200827878 九、發明說明： 【發明所屬之技術領域】 本發明係有概“板之晶胞相_成方法，_是岸用於 液晶面板製造’及以-上、下可雜之隔離層與液晶面板之頂、底層 黏貼結合而形成厚液晶晶胞間隙之方法。 土 【先前技術】 按，液晶廣找使聽顯示產品之材料，液絲由㈣加在兩面電極 而形成-光通開·關作用。通常，f知液晶層在二個電極之間之厚度是非常 稀薄的’舉例而言’在TFT_LCD型態之液晶顯示面板，厚度在6到8微米 ㈣；在TN或STN型態之液晶顯示面板之液晶層與間隙則是在職米以 下；而LCOS微型顯示器㈣ro display)之液晶層平均厚度在3到5微米左 右0 習知之較薄厚度之液晶面板特性歸納如下： 1. 液晶分子之極快速上昇與下降反應時間，厚度較薄的晶胞間隙及低電 壓驅動的液晶材料’低電壓驅動而可以達到更低的電力消耗，和容 易設計電子控制電路。 2, 較高的透射率，厚度較薄驗晶層可以產錄高的穿透率。 3·容易組裝，厚度較薄之晶胞間隙，通常關隔粒來維持晶胞_一致。晶 胞間隙廣泛被液晶顯示ϋ產業採用，更小關隔粒子，較容雜得及在 製程中易處理。 但是，在某一些應用領域争，厚度較厚的液晶層是有其必要與需求， 而厚度較厚的液晶層如以上述之習知厚度較薄之液晶層製法，將遭遇到不 利的製造問題。 如在習知的液晶面板生產過程中，由玻璃基板在内面點膠並形成一液 200827878 晶腔以供容置液晶，再由—頂端玻璃基板蓋在頂端，以形翻部液晶腔結 構，並再於邊緣處開口，讓液晶腔由抽真空機抽真空後將液晶注入該真空 的液晶㈣’或者是勤糾—種f知釘晶注人m液晶液滴 填入液晶財’奴合以間驗，使該可以被形成與維持。 如驗晶晶胞_增加到3嶋㈣，5_㈣，_微米_， 或者更_ ’間隔教取得不易，並且所需花費之成本大幅增加。即使較大 粒徑之間難供應問題可以魅解決，但液晶腔結構無法維持與形成厚度 較薄之黏勒壁’且寬度將大辆加而無法㈣化需求，在某些製程情況 下’是無法接受此種結構。 在相關先前專利技術文獻方面，如中華民國發明公開公報第鳩麵 號「液晶顯示面板間隙物製造方法」發明公開案，則揭示典型習知液晶顯 面板的製作方法’僅能夠使間隙物分佈均均，無法達到厚間隙之形成效 果。 【發明内容】 、緣此’本發明之主要目的即是在於提供一種液晶面板之晶胞厚間隙形 #成方法.，特別是藉由一隔離層預先設置系列空洞，以供液晶以卿方法注 入，並進而由隔離層形成晶胞厚間隙。 .·、、本發明之再-目的，即是在於提供—種液晶面板之晶胞·隙形成方 ..法加生產的棚’節鹤陳成本，並提驗晶晶胞生產之品質。 為達上述之目的’本發明之液晶面板之晶胞厚間隙形成方法，係由一液晶 面板之底面基板固定至定位，至少一隔離層上、下設有至少一 w黏膝層， 隔離層内部設有若干空洞，該隔離層對位至底面基層位置，並藉由獨的 UV黏膠層_於底板基層’ _内部設有轩空峨素顯示區域），該 隔離層對位至械舰’鍋下_ W觸_繼面板之 200827878 底面基板，再藉由滴下式液晶注入方法或真空液晶注入方式將液晶填入隔 離層之各孔中，再由隔離層上端之UV黏膠層與一液晶面板之頂面基板黏 、 貼對位，之後藉由紫外光照射加熱，使該上、下兩個UV黏膠層硬化，亦 •可以上、下兩個UV黏膠層分開照射硬化方式，讓液晶面板之底面基板與 : 頂面基板分別結合於隔離層的底面與頂面，以達到使隔離層形成液晶面板 之晶胞厚間隙之功效。 【實施方式】 _ 首先請參閱第一圖所示，本發明之液晶面板之晶胞厚間隙形成方法， 係包含一液晶面板之底面基板1〇，該底面基板1〇包括一底層η、ΙΤ〇導電 層(Indium Tin Oxide Layer) 12 及至少一配向層(Alignment Layer) 13，該底層 11位於底部，可以是玻璃或其他透明物質，或者為可撓性基板(flexible substrate)構成，例如：PC、PET及PES等材料。 一 ITO導電層12，結合於底層η上，該配向層13結合於IT0導電層 12上。 請再配合第二圖所示，至少一隔離層2〇，係包括若干隔離柱21、若干 # 空洞22、至少一下υν黏膠層23、下保護膜24、至少一上UV黏膠層25 及上保護膜26，該隔離柱21與空洞22分佈於隔離層20内，且該隔離柱 21與空洞22形成交錯方式佈置，該隔離柱21之材料不限，在本發明中係 / 以來四氟乙浠(Tefl如)或不會與液晶相互起反應之材料為例，且該隔離柱21 之高度Η可以無限範圍預先設定製成，即該隔離層2〇整體之厚度範圍亦可 無限範圍加厚，該下UV黏膠層23結合於隔離柱21與空洞22下方，該下 UV黏膠層23表面由該下保護膜24加以貼合保護，一旦剝除該下保護膜 24 ’即可讓下UV黏膠層23具有黏性，該上UV黏膠層25結合於隔離柱 21與空洞22上方，且該上υν黏膠層25表面由該上保護膜26加以貼合保 200827878 護’該上保護膜26並可用來封住空洞22頂面，同樣地，撕去上保護膜26， 可使上UV黏膠層25具有黏性及使空洞22露出。 上述之UV黏膠層23及黏膠層25並非以具有保護膜24及保護膜26 者為限，如以UY黏膠層23直接塗佈結合於隔離柱21與空洞22下方，及 黏膠層25直接塗佈結合於隔離柱21與空洞22上方之方式，亦不脫本發明 之範疇。 該隔離層20之型態不限，在本發明中係以若干個隔離層2〇相鄰連接 成帶狀（如第五圖所示），但也可以是單—元件型態。 請再參閱第三圖所示，-液⑽板之頂面基板3(W系包括一配向層31、 ITO導電層32及玻璃基體(Glass Substrate)33，該配向層31位於頂面基板 30底面該ITO $電層32結合於配向層31上，該，玻璃基體33結合於 ITO導電層32上。 請再配合細圖、第五圖、第六圖、第七圖及第八圖所示，本發明之 液晶面板之晶胞賴_成方法，其步_包含步驟⑽〜利，其中： (40) 底面基板及細基缺位，即紅述第_圖所示之底面基板與頂面 基板30輸送至如第五圖所示之固定位置，即頂面基板％條底面基 板10之上方。 土 (41) 隔離層移動至定位，即該如第二圖所示之帶狀隔離層2〇移動對應至步 驟40之底面基板10與頂面基板3〇之間位置，即如第五圖所示懈^ 面基板10上方及頂面基板30下方之位置。 、一 (42) 隔離層黏合至底面基板’即將步驟41之隔離層％之下保護膜^除去， 使下UV黏膠層23黏合至底面基板1〇頂端之配向層13上〜 締；。 耶弟六圖 200827878 t入液之空财’即將步驟42完成黏合底面基層⑺之隔離 曰2〇之上保觀26除去，使空洞22露出，並逐-注人液晶於空洞22 中如以滴下式液晶注入方法充填於空洞^中，如第七圖所示。 (44)黏合_雜練，_岭㈣冑舰·a轉之隔離層％ 、端上UV黏膠層μ黏合至步驟1〇所示之頂面基板％下方之配向 層31 ’使該底面基板10、隔離層2〇與頂面基板3〇結合為如第八圖所 示一體之結構。 鲁（45)以紫外光設備照射加熱’即將步驟*完成底面基板1〇、隔離層邡與 頂面基板3G組合—體之結構，以―紫外光設備5()加以照射加熱，使 隔離層20下端之下w黏膠層23與上端之上爪黏膠層^加熱硬化， 如第八圖卿’使_層2〇與該底面基板1G與頂面基板3q穩固結合。 (46)裁切成型，即將步驟45完成紫外光照射之底面基板1〇、隔離層邡與 頂面基板30組合一體之結構中之隔離層2〇加以切割後，即形成如第 九圖所示本發明之厚晶胞間隙之液晶面板1〇〇產品。 請再參閱第十圖所示，顯示本發明之液晶面板之晶胞厚間隙形成方法 _之第二實補，其f ’齡在於頂面基板3G及底面基板1〇之間，底面基 板連結有兩個隔離層20及20，，該隔離層20與頂面基板30間之連結方式 1及該隔離層20,與底面基板1〇之連結方式，與第八圖及第九圖所示之隔離 / 層20與底面基板1〇及頂面基板3〇之間連結方式相同。 請再配合第十一圖所示，上述之兩個隔離層20及20,間結合有一雙面 配向薄膜60，該雙面配向薄膜60係包括一透明基板61、第一配向膜62及 第二配向膜63，該透明基板61為一異向性聚合物薄片（anistropic p〇iymei· films)構成，該第一配向膜62塗鍍結合於該透明基板61之頂面，該第二配 200827878 向膜塗鍍結合於透明基板61底面，該第一配向膜62由該隔離層之 UV黏膠層25黏合，第二配向膜63由該隔離層2〇，之uy黏膠層23加以黏 • 合，該第一配向膜62及第二配向膜63之配向角度不限，在本發明中係以 : 該第一配向膜62之配向角度為45度，第二配向膜63之配向角度為145度 - 為例，此種正交配向角度設計，可以使兩個隔離層20及20,間之液晶光學 :偏極光依存性作最適當之輯，並且，也可以增加液晶面板觸之液晶晶 ：胞間隙厚度，而又不會增加所需驅動電壓與相對應的反應時間。 • 第十圖及第十一圖所示本發明之液晶面板100之液晶晶胞厚間隙構成 方法之第二實施例，其形成步驟係可依如第四圖所示之步驟40〜46來達 成，同時，加上如可撓性的底面基板10之底層n，可以改變液晶面板100 之外形，以符合不同的應用場合，例如：球面鏡的液晶鏡頭或增加液晶面 板100之液晶晶胞間隙的光學特性，例如：光學之焦距特性。 请再配合第十二圖及針三騎示，為本發赚晶面板之晶胞厚間隙 形成方法之第三實施例，其中，一隔離層70位於該底面基板10及頂面基 板30間，該隔離層70,係包括若干隔離柱71、若干空洞72、至少一下υν _黏膠層73、下保護膜74、至少一上υν黏膠層75及上保護膜％，該隔離 柱71形狀不限，在第十二圖及第十三圖中為-不規則之形狀之例，且並非 “為上述之隔離層20或2〇,之隔離柱21圓柱形狀，該空洞72分佈於隔離層 • 70内’每一空洞72 —侧並形成至少-注入孔721，該下UV轉層73結 合⑽_雜與如72下方，該下w娜層％絲由該下保護膜 74加以貼合保護，-旦剝除該下保護膜74，即可讓下清黏膠層73具有 黏性，該上UV黏膠層75結合封閉於隔離柱71與空洞％上方，且該上 UV黏膠層75表面由該上保護膜76加以貼合保護，同樣地，撕去上保護膜 10 200827878 76，可使上UV黏膠層75具有黏性。 請再配合針_、第十五圖及第十六騎示，第切圖為上述第十 .二第十三_示本發.晶面板之晶解_形成松第三實施例之 流程圖，包括步驟80〜86，其中： :㈣絲基減彻基缺位，即壯述料三_权底面基板⑺與頂 : 面基板3〇輸送至如第十三圖所示之固定位置，即頂面基板30位於底 : 面基板10之上方。 鲁⑻)隔離層移動至定位，即該如第十三圖所示之帶狀隔離層？0，移動對應 至步驟80之底面基板10與頂面基板3〇之間位置，即如第十三圖所示 位於底面基板10上方及頂面基板％下方之位置。 (82) 隔離層黏合至底面基板，即將步驟81之隔離層7〇之下方之^黏膠層 73之保護膜74除去，使下UV黏膠層73黏合至底面基板10頂端之配 向層13上，其作法類同於上開步驟42。 (83) 黏合隔離層與頂面基板，即藉由步驟82完成隔離層7〇黏合至底面基板 10步驟後，該隔離層70頂端之上UV黏膠層75黏合至步驟80所示之 • 頂面基板30下方之配向層31，使該底面基板1〇、隔離層70與頂面基 板30結合為如第十二圖所示一體之結構。 (84) 以紫外光設備照射加熱，即將步驟83完成底面基板1〇、隔離層％與 / 頂面基板30組合一體之結構，以一紫外光設備50加以照射加熱，使 隔離層下端之下UV黏膠層73與上端之上UV黏膠層75加熱硬化， 讓隔離層20與該底面基板1〇與頂面基板3〇穩固結合。 (85) 裁切成型，即將步驟84完成紫外光照射之底面基板1〇、隔離層％與 頂面基板30組合一體之結構中之隔離層70加以切割後，即形成如第 11 200827878 十五圖所示之液晶面板100’之單元件。 (86)液晶真空注入隔離層空洞，即藉由如習知真空注入方式，將液晶經由步 驟85所形成之液晶面板1〇〇’之單元件的隔離層之注入孔注入 以填滿整個空洞72。 :(87)密封注入孔，即將步驟86完成液晶注入隔離層7〇之空洞72製程後， • 將該隔離層70之注入孔721予以密封，而形成如同第十六圖所示之液 晶面板100’產品。 •上述第一圖〜第十六圖所示本發明之液晶面板之晶胞厚間隙形成方 法，其中所揭示之說明及圖式，係為便於闡明本發明之技術内容及技術手 段，所揭示較佳實施例之-隅，並不因而拘限其範脅。並且，舉凡一切針 對本發明之結構細部修飾、變更，或者是元件之等效替代、置換，當不脫 離本發明之發明精神及範轉，其範圍將由以下之申請專利範圍來界定之。 【圖式簡單說明】 第-圖為本發明方法第—實施例之底層基板之剖面放大圖。 第二圖為本發明方法第—實細之隔崎之剖面放大圖。 ⑩第三圖為本發明方法第—實施例之頂層基板之剖視放大圖。 第四圖為本發明方法第一實施例之流程圖。 ‘ 第五®為本伽方法第—實補之底面基板、隔離層及頂®基板定位之 ' 立體圖。 第/、圖為一剖視放大圖，顯示本發明方法第一實施例之隔離層黏合至底 面基板之狀態。 第七圖為-剖視放大圖，顯示本發明方法第一實施例之注入液晶於隔離 層之空洞中之狀態。 第八圖為一剖視放大圖，顯示本發明第一實施例之底面基板、隔離層及 J2 200827878 難射加熱之狀態。 就圖為本發明方法第一實施例所形成之液晶面板剖視放大圖。 第十圖為本發财法_成之液晶面板之第二實施例圖。 第十圖為第十目中之雙面配向_之立體分解結構圖。 第十一圖為U方法第二實施例之底面基板、隔離層及頂面基板結構。 第十三圖為本發财_三實施例之底聽板、隔離層及職基板定位 之立體圖。200827878 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a "cell cell phase_forming method of a board, _ is a wall for liquid crystal panel manufacturing" and an upper and lower barrier layer and liquid crystal The method of forming a thick liquid crystal cell gap by bonding the top and bottom layers of the panel. Soil [Prior Art] Press, the liquid crystal is widened to make the material of the display product, and the liquid filament is formed by adding (4) to the electrodes on both sides - the light is turned on and off Generally, it is known that the thickness of the liquid crystal layer between the two electrodes is very thin 'for example' in the TFT_LCD type liquid crystal display panel, the thickness is 6 to 8 micrometers (four); in the TN or STN type liquid crystal The liquid crystal layer and gap of the display panel are below the working meter; while the average thickness of the liquid crystal layer of the LCOS microdisplay (4) ro display is about 3 to 5 microns. 0 The characteristics of the thinner liquid crystal panel are summarized as follows: 1. The pole of the liquid crystal molecule Fast rise and fall response times, thinner cell gaps and low voltage driven liquid crystal materials 'low voltage drive for lower power consumption and easy design of electronic control circuits. 2 Higher transmittance, thinner thickness of the crystal layer can produce high transmittance. 3. Easy to assemble, thin cell gap, usually close the grain to maintain unit cell _ consistent. It is adopted by the liquid crystal display industry, and it is smaller and separates particles, which is easier to handle in the process. However, in some application fields, the thicker liquid crystal layer has its necessity and needs, and the thickness is thicker. The liquid crystal layer, such as the above-mentioned thin liquid crystal layer manufacturing method, will encounter unfavorable manufacturing problems. For example, in the conventional liquid crystal panel production process, the glass substrate is dispensed on the inner surface to form a liquid 200827878 crystal cavity. For accommodating the liquid crystal, and then, the top glass substrate is covered at the top end to shape the liquid crystal cavity structure, and then open at the edge, so that the liquid crystal cavity is vacuumed by the vacuuming machine and then the liquid crystal is injected into the vacuum liquid crystal (4)' Or it is diligently correcting - kind of nails, crystals, liquid crystal droplets filled with liquid crystal money, and the slaves can be formed and maintained. If the crystal cell is increased to 3 嶋 (4), 5_(4), _ Micron _, or more _ 'interval teach Easy, and the cost of the required cost is greatly increased. Even if the problem of difficult supply between the larger particle sizes can be solved, the structure of the liquid crystal cavity cannot be maintained and the thickness of the sticky wall is formed, and the width will be large and cannot be added (4) In the case of certain processes, it is not acceptable to accept such a structure. In the related prior patent documents, such as the disclosure of the invention of the Republic of China Invention Gazette No. No. "Method for manufacturing liquid crystal display panel spacers", it is revealed A typical method for fabricating a liquid crystal display panel can only make the spacers uniformly distributed, and the effect of forming a thick gap cannot be achieved. SUMMARY OF THE INVENTION Accordingly, the main object of the present invention is to provide a method for forming a cell thickness gap of a liquid crystal panel. In particular, a series of voids are preliminarily provided by a spacer layer for injecting liquid crystal into a clear method. And further, a cell thick gap is formed by the isolation layer. The re-purpose of the present invention is to provide a cell/gap formation side of a liquid crystal panel. The cost of the shed is to produce the quality of the crystal cell production. In order to achieve the above purpose, the method for forming a cell thickness gap of a liquid crystal panel of the present invention is fixed to a position by a bottom substrate of a liquid crystal panel, and at least one spacer layer is provided on at least one spacer layer, and the inside of the isolation layer is provided. There are a number of voids, which are aligned to the base layer of the bottom surface, and have a unique UV adhesive layer _ in the base layer of the bottom plate _ inside the sputum display area), the isolation layer is aligned to the ship' Under the pot _ W touch _ follow the panel of the 200827878 bottom substrate, and then fill the liquid crystal into the holes of the isolation layer by dropping liquid crystal injection method or vacuum liquid crystal injection method, and then the UV adhesive layer and the liquid crystal at the upper end of the isolation layer The top substrate of the