TW200828484A - Gas supplying and collecting unit - Google Patents

Gas supplying and collecting unit Download PDF

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Publication number
TW200828484A
TW200828484A TW096136874A TW96136874A TW200828484A TW 200828484 A TW200828484 A TW 200828484A TW 096136874 A TW096136874 A TW 096136874A TW 96136874 A TW96136874 A TW 96136874A TW 200828484 A TW200828484 A TW 200828484A
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Taiwan
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gas
unit
cleaning
assembly
processing
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TW096136874A
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Chinese (zh)
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TWI349321B (en
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Tatsunori Ogihara
Takashi Inoue
Takeya Inagaki
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Ckd Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45561Gas plumbing upstream of the reaction chamber

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Valve Housings (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)

Abstract

[Problem to be solved] To provide the gas supplying and collecting unit capable of making the base-foot space become smaller. [Solution] In the gas supplying and collecting unit 1 are disposed: the first gas units 72A, 72B, 72C used to control the supply of the first gas; the second gas unit 73, which is connected to the first gas units 72A, 72B, and 72C, and utilizes a plurality of fluid controllers 31-34, 38A-43A, 38B-43B and 38C-43C to control the cleaning gas converging to the said first gas unit; and overlapping layer modules 61A, 61B, 61C, which is overlapped with the first gas unit 72A, 72B, 72C in order that parts of the fluid controllers 38A, 38B, 38C are overlapped with the overlapping layer modules 61A, 61B, 61C.

Description

200828484 九、發明說明: 【發明所屬之技術領域】 於具備有氣體 本發明係有關 氣體供應集合單元 單元和清洗氣體單 元之 【先前技術】 自以往,在半導體製 體供给處理宕> 日 衣罝、人將既疋®之作用氣 to仏、、、口蜒理至之晶圓,曰一 固對日日囫進仃成膜。晶圓係被供认遴 數種作用氣體,而將成膜晶_ 被仏…设 于攻膜宜層。因為作用氣體之流量影塑 成膜品質,所以车 ^ " 、斤乂+V體製造裝置將已裝載複數個用以控制 作用氣體之供給的處理^ # 处段轧體早兀之乳體供應集合單 置於處理室的上游側。 1' % 為了使成膜品質變成良好,需要嚴格地管理供給晶圓 ,作用氣體的成分。因@,氣體供應集合單元將清洗氣體 單元和各處理氣體單元連接,並令清洗氣體匯合,再除去 殘留於處理氣體單元之流路内的作用氣體。因而,氣體供 應集合單元可將作用氣體調整成既定成分,並供給晶圓。 [專利文獻1 ]特開平Η 一 5〇257號公報 【發明内容】 【發明要解決之課題】 可是’在以往之氣體供應集合單元,為了清洗單元控 制清洗氣體的供給而具備有複數個流體控制器,因為在氣 體單元之旁邊排列並設置該清洗氣體單元,所以基腳空間 2097-9172-PF 7 200828484 大。 本發明係為了解決上述之問題點而開發者,其目 於提供可使基腳空間變小的氣體供應集人單元。 【解決課題之手段】 f 本發明之氣體供應集合單元具有如下所示的構造。 ⑴係-種氣體供應集合單元,具有:帛i氣體單元, :控制第丨氣體的供給;第2氣體單★,係和該第':體 早7C連接,並利用複數個流體控制器控制匯合至該第1 $ 體單元的帛2氣體;以及疊層組件,係和該第ι氣體單: 重疊;將該流體控制器之—部分和該疊層組件重70 此外,流體控制器之一部分意指例如質量心200828484 IX. Description of the Invention: [Technical Field] The present invention relates to a gas supply assembly unit unit and a cleaning gas unit according to the present invention. The person will use the 疋 疋 之 之 、 、 、 、 、 、 、 、 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The wafer system is supplied with a plurality of working gases, and the film-forming crystals are placed on the film. Because the flow rate of the working gas affects the film forming quality, the vehicle and the V body manufacturing device will be loaded with a plurality of treatments for controlling the supply of the working gas. The assembly sheet is placed on the upstream side of the processing chamber. 1' % In order to improve the film formation quality, it is necessary to strictly manage the components supplied to the wafer and the gas. Since @, the gas supply collecting unit connects the cleaning gas unit and each processing gas unit, and merges the cleaning gas, and then removes the working gas remaining in the flow path of the processing gas unit. Thus, the gas supply assembly unit can adjust the working gas to a predetermined component and supply it to the wafer. [Patent Document 1] Japanese Unexamined Patent Publication No. Hei No. Hei. No. Hei. No. Hei. No. 5, No. 5, No. 257, the disclosure of the present invention. Since the cleaning gas unit is arranged and arranged beside the gas unit, the footing space 2097-9172-PF 7 200828484 is large. The present invention has been made in order to solve the above problems, and it is intended to provide a gas supply collecting unit which can reduce the footing space. [Means for Solving the Problem] f The gas supply assembly unit of the present invention has the following structure. (1) A system-type gas supply assembly unit having: 帛i gas unit: controlling the supply of the second gas; the second gas unit ★ is connected to the first body 7C, and is controlled by a plurality of fluid controllers. a gas of 帛2 to the first body unit; and a laminate assembly that overlaps with the first gas sheet: the portion of the fluid controller and the stack assembly are 70. In addition, one of the fluid controllers For example, mass heart

器、質量流量計、止回關、^丨π . . Βθ 市J 止口間子L 口、亂動閥等控制氣 器。流體控制器之一部分亦可係丨個流體控制器,心 複數個流體控制器。 μ (2) 在(1)所,己載之發明,該疊層組件係以覆蓋該 氣體單元所含之配管的方式設置。 (3) 在(1)所圮載之發明,該疊層組件具有:固定 係用以固定被放置《體控制之_部分的下部流路也 件;及保持溝,係和該第14體單元抵接;並安裝加熱器,。 (4) 在(1)所記載之發明,該流體控制器之一部分 量流量控制器或質量流量計。 ’、貝 【發明效果】 具有上述之構造的本發明之氣體供應集合單元, 層組件和用以控制第1氣體之供爾i氣體單元重^, mass flow meter, check-off, ^丨π . . Βθ City J mouth M port, turbulence valve and other control air. One part of the fluid controller can also be a fluid controller with multiple fluid controllers. μ (2) In the invention of (1), the laminated assembly is provided in such a manner as to cover the piping included in the gas unit. (3) In the invention of (1), the laminated assembly has: a fixing system for fixing a lower flow path member to which the body control portion is placed; and a holding groove, the body and the 14th body unit Abut; install the heater. (4) In the invention of (1), one of the fluid controllers is a flow rate controller or a mass flow meter. The invention provides the gas supply assembly unit of the present invention having the above configuration, the layer assembly and the gas unit for controlling the first gas.

2097-9172-PF 8 200828484 又將構成第2氣體显- ,, ^ ^ 之流體控制器的一部分和疊層組件 重豐地配置。因而,因為。 的一 #八4楚1々 再成弟」孔脰早元之流體控制器 ' 關單元變成兩段構造,所以氣#供岸隹 合單元之基腳空間小了 4田& 尸坏以乱體t、應市 1】、了和®層組件重疊 基腳空間。因而,芒伏被* 級體&制卩。之 右依據本發明之氣體佴入抑— 使基腳空間變小。 /、…木口早兀,可 在本發明之氣體供應 單元所含之配管的方式配w::因為以覆蓋第1氣體 配置成在第1氣體單元之寬度:;::所以可將疊層組件 在本發明之氣體供應集合單元,對已 之下部流路組件固定對已固定於疊層組件 疊層組件知熱。和疊岸 口,並用加熱器將 元,從疊層組件傳遞二^rrr^1氣體單 1氣體在第!氣體單元之流路内力熱,例如可避免第 據本發明之氣體供應集合單元,:々不良。因而,若依 定下部流路組件之功用万脸4 °令1個疊層組件兼具固 的功用。 加熱器之熱傳至第1氣體單元 本發明之氣體供應集合單元, 質量流量控制器或質量流量計和属〜:將基聊空間大之 效率地使單元整體的基腳空間變二:、、且件重疊,所以可高 【實施方式】 以下,參照圖面說明本” 實施形態。 礼體i、應集合單元的一2097-9172-PF 8 200828484 Further, a part of the fluid controller constituting the second gas display - , ^ ^ and the laminated assembly are arranged in a large amount. Thus, because. One #八四楚1々再成弟" Kong Yi Zaoyuan's fluid controller' off unit becomes a two-stage structure, so the base space of the gas-sinking unit is small 4 fields & Body t, the city 1], and the ® layer components overlap the footer space. Thus, Manvo is made by the * body & The right gas intrusion according to the present invention - makes the foot space small. /, ... wooden mouth early, can be arranged in the piping of the gas supply unit of the present invention w:: because the first gas is disposed to cover the width of the first gas unit:::: In the gas supply assembly unit of the present invention, the fixed pair of the lower flow path assembly is fixed to the laminated assembly assembly. And stack the shore, and use the heater to transfer the element from the laminated assembly to the two ^rrr^1 gas single 1 gas in the first! The internal heat of the flow path of the gas unit can, for example, avoid the gas supply assembly unit according to the present invention: defective. Therefore, if the function of the lower flow path component is 4 °, one laminated component has a solid function. The heat of the heater is transmitted to the first gas unit, the gas supply assembly unit of the present invention, the mass flow controller or the mass flow meter and the genus~: the base space is greatly enlarged to make the base space of the unit as a whole two: In addition, the present invention is described below with reference to the drawings. The ritual i, one of the collection units

