TW200828521A - Package structure of micro electro-mechanical microphone - Google Patents
Package structure of micro electro-mechanical microphone Download PDFInfo
- Publication number
- TW200828521A TW200828521A TW095149120A TW95149120A TW200828521A TW 200828521 A TW200828521 A TW 200828521A TW 095149120 A TW095149120 A TW 095149120A TW 95149120 A TW95149120 A TW 95149120A TW 200828521 A TW200828521 A TW 200828521A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- mems
- microphone
- disposed
- micro electro
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
Landscapes
- Micromachines (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Description
200828521 九、發明說明: 【發明所屬之技術領域】 一種體積小 而 本發明係屬於一種晶片封裝結構,尤指 節省空間的微機電麥克風封裝結構。 【先前技術】 麥克風係現代人常用的 廣,在生醫領域上可應用於 訊領域上則可應用於手機、 電腦等等。 視聽設備之一,且應用範圍甚 助聽器及電子耳,在電腦、通 數位相機、免持聽筒、筆記型 隨著電子產業的蓬勃於展乂芬制 建功i展以及製程及封裝技術的進 步’麥克風產品的設計卜更朝命吝士从 旯朝向夕功旎化的需求發展,為 求達到輕薄短小、省電、低忐太望 、 电低成本等泝求,目前已能利用半 導體製程來做出晶片型來吞颀 介 乃i麥兑風,亦%作微機電(]^]£]^3)麥 克風。 請參照第五圖,目前的微機電麥克風係主要在一基板 (9 0 ) 1設置有一電路及一微機電晶片(g丄),微機 電晶片(9 1 )係以打線方式與基板(9 〇 )丨的電路電 連接,在基板(90)上另設置有一覆蓋微機電晶片(9 1 )的殼蓋(9 3 )。微機電晶片(9工)與基板(9 〇〕 之間的空間形成U(9〇 ,做為聲音的共振腔。聲音 由殼蓋(9 3 )的孔進入,與晶片上的薄膜產生振動,振 動的訊號轉為晶片上的電流/電壓。 然而,在里產麥克風時,需逐一對各微機電晶片(9 1 )打線,無法一次同時對多個微機電晶片(9 i )進行 4 200828521 打線,因此,麥克風的量產速度大為降低,進而提高了麥 克風的製造成本。 【發明内容】 本發明人係根據現有微機電麥克風在量產時無法一次 對多個微機電晶片打線的缺點,改良不足與缺失,進而發 明出一種微機電麥克風封裳結構。 本發明係主要提供-種微機電麥克風,其可適用於流 烊製程以便一次大量流焊多個微機電晶片到基板上。 為達上述目的,係令前述微機電麥克風至少包含有: 一基板,其上設置有一線路,在基板上貫穿形成有一 通孔; “ 微機電3曰片,係設置在基板上且相對應通孔,微機 電曰曰片底邛與基板線路之間植佈有複數錫球以連接微機電 日日片與基板線路,,亥等錫球可透過流焊技術將微機電晶片 焊接在基板而與其上的線路連接; 保濩層,係設置在基板上且包覆該基板與其上的微 機電晶片。 藉由上述技術手段,由於微機電晶片透過錫球設置在 基板上,故在置產麥克風時,可一次令複數微機電晶片與 ^板通過錫爐流焊作業來焊接微機電晶片與基板,因此, 可有效縮短整批麥克風的製造時間,降低麥克風的製造成 f述微機電晶片與保護層之間設置有一密封層。 月·J述密封層係以矽製造。 5 200828521 前述保護層係以銅、鎳或其合金製造。 前述保護層係以濺鍍方式設置在微機電晶片與基板 上。 微機電晶片與基板之間設置有固定膠。 【實施方式】 請參照第一圖,本發明微機電麥克風封裝結構包含 有:一基板(1 0 )、一微機電晶片(2 0 )、複數錫球 (30)、一密封層(40)、一固定膠(50)及一保 護層(6 0 )。 該基板(10)上設置有一線路(圖中未示),在基 板(10)上貫穿形成有一通孔(11)。 該微機電晶片(2 〇 )係設置在基板(1 〇 )上且相 對應通孔(11)。 該等錫球(3 〇 )係植佈在微機電晶片(2 〇 )底部 與基板(1 0 )線路之間,以便連接微機電晶片(2 〇 ) 與基板(1 0 )上的線路,該等錫球可透過流焊技術將微 機電晶片(2 Q )焊接在基板(1 Q )上而與其上的線路 連接。 該密封層(4 〇 )係設置在微機電晶片(2 〇 )上。 該固定膠(5 0 )係設置在微機電晶片(2 0 )底端 周緣與基板(1 Q )之間以進_步固定微機電晶片(2 〇 )。 該保濩層(6 〇 )係以銅、鎳或其合金製造,以濺鍍 方式設置在基板(10)上,且包覆該基板(10)及其 上的微機電晶片(2〇)。 、 6 200828521 請參照第二到第四圖,以下為麥克風的封襞步驟: 首先如第二圖所示,係在複數基板(i 〇 )上分別設 置有一微機電晶片(2 0 ),在微機電晶片(丄〇 )上設 置有密封層(4 0 ),並在各對應微機電晶片(2 〇 )與 基板(1 0 )之間设置有複數錫球(3 〇 ),接著令所有 的微機電晶片(2 0 )與基板(i 〇 )同時通過銲錫爐, 令錫球(3 0 )熔化後固接相對應的微機電晶片(2 〇 ) 與基板(1〇)。 接著如第三圖所示,係在相對應的基板(i 〇 )與微 機電晶片(2 0 )之間設置有一固定膠(5 0 )以強化基 板(1 0 )與微機電晶片(2 〇 )間的固接強度。 最後在微機電晶片與基板上以濺鍍方式設置一保護層 (60)(如第四圖所示)。 藉由上述技術手段,由於微機電晶片(2 〇 )透過錫 球(30)設置在基板(1 〇)上,故在量產麥克風時, 可一次令複數微機電晶片(2 0 )與基板(i 0 )通過錫 爐流焊作業來焊接所有的微機電晶片(2 〇 )與基板(工 〇 ),因此,可有效縮短整批麥克風的製造時間,進而降 低麥克風的製造成本。 【圖式簡單說明】 第一圖係本發明正面剖視圖。 第二圖係本發明製造步驟示意圖。 第三圖係接續第二圖的製造步驟示意圖。 第四圖係接續第三圖的製造步驟示意圖。 7 200828521 第五圖係傳統麥克風的正面剖視圖。 【主要元件符號說明】 (11)通孔 (3 0 )錫球 (5 0 )固定膠 (9 0 )基板 (9 3 )殼蓋 (9 5 )通孔 (1 〇)基板 (2 0 )微機電晶片 (4 0 )密封層 (6 0 )保護層 (9 1 )微機電晶片 (9 4 )氣室 8
