TW200931632A - Card type memory package - Google Patents

Card type memory package Download PDF

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Publication number
TW200931632A
TW200931632A TW097100109A TW97100109A TW200931632A TW 200931632 A TW200931632 A TW 200931632A TW 097100109 A TW097100109 A TW 097100109A TW 97100109 A TW97100109 A TW 97100109A TW 200931632 A TW200931632 A TW 200931632A
Authority
TW
Taiwan
Prior art keywords
card
package structure
substrate
memory package
type memory
Prior art date
Application number
TW097100109A
Other languages
Chinese (zh)
Inventor
Kuo-Yuan Lee
ke-wen Lu
Ta-Wei Kuo
Wen-Chun Chiu
Pi-Wei Hsu
Original Assignee
Walton Advanced Eng Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Walton Advanced Eng Inc filed Critical Walton Advanced Eng Inc
Priority to TW097100109A priority Critical patent/TW200931632A/en
Publication of TW200931632A publication Critical patent/TW200931632A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

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  • Led Device Packages (AREA)

Abstract

Disclosed is a card type memory package, primarily comprising at least a memory chip, a LED chip, a plurality of contact fingers and an encapsulant. Both of the memory chip and the LED chip are disposed on an encapsulated surface of the substrate where the LED chip is located adjacent a tail side of the substrate. The contact fingers are toward a plug-in side of the substrate. The encapsulant is formed on the encapsulated surface of the substrate to simultaneously encapsulate the memory chip and the LED chip but to expose the contact fingers. Accordingly, the package has a light-indicating function to show reading and saving and is possible to simplify assembling steps.

Description

200931632 九、發明說明： 【發明所屬之技術領域] 本發明係有關於一種半導體裝置，特別係有關於一 種卡片式記憶體封裝構造。 【先前技術】 按，目前市面上常見許多類型之微小型半導體記憶 體裝置，例如USB隨身碟或sd、mini SD、Micro SD(或 ❹稱TransFlash)、MS、CF、MMC等各式記憶卡，以供電 腦、數位相機或行動電話等電子產品讀取與儲存資料， 使得消費者對於記憶體裝置需求量曰益增加。其中，又 以USB隨身碟為目前最廣泛使用之儲存記憶體裝置。 然目前記憶體裝置的製作方法組裝複雜，在一具有複數 個接觸指之模組板上設置至少一記憶體封裝構造，然後 組裝於一塑膠外殼内並在該基板之插接侧（即為該些接 觸指之設置區）接合一 USB金屬殼，之後再將一後蓋組 Q 合至該基板之尾侧（即為該插接側之相對侧），以製成具 完整電性功能之記憶體裝置。 請參閱第1圖所示，習知例如USB隨身碟之記憶體 裝置100係包含一模組基板110、複數個接觸指120、 至少一記憶體封裝構造130、一塑膠殼體140、一 USB 金屬殼150以及一後蓋160。該模組基板110係具有一 上表面111、一插接側11 2以及一相對之尾側11 3。該 些接觸指120係設置於該模組基板110之該上表面111 並鄰近該插接側112，而該記憶體封裝構造130係設置 5 200931632 在該模組基板110之該上表面U1。該塑膠殼體140係 用以固定該模組基板110於其内並作為防塵之用，其中 該塑膠殼體140係具有一延伸端141，而該些接觸指120 係外露於該延伸端14卜該USB金屬殼150係接合至該 塑膠殼體140之該延伸端141(即為該模組基板11〇之該 插接側1 12)，以構成USB接頭，可插接至一電腦的USB 插槽’以讀取儲存資料。該後蓋1 60係結合於該塑膠殼 0 體1 4 0之後端（即該模組基板11 0之該尾侧1 1 3 )，以防 止該模組基板110由該塑膠殼體丨40之後端脫出。然 而，該記憶體裝置100需經過多次加工且組裝步驟繁 雜’而組裝所需之時間也較長，造成機台生產速度慢而 無法大量生產。 【發明内容】 本發明之主要目的係在於提供一種卡片式記憶體封 裝構造，包含一 LED晶片，利用一封膠體同時密封記 〇 憶體晶片與led晶片，具有讀寫運算指示功能，並能 以COB(chiponBoard，晶片在基板上）封裝製程簡化組 裝步驟，並可縮短製程時間進而提高機台生產速度。 本發明之次—目的係在⑤提供一種卡片A記憶體封200931632 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD The present invention relates to a semiconductor device, and more particularly to a card memory package structure. [Prior Art] According to the current, many types of micro-small semiconductor memory devices are commonly available on the market, such as USB flash drives or sd, mini SD, Micro SD (or nickname TransFlash), MS, CF, MMC, etc. Reading and storing data for electronic products such as computers, digital cameras or mobile phones has increased consumer demand for memory devices. Among them, the USB flash drive is the most widely used storage memory device. However, at present, the manufacturing method of