2097-9172-PF 200828484 〈電路說明〉 第1圖係氣體供應集合單元之電路圖。 氣體供應集合單元1係設置於未圖示之氣體槽和未圖 不的處理室之間,為了逐次將既定量之未圖示的氣體槽之 作用氣體供給未圖示的處理室,而具備有第丨〜第3處理氣 體管線2A、2B、2C。又,氣體供應集合單元1具備有用以 清洗第1〜第3處理氣體管線2A、2B、2C之清洗氣體管線 6 ° 將複數個流體控制器設置於第1〜第3處理氣體管線 2A、2B、2C。手動閥11A、11B、11C經由作用氣體輸入口 3A、3B、3C和未圖示之氣體槽連接。手動閥nA、UB、 11C經由過渡器;[2A、12B、12C、壓力調整閥i3A、13B、 1 3C以及壓力計14A、14B、14C和第1處理側氣動閥1 μ、 1 5B、15C 連接。 第1處理侧氣動閥1 5 A、1 5 B、1 5 C經由處理側質量流 里4工制器1 6 A、1 6 B、1 6 C和第2處理侧氣動閥1 7 a、;[ 7 B、 17C連接。第2處理側氣動閥17A、17B、17C經由過渡器 18A、18B、18C和共同輸出口 4A、4B、4C連接。共同輸出 口 4A、4B、4C和未圖示之處理室連接。 又,處理侧質量流量控制器1 6A、1 6B、1 6C亦和第3 處理側氣動閥19人、196、19(:連接。第3處理側氣動閥19八、 19B、19C經由處理側止回閥20A、20B、20C和排氣口 5A、 5B、5C連接。排氣口 5A、5B、5C和未圖示之排氣流路連 接0 2097-9172-PF 10 200828484 而’清洗氣體管線6亦設置複數個流體控制器。手動 閥31經由清洗氣體輸入口 7和未圖示之清洗氣體槽連 接。手動閱31經由過濾器32、壓力調整閥33以及壓力計 3 4和第1 β洗側氣動閥35連接。第1清洗側氣動閥3 5 經由第1清洗侧質量流量控制器36和第2清洗側氣動閥 37和清洗氣體排氣口 8連接。清洗氣體排氣口 8和未圖示 之排氣流路連接。 愿力叶34亦和第2清洗側質量流量控制器38Α、38Β、 38C連接。第2清洗侧質量流量控制器38α、38β、38(:經 由清洗側止回閥39A、39B、39C及第3清洗側氣動閥4〇Α、 4〇β、40C和第1〜第3處理氣體管線2Α、2Β、2C之處理側 質量流量控制器16A、16B、16C的上游側連接。 又’壓力計34亦和第4清洗側氣動閥41A、41B、41C 連接。第4清洗側氣動閥41A、41B、41C經由第3清洗側 質量流量控制器42A、42B、42C及第5清洗側氣動閥43A、 43B、43C和第卜第3處理氣體管線2Α、2β、沈之過濾器 18 A、1 8 B、1 8 C的游侧連接。 〈整體構造〉 第2圖係將第1圖所示的電路具體化之本發明的實施 形悲之氣體供應集合單元1的平面圖。 氣體供應集合單元1將係構成第丨〜第3處理氣體管線 2A、2B、2C之控制係「第1氣體」之一例的作用氣體之供 給的第1〜第3處理氣體單元(相當於「第i氣體單 元」)72A、72B、72C、和構成清洗氣體管線6之控制係「第2097-9172-PF 200828484 <Circuit Description> Fig. 1 is a circuit diagram of a gas supply assembly unit. The gas supply unit 1 is provided between a gas tank (not shown) and a processing chamber (not shown), and is provided with a working gas (not shown) for supplying a working gas of a gas tank (not shown) to a processing chamber (not shown). The third to third process gas lines 2A, 2B, and 2C. Further, the gas supply collection unit 1 includes a cleaning gas line for cleaning the first to third process gas lines 2A, 2B, and 2C, and a plurality of fluid controllers are provided in the first to third process gas lines 2A and 2B. 2C. The manual valves 11A, 11B, and 11C are connected to the gas grooves (not shown) via the working gas input ports 3A, 3B, and 3C. Manual valves nA, UB, 11C are connected via a transitioner; [2A, 12B, 12C, pressure regulating valves i3A, 13B, 1 3C and pressure gauges 14A, 14B, 14C and first processing side pneumatic valves 1 μ, 15B, 15C . The first processing side pneumatic valve 1 5 A, 1 5 B, 1 5 C passes through the processing side mass flow 4 factory 1 6 A, 1 6 B, 1 6 C and the second processing side pneumatic valve 17 a, [ 7 B, 17C connection. The second processing side pneumatic valves 17A, 17B, and 17C are connected to the common output ports 4A, 4B, and 4C via the transitioners 18A, 18B, and 18C. The common output ports 4A, 4B, 4C are connected to a processing chamber not shown. Further, the processing-side mass flow controllers 1 6A, 16B, and 16C are also connected to the third processing-side pneumatic valves 19, 196, and 19 (: the third processing-side pneumatic valves 19, 19B, and 19C are processed via the processing side. The return valves 20A, 20B, 20C are connected to the exhaust ports 5A, 5B, 5C. The exhaust ports 5A, 5B, 5C and an exhaust flow path (not shown) are connected to 0 2097-9172-PF 10 200828484 and the cleaning gas line 6 A plurality of fluid controllers are also provided. The manual valve 31 is connected to a cleaning gas tank (not shown) via a cleaning gas inlet port 7. The manual reading 31 passes through the filter 32, the pressure regulating valve 33, the pressure gauge 34, and the first β washing side. The pneumatic valve 35 is connected. The first cleaning side pneumatic valve 35 is connected to the second cleaning side mass flow controller 36 and the second cleaning side pneumatic valve 37 and the cleaning gas exhaust port 8. The cleaning gas exhaust port 8 and not shown are shown. The exhaust gas flow path is connected to the second cleaning side mass flow controllers 38A, 38A, 38C. The second cleaning side mass flow controllers 38α, 38β, 38 (by the cleaning side check valve 39A) , 39B, 39C and third cleaning side pneumatic valves 4〇Α, 4〇β, 40C and first to third processing gas lines 2 The upstream side of the processing side mass flow controllers 16A, 16B, and 16C of 2Β and 2C are connected. The 'pressure gauge 34 is also connected to the fourth cleaning side pneumatic valves 41A, 41B, and 41C. The fourth cleaning side pneumatic valves 41A and 41B 41C passes through the third cleaning side mass flow controllers 42A, 42B, 42C and the fifth cleaning side pneumatic valves 43A, 43B, 43C and the third processing gas line 2Α, 2β, the sediment filter 18 A, 1 8 B The connection of the swimming side of 1 8 C. <Overall structure> Fig. 2 is a plan view showing the gas supply assembly unit 1 of the present invention in which the circuit shown in Fig. 1 is embodied. The first to third processing gas units (corresponding to "i-th gas unit") 72A that supply the working gas of one of the control systems "first gas" of the third to third processing gas lines 2A, 2B, and 2C, 72B, 72C, and the control system constituting the purge gas line 6

2097-9172-PF 200828484 2氣體」之一例的作用氣體之 a 「第2氣體單元」)73固^於U孔體早70 (相當於 理氣體單元72A、72B、72C之檨:板9。因為第1〜第3處 . 冓造係相同,所以在此以篦 1處理氣體單元7 2 A為例說明構$ 〈處理氣體單元〉 第3圖係第2圖之A-A剖面圖。 第1處理氣體單元72A之丰 ^ 動閥11Α的輸入通口和設 置於輸入組件21之作用氣體輪 ,入口 3A連通,並控制虛揀 氣體的輸入。手動閥11A之輪 一 制處理 、口經由V字流路组件9 9 和過濾器1 2A的輸入通口連接。 、、牛22 過;慮态1 2 A之輸出通口經由〜 、由V予流路組件2 2和壓力 調正間m的輸入通口連接,並將已除去粒子等之作用^ 體昼力調整間13A。壓力調整閥m之輸出通口經: 广細 的輪入通口連接,並將作用 軋體之壓力調整成壓力言十“A顯示設定壓力。 麼力計14Α之輸出通口經由 # ^ ^ ^ 形成L子、抓路的流路組 B 24、流路組件23以及第1共同流路組件25 和第1處理側細15A之第3通口連接。第i處理側氣 動閥1 5A係二通閥,因應於閥開 、 阀開口大小而控制作用氣體的 供給量。第^處理側氣動間15A之第2通口經由乂字流路 組件22和處理側質量流量控制器⑽的輪人通口連接。 處理側質量流量控制器16A之輸出通口經由V字流路 組件22和第2處理側氣動^7A的第2通口連接, 整作用氣體之流量。第2處理側氣動閥m係三通閥,因 2097-9172-PF 12 200828484 =:口大小而控制作用氣體的供給量。第2處理側氣 :A之第3通口經由第2共同流路組件26、v字流路 屮 &amp;濾斋1 8A的輸入通口連接。過濾器1 8A之輸 二:口和設置於輪出組件28的共同輸出通“a連通,並 輸出已除去粒子等之作用氣體。 ^ &lt;里氣體單元7 2 A將下部流路組件21、2 2、2 3、 2利:從r所插入之未圖示的螺检固定於安裝板9。然 用k上方所插人之螺栓V將該手動閥11A、過渡器 12、壓力錢間13A、壓力計UA、第】共同流路組件… 声¥ ^氣動閥1 5A、處理側質量流量控制器1 6A、第2 、、1氣動閥1 7A、第2共同流路組件26、匯合組件27 、18各自m定於下部流路組件2卜22、μ。 …此外’將配f 24之兩端焊接於流路組件23、23,並 r,述之$層組件61覆蓋。如第2圖所示,疊層組件61 猎由將4支螺栓VP、“VP從上方貫穿4個角落 亚鎖緊於安裝板9而固定。 〈清洗氣體單元〉 而’弟2圖所示之清洗氣體單元73將手動閥31、過 2 32、堡力調整閥33以及麼力計“和上述之手動闕 Π A、過滤器;[2 A、Μ力調敕μ,〇 a 絚刀捫正閥13A以及壓力計UA 一樣地 固疋於安裝板9,並互相連通。 «力計34經由配管44、分支組件45和第&quot;青洗側氣 5之輪人通口連接。第1清洗側氣動閥35之輸出通 口經由第1清洗側質量流量控制器36和第2清洗側氣動2097-9172-PF 200828484 "Gas" in one of the gases "a second gas unit") 73 is fixed to the U-hole body 70 (corresponding to the gas unit 72A, 72B, 72C: plate 9 because First to third places. Since the manufacturing system is the same, here, the 篦1 processing gas unit 7 2 A is taken as an example to describe the structure of the processing gas unit. Fig. 3 is a cross-sectional view taken along line A of Fig. 2 of the first processing gas. The input port of the pump valve 11A of the unit 72A communicates with the working gas wheel provided at the input unit 21, and the inlet 3A communicates with the input of the dummy gas. The manual valve 11A is processed by the wheel and the port is flowed through the V-shaped flow path. The component 9 9 is connected to the input port of the filter 1 2A. , , the cow 22 is over; the output port of the 1 2 A is connected via the input port of the V to the flow path component 2 2 and the pressure adjustment interval m Connected, and the effect of removing particles, etc., is adjusted to 13A. The output port of the pressure regulating valve m is connected by a wide wheel-in port, and the pressure of the rolling body is adjusted to a pressure of ten. A shows the set pressure. The output port of the force meter 14Α is formed by # ^ ^ ^ to form the L sub-sliding flow path group B 24 The flow path unit 23 and the first common flow path unit 25 are connected to the third port of the first processing side thin 15A. The i-th processing side pneumatic valve 1 5A is a two-way valve, and is controlled according to the valve opening and the valve opening size. The supply amount of the gas. The second port of the pneumatic side 15A of the processing side is connected via the 流 word channel assembly 22 and the wheel port of the processing side mass flow controller (10). The output port of the processing side mass flow controller 16A The flow rate of the entire gas is connected via the V-shaped flow path unit 22 and the second port of the second processing side pneumatics 7A. The second processing side pneumatic valve m is a three-way valve, since 2097-9172-PF 12 200828484 =: The supply amount of the control gas is controlled by the size of the mouth. The third port of the second processing side gas: A is connected via the input port of the second common flow path unit 26 and the v-shaped flow path &amp; filter 8 8A. The input 2 of 8 8A: the port and the common output provided in the wheel-out assembly 28 are connected to "a, and output the action gas from which the particles have been removed. ^ &lt; the gas unit 7 2 A will lower the flow path assembly 21, 2 2 , 2 3, 2 Lee: The screw test (not shown) inserted from r is fixed to the mounting plate 9. However, the person inserted above k is inserted. The plug V has the manual valve 11A, the transition device 12, the pressure chamber 13A, the pressure gauge UA, the first common flow path assembly... the sound ¥ ^ pneumatic valve 1 5A, the treatment side mass flow controller 1 6A, the second, the 1 The pneumatic valve 17A, the second common flow path assembly 26, and the merge assemblies 27, 18 are each fixed to the lower flow path assembly 2, 22, μ. Further, the ends of the f 24 are welded to the flow path assemblies 23, 23 And r, described by the $layer component 61. As shown in Fig. 2, the laminated assembly 61 is fixed by fastening four bolts VP and "VP" from above through four corners to the mounting plate 9. <Cleaning gas unit> The cleaning gas unit 73 will be a manual valve 31, a 2 32, a fortune adjustment valve 33, and a force meter "and the above-mentioned manual 阙Π A, filter; [2 A, 敕力调敕μ, 〇a 絚刀扪正The valve 13A and the pressure gauge UA are fixed to the mounting plate 9 in the same manner and communicate with each other. The force meter 34 is connected via the piping 44, the branching unit 45, and the &quot;bluewashing side gas 5 rounds. The output port of the first cleaning side pneumatic valve 35 is pneumatically driven via the first cleaning side mass flow controller 36 and the second cleaning side.

