TWI705598B - Electricity supply system and the package structure thereof - Google Patents

Abstract

An electricity supply system and the package structure thereof are disclosed. Two substrates of the package structure are directly or indirectly served as current collectors of the electricity supply system. The sealing frame of the package structure is made of several silicone layers having high moisture-resistance and/or high gas-resistance. Hence, the package structure mentioned may not only provide a novel electrical conduction module to lower the intrinsic impedance of the electricity supply system itself but prevent the moisture and the gas outward from the electricity supply unit inside the package structure as well. Consequently, the electrical performance and safety of the electricity supply system are both improved.

Description

Electric energy supply system and its packaging structure

The invention relates to an electric energy supply system and its packaging structure, in particular to an electric energy supply system and its packaging structure with a novel conductivity mode and high water and gas barrier effects.

As 3C products such as electronics, information and communications are all developing towards wireless and portability, various high-performance components used in various products have moved towards the goal of being light, thin, short and small. In recent years, flexible The technological development of electronic products has also gradually received attention. Therefore, the demand for electric power supply systems with small size, light weight and high energy density is quite urgent. However, in order to extend the battery life and increase the energy density of the battery, the primary battery system that could not be reused in the past can no longer meet the needs of today's electronic products, and the current battery systems used in electronic products are mostly rechargeable and dischargeable. The secondary battery system is the mainstream, such as: lithium battery system, fuel cell system, solar battery system... etc. The following will take the more mature technology development of lithium battery system as an example for illustration.

First of all, the first figure is a schematic diagram of the battery cell structure of a conventional lithium battery system. The main structure is composed of a positive electrode plate and a negative electrode plate sandwiched between a separator layer, and the positive electrode plate and A conductive handle structure is respectively welded on the collector layer of the negative electrode plate as external electrodes, so that the battery system can be electrically connected with the peripheral electronic components through the two external electrodes. As shown in the first figure, the lithium battery 1 includes an isolation layer 11, a first active material layer 12, and a second active material layer. The material layer 13, a first collector layer 14, a second collector layer 15 and an encapsulation unit 16. As shown in the first figure, the first active material layer 12 is disposed on the isolation layer 11, the first collector layer 14 is disposed on the first active material layer 12, and the second active material layer 13 is disposed under the isolation layer 11. The second collector layer 15 is disposed under the second active material layer 13, and finally, the packaging unit 16 seals the stacked structure, and only the conductive handles 141, 151 are exposed. As mentioned above, if the lithium battery 1 wants to provide power to an electronic device 2 (the first figure is only a circuit board for illustration, but the electronic device 2 is not limited to a circuit board), the conductive handles 141, 151 must be It is electrically connected to the power input terminals 21 and 22 of the electronic device 2 so as to output the electric energy stored in the lithium battery 1 to the electronic device 2, and then the electric energy can be transmitted to the component area 23 of the electronic device 2 through the wire. The device area 23 may include logic circuits, active devices, passive devices, etc., which may be circuit layouts or surface mount devices (SMT). However, because whether the contact interface between the isolation layer 11 and the first active material layer 12 and the second active material layer 13 has a good contact system has a very direct and serious impact on the electrical and safety performance of the overall battery system. Therefore, in order to maintain good contact between these interfaces in the conventional lithium battery technology, whether it is a stacked structure or a wound structure of the battery cell, the flexibility of the overall structure after the battery is assembled is quite considerable. The reason is to avoid damage to the interface between the isolation layer 11 and the first active material layer 12 and the second active material layer 13 due to the stress generated by the flexing, thereby maintaining the lithium battery system The electrical performance and ensure the safety of its use.

Furthermore, considering the packaging structure of the conventional power supply system, whether it is a primary battery system or a secondary battery system, all conventional battery system packaging is mostly in the form of a hard metal shell (including traditional cylindrical and square) appearance. For example, the current large number of 18650 lithium batteries (cylindrical lithium batteries) used in notebook computers or the large number of 383562 lithium batteries (square lithium batteries) used in portable communication devices are all made of hard metal shells. For packaging materials, such packages In addition to avoiding damage to the battery cell by external stress, the installation method can also reduce the influence of external factors (such as moisture, oxygen, etc.) on the internal chemical system of the battery. Therefore, for terminal electronic products, although secondary lithium batteries can provide better electrical performance and service life, due to their fixed size design and hard shell material, most electronic products are in the circuit design The system is subject to considerable restrictions; although subsequent secondary battery systems have developed a packaging technology that replaces the conventional hard metal casing in the form of metal soft packaging, which can reduce the difficulty of the secondary battery system in the application of electronic products, however, Compared with the conventional hard metal casing, the packaging structure of the metal soft package is realized by heat and pressure sealing. Therefore, the metal soft package is on the sealing interface of the conductive handle, because the heat of the metal of the conductive handle and the metal soft package The sealing polymer is two different materials, so the sealing effect between them is not good. Therefore, the performance of the gas barrier (especially oxygen) and water barrier is worse than the conventional hard metal shell that is welded and sealed. Moreover, when the secondary battery is continuously charged and discharged, the overall size of the battery system will expand and shrink. At this time, because the metal flexible package itself cannot provide sufficient material stress, the system cannot effectively maintain the two Due to the size of the secondary battery, electronic products face annoying difficulties in circuit design.

Please refer to the first figure again. The isolation layer 11 disposed between the first active material layer 12 and the second active material layer 13 is mainly used to avoid the first electrode substrate (including the first active material layer 12 and the first active material layer 12). The current collection layer 14) and the second electrode substrate (including the second active material layer 13 and the second current collection layer 15) are in direct contact and an internal short circuit occurs in the lithium battery 1, but at the same time it must be able to provide lithium batteries The path required for ion migration in the cell 1. Therefore, the material of the isolation layer 11 must be both non-conductive and porous. The common isolation layer 11 is made of polymer materials such as polyethylene and polypropylene. , According to different polymers or the same polymer but different molecular weight The glass transition and softening temperature can also change the structure of the local polymer within a certain temperature range. Therefore, when the internal temperature of the battery system rises due to an internal short circuit, an external short circuit or any factor, the change in the structure of the isolation layer 11 However, sealing the ion migration path in the lithium battery 1 prevents the lithium battery 1 from continuing the electrochemical reaction at a high temperature, which can reduce the probability of explosion of the lithium battery 1. However, if the lithium battery 1 continues to heat up for some reason, once the inside of the battery reaches 150°C~180°C, based on the physical characteristics of the isolation layer 11 in the prior art, the chemical structure of the isolation layer 11 will collapse and melt as a whole. It causes a full-scale short circuit and then causes a serious fire or explosion, which poses a considerable threat to the safety of the use of the lithium battery 1.

However, in addition to the above-mentioned various deficiencies, it is more important that most of the internal circuits and component designs of current flexible electronic products have reached the design requirements for flexibility, but the existing battery system is still unable to maintain good performance. Provides flexible characteristics under the premise of electrical and safety performance. In addition, due to the gradual miniaturization of electronic products, the battery system used in it has not been designed to reduce the volume correspondingly and take into account at the same time The good electrical performance makes most electronic products have to sacrifice part of the structural space to set up the required battery system, and therefore the size of the electronic products is considerably restricted.

In view of the above, the present invention addresses the shortcomings of the above-mentioned conventional technologies and proposes an electric power supply system and its packaging structure to effectively overcome the above-mentioned problems.

The main purpose of the present invention is to provide an electric power supply system and its packaging structure, which uses materials that can effectively block moisture and gas as a sealing frame, thereby blocking the water and gas in the environment from entering the electric power supply unit, so as to make electric energy Electrical and chemical reactions in the supply unit It will not be affected by external water and gas to maintain the efficiency of the internal electric and chemical reactions of the electric power supply unit.

Another object of the present invention is to provide an electrical energy supply system and its packaging structure, wherein the sealing frame can be quickly and accurately formed on the first substrate and the second substrate by printing or coating, so that the process yield and production In terms of speed, both have made quite a positive contribution.

Another object of the present invention is to provide an electrical energy supply system and its packaging structure, wherein the packaging structure in the electrical energy supply system can be coupled with external electronic components at the same time, thereby reducing the use of components in electronic products, and can effectively shrink and thin The volume of electronic products.

Another object of the present invention is to provide an electrical energy supply system and its packaging structure, which can integrate the packaging structure of the electrical energy supply system and the electrical energy supply unit housed inside into a single structure, thereby reducing the use of materials to reduce The production cost of electronic products.

Another object of the present invention is to provide an electrical energy supply system and its packaging structure, wherein when the electrical energy supply system is impacted by an external force, the electrical energy supply unit is quickly separated from the packaging structure to create a protective open circuit structure, thereby increasing the electrical energy The safety of the supply system in use.

Another object of the present invention is to provide an electrical energy supply system and its packaging structure. Since it can integrate the packaging structure of the electrical energy supply system and the electrical energy supply unit into a single structure, the number of interfaces between the structures can be reduced, thereby effectively reducing The internal impedance of the power supply system improves the electrical capability of the power supply system.

In order to achieve the above objective, the present invention provides an electric power supply system and its packaging structure, which uses a flexible sealing frame to seal the accommodating space between the first substrate and the second substrate so as to be accommodated therein The electric power supply unit must be completely separated from the outside moisture and gas to ensure the overall electrical performance and safety performance of the power supply system. In addition, the first base At least one of the board and the second substrate can be used as a circuit board and coupled with external electronic components. Therefore, when the power supply system is applied to electronic products, it can effectively reduce the use of electronic components in electronic products and realize The design concept of thin and small electronic products.

The first electrode has a first active material layer and a first collector layer. The first collector layer is directly in contact with the first active material layer and has a first hermetic junction area. The second electrode has a second active material layer and a second collector. The second current collecting layer is in direct contact with the second active material layer and has a second sealing and bonding area, and the flexible sealing frame is arranged on the first sealing and bonding area of the first current collecting layer and the second current collecting layer. Between the two sealed joint areas, the flexible sealing frame is used to bond the first current collector layer to the second current collector layer to provide a accommodating space for accommodating the first active material layer, the second active material layer and the isolation layer .

The flexible sealing frame includes two first silicone layers and a second silicone layer. The first silicone layer mainly includes the following chemical formula 1:

The second silicone layer mainly contains the following chemical formula 2:

Both the first silicone layer and the second silicone layer have chemical formula 1 and chemical formula 2 to solve the problem of easy peeling of bubbles and substrate; while the first silicone layer adjusts the interface tension and material polarity to greatly improve the difference Adhesion of the material. In addition, the sealing frame is flexible. Therefore, when the electrical energy supply unit contained in the packaging structure is a flexible electrical energy supply unit, the disclosed sealing frame can also follow the flexible electrical energy supply unit after sealing. Flex, so it can It is fully in line with the flexible characteristics of flexible electronic products.

Detailed descriptions are given below by specific embodiments, so that it will be easier to understand the purpose, technical content, features, and effects of the present invention.

1‧‧‧Battery

11‧‧‧Isolation layer

12‧‧‧The first active material layer

13‧‧‧Second active material layer

14‧‧‧First collector layer

141‧‧‧Conductive handle

15‧‧‧Second collector layer

151‧‧‧Conductive handle

16‧‧‧Packaging unit

2‧‧‧Electronic device

21‧‧‧Power input terminal

22‧‧‧Power input terminal

23‧‧‧Component area

3‧‧‧Power Supply System

31‧‧‧Packaging structure

311‧‧‧First substrate

311a‧‧‧First conductive surface

311b‧‧‧First sealing joint area

312‧‧‧Second substrate

312a‧‧‧Second conductive surface

312b‧‧‧Second sealing joint area

313‧‧‧Sealing frame

313a‧‧‧The first silicone layer

313b‧‧‧Second silicone layer

32‧‧‧Power Supply Unit

321‧‧‧Polar layer/positive electrode layer

322‧‧‧Polar layer/Negative electrode layer

323‧‧‧Isolation layer

4‧‧‧Conductive adhesive

5‧‧‧Component

6‧‧‧Conductive element

A1‧‧‧Active material layer

A2‧‧‧Active material layer

C1‧‧‧ Collector layer

C2‧‧‧ Collector layer

S‧‧‧accommodating space

T1‧‧‧Terminal

T2‧‧‧Terminal

A-A’‧‧‧Cut off

The first figure is a schematic diagram of the battery cell structure of a conventional lithium battery system.

The second (A) drawing is an external view of the package structure of the power supply system disclosed in the present invention.

The second (B) drawing is a cross-sectional view along the line A-A' of the package structure of the power supply system disclosed in the second (A).

The third figure is an embodiment in which the first substrate of the package structure disclosed in the present invention is a circuit board.

The fourth (A) drawing is an implementation aspect of the package structure using the conductive surface of the substrate as the collector layer.

The fourth (B) drawing is an implementation aspect of the package structure that does not use the conductive surface of the substrate as the collector layer.

Figure 5 (A) is a partial cross-sectional view of an electrical energy supply system constituted by accommodating multiple electrode layers in a package structure.

Figure 5 (B) is a partial cross-sectional view of an electrical energy supply system formed by accommodating winding pole layers in a package structure.

The sixth (A) diagram is an implementation state where the two terminals of the power supply system are designed on different substrates.

The sixth (B) diagram is an implementation state where the two terminals of the power supply system are designed on the same substrate.

The seventh figure is the test curve of the moisture content of the packaging structure of the present invention at a relative humidity of 95% at 60 degrees Celsius Figure.

Figure 8 is a cross-sectional view of the package structure of the power supply system disclosed in Figure 2 (A) along the line A-A'.

Figure ninth (A) is a schematic diagram of the first conductive surface of the first substrate disclosed in the present invention, showing the state of its first sealing area.

Ninth (B) is a schematic diagram of the second conductive surface of the second substrate disclosed in the present invention, showing the state of its first sealing area.

In order to clearly reveal the technical features of the electric energy supply system and its packaging structure disclosed in the present invention, several embodiments are presented below to illustrate the technical features of the present invention in detail, and at the same time, a diagram is provided to highlight these technical features.

First, please refer to the second (A) and second (B) diagrams at the same time. The second (A) diagram is the external view of the package structure of the power supply system disclosed in the present invention, and the second (B) ) The figure is a cross-sectional view of the package structure of the power supply system disclosed in the present invention along the line AA'. The packaging structure 31 disclosed in the present invention is used to accommodate at least one power supply unit 32, and the packaging structure 31 includes a first substrate 311, a second substrate 312, and a sealing frame 313, wherein The packaging structure 31 can be directly exposed to the general environment, and has the ability to resist external forces and moisture penetration. The first substrate 311 and the second substrate 312 have at least one first conductive surface 311a and at least one second conductive surface 312a, respectively, and the sealing frame 313 is sandwiched between the first substrate 311 and the second substrate 312 And the sealing frame 313 is arranged around the peripheries of the first base material 311 and the second base material 312, so there is a structure formed between the sealing frame 313 and the first base material 311 and the second base material 312. The accommodating space S is for accommodating the power supply unit 32.

