JPH04137583A - Printed circuit board - Google Patents

Abstract

PURPOSE:To easily obtain a printed circuit board(PCB) with a battery formed at part of the board by covering the positive pole forming synthetic agent side and negative pole forming metallic material side of a paper battery with conductor plates stuck to the upper and lower surfaces of a board material after the paper battery is positioned to an opening provided on the board material and integrally forming the battery with the board material. CONSTITUTION:After a recessed section for putting a positive pole forming synthetic agent 6 is formed at the battery section 8 of a conductor plate 3a by working the plate 3a and the agent 6 is put in the recessed section, an adhesive sheet 2 and a board plate 1 are successively put on the conductor plate 3a. The board material 1 has a hole of the same size as that of a sealing material 7 and the sealing material 7 and separator 5 are put in the hole. Then another adhesive sheet 2 and another conductor plate 3b are successively put on the board material 1. A negative pole forming metallic material 4 is stuck to the battery section 8 of the conductor plate 3b. Then the whole laminated body is pressed so as to stuck the conductor plates 3a and 3b to the board material 1 by thermocompression bonding and, at the same time, the part of the paper battery filled with the sealing material 7 is sealed by drawing. Therefore, the PCB with the built-in battery can be manufactured easily.

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a printed circuit board (PCB) in which a battery is formed on a part of a printed circuit board (PCB) in which a conductive pattern is formed on an insulating board by printing and etching. It is.

[Conventional technology]

Conventionally, there has been no PCB with a battery formed on a portion thereof. FIG. 8 shows the structure of a conventional thin electronic device. FIG. 8 is a plan view, and FIG. In the figure, 24 is the IO of the surface mount thin pancage.
and 25 is an IO chip. 37 is a paper battery, 37LL is a negative terminal plate, 37t+ is a positive terminal plate, 37C is a positive electrode mixture layer, 37d is a negative electrode metal material (lithium, etc.), 37e is a separator, 37h is a sealing resin (silicon rubber, etc.), 31 is a PCB, 31a is an insulating board material (glass epoxy, polyide, etc.), and -c is a negative terminal for connection to the PCB.
, 32b is a through hole, 32C is an M pattern, 29a is a resistor, a capacitor, an oscillator, and other circuit components. 23 is an exterior material, which includes the above IC, IE pond,
Parts etc? Store it.

In the thin electronic device according to the prior art, the above PCB has 10.
Part 3 Ushida (26 in the figure is solder)
, after laser bond welding the paper battery (38 in the figure)
The internal gap is sometimes sealed with resin for the same reasons as strength, moisture resistance, etc.

[The problem that the invention attempts to solve]

In conventional thin electronic devices, a paper battery was mounted on a PCB as described above, but paper batteries are sensitive to heat and pressure, making it extremely difficult to mount and requiring a special mounting method. For example, the following methods were used.

■As mentioned above, with the laser point f/I contact -fJJ
A method of melting n by applying heat locally, ■Thermocompression conductive seal (polymer material that adheres at low temperatures)
Connect with - ■ Make contact by sandwiching between spring materials.

These methods have the following successors:

In method (①), the number of steps increases just for battery mounting, and it is necessary to introduce a laser spot welding machine, which increases the cost. It is not suitable for applications that require a large amount of water to flow.

With method (2), there are concerns about contact resistance and poor contact, and furthermore, it is necessary to press down the upper and lower X poles, so it is not suitable for thinning.

Furthermore, when the thin electronic device is used for portable use in the above method, reliability against bending becomes a problem.

Also, when filling and sealing the exterior material with resin, the injection pressure of the resin will cause the battery to move and deform! ! This invention was made to solve the above-mentioned problems, and it solves the difficulty of mounting paper batteries and makes it possible to create portable thin electronic devices. The aim is to obtain a printed circuit board that is highly reliable and can be manufactured at low cost.

[Means for resolving division issues]

In the PCB according to the present invention, at the time of forming a base board, that is, when pasting a front conductor and a back conductor on an insulating board such as a square epoxy or polyimide, a paper battery is formed by simultaneously inserting a material number 1 into a part of the board. Afterwards, a circuit pattern was printed outside the battery area.

C Effect] Since the paper battery is directly connected to the circuit pattern in the PCB of the present invention, no special mounting process is required. ! ! Second, since the paper can be stored at the same time as the substrate is formed, costs can be reduced. Furthermore, portable m
When applied to a type I device, it is advantageous in making it thinner and has high reliability against bending.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a configuration diagram of a POB base board (before circuit pattern formation) according to the present invention. FIG. 1A shows a cross-sectional view, 1 is an insulating substrate material, 2 is an adhesive sheet, and 3a and 3b are front and back conductor plates, respectively. Nanchu, Paper Battery Department 8 (
=, formed by a negative electrode metal material 4, a separator 5, and a positive electrode mixture 6. 7 is a sealing material.

