200826820 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種導熱板構造，尤其是指—種可提供平衡 缓衝力之導熱板構造。 、 【先前技術】 _電腦設備内之中央處理單元晶片與功率積體電路等電子元科 會在執行運算過程時產生熱量，亦隨之升高工作溫度，由於工竹 溫度對於電腦設備是否#機的影響極大，所以為了^發熱^ 几件的作溫度並㈣有效運作，錢過縣設計來設計出各式 的散熱I置，例如練熱模組壓合於電路板上的巾央處理單元2 二’並鎖祕電路板，以使散熱模組能緊密接觸於中央處理單= 晶片’達到散熱的目的。 :麥閱「第i圖」與「第2圖」所示’一般而言，電路板瓜 二放熱模組施之間通常會具有多個相對應的螺絲孔。以供 W夠利糊件施麵散熱模組施緊密地細於電路板他 |而基於佈線、電性或是機械性質的考量，電路板收係提伊 配置£ ’中央處理單以片咖係位於此配置區内。 养然而，當使用者欲將散熱模組3〇a自電路板池上移除， 先崧脫一個鎖附元件5〇a，此時由於 、/、 能日目士 ^ '另外—個鎖附元件仍呈鎖附狀 2~^、”、附％之内應力，因此散熱模組3Ga被鬆脫的—端(如「第 默销㈣即她起，進而造成中央處理單獅2 脫之鎖附树⑽處會麵_物發生。雜地說= 200826820 用者將第-個鎖附件50a _時，使得散熱模組術一端不再受 !/如件5〇a之應力作用而趣起’但散熱模組施之其餘兩端則 仍又卿之應力作用而固定於電路板他，散熱模組施 與^央處理單元晶片20a之接觸區域外側部分因而會屋向中央處 理早π晶片20a ’甚至造成中央處理單元晶片池之被塵毁。 又如關專利公開號第US2〇〇4/〇l88〇79號專利案（以下簡稱 案）便提出一種應用於筆記型電腦晶片之散熱模組，請參閱 奶糸的「第2圖」所示，其中，複數個彈性材質所製成之塾片係 姉於複數個固定孔而設置於基座平台下方。在組裝散熱模組 %係利用後數個固定孔以將基座平台固定於晶片表面上方，而 以接觸面貼合於晶片之表面，同時，複數個墊片亦接觸於筆記型 電腦晶片之周圍，以提供一平衡緩衝力。〇79案雖於基座平台與晶 月之接觸區域外概有墊片，以在組裝過程巾職晶片免受基座 平台之壓傷，但由於各墊纽位於關定孔之輕位置上，並非 設置在基座平台於固定孔與晶片之間，當組裝者在拆除鎖固於基 座平台-端之_以鬆脫基座平㈣，基解台之鬆脫端不再受 到鎖固件之應力作用而翹起，而未拆除螺絲的另端則仍受到螺絲 之應力作用而固定於電路板，這將使得基座平台於固定孔與晶片 之間的區域會直接壓向中央處理單元晶片，中央處理單元晶片仍 有被壓毁的情事發生。 【發明内容】 ‘觀上摘揭露之習知技術，基座平台雖然設置有墊片，但 墊片並非錄在基座平台中@定孔與晶片之間，這使得基座平台 200826820 於此部份會直向中央處理單元晶片，無法充分保護晶片，仍 非導熱板之取佳設計，因而本發明在於提供—種可確實保護晶 之散熱模組。 +為了達成上述目的，本發明係揭示有導熱板構造，其固設於 ❺路板亚與-飾_以進行熱錢，導熱減構包含有一導 二、板本體賤广_件，其巾，導熱板本體具有複數細設點， 藉以口4包路板並接峨源，各岐點係位於導熱板本體與熱 原接觸區：^之外側。緩衝件係設置於導熱板與熱源接觸區域之外 側’且緩衝件之〶度係係實質等於導熱板本體與電路板之間距。 、，本發明再揭示有拆料熱板之辅具，導熱板係目設於一電路 板亚與夾置於其間之_熱源接觸以進行熱交換，辅具係包含有一 供使用者握持之柄部、二支撐臂與複數個缓衝件。其巾，各支擇 二i、自钵作邛延伸並穿設於導熱板固設位置與熱源之間，而各緩 ，件係设置於支射，並且介於支撐臂與電路板之間，緩衝件之 回度係貫質等於支撐臂與電路板之間距。 根據本發明所揭示之導熱板構造及拆除導熱板之輔具，當使 用者在拆除導熱板上之第一個鎖附件時，導熱板受到鬆脫而趣 起，其餘端仍受到鎖附件之應力作用而固定於電路板，但由於缓 衝件設置於導熱板之固設點與熱源之間，因此，導熱板其餘未鬆 脫之部分係會壓向緩衝件，而非壓向晶片，緩衝件因而能夠吸收 導熱板之墨迫力，以保護晶片免於受損。另外，亦可藉由設有緩 衝件之辅具來拆除導熱板，同樣能吸收導熱板壓迫於晶片之作用 力除了便於使用者操作外，亦能降低晶片在移除導熱板時受到 200826820 損壞的機率。 —、下在’、％方式情細敘述本發明之詳細特徵以及優點，其 2合足以使任何㈣相關技藝者了解本發明之技術内容並據以實 %、、且根據本明書所揭露之内容、_請專利範圍及圖式，任何 …白相關技蟄者可輕易地理解本發明相關之目的及優點。 【實施方式】 < ”為使對本發明的目的、構造、特徵、及其魏有進一步的瞭 解’茲配合實施例詳細說明如下。 ^根據本發明所揭示之導熱㈣造及拆除導熱板之輔具，導熱 板係與熱源相接觸，其中，熱源可以是中央處理單元晶片（c_ processingunit，CPU)、北橋晶片（N〇rthBndgeC一）與南橋晶 片（SouthBndgeCmp)等，然而並不以中央處理單元晶片、北橋 曰曰片14南橋晶片為限’諸如可產生熱量之積體電路晶片亦可應用 本發明所揭示之技術，在以下本發_詳細說明中，將以中央處 理單元晶片作為本發明之應用實施例。 請參閱「第3圖」，並合併參閱「第4A圖」與「第4B圖」 所示，本發明實施例之導熱板構造係固設於電路板10上並與中央 處理單元晶片20接觸以進行熱交換，導熱板構造包含有導熱板本 體W與至少一緩衝件40。導熱板本體30之外形在此係呈三角形， 亦可為等方形、正多邊形等其他幾何形狀，不以三角形為限。導 熱成本體30具有複數個固設點，各固設點之位置係位於導熱板本 肢30與中央處理單元晶片20之接觸區域外側，且各固設點係為 牙孔31而貫通導熱板本體30，以供複數個鎖附件5〇穿設，鎖附 8 200826820 例如為螺絲、螺巾轉。而電路板1G相應於導熱板本體％之 f_設有複數侧定孔η，在導驗本體3Q—端面貼 ;中央處理單2叫，各穿孔M與各固定孔η係為相對 一以供複數個_件5〇穿設而使得導熱板本體3()目定於電路 板10上。 緩衝件40仏史置於導熱板本體30與中央處理單元晶片20之 ί觸區域外側，在此，緩衝件4G位於導熱板本體30與中央處王田 晶片20之接觸區域以及導熱板本體3()之穿孔η間。再者， 4G之數目至少係為—，在導熱板本體3G欲自電路板10上 2…可先自相對於設有緩衝件40之一側拆裝，以達到緩衝的 时而在此 '缓衝件4〇數目係為二，在導熱板本體％欲自電 L反10上拆裝時，可任意選擇導熱板本❹之一側拆裝。此外， 盘=則_性元件，其厚度係實f上辦於導熱板本體30 /、二，板/之間距，且可用以填塞於導熱板本體3〇與電路板10 =門K㈣衝件40二端分別接觸至導熱板本體3()與電路板⑺。 ㈣件4G例如為電木、橡皮彈簧等不具有導電性質之彈性元件， 熱板本體30固設於電路板1〇時，緩衝件4〇常態具有一推 頂^熱板本體30之力。 日士料參閱「第3圖」、「第4A圖」與「第犯圖」所示’組装 二、穿孔31與各峡孔U相對應，各鎖附件50而能一 與各’孔11 ’以111定導熱板本體3G於電路板 、首相同％各緩衝件4〇係位於導熱板本體30與電路板！〇之間， h板本體30貼合於中央處理單元晶片2q上方，導熱板本體 200826820 jo因而可將中鱗理單元晶片2G所產生之熱量傳導至熱傳遞元 ’熱傳遞7L件再將熱量傳至散熱區以排除。而欲自電路板1〇上 拆裝導熱板本體30時，使用者可·工具拆除第—個鎖附件5〇 以鬆脫導敝本體料，導触本體3G之鬆脫賴科受到鎖 博5〇之應力作用而過起，而未拆除鎖附件5G的另端則仍受到 鎖附件50之應力仙續定於f路板ω，但藉由設置於導熱板本 體30與中央處理單元⑼2〇接觸區域外側之緩衝件务使得導 熱板本㈣未鬆脫端係會壓向緩衝件4〇，緩衝件4〇因而能夠吸 收導熱板本體30之壓迫力（如「第4B圖」所示）。 、請參閱「第4C圖」所示，但是缓衝件4〇之位置並不以前述 為限例如田^熱板本體3〇之外形為方形時，緩衝件亦可位 於導熱板本體30之穿孔31外，再舰前述步雜作以拆裝導熱 板本體30時，緩衝件40同樣能吸收導熱板本體％之壓迫力。 請參閱「第5圖」所示，係為本發明實施例之另—導熱板構 迨組衣於電路板之側視示意圖。其結構大致與前述相同，不同的 是緩衝件40,之賴_。前狀_件4G係為不具有導電性質 之彈性元件，而在此，緩衝件40’係為具有導電性質之彈彳生元件， 例如金屬彈簧等，並更設有絕緣塊60於緩衝件4〇,與電路板1〇之 間以防止緩衝件40’直接接觸電路板1〇,造成電路板1〇之短路。 另外，絕緣塊60之厚度加上缓衝件40’之厚度係實質相等於導熱 板本體30與電路板1〇之間距。 請參閱「第6圖」、「第7圖」、「第8A圖」與「第8B圖」所 示，本發明之拆除導熱板之輔具70，係應用於將導熱板3〇，自電路 10 200826820 板10上拆除。導熱板3〇,之外形 正多邊形等其他幾何形狀，不三角形’亦可為等方形、 位置係設有複數個貫通導熱板限。鱗熱板30,之固設 30,盥中本卢神。口/曰y q 牙孔，各牙孔係位於導熱板 .50 早^片2G _區域之外侧，並供複數個鎖附件 % W與瓣K)岐⑽ = 片20接觸以進行熱交換。 