pEN), glass fiber or liquid crystal type 13 1323541 molecules, and the main constituent material of the glue layer is selected from polyamine, epoxy resin or acrylic resin. In addition, the circuit board 31 further includes a logic circuit region 312 disposed adjacent to the isolation region 311 and having at least one logic circuit electrically connected to the first collector layer 321 and the second collector layer 331. . As shown in FIG. 2, the isolation region 311 is between the first electrode substrate 32 and the second electrode substrate 33 on the vertical axis, and is between the first package unit 34 or the second package unit 35 on the horizontal axis. And the position of the logic circuit region 312 on the horizontal axis of the water is located outside the first package unit 34 or the second package unit 35, wherein the main function of the circuit substrate 31 has three items, the first function: The isolation region 311 electrically insulates and ionically conducts the first active material layer 322 of the first electrode substrate 32 and the second active material layer 332 of the second electrode substrate 33, and the second function: the logic circuit region 312 thereon The electric quantity generated by the internal electric energy unit can be directly connected to the external circuit and the component by using the etching circuit without the need for other solder joints, and the third φ term function: since the isolation region 311 thereon can be regarded as the carrier or the combined parent of other internal electric energy units Therefore, the overall power supply system can integrate the external circuit and components completely with the circuit substrate 31 by the logic circuit region 312 on the circuit substrate 31, and not only the circuit base 31 is thermally stable - excellent in resistance to pure tin reflow temperature, even 1C eutectic process temperature, so -_ when the circuit board 31 completes the external circuit of its logic circuit area 312 and the continuous component upper part process, Combined with other power units with lower thermal stability, the overall flexible logic power supply system can perform automatic workpiece processing, and its mass production value is self-evident! 1323541 In the present embodiment, the first package distribution is located between the position of the first electrode substrate 1兀34 on the vertical axis and the position of the parallel axis of the circuit is between the first-soil plate 31, And between the first active package unit 34 and the second package unit 35 of the water material layer 322 and the logic circuit region electrode substrate 32, and further, the same as the first between the second electrode substrate 33 and the circuit 5 is on the vertical axis. The positional distribution is the cross-sectional view of the second active material layer supply system 3 between the second electrode plate 31 and the horizontal axis 332 and the logic circuit region 312 plate 33. 2, because FIG. 2 is between the power-packaging units 34, and the first active material layer 322 is located between the first loading units 35, but actually the H material; ^ said bit = around the second first active material layer 322 , and the 34 series %6 is again around the second active material layer 332. The red package unit 35 is provided in the same manner as shown in FIG. 3 and FIG. 4, and the circuit board of FIG. 2 and the corresponding circuit substrate are in the first electrode substrate. The electrode substrate 33 has three essential junctions in the photoelectrode substrate 32 and the first-to-female structure, the first substrate, and the f-th substrate 33. The Li: plate 32 includes the first polymer layer. The human tongue material layer 322, the second electrode substrate 33 is covered with a first compound layer 333, a first layer, a second layer, and a second active material layer 332. In FIG. 4, the first Thunder 1 flip-chip 32 has three essential structures, and has two secondary structures. The polymer layer 323 and the first plate 32 of the t include the ^^ set. The electric layer 321, the first active material layer 322, the first separating member 324, the first adhesive reinforcing layer 325 and the first electric