2097-9172-PP 200828484 閥37的輸入通口連接。第2清洗側氣動閥37之輸出通口 和’月洗氣排氣口 8連接。因此,清洗氣體利用第丄清洗 側質量流量控制器36調整已通過第i清洗側氣動閥託之 清洗氣體的流量後’經由第2清洗側氣動目财清洗氣 體排氣口 8進行排氣。 f \ 分支組件45經由配管46和分流組件〇、48連接。 分流組件47以將和上方連接之配管46和第4清洗侧氣動 閥41A、41C的輸入通口連接之方式形成流路。另一方面, 分流組件4 8以將和上方德;^β i 竹不上万運接之配官46和第4清洗侧氣動 闕41B的輸入通口連接之方式形成流路。此外,配管μ 從分流組件48之上方配管成L字形,並和設置於構成第 卜第3處理氣體管線2A、2B、2C(圖n之塵力計i4a、i4b、 14C的旁邊之V字流路組件22、22、22的上面連接。 如第3圖所示,在後述之疊層組件6U的上面,將第 2清洗側質量流量控制器、38A設置於2自[字流路組件 22、22上。V字流路組件22、22利用未圖示之螺栓固定 於疊層組件6U。第2清洗側質量流量控制器…撕 上方所插入之4支螺栓V、V、V、V固定於v : 22、22。 1 卞 和第2清洗側質量流量控制$ 38A之輸入通口連 v字流路組件22,從上方使用2支螺栓Vs、^連接^ 仏。和第2清洗側質量流量控制讀之輸出 二 V字流路組件22 ’從上方使用2支螺栓v 、 v 6固定献等 49。配官49和清洗側止回閥39A之上面連接,、 我,以防止清 2097-9172-PP 14 200828484 洗氣體之倒流。 清洗側止回閥39A、39B、39C和第q 、主 ,ΠΑ 布弟3清洗側氣動閥 40Α、40Β、40C —起安裝於第!共同流路組件25、μ μ 的上面。清洗側止回閥39A、39B、39C之輪出通口和第3 清洗侧氣動閥40A、40B、40C之輸入通口連接。第3、青洗 側氣動閥40A、40B、40C之輸出通口和第]声弟'月; .乐1處理側氣動閥 1 5 A之弟1通口連接,並控制對第丨〜 ΟΛ 0 7乐弟3處理氣體管線 〆 2Α、2Β、2C(參照第i圖)之清洗氣體的供給。 另一方面,第2圖所示之第4清洗侧氣動間41A、41B、 41C之輸入通口和分流組件47、48連接,輸出通口和第3 清洗側質量流量控制器42A、42B、42C之 、 〃询八通口連接。 因為分流組件47反向地輸出清洗氣體,所以第4清洗侧 氣動閥41A、41C隔著分流組件47反向地設置。 | 第4清洗侧氣動閥41A、41B、41C之輪出通口婉由第 質量流量控制器42A,,和第5清洗側氣 “ 2、43B、43C的輸入通口連接,並調整清洗氣體的 *里。弟5清洗側氣動閥43A、樣、似之輪出通口娘由 配管5〇、5卜52,分別和處理側止回_ 2〇A、2〇b、2〇c 與過濾器18A、18B、18C之間的匯合組件2?、2了、u之 上面連接,並控制清洗氣體的供給。 :外’二先孔體早兀73利用未圖示之螺栓將V字流 、、且牛22或分支組件45、分流組件47、48 咖心即 μ寺配置於流體 工制益和安錄9之間的下部流路組件固定於安裝板9。 該第4清洗側氣動間41A、41B、41C、帛3清洗側質量流 2097-9172-PF 15 200828484 里控制器4 2 A、4 2 B、4 2 0以及繁ς、主 4〇Γ . Μ , ^ , 苐5 4洗側氣動閥43Α、43β、 43C係猎由將從上方所插入 22而固定。 累㈠鎖緊於V字流路組件 〈疊層組件〉 …Ϊ次,說明上述之疊層組件⑴、⑽、㈣。因為疊 杜⑴ bIL之構造相同,所以在此說明疊層組 件61A,而省略疊層組件㈣、61C的說明。 、 第4圖係疊層組件6U的平面圖。第5圖係表示從第 I—中之前號B方向所看到的疊層組件6u之圖。第6 圖係第4圖之c — c剖面圖。2097-9172-PP 200828484 The input port of valve 37 is connected. The output port of the second cleaning side pneumatic valve 37 is connected to the 'month scrubbing exhaust port 8. Therefore, the cleaning gas is deflated by the second cleaning side pneumatic cleaning gas exhaust port 8 by adjusting the flow rate of the cleaning gas that has passed through the i-th cleaning side pneumatic valve holder by the second cleaning side mass flow controller 36. The f \ branch assembly 45 is connected via a pipe 46 to the splitter assemblies 〇, 48. The flow dividing unit 47 forms a flow path for connecting the piping 46 connected to the upper side and the input ports of the fourth cleaning side pneumatic valves 41A and 41C. On the other hand, the flow dividing means 48 forms a flow path so as to be connected to the input port 46 of the upper portion 46 and the fourth cleaning side pneumatic port 41B. Further, the pipe μ is branched from the upper side of the branching unit 48 into an L shape, and is disposed in a V-shaped flow which is disposed adjacent to the third process gas lines 2A, 2B, and 2C (the dust force meters i4a, i4b, and 14C of Fig. n). The upper surfaces of the road components 22, 22, and 22 are connected. As shown in Fig. 3, the second cleaning side mass flow controller and 38A are disposed on the upper surface of the multilayer assembly 6U, which will be described later, from the [word flow path assembly 22, 22, the V-shaped flow path assemblies 22 and 22 are fixed to the laminated unit 6U by bolts (not shown). The second cleaning side mass flow controller ... is attached to the four bolts V, V, V, V which are inserted above the nail. v : 22, 22. 1 卞 and the second cleaning side mass flow control $ 38A input port with the v-shaped flow path assembly 22, using two bolts Vs, ^ connection ^ 仏 from the top, and the second cleaning side mass flow Control reading the output of the two V-shaped flow path assembly 22 'Use two bolts v, v 6 from the top to fix the 49. The upper part of the valve 49 and the cleaning side check valve 39A are connected, I, to prevent clearing 2097-9172 -PP 14 200828484 Reverse flow of washing gas. Cleaning side check valves 39A, 39B, 39C and q, main, ΠΑ Budi 3 cleaning side pneumatic valve 40 40 Β, 40C are mounted on the top of the common path assembly 25, μ μ. The input of the cleaning side check valves 39A, 39B, 39C and the third cleaning side pneumatic valves 40A, 40B, 40C The port is connected. The third, the side of the washing side of the pneumatic valve 40A, 40B, 40C and the mouth of the voice] month; the music 1 processing side pneumatic valve 1 5 A brother 1 port connection, and control the first丨~ ΟΛ 0 7 The 3rd cleaning gas supply of the gas line 〆2Α, 2Β, 2C (see the figure i) is on the other hand. On the other hand, the fourth cleaning side pneumatic chambers 41A, 41B, 41C shown in Fig. 2 The input port is connected to the shunt components 47, 48, and the output port and the third cleaning side mass flow controllers 42A, 42B, 42C are connected to each other. Since the shunting unit 47 outputs the cleaning gas in the reverse direction, The fourth cleaning side pneumatic valves 41A, 41C are reversely disposed via the flow dividing unit 47. | The fourth cleaning side pneumatic valves 41A, 41B, 41C are provided by the first mass flow controller 42A, and the fifth cleaning Side air "2, 43B, 43C input port connection, and adjust the cleaning gas *. Brother 5 cleaning side pneumatic valve 43A, sample, The round-out port is connected by the piping 5〇, 5卜52, and the processing side checkback _ 2〇A, 2〇b, 2〇c and the merged components 2?, 2 between the filters 18A, 18B, 18C The upper surface of the u is connected and the supply of the cleaning gas is controlled. The outer 'two first hole body early 兀 73 uses a bolt (not shown) to flow the V word, and the cow 22 or the branch assembly 45, the flow dividing assembly 47, 48 The lower flow path assembly, which is disposed between the fluid worker and the safety record 9, is fixed to the mounting plate 9. The fourth cleaning side pneumatic chambers 41A, 41B, 41C, 帛3 cleaning side mass flow 2097-9172-PF 15 200828484 controller 4 2 A, 4 2 B, 4 2 0 and the main, main 4 〇Γ. , ^, 苐5 4 Washing side pneumatic valves 43Α, 43β, 43C are hunt and will be fixed by inserting 22 from above. Tired (1) is locked to the V-shaped flow path assembly <Laminated component> ..., and the above-mentioned laminated components (1), (10), and (4) are explained. Since the structure of the stacked (1) bIL is the same, the laminated assembly 61A will be described here, and the description of the laminated assembly (four) and 61C will be omitted. Figure 4 is a plan view of the laminated assembly 6U. Fig. 5 is a view showing the laminated unit 6u as seen from the front direction B of the first to the middle. Figure 6 is a cross-sectional view of c-c in Figure 4.