the memory device is complicated to assemble, and at least one memory package structure is disposed on a module board having a plurality of contact fingers, and then assembled in a plastic case and on the plugged side of the substrate (ie, The contact areas of the contact fingers are joined to a USB metal case, and then a back cover group Q is bonded to the tail side of the substrate (ie, the opposite side of the plug side) to form a memory with complete electrical function. Body device. Referring to FIG. 1 , a memory device 100 such as a USB flash drive includes a module substrate 110 , a plurality of contact fingers 120 , at least one memory package structure 130 , a plastic housing 140 , and a USB metal . The shell 150 and a back cover 160. The module substrate 110 has an upper surface 111, a plug side 11 2 and an opposite tail side 113. The contact fingers 120 are disposed on the upper surface 111 of the module substrate 110 adjacent to the plug-in side 112, and the memory package structure 130 is disposed on the upper surface U1 of the module substrate 110. The plastic housing 140 is used for fixing the module substrate 110 and is used for dustproofing. The plastic housing 140 has an extending end 141, and the contact fingers 120 are exposed to the extending end 14 The USB metal case 150 is coupled to the extended end 141 of the plastic case 140 (ie, the plug-in side 1 12 of the module substrate 11) to form a USB connector, which can be plugged into a USB plug of a computer. Slot 'to read stored data. The back cover 1 60 is coupled to the rear end of the plastic case 0 1 0 0 (ie, the tail side 1 1 3 of the module substrate 110) to prevent the module substrate 110 from being behind the plastic case 40 The end is out. However, the memory device 100 has to be processed a plurality of times and the assembly steps are complicated, and the assembly takes a long time, resulting in a slow production speed of the machine and inability to mass produce. SUMMARY OF THE INVENTION The main object of the present invention is to provide a card-type memory package structure, comprising an LED chip, which simultaneously seals a memory chip and a LED chip by using a gel, and has a function of reading and writing operation indication, and can The COB (chiponBoard) process simplifies the assembly process and shortens the process time and increases the machine production speed. The second aspect of the present invention provides a card A memory cover at 5

裝構造，僅需將USB 體封裝構造，即可構成具有USB插頭之記憶體裝置 以及節省組裝所 藉此簡化習知記憶體裝置之組裝步驟 需之時間。 種卡片式記憶體封 本發明之另一目的係在於提供一 6 200931632 裝構造，可在同一道的打線製程完成記憶體晶片與LED 晶片之電性連接。 依據本發明之一種卡片式記憶體封裝構造，主要包 含一基板、複數個接觸指、至少一記憶體晶片、一 LED 晶片以及一封膠體。該基板係具有一封膠表面、一外表 面、一插接側以及一尾侧。該些接觸指係設置於該基板 並朝向該插接侧。該記憶體晶片係設置於該基板之封膠 表面。該LED晶片係設置於該基板之封膠表面並鄰近 於該尾侧。該封膠體係形成於該基板之封膠表面，以同 時密封該記憶體晶片與該LED晶片但顯露該些接觸指。 本發明的目的及解決其技術問題還可採用以下技術 措施進一步實現。 在前述的卡片式記憶體封裝構造中，該LED晶片係 可具有一外露於該尾侧之發光表面。 在前述的卡片式記憶體封裝構造中，該LED晶片之 φ 該發光表面係可形成有一透光層。 在前述的卡片式記憶體封裝構造中，該封膠體係可 為透明或半透明，以使該led晶片之光線可射出。 在前述的卡片式記憶體封裝構造中，可另包含有至 少一第一銲線，其係電性連接該led晶片至該基板。 在前述的卡片式記憶體封裝構造中，可另包含有複 數個第二鮮線，其係電性連接該記憶體晶片至該基板。 在前述的卡片式記憶體封裝構造中，該第一銲線之 弧高以及該LED晶片係可對準於該封膠體之凸出部内。 7 200931632 在前述的卡片式記憶體封裝構造中’該些接觸指係 可設置於該基板之該封膠表面。 在前述的卡片式記憶體封裝構造中’該些接觸指係 可設置於該基板之該外表面。 在前述的卡片式記憶體封裝構造中’該封膠體係可 形成為一 USB隨身碟之主體。 在前述的卡片式記憶體封裝構造中’該封膠髋係可 形成為一記憶卡之主體。 ❹ 在前述的卡片式記憶體封裝構造中’該封膠體所形 成之記憶卡形狀係可為微型保全數位卡（MiCr〇 SD card) 〇 在前述的卡片式記憶體封裝構造中’可另包含有至 少一被動元件，其係設置於該基板之該封膠表面並被該 封膠體密封。 在前述的卡片式記憶體封裝構造中’該被動元件係 0 可為晶片型。 在前述的卡片式記憶體封裝構造中，可另包含有至 少一控制晶片，其係設置於該基板之該封膠表面並被該 封膠體密封。 【實施方式】 請參閱第2及3圖所示’依據本發明之第一具體實 施例，一種卡片式記憶體封裝構造200主要包含一基板 210、複數個接觸指220、至少一記憶體晶片230、一 LED晶片240以及'一封膠體250。該基板210係具有一 200931632 封膠表面211、一外表面212、一插接侧2i3以及一尾 側214，其中該封膠表面211係用以設置該記憶體晶片 230與該LED晶片240並被該封膠體25〇所覆蓋，所謂 「外表面」係指不被該封膠體250所覆蓋之表面。該基 板210之該封膠表面211係形成有複數個内接墊215。 請參閱第3圖所示，該些接觸指22〇係設置於該基 板210並朝向該插接侧213，以作為該卡片式記憶體封 ❹ 裝構造200對外接觸之連接點。在本實施例中，該些接 觸指220係可設置於該基板210之該封膠表面211。 該記憶體晶片230係設置於該基板210之封膠表面 2 11。該記憶體晶片2 3 0係可為快閃記憶體晶片或非揮 發性記憶體晶片。請參閱第3圖所示，該LED晶片240 係設置於該基板210之封膠表面211並鄰近於該尾侧 2 1 4。在本實施例中，該記憶體晶片230與該LED晶片 240可利用非導電性或導電性黏著材料固定於該基板 q 210之該封膠表面211上。該LED晶片240係可具有一 外露於該尾侧2 1 4之發光表面241。較佳地，該LED晶 片240之該發光表面241係可形成有一透光層242，以 供該LED晶片240之光線射出，故該封膠體250係為 非透光性，一般為黑色。請參閱第5圖所示，該卡片式 記憶體封裝構造200係可另包含有至少一第一銲線 261，其係電性連接該LED晶片240至該基板210之該 些内接墊215。而該記憶體晶片230係可藉由複數個第 二銲線262以電性連接該記憶體晶片230至該基板210 9 200931632 之該些内接整215’故可在同一道的打線製程完成該記 憶體晶片230與該LED晶片24〇之電性連接。 較佳地，該卡片式記憶體封裝構造2 00可另包含有 至少一被動元件270以及至少—控制晶片（圖未繪出）， 其係設置於該基板210之該封膠表面211並被該封膠體 250密封。在本實施例中’該被動元件270係可為晶片 型。 請參閱第3及5圖所示，該封膠體250係形成於該 ❹ 基板210之封膠表面211，以同時密封該記憶體晶片23〇 與該LED晶片240但顯露該些接觸指220，故僅需一次 形成封膠趙便可獲得具完整電氣功能之卡片式記憶體 封裝構造200。該封膠體250係可採用模封、印刷或塗 晝膠的技術’以連續地覆蓋該基板210之封膠表面 2Π ’能同時密封該記憶體晶片230與該LED晶片240。 在本實施例中，該封膠體25 0係可為非透明之膠體，該 Q LED晶片240之光線可藉由該透光層242，將光線射 出。在本實施例中，該封膠體250係可形成為一 USB 隨身碟之主體。所謂USB係為一種國際通用的連接器 規範，為Universal Serial Bus之簡稱，中文稱之為通 用串列匯流排。請參閱第2圖所示，當該封膠體250為 一 USB隨身碟之主體時，可將一 USB金屬殼30接合在 該基板210之該插接侧213，該USB金屬殼30係遮蓋 該些接觸指220 ’並與該些接觸指220構成一USB接 頭，用以插接至一如電腦主機、筆記型電腦等電子產品 10 200931632 之USB插槽或是轉接器之USB插槽’以儲存或讀取數 位資料。其中，該USB金屬殼30係為導電金屬材質， 例如不錄鋼。 在上述之卡片式記憶體封裝構造200之製造過程 中，如第4圖所示，複數個基板2 10係以矩陣排列方式 一體連接於一基板條20上。如第5圖所示’並可在每 一基板210上設置該記憶體晶片230與該LED晶片 240，或可更設置該被動元件270及控制晶片（圖未繪 Θ 出）。如第3圖所示’在形成封膠體之過程中，該封膠 體250可同時密封該記憶體晶片230、該LED晶片240 以及該第一銲線261與該些第二銲線262’甚至該被動 元件270及控制晶片，而能獲得複數個位於該基板條 20上之卡片式記憶體封裝構造，藉以簡化製程步驟以 及縮短製程時間進而提高機台生產速度。利用雷射或鑛 切技術切割該基板條20’可獲得複數個可發光之卡片 Q 式記憶體封裝構造200，故採用COB(晶片在基板上）封 裝製程，能將讀存指示燈功能整合於半導體封裝作業， 大幅減少組裝步驟。在本實施例中，請再參閱第2圖所 示，僅需將該USB金屬殼30連接組裝於該卡片式記憶 體封裝構造200,即可構成一具有USB插頭之記憶體震 置，如隨身碟，故可簡化習知記憶體裝置之組裝步驟， 並能節省組裝所需之時間，以提高產量。 在本發明之第二具體實施例中’如第6圖所示，另 一種卡片式記憶體封裝構造300主要包含一基板31〇、 11 200931632 複數個接觸指320、至少一記憶體晶片330、一 LED晶 片340以及一封膠體350。該基板310係具有一封膠表 面3 11、一外表面3 1 2、一插接侧3 1 3以及一尾侧3 1 4。 該些接觸指320係設置於該基板310並朝向該插接側 313。在本實施例中，該些接觸指320係可設置於該基 板310之該外表面312。請參閱第7圖所示，該記憶體 晶片330與該LED晶片340係設置於該基板310之封 膠表面311，其中該LED晶片340係鄰近於該基板310 之該尾侧314。該LED晶片340係可具有一外露於該尾 側3 14之發光表面341。請參閲第7圖所示，在本實施 例中’該LED晶片340係藉由一第一銲線361以電性 連接該LED晶片340至該基板310，而該記憶體晶片 330係藉由複數個第二銲線362電性連接該記憶體晶片 330至該基板310。 請參閱第6及7圖所示，該封膠體35〇係形成於該The mounting structure allows the USB body package structure to be constructed, thereby constituting a memory device having a USB plug and saving assembly time, thereby simplifying the assembly steps of the conventional memory device. A card type memory pack Another object of the present invention is to provide a 6 200931632 package structure for electrically connecting a memory chip and an LED chip in the same wire bonding process. A card memory package structure according to the present invention mainly comprises a substrate, a plurality of contact fingers, at least one memory chip, an LED chip, and a gel. The substrate has a glue surface, an outer surface, a plug side, and a tail side. The contact fingers are disposed on the substrate and face the plug side. The memory chip is disposed on a surface of the sealing of the substrate. The LED chip is disposed on a surface of the encapsulant of the substrate adjacent to the tail side. The encapsulation system is formed on the encapsulation surface of the substrate to simultaneously seal the memory wafer and the LED wafer but expose the contact fingers. The object of the present invention and solving the technical problems thereof can be further realized by the following technical measures. In the card memory package structure described above, the LED chip can have a light emitting surface exposed on the trailing side. In the above card-type memory package structure, the light-emitting surface of the LED chip may be formed with a light-transmitting layer. In the card memory package construction described above, the encapsulation system can be transparent or translucent to allow light from the LED wafer to be ejected. In the card memory package structure described above, at least one first bonding wire may be further included, which electrically connects the LED wafer to the substrate. In the card memory package structure described above, a plurality of second fresh lines may be further included, which electrically connect the memory chips to the substrate. In the card memory package construction described above, the arc height of the first bonding wire and the LED chip can be aligned in the projection of the encapsulant. 7 200931632 In the aforementioned card-type memory package construction, the contact fingers can be disposed on the surface of the encapsulant of the substrate. In the aforementioned card type memory package structure, the contact fingers may be disposed on the outer surface of the substrate. In the card memory package construction described above, the encapsulation system can be formed as a body of a USB flash drive. In the aforementioned card type memory package structure, the encapsulating hip system can be formed as a main body of a memory card. ❹ In the card memory package structure described above, the memory card shape formed by the encapsulant may be a micro-preserved digital card (MiCr〇SD card). In the card memory package structure described above, At least one passive component disposed on the surface of the encapsulant of the substrate and sealed by the encapsulant. In the aforementioned card type memory package structure, the passive element system 0 may be of a wafer type. In the card memory package structure described above, at least one control wafer may be further disposed on the sealing surface of the substrate and sealed by the sealing body. [Embodiment] Referring to the first embodiment of the present invention, a card-type memory package structure 200 mainly includes a substrate 210, a plurality of contact fingers 220, and at least one memory wafer 230. , an LED wafer 240 and 'a gel 250. The substrate 210 has a 200931632 sealing surface 211, an outer surface 212, a plugging side 2i3, and a tail side 214. The sealing surface 211 is used to set the memory chip 230 and the LED wafer 240. The encapsulant 25 is covered, and the "outer surface" means a surface that is not covered by the encapsulant 250. The encapsulation surface 211 of the substrate 210 is formed with a plurality of inner pads 215. Referring to Fig. 3, the contact fingers 22 are disposed on the substrate 210 and face the insertion side 213 as a connection point for external contact of the card-type memory package mounting structure 200. In this embodiment, the contact fingers 220 are disposed on the sealing surface 211 of the substrate 210. The memory chip 230 is disposed on the sealing surface 211 of the substrate 210. The memory chip 230 can be a flash memory chip or a non-volatile memory chip. Referring to FIG. 3, the LED chip 240 is disposed on the sealing surface 211 of the substrate 210 adjacent to the trailing