15 1323541 路佈局層326,而第二電極基板33包含了第二聚 333、第二集電層33丨、第二活性材料層332、複數: 分隔元件334、第二黏著加強層335與第二電路佈局^ 336。 以下走針對15 1323541 way layout layer 326, and second electrode substrate 33 comprises second poly 333, second collector layer 33, second active material layer 332, plural: separation element 334, second adhesion enhancement layer 335 and second Circuit layout ^ 336. Follow the following
，、〜叉呀4再進子〒眘 A 態樣說明；第一種必要結構：以第一聚合物層323為你^ 該層是處在第一電極基板32之最外圍區域，其中2】 功能有二項，第-項係為保護第-集電層321在高溫=熊 下不受氧化，第二係為加強第一集電層321之耐撓：之: 力’其實施之方式係為利用對位貼膠與熱壓合一： 合物層323完整覆蓋於第一集電層321 版印刷直接將防焊綠漆印刷於第一集電層321 2疋利用網 烘烤熟化後’完整將第一聚合物層= 321之外’其中，第一聚合物層之材料係為 集:層 PP、酬、PVC、壓克力樹脂與環氣樹脂。第、PS' 構：以第一集電層321為例，該層是處 一種必要、、Ό 與第一活性材料層322之間，其中主要=合物層323 -項係為將第一活性材料層322所產：：：有二項’第 封裝單元34或是其他導電結構(如 禮何’藉由第- 電路區域312,第二項係為利用第—集^至外部之邏輯 特性，降低水氣渗透至第—活性材料芦=21為金屬之 量，其中，第一集電層功之材料係_、/逮度與數 銀、金等金屬或金屬合金。第三種必要:構錄、錫、 材料層似為例，該層是處在第=構.Μ第-活性 基板32與對應之 1323541 =板Μ之隔離區域311之間，其 ===㈣層322之活性材料將化學能轉成電能使 用或將電旎轉換成化學能儲存於系統之中。 料充要結構：以第一分隔心牛324為例， 集電Γ21與對應之電路基板31之隔 並將處於同位置之第1性材料層322 進仃/刀隔，其中主要之功能有二項，第一 第-活性材料層322與第一集電層321二=強 是系統處在-般環境或是高溫環境下之 = 係為加強固定電路基板31與第一集電層321:相：= 之月t*力’其實施之方式係為利用對位貼膠與教壓合，將 -分隔元件324黏合在於第一集電層321上與第一活性材 料層322之間，或是利用網版印刷直接將膠框印刷於第一 集電層321之上與第一活性材料層322之間，同時再經過 供烤熟化使膠框產生化學架橋結構後，藉以形成第一分隔 元件324’並藉由第一分隔元件324所產生之強黏著力將 第-集電層321、第一活性材料層322與相對應之電路美 板3!之隔離區域311進行完整一體之黏著固定，增強^ 體之耐撓折度，其中’第-分隔元件324之材料係為壓克 力樹脂與環氧樹脂。第二種充要結構：以第一黏著加強層 325為例，該結構是處在第一集電層321與第一活性材料 層322之間’其中主要之功能係為加強第一活性材料層奶 與第-集電層321之黏著力，其實施之方式係為利用塗 佈、轉印與印刷之方式’將第一點著加強層功形成在於 17 (S ) 苐一集電層321歲笛 黏著加強層325將逝Γ活性材料層322之間，其中，第一 纏機構，並且同時因^一活性材料層322產生較強物理交 著加強層325金M南之高分子助黏劑含量而使第一黏 而增加電能供應系產生:大的黏著力，進 強層325之材料為=耐撓折性，其中，第一黏著加 要結構子材料和導電粒子。第三種充 聚合物層323之认佈局層326為例，該結構是處在第一 -般電路與元件主要功能係為直接將正、負電極、 一電極基板32 合於第—電路佈局層326上，使第 其一為主動式RFID ; __ +說明’,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, There are two functions, the first term is to protect the first collector layer 321 from oxidation under high temperature = bear, and the second is to strengthen the resistance of the first collector layer 321 : In order to utilize the alignment adhesive and the thermocompression bonding: the layer 323 is completely covered on the first collector layer 321 printing, and the solder resist green lacquer is directly printed on the first collector layer 321 2 The first polymer layer is completely = 321 except that the material of the first polymer layer is a set: layer PP, retort, PVC, acrylic resin and epoxy resin. First, PS' structure: taking the first collector layer 321 as an example, the layer is a necessary, between the 活性 and the first active material layer 322, wherein the main = compound layer 323 - the system is the first activity Material layer 322 produces::: there are two 'packaging units 34 or other conductive structures (such as Lie' through the first circuit area 312, the second item is the use of the first set to the external logic characteristics, Reducing moisture penetration into the first active material, a = 21 is the amount of metal, wherein the material of the first collector layer is _, / catch and a number of metals or metal alloys such as silver, gold, etc. The third necessity: For example, the layer of recording, tin, and material is between the layer of the first active substrate 32 and the corresponding isolation region 311 of the 1335541 = plate, and the active material of the layer 322 of the === (four) layer will be The chemical energy is converted into electrical energy or converted into chemical energy and stored in the system. The charging structure is: taking the first separation of the heart cattle 324 as an example, the collecting electricity 21 is separated from the corresponding circuit substrate 31 and will be in the same The position of the first material layer 322 enters the enthalpy/knife partition, wherein the main function has two items, the first first active material layer 322 and the first The electric layer 321 2 = strong is the system in the general environment or high temperature environment = is to strengthen the fixed circuit substrate 31 and the first collector layer 321: phase: = month t * force ' The spacer element 324 is bonded between the first collector layer 321 and the first active material layer 322 by using the alignment adhesive and the teaching, or the screen is directly printed on the first collector by screen printing. Between the layer 321 and the first active material layer 322, and at the same time, after the baking frame is used for the plastic frame to form a chemical bridging structure, the first separating member 324' is formed and the strong