FIG. 1 is a plan view of the bare substrate 9. As shown in FIG.

Next, a method for manufacturing a POE according to the present invention will be briefly explained using FIG. First, the conductor plate 3a is processed to form the positive electrode mixture 6 in the battery part 8. A depression is formed, a positive electrode mixture 6B is poured into the depression, an adhesive sheet 2 is laminated thereon, and a substrate material is further laminated thereon.

Here, the substrate material 1 has a hole made in the size of the sealing material 7, and the sealing material 7 and the separator 5 are fitted into the hole.

Next, the adhesive sheet 2 is sandwiched and the conductor plate 3b is laminated thereon. A negative electrode metal material 4 is attached to the battery part 8 on the conductor plate 3b. After lamination as described above, the whole is pressed to bond the conductor plates 3a, 3b to the substrate material 1 by thermocompression, and the portion filled with the sealing material 7 of the paper battery is squeezed and sealed. Note that at this time, the temperature must be set within a temperature range that does not deteriorate the battery.

Next, a circuit pattern is formed outside the battery area indicated by the broken line 7a on the completed base substrate 9, and this pattern formation involves resist coating, mask alignment exposure, development processing, etching,
It is formed through processes such as drilling, through-hole plating, pattern/lead coating, and blanking line punching.

Here, due to the battery being out of service, there are the following restrictions.

■Through hole formation must be done after the pattern etching process.

■If wet etching is used for etching, it is necessary to etch one side at a time to avoid shorting between the positive and negative electrodes of the battery via the electrolyte. The non-etched surface &=the entire surface must be covered with resist.

■During the plating process, it is necessary to cover and protect the battery pattern with a jig or resist.

Here, although FIG. 1 shows one POB 'f, in actual manufacturing, several dozen PCBs are simultaneously formed on one board.

Next, a thin electronic device using the above-mentioned POB will be explained. FIG. 2A is a sectional view of a thin single-child device, and the opening is a plan view. 24 is an IC in a surface-mount thin package, and 8 is a paper battery formed on a PCB according to the present invention. 3b is a negative electrode pattern, 4 is a negative electrode material, 5 is a separator,
6 is a positive electrode mixture, a positive electrode pattern, and 7 is a sealing material. 1 is a PCB according to the present invention, 3C is a front conductor circuit pattern, and 3d is a back conductor circuit pattern, which are the same as battery electrode patterns 3g, 3b, respectively.

In the top plan view of the figure, 2g and 29b are circuit components, and 3
is the solder that slides the IO and components onto the POE.

Next Il! I will explain how to send it. A preferred manufacturing method is to mount the IO, components, etc. by solder reflow at a temperature that does not deteriorate the characteristics of the battery formed on the FOE, or by protecting the battery part with a jig. The PCB on which component mounting has been completed is housed in the exterior material 23, and the exterior material is bonded to complete the product. For an electronic device such as an IC card σ having a connection terminal with an external device, it is sufficient to form a t-pole turn on a PCB, make a hole in a part of the exterior material, and expose it to the outside. Further, for an electronic device including a display element such as an LOD, the display element may be similarly soldered onto a PCB and an exposure hole may be made in the exterior material.

If necessary, it is also possible to resin-seal the inside of the exterior material, and since there is no J-shape or placement that causes the battery to shift due to resin injection pressure as in conventional technology, resin-sealing is easy. I can do it.

〔Effect of the invention〕

As described above, according to the present invention, a PCB with a built-in paper battery can be easily manufactured, so a thin electronic device with a built-in battery can be obtained at low cost.Furthermore, since the battery can be completely connected, the reliability is improved as well. do. Further, when manufacturing an electronic device using this, it is easy to reduce the thickness, have high reliability, and can be manufactured at low cost. In addition, when performing resin sealing, there is no need to secure the battery as in conventional methods.
There is no need to worry about the battery becoming misaligned or the connections coming off, and it also has the advantage of being resistant to bending.

[Brief explanation of the drawing]

Figure 1A shows a cross-sectional view and a plan view of a bare substrate of FOR, which is an embodiment of the present invention. Figure 2B shows a cross-sectional view and a plan view of a thin electronic device using the same device as shown in Figure 1. , FIG. 8A is a sectional view and a plan view of a thin electronic device according to the prior art. In the figure, 1 is a substrate material, 2 is a mounting sheet, 3a and 3b are conductor plates, 4 is a negative electrode metal material, 5 is a separator, and 6 is a positive electrode mixture.

Claims (1)

[Claims] The positive electrode mixture, separator,
A paper battery made of a negative electrode metal material is positioned, the positive electrode mixture side and the negative electrode metal side of this battery are respectively covered with conductor plates attached to the front and back of the substrate material, and the battery is integrated with the substrate material. A printed circuit board characterized in that: