TW200822300A - Memory card - Google Patents
Memory card Download PDFInfo
- Publication number
- TW200822300A TW200822300A TW096110381A TW96110381A TW200822300A TW 200822300 A TW200822300 A TW 200822300A TW 096110381 A TW096110381 A TW 096110381A TW 96110381 A TW96110381 A TW 96110381A TW 200822300 A TW200822300 A TW 200822300A
- Authority
- TW
- Taiwan
- Prior art keywords
- memory card
- chip package
- package
- tabs
- bottom wall
- Prior art date
Links
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07732—Physical layout of the record carrier the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Semiconductor Memories (AREA)
Abstract
Description
200822300 九、發明說明: 【發明所屬之技術領域】 本發明係關於記憶卡。 【先前技術】 已提供有一種具有可更新資料之快閃記憶體,將資料寫 入該快閃記憶體或讀出之記憶卡。200822300 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a memory card. [Prior Art] A flash memory having updatable data has been provided to write data into the flash memory or read the memory card.
Ο 作為如此之圮憶卡,提供有一種由外殼和矩形之多晶片 封哀形成矩形之薄板狀之記憶卡,其外殼由絕緣材料構 成並在構成厚度方向之一側之面之上面形成上方成開放 狀之平視矩形之收容凹部而可裝卸於外部裝置之插槽(卡 槽或卡連接器)上;該多晶片封裝係包含有用於與外部裝 置之間傳遞信唬之複數個接片及快閃記憶體且收容於前述 收容凹部(參照曰本特開2〇〇1_338274號公報)。 在该記憶卡,外殼之收容凹部具有矩形之底壁,及分別 自底壁之4邊竪起之4個側壁,可將手指按在4個側壁中之i 個’完成記憶卡對外部裝置插槽之裝卸。 、年來由於對記憶卡之記憶容量增大之要求,裝 入多晶片封裝内之快閃記憶體之尺寸增大,多晶片封裝: 外形尺寸增大。 t 另一方面’由於外殼之外形尺寸由記憶卡之規格決定, 故外殼之凹部中可收容之多晶片封裝之大小有p艮,在對應 。己隐卡之纪憶容量增大化上不利。 心 本毛月係#於如此情形而完成者,其目的在於提供 記憶卡’其係在對應記憶容量增大化上有利者。 116906.doc 200822300 【發明内容】 成上述目的,本發明之記憶卡之特徵為:由外殼和 夕曰曰片封裝形成矩形之薄板狀,料㈣由 成,並在厚度方向之-側之面之上面形成收容凹部且3 置之插槽者;該多晶片封裝係具有用於與前述 外以置之間傳遞信號之複數個接片,並收容於前述收容 凹部者;前述外殼具有矩形之底壁 中之3邊堅起之側壁;前述收容凹部壁之4邊 辟 U〇丨猎由則述底壁及3個側 1上方及侧方形成開放狀;前述多晶片封襄在前述收容 二延伸至:述底壁全域;前述複數個接片設於前述收 所之前述多晶片封裳之上面;在前述底壁之 外殼之/λ:述側壁之1邊所對應之位置,在構成前述 用凹部向之另外一側之面之下面之位置,設有指按 Ο 置插择^月之°己憶卡’其特徵為具傷··可裝卸於外部裝 «之由絕緣材料構成之矩形薄板狀^ 前述封裝上,用於與前述外部褒置之間傳遞㈡之^於 =前述複數個接片係在前述封裝之厚度二二! 之方二上前述外部_卸之方向正交 前述裝卸方向正:之; 述矩形之_之2邊;對應二有前=個接片之前 厚度方向之另外1 ㈣成雨述封裝之 部。 之面之下面之位置,設有指按用凹 116906.doc 200822300 基於本發明之記憶卡,在外殼上形成之凹部内 晶片封裝延伸至整個底壁,所以與先伽,可確伴 片封裝之面積增大至拆除1個側壁之份,從而,即便:: =記憶卡大小㈣,仍可獲得具有記憶容量增大而㈣ 、亦&大之夕Β0片封裝之記憶卡,在對應記憶容量增大 化上有利。 又’因為取代先前之指按用之⑽側壁而在外殼下面…Ο As such a memory card, there is provided a memory card having a rectangular thin plate shape formed by a casing and a rectangular multi-wafer, the outer casing of which is made of an insulating material and formed on the upper side of the surface constituting one side in the thickness direction. The open-plan rectangular rectangular receiving recess is detachable from a slot (card slot or card connector) of the external device; the multi-chip package includes a plurality of tabs for transmitting a signal between the external device and The flash memory is housed in the housing recess (refer to Japanese Patent Application Laid-Open No. Hei. No. Hei. In the memory card, the housing recess of the outer casing has a rectangular bottom wall, and four side walls respectively erected from the four sides of the bottom wall, and the fingers can be pressed into the four of the four side walls to complete the insertion of the memory card to the external device. Loading and unloading of the tank. In recent years, due to the increased memory capacity of memory cards, the size of flash memory incorporated in multi-chip packages has increased, and multi-chip packages have increased in size. On the other hand, the size of the outer casing is determined by the size of the memory card, so that the size of the multi-chip package that can be accommodated in the recess of the outer casing is p艮. It is unfavorable to increase the capacity of the hidden card. The heart of the month is completed in such a case, and the purpose thereof is to provide a memory card, which is advantageous in terms of increasing the memory capacity. 116906.doc 200822300 SUMMARY OF THE INVENTION In order to achieve the above object, the memory card of the present invention is characterized in that a rectangular thin plate shape is formed by the outer casing and the matte sheet, and the material (4) is formed and formed on the side of the thickness direction. a plurality of sockets for receiving a recessed portion and having a plurality of tabs for transmitting signals between the outer surface and the receiving recess; the outer casing has a rectangular bottom wall The side wall of the three sides is fixed; the four sides of the wall of the receiving recess are formed by the bottom wall and the three sides 1 and the side of the side are open; the multi-chip sealing is extended to the above-mentioned housing 2 The plurality of tabs are disposed on the top surface of the multi-wafer cover of the receiving body; and the recessed portion is formed at a position corresponding to one side of the outer wall of the bottom wall of the bottom wall To the position below the other side of the face, there is a rectangular thin plate made of insulating material with a finger press to insert the moon's memory card, which is characterized by an injury and a removable outer casing. ^ on the aforementioned package, used for the aforementioned external Pass between the two sets (2) ^ The number of the above-mentioned plurality of tabs is two or two in the thickness of the aforementioned package! On the second side, the direction of the external _ unloading is orthogonal. The direction of the loading and unloading is positive: the two sides of the rectangle; the two are before the front = one of the tabs; the other one in the thickness direction (four) is the part of the package. The bottom surface of the surface is provided with a recessed 116906.doc 200822300 memory card according to the present invention, and the inner chip package is formed in the recess formed on the outer casing to extend to the entire bottom wall, so that the first package can be packaged with the first package. The area is increased to remove one side wall, so that even if: = = memory card size (four), a memory card with a memory capacity increase and (4), also & It is advantageous to increase the size. Also, because it replaces the front side of the (10) side wall and is under the outer casing...