〕之中央處理早το曰曰 而辅具70係包含有柄部71與二支 :使:者以r或手工具操作握持，邮 (伸亚牙设於導熱板3〇,之穿孔位置盘中 … ，與樹臂72共同形成有中空; :二C Γ %設有一匹配於鎖附件50之定位槽76，以與鎖附 二互套接。侧72物__料 衝。 二::可包含有複數—^ 且以緩衝件73 *支樓臂72為兩獨立元件， 圖設置於支撐臂72她合成—_應關（如「第3 緩衝件72並介於各支撐臂72與電路板 之厚度加上各支撐臂72之古声孫每心 之間各_件73 之間距等於導熱板30,與電路板10 於導哉板30,於:件73係為彈性元件’以在各支禮臂72穿設 支=/力 間時’各緩衡件73常態具有-推頂各 命性f 緩衝件73可例如為電木、橡皮彈菩等不且有導 亦可為金屬彈菁等具有導電性質之彈性元 更咖緣塊於緩衝件73與電路㈣之間，以防止緩衝 200826820 件73直接接觸電路板，造成電路板之短路，在此，各緩衝件73 係以電木為其應用例。 請續參閱「第6圖」、「第7圖」、「第8A圖」與「第8β圖」 所示’導to 30,组裝於電路板10日夺，係使鎖附件％穿過各穿孔 與電路板10，以固定導熱板3〇,於電路板1〇上，且導敎板％，貼 合於中央纽單元^ 上方，導驗㈣而可射央處理單 凡晶片2〇職生之熱量料至熱傳遞元件，熱傳遞元件再將熱量 傳至散熱區以排除。而欲自電路板1〇上拆裝導熱板％，時，使用 者^木作輔具7〇之柄部71，以將二支撐臂72穿設於導熱板30, 牙孔’、中央處理單儿晶片2G之間，且各支撐臂W係位於導熱 反I與中央處理單晶片20觸區域以及導熱板30,之各穿孔間，並 于疋位；76與伽件5〇相卡合，以粒概％便於之後導熱 = 30’的雜’同時’各緩衝件73係位於各支撐㈣與電路板⑴ ^附^’魏拆除鎖附件50以鬆脫導熱板3〇,。當拆除第一個 用博叫’導熱板30,之鬆脫端因不再受到鎖附件％之應力作 二=，未拆除鎖附件5G的另端___ 之應力 臂72，ΐΓ_路板⑻但導熱板3G，之未鬆脫端係會麼向各支撐 迫力。，撐臂72上之各緩衝件73因而能夠吸收導熱板30,之壓 與中St:第Γ圖」所示’各支撐臂72在穿設於導熱板3〇, 之神為方ΓΓ片20時，其位置並不以上述為限。當導熱板抑 依昭前料^撐臂72亦可位於導熱板30,之各穿孔外，在 竭麵作以拆裝導熱板30,時，各支撐臂72上之緩衡件 12 200826820 73同樣能吸收導熱板30’之壓迫力。 根據前述，辅具70中：切f 72之姆距離係、制定不變， 右應用在不視格尺寸之中央處理單元^ 2q時，受限於又 臂72之相對距離，使得辅具70之適用性受到侷限，因此本^ 再揭示有拆除導熱板之輔具另一結構。 X乃 請參閱「第9圖」所示’輔具7〇之大致結構與前述相同 異在於各支射72與柄部7丨邮紐構，使得各支= 可相對滑_改姉距離。射，細柄部71設有 712，各支撑臂72相應於各導槽犯位置處設有-滑塊瓜為廣曰 用例，各滑塊722係可伸入且滑移於各導槽犯，如此，在將^ 據臂W穿設於導熱板30,之穿孔位置與中央處理單元晶片2〇 2 時’可視中央處理單元晶片20之尺寸’使用者而能調整二支擇臂 =之才晴距離，以增加適用性的範圍。再者，各支樓臂η亦可分 設有-導槽，柄部71相應於各導槽位置處設有二滑塊，各滑塊2 可伸入且滑移於各導槽，同樣能達到改變二支樓臂72相對距離之 目的，但此為相對應的凹凸關係，於此不再詳述。 雖然本發明之實施例揭露如上所述，然並非用以限定本發 明，任何熟習相藝者，在不_本發明之精神和範圍内 凡=本發日科請範圍所述之形狀、構造、特徵及精神當可做些言; 之又更’目此本發日狀專利傾範_視核明書 利範圍所界定者為準。 申5月專 【圖式簡單說明】 第1圖，習知技術之散熱模組組裝於電路板背視示意圖。 13 200826820 第2圖，習知技術之拆裝散熱模組側視示意圖。 弟3圖’本發明實施例之導熱板構造組裝於電路板之分解圖。 第4A圖，本發明實施例之導熱板構造組裝於電路板之組合 圖。 第4B圖’本發明實施例之拆裝散熱模組侧視示意圖。 第4C圖，本發明實施例之方形導熱板本體及緩衝件組裳於 電路板之背視示意圖。 第5圖，本發明實施例之另一導熱板構造組裝於電路板之側 視示意圖。 第6圖，本發明實施例之拆除導熱板之輔具立體外觀圖。 第7圖，本發明實施例之拆除導熱板之輔具組裝於電路板與 導熱板間背視示意圖。 第8A圖，本發明實施例之拆裝導熱板之輔具組裝於電路板 與導熱板間側視示意圖。 第8B圖，本發明實施例之拆裝導熱板之輔具應用於方形導 熱板且各支撐臂錄固雜置外歡f視示意圖。 第9圖，本發明實施例之另一拆除導熱板之輔具組裂於電路 板與導熱板間背視示意圖。 【主要元件符號說明】 習知技術 l〇a…·· 20a…·· 3〇a····· •電路板 •中央處理單元晶片 •散熱模組 14 200826820 50a.............................. ...............鎖附件 本發明 10................................ ...............電路板 11................................ ...............固定孔 20................................ ...............中央處理單元晶片 30................................ ...............導熱板本體 30,.............................. ...............導熱板 31................................ ...............穿孔 40、40,、73.............. ...............缓衝件 50................................ ...............鎖附件 60................................ ...............絕緣塊 70····............................ ...............輔具 71................................ 712.............................. ...............導槽 72................................ ...............支撐臂 722.............................. ...............滑塊 74................................ ...............中空部 75................................ ...............環牆 76................................ ...............定位槽 15200826820 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a thermally conductive plate construction, and more particularly to a thermally conductive plate construction that provides a balanced cushioning force. [Prior Art] _ The electronic processing unit such as the central processing unit chip and the power integrated circuit in the computer equipment generates heat during the calculation process, and also increases the operating temperature, because the temperature of the working bamboo is for the computer equipment. The impact is extremely great, so in order to heat the temperature of several pieces and (4) to operate effectively, Qian Guoxian designed to design various types of heat dissipation I, for example, the heat treatment module is pressed on the circuit board to handle the central processing unit 2 Two 'and lock