bonding is generated by the first separating member 324. The first collector layer 321 and the first active material layer 322 are integrally and integrally bonded to the isolation region 311 of the corresponding circuit board 3! to enhance the flexural resistance of the body, wherein the first-partition element The material of 324 is acrylic resin and epoxy resin. The second essential structure: taking the first adhesive reinforcing layer 325 as an example, the structure is in the first collector layer 321 and the first active material layer 322. The main function of the room is to strengthen the first active material layer milk and the first set The adhesion of the electric layer 321 is implemented by means of coating, transfer and printing. The first point of the reinforcement layer is formed by 17 (S) 苐 a collector layer 321 years old flute adhesion layer 325 Between the active material layers 322, wherein the first wrapping mechanism, and at the same time, the active material layer 322 produces a strong physical interaction reinforcing layer 325 gold M South polymer adhesion promoter content to make the first sticky Increasing the power supply system produces: a large adhesion, the material of the strength layer 325 is = flex resistance, wherein the first adhesion plus the structural material and the conductive particles. The third filling layer 323 For example, the layer 326 is in the first general circuit and the main function of the component is to directly connect the positive and negative electrodes and an electrode substrate 32 to the first circuit layout layer 326, so that the first one is active RFID. ; __ + description '
直接焊接於第一電木之產品，將天線、簡易回路與射頻1C 節省封褒體積與成^基板32上之第一電路佈局層326,可 顯示圖樣直接形戍^其二為軟性可撓折顯示器產品，將 連接法，使顯—電路佈局層似’湘内部電性 將顯示n上之透”f接帶負電，並利料部電性連接法 連接，控制電極與第一電路佈肩層326上之正電極 如n 电聲或電流大小而產生不同灰階顯示， 亦可郎賴示與成本，最4要岐錢將電能 供應糸統3與可撓式顯示器基板一體整合。其實施之方式 係可分為内部電性連接法與外部連接法’其中，内部連接 法有多種作法’例如利用盲孔與填寨銀漿之技術，或是盲 孔加上在盲孔表面鍍金屬層方式，透過第一聚合物層323 將第一集電層321與第一電路佈局層326做電性連接，當 然若第一聚合物層323之材料為導電高分子或是高分子層 18 1323541 加入導電粒子，則無須經由導電盲孔之技術，可直接將兩 層做電性連接。另外，外部連接法亦有多種作法，例如將 外部金屬導線利用焊接或是ACF(異方向導電膠）製程黏接 於兩層之上、外部軟性電路排線利用焊接或是ACF(異方 向導電膠）製程黏接於於兩層之上之技術、依據第一集電芦 321與第一電路佈局層326之延伸結構基於自身可撓折二 性，利用焊接或是ACF(異方向導電膠）製程互相黏接技 術’或是直接黏合或印刷可導電之高分子以連接兩層。此 外第一電路佈局層326亦可經由以上所述之外部電^連接 法與位在電路基板31上之邏輯電路區域312做電性連 結。需注意者’第二電極基板33更具有第二聚合物層 第二分隔元件334、第二黏著加強層335、及第二曰電路佈 局層336’#功能與結構係與前述之第一聚合物層奶、 第-分隔元件324、第-黏著加強層坊、及第:電 局層326相同，故此不再贅述。 再者，請同時參照圖3與圖4所 之隔離區域311内係移除第一金屬 土 31 屬層313與第二金屬層 ’且更於基板聚合物層314 JL爷此#u、 圯成啜數微孔洞3141， 且該些微孔洞3141係貫穿位於電 311上之基板聚合物層314，該此土板之隔離區域 能為作為篦一蕾技且,^ 二微孔洞3141之主要之功 層鱼離;邋 土 ’、第—電極基板33之電子絕緣 e…離子導通層，同時為了避免 與局部電極活㈣域負載過大造成第、、。構造成微短路狀態 化過快，故需在此微孔洞314Γ^γ活性材料層322老 復盍上一層電子隔離層 1323541 3Ιό、317 ’其主要之功能不僅在避免以上之問題，同時亦 可加強第一活性材料層322與第二活性材料層332與相對 應之電路基板31之隔離區域311之黏著力，同時因為覆 蓋上此電子隔離層316、317，亦相對會影響離子導電度， 同時材料之機械強度亦是考慮之重點，基本上微孔洞3141 之大小與開口率需做一定設計，其中，電子隔離層316、 317之主要材料係為高分子材料與支撐微體，其支撐微體 之功能在於增加電子隔離層316、317之離子導電度尤其 是離子穿越電子隔離層316、317之距離長短，同時此支 撐微體亦可增加含吸電解液能力。其中，此支撐微體之材 料可為二氧化矽、二氧化鈦與二氧化鋁等氧化金屬，表面 經過疏水性處理。 請同時參照圖5與圖6所示，其中圖5係為圖2之局 部結構放大示意圖，其主要放大之區域在於第一封裝單元 34、第二封裝單元35與其鄰接之其他電能供應系統之結 構，在圖5中，該區域只顯示第一封裝單元34及第二封 裝單元35此一必要結構，而圖6亦係為圖2之局部結構 放大示意圖，其主要放大之區域亦為第一封裝單元34、第 二封裝單元35與其鄰接之其他電能供應系統之結構。在 圖6中，除了第一封裝單元34及第二封裝單元35為必要 結構之外，另外增加了兩項充要結構，其包含了第一鈍性 單元341及第二鈍性單元351與第一成型單元342及第二 成型單元352。以下是針對第一封裝單元34與其鄰接之其 他電能供應系統結構進行實施態樣說明；第一種必要結 20 1323541 構，以第一封裝單元34為例：由圖面之垂直軸上觀察， 第一封裝單元34是處在第一電極基板32之第一集電層 321與相對應之電路基板31之隔離區域311之間，若再細 分結構，第一封裝單元34又可分為第一上封裝元件，其 r ' 係位在第一集電層321上，與第一下封裝元件，其係位在 相對應於第一電極基板32之電路基板31上，其中，第一 封裝單元34可以全部是第一上封裝元件或是第一下封裝 元件，或是由兩者所共同形成，不僅如此，當由第一上封 * 裝元件及第一下封裝元件共同形成第一封裝單元34時， 可以利用數種特別排列加強其功能，如第一上封裝元件與 第一下封裝元件交錯排列或上下重疊排列，以增加黏著 力、導電能力與阻氣效果。由圖面水平軸向觀察，第一封 裝單元34是介於第一活性材料層322與邏輯電路區域312 之間，其中主要之功能有三項，第一項係將第一電極基板 32之第一活性材料層322密封在第一集電層321、所對應 I 之電路基板31之隔離區域311與第一封裝單元34之内， 其主要是為了避免電解液外瀉或是外部水氣滲入，第二係 為透過第一封裝單元34所形成之良好黏著力於第一電極 基板32與電路基板31之間以加強整體電能供應系統之機 .. 械特性，如耐撓曲特性等，第三項係為透過第一封裝單元 _ 34，可以將電能供應系統内部所產生之電能傳至電路基板 31之邏輯電路區域312，而無須使用外部電性連接方法， 其中，第一封裝單元34 (包含第一上、下封裝元件）之材 料係選自膠體、金屬、玻璃纖維或三者混用。其中，若第 21 1323541 一封裝單元34 (包含第一上、下封裝元件）之材料係為膠 體時，其膠體種類可為單純膠體結構或是含阻氣性材料 (如玻璃纖維）之混和性膠體，或更可以是含有第一導電 粒子之混和性膠體，其實施方法為對位貼合或是網印，將 a ·' 膠體黏合於第一電極基板32與其相對應之電路基板31之 / 上，最後進行壓合製程後形成，其中，該膠體之主要材料 係選自於PI、環氧樹脂或壓克力樹脂，而阻氣性材料可為 數種材料，例如：金屬粒子或是玻璃纖維，至於第一導電 鲁 粒子，其材料可係選自於金、銀、錫、鎳、铭、銅、銘或 導電碳粉。另外，若第一封裝單元34 (包含第一上、下封 裝元件）之材料係為金屬，其實施方法為選鍍金屬或蝕刻 金屬’其意義在於形成銅凸框或是銅凹槽於第一集電層 321與所對應之電路基板31之第一金屬層313上，並利用 該結構增強黏著力、導電能力與阻氣效果。