〃疊層組件m係將金屬(例如銘等)或樹脂材料(例如 四氣乙細(pj*FE)茸A …… 成長方體形的。在-側面,將和 配官24A確實地(參昭第? R 哲0 m、山 、弟2圖13圖)喪合並用以保持配 吕一之保持溝62A形成拱形。在疊層組件6U之兩端, k保持溝62A各自形成固定孔63人、63a,其係為了固定 V子机路組件22、22而在内周面形成陰螺紋。又,在疊層 牛1A之兩翊,在比固定孔63A、63A外側,隔著保持 溝62A而形成用以插入螺栓Vp之插入孔64A、64八,該螺 检Vp係用以將疊層組件6U固定於安裝板9。將插入孔 =形成於固定孔63A之外側的理由,係為了使可對各第 2清洗側質量流量控制胃38A處理疊層組件6U,以使使 用性或維修性變成良好。 ^此外,疊層組件61A例如在安裝加熱器71、71 (參照 第2圖)日守,可選擇導熱率高的鋁材等,以使加熱器71、〃Laminated component m is a metal (for example, Ming, etc.) or a resin material (for example, four gas (Pj*FE) velvet A... grows in a square shape. On the side, it will be positively associated with the official 24A. The first holding of the groove 64A is formed in an arch shape. At both ends of the laminated assembly 6U, the k holding groove 62A each forms a fixing hole 63. 63a is a female thread formed on the inner peripheral surface for fixing the V sub-machine units 22 and 22. Further, the two sides of the laminated cow 1A are spaced apart from the fixing holes 63A and 63A by the holding groove 62A. Inserting holes 64A, 64 for inserting the bolt Vp for fixing the laminated assembly 6U to the mounting plate 9. The reason why the insertion hole = formed on the outer side of the fixing hole 63A is to make it possible The laminate assembly 6U is treated for each of the second cleaning side mass flow control stomachs 38A to improve the usability or maintainability. Further, the laminate assembly 61A is mounted on the heaters 71, 71 (see Fig. 2), for example. , aluminum material with high thermal conductivity can be selected to make the heater 71,

2097-9172-PF 16 200828484 71之熱經由疊層組件61A易傳至氣體流動的配管24a。另 一方面,疊層組件61A在不使用加熱器71、71的情況, 可選導熱率低之不銹鋼或氟樹脂等選作疊層組件6l A的材 料,以使作用氣體之溫度變化變小。 〈動作說明〉 接著,說明具有上述之構造的氣體供應集合單元丨之 動作。The heat of 2097-9172-PF 16 200828484 71 is easily transmitted to the piping 24a through which the gas flows via the laminated assembly 61A. On the other hand, in the case where the heaters 71, 71 are not used, the laminated assembly 61A may be selected as a material of the laminated assembly 61A, such as stainless steel or fluororesin having a low thermal conductivity, so that the temperature change of the working gas becomes small. <Description of Operation> Next, the operation of the gas supply assembly unit 具有 having the above-described configuration will be described.

, 氣體供應集合單元1例如在從第1處理氣體管線2A 將作用氣體供給未圖示之處理室的情況,將第丨處理側氣 動閥15A和第3處理侧氣動閥19A設為開閥狀態,並將第 1處理側氣動閥15B、15C、第2處理側氣動閥17A、17B、 17C、第3處理侧氣動閥19B、19C、第3清洗側氣動閥4〇八、 • 40β、40C、第4清洗侧氣動閥4iA、41B、41C以及第5清 洗側氣動閥43A、43B、43C設為閉閥狀態。 供給作用氣體輸入口 3A之作用氣體通過手動閥 k 1U、過濾器12A、壓力調整閥13A以及壓力計14A而被調 t [力後,流向配官2 4、第1共同流路組件2 5、第j處 理側氣動閥15A以及處理側質量流量控制器16A,而被調 正版里。作用氣體從處理側質量流量控制器i 6A經由第2 處理侧氣動閥17A、第3處理側氣動閱19A以及處理侧止 回閥2 0 A而向排氣流路進行排氣。 作用氣體之壓力和流量安定於既定值後,將第2處理 側氣動閥1 7A k閉閥狀態切換成開閥狀態,而且將第3處 理側氣動閥…從開間狀態切換成閉閱狀態。因而,將作 2097-9172-pp 17 200828484 用氣體從第2處理側氣翻„,7 Λ 、清哭1SA、,^丄 動閥17A經由匯合組件27供給過 /慮四18Δ亚除去雜質後丘 處理室。 “同輪出口 4A供給未圖示的When the gas supply unit 1 supplies the working gas to the processing chamber (not shown) from the first processing gas line 2A, for example, the second processing side pneumatic valve 15A and the third processing side pneumatic valve 19A are opened. The first processing side pneumatic valves 15B and 15C, the second processing side pneumatic valves 17A, 17B, and 17C, the third processing side pneumatic valves 19B and 19C, and the third cleaning side pneumatic valve 4, 8, 40β, 40C, and The cleaning side pneumatic valves 4iA, 41B, and 41C and the fifth cleaning side pneumatic valves 43A, 43B, and 43C are in a closed state. The working gas supplied to the working gas input port 3A is adjusted by the manual valve k 1U, the filter 12A, the pressure regulating valve 13A, and the pressure gauge 14A. [The force flows to the dispensing chamber 2 4 and the first common flow path assembly 25, The jth processing side pneumatic valve 15A and the processing side mass flow controller 16A are adjusted. The working gas is exhausted from the processing-side mass flow controller i 6A to the exhaust flow path via the second processing-side pneumatic valve 17A, the third processing-side pneumatic reading 19A, and the processing-side check valve 20A. After the pressure and flow rate of the working gas are stabilized at a predetermined value, the second process side pneumatic valve 1 7A k is closed to the valve open state, and the third process side pneumatic valve ... is switched from the open state to the closed state. Therefore, the gas will be turned from the second treatment side by the gas of 2097-9172-pp 17 200828484, 7 Λ, the crying 1SA, and the turbulent valve 17A is supplied via the confluence unit 27 to remove the impurities. Processing chamber. "The same wheel outlet 4A is supplied not shown

然後,在清洗第1處P ^ A 处理虱體官線2A的情況,在將第] 處理側氣動閥15A和第2卢柿彳日丨# * 狀能下,將笛” 2處理側氧動閥17A依然設為開閥 ^ ^ 動閥19Α、弟3清洗侧氣動閥4〇α、 弟4清洗側氣動閥4U以 t 及弟5 π洗側氣動閥43A從閉閥 狀悲切換成開閥狀態。 被供給清洗氣體輪入 鞠入口 7之清洗氣體,通過手動關Then, in the case where the first P ^ A treatment of the corpus callosum 2A is performed, the turmeric "2" side is operated under the condition of the first processing side pneumatic valve 15A and the second lye 彳 丨 * #*. Valve 17A is still set to open valve ^ ^ valve 19 Α, brother 3 cleaning side pneumatic valve 4 〇 α, brother 4 cleaning side pneumatic valve 4U to t and brother 5 π wash side pneumatic valve 43A switch from closed valve to open valve State. The cleaning gas supplied to the inlet 7 of the cleaning gas is turned off by manual

31、過濾器3 2、壓力铜敕M Q Q ^刀凋羞閥33以及壓力計34而調整壓力 後,再經由配管44、分支組件45、配管46以及V字流路 曰件22 ί、、’.α第2 π洗側質量流量控制器38A,而調整流 量。然後’將清洗氣體經由清洗側止回閥39A、第3清: 、&quot;UA1—弟i處理側氣動閥15A ’並供給作用氣 |斤抓動的桃路。將清洗氣體從第i處理侧氣動閥1μ、經 由處理側質量流量控制器16A供給第2處理側氣動閥i7A。 將清洗氣體之-部分從第2處理側氣動目】7a經由第 3處理側氣動閥19A、處理側止回閥2〇A,從排氣口 μ向 未圖示的排氣流路排氣,,將剩下的清洗氣體從第2 處理側氣動閥17A經由第2共同流路組件26、匯合組件 27、過濾器18A以及共同輸出口 4A向未圖示的處理室輸 出。 ’ 利用該清洗動作,清洗比第丨處理侧氣動閥15A下游 側的流路。31. The filter 3, the pressure copper cymbal MQQ, the knife suffocating valve 33, and the pressure gauge 34 adjust the pressure, and then pass through the pipe 44, the branch assembly 45, the pipe 46, and the V-shaped flow path element 22 ί,, '. The α 2nd π wash side mass flow controller 38A adjusts the flow rate. Then, the cleaning gas is supplied to the peach road which is gripped by the action gas via the cleaning side check valve 39A, the third clear: , &quot;UA1 - the younger processing side pneumatic valve 15A'. The cleaning gas is supplied from the i-th processing side pneumatic valve 1μ to the second processing side pneumatic valve i7A via the processing side mass flow controller 16A. The portion of the cleaning gas is exhausted from the second processing side pneumatic valve 7A and the processing side check valve 2A through the third processing side pneumatic valve 19A to the exhaust flow path (not shown). The remaining cleaning gas is output from the second processing side pneumatic valve 17A to the processing chamber (not shown) via the second common flow path unit 26, the combination unit 27, the filter 18A, and the common output port 4A. By this cleaning operation, the flow path on the downstream side of the second processing side pneumatic valve 15A is cleaned.