The power supply unit 32 is electrically connected to the first conductive surface 311a of the first substrate 311 and the second conductive surface 312a of the second substrate 312, and the sealing frame 313 includes two first silicone layers 313a and A second silicone layer 313b and two first silicone layers 313a are respectively adhered to the first substrate 311 and the second substrate 312. In other words, the first substrate 311 and the second substrate 312 are respectively adhered with a first silicone Layer 313a, the second silicon layer 313b is disposed between the two first silicon layers 313a to adhere the two first silicon layers 313a, that is, the first silicon layer 313a adhered to the first substrate 311 and the second The first silicone layer 313a of the substrate 312 is adhered to each other by the second silicone layer 313b.

Further, referring to FIG. 9(A), the first conductive surface 311a of the first substrate 311 has a first sealing junction area 311b which is along the area around the first conductive surface 311a, the first substrate 311 The remaining area of the first conductive surface 311a (that is, the area surrounded by the first sealing junction area 311b) is mainly used as the contact area of the first active material layer, and one of the first silicone layer 313a is bonded to the first A sealing joint area 311b. Please refer to the ninth (B) figure, the second conductive surface 312a of the second substrate 312 has a second sealing junction area 312b, which is along the area around the second conductive surface 312a another first silicone layer 313a is bonded to The second sealing junction area 312b, the remaining area of the second conductive surface 312a of the second substrate 312 (that is, the area surrounded by the second sealing area 312b) is mainly used as the contact area of the second active material layer.

In order to enable the first silicone layer 313a and the second silicone layer 313b to have different adhesive properties, different formulations or additives are used for modification in the present invention. The interface tension and material polarity of the first silicone layer 313a are based on the first conductive surface 313a and the second conductive surface 313b Adjustments are made to greatly improve the adhesion to the dissimilar material, so that the adhesion of the first silicone layer 313a to the surface of the dissimilar material is increased. The dissimilar material surface referred to here, such as the surface of the metal substrate and the surface of the silicon rubber The second silicone layer 313b), so that the first silicone layer 313a can be firmly adhered to the surfaces of the first substrate 311 and the second substrate 312. In contrast, for the second silicone layer 313b, since its function is mainly to adhere the two first silicone layers 313a, the second silicone layer 313b has a stronger effect on homogeneous surfaces (for example, the first silicone layer 313a). The adhesion force of the first silicone layer 313a and the second silicone layer 313b can be used to closely adhere the first substrate 311 and the second substrate 312, and make the sealing frame 313, the first substrate 311 and The accommodating space S between the second substrates 312 can be effectively isolated from external moisture and gas.

The first silicone layer 313a mainly includes the following chemical formula 1:

The second silicone layer 313b mainly includes the following chemical formula 2:

Both the first silicon layer 313a and the second silicon layer 313b have chemical formula one and chemical formula two.

The amount of the chemical formula one component in the first silicone layer 313a is greater than that of the chemical formula two component, and the amount of the chemical formula two component in the second silicone layer 313b is greater than the chemical formula one component.

In addition, the amount of the second component of the chemical formula in the second silicone layer 313b is greater than 0.1-60% (weight/volume ratio) than the amount of the second component of the chemical formula in the first silicone layer 313a. The modification method of the first silicone layer 313a can be to increase the proportion of addition type silicone, or Acrylic resin (Epoxy), acrylic acid (acrylic acid), or a combination thereof is added to the silicone to be modified.

For example, the flexible sealing frame of the present invention can be formed on the first conductive surface 311a of the first substrate 311 and the second conductive surface 312a of the second substrate 312 by coating or printing processes. The first silicone layer 313a is formed separately to adjust the surface characteristics of the first conductive surface 311a and the second conductive surface 312a to increase subsequent adhesion to the second silicone layer 313b. In other words, the first silicone layer 313a can be regarded as the surface modification layer of the first substrate 311 and the second substrate 312. Furthermore, the first silicon layer 313a is adhered to the inner periphery of the first conductive surface 311a and the second conductive surface 312a.

Then it is cured by slow curing. Because the first silicone layer 313a is an open surface that is not sandwiched between the upper and lower sides, and is combined with slow curing, the gas generated during the curing process of the silicone is easier to be discharged. The silicone layer 313a is modified according to the materials of the first conductive surface 311a of the first substrate 311 and the second conductive surface 312a of the second substrate 312, so that the first silicone layer 313a and the first substrate 311 The bonding condition between the first silicone layer 313a and the second substrate 312 is quite good.