the secret circuit board, so that the thermal module can be in close contact with the central processing unit = wafer 'to achieve the purpose of heat dissipation. : "Reading the "I" and "Figure 2" in general. Generally speaking, there are usually a plurality of corresponding screw holes between the circuit board and the heat release module. For the benefit of the paste, the heat dissipation module is applied tightly to the circuit board. Based on the consideration of wiring, electrical or mechanical properties, the circuit board is equipped with a Tie configuration. Located in this configuration area. However, when the user wants to remove the heat-dissipating module 3〇a from the circuit board, first remove a locking component 5〇a, at this time, due to, /, can the Japanese eye ^ 'additional - a locking component Still locked in the shape of 2~^,", with % internal stress, so the heat-dissipating module 3Ga is loosened - the end (such as "the second driver (four) that she starts, which causes the central processing of the single lion 2 off the lock Meeting at the tree (10) _ things happen. Miscellaneous = 200826820 The user will lock the attachment 50a _, so that the end of the heat-dissipation module is no longer subject to! / As the stress of the 5〇a is interesting, but The other ends of the heat-dissipating module are still fixed to the circuit board by the stress of the heat-dissipating module, and the heat-dissipating module is applied to the outer portion of the contact area of the wafer processing unit wafer 20a, and thus the house is processed toward the center π wafer 20a' even The central processing unit wafer pool is destroyed by dust. Also, as disclosed in the patent publication No. US2〇〇4/〇l88〇79 (hereinafter referred to as the case), a heat dissipation module applied to a notebook computer chip is proposed. Figure 2 of the milk thistle, in which a plurality of elastic materials are used to make the film system. a plurality of fixing holes are disposed under the base platform. The assembled heat dissipation module % utilizes a plurality of fixing holes to fix the base platform above the wafer surface, and the contact surface is attached to the surface of the wafer, and at the same time, the plurality The spacers are also in contact with the periphery of the notebook chip to provide a balanced cushioning force. In the case of 〇79, there is a gasket outside the contact area between the base platform and the crystal moon to protect the wafer from the base during the assembly process. The crushing of the platform, but because the pads are located in the light position of the closed hole, it is not disposed between the fixing hole and the wafer in the base platform, when the assembler is dismantled and locked on the platform-end of the base Loosen the base flat (4), the loose end of the base disengagement table is no longer lifted by the stress of the lock, and the other end of the unremoved screw is still fixed to the circuit board by the stress of the screw, which will make the base The area between the fixed hole and the wafer is directly pressed against the central processing unit chip, and the central processing unit chip is still crushed. [Summary of the Invention] The conventional technology of the observation and disclosure, the pedestal platform although The gasket is placed, but the gasket is not recorded between the fixed hole and the wafer in the base platform. This makes the base platform 200826820 directly to the central processing unit wafer in this part, which cannot fully protect the wafer, and is still not a heat conducting plate. The present invention is directed to providing a heat dissipation module capable of reliably protecting crystals. In order to achieve the above object, the present invention discloses a heat conduction plate structure