panel is adhered and aligned, and then the upper and lower UV adhesive layers are hardened by ultraviolet light irradiation, and the upper and lower UV adhesive layers can be separately irradiated and hardened. The bottom substrate of the liquid crystal panel and the top substrate are respectively bonded to the bottom surface and the top surface of the isolation layer to achieve the effect of forming the spacer layer into a thick cell gap of the liquid crystal panel. [Embodiment] First, as shown in the first figure, the method for forming a cell thick gap of a liquid crystal panel of the present invention comprises a bottom substrate 1A of a liquid crystal panel, and the bottom substrate 1A includes a bottom layer η, ΙΤ〇 Indium Tin Oxide Layer 12 and at least one alignment layer 13, the bottom layer 11 is located at the bottom, may be glass or other transparent material, or may be a flexible substrate, such as: PC, PET and PES and other materials. An ITO conductive layer 12 is bonded to the underlying layer η, and the alignment layer 13 is bonded to the IT0 conductive layer 12. Further, as shown in the second figure, at least one isolation layer 2 includes a plurality of isolation pillars 21, a plurality of voids 22, at least a second adhesive layer 23, a lower protective film 24, at least one upper UV adhesive layer 25, and The upper protective film 26, the spacer 21 and the cavity 22 are distributed in the isolation layer 20, and the spacer 21 is arranged in a staggered manner with the cavity 22. The material of the spacer 21 is not limited, and in the present invention, the PTFE is Ethyl (Tefl) or a material that does not react with the liquid crystal is taken as an example, and the height Η of the spacer 21 can be preset in an infinite range, that is, the thickness range of the isolation layer 2 can also be infinitely increased. Thick, the lower UV adhesive layer 23 is bonded under the spacer 21 and the cavity 22, and the surface of the lower UV adhesive layer 23 is protected by the lower protective film 24, and once the lower protective film 24' is peeled off, The lower UV adhesive layer 23 has adhesiveness, and the upper UV adhesive layer 25 is bonded to the spacer 21 and the cavity 22, and the surface of the upper υν adhesive layer 25 is adhered by the upper protective film 26 to protect the The upper protective film 26 can be used to seal the top surface of the cavity 22, and likewise, the upper protective film 26 is torn off. The UV adhesive layer 25 can have adhesive 22 is exposed and that the cavity. The UV adhesive layer 23 and the adhesive layer 25 are not limited to have the protective film 24 and the protective film 26, for example, the UY adhesive layer 23 is directly coated and bonded under the spacer 21 and the cavity 22, and the adhesive layer. The manner in which the direct coating is applied to the spacers 21 and the voids 22 is also within the scope of the invention. The shape of the spacer layer 20 is not limited. In the present invention, a plurality of spacer layers 2 are adjacently connected in a strip shape (as shown in the fifth figure), but may be a single-element type. Referring to the third embodiment, the top substrate 3 of the liquid (10) plate (the W system includes an alignment layer 31, an ITO conductive layer 32, and a glass substrate 33), and the alignment layer 31 is located on the bottom surface of the top substrate 30. The ITO $ electric layer 32 is bonded to the alignment layer 31, and the glass substrate 33 is bonded to