The second silicone layer 313b is arranged on one of the first silicone layers 313a, and then the first substrate 311 and the second substrate 312 are combined with the first silicone layer 313a and the second silicone layer 313b. This curing process can be Two stages are used to make the adhesion closer, and the curing process can also be combined with pressure treatment; the heat treatment temperature of the first stage is lower than the heat treatment temperature of the second stage, and the heat treatment time of the first stage is longer than the heat treatment time of the second stage. During the first stage of the lower heat treatment temperature, the second component of the chemical formula in the second silicone layer 313b is the dominant component, and a crystalline structure is formed in the second silicone layer 313b. The thickness of 313b is relatively thin, so the crystalline structure is regarded as a moisture-blocking structure in the second silicone layer 313b. Therefore, the crystalline structure can strengthen the ability of blocking moisture at the interface between the second silicone layer 313b and the first silicone layer 313a; This is a very important performance when used as a package structure for a power supply system such as a lithium battery.

In the second stage of the higher heat treatment temperature, the chemical formula one component in the second silicone layer 313b is the dominant component, and has better adhesion than the chemical formula two. Therefore, the second silicone layer 313b and the first silicone layer 313a They can adhere closely to each other. Preferably, the heat treatment temperature in the first stage is about 30-70 degrees (C°) lower than the heat treatment temperature in the second stage, and the heat treatment time in the first stage is longer than the heat treatment time in the second stage by about 80-300 seconds. In order to prevent the second silicon layer 313b from being deformed during the above process, the second silicon layer 313b may further include spacers. The spacer silicon includes silicon dioxide, titanium oxide particles, or a combination thereof.

Since the second silicon layer 313b and the upper/lower first silicon layer 313a are of homogenous material (the material is the same or roughly the same, in other words, silicon), the adhesive force is high. Once gas is generated, it is not easy to damage the two. The adhesive structure between. In addition, compared to the first substrate 311 and the second substrate 312 with high density, the microscopic internal structure of the silicone material has larger pores than the first substrate 311 and the second substrate 312. The silicon layer 313b is sandwiched between the first silicon layer 313a for curing, and the generated gas can also be discharged by the first silicon layer 313a, and it is less likely to accumulate gas and form bubbles. Since the molecular forces in the second silicone layer 313b and the first silicone layer 313a are equal, the gas flow state therein is uniform, which is not the same as the second silicone layer 313b and the heterogeneous first substrate 311 and the second substrate 312 ( Especially for dense substrates, such as metal, glass, highly crystalline molecular substrates, etc., due to the significant difference in molecular forces, the gas flow is uneven, resulting in problems such as bubbles integration and larger defects. Therefore, by homogeneous The material makes it difficult for the gas generated during the curing process to integrate into larger-sized bubbles. Therefore, the bonding condition between the interface of the second silicon layer 313b and the first silicon layer 313a is much improved. For the above reasons, the interfaces between the first silicone layer 313a and the first substrate 311 and between the first silicone layer 313a and the second substrate 312 will be more firmly bonded than conventional interfaces.

Furthermore, at least one of the first substrate 311 and the second substrate 312 in the present invention is a circuit board (for example: printed circuit board, multilayer circuit board, flexible circuit board, metal layer... etc.), regardless of It is the first substrate 311 or the second substrate 312. The first substrate 311 and the second substrate 312 must have at least one conductive surface (311a, 312a) for the power supply unit 32 contained in the package structure 31 The electrical connection relationship with the conductive surfaces (311a, 312a) can be used to collect the electrical energy generated by the electrical energy supply unit 32, and the collected electrical energy can be transferred to the circuit board according to different mechanism designs, for example As shown in the third figure, for a substrate that is also a circuit board and has conductive surfaces (311a, 312a) (this embodiment uses the first substrate 311 as an example), it can be collected directly The electrical energy of the conductive surface (311a) is transferred to the circuit board. For a substrate with only a conductive surface (312a) (this embodiment is represented by the second substrate 312), the conductive surface (312a) collects The electrical energy can be through the electrical connection between the two substrates (for example, the conductive glue 4 is used to adhere the two substrates), and then the electrical energy generated by the electrical power supply unit 32 can form a complete loop and can be transferred to the electrical circuit On the board, finally, the electrical energy can be transmitted to the components 5 on the circuit board (not limited to active components or passive components) through the circuit layout design on the circuit board; of course, on the first substrate 311 and the second substrate In the case where 312 is a circuit board at the same time, the effect of electrically connecting the first substrate 311 and the second substrate 312 not only can be used to provide electrical energy, but also can be used as a path for electrically connecting components on the circuit board. The above-mentioned first substrate 311 and second substrate 312 can be not only circuit boards, but also metal substrates, glass substrates, and composite substrates. Board (for example: metal and polymer composite substrate).