其中金屬材料 係選自於銅、铭、鎳、金、銀或錫，基本上第一上、下封 _ 裝元件之材料可以相同也可以不相同，亦即是第一上、下 封裝元件皆可為膠體，或是第一上、下封裝元件皆可以為 金屬，亦或者是第一上、下封裝元件可以分別為膠體或金 屬。需注意者，第二封裝單元35之功能與結構係與前述 . 之第一封裝單元34相同，故此不再贅述。 第一種充要結構，以第一鈍性單元341為例：由圖面 之垂直軸上觀察，第一鈍性單元341是處在第一電極基板 32與其相對應之電路基板31之隔離區域311之間，若再 細分結構，第一鈍性單元341又可分為第一上鈍性元件， 22 1323541 其係位在第—集電層321上，與第—下鈍性元件，其係位 在相對應電路基板31上，其中，第一純性單元341可以 全部是第-上鈍性元件或是第—下鈍性元件，或是由兩者 所共同形成，不僅如此，當由第—上、下鈍性以牛共同形 t第一：Γ元341時’可以利用數種特別排列進行加強 功月匕’如P上、下鈍性轉交錯排列或上下重疊排列， =增加黏者力、阻液效果與阻氣效果4圖面水平轴向觀 察’ ^純性单疋341是介於第一活性材料層322與第一 封裝單元34之間’其主要之功能有三項，第—項係將第 -電極基板32之第-活性材料層322密封在第一集電層 32卜所對應之電路基板31之隔離區域3ΐι與第 /純性單 7L 341之内’其主要是為了避免電解液外瀉造成第，封裝 單元34之黏著能力下降，第二項係為降低鋰金屬於邊櫂 析出之可能性，第三項係為降低外框金屬因電化#穩定性 而形成離子溶解於電能供應系統3之中，其中，第/鈍性 單元341(包含第-上、下鈍性元件)之材料係遂自#禮、金 屬、其他電化學穩定材料或三者混用。其中，砮第〆鈍性 單元341(包含第-上'下鈍性元件)之材料係為為#據持’ 其膠體種類可為單純膠體結構或是含電化學穩定材料（如 玻璃纖維）之混和性膠體，其實施方法為對^貼含成是網 印，將膠體黏合於第一集電層321或其 電絡基板 31之上並且介於在第一活性材料上其二対装草元 34之間，再進行最後壓合製程形成，其中，該膠艚之彡要 材料係選自於Π、環氧樹脂或壓克力樹脂，而電牝學穩定 23 1323541 材料可為數種材料，例如：玻璃纖維。另外，若第一鈍性 單元341(包含第一上、下鈍性元件）之材料係為金屬，其實 施方法為選鍍金屬，其意義在於形成銅凸框於第一集電層 321或其相對應之電路基板31之第一金屬層313上並且介 於在第一活性材料層322與第一封裝單元34之間，同時 更需要進行金屬表面鈍化處理，如氧化處理。其中金屬材 料係選自於銅、鋁、鎳、金、銀或錫，基本上第一上、下 鈍性元件之材料可以相同也可以不相同、亦可以不同於第 一封裝單元34之材料，其組合只能為第一上、下鈍性元 件皆為膠體，或第一上、下鈍性元件至少一個為膠體。需 注意者，第二鈍性單元351之功能與結構係與前述之第一 鈍性單元341相同，故此不再贅述。 第二種充要結構，以第一成型單元342為例：由圖面 之垂直軸上觀察，第一成型單元342是處在第一電極基板 32與其相對應之電路基板31之隔離區域311之間。由圖 面水平轴向觀察，第一成型單元342是介於第一封裝單元 34與產品外型邊線（即第一電極基板32之邊界週緣）之 間，其中主要之功能有二項，第一項係將第一集電層321 與相對應之電路基板31之第一金屬層313隔絕，故可在 成型或壓合時避免第一集電層321與電路基板31之第一 金屬層313接觸造成短路發生。第二項係將第一集電層321 與第二集電層331隔絕，故可在成型或壓合時避免第一集 電層321與第二集電層331接觸造成短路發生。其中，第 一成型單元342之實施方法係將第一集電層321與其相對 24 丄以3541 應之電路基板31之第一金屬層313，利用化學蝕刻將其二 者介於第一封裝單元34與產品外型邊線（即第一電極基板 32之邊界週緣）之金屬蝕去，亦即是在第一成型單元342 • 之内並無第一集電層321而僅有第一聚合物層323，且在 第一成犁單元342内’亦可能是無電路基板31之第一金 屬層313而僅有基板聚合物層3M。需注意者，第二成型 單元352之功能與結構係與前述之第一成塑單元342相 • 同，故此不再贅述。 綜上所述’因依本發明之電能供應系統係採用電路基 板來分隔第一活性材料層及第二活性材料層，亦即可以將 電池單元直接整合於電路板中，所以能夠將電能供應系統 與電路板進行有效地整合，甚至可以應用電路板的製程條 件來製造本發明之電能供應系統。與習知技術相較，依本 發明之電能供應系統可以與電路板的製程整合，電能供應 系統可以視為一種表面黏著元件（SMT)，因此，可以有效 • 降低產品的製造成本’而且還可以使得產品更加的小型 化、薄蜇化；此外，第一電極基板及第二電極基板之外側 V以更設置有其他電路基板’因此可以有效利用電能供應 系統的區域進行電路佈局上’藉以使得產品更加小型化。 ' 以上所述僅為舉例性’而非為限制性者。任何未脫離 •，本發明之精神與範鳴’而對其進行之等效修改或變更，均 應包含於後附之申請專利範圍中。 【圖式簡單說明】 25 1323541 圖1為一示意圖，顯示習知電池之結構剖面示意圖； 圖2為一示意圖，顯示依本發明較佳實施例之電能供 應系統之結構剖面示意圖； 圖3為一示意圖，顯示依本發明較佳實施例之電能供 應系統之局部結構剖面示意圖，其係主要顯示電路基板之 隔離區域； 圖4為一示意圖，顯示依本發明較佳實施例之電能供 應系統之結構剖面示意圖，其係主要顯示電路基板之隔離 區域的必要結構及充要結構； 圖5為一示意圖，顯示依本發明較佳實施例之電能供 應系統之結構剖面示意圖，其係主要顯示第一封裝單元、 第二封裝單元及其鄰近結構；以及 圖6為一示意圖，顯示依本發明較佳實施例之電能供 應系統之結構剖面示意圖，其係主要顯示第一封裝單元、 第二封裝單元及其鄰近的必要結構及充要結構。 元件符號說明： I 電池 II 隔離層 12 第一活性材料層 13 第二活性材料層 14 第一集電層 141 導電柄 15 第二集電層 26 1323541The product is directly soldered to the first bakelite, and the antenna, the simple circuit and the radio frequency 1C are saved in the sealed volume and the first circuit layout layer 326 on the substrate 32, which can display the pattern directly, and the second is soft and flexible. Display products, will be connected, so that the display - circuit layout layer like 'Xiang internal electrical will display n on the transparent" f with negative power, and the material part of the electrical connection method, control electrode and the first circuit cloth shoulder layer The positive electrode on 326 produces different gray scale display such as n electroacoustic or current, which can also be used for cost and cost. The most important thing is to integrate the power supply system 3 with the flexible display substrate. The method can be divided into internal electrical connection method and external connection method. Among them, the internal connection method has various methods, such as the technique of using blind holes and filling silver paste, or blind holes plus metal plating on the surface of blind holes. The first collector layer 321 is electrically connected to the first circuit layout layer 326 through the first polymer layer 323. Of course, if the material of the first polymer layer 323 is a conductive polymer or a polymer layer 18 1323541, conductive is added. Particles, no need to pass The technology of electric blind hole can directly connect two layers electrically. In addition, the external connection method also has various methods, such as bonding external metal wires by soldering or ACF (transverse conductive adhesive) process on two layers. The external flexible circuit cable is bonded to the two layers by soldering or ACF (transverse conductive adhesive), and the structure is based on the extension of the first collector 321 and the first circuit layout layer 326. Bipolar, using solder or ACF (transverse conductive paste) process bonding technology 'either directly bonding or printing conductive polymer to connect two layers. In addition, the first circuit layout layer 326 can also be described above The external electrical connection method is electrically connected to the logic circuit region 312 located on the circuit substrate 31. It should be noted that the second electrode substrate 33 further has a second polymer layer second separation member 334 and a second adhesion enhancement layer. 