the ITO conductive layer 32. Please cooperate with the fine figure, the fifth figure, the sixth figure, the seventh figure and the eighth figure, The method for forming a cell of a liquid crystal panel according to the present invention comprises the following steps: (10) wherein: (40) the bottom substrate and the fine base are absent, that is, the bottom substrate and the top substrate shown in FIG. 30 is transported to a fixed position as shown in Fig. 5, that is, above the top substrate % of the bottom substrate 10. The soil (41) is moved to the positioning, that is, the strip-shaped spacer 2 as shown in the second figure. The movement corresponds to the position between the bottom substrate 10 and the top substrate 3A of the step 40, that is, the position above the substrate 10 and the lower surface of the top substrate 30 as shown in FIG. 5, and the (42) isolation layer is bonded to The bottom substrate 'is removed from the protective layer under the isolation layer of step 41, and the lower UV adhesive layer 23 is bonded to the bottom substrate 1〇. Alignment layer 13 on the top ~ ;;. 耶弟六图200827878 t into the empty space of the liquid 'coming step 42 to complete the adhesion of the bottom layer of the base layer (7) on the 曰 2 保 above the view 26 to remove, so that the cavity 22 is exposed, and - The liquid crystal is filled in the cavity 22 by a drop-type liquid crystal injection method, as shown in the seventh figure. (44) Adhesive_Machine, _Ling (four) 胄船·a turn of the isolation layer%, end The UV adhesive layer μ is adhered to the alignment layer 31 ′ below the top substrate % shown in the step 1 使 to bond the bottom substrate 10 , the isolation layer 2 〇 and the top substrate 3 为 into an integrated structure as shown in FIG. 8 . Lu (45) irradiates and heats with ultraviolet light equipment. The structure of the bottom substrate 1〇, the spacer layer and the top substrate 3G are combined, and the ultraviolet light device 5() is used to irradiate and heat the insulating layer to make the isolation layer. Below the lower end of the 20, the adhesive layer 23 and the upper end of the upper adhesive layer are heat-hardened, as in the eighth figure, the layer 2 is firmly bonded to the bottom substrate 1G and the top substrate 3q. (46) Cutting Forming, that is, the bottom substrate 1 〇 of the ultraviolet light irradiation in step 45, the isolation layer 邡 and the top substrate 30 are integrated After the isolation layer 2 is cut in the structure, the liquid crystal panel 1 〇〇 product of the thick cell gap of the present invention as shown in the ninth figure is formed. Referring to the tenth figure, the liquid crystal panel of the present invention is shown. The second solid complement of the cell thick gap forming method is f between the top substrate 3G and the bottom substrate 1〇, and the bottom substrate is connected with two isolation layers 20 and 20, and the isolation layer 20 and the top The connection method 1 between the surface substrates 30 and the connection between the isolation layer 20 and the bottom substrate 1A, and the isolation/layer 20 and the bottom substrate 1A and the top substrate 3 shown in FIGS. 8 and 9 The connection is the same. In addition, as shown in FIG. 11 , the two isolation layers 20 and 20 are combined with a double-sided alignment film 60, and the double-sided alignment film 60 includes a transparent substrate 61, a first alignment film 62, and a second layer. The alignment film 63 is composed of an anisotropic polymer film (anostropic p〇iymei film), and the first alignment film 62 is plated and bonded to the top surface of the transparent substrate 61. The film is coated on the bottom surface of the transparent substrate 61. The first alignment film 62 is bonded by the UV adhesive layer 25 of the isolation layer, and the second alignment film 63 is adhered by the isolation layer 2, and the uy adhesive layer 23 is bonded. The alignment angle of the first alignment film 62 and the second alignment film 63 is not limited. In the present invention, the alignment angle of the first alignment film 62 is 45 degrees, and the alignment angle of the second alignment film 63 is 145 degrees. - For example, this orthogonal alignment angle design can make the liquid crystal optics between the two isolation layers 20 and 20: the most appropriate color of the polarization dependence, and also increase the liquid crystal panel touched by the liquid crystal panel: Gap thickness without increasing the required drive voltage and corresponding reaction timeThe tenth and eleventh figures show a second embodiment of the liquid crystal cell thick gap forming method of the liquid crystal panel 100 of the present invention, and the forming steps can be achieved according to steps 40 to 46 shown in the fourth figure. At the same time, with the bottom layer n of the flexible bottom substrate 10, the shape of the liquid crystal panel 100 can be changed to suit different applications, such as a liquid crystal lens of a spherical mirror or an optical for increasing the liquid crystal cell gap of the liquid crystal panel 100. Characteristics, such as: optical focal length characteristics. The third embodiment of the method for forming a thick cell gap of the crystal panel of the present invention is provided in conjunction with the twelfth figure and the third surface mount, wherein an isolation layer 70 is located between the bottom substrate 10 and the top substrate 30. The isolation layer 70 includes a plurality of isolation pillars 71, a plurality of voids 72, at least a lower υν_adhesive layer 73, a lower protective film 74, at least one upper υν adhesive layer 75, and an upper protective film%. The isolation pillar 71 is not shaped. In the twelfth and thirteenth figures, the shape of the irregular shape is not "is the separation layer 20 or 2", and the isolation column 21 has a cylindrical shape, and the cavity 72 is distributed on the isolation layer. 70 in each cavity 72 - side and form at least - injection hole 721, the lower UV transfer layer 73 is combined with (10)_hetery and under 72, the lower w nanolayer % wire is attached and protected by the lower protective film 74, Once the lower protective film 74 is stripped, the lower adhesive layer 73 is made viscous, and the upper UV adhesive layer 75 is bonded and closed over the spacer 71 and the void %, and the surface of the upper UV adhesive layer 75 The upper protective film 76 is adhered and protected, and similarly, the upper protective film 10 200827878 76 is peeled off, so that the upper UV adhesive layer 75 can be adhered. Please cooperate with the needle _, the fifteenth figure and the sixteenth riding, the first cut is the above tenth. The thirteenth _ show the hair. Crystallization of the crystal panel _ formation of the third embodiment of the process The figure includes steps 80 to 86, wherein: (4) the silk base is reduced by the base defect, that is, the material of the bottom surface substrate (7) and the top surface substrate 3 are transported to a fixed position as shown in FIG. That is, the top substrate 30 is located at the bottom: above the surface substrate 10. The (8)) isolation layer is moved to the positioning, that is, the strip isolation layer ?0 as shown in the thirteenth figure, moving to the bottom substrate 10 of step 80 and The position between the top substrate 3〇, that is, the position above the bottom substrate 10 and below the top substrate is as shown in Fig. 13. (82) The isolation layer is bonded to the bottom substrate, that is, the isolation layer 7 of step 81 is The protective film 74 of the lower adhesive layer 73 is removed, and the lower UV adhesive layer 73 is adhered to the alignment layer 13 at the top of the bottom substrate 10. The same operation as in the upper opening step 42. (83) Bonding the isolation layer and the top The surface substrate, that is, after the step of bonding the isolation layer 7 to the bottom substrate 10 by the step 82, the UV adhesive on the top of the isolation layer 70 75 is bonded to the alignment layer 31 under the top substrate 30 shown in step 80, so that the bottom substrate 1A, the spacer layer 70 and the top substrate 30 are combined into a structure as shown in Fig. 12. (84) The device is heated by ultraviolet light, that is, the structure of the bottom substrate 1〇, the spacer layer % and/the top substrate 30 is integrated in step 83, and is irradiated and heated by an ultraviolet light device 50 to make the UV adhesive layer under the lower end of the isolation layer. And the UV adhesive layer 75 on the upper end is heat-hardened, and the separation layer 20 and the bottom substrate 1〇 are firmly bonded to the top substrate 3〇. (85) Cutting forming, that is, the bottom substrate of the step 84 is completed by ultraviolet light irradiation. After the isolation layer 70 in the structure in which the spacer layer % and the top substrate 30 are integrated is cut, the unit member of the liquid crystal panel 100' as shown in the fifteenth of the 11th 200827878 is formed. (86) The liquid crystal is vacuum-injected into the spacer void, that is, the liquid crystal is injected through the injection hole of the isolation layer of the unit member of the liquid crystal panel 1' formed in step 85 to fill the entire cavity 72 by a conventional vacuum injection method. . : (87) sealing the injection hole, that is, after the step 86 is completed to fill the cavity 72 of the liquid crystal isolation layer 7, the injection hole 721 of the isolation layer 70 is sealed to form the liquid crystal panel 100 as shown in FIG. 'product. The method for forming a cell thickness gap of the liquid crystal panel of the present invention as shown in the above first to sixth embodiments, wherein the description and the drawings are for the purpose of clarifying the technical contents and technical means of the present invention. The best example of this is that it does not limit its threat. In addition, the scope of the invention is defined by the following claims, and the scope of the invention is defined by the following claims. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is an enlarged cross-sectional view of the underlying substrate of the first embodiment of the method of the present invention. The second figure is an enlarged view of the section of the method of the present invention. 