2097-9172-PF 200828484 侧質 制器 此時’若比較第2清洗侧質 量流量控制器16A的流量, 1βΑ之異常。 量流量控制器38Α和處理 可檢測處理側質量流量控 和δ亥清洗動作同時將 月’兀軋餸攸刀-矶殂件47經由第 =側氣動閥41Α、第3清洗側質量流量控制器42Α、第 /月洗L動閥43Α以及配管5〇供給匯合組件27,再從 ,合:件27經由過濾器18Α從共同輸出口 4α向未圖示的 輪出。因而,可清洗配管5&quot;。此時,藉由量測 弟/月洗側貝里流置控制器42Α之流量,而可檢測過渡器 1 8 Α的阻塞。 〃此外,因為作用氣體或清洗氣體流向第2、第3處理 虱體官線2B、2C的動作,和作用氣體或清洗氣體流向第i 處理氣體管線2A之動作相同,所以省略說明。 〈作用效果〉 接著,說明具有該構造之氣體供應集合單元丨的作用 效果。第7圖係將第丨圖所示的電路具體化之未使用疊層 組件61A、61B、61C的氣體供應集合單元ι〇〇之圖。 如第7圖所示,在未使用疊層組件61 a、61 β、61 c的 情況’第2清洗側質量流量控制器38Α、38β、38C配置於 在配官24A、24B、24C的侧方所設置之區域pii。在此情 況’為了抑制基腳空間,而將第2清洗側質量流量控制器 38A、38B、38C以和第3清洗側質量流量控制器42A、42B、 4 2 ◦各自變成同列的方式和分流組件4 7、4 7、4 7連接。第 2清洗侧質量流量控制器38A、38B、38C和第3清洗側質 2097-9172-PF 19 200828484 里流里控制斋42A、42B、42C控制從配管ιοί所供給之清 洗氣體的流量。 而’如第2圖所示,在使用疊層組件61A、6ib、61C 的情況,將第2清洗側質量流量控制器38Α、38β、38C重 疊地配置於已和配管24A、24B、24c上重疊之疊層組件 61A、61B、61C上。因而,第2清洗側質量流量控制器38A、 38B、38(:和配管24A、24B、24C變成兩段構造。 因而’在未使用疊層組件61A、61b、61C的情況,如 第7圖所不,雖然需要用以配置第2清洗侧質量流量控制 器38A、38B、38C的區域pii,但是藉由使用疊層組件61A、 61B、61C,而如第2圖所示,可將第2清洗側質量流量控 制态38A、38B、38C設置於用以配置配管24A、24B、24C 區域P1。因此,若依據本實施形態之氣體供應集合單元1, 可減少用以配置第2清洗側質量流量控制器38A、38B、38C 的區域P11,而可使基腳空間變小。 而且’藉由將第2清洗侧質量流量控制器38A、38B、 38C和配管24A、24B、24C作成兩段構造,而第7圖所示 之區域PI 1變成空。因此,如第2圖所示,使用分流組件 4 7將第4清洗側氣動閥41A、第3清洗側質量流量控制器 42A以及第5清洗侧氣動閥43 A反向地配置。因而,第7 圖所示之區域P21移至第2圖所示的區域P2,而可使氣體 供應集合單元1之寬度尺寸少1行。 一般,在半導體製造裝置,因為所使用之流體控制器 的個數多而難使全長變短。所以使寬度尺寸變小較佳。因 2097-9172-PF 20 200828484 而曰如上述所示將配管24A、24B、24C和第2清洗側質量 流罝控制器38A、38B、38C作成兩段構造,而產生空的空 間,亚將構成清洗氣體管線6之第4清洗侧氣動閥41八、 第3清洗侧f量流量控制器' m以及第5清洗侧氣動閥 43A配置於該空的空間,而使氣體供應集合單元i之寬度 尺寸變小,這係很有利。 此外如第7圖所示,在未使用疊層組件61A、61B、 ,61C的情況,為了第2清洗側質量流量控制器38a、⑽卜 、38C將已調整流量之清洗氣體供給清洗側止回閥39a、 39B、39C,而將配管1〇2、1〇3、1〇4配管成和清洗側止回 閥39A、39B、39C的上面個別地連接。又,第5清洗侧氣 動閥43A、43B、43C將配管1〇5、106、1〇7配管成L字形, 並各自和第卜第3處理氣體單元72A、72B、72C之匯合組 件27、27、27連接。 而’如第2圖所示,在使用疊層組件6ia、61B、61C 的情況,因為不必嚴格地管理清洗氣體之供給量,所以將 ' 配管46和第2清洗側質量流量控制器38Α、38β、38C的 輸入通口連接,並將第2清洗侧質量流量控制器38a、 38B、38C之輸出通口經由短的配管49、4g、49和清洗侧 止回閥39A、39B、39C連接。又,將配管5〇配管成使和 第5清洗側氣動閥43B ' 43C反向地設置之第5清洗側氣 動閥43A通過在氣體單元之間產生的間隙,並和第i處理 氣體單元72A的匯合組件27連接。對於第5清洗側氣動 閥43B、43C ’將配管51、52配管成L字形。 2097-9172-PF 21 2008284842097-9172-PF 200828484 Side controller At this time, if the flow rate of the second cleaning side mass flow controller 16A is compared, the 1βΑ is abnormal. The flow rate controller 38Α and the process detectable treatment side mass flow control and the delta cleanup operation simultaneously pass the month's rolling trowel-sandwich member 47 via the first side pneumatic valve 41Α and the third cleaning side mass flow controller 42Α. The first/month wash L valve 43Α and the pipe 5〇 are supplied to the merger unit 27, and the unit 27 is rotated from the common output port 4α to the unillustrated line via the filter 18A. Therefore, the piping 5&quot; can be cleaned. At this time, the blockage of the transitioner 1 8 可 can be detected by measuring the flow rate of the brother/month wash side Berry flow controller 42. Further, since the operation of the working gas or the cleaning gas to the second and third processing body lines 2B and 2C is the same as the operation of the working gas or the cleaning gas flowing to the i-th processing gas line 2A, the description thereof is omitted. <Effects of Effect> Next, the effect of the gas supply collecting unit 具有 having this configuration will be described. Fig. 7 is a view showing a gas supply assembly unit ι of the unused laminate assemblies 61A, 61B, and 61C embodying the circuit shown in Fig. 。. As shown in Fig. 7, in the case where the laminated modules 61a, 61β, 61c are not used, the second cleaning side mass flow controllers 38A, 38β, 38C are disposed on the sides of the dispensers 24A, 24B, and 24C. The area pii set. In this case, the second cleaning-side mass flow controllers 38A, 38B, and 38C and the third cleaning-side mass flow controllers 42A, 42B, and 4 2 are each in the same column and the shunting assembly in order to suppress the foot space. 4 7, 4 7, 4 7 connections. The second cleaning side mass flow controllers 38A, 38B, 38C and the third cleaning side material 2097-9172-PF 19 200828484 The inner flow control units 42A, 42B, and 42C control the flow rate of the cleaning gas supplied from the piping ιοί. As shown in Fig. 2, when the laminated modules 61A, 6ib, and 61C are used, the second cleaning-side mass flow controllers 38A, 38β, and 38C are overlapped and disposed on the pipes 24A, 24B, and 24c. On the stacked components 61A, 61B, 61C. Therefore, the second cleaning-side mass flow controllers 38A, 38B, and 38 (: and the pipes 24A, 24B, and 24C have a two-stage structure. Therefore, in the case where the laminated components 61A, 61b, and 61C are not used, as shown in FIG. No, although the area pii for arranging the second cleaning side mass flow controllers 38A, 38B, 38C is required, the second cleaning can be performed as shown in FIG. 2 by using the lamination assemblies 61A, 61B, 61C. The side mass flow control states 38A, 38B, and 38C are disposed in the region P1 for arranging the pipes 24A, 24B, and 24C. Therefore, according to the gas supply assembly unit 1 of the present embodiment, the second cleaning side mass flow control can be reduced. The region P11 of the devices 38A, 38B, 38C can reduce the footprint of the foot. Further, 'by making the second cleaning side mass flow controllers 38A, 38B, 38C and the pipes 24A, 24B, 24C into a two-stage configuration, The area PI 1 shown in Fig. 7 becomes empty. Therefore, as shown in Fig. 2, the fourth cleaning side pneumatic valve 41A, the third cleaning side mass flow controller 42A, and the fifth cleaning side are pneumatically driven by the flow dividing unit 47. The valve 43 A is reversely arranged. Thus, the area P21 shown in Fig. 7 is shifted. In the region P2 shown in Fig. 2, the width of the gas supply collecting unit 1 can be made smaller by one line. Generally, in the semiconductor manufacturing apparatus, it is difficult to shorten the total length because the number of fluid controllers used is large. Therefore, it is preferable to make the width dimension small. Since 2097-9172-PF 20 200828484, the pipes 24A, 24B, and 24C and the second cleaning side mass flow controllers 38A, 38B, and 38C are constructed in two stages as described above. The empty space is generated, and the fourth cleaning side pneumatic valve 41, the third cleaning side f amount flow controller 'm, and the fifth cleaning side pneumatic valve 43A, which constitute the cleaning gas line 6, are disposed in the empty space, and It is advantageous to make the width dimension of the gas supply collecting unit i small. Further, as shown in Fig. 7, in the case where the laminated assemblies 61A, 61B, and 61C are not used, the second cleaning side mass flow controller 38a is used. (10), and 38C, the cleaning gas having the adjusted flow rate is supplied to the cleaning side check valves 39a, 39B, and 39C, and the pipes 1〇2, 1〇3, and 1〇4 are piped into the cleaning side check valves 39A and 39B, The top of the 39C is individually connected. Again, the fifth cleaning side pneumatic valves 43A, 43B, 4 3C pipes the pipes 1〇5, 106, and 1〇 into an L shape, and are respectively connected to the joining units 27, 27, and 27 of the third processing gas units 72A, 72B, and 72C. In the case where the laminated components 6ia, 61B, and 61C are used, since it is not necessary to strictly manage the supply amount of the cleaning gas, the 'pipe 46 is connected to the input ports of the second cleaning-side mass flow controllers 38A, 38β, and 38C, The output ports of the second cleaning side mass flow controllers 38a, 38B, and 38C are connected to the cleaning side check valves 39A, 39B, and 39C via the short pipes 49, 4g, and 49. Further, the pipe 5〇 is piped so that the fifth cleaning side pneumatic valve 43A provided opposite to the fifth cleaning side pneumatic valve 43B' 43C passes through the gap generated between the gas cells, and the i-th processing gas unit 72A The merge component 27 is connected. The pipes 51 and 52 are piped into an L shape for the fifth cleaning side pneumatic valves 43B and 43C'. 2097-9172-PF 21 200828484

因而’如弟2圖及第3圖所示’藉由使用疊層組件 61A、61B、61C並將第1〜第3處理氣體單元72A、72B、72C 採用兩段構造,而從第2清洗侧質量流量控制器38A、 38B、38C至清洗側止回閥39A、39B、39C為止之配管長度 變短’可減少已調整流體之清洗氣體的損失地控制清洗氣 體。又,因為第2圖所示之氣體供應集合單元1游第7圖 所示的配管1 〇 2、1 0 3、1 0 4綜合成1條配管4 6,所以可使 配管空間比第7圖所示之氣體供應集合單元ι〇〇的更減 少。而且,因為利用氣體單元之間隙配置配管5 〇,所以不 必另外設置配管50所需之配管空間,不會引起單元尺寸 的大型化。Therefore, as shown in FIG. 2 and FIG. 3, the first cleaning unit 61A, 61B, and 61C are used, and the first to third processing gas units 72A, 72B, and 72C are configured in two stages, and the second cleaning side is used. The piping lengths of the mass flow controllers 38A, 38B, and 38C to the cleaning side check valves 39A, 39B, and 39C are shortened to control the cleaning gas by reducing the loss of the cleaning gas of the adjusted fluid. In addition, since the pipes 1 〇 2, 1 0 3, and 1 0 4 shown in Fig. 7 are integrated into one pipe 4 6 as shown in Fig. 2, the piping space can be made larger than that of Fig. 7 The gas supply collection unit shown is more reduced. Further, since the piping 5 is disposed by the gap between the gas cells, it is not necessary to separately provide the piping space required for the piping 50, and the size of the unit is not increased.

又,本實施形態之氣體供應集合單元1如第2圖及第 3圖所示,因為以覆蓋配管24A、24B、24C之方式配置疊 層組件61A、61B、61C,所以可將疊層組件61A、61B、61C 配置成在第卜第3處理氣體單元72A、72B、72C的寬度尺 寸内。 又,本實施形態之氣體供應集合單元1如第2圖所 示’使用插入插入孔6 4A之螺栓Vp將疊層組件61A、61B、 61C固定於安裝板9,V字流路組件22將未圖示的螺栓各 自固定於疊層組件61A、61B、61C的固定孔63A,又使用 螺栓V將第2清洗側質量流量控制器38A、38B、38C各自 固定於V字流路組件2 2。 而,例如在將第3處理氣體單元72C加熱的情況,將 帶狀的加熱器71、71安裝於手動閥uc、過濾器12C、壓 2097-9172-PF 22 200828484 力調整閥13C、壓力計14C、疊層組件61C、第i共同流路 組件25、第1處理侧氣動閥15C、處理側質量流量控制器 16C、第2處理侧氣動閥17C、第2共同流路組件2七、^ 合組件27以及過濾器i8C的兩側。因而,將各流體控制 器及配置於其下方的下部流路組件加熱,而作用氣體在流 路内不會凝結。此時,利用和兩侧面密接之加熱器Η、Η 將豐層組件61C加熱。該熱傳至和保持溝62c接觸之配管 ,24C ’而將配管24C加熱。因而,在配管24c流動的作用 氣體在配管24C内不會凝結。 因而,若依據本實施形態之氣體供應集合單元丨,工 個疊層組件61可兼具:固定第2清洗侧質量流量控制器 38和配置於其下部的v字流路組件22、22之功用;及將 •加熱器7丨、71之熱傳至配管24A、24B、24C的功用。 換言之,如第7圖所示,在未使用疊層組件61C的情 況,將處理氣體單元加熱時,雖然以覆蓋配管2牝之方式 、將加熱組件110固定於安裝板9,但是無法有效利用加^ 組件110。❿,如第2圖及第3圖所示,藉由使疊層組件 61不僅具有將配管24加熱之功用,而且具有固定v字流 路組件22、22的功用,而有效利用疊層組件61,並可使 基腳空間變小。 又,本實施形態之氣體供應集合單元丨如第2圖及第 3圖所示,因為將基腳空間大之第2清洗侧質量流量控制 器38A、38B、38C和疊層組件61A、61B、61C重疊,所以 可高效率地使單元整體的基腳空間變小。Further, as shown in FIGS. 2 and 3, the gas supply assembly unit 1 of the present embodiment has the laminated assembly 61A, 61B, and 61C disposed so as to cover the pipes 24A, 24B, and 24C, so that the laminated assembly 61A can be disposed. 61B and 61C are disposed within the width dimension of the third processing gas units 72A, 72B, and 72C. Further, in the gas supply assembly unit 1 of the present embodiment, as shown in Fig. 2, the laminated assembly 61A, 61B, 61C is fixed to the mounting board 9 by the bolt Vp inserted into the insertion hole 64A, and the V-shaped flow path assembly 22 will not be Each of the illustrated bolts is fixed to the fixing holes 63A of the laminated assemblies 61A, 61B, and 61C, and the second cleaning-side mass flow controllers 38A, 38B, and 38C are fixed to the V-shaped flow path unit 22 by bolts V, respectively. For example, when the third processing gas unit 72C is heated, the strip-shaped heaters 71 and 71 are attached to the manual valve uc, the filter 12C, the pressure 2097-9172-PF 22 200828484, the force adjustment valve 13C, and the pressure gauge 14C. The laminated unit 61C, the i-th common flow path unit 25, the first processing-side pneumatic valve 15C, the processing-side mass flow controller 16C, the second processing-side pneumatic valve 17C, and the second common flow path unit 27, and the assembly 27 and both sides of the filter i8C. Therefore, each fluid controller and the lower flow path unit disposed below it are heated, and the working gas does not condense in the flow path. At this time, the layered assembly 61C is heated by the heaters Η and Η which are in close contact with the both sides. This heat is transmitted to the piping 24C which is in contact with the holding groove 62c, and the pipe 24C is heated. Therefore, the working gas flowing through the pipe 24c does not condense in the pipe 24C. Therefore, according to the gas supply assembly unit 本 of the present embodiment, the work stacking unit 61 can have the functions of fixing the second cleaning side mass flow controller 38 and the v-shaped flow path assemblies 22 and 22 disposed at the lower portion thereof. And the function of transferring the heat of the heaters 7丨, 71 to the pipes 24A, 24B, and 24C. In other words, as shown in Fig. 7, in the case where the laminated unit 61C is not used, when the processing gas unit is heated, the heating unit 110 is fixed to the mounting board 9 so as to cover the piping 2, but the heating unit 110 cannot be effectively used. ^ Component 110. That is, as shown in Figs. 2 and 3, the laminated assembly 61 is effectively utilized by the function of heating the piping 24 and having the functions of the fixed v-shaped flow path assemblies 22, 22. And can make the footer space smaller. Further, as shown in FIGS. 2 and 3, the gas supply assembly unit of the present embodiment has the second cleaning side mass flow controllers 38A, 38B, and 38C and the lamination assemblies 61A and 61B having a large foot space. Since the 61C overlaps, the foot space of the entire unit can be efficiently reduced.

2097-9172-PF 200828484 此外,本發明未限定為上述之實施形態,亦可進行各 種應用。 (1)例如,在上述之實施形態,將作用氣體流動之第 卜第3處理氣體單元72A、72B、72C列舉為「第i氣體單 元」,並將清洗氣體單元73列舉為「第2氣體單元」。而, 例如亦可將控制作用氣體之供給的氣體單元作為「第i、 第2氣體單元」。 (2)例如,在上述之實施形態,雖然將疊層組件61的2097-9172-PF 200828484 Further, the present invention is not limited to the above-described embodiments, and various applications can be made. (1) For example, in the above embodiment, the third processing gas units 72A, 72B, and 72C through which the working gas flows are listed as "i-th gas unit", and the cleaning gas unit 73 is referred to as "second gas unit". "." Further, for example, a gas unit that controls the supply of the working gas may be referred to as an "i-th and second gas unit". (2) For example, in the above embodiment, the laminated assembly 61 is

保持溝6 2作成拱門狀’但是只要係和配管2 4之外周面接 觸並可傳熱的形狀,亦可係矩形或三角形等。 (3) 例如,在上述之實施形態,雖然將疊層組件μ設 置成和配管24重疊,但是亦可和流路組件等重疊。 又 (4) 例如,在上述之實施形態,雖然將第3清洗侧質 量流量控制器3δ配置於疊層組件61之上 、 、 彳疋亦可將閥 或感測器等其他的種類之流體控制器配置於疊層組件Η 之上。 【圖式簡單說明】 第1圖係氣體供應集合單元之電路圖。 弟2圖係將第i圖所示的電路具體化之本 形態之氣體供應集合單元的平面圖。 X的貝施 第3圖係第2圖之a — A剖面圖。 ^ 4圖係第2圖所示之疊層構件的平面圖。 第5圖係表示從第4圖圖中之这味D + , 間中之…方向所看到的疊The groove 6 2 is formed in an arch shape. However, as long as it is in contact with the outer surface of the pipe 24 and can transmit heat, it may be rectangular or triangular. (3) For example, in the above embodiment, the stacking unit μ is disposed to overlap the pipe 24, but may be overlapped with the flow path unit or the like. Further, for example, in the above-described embodiment, the third cleaning-side mass flow controller 3δ is disposed on the multilayer assembly 61, and other types of fluids such as valves or sensors may be controlled. The device is disposed above the stacked component Η. [Simple description of the drawing] Fig. 1 is a circuit diagram of a gas supply collection unit. The second diagram is a plan view of the gas supply assembly unit of the present embodiment in which the circuit shown in Fig. i is embodied. The Besch of X is a cross-sectional view of the a-A of Fig. 2. ^ 4 is a plan view of the laminated member shown in Fig. 2. Figure 5 shows the stack seen from the direction of the D + in the picture in Figure 4

2097-9172-PF 200828484 層構件之圖。 第6圖係第4圖之C — C剖面圖。 第7圖係將第1圖所示的電路具體化之未使用疊層構 件的氣體供應集合單元之圖。 【主要元件符號說明】. 1 氣體供應集合單元 24A、24B、24C 配管 / ^ 38A、38B、38C 第2清洗侧質量流量控制器(流體控 制器之一部分) , 61A、61B、61C 疊層組件 63A、63B、63C 固定孔(固定部) 71 加熱器 72A、72B、72C 處理氣體單元(第1氣體單元) 73 清洗氣體單元(第2氣體單元) 2097-9172-PF 252097-9172-PF 200828484 Diagram of layer components. Figure 6 is a cross-sectional view taken along line C-C of Figure 4. Fig. 7 is a view showing a gas supply assembly unit of the unused laminated member in which the circuit shown in Fig. 1 is embodied. [Main component symbol description]. 1 Gas supply assembly unit 24A, 24B, 24C piping / ^ 38A, 38B, 38C 2nd cleaning side mass flow controller (one part of fluid controller), 61A, 61B, 61C laminated assembly 63A , 63B, 63C fixing hole (fixing part) 71 heater 72A, 72B, 72C processing gas unit (first gas unit) 73 cleaning gas unit (second gas unit) 2097-9172-PF 25

Claims (1)

200828484 十、申請專利範圍: 1. 一種氣體供應集合單元,其特徵在於具有: 第1氣體單元,係控制第1氣體的供給; 第2氣體單元,係和該第1氣體單元連接,並利用複 數個流體控制器控制匯合至該第1氣體單元的第2氣體; 以及 疊層組件,係和該第1氣體單元重疊, 將該流體控制器之一部分和該疊層組件重疊。 2. 如申請專利範圍第1項之氣體供應集合單元,其中 該疊層組件係以覆蓋該第1氣體單元所含之配管的方式設 置。 3. 如申請專利範圍第1項之氣體供應集合單元,其中 ' 該疊層組件具有··固定部,係用以固定被放置該流體控制 器之一部分的下部流路組件;及保持溝,係和該第1氣體 早元抵接,並安裝加熱器。 4. 如申請專利範圍第1項之氣體供應集合單元,其中 I 該流體控制器之一部分係質量流量控制器或質量流量計。 2097-9172-PF 26200828484 X. Patent Application Range: 1. A gas supply assembly unit, comprising: a first gas unit for controlling supply of a first gas; and a second gas unit connected to the first gas unit and using plural The fluid controller controls the second gas merged to the first gas unit; and the stacking assembly overlaps the first gas unit to overlap a portion of the fluid controller with the stack assembly. 2. The gas supply assembly unit of claim 1, wherein the laminate assembly is disposed to cover a pipe included in the first gas unit. 3. The gas supply assembly unit of claim 1, wherein the laminate assembly has a fixed portion for fixing a lower flow path component to which a portion of the fluid controller is placed; and a retaining groove The first gas is in contact with the first gas, and a heater is installed. 4. The gas supply assembly unit of claim 1, wherein one of the fluid controllers is a mass flow controller or a mass flow meter. 2097-9172-PF 26
TW096136874A 2006-12-25 2007-10-02 Gas supplying and collecting unit TW200828484A (en)

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