335, and the second circuit layout layer 336'# function and structure are the same as the first polymer layer milk, the first separation element 324, the first adhesion enhancement layer, and the first: electricity layer 326, so Let me repeat. Furthermore, please remove the first metal 31 genus layer 313 and the second metal layer ' from the isolation region 311 of FIG. 3 and FIG. 4 at the same time, and further to the substrate polymer layer 314 JL, this #u, 圯成The micropores 3141 are formed, and the micropores 3141 are penetrated through the substrate polymer layer 314 on the electric 311. The isolation region of the earth plate can be the main one of the micro holes 3141. The power layer of the fish is separated from the earth's and the electronically insulated e...ion conducting layer of the first electrode substrate 33, and at the same time, in order to avoid the excessive load caused by the local electrode active (four) domain, the micro-short state is too fast, so it is required In this micro-hole 314 Γ γ active material layer 322, an electronic isolation layer 1335541 3 Ιό, 317 ′ is used to not only avoid the above problems, but also strengthen the first active material layer 322 and the second active material. The adhesion of the material layer 332 to the isolation region 311 of the corresponding circuit substrate 31, and the coverage of the electronic isolation layer 316, 317, also affect the ionic conductivity, and the mechanical strength of the material is also the focus of consideration, basic Upper micro hole 314 The size and aperture ratio of 1 need to be designed. The main materials of the electronic isolation layers 316 and 317 are polymer materials and supporting micro-body. The function of supporting the micro-body is to increase the ionic conductivity of the electronic isolation layers 316 and 317. In particular, the distance between the ions passing through the electron isolation layers 316 and 317 is long, and the supporting micro-body can also increase the ability to absorb electrolyte. The material supporting the micro-body may be an oxidized metal such as cerium oxide, titanium dioxide or aluminum oxide, and the surface is subjected to hydrophobic treatment. 5 and FIG. 6 , wherein FIG. 5 is an enlarged schematic view of a partial structure of FIG. 2 , and the main enlarged area thereof is the structure of the other power supply system adjacent to the first package unit 34 and the second package unit 35 . In FIG. 5, the area only shows the necessary structure of the first package unit 34 and the second package unit 35, and FIG. 6 is also an enlarged schematic view of the partial structure of FIG. 2, and the main enlarged area is also the first package. The structure of the unit 34, the second package unit 35 and other power supply systems adjacent thereto. In FIG. 6, in addition to the first package unit 34 and the second package unit 35 being a necessary structure, two additional structures are added, including the first passive unit 341 and the second passive unit 351 and the first A molding unit 342 and a second molding unit 352. The following is an implementation of the first package unit 34 and other power supply system structures adjacent thereto; the first necessary structure 20 1323541, taking the first package unit 34 as an example: viewed from the vertical axis of the drawing, A package unit 34 is disposed between the first collector layer 321 of the first electrode substrate 32 and the isolation region 311 of the corresponding circuit substrate 31. If the structure is subdivided, the first package unit 34 can be further divided into the first a package component, wherein the r ' is located on the first collector layer 321 and the first lower package component is on the circuit substrate 31 corresponding to the first electrode substrate 32, wherein the first package unit 34 can All of them are the first upper package component or the first lower package component, or are formed by the two together, and when the first package unit 34 is formed by the first upper package * component and the first lower package component Several special arrangements can be used to enhance its function, such as the first upper package component and the first lower package component are staggered or arranged one on top of the other to increase the adhesion, conductivity and gas barrier effect. As seen from the horizontal axial direction of the drawing, the first package unit 34 is interposed between the first active material layer 322 and the logic circuit region 312, wherein the main function has three items, and the first item is the first of the first electrode substrate 32. The active material layer 322 is sealed in the first collector layer 321 and the isolation region 311 of the circuit substrate 31 corresponding to the I and the first package unit 34. The main purpose is to prevent electrolyte leakage or external moisture infiltration. The second is a good adhesion formed by the first package unit 34 between the first electrode substrate 32 and the circuit substrate 31 to enhance the overall electrical energy supply system. Mechanical characteristics, such as flexural resistance, etc., the third item The first package unit 34 can transmit the power generated in the power supply system to the logic circuit region 312 of the circuit substrate 31 without using an external electrical connection method. The material of an upper and lower package component is selected from the group consisting of colloid, metal, fiberglass or a mixture of the three. Wherein, if the material of the package unit 34 (including the first upper and lower package components) is a colloid, the colloid type may be a simple colloidal structure or a mixture of a gas barrier material (such as glass fiber). a colloid, or a mixed colloid containing the first conductive particles, which is carried out by alignment or screen printing, and bonding the a · ' colloid to the first electrode substrate 32 and its corresponding circuit substrate 31 / And finally formed after the pressing process, wherein the main material of the colloid is selected from PI, epoxy resin or acrylic resin, and the gas barrier material may be several materials, such as metal particles or glass fiber. As for the first conductive Lu particles, the material may be selected from gold, silver, tin, nickel, Ming, copper, Ming or conductive carbon powder. In addition, if the material of the first package unit 34 (including the first upper and lower package components) is metal, the implementation method is metal plating or etching metal. The meaning is to form a copper convex frame or a copper groove in the first The collector layer 321 and the corresponding first metal layer 313 of the circuit substrate 31 are used to enhance the adhesion, conductivity, and gas barrier effect. The metal material is selected from copper, inscription, nickel, gold, silver or tin. Basically, the materials of the first upper and lower sealing elements may be the same or different, that is, the first upper and lower packaging components are It may be a colloid, or the first upper and lower package components may be metal, or the first upper and lower package components may be respectively colloidal or metal. It should be noted that the function and structure of the second package unit 35 are the same as those of the first package unit 34 described above, and thus will not be described again. The first intrinsic structure is exemplified by the first passive unit 341: the first passive unit 341 is located in the isolation region of the first electrode substrate 32 and the corresponding circuit substrate 31 as viewed from the vertical axis of the drawing. Between 311, if the structure is further subdivided, the first passive unit 341 can be further divided into a first upper passive element, 22 1323541, which is located on the first collecting layer 321 and the first-low passive element. Positioned on the corresponding circuit substrate 31, wherein the first purity unit 341 may be all of the first-passive element or the first-passive element, or may be formed by the two together, not only when - The upper and lower bluntness are common to the cows. The first one: when the 301 is Γ, 'a number of special arrangements can be used to enhance the power of the moon 匕', such as P, blunt or staggered arrangement or top and bottom overlap, = increase the viscosity Force, liquid-repellent effect and gas-blocking effect 4 horizontal axial observation of the figure '^The pure single unit 341 is between the first active material layer 322 and the first package unit 34', and its main function has three items, the first The item seals the first active material layer 322 of the first electrode substrate 32 on the first collector layer 32. Corresponding to the isolation region 3ΐι of the circuit substrate 31 and the first/pure single 7L 341, which is mainly for avoiding the electrolyte diarrhea, the adhesion ability of the package unit 34 is lowered, and the second item is to reduce the lithium metal to the side. The possibility of decanting, the third term is to reduce the formation of ions into the electric energy supply system 3 due to the stability of the outer frame metal, wherein the first/passive unit 341 (including the first-upper and lower passive elements) The material is from #礼, metal, other electrochemically stable materials or a mixture of the three. Wherein, the material of the 砮 〆 〆 单元 unit 341 (including the upper-lower blunt element) is # 承 承 》 》 》 》 》 》 》 》 》 》 》 》 》 》 》 》 》 》 》 》 》 》 》 》 》 》 》 》 》 》 The mixed colloid is carried out by screen printing, bonding the colloid to the first collector layer 321 or its electrical substrate 31 and interposing on the first active material Between 34, a final press-forming process is formed, wherein the material of the capsule is selected from the group consisting of ruthenium, epoxy resin or acrylic resin, and the electro-stable stability 23 1323541 material can be several materials, for example :glass fiber. In addition, if the material of the first passive unit 341 (including the first upper and lower passive elements) is metal, the implementation method is metal plating, which is to form a copper convex frame on the first collector layer 321 or The first metal layer 313 of the corresponding circuit substrate 31 is interposed between the first active material layer 322 and the first package unit 34, and at the same time, a metal surface passivation treatment such as an oxidation treatment is more required. Wherein the metal material is selected from copper, aluminum, nickel, gold, silver or tin, and the materials of the first upper and lower passive elements may be the same or different, or may be different from the material of the first package unit 34. The combination can only be that the first upper and lower passive elements are colloidal, or at least one of the first upper and lower passive elements is a colloid. It should be noted that the function and structure of the second passive unit 351 are the same as those of the first passive unit 341 described above, and thus will not be described again. The second main structure is exemplified by the first molding unit 342: the first molding unit 342 is located on the vertical axis of the drawing, and the first molding unit 342 is located in the isolation region 311 of the circuit substrate 31 corresponding to the first electrode substrate 32. between. As seen from the horizontal axial direction of the drawing, the first molding unit 342 is interposed between the first package unit 34 and the product outline (ie, the boundary edge of the first electrode substrate 32), wherein the main function has two items, the first The first collector layer 321 is isolated from the first metal layer 313 of the corresponding circuit substrate 31, so that the first collector layer 321 can be prevented from contacting the first metal layer 313 of the circuit substrate 31 during molding or pressing. Causes a short circuit to occur. The second term isolates the first collector layer 321 from the second collector layer 331, so that the first collector layer 321 and the second collector layer 331 are prevented from contacting each other during molding or pressing to cause a short circuit. The first molding unit 342 is implemented by the first collector layer 321 being opposite to the first metal layer 313 of the circuit substrate 31 of the 3541, and is chemically etched between the first package unit 34. The metal is etched away from the product outline (ie, the boundary periphery of the first electrode substrate 32), that is, there is no first collector layer 321 and only the first polymer layer 323 within the first molding unit 342. And in the first plow unit 342 'may also be the first metal layer 313 of the circuit-free substrate 31 and only the substrate polymer layer 3M. It should be noted that the function and structure of the second molding unit 352 are the same as those of the first molding unit 342 described above, and thus will not be described again. In summary, the power supply system according to the present invention uses a circuit substrate to separate the first active material layer and the second active material layer, that is, the battery unit can be directly integrated into the circuit board, so that the power supply system can be Efficient integration with the board, and even the process conditions of the board can be applied to fabricate the power supply system of the present invention. Compared with the prior art, the power supply system according to the present invention can be integrated with the process of the circuit board, and the power supply system can be regarded as a surface mount component (SMT), thereby effectively reducing the manufacturing cost of the product. Further, the product is further miniaturized and thinned; in addition, the outer side V of the first electrode substrate and the second electrode substrate are further provided with other circuit substrates 'so that the area of the power supply system can be effectively utilized for circuit layout' More miniaturized. The above description is by way of example only and not as a limitation. Any equivalent modifications or alterations of the spirit of the invention and the scope of the invention are intended to be included in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view showing a structure of a conventional battery; FIG. 2 is a schematic cross-sectional view showing the structure of a power supply system according to a preferred embodiment of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 4 is a schematic cross-sectional view showing a portion of a power supply system according to a preferred embodiment of the present invention, showing an isolated region of a circuit substrate; FIG. 4 is a schematic view showing the structure of an electrical energy supply system in accordance with a preferred embodiment of the present invention; FIG. 5 is a schematic cross-sectional view showing the structure of an electric energy supply system according to a preferred embodiment of the present invention, which mainly shows the first package. The unit, the second package unit and its adjacent structure; and FIG. 6 is a schematic cross-sectional view showing the structure of the power supply system according to the preferred embodiment of the present invention, which mainly shows the first package unit, the second package unit and Necessary structure and necessary structure in the vicinity. Symbol Description: I Battery II Isolation Layer 12 First Active Material Layer 13 Second Active Material Layer 14 First Collector Layer 141 Conductive Handle 15 Second Collector Layer 26 1323541
151 導電柄 16 封裝單元 2 電子裝置 21 電源輸入端子 22 電源輸入端子 23 元件區 3 電能供應系統 31 電路基板 311 隔離區域 312 邏輯電路區域 313 第一金屬層 314 基板聚合物層 3141 微孔洞 315 第二金屬層 316 電子隔離層 317 電子隔離層 32 第一電極基板 321 第一集電層 322 第一活性材料層 323 第一聚合物層 324 第一分隔元件 325 第一黏著加強層 326 第一電路佈局層 33 第二電極基板 1323541 331 第二集電層 332 第二活性材料層 333 第二聚合物層 334 第二分隔元件 335 第二黏著加強層 336 第二電路佈局層 34 第一封裝單元 341 第一鈍性單元 342 第一成型單元 35 第二封裝單元 351 第二鈍性單元 352 第二成型單元151 Conductor shank 16 Package unit 2 Electronics 21 Power input terminal 22 Power input terminal 23 Component area 3 Power supply system 31 Circuit board 311 Isolation area 312 Logic circuit area 313 First metal layer 314 Substrate polymer layer 3141 Micro hole 315 Two metal layer 316 electronic isolation layer 317 electronic isolation layer 32 first electrode substrate 321 first collector layer 322 first active material layer 323 first polymer layer 324 first separation member 325 first adhesion enhancement layer 326 first circuit layout Layer 33 second electrode substrate 1323541 331 second collector layer 332 second active material layer 333 second polymer layer 334 second spacer element 335 second adhesion enhancement layer 336 second circuit layout layer 34 first package unit 341 first Passive unit 342 first molding unit 35 second package unit 351 second passive unit 352 second molding unit