10 is a cross-sectional enlarged view of the top substrate of the first embodiment of the method of the present invention. The fourth figure is a flow chart of the first embodiment of the method of the present invention. ‘The fifth® is the first method of the gamma method—the solid substrate, the isolation layer, and the top® substrate. Fig. 3 is a cross-sectional enlarged view showing the state in which the spacer layer of the first embodiment of the method of the present invention is bonded to the underlying substrate. Fig. 7 is a cross-sectional enlarged view showing the state in which the liquid crystal is injected into the void of the spacer layer in the first embodiment of the method of the present invention. Figure 8 is a cross-sectional enlarged view showing the state of the underlying substrate, the spacer layer, and the J2 200827878 in a first embodiment of the present invention. The figure is a cross-sectional enlarged view of a liquid crystal panel formed by the first embodiment of the method of the present invention. The tenth figure is a diagram of a second embodiment of the liquid crystal panel of the present invention. The tenth figure is a three-dimensional exploded structure diagram of the double-sided alignment in the tenth. The eleventh figure shows the bottom substrate, the isolation layer and the top substrate structure of the second embodiment of the U method. The thirteenth figure is a perspective view of the bottom listening board, the isolation layer and the positioning of the occupational substrate of the third embodiment.
第十四圖為本發财法第三實補之流程圖； 第十五圖為本發财料三實施例之液晶面板單元件之結構。 第十六圖為本發财法之液晶面板結構。 【主要元件符號說明】The fourteenth figure is a flow chart of the third actual supplement of the financial method; the fifteenth figure is the structure of the liquid crystal panel unit of the third embodiment of the present invention. The sixteenth figure is the liquid crystal panel structure of the present financial method. [Main component symbol description]
10底面基板 12 ITO導電層 20隔離層 22空洞 24下保護膜 26上保護膜 31配向層 33玻璃基體 41隔離層移動至定位 43 注入液晶於隔離層之空洞中 45以紫外光設備照射加熱 5〇紫外光設備 61透明基板 11底層 13 配向層 21隔離柱 23下UV黏膠層 25上UV黏膠層 30頂面基板 32 ITO導電層 40底面基板及頂面基板定位 42隔離層黏合至底面基板 44黏合隔離層與頂面基板 46裁切成型 60雙面配向薄膜 62 第一配向膜 13 200827878 63 第二配向膜 70 71 隔離柱 72 721 注入孔 73 74 下保護膜 75 80 底面基板及頂面基板定位 81 82 隔離層黏合至底面基板 83 84 以紫外光設備照射加熱 85 86 液晶真空注入隔離層空洞 87 100’液晶面板 Η 隔離層 空洞 下uv黏膠層 上UV黏膠層 隔離層移動至定位 黏合隔離層與頂面基板 裁切成型 密封注入孔 高度10 bottom substrate 12 ITO conductive layer 20 isolation layer 22 cavity 24 lower protective film 26 upper protective film 31 alignment layer 33 glass substrate 41 isolation layer moved to positioning 43 injected liquid crystal in the cavity of the isolation layer 45 by ultraviolet light irradiation heating 5 〇 UV device 61 transparent substrate 11 bottom layer 13 alignment layer 21 isolation pillar 23 under UV adhesive layer 25 UV adhesive layer 30 top surface substrate 32 ITO conductive layer 40 bottom substrate and top substrate positioning 42 isolation layer bonded to the bottom substrate 44 The adhesive isolation layer and the top substrate 46 are cut and formed 60 double-sided alignment film 62 first alignment film 13 200827878 63 second alignment film 70 71 isolation column 72 721 injection hole 73 74 lower protection film 75 80 bottom substrate and top substrate Positioning 81 82 Isolation layer bonded to the bottom substrate 83 84 UV light irradiation heating 85 86 Liquid crystal vacuum injection isolation hole 87 100' LCD panel 隔离 Isolation layer void uv adhesive layer UV adhesive layer isolation layer moved to positioning bonding Isolation layer and top substrate cutting and sealing injection hole height
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