In addition, the above-mentioned power supply unit 32 includes at least two-pole layers 321 and 322 and at least one isolation layer 323. The two-pole layers 321 and 322 are all arranged to directly contact the sealing frame 313 (see the second (B) drawing); In another embodiment, one of the electrode layers 321, 322 is arranged to directly contact the sealing frame 313 (see Figure 8), which is usually the anode electrode layer. In Figure 8, the electrode layer 321 does not directly contact The sealing frame 313 is usually the cathode electrode layer. In addition, since the pole layer 321 does not directly contact the sealing frame 313, at least a part of the first conductive surface 311a is exposed between the sealing frame 313 and the pole layer 321; the power supply unit 32 is a lithium ion conductive functional layer of a lithium battery.

The first silicone layer 313a is used to support the power supply unit 32 to maintain the stress balance of the electrode layers 321 and 322. Therefore, the thickness of the first silicone layer 313a is close to the thickness of the electrode layers 321 and 322, and each first silicone layer 313a The thickness is 70-90% of the total thickness of the isolation layer 323 and the first active material layer (polar layer 321), or 70-90% of the total thickness of the isolation layer 323 and the second active material layer (polar layer 322), preferably, The thickness of the first silicone layer 313a is 80-85% of the total thickness of the isolation layer 323 and the first active material layer (polar layer 321), or the total thickness of the isolation layer 323 and the second active material layer (polar layer 322)

The second silicone layer 313b is used as the adhesive layer of the present invention. Its thickness is a setting value and does not change with the thickness of the first silicone layer 313a. Therefore, the thickness of the second silicone layer 313b is 0.5-2.5 Micrometers. When the thickness of the second silicone layer 313b is too thin, in other words less than 0.5 microns, its adhesive force will be too weak; and when the thickness of the second silicone layer 313b is too thick, in other words greater than 2.5 microns, it will cause Water resistance becomes worse. Preferably, the thickness of the second silicone layer 313b is 1-2 microns

Each isolation layer 323 is arranged between the adjacent diode layers 321 and 322, Its purpose is to isolate the diode layers 321, 322 to avoid the problem of internal short circuit in the power supply unit 32, and the diode layers 321, 322 and the isolation layer 323 are all attached with electrolyte. Of course, the electrolyte contains pure Liquid electrolyte, colloidal electrolyte and solid electrolyte. Furthermore, the material of the isolation layer 323 can be selected from polymer materials, ceramic materials or glass fiber materials.

In more detail, each pole layer 321, 322 includes an active material layer A1, A2, and the embodiment shown in the fourth (A) figure uses the conductive surface (311a) of the substrate (311, 312) , 312a) is the state of the collector layer. In this state, the active material layers A1, A2 are in direct contact with the conductive surfaces (311a, 312a) of the substrate (311, 312) to form an electrical connection. In other words, no other structure is interposed between the active material layer A1, A2 and the conductive surface (311a, 312a) of the substrate (311, 312). Among them, the so-called direct contact system includes forming the active material layers A1, A2 directly on the conductive surface (311a, 312a) of the substrate (311, 312), or by means of mechanical design (for example: vacuum sealing) In order to push the active material layer A1, A2 against the conductive surface (311a, 312a) of the substrate (311, 312), therefore, in this state, the electric energy generated by the active material layer A1, A2 can be directly borrowed The conductive surface (311a, 312a) of the substrate (311, 312) is transferred to the circuit board. In addition, the embodiment shown in the fourth (B) figure does not use the conductive surface (311a, 312a) of the substrate (311, 312) as the collector layer, but uses an independent collector layer (C1, C2) is described as an example. In other words, the pole layer (321, 322) in this embodiment includes the active material layer (A1, A2) and the collector layer (C1, C2), and the active material layer (A1 , A2) is formed on the collector layer (C1, C2), and the electrical connection between the pole layer of the power supply unit 32 and the package structure 31 is through the collector layer (C1, C2) and the substrate ( 311, 312) of the conductive surfaces (311a, 312a) of the direct contact (such as the structure shown in the fourth (B) figure) or indirect contact to achieve, wherein the so-called indirect contact mode can, for example, use additional wires, conductive The electric handle or other conductive structure (not shown in the figure, the conductive structure can be, for example, a metal sheet, a metal strip, etc.) to electrically connect the collector layer (C1, C2) and the substrate (311, 312) Conductive surfaces (311a, 312a).

Therefore, it can be seen from the above that the package structure 31 disclosed in the present invention and the power supply unit 32 contained therein have an electrical connection relationship, but the electrical connection relationship may be a direct electrical connection. Connection mode or indirect electrical connection mode. Such a design can not only reduce the impedance of the overall power supply system 3 by increasing the electrical connection area, but also can cause the power supply system 3 to be hit, dropped or punctured Under such circumstances, the current collection of the active material layer (A1, A2) of the pole layer (321, 322) or the pole layer (321, 322) is caused by instantaneous destruction (thus causing problems such as local high temperature or structural fracture) The layer (C1, C2) is immediately separated from the conductive surface (311a, 312a) of the substrate (311, 312), and therefore the electrical connection between the power supply unit 32 and the packaging structure 31 is completely destroyed, and That is, the overall electric power supply system 3 will immediately be disconnected and the chemical reaction inside the electric power supply unit 32 can be immediately terminated, thereby preventing the electric power supply system 3 from exploding or catching fire due to a series of chemical reactions, thereby greatly increasing the power supply Security of System 3.