置有指按用㈣,❹可簡單地進行記憶卡之裝卸,又Γ 由'可抑制形成指按凹部之金屬模具之成本,因此在謀求 降低冗憶卡之成本上亦為有利。 土於本t明之c憶卡,不使用外殼而僅以封裝構成 記憶卡’在謀求降低記憶卡之成本上為有利。 為在封破之下面設有指按用凹部,所以可簡單地 進订Z It卡之裝卸’又,由於可抑制形成指按凹部之金屬 权具之成本’因此在謀求降低記憶卡之成本上為有利。 【實施方式】 (第1實施形態) 下面參照圖式説明本發明之第i實施形態。 圖1係記憶卡U)之立體圖,圖2係將記憶卡1()之上下反轉 之立體圖,圖3、圖4係記憶卡10之分解立體圖,圖5係圖i 之AA線剖面圖。 另’在本説明書,記憶卡10係Memory Stick Micro (SONY股份公司之註冊商標)。 如圖1乃至圖4所千,~卜立上 厅不兄k、卡1〇係由外殼12及矩形多晶片 116906.doc 200822300 封裝14形成矩形之薄板狀,該外殼12係由絕緣材料構成, 並在構成厚度方向之一側之面之上面形成收容凹部Μ ;該 多晶片封裝14係收容於收容凹部16。 作為構成外殼12之絕緣材料,可採用例如聚碳酸酯、聚 對本一甲酸二丁商等熱塑性樹脂。 如此之外殼12由在金屬模具内傾入前述熱塑性樹脂而製 成。 〇 如圖3所示,外殼12具有矩形之底壁2〇,及自底壁2〇之4 邊中之3邊竪起之側壁22,該等側壁22中之2個側壁22 A相 對,其餘1個側壁22B與該等2個側壁22A之一侧之端部連 接。 另’相對之2個側壁22A沿與記憶卡1 〇朝外部裝置之插槽 裝卸之方向平行之方向延伸,其餘1個側壁22B沿與記憶卡 10朝外部裝置之插槽裝卸之方向正交之方向延伸。 收容凹部16藉由底壁20和3個側壁22在上方及側方形成 (J 開放狀。 在相對之側壁22A之外側面形成有在該記憶卡丨〇插入設 於外部裝置之插槽時用以嵌合住將記憶卡1 〇之插入狀態鎖 住之鎖住機構的嵌合凹部22 1 0。 多晶片封裝14在收容凹部16内延伸至整個底壁20。 並且,如圖2所示,記憶卡1〇之4個側面中之3個側面由 外殼12之側壁22 (22A、22B)構成,其餘1個側面由底壁20 之端面2002、相對之2個側壁22A之端面2204、及收容凹部 16所收容之多晶片封裝14之側面1402構成。 116906.doc 200822300 構成其餘1個側面之底壁20之端面2〇〇2、 ^ ® 2204 ^ A ^ 000 Η 44 ^ 1 , ^ y ! 則壁 22A之With the reference (4), the memory card can be easily loaded and unloaded, and the cost of forming the metal mold of the finger recess can be suppressed. Therefore, it is also advantageous to reduce the cost of the memory card. It is advantageous to reduce the cost of the memory card by using a memory card without using a casing and using only a package. In order to provide a finger recess for the underside of the seal, the loading and unloading of the Z It card can be easily made. In addition, since the cost of forming the metal fastener of the finger recess can be suppressed, the cost of the memory card is reduced. For the benefit. [Embodiment] (First Embodiment) An i-th embodiment of the present invention will be described below with reference to the drawings. 1 is a perspective view of a memory card U), FIG. 2 is a perspective view in which the memory card 1 () is inverted upward, and FIGS. 3 and 4 are exploded perspective views of the memory card 10. FIG. 5 is a cross-sectional view taken along line AA of FIG. In the present specification, the memory card 10 is a Memory Stick Micro (registered trademark of SONY Co., Ltd.). As shown in FIG. 1 to FIG. 4, the first housing 12 is formed of a thin rectangular plate shape, and the outer casing 12 and the rectangular multi-chip 116906.doc 200822300 package 14 are formed into a rectangular thin plate shape, and the outer casing 12 is made of an insulating material. A housing recess Μ is formed on the upper surface of the surface constituting one of the thickness directions, and the multi-chip package 14 is housed in the housing recess 16 . As the insulating material constituting the outer casing 12, for example, a thermoplastic resin such as polycarbonate or polybutylene dicarboxylic acid can be used. The outer casing 12 is made by pouring the aforementioned thermoplastic resin into a metal mold. As shown in FIG. 3, the outer casing 12 has a rectangular bottom wall 2〇 and side walls 22 which are erected from three of the four sides of the bottom wall 2, and the two side walls 22 A of the side walls 22 are opposite each other. One side wall 22B is connected to one end of one of the two side walls 22A. In addition, the two opposite side walls 22A extend in a direction parallel to the direction in which the memory card 1 is attached to and detached from the slot of the external device, and the other one of the side walls 22B is orthogonal to the direction in which the memory card 10 is attached to and detached from the slot of the external device. The direction extends. The receiving recess 16 is formed on the upper side and the side by the bottom wall 20 and the three side walls 22 (J open shape. The outer side surface of the opposite side wall 22A is formed when the memory card is inserted into the slot provided in the external device. The fitting recess 2210 of the locking mechanism that locks the insertion state of the memory card 1 is engaged. The multi-chip package 14 extends in the housing recess 16 to the entire bottom wall 20. Further, as shown in FIG. Three of the four sides of the memory card 1 are formed by the side walls 22 (22A, 22B) of the outer casing 12, and the other one side is formed by the end surface 2002 of the bottom wall 20, the opposite end faces 2204 of the two side walls 22A, and the receiving side. The side surface 1402 of the multi-chip package 14 housed in the recess 16 is formed. 116906.doc 200822300 The end faces 2 2 of the bottom wall 20 constituting the remaining one side, ^ 2 2204 ^ A ^ 000 Η 44 ^ 1 , ^ y ! Wall 22A
汉夕日日片封裝14之側面1402在同L 曰…示’多晶片封裝14之上面係形成— 為:=: 厚度方向上比相對之2個側壁22a 141〇。 -之位置延伸之平坦面 馮月b順利地將記憶卡丨0插 1〜卜逆接器或The side surface 1402 of the Chinese matte day package 14 is formed on the same side as the 'multi-chip package 14' as follows: =: The thickness direction is opposite to the opposite side walls 22a 141 〇. - The flat surface extended by the position Feng Yueb smoothly inserted the memory card 丨 0 into the 1~Bu reverser or
〇 月:端位於下方之傾斜面,使上面咖與平坦面ΐ4ι〇 = 績。 如圖2、圖4、圖5所示,在底壁2〇之4邊中之未設有側壁 22之1邊所對應之位置,在構成外殼12之厚度方向之另外 一側之面之下面1202(底壁2〇之下面丨2〇2)之位置上設有指 按用凹部40’在本實施形態,指按用凹部4()沿未設^側^ 22之1邊延伸而形成。 土 多晶片封裝14具備由絕緣材料構成之矩形薄板狀之保持 體30 (苓照圖5);及配設於保持體3〇上且形成有可寫入及/ 或讀出資料之記憶部34 (參照圖5)之基板32 (參照圖”;平 坦面1410由基板32之上面所形成。 更詳細而言,在面對其餘1個側壁22B之多晶片封裝14之 上面之位置,沿其餘!個側壁22β並列設有用於在與外部裝 置之間傳遞信號之複數個接片3 6。 下面詳細説明多晶片封裝14。 如圖5所示,多晶片封裝丨4除具備上述之保持體3 〇、基 板32、記憶部34、複數個接片36以外,還具備控制器38。 116906.doc •10- 200822300 作為構成保持體3G之絕緣材料,可使用例如包含玻 維之環氧樹脂等熱硬化性樹脂。 、' 、基板32由絕緣材料形成矩形薄板狀,在其表面或内部形 成導電圖案,位於保持體30之上面。 在安裝於基板32之下面之狀態下,記憶㈣係埋設於保 持體3 0内之可官人芬/避 处 之了寫入及/獲項出資料之構成。在本實施形 恶’記憶部34由可更新資料之快閃記憶體所構成。〇 Month: The inclined surface is located at the bottom, so that the top coffee and the flat surface are 〇4ι〇 = performance. As shown in Fig. 2, Fig. 4, and Fig. 5, the position corresponding to one side of the side wall 22 which is not provided with the side wall 22 is located below the other side of the thickness direction of the outer casing 12. A finger recessed portion 40' is provided at a position of 1202 (the lower surface of the bottom wall 2〇2〇2). In the present embodiment, the finger pressing recessed portion 4() is formed to extend along one side of the unprovided side surface 22. The multi-chip package 14 includes a rectangular thin plate-shaped holder 30 made of an insulating material (see FIG. 5); and a memory portion 34 disposed on the holder 3 and formed with writable and/or readable data. The substrate 32 (see FIG. 5) (see FIG. 5); the flat surface 1410 is formed by the upper surface of the substrate 32. In more detail, at the position above the multi-chip package 14 facing the remaining one side wall 22B, along the rest! The side walls 22β are juxtaposed with a plurality of tabs 36 for transmitting signals between the external devices. The multi-chip package 14 will be described in detail below. As shown in Fig. 5, the multi-chip package 丨4 has the above-described holder 3 〇 In addition to the substrate 32, the memory unit 34, and the plurality of tabs 36, the controller 38 is further provided. 116906.doc • 10- 200822300 As the insulating material constituting the holding body 3G, for example, thermosetting such as Bolivia-containing epoxy resin can be used. The substrate 32 is formed of an insulating material into a rectangular thin plate shape, and a conductive pattern is formed on the surface or inside thereof, and is placed on the upper surface of the holding body 30. In the state of being mounted on the lower surface of the substrate 32, the memory (4) is embedded in the holding body. Within 30 Fen / avoidance of the writing and / eligible items constituting the information purposes. In the present embodiment bad shape 'memory unit 34 may be constituted by the flash memory update information.
Ο 接2 36設於保持體3〇之厚度方向之一側之面即上面。具 體而5 ’基板32形成為:除上面以外之部分埋設於保持體 3〇内’接片36自基板32之上面貫通至下面。基板32之表面 (上面)覆蓋有由絕緣材料構成之抗蝕層32〇2,在抗蝕層 3202上對應於接片36的部分予以開口,接片%經由該開口 向外方露出。從而,在本實施形態,抗蝕層3202之表面構 成多晶片封裝14之平坦面14 1〇之一部分。 控制器38係藉由經由埋設於保持體3〇内之接片刊與外部 裝置之間進行資料通信,對記憶部34進行資料之寫入及/ 或讀出者。在本實施形態,控制器38埋設於記憶部Μ上之 保持體30之位置,但控制器38亦可埋設於基板“上之保持 體30之位置。 另,在圖5中,符號42係分別使記憶部34與基板32之圖 案之間、控制器38與基板32之圖案之間、記憶部34與接片 36之間、控制器38與接片36之間電性連接之接合線。 如此之多晶片封裝14係在金屬模具内配置具有複數個接 片36之基板32,將由前述絕緣材料構成之合成樹脂傾入金 116906.doc 200822300 屬模具内而製成。 夕曰曰片封裝14之配設為:下面藉由黏著劑安裝在收容凹 M6之底壁2〇,在收容凹部16内延伸至整個底壁2〇。 圖6係顯示記憶卡1〇之接片36與信號名之對應圖。 如圖1所不,接片36由接片36-1〜36-11之11個接片所構 成如圖6所不,接片36-10、36-11未使用,而將信號分配 在其餘9個接片上。 (] 即複數個接片36包含:對控制器38進行信號收發之信 而子用於對控制器38及記憶部34供給接地電位之接地 翊子、及用於對控制器38及記憶部34供給電源之電源端 子。 接片Μ·1〜36_7係前述信號端子,接片36-8係前述電源端 子,接片36-9係前述接地端子。 ^羊、田地。兑明,則接片36_1係輸入有顯示在資料信號 ΑΤΑ3所通^之資料區間之匯流排狀態信號β s之 (J 信號端子。 接片36-2係進行資料信號DATA1之輸入輸出之信號端 子,接片3心3係進行資料信號DATA0之輸入輸出之信號端 子’接片36·4係進行資料信號DATA2之輸人輸出之信號端 子,接片36-6係進行資料信號DATA3之輸人輸出之信號端 子。 接片36 5係插拔檢測接片,係收發用於檢測前述外部裝 置之記憶卡之插拔之INS信號之信號端子。 接片36-7係輸入時序信號sclk之信號端子,前述匯流 116906.doc •12- 200822300 排狀,¾ k號BS及資料信號DATA0〜DATA3與該時序信號 S C L K同步而通信。 接片36-8係輸入電源vcc之電源端子。 接片36-9係連接於接地位準(Vss)之接地端子。 另,未使用之接片36-10、36-11作為擴充用而設置。 基於本實施形態,形成於外殼12之收容凹部16藉由底壁 20及3個側壁22在上方及側方形成開放狀,在該收容凹部 (、16内,因為多晶片封裝14延伸至整個底壁2〇,所以與先前 相比,可確保基板32 (多晶片封裝14)之面積增大至拆除j 個側壁之份,從而,即便與先前之記憶卡大小相同,仍可 獲得具有記憶容量增大而外形尺寸亦增大之記憶部34 (多 晶片封裝14)之記憶卡10,或即便比先前之記憶卡大小更 小,仍可獲得具有同樣記憶容量之記憶部34之記憶卡1〇。 又,因為在外殼12之下面1202設有指按用凹部4〇,所以 當然只要將手指按在該指按用凹部4〇上,即可簡單地進行 ,/ 記憶卡1〇之裝卸,由於在使外殼12成形之金屬模具上設置 用於設置指按用凹部40之部分很廉價,所以在謀求降低記 憶卡10之成本上為有利。 (第2實施形態) 下面説明第2實施形態。 第2實施形態之指按用凹部4 〇之形狀與第i實施形態不 同。 圖7係第2實施形態之記憶卡10之分解立體圖。另,在以 下實施形態,在與第1實施形態同—或同樣之位置、構 116906.doc -13- 200822300 件,附以同一符號進行説明。 如圖7所示,在第2實施形態之記憶卡1〇,指按用凹部4〇 設為貫通外殼12之底壁20之厚度方向。 如此之第2實施形態亦可取得與第丨實施形態同様之效 果。 (第3實施形態) 下面説明第3實施形態。 第3實施形態係藉由外殼12牢固地安裝多晶片封裝14 者。 圖8(A)係將第3實施形態之記憶卡丨〇之多晶片封裝丨斗上 下反轉之立體圖,圖8(B)係多晶片封裝14之立體圖,圖 8(C)係外殼12之立體圖。 即,如圖8(C)所示,在未形成側壁22之底壁邊, 自底土 20向上方犬出之傾斜面5〇 (外殼側扣合部)沿1邊鼓 出而形成。 ◎ 傾斜面50形成為沿裝卸於插槽之方向,隨著接近底壁2〇 之緣而次第上升。 另方面’如圖8(A)、圖8(B)所示,在與傾斜面5〇對應 之夕曰曰片封裝14之下面之位置,即在多晶片封裝14面對底 土 之下面’在與底壁2 0之1邊對應之位置,沿矩形之1邊 延伸形成可與傾斜面5〇扣合之傾斜面52 (封裝側扣合部)。 並且’多晶片封裝14之下面在藉由黏著劑安裝於收容凹 Μ 6之底壁20時,傾斜面50、52相扣合,使多晶片封裝14 對外殼1 2之安奘肢击 乂女展將更牢固。又,傾斜面50、52相扣合,可 116906.doc -14- 200822300 簡單地進行多晶片封裝14對外殼12之定位而為有利。 藉由如此之第3實施形態,當然亦可取得與第丨實施形能 同様之效果。 (第4實施形態) 下面説明第4實施形態。 第4實施形態係藉由外殼12牢固地安裝多晶片封裝μ 者。 (、 圖9(Α)係將第4實施形態之記憶卡1〇之多晶片封裝14上 下反轉之立體圖,圖9(B)係多晶片封裝14之立體圖,圖 9(C)係外殼12之立體圖。 ° 即,如圖9(C)所示,在未形成側壁22之底壁2〇之i邊, 從底壁20向上方突出之突起54 (外殼側扣合部)沿丨邊鼓出 而形成。 另一方面,如圖9(A)、圖9(B)所示,在與突起54對應之 多晶片封裝14之下面之位置,即在多晶片封裝14面對底壁 (J 2〇之下面,在與底壁20之1邊對應之位置,沿矩形之1邊延 伸形成可與突起54扣合之凹部56 (封裝側扣合部)。 並且夕曰曰片封裝丨4之下面在藉由黏著劑安裝於收容凹 部1 6之底壁2〇時,突去$4 φ 大起Μ與凹部56相扣合,使多晶片封裝 14對外殼12之安裝更加牢固。又,突起54與凹部56相扣 °可簡單地進行多晶片封裝14對外殼12之定位而有利。Ο 2 36 is provided on the side of one side in the thickness direction of the holding body 3〇. Specifically, the 5' substrate 32 is formed such that a portion other than the upper portion is embedded in the holder 3'. The tab 36 penetrates from the upper surface of the substrate 32 to the lower surface. The surface (upper surface) of the substrate 32 is covered with a resist layer 32 2 made of an insulating material, and a portion of the resist layer 3202 corresponding to the tab 36 is opened, and the tab % is exposed outward through the opening. Therefore, in the present embodiment, the surface of the resist layer 3202 constitutes a portion of the flat surface 14 1 of the multi-chip package 14. The controller 38 writes and/or reads data to and from the memory unit 34 by performing material communication between the tabs embedded in the holder 3 and the external device. In the present embodiment, the controller 38 is embedded in the position of the holder 30 on the memory unit, but the controller 38 may be embedded in the position of the holder 30 on the substrate. In addition, in Fig. 5, the symbol 42 is respectively A bonding wire electrically connecting between the pattern of the memory portion 34 and the substrate 32, between the pattern of the controller 38 and the substrate 32, between the memory portion 34 and the tab 36, and between the controller 38 and the tab 36. The multi-chip package 14 is provided with a substrate 32 having a plurality of tabs 36 in a metal mold, and the synthetic resin composed of the insulating material is poured into a mold of the gold 116906.doc 200822300. The matte package 14 is provided. It is assumed that the bottom is attached to the bottom wall 2 of the receiving recess M6 by an adhesive, and extends to the entire bottom wall 2 in the receiving recess 16. Fig. 6 is a view showing the correspondence between the tab 36 of the memory card and the signal name. As shown in Fig. 1, the tab 36 is composed of 11 tabs of the tabs 36-1~36-11 as shown in Fig. 6. The tabs 36-10, 36-11 are not used, and the signals are distributed. The remaining 9 tabs. () That is, the plurality of tabs 36 include: a signal for transmitting and receiving signals to the controller 38. A grounding clamp for supplying a ground potential to the controller 38 and the memory unit 34, and a power supply terminal for supplying power to the controller 38 and the memory unit 34. The tabs 1 to 36_7 are the signal terminals, and the tabs 36-8 The power supply terminal is connected to the power supply terminal, and the connecting piece 36-9 is the grounding terminal. ^ Sheep, field, and clearing, the connecting piece 36_1 is input with the bus state signal β s displayed in the data section of the data signal ΑΤΑ3 ( J signal terminal. The connector 36-2 is a signal terminal for inputting and outputting the data signal DATA1, and the chip 3 is a signal terminal for inputting and outputting the data signal DATA0. The connector 36·4 is for inputting the data signal DATA2. The signal terminal for human output, the tab 36-6 is a signal terminal for inputting the output signal of the data signal DATA3. The tab 36 is a plug-in detecting tab for transmitting and receiving a memory card for detecting the external device. The signal terminal of the INS signal. The connector 36-7 is a signal terminal for inputting the timing signal sclk, and the aforementioned convergence 116906.doc • 12-200822300 row, 3⁄4 k BS and data signals DATA0 to DATA3 are synchronized with the timing signal SCLK. Tab 36 -8 series power supply terminal for power supply vcc. Connector 36-9 is connected to the ground terminal of grounding level (Vss). Also, unused tabs 36-10 and 36-11 are used for expansion. In the embodiment, the receiving recess 16 formed in the outer casing 12 is open on the upper side and the side side by the bottom wall 20 and the three side walls 22, and the multi-chip package 14 extends to the entire bottom wall 2 in the receiving recess (16). 〇, so that the area of the substrate 32 (multi-chip package 14) is increased to the extent that the j side walls are removed compared to the prior, so that even if the size of the previous memory card is the same, the memory capacity increase can be obtained. The memory card 10 of the memory unit 34 (multi-chip package 14) having an increased external size, or even smaller than the previous memory card, can obtain the memory card 1 of the memory unit 34 having the same memory capacity. Further, since the finger-receiving recessed portion 4 is provided on the lower surface 1202 of the outer casing 12, it is of course possible to simply press the finger on the finger-receiving recessed portion 4, and the memory card 1 can be easily attached or detached. It is advantageous in that the metal mold for molding the outer casing 12 is provided with a portion for providing the finger recess 40, which is advantageous in that the cost of the memory card 10 is lowered. (Second embodiment) Next, a second embodiment will be described. The shape of the finger pressing recessed portion 4 in the second embodiment is different from that of the i-th embodiment. Fig. 7 is an exploded perspective view of the memory card 10 of the second embodiment. In the following embodiments, the same reference numerals are used in the same or similar positions as in the first embodiment, and the same reference numerals will be given. As shown in Fig. 7, in the memory card 1 of the second embodiment, the finger pressing recess 4 is formed to penetrate the thickness direction of the bottom wall 20 of the casing 12. The second embodiment as described above can also achieve the same effect as the second embodiment. (Third embodiment) Next, a third embodiment will be described. In the third embodiment, the multi-chip package 14 is firmly mounted by the outer casing 12. Fig. 8(A) is a perspective view showing the multi-chip package hopper of the memory card of the third embodiment upside down, Fig. 8(B) is a perspective view of the multi-chip package 14, and Fig. 8(C) is a case 12 Stereo picture. That is, as shown in Fig. 8(C), the inclined surface 5〇 (the outer casing side engaging portion) which is pulled upward from the subsoil 20 is formed to bulge along one side without forming the bottom wall of the side wall 22. ◎ The inclined surface 50 is formed to be attached to and detached from the slot, and rises as it approaches the edge of the bottom wall 2〇. On the other hand, as shown in FIG. 8(A) and FIG. 8(B), at the position below the wafer package 14 corresponding to the inclined surface 5〇, that is, under the surface of the multi-chip package 14 facing the subsoil A position corresponding to one side of the bottom wall 20 extends along one side of the rectangle to form an inclined surface 52 (package side engaging portion) that can be engaged with the inclined surface 5'. And when the underside of the multi-chip package 14 is attached to the bottom wall 20 of the receiving recess 6 by an adhesive, the inclined faces 50, 52 are engaged to cause the multi-chip package 14 to smash the outer casing 12 The exhibition will be stronger. Further, the inclined faces 50, 52 are engaged with each other, and it is advantageous to simply position the outer casing 12 by the multi-chip package 14 at 116906.doc -14-200822300. According to the third embodiment as described above, it is of course possible to obtain the same effect as the second embodiment. (Fourth embodiment) Next, a fourth embodiment will be described. In the fourth embodiment, the multi-chip package μ is firmly mounted by the outer casing 12. (Fig. 9(Α) is a perspective view in which the multi-chip package 14 of the memory card 1 of the fourth embodiment is vertically inverted, and Fig. 9(B) is a perspective view of the multi-chip package 14, and Fig. 9(C) is a case 12 In other words, as shown in Fig. 9(C), on the side of the bottom wall 2 which is not formed with the side wall 22, the projection 54 (the outer casing side engaging portion) which protrudes upward from the bottom wall 20 is drummed along the side. On the other hand, as shown in FIGS. 9(A) and 9(B), at a position below the multi-chip package 14 corresponding to the protrusions 54, that is, the multi-chip package 14 faces the bottom wall (J). On the lower side of the second side, at a position corresponding to one side of the bottom wall 20, a concave portion 56 (encapsulated side engaging portion) engageable with the projection 54 is formed along one side of the rectangular shape. When the adhesive is attached to the bottom wall 2 of the receiving recess 16 by the adhesive, the $4 φ large ridge is engaged with the recess 56 to make the mounting of the multi-chip package 14 to the outer casing 12 more secure. The positioning of the multi-chip package 14 to the outer casing 12 can be facilitated by simply interlocking with the recess 56.
W然’箱^由如此之兹4墙L W 弟4貫施形態,亦可取得與第1實施形 態同様之效果。 (第5實施形態) 116906.doc 15- 200822300 下面説明第5實施形態。 第:實施形態之記憶卡60不具備外殼12,4堇具備封裝 Μ 2封裝62設有指按用凹部40,這一點與第1乃至第4實 訑开ν L、不同。另,在第5實施形態,記憶卡亦係 Stick Micro (S0NY股份公司之註冊商標)。 圖1〇係第5實施形態之記憶卡6G之立體圖,圖u係將纪 憶卡60上下反轉之立體圖。 如圖1G所示,在封裝62上設有複數個接片64、及接片伴 護用標籤66。 1示 封裝62係由絕緣材料形成薄板狀,可裝卸於外部裝置之 插槽上者,作為絕緣材料,可使用例如包含玻璃纖維 氧樹脂等熱硬化性樹脂。 又 封裝62成具有沿裝卸方向延伸之長度、及沿與長度方向 正交之方向延伸之寬度之矩形,在厚度方向之-方形成平 坦之上面6202。 X卞 ϋ 在上面6202之對於朝外部裝置裝卸之方向正交之方 之兩側位置以外之區域,於與前述拆裝方向正交之方二 列設有複數個接片64。 向並 J 纟面62G2之沿著對於朝外部裝置H _之方向 正交之方向延伸之構成矩形之丨邊之區域,於 义、° 卸方向正交之方向並列設有複數個接片64。、引述扁 又,在複數個接片64所設置之上面62〇2之長度 端,設有達前端且高度降低之傾斜面62iq, 2 行對外部裝置之插槽之裝入。 ㈡丨員利地進 116906.doc -16- 200822300 在封裝62 ’與第1實施形態之多晶片封裝14同様,設有 如圖5所示之基板32、記憶部34、控制器μ,: 6202設有複數個接片64。 :此之封裝62係在金屬模具内配置有具有複數個接片μ 之土板32,將由前述絕緣材料構成之合成樹脂傾入全屬桓 具内而製成。 鲁辕 Γ υ =護用標鐵66在將記憶卡6。之上下反轉,載置於桌 =置面之情形時’該接片保護用標籤“藉由與前述载 '面抵接,在前述載置面與各接片64之表面之間確保間 防止塵埃或污垢從前述載置面附著在各接片Μ之表 %接片保護用標籤66由具有絕緣性之材料形成,在實施形 悲’接片保護用標籤66藉由2個側部標鐵68和連接標藏川 構成。 如圖10所不’封裝62在對於朝前述外部裝置㈣之插槽 方向為以之方向上之上面咖之兩側位置,未設有複^ 個接片⑷側部標籤68在該封㈣之上面咖之兩側位 置:沿前述裝卸方向延伸,分別貼附於該等兩側位置。 連接標籤7。沿著對於朝前述外部裝置裝卸之方向正交之 方向延伸’連接兩側之側部標籤68,貼附於由複數個接片 64所分隔之上面6202之位置。 另個側部標籤68及連接標籤7〇之上面62〇2之貼 係精由先前公知之雙面黏合膠帶或黏合層實施,作為 面4 口膠γ及黏合層,可採用藉由加壓而發揮黏著力之 13 6906.doc 200822300 感壓型或藉由加&而發揮黏著力之加熱型等。 藉由該等兩側之側部標籤68及連接標籤7〇, 用標藏66’向設有複數個接片64之封裝62之長度方向= 方開放狀地形成使該等接片64露出之開口 並且’藉由將接片保護用標籤66貼附於上面62〇2 裝62之厚度方向,與複數個接片“之表面相比,側部 68及連接標籤7G之表面處於更高之位置。 ’、戴However, the effect of the first embodiment is the same as that of the first embodiment. (Fifth Embodiment) 116906.doc 15- 200822300 Next, a fifth embodiment will be described. The memory card 60 of the embodiment does not include the casing 12, and the package 4 is provided with a package. The package 62 is provided with a recess 40 for finger pressing, which is different from the first to fourth embodiments. Further, in the fifth embodiment, the memory card is also Stick Micro (registered trademark of S0NY Co., Ltd.). Fig. 1 is a perspective view of a memory card 6G according to a fifth embodiment, and Fig. 9 is a perspective view showing the memory card 60 upside down. As shown in Fig. 1G, a plurality of tabs 64 and tab retaining tabs 66 are provided on the package 62. (1) The package 62 is formed of an insulating material in a thin plate shape and is detachable from the slot of the external device. For the insulating material, for example, a thermosetting resin such as glass fiber oxy-resin may be used. Further, the package 62 has a rectangular shape having a length extending in the attaching and detaching direction and a width extending in a direction orthogonal to the longitudinal direction, and a flat upper surface 6202 is formed in the thickness direction. X 卞 ϋ In the region other than the position on both sides of the upper portion of the 6202 which is orthogonal to the direction in which the external device is attached or detached, a plurality of tabs 64 are provided in the two rows orthogonal to the detaching direction. A plurality of tabs 64 are arranged side by side in the direction orthogonal to the direction in which the direction of the outer surface of the outer surface of the outer device H_ is orthogonal to the direction in which the outer surface of the external device H_ is orthogonal. In addition, at the end of the upper surface 62〇2 provided by the plurality of tabs 64, an inclined surface 62iq having a front end and a lowered height is provided, and two rows are inserted into the slots of the external device. (2) The employee enters 116906.doc -16- 200822300. The package 62' is provided in the same manner as the multi-chip package 14 of the first embodiment, and is provided with a substrate 32, a memory portion 34, and a controller μ as shown in FIG. There are a plurality of tabs 64. In the package 62, the earth plate 32 having a plurality of tabs μ is disposed in the metal mold, and the synthetic resin composed of the insulating material is poured into the entire mold. Lu Hao Γ υ = Guarding the standard iron 66 in the memory card 6. When the table is placed on the table or the surface is placed, the label for protecting the tabs is prevented from abutting against the surface of the carrier, and the surface between the mounting surface and the surface of each of the tabs 64 is prevented. Dust or dirt adheres to the surface of each of the tabs from the mounting surface. The tabs 66 are formed of an insulating material, and the tabs 66 are provided with two side rails. 68 and the connection of the standard Chuanchuan. As shown in Fig. 10, the package 62 is not provided with a plurality of tabs (4) on the sides of the upper side in the direction of the slot facing the external device (4). The part label 68 is located on both sides of the upper side of the seal (4): extending in the loading and unloading direction and attached to the two side positions respectively. The connecting label 7 extends in a direction orthogonal to the direction of loading and unloading the external device. 'The side tabs 68 connecting the two sides are attached to the upper portion 6202 separated by a plurality of tabs 64. The other side tabs 68 and the upper tabs of the connecting tabs 7 are attached to the top 62. Double-sided adhesive tape or adhesive layer is applied as a face 4 adhesive γ and sticky The layer may be a pressure-sensitive type that exerts an adhesive force by pressurization or a heating type that exerts an adhesive force by adding & the side label 68 and the connection label by the two sides. 7〇, the opening of the tabs 64 is opened to the length direction of the package 62 having the plurality of tabs 64 by the label 66' and is attached by the tab 66 for attaching the tabs. In the thickness direction of the upper 62 〇 2 mount 62, the side 68 and the surface of the connection label 7G are at a higher position than the surface of the plurality of tabs. ',wore
Ο 如圖U所示’在與設有複數個接片64之矩形之磺 之!邊所對應之位置,在構成封裝62之厚度方向之另—面 之下面6204之位置,設有指按用凹部4〇。 在本實施形態,指㈣凹⑽沿著與設有複數個接片料 之矩形之1邊相對之前述丨邊延伸而形成。 基於第5實施形態,因為在封裝62之下面62()4設有指按 用凹。卩40,所以記憶卡10之裝卸當然可簡單地進行,由於 在使封袭62成形之金屬模具上設置用於設置指按用凹部如 之部分报廉價,所以在謀求降低記憶卡1〇之成本上為有 利0 又,基於本實施形態,不使用外殼而僅以封裝Q構成吒 憶卡60,在謀求降低記憶卡60之成本上為有利。 又,藉由採用接片保護用標籤66之簡單構成謀求複數個 接片64之保護,在謀求降低記憶卡6〇之成本上為有利。 另,在第5實施形態,已説明藉由2個側部標籤68和連接 標鐵7〇構成接片保護用標籤66之情形,但連接標籤7〇亦可 省略。惟,若採用連接標籤70,在簡單地進行接片保護用 116906.doc -18- 200822300 標籤66之貼附上為有利。 又,連接標籤70之配置場所及大小俜 ^ 你任思的,例如實施 >恶’亦可設置為連接兩侧之侧部標籤68之延伸方向之中 間部,亦可設置為覆蓋複數個接片64所設置之位置料之 上面6202之全域,總之,在設有連接標籤π之情形,只要 將貼附位置與設有接片64之位置錯開,至少露出設有接片 6 4之位置即可。Ο As shown in Figure U, in the sulphur of the rectangle with a plurality of tabs 64! At the position corresponding to the side, a finger recess 4 〇 is provided at a position below the other surface 6204 constituting the thickness direction of the package 62. In the present embodiment, the (four) recess (10) is formed to extend along the side edge of the rectangle which is provided with a plurality of gussets. According to the fifth embodiment, since the lower surface 62 () 4 of the package 62 is provided with a finger pressing recess.卩40, the loading and unloading of the memory card 10 can of course be carried out simply. Since the metal mold for forming the seal 62 is provided with a recess for providing the pointing portion, it is inexpensive, so that the cost of the memory card 1 is reduced. Further, according to the present embodiment, it is advantageous to reduce the cost of the memory card 60 by using only the package Q without constituting the memory card 60. Further, it is advantageous to reduce the cost of the memory card 6 by protecting the plurality of tabs 64 by the simple configuration of the tabs 66 for patch protection. Further, in the fifth embodiment, the tab protection tab 66 is formed by the two side labels 68 and the connection rails 7, but the connection labels 7A may be omitted. However, if the connection label 70 is used, it is advantageous to simply attach the tab protection 116906.doc -18-200822300 label 66. Moreover, the arrangement place and size of the connection tag 70 can be set to the middle of the extending direction of the side tabs 68 on both sides, or can be set to cover a plurality of connections. The entire area of the upper portion 6202 of the position material set by the sheet 64. In short, in the case where the connection label π is provided, as long as the attachment position is shifted from the position at which the tab 64 is provided, at least the position where the tab 64 is provided is exposed. can.
Ο 另’在實施形態’已説明記憶卡10係Mem〇ry咖 Micro之情形,但記憶卡1()之形式並不限定於該等。 又,在貫施形態’已説明將可更新資料之快閃記憶體作 為記憶部34使用之情形,但本發明並不限定於此,記憶部 34只要可進行資料之寫入及/或讀出者即可。 【圖式簡單說明】 圖1係記憶卡1 〇之立體圖。 圖2係記憶卡10之上下反轉之立體圖。 圖3係記憶卡10之分解立體圖。 圖4係記憶卡1 0之分解立體圖。 圖5係圖1之AA線剖面圖。 圖6係顯示記憶卡10之接片36與信號名對應之圖。 圖7係第2實施形態之記憶卡1〇之分解立體圖。 圖8(A)係將第3實施形態之記憶卡1〇之多晶片封裴μ上 下反轉之立體圖,(Β)係多晶片封裝14之立體圖,係外 殼12之立體圖。 圖9(A)係將第4實施形態之記憶卡1〇之多晶片封裝η上 116906.doc -19- 200822300 ’(C)係外 下反轉之立體圖,(B)係多晶片封農14之立體圖 殼12之立體圖。 圖10係弟5貫施形態之記憶卡6 〇之立體圖。 圖11係將記憶卡60上下反轉之立體圖。 【主要元件符號說明】Ο In the case of the embodiment, the case where the memory card 10 is Mem〇ry Coffee Micro has been described, but the form of the memory card 1 () is not limited to these. Further, in the case where the flash memory having the updateable material has been described as the memory unit 34, the present invention is not limited thereto, and the memory unit 34 can write and/or read data as long as it is possible. Yes. [Simple description of the drawing] Fig. 1 is a perspective view of the memory card 1 〇. 2 is a perspective view of the upper and lower inversion of the memory card 10. 3 is an exploded perspective view of the memory card 10. 4 is an exploded perspective view of the memory card 10. Figure 5 is a cross-sectional view taken along line AA of Figure 1. Fig. 6 is a view showing the tab 36 of the memory card 10 corresponding to the signal name. Fig. 7 is an exploded perspective view showing the memory card 1 of the second embodiment. Fig. 8(A) is a perspective view showing the multi-chip package 裴 of the memory card 1 of the third embodiment, and the multi-chip package 14 is a perspective view of the multi-chip package 14, and is a perspective view of the outer casing 12. Fig. 9(A) is a perspective view showing the multi-chip package of the memory card 1 of the fourth embodiment, 116906.doc -19-200822300' (C), and (B) is a multi-chip package. A perspective view of the stereoscopic shell 12. Fig. 10 is a perspective view of the memory card 6 of the form of the younger brother. Fig. 11 is a perspective view showing the memory card 60 upside down. [Main component symbol description]
U 10 > 60 記憶卡 12 外殼 14 多晶片封裝 16 收容凹部 20 底壁 22、22A、22B 側壁 30 保持體 32 基板 34 記憶部 36、36-1 〜36-11、64 接片 38 控制器 40 指按用凹部 42 接合線 50 、 52 、 6210 傾斜面 54 突起 56 凹部 62 封裝 66 接片保護用標籤 68 側部標籤 116906.doc -20. (、 200822300 70 72 1202 、 6204 1402 1410 2002 > 2204 2210 2220 3202 6202 連接標籤 開口 下面 側面 平坦面 端面 嵌合凹部 上面 抗餘層 上面U 10 > 60 Memory Card 12 Case 14 Multi-chip package 16 Housing recess 20 Bottom wall 22, 22A, 22B Side wall 30 Holder 32 Substrate 34 Memory 36, 36-1~36-11, 64 Tab 38 Controller 40 Finger pressing recess 42 bonding wire 50, 52, 6210 inclined surface 54 projection 56 recess 62 package 66 tab protection tab 68 side label 116906.doc -20. (, 200822300 70 72 1202, 6204 1402 1410 2002 > 2204 2210 2220 3202 6202 Connection label opening lower side flat surface end fitting recessed upper surface
116906.doc •21 -116906.doc •21 -
Claims (1)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2006091703A JP4816195B2 (en) | 2006-03-29 | 2006-03-29 | Memory card |
Publications (1)
Publication Number | Publication Date |
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TW200822300A true TW200822300A (en) | 2008-05-16 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW096110381A TW200822300A (en) | 2006-03-29 | 2007-03-26 | Memory card |
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JP (1) | JP4816195B2 (en) |
TW (1) | TW200822300A (en) |
WO (1) | WO2007114113A1 (en) |
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JP4763223B2 (en) * | 2001-01-26 | 2011-08-31 | ソニー株式会社 | IC card |
JP2003022430A (en) * | 2001-07-06 | 2003-01-24 | Hitachi Ltd | Memory card |
-
2006
- 2006-03-29 JP JP2006091703A patent/JP4816195B2/en not_active Expired - Fee Related
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2007
- 2007-03-26 TW TW096110381A patent/TW200822300A/en unknown
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JP2007265214A (en) | 2007-10-11 |
JP4816195B2 (en) | 2011-11-16 |
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