TW200826154A - Exposure apparatus and device manufacturing method - Google Patents

Exposure apparatus and device manufacturing method Download PDF

Info

Publication number
TW200826154A
TW200826154A TW096128626A TW96128626A TW200826154A TW 200826154 A TW200826154 A TW 200826154A TW 096128626 A TW096128626 A TW 096128626A TW 96128626 A TW96128626 A TW 96128626A TW 200826154 A TW200826154 A TW 200826154A
Authority
TW
Taiwan
Prior art keywords
substrate
optical system
detector
mark
surface position
Prior art date
Application number
TW096128626A
Other languages
English (en)
Chinese (zh)
Inventor
Shinichiro Hirai
Tetsuya Mori
Seiya Miura
Yoshinori Ohsaki
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of TW200826154A publication Critical patent/TW200826154A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026—Focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7034—Leveling
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW096128626A 2006-08-08 2007-08-03 Exposure apparatus and device manufacturing method TW200826154A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006216261A JP2008042036A (ja) 2006-08-08 2006-08-08 露光装置及びデバイス製造方法

Publications (1)

Publication Number Publication Date
TW200826154A true TW200826154A (en) 2008-06-16

Family

ID=39050394

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096128626A TW200826154A (en) 2006-08-08 2007-08-03 Exposure apparatus and device manufacturing method

Country Status (4)

Country Link
US (1) US8130360B2 (enExample)
JP (1) JP2008042036A (enExample)
KR (1) KR100898441B1 (enExample)
TW (1) TW200826154A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8068211B2 (en) * 2007-07-06 2011-11-29 Canon Kabushiki Kaisha Exposure apparatus and method for manufacturing device
KR100971322B1 (ko) 2008-08-21 2010-07-20 주식회사 동부하이텍 반도체 소자 제조용 노광장치
NL2003331A (en) * 2008-09-02 2010-03-12 Asml Netherlands Bv Device manufacturing method, control system, computer program and computer-readable medium.
TWI418914B (zh) * 2010-03-31 2013-12-11 Pixart Imaging Inc 適用於光感測系統之失焦校正模組及其方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56130707A (en) * 1980-03-18 1981-10-13 Canon Inc Photo-printing device
JPH0743245B2 (ja) * 1987-07-03 1995-05-15 キヤノン株式会社 アライメント装置
US5331371A (en) * 1990-09-26 1994-07-19 Canon Kabushiki Kaisha Alignment and exposure method
JP3109852B2 (ja) * 1991-04-16 2000-11-20 キヤノン株式会社 投影露光装置
JP3183046B2 (ja) * 1994-06-06 2001-07-03 キヤノン株式会社 異物検査装置及びそれを用いた半導体デバイスの製造方法
US5751404A (en) * 1995-07-24 1998-05-12 Canon Kabushiki Kaisha Exposure apparatus and method wherein alignment is carried out by comparing marks which are incident on both reticle stage and wafer stage reference plates
JP4136067B2 (ja) * 1997-05-02 2008-08-20 キヤノン株式会社 検出装置及びそれを用いた露光装置
JP4261689B2 (ja) 1999-07-01 2009-04-30 キヤノン株式会社 露光装置、当該露光装置に対して用いられる方法、及び当該露光装置を用いたデバイスの製造方法
JP2001332490A (ja) 2000-03-14 2001-11-30 Nikon Corp 位置合わせ方法、露光方法、露光装置、及びデバイス製造方法
US20020021433A1 (en) * 2000-03-24 2002-02-21 Shinichi Okita scanning exposure apparatus
JP2002093691A (ja) * 2000-09-20 2002-03-29 Canon Inc 露光装置、結像性能測定方法、デバイス製造方法、半導体製造工場および露光装置の保守方法
JP2003084189A (ja) * 2001-09-07 2003-03-19 Canon Inc オートフォーカス検出方法および投影露光装置
JP5002100B2 (ja) * 2001-09-13 2012-08-15 キヤノン株式会社 焦点位置検出方法及び焦点位置検出装置
JP3780221B2 (ja) * 2002-03-26 2006-05-31 キヤノン株式会社 露光方法及び装置
JP4227402B2 (ja) * 2002-12-06 2009-02-18 キヤノン株式会社 走査型露光装置
JP4174324B2 (ja) * 2003-01-06 2008-10-29 キヤノン株式会社 露光方法及び装置
US7154582B2 (en) * 2003-02-14 2006-12-26 Canon Kabushiki Kaisha Exposure apparatus and method
JP4497908B2 (ja) * 2003-12-15 2010-07-07 キヤノン株式会社 露光方法及び装置
JP2005175407A (ja) * 2003-12-15 2005-06-30 Canon Inc 計測方法及び装置、それを利用した露光方法及び装置、並びに、デバイス製造方法

Also Published As

Publication number Publication date
KR20080013772A (ko) 2008-02-13
US20080036990A1 (en) 2008-02-14
US8130360B2 (en) 2012-03-06
KR100898441B1 (ko) 2009-05-21
JP2008042036A (ja) 2008-02-21

Similar Documents

Publication Publication Date Title
JP4029183B2 (ja) 投影露光装置及び投影露光方法
KR100875008B1 (ko) 노광장치 및 디바이스 제조방법
US7528966B2 (en) Position detection apparatus and exposure apparatus
TWI476538B (zh) 定位測量系統及微影裝置
JP4006217B2 (ja) 露光方法、露光装置及びデバイスの製造方法
TWI390373B (zh) 傳送基板之方法、電腦可讀媒體及傳送系統
CN106104382A (zh) 传感器系统、衬底输送系统和光刻设备
JP3880155B2 (ja) 位置決め方法及び位置決め装置
TW202028693A (zh) 測量裝置、測量系統、曝光裝置及測量方法
JP2004014876A (ja) 調整方法、空間像計測方法及び像面計測方法、並びに露光装置
JP4924421B2 (ja) センサの校正方法、露光方法、露光装置、デバイス製造方法、および反射型マスク
JP5641210B2 (ja) 露光装置、露光方法及びデバイス製造方法
TW200826154A (en) Exposure apparatus and device manufacturing method
JP2017215556A (ja) マーク検出装置、露光装置、デバイス製造方法、及びマーク検出方法
WO1999050893A1 (en) Exposure method and exposure system
JP4078683B2 (ja) 投影露光装置及び投影露光方法並びに走査露光方法
JP3754743B2 (ja) 表面位置設定方法、ウエハ高さ設定方法、面位置設定方法、ウエハ面位置検出方法および露光装置
JPH10284393A (ja) 露光装置およびデバイス製造方法
JP6748907B2 (ja) 計測装置、露光装置、デバイス製造方法、及びパターン形成方法
JP7538790B2 (ja) 露光装置、露光方法及び物品の製造方法
TW527638B (en) Evaluating method of lithography system, adjusting method for substrate-processing apparatus, lithography system and exposure apparatus
JP3428825B2 (ja) 面位置検出方法および面位置検出装置
JPH1140493A (ja) 走査型露光装置およびデバイス製造方法
JPH104055A (ja) 自動焦点合わせ装置及びそれを用いたデバイスの製造方法
JP2005311198A (ja) 露光装置、合焦位置検出装置及びそれらの方法、並びにデバイス製造方法