The above-mentioned power supply unit 32 can be formed by stacking a single positive electrode layer 321, a single isolation layer 323, and a single negative electrode layer 322 on each other, and can also be composed of multiple positive electrode layers 321 and multiple pieces of isolation. The layer 323 and the multiple negative electrode layers 322 are stacked on each other to form, for example, the cross-sectional structure diagram shown in the fifth (A) figure, of course, it can also be a wound-shaped power supply unit 32' structure, such as the fifth (B) figure. The cross-sectional structure diagram shown is also another conventional power supply unit structure. However, unlike the conventional power supply system, the power supply unit 32 of the present invention and the package structure 31 have an electrical connection relationship. , But in the In the energy supply system, there is no electrical connection between the power supply unit and the packaging structure.

In addition, the package structure 31 disclosed in the present invention includes at least two terminals (T1, T2). One ends of the two terminals (T1, T2) are electrically connected to the positive electrode layer 321 and the negative electrode layer of the power supply unit 32, respectively. 322, and the other end of the two terminals (T1, T2) is set on the substrate (311, 312) of the package structure 31 as a contact point for electrical connection with other components (not shown). Of course, according to Different designs Two terminals (T1, T2) can be designed on the same substrate (311, 312), or on different substrates (311, 312), for example, as shown in Figure 6 (A) As shown, when the two terminals (T1, T2) are designed on different substrates (311, 312), the conductive surfaces (311a, 312a) of the two substrates (311, 312) are directly connected to the power supply unit 32. The two-pole layers 321 and 322 are electrically connected, so the two terminals (T1, T2) that are electrically connected to the two-pole layers 321 and 322 can be directly connected through the circuit layout design or the connection of other conductive elements. Electric energy is conducted from the pole layers 321 and 322 to the terminals (T1, T2), and when the two terminals (T1, T2) are designed on the same substrate (311, 312), as shown in Figure 6 (B), Since the conductive surfaces (311a, 312a) of the two substrates (311, 312) are still directly electrically connected to the diode layers 321, 322 of the power supply unit 32, they are electrically connected to the diode layers 321, 322. The two connected terminals (T1, T2) must indirectly pass through the conductive element 6 (such as conductive glue... etc.) between the two substrates (311, 312) to connect one of the substrates (311, 312) 312) The electrically connected electrode layers 321, 322 are conducted to the terminals (T1, T2) on the other substrate (311, 312).

The above-mentioned package structure mainly has four functions. The first function is to completely seal the power supply unit contained in the package structure. As is generally known, the power supply unit is Normal electrochemical reaction (reaction mechanism that can lead to the conversion of electrical energy and chemical energy), the electrical energy supply unit is bound to contain a certain amount of electrolyte, However, since the polarity of the sealing frame and the electrolyte are not the same, when the first silicone layer and the second silicone layer are formed on the first substrate and the second substrate, even if the electrolyte in the power supply unit adheres to the first The silicone layer and the second silicone layer will also repel each other due to the different polarities of the materials. In other words, the adhesion between the first and second silicone layers and the first and second substrates is not It will cause the problem of degradation due to the adhesion of the electrolyte. In addition, when the first silicone layer and the second silicone layer are adhered, the ability of the first and second silicone layers to repel the electrolyte can also be used to reduce Most of the electrolyte is retained in the power supply unit, and a large amount of electrolyte will not be squeezed out of the sealing frame during the adhesion process; furthermore, because the sealing frame is not made of metal (for example: copper, nickel, etc.) It is made of lithium metal material), so it can reduce the possibility of lithium metal precipitation in the frame; third, because the material of the sealing frame is mainly composed of silicon, it can still have a certain degree of flexibility after the high temperature aging reaction , So it can provide good flexibility; finally, silicone has a certain repulsive force against water vapor. In other words, the transmission method of water vapor in the package structure can only be achieved by a slower diffusion method. The moisture inside the silicone layer and the second silicone layer is gradually filled into a saturated state, and then can gradually enter the inside of the package structure, so the time required for water vapor to enter the inside of the package structure can be effectively extended, as shown in Figure 7 It shows that compared with the packaging materials in the conventional power supply system, the packaging structure disclosed in the present invention is under accelerated environmental testing (test conditions where the ambient temperature is raised to 60 degrees Celsius and the humidity is 95% relative humidity). Seven days (approximately equal to one year of operation of the power supply system in a normal temperature and humidity environment). Although there is a high water content during the test period, it is in the next fourteen days (approximately equal to the operation of the power supply system in a normal temperature and humidity environment). Compared with the conventional package structure, the package structure disclosed in the present invention is obviously compared with the test time of two years) and twenty-one days (approximately equal to three years of operation of the power supply system in a normal temperature and humidity environment). Can block the entry of moisture Into.

In summary, the power supply system uses a circuit substrate to separate the first active material layer and the second active material layer, that is, the battery cells can be directly integrated into the circuit board, so the power supply system and the circuit board can be integrated Effective integration, even the process conditions of the circuit board can be used to manufacture the power supply system of the present invention. Compared with the prior art, the power supply system according to the present invention can be integrated with the circuit board manufacturing process. The power supply system can be regarded as a surface mount device (SMT). Therefore, the manufacturing cost of the product can be effectively reduced, and it can also make The product is more miniaturized and thinner; in addition, other circuit substrates or electronic components can be directly arranged on the outer surface of the substrate of the packaging structure, so the area of the power supply system can be effectively used for circuit layout, thereby making the product More miniaturization.

Only the above are merely preferred embodiments of the present invention, and are not used to limit the scope of the present invention. Therefore, all equivalent changes or modifications made in accordance with the characteristics and spirit of the application scope of the present invention shall be included in the patent application scope of the present invention.

3‧‧‧Power Supply System

31‧‧‧Packaging structure

311‧‧‧First substrate

311a‧‧‧First conductive surface

312‧‧‧Second substrate

312a‧‧‧Second conductive surface

313‧‧‧Sealing frame

313a‧‧‧First adhesive layer

313b‧‧‧Second adhesive layer

32‧‧‧Power Supply Unit

321‧‧‧Polar layer/positive electrode layer

322‧‧‧Polar layer/Negative electrode layer

323‧‧‧Isolation layer

S‧‧‧accommodating space

A-A’‧‧‧Cut off

Claims (15)

An electric power supply system, which includes: A first electrode layer having a first active material layer and a first collector layer directly in contact with the first active material layer, the first collector layer having a first hermetic junction area; A second electrode layer having a second active material layer and a second collector layer directly in contact with the second active material layer, the second collector layer having a second hermetic junction area; An isolation layer located between the first pole layer and the second pole layer; and A flexible sealing frame is arranged between the first sealing joint area of the first current collector layer and the second sealing joint area of the second current collector layer, and the flexible sealing frame is the first A collector layer is bonded to the second collector layer to provide an accommodating space for accommodating the first active material layer, the second active material layer, and the isolation layer, wherein the flexible sealing frame includes: Two first silicone layers, one of the first silicone layer is bonded to the first sealing junction area of the first current collector layer, and the other first silicone layer is bonded to the second seal of the second current collector layer In the bonding area, each of the modified silicone cured layers mainly contains the following chemical formula 1:

;as well as A second silicone layer is located between the two first silicone layers and bonded In between, the second silicone layer mainly includes the following chemical formula 2:

Wherein the first silicon glue layer and the second silicon glue layer both have the chemical formula one and the chemical formula two; The thickness of each of the first silicone layers is 70-90% of the total thickness of the isolation layer and the first active material layer, or the total thickness of the isolation layer and the second active material layer. The power supply system according to the first item of the scope of patent application, wherein the first hermetic junction area of the first collector layer is along the area around the first collector layer, the second collector layer The sealing junction area is the area along the periphery of the second current collector layer. According to the first power supply system of the patent application, at least one of the first collector layer and the second collector layer is a metal layer of a printed circuit board. According to the power supply system according to item 1 of the scope of patent application, the first active material layer directly contacts the flexible sealing frame, and the second active material layer does not contact the flexible sealing frame. The power supply system according to item 4 of the scope of patent application, wherein the first active material layer is an anode active material layer, and the second active material layer is an anode active material layer. Cathode active material layer. According to the power supply system of item 4 of the scope of patent application, a part of the second collector layer is exposed between the flexible sealing frame and the second active material layer. According to the power supply system of the first item of the scope of patent application, the first silicone layers are modified by increasing the composition ratio of the addition molding silicone. According to the first power supply system in the scope of patent application, the first silicone layer is modified by adding epoxy, acrylic acid, or a combination thereof in the silicone. According to the first power supply system in the scope of the patent application, the second silicone layer further includes a spacer, and the spacer silicon includes silicon dioxide, titanium oxide particles, or a combination thereof. According to the power supply system of item 1 of the scope of patent application, the amount of the second component of the chemical formula in the second silicone layer is greater than 0.1-60% (weight/ Volume ratio). According to the first power supply system of the scope of patent application, the thickness of the second silicone layer is 0.5-2.5 microns. According to the 11th power supply system in the scope of patent application, the thickness of the second silicone layer is 1-2 microns. According to the power supply system of item 1 of the scope of patent application, the thickness of the first silicone layer is the sum of the thicknesses of the isolation layer and the first active material layer, or the sum of the thicknesses of the isolation layer and the second active material layer 75-80% of According to the power supply system of item 1 of the scope of patent application, the second The silicone layer has a moisture barrier crystalline structure. According to the power supply system of item 1 of the scope of patent application, the thickness of the second silicone layer is a set value, and the set value does not change with the thickness of the first silicone layer.

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