side 2 14 . In this embodiment, the memory chip 230 and the LED wafer 240 may be fixed on the sealing surface 211 of the substrate q 210 by using a non-conductive or conductive adhesive material. The LED chip 240 can have a light emitting surface 241 exposed to the trailing side 2 1 4 . Preferably, the light emitting surface 241 of the LED wafer 240 is formed with a light transmissive layer 242 for emitting light from the LED chip 240. Therefore, the encapsulant 250 is non-transparent, generally black. As shown in FIG. 5, the card memory package structure 200 can further include at least one first bonding wire 261 electrically connecting the LED chip 240 to the inner pads 215 of the substrate 210. The memory chip 230 can be electrically connected to the memory chip 230 to the substrate 210 9 200931632 by a plurality of second bonding wires 262, so that the wire bonding process can be completed in the same wire bonding process. The memory chip 230 is electrically connected to the LED chip 24A. Preferably, the card memory package structure 200 may further include at least one passive component 270 and at least a control chip (not shown) disposed on the sealing surface 211 of the substrate 210 and The sealant 250 is sealed. In the present embodiment, the passive component 270 can be of a wafer type. Referring to FIGS. 3 and 5, the encapsulant 250 is formed on the encapsulation surface 211 of the substrate 210 to simultaneously seal the memory chip 23 and the LED wafer 240 but expose the contact fingers 220. A card-type memory package structure 200 having a complete electrical function can be obtained by forming the sealant Zhao once. The encapsulant 250 can be formed by simultaneously sealing the surface of the encapsulant 2' with the technique of molding, printing or coating to seal the memory wafer 230 and the LED wafer 240. In this embodiment, the encapsulant 25 0 can be a non-transparent colloid, and the light of the Q LED wafer 240 can be emitted by the light transmissive layer 242. In this embodiment, the encapsulant 250 can be formed as a body of a USB flash drive. The so-called USB is an internationally accepted connector specification, which is the abbreviation of Universal Serial Bus, which is called a general-purpose serial bus in Chinese. Referring to FIG. 2, when the encapsulant 250 is a main body of a USB flash drive, a USB metal shell 30 can be bonded to the plug-in side 213 of the substrate 210. The USB metal shell 30 covers the plug-in side. The contact finger 220' and the contact finger 220 form a USB connector for plugging into a USB slot of an electronic product 10 200931632 such as a computer mainframe or a notebook computer or a USB slot of the adapter to store Or read digital data. The USB metal shell 30 is made of a conductive metal material, for example, without recording steel. In the manufacturing process of the card-type memory package structure 200 described above, as shown in Fig. 4, a plurality of substrates 2 10 are integrally connected to a substrate strip 20 in a matrix arrangement. As shown in FIG. 5, the memory chip 230 and the LED chip 240 may be disposed on each of the substrates 210, or the passive component 270 and the control wafer may be further disposed (not shown). As shown in FIG. 3, in the process of forming the encapsulant, the encapsulant 250 can simultaneously seal the memory chip 230, the LED wafer 240, and the first bonding wire 261 and the second bonding wires 262'. The passive component 270 and the control