which is fixed to a circuit board. Hot money, thermal conduction reduction includes a guide, the body of the plate is wide, and the towel, the body of the heat-conducting plate has a plurality of fine points, so that the port 4 is connected to the source, and the points are located on the body of the heat-conducting plate and the heat The original contact area: the outer side of the ^. The buffering member is disposed on the outer side of the contact area of the heat conducting plate and the heat source' and the twisting system of the cushioning member is substantially equal to the distance between the main body of the heat conducting plate and the circuit board. The auxiliary plate of the hot plate, the heat conducting plate system is disposed on a circuit board sub-contact with the heat source sandwiched therebetween for heat exchange, the auxiliary device includes a handle portion for the user to hold, two support arms and a plurality of Buffer. The towel, each of which is selected from the second, extends and is disposed between the fixed position of the heat conducting plate and the heat source, and each of the slow parts is disposed in the branch and is interposed between the support arm and the circuit board. The backlash of the cushioning member is equal to the distance between the support arm and the circuit board. According to the heat conduction plate structure and the auxiliary device for removing the heat conduction plate disclosed by the present invention, when the user removes the first lock attachment on the heat conduction plate, the heat conduction plate is loosened and the other end is still stressed by the lock attachment. The function is fixed on the circuit board, but since the buffer member is disposed between the fixing point of the heat conducting plate and the heat source, the remaining unreleased portion of the heat conducting plate is pressed against the buffer member instead of pressing against the wafer, the buffer member Therefore, it is possible to absorb the ink force of the heat conducting plate to protect the wafer from damage. In addition, the heat-conducting plate can be removed by the auxiliary device provided with the buffering member, and the force of the heat-conducting plate pressed against the wafer can be absorbed. In addition to facilitating the user's operation, the wafer can be damaged by the damage of the 200826820 when the heat-transfer plate is removed. Probability. The detailed features and advantages of the present invention are described in the '%' manner, which is sufficient for any (4) related artisan to understand the technical content of the present invention and to disclose it according to the present disclosure. The contents, the scope of the patent and the drawings, any of the white related art can easily understand the related objects and advantages of the present invention. [Embodiment] The following is a detailed description of the purpose, structure, features, and advantages of the present invention. The heat conduction (four) fabrication and removal of the heat-conducting plate are disclosed in accordance with the present invention. The heat conducting plate is in contact with the heat source, wherein the heat source may be a central processing unit chip (CPU), a north bridge chip (N〇rthBndgeC1), a south bridge chip (SouthBndgeCmp), etc., but not a central processing unit chip. The north bridge wafer 14 south bridge wafer is limited to such a heat-generating integrated circuit wafer. The technology disclosed in the present invention can also be applied. In the following detailed description, a central processing unit wafer will be used as the application of the present invention. For example, please refer to "FIG. 3" and refer to "FIG. 4A" and "FIG. 4B". The heat conducting plate structure of the embodiment of the present invention is fixed on the circuit board 10 and is processed with the central processing unit chip. 20 contacts for heat exchange, the heat conducting plate construction comprising a heat conducting plate body W and at least one buffer member 40. The outer shape of the heat conducting plate body 30 is triangular in this shape, and may be other geometric shapes such as an equilateral square and a regular polygon, and is not limited to a triangle. The heat-conducting cost body 30 has a plurality of fixing points, and the positions of the fixing points are located outside the contact area between the heat-radiating plate body 30 and the central processing unit wafer 20, and each fixing point is the tooth hole 31 and penetrates the heat-conducting plate body. 30, for a plurality of lock attachments 5 〇, the lock 8 200826820 For example, screws, spirals turn. The circuit board 1G is provided with a plurality of side holes η corresponding to the heat source plate body f_, and is attached to the guide body 3Q-end face; the central processing unit 2 is called, and each of the holes M and the fixed holes η are opposite one for the A plurality of pieces are placed so that the heat conducting plate body 3 () is positioned on the circuit board 10. The buffer member 40 is disposed outside the contact area of the heat conducting board body 30 and the central processing unit wafer 20, wherein the buffering member 4G is located at a contact area between the heat conducting board body 30 and the central Wangtian wafer 20 and the heat conducting board body 3 ( ) between the perforations η. Furthermore, the number of 4G is at least -, and the heat-conducting plate body 3G is intended to be detached from the side of the circuit board 10 with respect to the side of the buffer member 40 to be buffered. The number of pieces 4〇 is two. When the main body of the heat conducting plate is to be disassembled from the electric L, the one side of the heat conducting plate can be arbitrarily selected and disassembled. In addition, the disk = the _ sex element, the thickness of which is on the heat conduction plate body 30 /, two, plate / spacing, and can be used to fill the heat conduction plate body 3 电路 and the circuit board 10 = door K (four) punch 40 The two ends are respectively in contact with the heat conducting plate body 3 () and the circuit board (7). (4) The member 4G is, for example, an elastic member having no conductive property such as bakelite or rubber spring. When the hot plate body 30 is fixed to the circuit board 1 , the buffer member 4 has a force for pushing the hot plate body 30. For the Japanese materials, please refer to "3", "4A" and "figure map" as shown in the 'Assembly 2', the perforations 31 correspond to the respective Gorge holes U, and each lock attachment 50 can be used with each 'hole 11'. 'Set the heat-conducting plate body 3G to 111 on the circuit board, the first and the same, each buffer member 4 is located on the heat-conducting plate body 30 and the circuit board! Between the 〇, the h-plate body 30 is attached to the central processing unit wafer 2q, and the heat-conducting plate body 200826820 jo can thereby transfer the heat generated by the middle squaring unit wafer 2G to the heat transfer element 'heat transfer 7L pieces and then pass the heat Remove to the heat sink area. When the heat-conducting plate body 30 is to be detached from the circuit board 1 , the user can remove the first lock accessory 5 to loosen the guiding body material, and the guiding body 3G is released by Lai Ke. The stress of the cymbal is over, and the other end of the lock attachment 5G is still removed by the stress of the lock attachment 50, but is contacted by the central processing unit (9) 2 by the heat transfer plate body 30. The buffering member on the outer side