Claims (1)
- 200828521 十、申請專利範圍: 1 ·一種微機電麥克風,其包含有: 一基板,其上設置有一線路,該基板上貫穿形成有一 通孔; 一微機電晶片,係設置在基板上且相對應通孔,微機 電晶片底部與基板線路之間植佈有複數錫球,以連接微機 電曰曰片與基板線路,該等錫球係可透過流焊技術將微機電 晶片焊接在基板電路上;及 一保護層’係設置在基板上,以包覆該基板及其上的 微機電晶片。 2 ·如申請專利範圍第1項所述之微機電麥克風,其 中該微機電晶片與保護層之間設置有一密封層。 3 ·如申請專利範圍第2項所述之微機電麥克風,其 中該密封層係以石夕製造。 4 ·如申请專利範圍第1到3項中任一項所述之微機 電麥克風’其中該保護層係以銅或鎳或其合金製造。 5 ·如申請專利範圍第4項所述之微機電麥克風,其 中该保護層係以賤鍍方式設置在微機電晶片與基板上。 十一、圖式: 如次頁 9
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095149120A TW200828521A (en) | 2006-12-27 | 2006-12-27 | Package structure of micro electro-mechanical microphone |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095149120A TW200828521A (en) | 2006-12-27 | 2006-12-27 | Package structure of micro electro-mechanical microphone |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200828521A true TW200828521A (en) | 2008-07-01 |
TWI327356B TWI327356B (zh) | 2010-07-11 |
Family
ID=44817677
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095149120A TW200828521A (en) | 2006-12-27 | 2006-12-27 | Package structure of micro electro-mechanical microphone |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200828521A (zh) |
-
2006
- 2006-12-27 TW TW095149120A patent/TW200828521A/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI327356B (zh) | 2010-07-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9002040B2 (en) | Packages and methods for packaging MEMS microphone devices | |
CN102318365B (zh) | 麦克风单元 | |
US7790492B1 (en) | Method for fabricating a transducer package with the transducer die unsupported by a substrate | |
US8275155B2 (en) | Method for fabricating micro speaker and micro speaker fabricated by the same | |
US20170064458A1 (en) | Mems microphone package structure having a non-planar substrate | |
US20080037768A1 (en) | Microphone module and method for fabricating the same | |
US20180146302A1 (en) | Mems microphone package structure and method for manufacturing the mems microphone package structures | |
KR100737730B1 (ko) | 멤스 마이크로폰 패키징 구조 | |
US10171918B2 (en) | MEMS microphone modules and wafer-level techniques for fabricating the same | |
TW200827288A (en) | MEMS microphone module and method thereof | |
JP2008199353A (ja) | Memsマイクロホン装置 | |
CN104244152B (zh) | 微机电系统麦克风封装及封装方法 | |
US9260298B1 (en) | Stacked MEMS microphone packaging method | |
WO2015105969A1 (en) | Interposer for mems-on-lid microphone | |
JP2007150507A (ja) | マイクロホンパッケージ | |
WO2016172866A1 (en) | Piezoelectric speaker and method for forming the same | |
JP4642634B2 (ja) | 音響センサの製造方法 | |
TW200828521A (en) | Package structure of micro electro-mechanical microphone | |
JP2007124500A5 (zh) | ||
US9309108B2 (en) | MEMS microphone packaging method | |
JP2010010480A (ja) | 半導体モジュールおよびその製造方法、ならびに携帯機器 | |
TWI736921B (zh) | 麥克風裝置以及麥克風裝置製造方法 | |
KR101593926B1 (ko) | 멀티미디어 기기에 장착되는 메인보드의 마이크로폰 실장 구조 | |
CN101325815B (zh) | 一种数字传声器及其制造方法 | |
TWI295113B (zh) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |