CN111650786A

CN111650786A - Micron narrow-frame display device and manufacturing method thereof

Info

Publication number: CN111650786A
Application number: CN202010628219.1A
Authority: CN
Inventors: 赵景罡
Original assignee: Dalian Longning Technology Co ltd
Current assignee: Dalian Longning Technology Co ltd
Priority date: 2020-07-02
Filing date: 2020-07-02
Publication date: 2020-09-11

Abstract

The invention provides a micron narrow frame liquid crystal display device and a manufacturing method thereof, which is characterized in that a sealing frame with cohesiveness is arranged between an upper film substrate and a lower film substrate, liquid crystal is formed into a uniform liquid crystal layer according to the thickness of a spacing structure and then is sealed in a closed space, wherein the sealing frame at least consists of two connecting structures with concave-convex embedded parts; the spacing structure has cohesiveness and is arranged between the upper film substrate and the lower film substrate, and two ends of the spacing structure are contacted with the inner surfaces of the film substrates and/or the films. According to the invention, the viscous sealing frame and the interval structure are added, the width of the frame glue of the sealing frame is restrained by the outer side structure and the inner side structure of the sealing frame, micron-scale narrow frame display can be realized, the display device is suitable for rigid and flexible full-screen display requirements, and small deformation is generated so as to keep the stability of the display device, and the design requirements of the narrow frame of various equipment with the display device, especially spliced screens and portable equipment, can be met.

Description

Micron narrow-frame display device and manufacturing method thereof

Technical Field

The invention relates to the technical field of flat-panel crystal display, in particular to a micron narrow-frame liquid crystal display device and a manufacturing method thereof.

Background

With the development of electronic products, the demand of portable mobile devices, flat panel televisions, wearable display products, and the like is rapidly increasing. People are increasingly demanding on the performance of display products, and desire a wide viewing range, and desire a larger screen display size and a better frame ratio, i.e., a larger screen ratio, and therefore, narrow-frame display devices continue to receive attention from the industry.

The wide bezel tends to make the display panel bulky, making it difficult to incorporate into the housing of the electronic device. A bezel may also require that a significant portion of the display panel be covered by an oversized covering (e.g., bezel, border, overlay material), resulting in a display device that is aesthetically unappealing. Taking the mobile phone industry as an example, the mobile phone industry is limited by the technology at present, and the mobile phone with a full screen declared by the industry is only a mobile phone with an ultrahigh screen ratio temporarily, and a mobile phone with a front screen ratio of 100% cannot be realized. The full screen mobile phone in the industry means that the real screen ratio can reach more than 80 percent, and the full screen mobile phone is a mobile phone with a narrower frame design compared with the prior products.

The narrower frame display device has the characteristics of larger effective display area and more beautiful appearance, and the narrow frame display device is the development enthusiasm in the industry at present. The narrow frame design has the advantages that the narrow frame design is attractive, when two or more screens work together, the design margin is increased, and the display content connectivity between the screens is good. The narrow-frame display device can meet the requirements of a comprehensive screen mobile phone and can be widely applied to the fields of folding mobile phones, spliced screens and the like.

At present, in the prior art, there are many technical types covered in the field of narrow-frame display devices in the display field, including improving pollution of a sealing frame to an alignment film, backlight assembly, organic light emitting diode display, reducing the narrow frame of a backlight sealant frame, building a gate drive circuit, improving the adhesive property of the sealant frame and various thin film materials, and adopting polyimide-free alignment films.

Improving the distance between the orientation film and the sealing frame: with the development of materials and processes, the visual range of the display device is enlarged, that is, the display area is enlarged and the frame is narrowed, so that the occupied area of the orientation film is enlarged, and the display device can generate an overlapping part with the frame sealing glue in a limited space, so that the frame sealing glue is mixed with the organic material in the orientation film, the pollution of the orientation film in the display area is caused, and the display quality of the display device is influenced. The problem that organic materials in the frame sealing glue can enter the orientation film through an overlapping area and are mixed with the organic materials in the orientation film to cause pollution of the orientation film in a display area and further influence the display quality of the display device in the prior art is solved by arranging the separation wall in the middle.

Narrow bezel of flexible OLED: according to the OLED display device of the flexible display device, the conductive connector is arranged in the lower substrate and is respectively connected with the circuit wiring layer and the flexible connecting circuit connected with the driving circuit board, so that the driving circuit board is connected with the circuit wiring layer, an extra connecting area does not need to be arranged on one side of the circuit wiring layer of the lower substrate to be used for being connected with the flexible connecting circuit, the effective display area of the flexible display device can be increased, a narrower frame is achieved, and the display quality is improved.

Set up light-directing structure in the frame region: the upper cover plate is positioned above the display module and provided with a display area and a frame area, the display area is over against the display module, and the frame area surrounds the outer side of the display area; the light guide structure is positioned on the surface of the upper cover plate and comprises a display overlapping area and a frame overlapping area which are adjacent, the display overlapping area is overlapped with a part of the display area, and the frame overlapping area is overlapped with at least a part of the frame area; when light emitted by the display module is irradiated to the display overlapping area, the light is refracted at the light guide structure, and part of the light is refracted to the frame overlapping area from the display overlapping area. The narrow-frame display device of the display device can realize the display effect of a visual ultra-narrow frame, even the display effect of a frame-free frame.

Built-in gate drive circuit: including gate drivers, power supply wiring, electrostatic discharge (ESD) circuits, multiplexing circuits, data signal lines, cathode contacts, and other functional elements. There may be a plurality of peripheral circuits included in the display assembly for providing various different types of additional functions, such as touch sensing or fingerprint identification functions. The adhesive property of the frame sealing glue and various film materials is improved: in a general liquid crystal display device, a frame sealing adhesive is an indium tin oxide material, a polyimide alignment film, a silicon oxide or silicon nitride insulating film, or the like, of an edge region on a TFT/CF substrate. The frame glue is improved, so that the adhesive force between the frame glue and the polyimide material is stronger.

Using a polyimide-free alignment film: the liquid crystal display device includes a pair of substrates disposed to face each other, and a liquid crystal layer and a sealing material disposed between the pair of substrates, wherein an alignment control layer for controlling alignment of liquid crystal molecules is provided between the pair of substrates and the liquid crystal layer, the pair of substrates is in direct contact with the sealing material, the alignment control layer is formed of a polarizing light absorbing compound, and the polarizing light absorbing compound includes in its molecules: at least one of phenylene and phenyl; and at least one of a carbonyl group and an azo group. In the above various improvements of the narrow border type, the width of the sealing border is not improved, mainly because the width of the narrow border type glue is difficult to control accurately in the printing process, and after the sealing border type glue is coated, a flowing process is needed in the liquid crystal box attaching process, so that an accurate geometric shape is not easy to form. Even if the geometric dimension of the narrow frame is accurately controlled, the insufficient adhesive property of the frame with the excessively small dimension can easily cause the falling off and the loss of the adhesive property. The narrow frame process in the prior art can not realize micron-scale sealing, and particularly relates to a narrow frame liquid crystal display device below 500 microns.

Therefore, it is very necessary to develop a new sealing frame structure and a manufacturing method thereof to solve the problems of the narrow-frame display device, and reduce the width of the sealing frame to the micrometer level to improve the performance of the display device, so that the narrow-frame display device can be applied in a wider range.

Disclosure of Invention

According to the technical problem that the process limitation of the sealing frame influences the narrowing of the sealing frame, the micron narrow-frame liquid crystal display device and the manufacturing method thereof are provided. The invention mainly designs a sealing frame structure and a spacing structure which are different from those of the prior art, wherein the sealing frame structure is an embedded structure which is formed by using composite materials and has an inner side structure and an outer side structure matched with a filler layer, and the sealing frame structure is matched with the spacing structure with cohesiveness, so that the widening width is reduced, the micron-scale level is reduced, and the performance of the display device is improved.

The technical means adopted by the invention are as follows:

a micro narrow bezel liquid crystal display device, the display device comprising: the thin film transistor comprises an upper thin film substrate, a lower thin film substrate, a common electrode thin film, an orientation film, an active array thin film, a protective film, an orientation film, a grid electrode, a source electrode lead thin film, a grid electrode driver thin film and the like, wherein the upper thin film substrate and the lower thin film substrate are relatively parallel, and the common electrode thin film and the orientation film are attached to the inner surface of the upper thin film substrate and the lower thin film substrate; it is characterized in that the preparation method is characterized in that,

the sealing frame is arranged between the upper film substrate and the lower film substrate and has cohesiveness, and liquid crystal is sealed in the closed space after forming a uniform liquid crystal layer according to the thickness of the interval structure, wherein the sealing frame at least consists of two connecting structures with concave-convex embedded structures; the spacing structure has cohesiveness and is arranged between the upper film substrate and the lower film substrate, and two ends of the spacing structure are in contact with the inner surfaces of the film substrates and/or the films.

Further, the sealing frame comprises an outer side structure, an inner side structure and a filler layer arranged between the inner side structure and the outer side structure, the inner side structure and the filler layer are formed by correspondingly processing a viscous photoresist mixture and an ultraviolet heat curing adhesive mixture, and the cured outer side structure and the cured inner side structure and the filler layer are provided with concave-convex embedded connection structures. The photoresist mixture selected for the inner side structure, the outer side structure and the spacing structure has patterning characteristics, and can be patterned in various ways, such as APR printing, gravure printing, screen printing, ink-jet printing, photolithography and the like. The ultraviolet heat curing glue mixture selected for the filler layer is as follows: (1) it is difficult for the liquid crystal display material to diffuse and precipitate before being cured; (2) easy positioning in forming the pattern is enough, and the preferable scheme is ink-jet printing; (3) has good adhesion to various films.