of the region causes the unsealed end of the heat conducting plate (4) to be pressed against the cushioning member 4, and the cushioning member 4 can absorb the pressing force of the heat conducting plate body 30 (as shown in "Fig. 4B"). Please refer to the "4C figure", but the position of the cushioning member 4〇 is not limited to the above. For example, when the shape of the hot plate body 3 is square, the cushioning member may also be located in the perforation of the heat conducting plate body 30. In addition, when the foregoing step is repeated to disassemble the heat conducting plate body 30, the cushioning member 40 can also absorb the pressing force of the heat conducting plate body. Please refer to FIG. 5, which is a side view of the heat-conducting plate assembly on the circuit board according to an embodiment of the present invention. The structure is substantially the same as described above, except that the cushioning member 40 is used. The front piece 4G is an elastic element having no conductive property, and here, the cushioning member 40' is an elastic generating element having a conductive property, such as a metal spring or the like, and further provided with an insulating block 60 on the cushioning member 4. 〇, and the circuit board 1〇 to prevent the buffer member 40' from directly contacting the circuit board 1〇, causing a short circuit of the circuit board 1〇. Further, the thickness of the insulating block 60 plus the thickness of the buffer member 40' is substantially equal to the distance between the heat conducting plate body 30 and the circuit board 1''. Please refer to "Fig. 6", "Fig. 7", "8A" and "8B". The auxiliary device 70 for removing the heat conducting plate of the present invention is applied to the heat conducting plate 3, from the circuit. 10 200826820 Removed from board 10. The heat conducting plate has 3 〇, other geometric shapes such as a regular polygon, and the non-triangle may also be an equilateral square, and the position is provided with a plurality of through-heat conduction plates. Scaled hot plate 30, fixed 30, 盥中本卢神. Mouth / 曰 y q The perforations, each of which is located on the heat-conducting plate. 50 The outer side of the 2G _ area is provided, and a plurality of lock attachments % W are in contact with the flap K) 岐 (10) = the sheet 20 for heat exchange. The central processing of the early το曰曰 and the auxiliary device 70 series includes the handle 71 and the two branches: so that the person holds the handle with r or hand tool, and the postal (the sub-tooth is placed on the heat-conducting plate 3〇, the perforated position plate) The middle ... is formed with the tree arm 72 to have a hollow; the second C Γ % is provided with a positioning groove 76 matched with the lock attachment 50 to be nested with the lock attachment 2. The side 72 is __ material flush. Including the plural - ^ and the buffer member 73 * the branch arm 72 as two independent components, the figure is set on the support arm 72, she is synthesized - _ should be closed (such as "the third buffer member 72 and between the support arm 72 and the circuit board The thickness of each of the support arms 72 is the same as that of the heat conduction plate 30, and the circuit board 10 is connected to the guide plate 30, and the member 73 is an elastic member. When the arm 72 is pierced by the branch = / between the forces, the respective balance members 73 have a normal state - the push-ups of the fateness f. The buffer member 73 can be, for example, a bakelite, a rubber bullet, or the like. The elastic element of the conductive property is interposed between the buffering member 73 and the circuit (4) to prevent the buffering of the 200826820 piece 73 from directly contacting the circuit board, thereby causing a short circuit of the circuit board, where