TW200822300A - Memory card - Google Patents

Abstract

To provide a memory card that advantageously increases the storage capacity. A memory card 10 is formed in a rectangular thin plate shape with a housing 12, which is made of an insulation member and a housing recessed part 16 is formed on an upper face that is one face in the thickness direction, and a rectangular multi-chip package 14 housed in the recessed part 16. The housing 12 includes a rectangular bottom wall 20 and sidewalls 22 standing up from three sides among four sides of the bottom wall 20, two sidewalls 22A among the sidewalls 22 face each other, and the rest one sidewall 22B connects one end part of the two sidewalls 22A. A finger engaging recessed part 40 is disposed, at a position corresponding to one side on which the sidewall 22 is not disposed among the four sides of the bottom walls 20 and at a lower face 1202 that is the other face in the thickness direction of the housing 12.

Description

200822300 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a memory card. [Prior Art] A flash memory having updatable data has been provided to write data into the flash memory or read the memory card.

Ο As such a memory card, there is provided a memory card having a rectangular thin plate shape formed by a casing and a rectangular multi-wafer, the outer casing of which is made of an insulating material and formed on the upper side of the surface constituting one side in the thickness direction. The open-plan rectangular rectangular receiving recess is detachable from a slot (card slot or card connector) of the external device; the multi-chip package includes a plurality of tabs for transmitting a signal between the external device and The flash memory is housed in the housing recess (refer to Japanese Patent Application Laid-Open No. Hei. No. Hei. In the memory card, the housing recess of the outer casing has a rectangular bottom wall, and four side walls respectively erected from the four sides of the bottom wall, and the fingers can be pressed into the four of the four side walls to complete the insertion of the memory card to the external device. Loading and unloading of the tank. In recent years, due to the increased memory capacity of memory cards, the size of flash memory incorporated in multi-chip packages has increased, and multi-chip packages have increased in size. On the other hand, the size of the outer casing is determined by the size of the memory card, so that the size of the multi-chip package that can be accommodated in the recess of the outer casing is p艮. It is unfavorable to increase the capacity of the hidden card. The heart of the month is completed in such a case, and the purpose thereof is to provide a memory card, which is advantageous in terms of increasing the memory capacity. 116906.doc 200822300 SUMMARY OF THE INVENTION In order to achieve the above object, the memory card of the present invention is characterized in that a rectangular thin plate shape is formed by the outer casing and the matte sheet, and the material (4) is formed and formed on the side of the thickness direction. a plurality of sockets for receiving a recessed portion and having a plurality of tabs for transmitting signals between the outer surface and the receiving recess; the outer casing has a rectangular bottom wall The side wall of the three sides is fixed; the four sides of the wall of the receiving recess are formed by the bottom wall and the three sides 1 and the side of the side are open; the multi-chip sealing is extended to the above-mentioned housing 2 The plurality of tabs are disposed on the top surface of the multi-wafer cover of the receiving body; and the recessed portion is formed at a position corresponding to one side of the outer wall of the bottom wall of the bottom wall To the position below the other side of the face, there is a rectangular thin plate made of insulating material with a finger press to insert the moon's memory card, which is characterized by an injury and a removable outer casing. ^ on the aforementioned package, used for the aforementioned external Pass between the two sets (2) ^ The number of the above-mentioned plurality of tabs is two or two in the thickness of the aforementioned package! On the second side, the direction of the external _ unloading is orthogonal. The direction of the loading and unloading is positive: the two sides of the rectangle; the two are before the front = one of the tabs; the other one in the thickness direction (four) is the part of the package. The bottom surface of the surface is provided with a recessed 116906.doc 200822300 memory card according to the present invention, and the inner chip package is formed in the recess formed on the outer casing to extend to the entire bottom wall, so that the first package can be packaged with the first package. The area is increased to remove one side wall, so that even if: = = memory card size (four), a memory card with a memory capacity increase and (4), also & It is advantageous to increase the size. Also, because it replaces the front side of the (10) side wall and is under the outer casing...