The outer side structure, the inner side structure and the spacing structure have cohesiveness, namely the two ends of the spacing structure, the substrate, the common electrode film and the orientation film, the active array film, the protective film and the orientation film and the driver film have cohesiveness along the normal direction of the substrate; the spacer structure and the inner structure can be stable in the liquid crystal for a long period of time. The outer structure is in contact with the substrate, the active array film middle lead, the protective film, the orientation film and the gate driver film. The protective film may be organic or inorganic, and particularly, an inorganic protective film is widely used because of its low cost and excellent performance. Silicon nitride and silicon oxide have been used in the prior art to meet the needs of most display devices. In the formation of each layer of thin film, bm (black matrix), oc (over coat) layer, electrode thin film and insulating film are first patterned, sputtered or evaporated, patterned as necessary, orientation film is coated, and thin films required for forming the spacer structure are sequentially formed in this order. After each layer of thin film is formed, corresponding patterning treatment is performed as required.

The viscosity of the filler layer is stronger than that of the inner side structure and the outer side structure, namely the viscosity of the ultraviolet heat curing glue mixture is stronger than that of the photoresist mixture; the inner side structure, the outer side structure and the spacer structure are required to have adhesion with the alignment film, the insulating film and the base material. When the material selected after the inner structure, the outer structure and the spacer structure are cured does not resist the solvent during the formation of the alignment film, it is necessary to form the alignment film first or to coat the alignment film with a single-sided substrate. The alignment film may be applied after the inner structure, the outer structure and the spacer structure are cured. In both cases, damage to the alignment film by the filler layer can be avoided.

The electrode films mentioned above are in a rectangular strip shape in practical application, the distance between the electrode films is usually less than 50 μm, the electrode films are of a type in which a transparent electrode is disposed in the display region, and the lead electrode connecting the pixel electrode and the driver may be composed of a lead electrode with low sheet resistance or together with the transparent electrode. The overlapping area is specifically set according to the wiring structure of the display device, an insulating film such as silicon oxide or silicon nitride can be arranged in the middle, and via holes are arranged on the insulating film to connect all parts of the electrode films.

The electrode thin film is transparent or non-transparent, and the orientation film is arranged on the outermost layer of each thin film on the inner side of the upper thin film substrate and/or the lower thin film substrate. The electrode film has both transparent and opaque, and the opaque electrode is usually a metal electrode, and may be copper, molybdenum, aluminum, chromium or a stack of layers, and a molybdenum-aluminum-molybdenum laminated structure is preferably used in view of cost and stability. The transparent electrode is usually a metal oxide electrode such as tin or indium, and preferably an ITO electrode. In flexible display, it is preferable to use a material such as a silver nanowire, graphene, PEDOT/PSS (poly 3, 4-ethylenedioxythiophene/polystyrenesulfonic acid) or the like for the transparent electrode. The transparent electrode film can be used for the display electrode part and can also be superposed with the metal electrode for the non-display electrode part, and the higher the resolution ratio is, the smaller the electrode distance is required to be.

The alignment film is usually disposed over the entire effective display area, also called AA (active area), and does not require a fine patterning process for each display device, but only covers the entire AA area and does not exceed the sealing frame. In the lead electrode or the blank region in the AA region, an alignment film is also generally provided. In the manufacture of liquid crystal, the adjustment of working procedures is very difficult, and the simplification process is difficult and expensive on the premise of not influencing the display performance. In order to adapt to the process flow of the production line, a cholesteric liquid crystal display device with a single-side orientation film can also be arranged, and a layer of protective film is arranged on the surface of an electrode film on the other side without the orientation film, so that the electrodes, particularly metal electrodes, are prevented from slowly seeping to pollute the display liquid crystal material, and the display stability is influenced by conductive impurities in the liquid crystal display material. The insulating film is patterned in a manner similar to that of the alignment film.

The spacing structure disposed between the two film substrates is in contact with the inner surface of a certain film or substrate. When the material of the spacer structure is in contact with the alignment film or the insulating film, good stability and film formation characteristics are required. The gate driver is composed of a plurality of thin film transistors. The sealing frame portion of the sealing structure is in contact with ITO or a metal electrode, and is also required to have good stability and film forming characteristics.

Further, at least one side end of the outline structure composed of the inner structure and the outer structure is in contact with the inner surface of the upper (or lower) film substrate and/or the film and has a completely or partially hollow accommodating space, the filler layer is a solid structure embedded in the outline structure, and at least one side end of the filler layer is in contact with the inner surface of the lower (or upper) film substrate and/or the film.

Further, along the horizontal direction of the film substrate, the inner side structure and the outer side structure are formed by two closed or partially opened frame outlines which are nested inside and outside, and a columnar or other-shaped filling structure is arranged in the accommodating space of the outline structure. The middle of the sealing frame is provided with a solid structure in a column shape or other shapes, so that the upper film substrate and the lower film substrate can be effectively supported, and the deformation of the film substrates is reduced. The frame profile with the opening requires that the inner side structure and the outer side structure are connected at the opening, and the sealed frame structure with the opening is adopted for the production process of vacuum infusion.