each buffering The article 73 is based on Bakelite. Please continue to refer to the "Picture 6", "Picture 8", "8A" and "8β" diagrams. In the case of the sun, the lock attachment % is passed through each of the perforations and the circuit board 10 to fix the heat conducting plate 3 〇 on the circuit board 1 ,, and the guide plate %, fits over the central button unit ^, the test (4) The heat can be processed by the heat treatment element, and the heat transfer element is transferred to the heat dissipation area to be removed. However, if the heat transfer plate is removed from the circuit board, the user The shank 71 of the wooden tool auxiliaries 7 is configured to pass the two support arms 72 between the heat conducting plate 30, the dental hole ', and the central processing unit wafer 2G, and each supporting arm W is located at the heat conducting reverse I and the center. Processing the single-tap 20-touch area and the heat-conducting plate 30, and between the perforations, and in the clamping position; 76 and the gamma 5 卡 are engaged with each other to facilitate the subsequent heat conduction = 30' of the hybrid 'simultaneous' buffer members 73 The system is located in each support (four) and the circuit board (1) ^ attached ^ 'We removed the lock attachment 50 to loosen the heat-conducting plate 3 〇, when the first one is removed by the use of the heat-conducting plate 30, the loose end No longer subject to the stress of the lock attachment %==, the stress arm 72 of the other end ___ of the lock attachment 5G, the ΐΓ_road plate (8) but the heat-dissipating plate 3G, the unreleased end will be forced to the support. The buffering members 73 on the arms 72 are thus capable of absorbing the heat conducting plate 30, and the pressure and the middle St: the respective supporting arms 72 are disposed on the heat conducting plate 3, and the gods are the square pieces 20 The position of the heat-conducting plate is not limited to the above. When the heat-conducting plate is restrained, the support arm 72 can also be located outside the perforated plate of the heat-conducting plate 30, and when the heat-dissipating plate 30 is removed and removed, each support The weighting member 12 200826820 73 on the arm 72 can also absorb the pressing force of the heat conducting plate 30'. According to the foregoing, in the auxiliary device 70, the distance of the f-72 is determined, and the right is applied to the central processing unit 2q of the non-view size, which is limited by the relative distance of the arm 72, so that the auxiliary device 70 The applicability is limited, and therefore another structure of the auxiliary device for removing the heat conducting plate is disclosed. X is the same as the above, and the general structure of the auxiliary device 7〇 is the same as the above. The difference between the respective branches 72 and the handle 7 is that the branches can be relatively slid. The ejector portion 71 is provided with a 712, and each of the support arms 72 is provided at a position corresponding to each of the guide slots. The slider is a wide-opening use case, and each of the sliders 722 can extend into and slide over the guide slots. In this way, when the arm W is inserted into the heat conducting plate 30 and the punching position and the central processing unit wafer 2〇2, the user can adjust the size of the central processing unit wafer 20 to adjust the two arm selections. Distance to increase the range of applicability. Furthermore, each of the arm arms η can also be provided with a guide groove, and the handle portion 71 is provided with two sliders corresponding to the positions of the guide channels, and each of the sliders 2 can extend into and slide over the guide channels, and can also The purpose of changing the relative distance between the two legs 72 is achieved, but this is the corresponding concave-convex relationship, which will not be described in detail herein. Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and any person skilled in the art, without departing from the spirit and scope of the present invention, shall have the shape, structure, and structure described in the scope of the present application. The characteristics and spirit can be said in some ways; the more the purpose of this is to define the scope of the patent. Shen May special [Simplified illustration] Figure 1, the heat dissipation module of the prior art is assembled on the back view of the circuit board. 13 200826820 Fig. 2 is a side view showing the disassembly and assembly of the heat dissipating module of the prior art. 3 is an exploded view of the heat conducting plate structure of the embodiment of the present invention assembled on a circuit board. Fig. 4A is a combination view showing the structure of a heat conducting plate according to an embodiment of the present invention assembled on a circuit board. 4B is a side view showing the disassembly and assembly heat dissipation module of the embodiment of the present invention. 4C is a schematic rear view of the square heat conducting plate body and the buffer member of the embodiment of the present invention. Fig. 5 is a side elevational view showing another heat conducting plate structure of the embodiment of the present invention assembled to a circuit board. Fig. 6 is a perspective view showing the auxiliary device for removing the heat conducting plate according to the embodiment of the present invention. Fig. 7 is a rear view showing the assembly of the auxiliary device for removing the heat conducting plate in the embodiment of the present invention between the circuit board and the heat conducting plate. 8A is a side view showing the auxiliary device of the disassembling and heat conducting plate of the embodiment of the present invention assembled between the circuit board and the heat conducting plate. In Fig. 8B, the auxiliary device for disassembling and disassembling the heat conducting plate according to the embodiment of the present invention is applied to a square heat conducting plate, and each supporting arm is recorded and fixed. FIG. 9 is a schematic cross-sectional view showing the auxiliary device of the heat dissipating plate removed from the circuit board and the heat conducting plate in the embodiment of the present invention. [Explanation of main component symbols] Conventional technology l〇a...·· 20a...·· 3〇a····· • Circuit board • Central processing unit chip • Thermal module 14 200826820 50a........ ........................................Lock attachments of the invention 10....... ..........................................Circuit board 11........ ..........................................Fixed holes 20........ .......................................... central processing unit wafer 30... ............................................thermal plate body 30,... ............................................thermal plate 31... ............................................Perforation 40, 40,, 73.. .............................. cushioning parts 50................... ...............................Lock attachment 60................... ...............................Insulation block 70····............... ...............................Auxiliary equipment 71................... ............. 712.................................... ......... Guide groove 72...................................... .........support arm 722................................................slider 74. ................................................. hollow 75. .................................................ring wall 76. .................................................Positioning groove 15