With the reference (4), the memory card can be easily loaded and unloaded, and the cost of forming the metal mold of the finger recess can be suppressed. Therefore, it is also advantageous to reduce the cost of the memory card. It is advantageous to reduce the cost of the memory card by using a memory card without using a casing and using only a package. In order to provide a finger recess for the underside of the seal, the loading and unloading of the Z It card can be easily made. In addition, since the cost of forming the metal fastener of the finger recess can be suppressed, the cost of the memory card is reduced. For the benefit. [Embodiment] (First Embodiment) An i-th embodiment of the present invention will be described below with reference to the drawings. 1 is a perspective view of a memory card U), FIG. 2 is a perspective view in which the memory card 1 () is inverted upward, and FIGS. 3 and 4 are exploded perspective views of the memory card 10. FIG. 5 is a cross-sectional view taken along line AA of FIG. In the present specification, the memory card 10 is a Memory Stick Micro (registered trademark of SONY Co., Ltd.). As shown in FIG. 1 to FIG. 4, the first housing 12 is formed of a thin rectangular plate shape, and the outer casing 12 and the rectangular multi-chip 116906.doc 200822300 package 14 are formed into a rectangular thin plate shape, and the outer casing 12 is made of an insulating material. A housing recess Μ is formed on the upper surface of the surface constituting one of the thickness directions, and the multi-chip package 14 is housed in the housing recess 16 . As the insulating material constituting the outer casing 12, for example, a thermoplastic resin such as polycarbonate or polybutylene dicarboxylic acid can be used. The outer casing 12 is made by pouring the aforementioned thermoplastic resin into a metal mold. As shown in FIG. 3, the outer casing 12 has a rectangular bottom wall 2〇 and side walls 22 which are erected from three of the four sides of the bottom wall 2, and the two side walls 22 A of the side walls 22 are opposite each other. One side wall 22B is connected to one end of one of the two side walls 22A. In addition, the two opposite side walls 22A extend in a direction parallel to the direction in which the memory card 1 is attached to and detached from the slot of the external device, and the other one of the side walls 22B is orthogonal to the direction in which the memory card 10 is attached to and detached from the slot of the external device. The direction extends. The receiving recess 16 is formed on the upper side and the side by the bottom wall 20 and the three side walls 22 (J open shape. The outer side surface of the opposite side wall 22A is formed when the memory card is inserted into the slot provided in the external device. The fitting recess 2210 of the locking mechanism that locks the insertion state of the memory card 1 is engaged. The multi-chip package 14 extends in the housing recess 16 to the entire bottom wall 20. Further, as shown in FIG. Three of the four sides of the memory card 1 are formed by the side walls 22 (22A, 22B) of the outer casing 12, and the other one side is formed by the end surface 2002 of the bottom wall 20, the opposite end faces 2204 of the two side walls 22A, and the receiving side. The side surface 1402 of the multi-chip package 14 housed in the recess 16 is formed. 116906.doc 200822300 The end faces 2 2 of the bottom wall 20 constituting the remaining one side, ^ 2 2204 ^ A ^ 000 Η 44 ^ 1 , ^ y ! Wall 22A

The side surface 1402 of the Chinese matte day package 14 is formed on the same side as the 'multi-chip package 14' as follows: =: The thickness direction is opposite to the opposite side walls 22a 141 〇. - The flat surface extended by the position Feng Yueb smoothly inserted the memory card 丨 0 into the 1~Bu reverser or