Further, the height of the sealing frame and the height of the spacing structure are between 2 and 8 μm, the length, the width and the circumference of the sealing frame and the spacing structure can be the same or different, and the materials of the sealing frame and the spacing structure can be the same or different.

The height range of 2-8 μm can satisfy the display requirements of TN, STN, VA, MVA, PVA, IPS, E-IPS, S-IPS, FFS, OCB, Ch-LCD and the like. The inner side structure, the outer side structure and the spacing structure can be arranged according to the electrode wiring, the non-transparent area and the non-effective display area are effectively utilized to be provided with the spacing structure, the density of the spacing structure is enabled to be as high as possible, and the stress reduction of the whole display device is facilitated. Typically the ratio of the total area of the spacer structure to the area enclosed by the sealing rim is greater than 2%. On the premise of not influencing the opening ratio, the higher the ratio is, the more favorable the sealing frame is narrowed. The outer structure, the inner structure and the spacer structure are manufactured by the same process method, are generally formed by the same process steps and materials at one time, use the same illumination, the same photoetching process and the same materials, and have no difference from the prior art in cost. If special requirements are required, different materials can be manufactured and used respectively, and the cost is generally higher than that of the same material and the same technological method.

Further, the components of the photoresist mixture adopted by the outer side structure, the inner side structure and the interval structure are composed of an organic silicon mixture, a cross-linking agent, a solvent, a polymerization inhibitor, a defoaming agent, a surfactant, a photosensitizer, a stabilizing agent and a silane coupling agent containing primary amino, glycidoxypropyl, amino or epoxy. And irradiating the film formed by the mixture solution by ultraviolet light, wherein the solubility of the organosilicon mixture in the film in an alkaline developing solution is weakened under the action of a photoinitiator. The part not irradiated by ultraviolet light is more easily dissolved in an alkaline developer than the part irradiated by ultraviolet light, and a fine pattern is formed by utilizing the characteristic. The content of the organic silicon in the solution can be adjusted by using propylene glycol methyl ether acetate PGMEA for short, so that the method is suitable for requirements of different devices. The silicone mixture is generally composed of two or more silicones having a significant difference in dissolution characteristics in an acid or alkali solution. The organosilicon mixture provided by the invention has high resolution, high heat resistance and high transparency when being used for an inner side structure, an outer side structure and a spacing structure, and particularly has compatibility with various silane coupling agents in a solution state. The inner structure, the outer structure and the spacer structure formed by the mixture have the characteristic of resisting high temperature of more than 230 ℃, and have certain bonding strength with the polyimide film, silicon oxide and silicon nitride even after being cured. The silane coupling agent of primary amino, glycidoxypropyl, amino or epoxy group is a tackifier which has good compatibility with organosilicon mixture, namely the solubility parameter is similar. Compatibility is critical to producing tack, tack and hold tack, and if incompatible, the adhesive becomes opaque or precipitates. The silane coupling agent can be well adhered to the alignment film or the inorganic insulating film by chemical bonding or physical adsorption. The crosslinking agent, solvent, polymerization inhibitor, defoaming agent, surfactant and photosensitizer may be any of the conventional materials. The spacer structure provided by the invention has dry adhesion after being cured at high temperature (generally more than 200 ℃), namely, after polymerization, the inner side structure, the outer side structure and the spacer structure have uniform height, certain hardness and compression ratio higher than 85%, and also have certain bonding strength. The spacing structure provided by the invention has certain bonding strength, can effectively improve the tensile strength, the shear strength and the peeling strength of the upper film substrate and the lower film substrate, and effectively inhibits the impact of stress on the sealing frame under the action of external force. Thus, the sealing rim can be narrowed to the micrometer order.

Further, the filler layer is made of an ultraviolet heat curing adhesive mixture, the ultraviolet heat curing adhesive mixture comprises liquid epoxy resin, acrylate monomer and/or methacrylate monomer or oligomer thereof, a latent epoxy curing agent, a photo-radical polymerization initiator and a mixture containing more than 2 thiol compounds per molecule, and the filler layer is filled in the inner structure and the outer structure and is processed to form a sealing frame with the inner structure, the outer structure and the filler layer. The filler layer has stronger viscosity, and can be cured by light under the action of ultraviolet light or by heating at a certain temperature. The required heat curing temperature is set according to the nature of the latent epoxy curing agent in combination with the process requirements. The intermediate resin is not easy to form a fine pattern, is difficult to form a uniform pattern of tens of microns or several microns, is only suitable for a display device with a wider sealing frame when being used independently, and can form a very fine pattern through an inner side structure and an outer side structure. By combining two materials with characteristics, the spacing structure and the upper and lower film substrates can be effectively and firmly bonded together to form a relatively narrow sealing frame, and the method is applied to a display device with a micron narrow sealing frame.