chip can obtain a plurality of card-type memory package structures on the substrate strip 20, thereby simplifying the process steps and shortening the processing time to increase the speed of the machine. By cutting the substrate strip 20' by laser or mineral cutting technology, a plurality of illuminable card Q-type memory package structures 200 can be obtained, so that the COB (on-wafer on substrate) packaging process can be used to integrate the read and write indicator functions. Semiconductor packaging operations significantly reduce assembly steps. In this embodiment, please refer to FIG. 2 again, and only the USB metal shell 30 needs to be connected to the card memory package structure 200 to form a memory with a USB plug, such as a portable body. The disc can simplify the assembly steps of the conventional memory device and save the time required for assembly to increase the yield. In a second embodiment of the present invention, as shown in FIG. 6, another card-type memory package structure 300 mainly includes a substrate 31〇, 11 200931632, a plurality of contact fingers 320, at least one memory chip 330, and a The LED chip 340 and a colloid 350. The substrate 310 has a rubber surface 31, an outer surface 3 1 2, a plug side 3 1 3 and a tail side 3 14 . The contact fingers 320 are disposed on the substrate 310 and face the plug side 313. In the present embodiment, the contact fingers 320 can be disposed on the outer surface 312 of the substrate 310. Referring to FIG. 7, the memory chip 330 and the LED chip 340 are disposed on the sealing surface 311 of the substrate 310, wherein the LED chip 340 is adjacent to the tail side 314 of the substrate 310. The LED wafer 340 can have a light emitting surface 341 that is exposed on the trailing side 314. Referring to FIG. 7, in the embodiment, the LED chip 340 is electrically connected to the LED chip 340 by a first bonding wire 361, and the memory chip 330 is used by the memory chip 330. A plurality of second bonding wires 362 are electrically connected to the memory chip 330 to the substrate 310. Referring to Figures 6 and 7, the encapsulant 35 is formed in the

基板310之封膠表面3u，以同時密封該記憶體晶片33〇 與該LED晶片340但顯露該些接觸指32〇。在本實施例 中，該封膠體350係可為全透明或半透明，以使該led 晶片340之光線可射出（如第8圖所示）。該封膠體35〇 係可進一步混合有各種顏料（如黃色或藍色）等可改變 顏色之半透明混合式封裝好M ^ ^ ± ^ 可装材枓。較佳地，請再參閱第6 圖所示，該第一録綠Κι > 綠361之弧高以及該led晶片340 係可對準於該封膠體350之凸 中，該封膠體350係可形成為 出.部3 5 1内。在本實施例 一記憶卡之主體。請參閱 12 200931632 第8及9圖所示，該封膠體35〇所形成之記憶卡形狀係 可為微型保全數位卡（Micr〇 SD card)。然而不受限制 地在不同實施例中，該封膠體35〇所形成之記憶卡形狀The sealing surface 3u of the substrate 310 is used to simultaneously seal the memory wafer 33 and the LED wafer 340 but expose the contact fingers 32. In this embodiment, the encapsulant 350 can be fully transparent or translucent so that the light of the led wafer 340 can be emitted (as shown in FIG. 8). The encapsulant 35 can be further mixed with a variety of pigments (such as yellow or blue), such as a translucent hybrid package that can change color, M ^ ^ ± ^ can be loaded. Preferably, please refer to FIG. 6 again, the arc height of the first green Κ > green 361 and the LED wafer 340 can be aligned in the protrusion of the sealant 350, and the sealant 350 can be Formed as a part of the 3 5 1 inside. In the present embodiment, the main body of a memory card. Please refer to 12 200931632, as shown in Figures 8 and 9. The shape of the memory card formed by the sealant 35〇 can be a Micr〇 SD card. However, in various embodiments, the shape of the memory card formed by the sealant 35〇 is not limited.

亦可為保全數位卡（SD card)、mini SD、MS、CF、MMC 等記憶卡。 以上所述，僅是本發明的較佳實施例而已，並非對本發 明作任何形式上的限制，本發明技術方案範圍當依所附申請 ❹專利範圍為準。任何熟悉本專業的技術人員可利用上述揭示 的技術内容作出些許更動或修飾為等同變化的等效實施 例，但凡是未脫離本發明技術方案的内容，依據本發明的技 術實質對以上實施例所作的任何簡單修改、等同變化與修 飾’均仍屬於本發明技術方案的範圍内。 、乂 【圖式簡單說明】 1圖.習知記憶體裝置之元件分解之立體示意圖。 2圖：依據本發明之第一具體實施例，一種卡 憶體封裝構造之立體示意圖。 3圖：依據本發明之第一具體實施例，該卡片式記情 體封裝構造之截面示意圖。 4圖：依據本發明之第一具體實施例，該卡片式記怜 體封裝構造之基板形成於一基板條之I 〜τ面不 意圖。 第 第 〇 第 第 第5圖：依據本發明之第一具體實施例，該卡片式記憶 體封裝構造在封膠前之截面示意圖。 第6圖：依據本發明之第二具體實施例，一種卡片式記 13 200931632 憶體封裝構造之截面示意圖° 第7圖：依據本發明之第二具體實施例’該卡片式記憶 體封裝構造在封膠前之截面示意圖° 第8圖：依據本發明之第二具體實施例，該卡片式記憶 體封裝構造在成形後之打印面立體示意圖。 第9圖：依據本發明之第二具體實施例，該卡片式記憶 體封裝構造在成形後之基板面立體示意圖。 【主要元件符號說明】 20 基板條 30 USB金屬殼 100 記憶體裝置 110 模組基板 111上表面 112 插接側 113 尾侧 120 接觸指 130記憶體封裝構造 140 塑膠殼體 141延伸端 150 USB金屬殼 160後蓋 200 卡片式記憶體封裝構造 210 基板 211封膠表面 212 外表面 213 插接側 214尾侧 215 内接墊 220 接觸指 230記憶體晶片 240 LED晶片 250封膠體 270被動元件 241發光表面 261第一銲線 242 262 透光層 第二鲜線 300 卡片式記憶體封裝構造 310 基板 311封膠表面 312 外表面 14 200931632 313 插接側 314 尾側 320 接觸指 330 記憶體晶片 340 LED晶片 341 發光表面 350 封膠體 351 凸出部 361 第一銲線 362 第二銲線 〇 15It can also be used to save memory cards such as SD card, mini SD, MS, CF, MMC. The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. The scope of the present invention is defined by the scope of the appended claims. Any person skilled in the art can make some modifications or modifications to the equivalent embodiments by using the technical content disclosed above, but the content of the technical solution of the present invention is made according to the technical essence of the present invention without departing from the technical solution of the present invention. Any simple modifications, equivalent changes and modifications are still within the scope of the technical solutions of the present invention.乂 [Simple description of the diagram] 1 Fig. Stereoscopic diagram of the component decomposition of the conventional memory device. 2 is a perspective view of a card memory package structure in accordance with a first embodiment of the present invention. 3 is a cross-sectional view showing the structure of the card type sensible package according to the first embodiment of the present invention. 4: According to a first embodiment of the present invention, the substrate of the card type pictorial package structure is formed on the I to τ plane of a substrate strip. Fig. 5 is a cross-sectional view showing the card-type memory package structure before sealing, in accordance with a first embodiment of the present invention. Figure 6 is a cross-sectional view showing a structure of a memory card according to a second embodiment of the present invention. Figure 7 is a cross-sectional view of a memory package structure according to a second embodiment of the present invention. Cross-sectional view before sealing. FIG. 8 is a perspective view of the printing surface of the card-type memory package structure after forming according to the second embodiment of the present invention. Fig. 9 is a perspective view showing the substrate surface of the card-type memory package structure after molding according to a second embodiment of the present invention. [Main component symbol description] 20 substrate strip 30 USB metal case 100 memory device 110 module substrate 111 upper surface 112 plug side 113 tail side 120 contact finger 130 memory package structure 140 plastic case 141 extended end 150 USB metal case 160 rear cover 200 card memory package structure 210 substrate 211 sealing surface 212 outer surface 213 plug side 214 tail side 215 inner pad 220 contact finger 230 memory chip 240 LED wafer 250 encapsulant 270 passive element 241 light emitting surface 261 First bonding wire 242 262 light transmitting layer second fresh wire 300 card memory package structure 310 substrate 311 sealing surface 312 outer surface 14 200931632 313 plug side 314 tail side 320 contact finger 330 memory chip 340 LED chip 341 light Surface 350 sealant 351 projection 361 first bond wire 362 second bond wire 15

Claims (1)