〇 Month: The inclined surface is located at the bottom, so that the top coffee and the flat surface are 〇4ι〇 = performance. As shown in Fig. 2, Fig. 4, and Fig. 5, the position corresponding to one side of the side wall 22 which is not provided with the side wall 22 is located below the other side of the thickness direction of the outer casing 12. A finger recessed portion 40' is provided at a position of 1202 (the lower surface of the bottom wall 2〇2〇2). In the present embodiment, the finger pressing recessed portion 4() is formed to extend along one side of the unprovided side surface 22. The multi-chip package 14 includes a rectangular thin plate-shaped holder 30 made of an insulating material (see FIG. 5); and a memory portion 34 disposed on the holder 3 and formed with writable and/or readable data. The substrate 32 (see FIG. 5) (see FIG. 5); the flat surface 1410 is formed by the upper surface of the substrate 32. In more detail, at the position above the multi-chip package 14 facing the remaining one side wall 22B, along the rest! The side walls 22β are juxtaposed with a plurality of tabs 36 for transmitting signals between the external devices. The multi-chip package 14 will be described in detail below. As shown in Fig. 5, the multi-chip package 丨4 has the above-described holder 3 〇 In addition to the substrate 32, the memory unit 34, and the plurality of tabs 36, the controller 38 is further provided. 116906.doc • 10- 200822300 As the insulating material constituting the holding body 3G, for example, thermosetting such as Bolivia-containing epoxy resin can be used. The substrate 32 is formed of an insulating material into a rectangular thin plate shape, and a conductive pattern is formed on the surface or inside thereof, and is placed on the upper surface of the holding body 30. In the state of being mounted on the lower surface of the substrate 32, the memory (4) is embedded in the holding body. Within 30 Fen / avoidance of the writing and / eligible items constituting the information purposes. In the present embodiment bad shape 'memory unit 34 may be constituted by the flash memory update information.

Ο 2 36 is provided on the side of one side in the thickness direction of the holding body 3〇. Specifically, the 5' substrate 32 is formed such that a portion other than the upper portion is embedded in the holder 3'. The tab 36 penetrates from the upper surface of the substrate 32 to the lower surface. The surface (upper surface) of the substrate 32 is covered with a resist layer 32 2 made of an insulating material, and a portion of the resist layer 3202 corresponding to the tab 36 is opened, and the tab % is exposed outward through the opening. Therefore, in the present embodiment, the surface of the resist layer 3202 constitutes a portion of the flat surface 14 1 of the multi-chip package 14. The controller 38 writes and/or reads data to and from the memory unit 34 by performing material communication between the tabs embedded in the holder 3 and the external device. In the present embodiment, the controller 38 is embedded in the position of the holder 30 on the memory unit, but the controller 38 may be embedded in the position of the holder 30 on the substrate. In addition, in Fig. 5, the symbol 42 is respectively A bonding wire electrically connecting between the pattern of the memory portion 34 and the substrate 32, between the pattern of the controller 38 and the substrate 32, between the memory portion 34 and the tab 36, and between the controller 38 and the tab 36. The multi-chip package 14 is provided with a substrate 32 having a plurality of tabs 36 in a metal mold, and the synthetic resin composed of the insulating material is poured into a mold of the gold 116906.doc 200822300. The matte package 14 is provided. It is assumed that the bottom is attached to the bottom wall 2 of the receiving recess M6 by an adhesive, and extends to the entire bottom wall 2 in the receiving recess 16. Fig. 6 is a view showing the correspondence between the tab 36 of the memory card and the signal name. As shown in Fig. 1, the tab 36 is composed of 11 tabs of the tabs 36-1~36-11 as shown in Fig. 6. The tabs 36-10, 36-11 are not used, and the signals are distributed. The remaining 9 tabs. () That is, the plurality of tabs 36 include: a signal for transmitting and receiving signals to the controller 38. A grounding clamp for supplying a ground potential to the controller 38 and the memory unit 34, and a power supply terminal for supplying power to the controller 38 and the memory unit 34. The tabs 1 to 36_7 are the signal terminals, and the tabs 36-8 The power supply terminal is connected to the power supply terminal, and the connecting piece 36-9 is the grounding terminal. ^ Sheep, field, and clearing, the connecting piece 36_1 is input with the bus state signal β s displayed in the data section of the data signal ΑΤΑ3 ( J signal terminal. The connector 36-2 is a signal terminal for inputting and outputting the data signal DATA1, and the chip 3 is a signal terminal for inputting and outputting the data signal DATA0. The connector 36·4 is for inputting the data signal DATA2. The signal terminal for human output, the tab 36-6 is a signal terminal for inputting the output signal of the data signal DATA3. The tab 36 is a plug-in detecting tab for transmitting and receiving a memory card for detecting the external device. The signal terminal of the INS signal. The connector 36-7 is a signal terminal for inputting the timing signal sclk, and the aforementioned convergence 116906.doc • 12-200822300 row, 3⁄4 k BS and data signals DATA0 to DATA3 are synchronized with the timing signal SCLK. Tab 36 -8 series power supply terminal for power supply vcc. Connector 36-9 is connected to the ground terminal of grounding level (Vss). Also, unused tabs 36-10 and 36-11 are used for expansion. In the embodiment, the receiving recess 16 formed in the outer casing 12 is open on the upper side and the side side by the bottom wall 20 and the three side walls 22, and the multi-chip package 14 extends to the entire bottom wall 2 in the receiving recess (16). 〇, so that the area of the substrate 32 (multi-chip package 14) is increased to the extent that the j side walls are removed compared to the prior, so that even if the size of the previous memory card is the same, the memory capacity increase can be obtained. The memory card 10 of the memory unit 34 (multi-chip package 14) having an increased external size, or even smaller than the previous memory card, can obtain the memory card 1 of the memory unit 34 having the same memory capacity. Further, since the finger-receiving recessed portion 4 is provided on the lower surface 1202 of the outer casing 12, it is of course possible to simply press the finger on the finger-receiving recessed portion 4, and the memory card 1 can be easily attached or detached. It is advantageous in that the metal mold for molding the outer casing 12 is provided with a portion for providing the finger recess 40, which is advantageous in that the cost of the memory card 10 is lowered. (Second embodiment) Next, a second embodiment will be described. The shape of the finger pressing recessed portion 4 in the second embodiment is different from that of the i-th embodiment. Fig. 7 is an exploded perspective view of the memory card 10 of the second embodiment. In the following embodiments, the same reference numerals are used in the same or similar positions as in the first embodiment, and the same reference numerals will be given. As shown in Fig. 7, in the memory card 1 of the second embodiment, the finger pressing recess 4 is formed to penetrate the thickness direction of the bottom wall 20 of the casing 12. The second embodiment as described above can also achieve the same effect as the second embodiment. (Third embodiment) Next, a third embodiment will be described. In the third embodiment, the multi-chip package 14 is firmly mounted by the outer casing 12. Fig. 8(A) is a perspective view showing the multi-chip package hopper of the memory card of the third embodiment upside down, Fig. 8(B) is a perspective view of the multi-chip package 14, and Fig. 8(C) is a case 12 Stereo picture. That is, as shown in Fig. 8(C), the inclined surface 5〇 (the outer casing side engaging portion) which is pulled upward from the subsoil 20 is formed to bulge along one side without forming the bottom wall of the side wall 22. ◎ The inclined surface 50 is formed to be attached to and detached from the slot, and rises as it approaches the edge of the bottom wall 2〇. On the other hand, as shown in FIG. 8(A) and FIG. 8(B), at the position below the wafer package 14 corresponding to the inclined surface 5〇, that is, under the surface of the multi-chip package 14 facing the subsoil A position corresponding to one side of the bottom wall 20 extends along one side of the rectangle to form an inclined surface 52 (package side engaging portion) that can be engaged with the inclined surface 5'. And when the underside of the multi-chip package 14 is attached to the bottom wall 20 of the receiving recess 6 by an adhesive, the inclined faces 50, 52 are engaged to cause the multi-chip package 14 to smash the outer casing 12 The exhibition will be stronger. Further, the inclined faces 50, 52 are engaged with each other, and it is advantageous to simply position the outer casing 12 by the multi-chip package 14 at 116906.doc -14-200822300. According to the third embodiment as described above, it is of course possible to obtain the same effect as the second embodiment. (Fourth embodiment) Next, a fourth embodiment will be described. In the fourth embodiment, the multi-chip package μ is firmly mounted by the outer casing 12. (Fig. 9(Α) is a perspective view in which the multi-chip package 14 of the memory card 1 of the fourth embodiment is vertically inverted, and Fig. 9(B) is a perspective view of the multi-chip package 14, and Fig. 9(C) is a case 12 In other words, as shown in Fig. 9(C), on the side of the bottom wall 2 which is not formed with the side wall 22, the projection 54 (the outer casing side engaging portion) which protrudes upward from the bottom wall 20 is drummed along the side. On the other hand, as shown in FIGS. 9(A) and 9(B), at a position below the multi-chip package 14 corresponding to the protrusions 54, that is, the multi-chip package 14 faces the bottom wall (J). On the lower side of the second side, at a position corresponding to one side of the bottom wall 20, a concave portion 56 (encapsulated side engaging portion) engageable with the projection 54 is formed along one side of the rectangular shape. When the adhesive is attached to the bottom wall 2 of the receiving recess 16 by the adhesive, the $4 φ large ridge is engaged with the recess 56 to make the mounting of the multi-chip package 14 to the outer casing 12 more secure. The positioning of the multi-chip package 14 to the outer casing 12 can be facilitated by simply interlocking with the recess 56.

However, the effect of the first embodiment is the same as that of the first embodiment. (Fifth Embodiment) 116906.doc 15- 200822300 Next, a fifth embodiment will be described. The memory card 60 of the embodiment does not include the casing 12, and the package 4 is provided with a package. The package 62 is provided with a recess 40 for finger pressing, which is different from the first to fourth embodiments. Further, in the fifth embodiment, the memory card is also Stick Micro (registered trademark of S0NY Co., Ltd.). Fig. 1 is a perspective view of a memory card 6G according to a fifth embodiment, and Fig. 9 is a perspective view showing the memory card 60 upside down. As shown in Fig. 1G, a plurality of tabs 64 and tab retaining tabs 66 are provided on the package 62. (1) The package 62 is formed of an insulating material in a thin plate shape and is detachable from the slot of the external device. For the insulating material, for example, a thermosetting resin such as glass fiber oxy-resin may be used. Further, the package 62 has a rectangular shape having a length extending in the attaching and detaching direction and a width extending in a direction orthogonal to the longitudinal direction, and a flat upper surface 6202 is formed in the thickness direction. X 卞 ϋ In the region other than the position on both sides of the upper portion of the 6202 which is orthogonal to the direction in which the external device is attached or detached, a plurality of tabs 64 are provided in the two rows orthogonal to the detaching direction. A plurality of tabs 64 are arranged side by side in the direction orthogonal to the direction in which the direction of the outer surface of the outer surface of the outer device H_ is orthogonal to the direction in which the outer surface of the external device H_ is orthogonal. In addition, at the end of the upper surface 62〇2 provided by the plurality of tabs 64, an inclined surface 62iq having a front end and a lowered height is provided, and two rows are inserted into the slots of the external device. (2) The employee enters 116906.doc -16- 200822300. The package 62' is provided in the same manner as the multi-chip package 14 of the first embodiment, and is provided with a substrate 32, a memory portion 34, and a controller μ as shown in FIG. There are a plurality of tabs 64. In the package 62, the earth plate 32 having a plurality of tabs μ is disposed in the metal mold, and the synthetic resin composed of the insulating material is poured into the entire mold. Lu Hao Γ υ = Guarding the standard iron 66 in the memory card 6. When the table is placed on the table or the surface is placed, the label for protecting the tabs is prevented from abutting against the surface of the carrier, and the surface between the mounting surface and the surface of each of the tabs 64 is prevented. Dust or dirt adheres to the surface of each of the tabs from the mounting surface. The tabs 66 are formed of an insulating material, and the tabs 66 are provided with two side rails. 68 and the connection of the standard Chuanchuan. As shown in Fig. 10, the package 62 is not provided with a plurality of tabs (4) on the sides of the upper side in the direction of the slot facing the external device (4). The part label 68 is located on both sides of the upper side of the seal (4): extending in the loading and unloading direction and attached to the two side positions respectively. The connecting label 7 extends in a direction orthogonal to the direction of loading and unloading the external device. 'The side tabs 68 connecting the two sides are attached to the upper portion 6202 separated by a plurality of tabs 64. The other side tabs 68 and the upper tabs of the connecting tabs 7 are attached to the top 62. Double-sided adhesive tape or adhesive layer is applied as a face 4 adhesive γ and sticky The layer may be a pressure-sensitive type that exerts an adhesive force by pressurization or a heating type that exerts an adhesive force by adding & the side label 68 and the connection label by the two sides. 7〇, the opening of the tabs 64 is opened to the length direction of the package 62 having the plurality of tabs 64 by the label 66' and is attached by the tab 66 for attaching the tabs. In the thickness direction of the upper 62 〇 2 mount 62, the side 68 and the surface of the connection label 7G are at a higher position than the surface of the plurality of tabs. ',wore

Ο As shown in Figure U, in the sulphur of the rectangle with a plurality of tabs 64! At the position corresponding to the side, a finger recess 4 〇 is provided at a position below the other surface 6204 constituting the thickness direction of the package 62. In the present embodiment, the (four) recess (10) is formed to extend along the side edge of the rectangle which is provided with a plurality of gussets. According to the fifth embodiment, since the lower surface 62 () 4 of the package 62 is provided with a finger pressing recess.卩40, the loading and unloading of the memory card 10 can of course be carried out simply. Since the metal mold for forming the seal 62 is provided with a recess for providing the pointing portion, it is inexpensive, so that the cost of the memory card 1 is reduced. Further, according to the present embodiment, it is advantageous to reduce the cost of the memory card 60 by using only the package Q without constituting the memory card 60. Further, it is advantageous to reduce the cost of the memory card 6 by protecting the plurality of tabs 64 by the simple configuration of the tabs 66 for patch protection. Further, in the fifth embodiment, the tab protection tab 66 is formed by the two side labels 68 and the connection rails 7, but the connection labels 7A may be omitted. However, if the connection label 70 is used, it is advantageous to simply attach the tab protection 116906.doc -18-200822300 label 66. Moreover, the arrangement place and size of the connection tag 70 can be set to the middle of the extending direction of the side tabs 68 on both sides, or can be set to cover a plurality of connections. The entire area of the upper portion 6202 of the position material set by the sheet 64. In short, in the case where the connection label π is provided, as long as the attachment position is shifted from the position at which the tab 64 is provided, at least the position where the tab 64 is provided is exposed. can.

Ο In the case of the embodiment, the case where the memory card 10 is Mem〇ry Coffee Micro has been described, but the form of the memory card 1 () is not limited to these. Further, in the case where the flash memory having the updateable material has been described as the memory unit 34, the present invention is not limited thereto, and the memory unit 34 can write and/or read data as long as it is possible. Yes. [Simple description of the drawing] Fig. 1 is a perspective view of the memory card 1 〇. 2 is a perspective view of the upper and lower inversion of the memory card 10. 3 is an exploded perspective view of the memory card 10. 4 is an exploded perspective view of the memory card 10. Figure 5 is a cross-sectional view taken along line AA of Figure 1. Fig. 6 is a view showing the tab 36 of the memory card 10 corresponding to the signal name. Fig. 7 is an exploded perspective view showing the memory card 1 of the second embodiment. Fig. 8(A) is a perspective view showing the multi-chip package 裴 of the memory card 1 of the third embodiment, and the multi-chip package 14 is a perspective view of the multi-chip package 14, and is a perspective view of the outer casing 12. Fig. 9(A) is a perspective view showing the multi-chip package of the memory card 1 of the fourth embodiment, 116906.doc -19-200822300' (C), and (B) is a multi-chip package. A perspective view of the stereoscopic shell 12. Fig. 10 is a perspective view of the memory card 6 of the form of the younger brother. Fig. 11 is a perspective view showing the memory card 60 upside down. [Main component symbol description]

U 10 > 60 Memory Card 12 Case 14 Multi-chip package 16 Housing recess 20 Bottom wall 22, 22A, 22B Side wall 30 Holder 32 Substrate 34 Memory 36, 36-1~36-11, 64 Tab 38 Controller 40 Finger pressing recess 42 bonding wire 50, 52, 6210 inclined surface 54 projection 56 recess 62 package 66 tab protection tab 68 side label 116906.doc -20. (, 200822300 70 72 1202, 6204 1402 1410 2002 > 2204 2210 2220 3202 6202 Connection label opening lower side flat surface end fitting recessed upper surface

116906.doc •21 -

Claims (1)

200822300, the scope of application for patents: 1. A memory card 2 is characterized in that a rectangular thin plate is formed by a casing and a multi-chip package, and the outer casing is made of an insulating material, and is formed on the side of the side facing the thickness direction. a accommodating recess, which can be mounted in a slot of an external device or a detacher, wherein the multi-chip package has a plurality of tabs for transmitting signals between the external device and the accommodating recess, wherein the foregoing The outer casing has a bottom wall of the moment 7 and a side wall which is lifted from three sides of the four sides of the bottom wall; the receiving recess is by A #, +, + _ 曰, and the bottom wall and the three side walls are above and side The square is formed in an open shape; the multi-chip package extends in the receiving recess to the entire bottom wall; - a plurality of tabs as described above, and a sigh of the upper surface of the multi-chip package accommodated in the housing recess; (j) in the four sides of the bottom wall, and the position corresponding to one side of the side wall is provided with a finger at a position below the other side constituting the predetermined direction of the outer casing. 2. If the memory card of the request item is used, 苴/, A is the extension of the concave portion along the side where the side wall is not provided. 3. If the request item is printed + ^ t , σ The center and/or the middle finger recesses are formed to penetrate the thickness direction of the bottom cymbal. 4. According to the memory card of claim 1, 1 front, +, and upper sides are 4 sides of 1 outer & card In the middle of the 3, the side wall of the Bu Dang is formed, and the other one side is covered by the end face of the wall 116906.doc 200822300, the opposite side of the two 乂 乂, 々 、, and the 收容 + + The side surface of the package is formed. ^Individually, the recessed portion 5. The card 1 of claim 4 is extended from the end surface of the bottom wall and the surface of the other one of the other side surfaces on the same surface: surface, and In the above-mentioned multi-chip package, the memory card of the side of the multi-chip package is paired, and the direction of the opposite side of the Mu-side of the multi-chip package is smaller than the thickness of the outer casing. a flat surface extending. For the plurality of ridges 2', wherein two of the three side walls are opposite to each other The upper surface of the sealing is formed as a flat surface extending at a position lower than the thickness of the outer casing or the two opposite side walls, and the upper surface of the other one of the three side walls is opposite to the flat surface. The two of the three side walls are opposite to each other, and the upper surface of the multi-chip package is formed such that the thickness of the outer casing = a flat surface extending at a position lower than the two opposite side walls. The plurality of tabs of the month J are facing the other one of the three side walls, and the upper position of the wafer package is juxtaposed along the remaining ones of the sidewalls. 9·Qingqing 8 Memory Card The multi-chip package includes: a rectangular thin plate-shaped holder made of an insulating material; and a substrate disposed on the upper surface of the holder and having a memory portion capable of writing and/or reading data; The flat surface is formed on the upper surface of the substrate; 116906.doc 200822300 The plurality of tabs are formed on the substrate. 1 0. The memory card of claim 1, the A 乂丨 卞 卞 in the bean, and the outer side fastening portion on the side of the wall where the side wall is not erected; & the multi-chip package surface a package side fastening portion under the bottom wall; "" and "porting portion fastening portion 11", the outer casing side fastening portion and the package side fastening portion are engaged with each other. : a package that can be mounted in a slot of an external device or a rectangular plate from which it is removed; and a 抖 抖 构成 设 设 设 构成 构成 构成 构成 构成 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖The plurality of tabs are formed on the front surface, i.e., one of the sides on one side of the degree direction, and extending in the positive G direction toward the direction of the front side A « ^4 The area of one side of the rectangle, juxtaposed... the direction in which the loading and unloading directions are orthogonal; 4 juxtaposed to the opposite direction = the position of the rectangle =: having the plurality of tabs, and the position below the thickness direction of the package is set There is a recess for the finger press. 12. A memory card as claimed in claim 11, wherein The above-mentioned upper surface mounted on the side of the external device is attached with a side label extending laterally on both sides in the direction in which the detaching side 6 extends. 116906.doc