Further, the thickness of the upper and lower thin film substrates is less than 200 μm; one side of the source electrode adopts a wide sealing frame or a sealing frame with the same width as the other side, and the grid driver film attached to the inner surface of the lower film substrate is partially or completely covered by the sealing frame.

The thickness of the film substrate is less than 200 mu m, the thinner the film substrate is, the more easily the impulse is absorbed by the spacing structure when external force acts on the film substrate, and the cracking caused by the external force which generates vibration, bending and twisting between the upper film substrate and the lower film substrate and impacts the sealing frame is reduced. For narrow sealing rims the width of the outer and inner structures is 1-25 microns, preferably the width of the intermediate resin is 3-150 microns, and the sum of the outer, inner and intermediate resin widths is between 5-200 microns. A wider margin of 5-500 microns is preferred for the sum of the wide seal frame outboard structure, inboard structure and intermediate resin width, and may be greater than 500 microns. For the wide sealing frame, it is also possible to form it using the material for the intermediate resin alone. The size of the spacing structure is limited by the resolution size of the display and cannot be designed arbitrarily, and only the material composition can be optimized to meet the performance requirement of the display device. The thinner the film substrate is, the higher the flexibility is, the lower the elasticity is, and the easier the interval structure restrains the deformation of the film substrate. A small deformation liquid crystal cell can be formed as long as the spacer structure density is high enough, and the spacer structure is very tiny (several micrometers or tens of micrometers). The film substrate may be made of transparent or opaque material such as plastic or glass.

Further, the filler layer is embedded in the profile structure, one side end of which is flush with the profile structure edge or has an extension wrapping the profile structure edge. The filling amount of the filler layer is equal to or larger than the volume between the inner side structure and the outer side structure and is uniformly distributed. After the upper film substrate and the lower film substrate are attached, cured middle resin can not exceed the outer side structure and the inner side structure, the outer side structure and the inner side structure can be wrapped, the wrapping size can be effectively controlled through accurately controlling the filling amount, and a narrow-frame display device is formed. The intermediate resin has stronger viscosity, and can be cured by light under the action of ultraviolet light or by heat at a certain temperature. The required heat curing temperature is set according to the nature of the latent epoxy curing agent in combination with the process requirements. Through the constraint of the outer side structure and the inner side structure and the combination of materials with two characteristics, the upper film substrate and the lower film substrate can be effectively and firmly bonded together to form a narrower sealing frame, and the display device is applied to a display device with the narrow sealing frame.

The invention discloses a manufacturing method of a micron narrow-frame liquid crystal display device, which is characterized in that the manufacturing method is used for manufacturing the micron narrow-frame liquid crystal display device and comprises the following steps:

s1, cleaning: cleaning the film substrate and the film which is attached to the inner surface of the film substrate and has patterning or non-patterning;

s2, preparing a contour structure and a spacing structure: selecting an upper (or lower) film substrate, coating a photoresist mixture on the inner surface of the film substrate by using spin and slit methods, and forming a profile structure and a spacing structure through precuring, exposing, developing by using an alkaline solution, cleaning and curing;

filling the ultraviolet heat-curing glue mixture into the containing space of the contour structure by using a dripping method, a printing method or an ink-jet printing method, and heating to volatilize a solvent in the mixture;

s3, filling and preparing a liquid crystal layer: filling liquid crystal into a space surrounded by the sealing frame by using a dripping method;

s4, secondary cleaning: ultrasonic cleaning or DI water cleaning the inner surface of the thin film substrate to improve the surface physical properties of the orientation film;

s5, curing and packaging: after the liquid crystal is instilled, the lower (or upper) film substrate is jointed, and a liquid crystal box is pressed by using proper atmospheric pressure to form a uniform liquid crystal layer; and carrying out photocuring on the liquid crystal box, and then carrying out thermocuring to obtain the micron narrow-frame liquid crystal display device.

Compared with the prior art, the invention has the advantages that the viscous sealing frame and the interval structure are added between the upper film substrate and the lower film substrate, the width of the frame glue of the sealing frame is restricted by the outer side structure and the inner side structure of the sealing frame, micron-scale narrow frame display can be realized, the invention is suitable for rigid and flexible comprehensive screen display requirements, meanwhile, the interval structure is matched with the sealing frame, a mode of dripping liquid crystal materials firstly and then laminating can be adopted in the manufacturing process, liquid crystal is dripped in advance before the two film substrates are laminated to form a box, the invention is suitable for manufacturing and processing of a narrow frame liquid crystal display device, and small deformation is generated so as to keep the stability of the display device.

The invention can meet the design requirements of narrow frames of various devices with display devices, and is particularly widely applied to the fields of spliced screens, portable devices and the like.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a micron narrow-bezel liquid crystal display device according to the present invention.

Fig. 2 is a schematic structural diagram of a sealed frame with the same width of a micron narrow frame liquid crystal display device according to the present invention.

Fig. 3 is a schematic cross-sectional view of the inner and outer structures of the sealed frame of the present invention configured to have a completely hollow structure.