200931632 十、申請專利範圍： 1、 一種卡片式記憶體封裝構造，主要包含： 一基板，係具有一封膠表面、一外表面、一插接側以及 一尾側； 複數個接觸指，係設置於該基板並朝向該插接側； 至少一記憶體晶片’係設置於該基板之該封膠表面； 一 LED晶片，係設置於該基板之該封膠表面並鄰近於 該尾側；以及 一封膠體’係形成於該基板之該封膠表面，以同時密封 該記憶體晶片與該LED晶片但顯露該些接觸指。 2、 如申請專利範圍第1項所述之卡片式記憶體封裝構造， 其中該LED晶片係具有一外露於該尾侧之發光表面。 3、 如申請專利範圍第2項所述之卡片式記憶體封裝構造， 其中該LED晶片之該發光表面係形成有一透光層。 4、 如申請專利範圍第！或3項所述之卡片式記憶體封裝 構造’其中該封膠體係為不透光》 5、 如申請專利範圍第1項所述之卡片式記憶體封裝構造， 其中該封膠體係為透明或半透明，以使該LED晶片之光 線可射出。 6、 如申請專利範圍第丨項所述之卡片式記憶體封裝構造， 另包含有至少一第一銲線，其係電性連接該LED晶片至 該基板。 7、 如申請專利範圍第6頊所述之卡片式記憶體封裝構造， 另包含有複數個第二銲線’其係電性連接該記憶體晶片 16 200931632 至該基板。 8、 如申請專利範圍第6項所述之卡片式記憶體封裝構造， 其中該第一辉線之孤高以及該LED晶片係對準於該封 膠體之凸出部内。 9、 如申請專利範圍第i項所述之卡片式記憶體封裝構造， 其中該些接觸指係設置於該基板之該封膠表面。 10、 如申請專利範圍第i項所述之卡片式記憶體封裝構 造’其中該些接觸指係設置於該基板之該外表面。 η、如中請專利範圍第i項所述之卡片式記憶體封裝構 造’其中該封膠體係形成為一 USB隨身碟之主體。 12、 如"㈣範圍第丨項所述之卡片式錢體封裝構 造’其中該封膠體係為不透光。 13、 如中請專利範圍第i或8項所述之卡片式記憶體封裝 構造’其中該封膠體係形成為一記憶卡之主體。 …如申請專利範圍第13項所述之卡片式記憶體封裝構 造’其中該封膠體係為透明或半透明。 15、 如申請專利範圍第13項所述之卡片式記憶體封裝構 造’其中該封膠體所形成之記憶卡形狀係綠型保全數 位卡（Micro SD card)。 16、 如中請專利範圍第i項所述之卡片式記憶體封裝構 造，另包含有至少-被動元件’其係設置於該基板之該 封膠表面並被該封膠體密封。 17、 如中請專利範圍第16項所述之卡片式記憶體封裝構 造’其中該被動元件係為晶片型。 17200931632 X. Patent application scope: 1. A card-type memory package structure, which mainly comprises: a substrate having a glue surface, an outer surface, a plug side and a tail side; a plurality of contact fingers, a system setting The at least one memory chip is disposed on the sealing surface of the substrate; an LED chip is disposed on the sealing surface of the substrate adjacent to the tail side; and An encapsulant is formed on the surface of the encapsulant of the substrate to simultaneously seal the memory wafer and the LED wafer but expose the contact fingers. 2. The card-type memory package structure of claim 1, wherein the LED chip has a light-emitting surface exposed on the trailing side. 3. The card-type memory package structure of claim 2, wherein the light-emitting surface of the LED chip is formed with a light-transmitting layer. 4, such as the scope of application for patents! Or the card-type memory package structure of the invention, wherein the sealing system is opaque, and the card-type memory package structure according to claim 1, wherein the sealing system is transparent or Translucent so that the light of the LED chip can be emitted. 6. The card memory package structure of claim 2, further comprising at least one first bonding wire electrically connecting the LED chip to the substrate. 7. The card-type memory package structure of claim 6, further comprising a plurality of second bonding wires ′ electrically connected to the memory chip 16 200931632 to the substrate. 8. The card-type memory package structure of claim 6, wherein the ligation height of the first illuminating line and the LED chip are aligned in the embossing portion of the encapsulant. 9. The card-type memory package structure of claim i, wherein the contact fingers are disposed on the surface of the encapsulant of the substrate. 10. The card-type memory package structure of claim i, wherein the contact fingers are disposed on the outer surface of the substrate. η. The card-type memory package structure as described in claim i of the patent scope, wherein the encapsulation system is formed as a body of a USB flash drive. 12. The card-type money body package structure as described in the item (4), wherein the sealant system is opaque. 13. The card type memory package structure as described in claim i or 8 of the patent, wherein the encapsulation system is formed as a main body of a memory card. The card-type memory package structure as described in claim 13 wherein the sealant system is transparent or translucent. 15. The card-type memory package structure according to claim 13 wherein the memory card formed by the sealant is a micro SD card. 16. The card-type memory package structure of claim i, further comprising at least a passive component disposed on the surface of the encapsulant of the substrate and sealed by the encapsulant. 17. The card-type memory package structure of claim 16, wherein the passive component is of a wafer type. 17
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI833565B (en) * 2023-02-01 2024-02-21 華東科技股份有限公司 Embedded dual in-line memory module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI833565B (en) * 2023-02-01 2024-02-21 華東科技股份有限公司 Embedded dual in-line memory module

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