Fig. 4 is a schematic cross-sectional view of the inner structure and the outer structure of the sealing frame of the present invention, which are formed to have a partially hollow structure (U-shaped structure).

Fig. 5 is a schematic cross-sectional view illustrating the filling of the filler layer of the present invention into the completely hollow structure shown in fig. 3.

Fig. 6 is a schematic cross-sectional view of the filler layer of the present invention filled in the hollow structure (U-shaped structure) shown in fig. 4.

FIG. 7 is a schematic cross-sectional view of the sealing frame of FIG. 5 of the present invention after curing between upper and lower film substrates.

Fig. 8 is a schematic cross-sectional view of the sealing frame of fig. 6 after curing between upper and lower film substrates in accordance with the present invention.

In the figure: 1. an upper thin film substrate; 2. a lower film substrate; 3. a common electrode film and an alignment film attached to an inner surface of the upper (lower) film substrate; 4. an active array film, a protective film, an alignment film, a gate and source electrode lead film, a gate driver film, etc. attached to the inner surface of the lower (upper) film substrate; 5. sealing the frame; 6. a spacer structure; 7. an outboard structure; 8. an inboard structure; 9. a filler layer.

Detailed Description

It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. Any specific values in all examples shown and discussed herein are to be construed as exemplary only and not as limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the directional terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc., are generally based on the orientation or positional relationship shown in the drawings, and are used for convenience of description and simplicity of description only, and in the absence of any contrary indication, these directional terms are not intended to indicate and imply that the device or element so referred to must have a particular orientation or be constructed and operated in a particular orientation, and therefore should not be considered as limiting the scope of the present invention: the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.

As shown in fig. 1 and fig. 2, the present invention provides a micron narrow bezel liquid crystal display device, including: the thin film transistor comprises an upper thin film substrate 1, a lower thin film substrate 2, a common electrode thin film and an orientation film 3 attached to the inner surface of the upper (lower) thin film substrate, an active array thin film, a protective film, an orientation film, a grid and source electrode lead thin film, a grid driver thin film and the like 4 attached to the inner surface of the lower (upper) thin film substrate, a sealing frame 5 with adhesive property arranged between the upper thin film substrate and the lower thin film substrate, and a spacing structure 6. In the figure, a well-known structure such as a liquid crystal layer is not shown.

The liquid crystal is sealed in the closed space after a uniform liquid crystal layer is formed by a sealing frame 5 according to the thickness of a spacing structure 6 (the height of the sealing frame and the height of the spacing structure are between 2 and 8 mu m, the length, the width and the perimeter of the sealing frame and the spacing structure can be the same or different, and the materials of the sealing frame and the spacing structure can be the same or different), wherein the sealing frame 5 at least consists of two connecting structures with concave-convex embedded structures; the interval structure 6 has cohesiveness, is arranged between the upper film substrate and the lower film substrate, can be uniformly distributed between the film substrates, and can also be arranged according to actual requirements, and two ends of the interval structure 6 are in contact with the inner surfaces of the film substrates and/or the films, namely two ends of the interval structure 6 can be in contact with the inner surfaces of the film substrates at the same time, can also be in contact with the inner surfaces of the films at the same time, or one side of the interval structure is in contact with one side of the film substrates. Along the normal direction of the film substrate, the two ends of the spacing structure 6 at least have close connectivity with all or part of the contact surfaces of the upper and lower film substrates, the electrode film, the insulating film or the orientation film, the two ends of the spacing structure 6 refer to the end surfaces of the two ends or the side wall parts of the end parts, and because of the multi-layer overlapping of the films, there will be close connectivity in the microstructure.

Preferably, the thickness of the upper and lower film substrates is less than 200 μm; one side of the source electrode adopts a wide sealing frame or adopts a sealing frame 5 with the same width as the other sides, and the grid driver film attached to the inner surface of the lower film substrate is partially or completely covered by the sealing frame 5.

As shown in fig. 2, which is a schematic view of a sealed frame 5 having the same width, the sealed frame 5 includes an outer structure 7, an inner structure 8, and a filler layer 9 disposed between the inner and outer structures. The outer structure 7, the inner structure 8 and the filler layer 9 are formed by correspondingly processing a viscous photoresist mixture and an ultraviolet thermal curing adhesive mixture, and the cured outer structure 7, the cured inner structure 8 and the filler layer 9 have a concave-convex embedded connection structure.

In particular, at least one side end of the profile structure formed by the inner structure 8 and the outer structure 7 is in contact with the inner surface of the upper (or lower) film substrate and/or the film and has a completely or partially hollow accommodating space, and fig. 3 shows a schematic view of the bottomless outer structure 7 and the inner structure 8 fixed on the lower film substrate. The structure has low processing cost. Fig. 4 shows a schematic view of fixing the U-shaped outer structure 7 and the inner structure 8 on the lower film substrate, which requires a gray mask, and has the advantages of high mold cost, and the outer structure and the inner structure are not easy to fall off, so that a narrower sealing frame can be manufactured. In the cross-sectional views of fig. 3 and 4, the interior may be simultaneously fabricated, patterned with columnar or other hollow structures, or other shapes using the same method.

The filler layer 9 is a solid structure embedded in the outline structure and at least one side end of the filler layer 9 is in contact with the inner surface of the lower (or upper) film substrate and/or the film, and this is and/or means that, since the film structure has a patterned or unpatterned structure as required, when the hollowed-out regions of the multi-layer pattern overlap, there is a case that the hollowed-out regions are in direct contact with the film substrate. The filler layer 9 is embedded in the profile structure with one side end flush with or having an extension enveloping the profile structure edge.

Fig. 5 and 6 show a schematic view of the filling of the filler layer 9 between the lateral and medial structures, from which it can be seen that the lateral and

medial structures

7 and 8 confine the filler layer 9 in a regular or irregular space. Fig. 7 and 8 show the bonded upper and lower film substrates, and the filler layer 9 is in close contact with the upper film substrate 1 and also with the lower film substrate 2 or the U-shaped bottom. While the sealed frame 5 is bonded with the upper film substrate 1 in a curing manner, the spacing structures 6 are also bonded with the upper film substrate 1, so that bonding firmness can be ensured even if the narrow sealed frame is narrow. Under the action of external force in pressing, bending, shearing or other forms, the sealing frame 5 can also effectively seal the liquid crystal box without leakage, thereby keeping the display performance unchanged.

As a further proposal, along the horizontal direction of the film substrate, the inner side structure 8 and the outer side structure 7 are formed by two closed or partially opened frame profiles which are nested inside and outside, and a columnar or other-shaped filling structure is arranged in the accommodating space of the profile structures.

The components of the photoresist mixture adopted by the outer side structure 7, the inner side structure 8 and the spacing structure 6 comprise an organic silicon mixture, a cross-linking agent, a solvent, a polymerization inhibitor, a defoaming agent, a surfactant, a photosensitizer, a stabilizer and a silane coupling agent containing primary amino, glycidoxypropyl, amino or epoxy.

The ultraviolet heat curing adhesive mixture adopted by the filler layer 9 comprises liquid epoxy resin, acrylate monomer and/or methacrylate monomer or oligomer thereof, latent epoxy curing agent, photo-free radical polymerization initiator and a mixture containing more than 2 thiol compounds per molecule, wherein the filler layer 9 is filled in the inner side structure 8 and the outer side structure 7 and is processed to form a sealing frame with the inner side structure 8, the outer side structure 7 and the filler layer 9.

The invention also discloses a manufacturing method of the micron narrow-frame liquid crystal display device, which is used for manufacturing the micron narrow-frame liquid crystal display device and comprises the following steps:

s2, preparing the contour structure and the spacer structure 6: selecting an upper (or lower) film substrate, coating a photoresist mixture on the inner surface of the film substrate by using spin and slit methods, and forming a profile structure and a spacing structure through precuring, exposing, developing by using an alkaline solution, cleaning and curing;

Example 1

A manufacturing method of a micron narrow-frame liquid crystal display device comprises the following specific material types and parameter settings:

s1, cleaning the upper or lower film base plate, the public electrode film and the orientation film attached to the inner surface of the upper (lower) film base plate, the active array film, the protective film and the orientation film attached to the inner surface of the lower (upper) film base plate, the driver film and the like; the electrode film comprises a transparent electrode film and a non-transparent electrode film, wherein the transparent electrode film is made of ITO, and the non-transparent electrode film is made of molybdenum, aluminum and molybdenum; the insulating film is made of silicon nitride; the alignment film used SE 2170.

S2, applying a mixed solution of an organosilicon mixture (9-11%), a cross-linking agent (0.39-0.47%), a solvent (78.4-94.6%), a polymerization inhibitor (0.24-0.28%), a defoaming agent (0.19-0.23%), a surfactant (0.18-0.22%), a photosensitizer (1.3-1.5%), a stabilizer (0.18-0.22%) and a silane coupling agent (1.17-1.43%) containing primary amino, glycidoxypropyl, amino or epoxy groups onto the inner surface of the upper or lower film substrate by using spin and slit methods. Slit followed by spin coating, drying under reduced pressure, edge or back cleaning in generalWashing, prebaking, etc. spin rotation number is 850-. This example uses aminophenyltrimethoxysilane, aminophenylethyltrimethoxysilane, aminophenylaminomethylphenylethyltrimethoxysilane, or a mixture thereof, which has a high heat resistance. The exposure intensity is set to 80-100mj/cm²The film is developed by using an alkaline solution such as tetramethylammonium hydroxide or potassium hydroxide, and the developing temperature is adjusted according to the beat and is required to be lower than the film pre-curing temperature.

Filling a mixture of liquid epoxy resin (50-70%), acrylate monomer and/or methacrylate monomer or oligomer thereof (33.3-40.7%), latent epoxy curing agent (0.9-1.1%), photo-radical polymerization initiator (0.9-1.1%) and compound containing more than 2 thiol groups per molecule (0.9-1.1%) into a space surrounded by the inner structure and the outer structure by using an ink-jet printing method, and adding a solvent to dilute the mixture according to the requirements of equipment; and heating to volatilize the solvent. If a photo-polymerizable material is introduced into the material forming the solid structure, in order to reduce the influence of ultraviolet light on the liquid crystal, a precise mask used in step S2 is used to block the irradiation.

S3, filling the four-bottle system mixture of MLC-13800-000, MLC-13800-100, MLC-13900-000 and MLC-13900-100 of Merck company into the space surrounded by the sealing frame by using a dropping method. The four liquid crystal proportions can be adjusted according to the required voltage and birefringence.

and S5, adhering the upper and lower film substrates after liquid crystal instillation, and pressing the liquid crystal box by using 0.08 atmosphere to form a uniform cholesteric liquid crystal layer with the thickness of approximately 4.5 mu m.

After photo-curing, the photo-curing is to ensure that the sealing frame has certain bonding strength, and then the photo-curing is carried out, so that the interval structure and the sealing frame are further firmly bonded with the upper film substrate and the lower film substrate or various films attached to the upper film substrate and the lower film substrate.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; the adjustment of the display device by changing the thickness of the thin film substrate, the density, height, material ratio, etc. of the outer structure 7, the inner structure 8 and the spacing structure 6 is within the protection scope of the present invention; although the present invention is designed in accordance with the requirements of a narrow bezel liquid crystal display device, it will be appreciated that other types of display devices, such as the narrow bezel configuration of an OLED display device, may also benefit. Those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A micro narrow bezel liquid crystal display device, the display device comprising: the thin film transistor comprises an upper thin film substrate, a lower thin film substrate, a common electrode thin film, an orientation film, an active array thin film, a protective film, an orientation film, a grid electrode, a source electrode lead thin film and a grid electrode driver thin film, wherein the upper thin film substrate and the lower thin film substrate are relatively parallel, and the common electrode thin film and the orientation film are attached to the inner surface of the upper thin film substrate and the lower thin film substrate; it is characterized in that the preparation method is characterized in that,

2. The liquid crystal display device with narrow micro-border according to claim 1, wherein the sealing border comprises an outer structure, an inner structure and a filler layer disposed between the outer and inner structures, the outer structure, the inner structure and the filler layer are formed by respectively processing a viscous photoresist mixture and an ultraviolet curing adhesive mixture, and the cured outer structure and the cured inner structure have a connection structure with a concave-convex mosaic with the filler layer.

3. The narrow bezel lcd device of claim 2, wherein at least one side end of the outline structure consisting of the inner and outer structures is in contact with the inner surface of the upper (or lower) film substrate and/or film and has a completely or partially hollow receiving space, the filler layer is a solid structure embedded in the outline structure and at least one side end of the filler layer is in contact with the inner surface of the lower (or upper) film substrate and/or film.

4. The micron narrow-bezel liquid crystal display device according to claim 3, wherein the inner structure and the outer structure are formed by two closed or partially open bezel outlines nested inside and outside along the horizontal direction of the film substrate, and a columnar or other-shaped filling structure is arranged in a containing space of the outline structure.

5. The liquid crystal display device with narrow micro-border according to claim 1, wherein the height of the sealing border and the spacer structure is 2-8 μm, the length, width and perimeter of the sealing border and the spacer structure can be the same or different, and the materials of the sealing border and the spacer structure can be the same or different.

6. The liquid crystal display device with narrow micro-frame as claimed in claim 2, wherein the photoresist mixture used for the outer, inner and spacer structures comprises silicone mixture, cross-linking agent, solvent, polymerization inhibitor, defoaming agent, surfactant, photosensitizer, stabilizer and silane coupling agent containing primary amino group, glycidoxypropyl group, amino group or epoxy group.

7. The narrow bezel of claim 6, wherein the filler layer is made of a UV curable adhesive mixture comprising a liquid epoxy resin, an acrylate monomer and/or a methacrylate monomer or an oligomer thereof, a latent epoxy curing agent, a photo radical polymerization initiator and a mixture containing 2 or more thiol compounds per molecule, and the filler layer is filled in the inner and outer structures and processed to form a sealed bezel having an inner structure, an outer structure and a filler layer.

8. The micro narrow-bezel liquid crystal display device according to claim 1, wherein the upper and lower film substrates have a thickness of less than 200 μm; one side of the source electrode adopts a wide sealing frame or a sealing frame with the same width as the other side, and the grid driver film attached to the inner surface of the lower film substrate is partially or completely covered by the sealing frame.

9. The narrow bezel LCD device of claim 3, wherein the filler layer is embedded in the outline structure with one side end flush with or having an extension that wraps around the outline structure edge.

10. A method for manufacturing a micron narrow bezel liquid crystal display device, characterized in that the method is used for manufacturing the micron narrow bezel liquid crystal display device of any one of claims 1-9, comprising the steps of: