TWI289371B - Micro USB flash drive with card reading capability - Google Patents

Micro USB flash drive with card reading capability Download PDF

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Publication number
TWI289371B
TWI289371B TW095122769A TW95122769A TWI289371B TW I289371 B TWI289371 B TW I289371B TW 095122769 A TW095122769 A TW 095122769A TW 95122769 A TW95122769 A TW 95122769A TW I289371 B TWI289371 B TW I289371B
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Taiwan
Prior art keywords
card
usb
memory
memory package
brick
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Application number
TW095122769A
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Chinese (zh)
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TW200803054A (en
Inventor
Hong-Chi Yu
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Walton Advanced Eng Inc
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Priority to TW095122769A priority Critical patent/TWI289371B/en
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Publication of TWI289371B publication Critical patent/TWI289371B/en
Publication of TW200803054A publication Critical patent/TW200803054A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71

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  • Credit Cards Or The Like (AREA)

Abstract

A micro USB flash drive with card reading capability, mainly includes a front USB joint, a memory encapsulated brick, and a rear plug. The brick is disposed inside the joint and includes an encapsulant, a wiring substrate on the encapsulant, and at least a flash memory chip encapsulated in the encapsulant. The substrate has an outside surface with a plurality of USB contact fingers and a plurality of card-reading contact fingers exposed. The plug is fixed to the rear opening of the joint. The plug has a memory card socket and a tail fastener, wherein the fastener wedges a side of the brick to prevent the brick escaped from the joint. Accordingly, the flash drive is configured for insertion of a memory card.

Description

•1289371 九、發明說明： 【發明所屬之技術領域】 本發明係有關於可播式儲存裝置，特別係有關於一 種可讀卡之微型USB隨身碟，其整體尺寸接近傳統 USB隨身碟之前置USB接頭。 【先前技術】 按，刪隨身碟（USB flash drive，其中麵是 UlliVerSal SerU1 BUS的簡寫，其中文為通用串列匯流 排）已是相當普遍的可攜式儲存裝置，USB隨身碟又可 稱為小型行動碟（mini walking drive)、大拇哥、快閃 碟等等。一般而言，USB隨身碟係具有_ _接頭，BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a playable storage device, and more particularly to a micro USB flash drive with a readable card, the overall size of which is close to that of a conventional USB flash drive. USB connector. [Prior Art] Press and delete the USB flash drive (the USB flash drive, which is the abbreviation of UlliVerSal SerU1 BUS, its Chinese is a universal serial bus). It is a very popular portable storage device. The USB flash drive can also be called Mini walking drive, thumb, flash drive, etc. In general, the USB flash drive has a _ _ connector.

可插接至一如電腦主機、筆記型電腦等電子產品之 USB插槽或是轉接器之勵插槽，以儲存或讀取數位 資料。目前USB隨身碟的USB接頭主要是由一方形金 屬殼與一塑膠絕緣子所構成，且該塑膠絕緣子内設有 複數個USB端子。在USB接頭之後端焊接有一印刷電 路板，板上表面結合有記憶體封裝件與各式電子元 件，並以一塑膠外殼包覆該印刷電路板。整個usb隨 身碟的尺寸約在USB接頭之尺寸三倍以上。 如同Lee等人在美國專利第6,854,984號所揭示的 USB隨身碟，USB接頭可焊接在一印刷電路板，或者， USB接頭之塑膠絕緣子與uSB端子可由印刷電路板之 一延伸側所構成。快閃記憶體封裝件是表面接合在該 印刷電路板上且位在USB接頭之外，故USB隨身碟的 5 •1289371 能。 尺寸是遠大於USB接頭，且不具有記憶體擴充之功 【發明内容】 為了解決上述之問題，本發明之主要目的係在於提 供-種可讀卡之微型USB隨身碟，能將隨身碟包含記 憶體之主要元件整合並料尺寸如同傳統 < 議接 頭，更兼具有讀卡以擴充記憶體容量的功能。 本發明之次一目的係在於提供一種可^卡之微型 USB隨身# ’能限制一記憶體封裝碑塊在一前置刪接 口不可脫出’並能重複插拔一如微型保全數位卡㈤⑽SD card)之記憶卡至該前置USB接口内。 本發明的目的及解決其技術問題是採用以下技術 方案來實現的。本發明揭示一種可讀卡之微型uSB隨 身碟’主要包含-前置USB接Π、—記憶體封裝碑塊以 及一尾塞封蓋。該記憶體封裝碑塊係容置於該前置usb 接口内，該記憶體封裝磚塊係包含一封膠體與一在該封膠體 表面之電路板，該封膠體内封設有至少一快閃記憶體晶片， 該電路板之外表面形成有複數個USB接觸指與複數個讀卡 接指。該尾塞封蓋係結合於該前置USB接口之後端，該尾 塞封盍係具有一記憶卡插接槽與一扣接尾，該扣接尾係卡扣 該記憶體封裝磚塊之一侧緣，以防止該記憶體封裝碑塊由該 前置USB接口脫出。另揭示該微型usb隨身碟之記憶體 封裝磚塊之具體結構。 本發明的目的及解決其技術問題還可採用以下技 術措施進一步實現。 6 ♦1289371 前述的可讀卡之微型USB隨身碟，其中該些讀卡接 指係顯露且位於由該記憶體封裝碑塊與該尾塞封蓋之該記 憶卡插接槽所構成的空間内。 前述的可讀卡之微型USB隨身碟，其中由該記憶體 封裝碑塊與該尾塞封蓋之該記憶卡插接槽所構成的空間大 小係可容許一微型保全數位卡（Micro SD card)之插置。 前述的可讀卡之微型USB隨身碟，其中該前置USB 接口係具有一前插置端，其係形成有一擋唇。It can be plugged into a USB slot such as a computer mainframe, a notebook computer, or an adapter slot for storing or reading digital data. At present, the USB connector of the USB flash drive is mainly composed of a square metal shell and a plastic insulator, and the plastic insulator has a plurality of USB terminals. A printed circuit board is soldered to the rear end of the USB connector, and the upper surface is combined with a memory package and various electronic components, and the printed circuit board is covered with a plastic outer casing. The size of the entire usb flash drive is about three times larger than the size of the USB connector. The USB connector can be soldered to a printed circuit board, or the plastic insulator and uSB terminal of the USB connector can be formed by an extended side of the printed circuit board, as in the USB flash drive disclosed in U.S. Patent No. 6,854,984. The flash memory package is surface bonded to the printed circuit board and is located outside of the USB connector, so the USB • 129379371 can. The size is much larger than the USB connector, and does not have the function of memory expansion. [Invention] In order to solve the above problems, the main object of the present invention is to provide a micro USB flash drive with a readable card, which can contain the memory of the flash drive. The main components of the body are integrated and the size of the material is the same as the traditional < connection, and has the function of reading the card to expand the memory capacity. The second object of the present invention is to provide a micro USB portable device that can be used to limit a memory package block to be unplugged in a front-mounted interface and can be repeatedly inserted and removed as a micro-protected digital card (5) (10) SD card. ) The memory card is in the front USB port. The object of the present invention and solving the technical problems thereof are achieved by the following technical solutions. The present invention discloses a micro-uSB flash drive for a readable card, which mainly includes a front USB connector, a memory package block, and a tail plug cover. The memory package block is disposed in the front USB interface, and the memory package brick comprises a glue body and a circuit board on the surface of the sealant, and the seal body is sealed with at least one flash The memory chip has a plurality of USB contact fingers and a plurality of card reader fingers formed on the outer surface of the circuit board. The tail plug cover is coupled to the rear end of the front USB interface, the tail plug sealing system has a memory card insertion slot and a buckle tail, and the buckle tail buckles a side edge of the memory package brick To prevent the memory package block from coming out of the front USB interface. The specific structure of the memory package brick of the micro usb flash drive is also disclosed. The object of the present invention and solving the technical problems thereof can be further achieved by the following technical measures. 6 ♦1289371 The aforementioned micro-USB flash drive of the readable card, wherein the read card fingers are exposed and located in a space formed by the memory package block and the memory card insertion slot of the tail plug cover . The micro USB flash drive of the aforementioned readable card, wherein the space formed by the memory package block and the memory card insertion slot of the tail plug can accommodate a micro SD card. Interposed. The aforementioned micro USB flash drive of the readable card, wherein the front USB interface has a front insertion end, which is formed with a lip.

鲁 前述的可讀卡之微型USB隨身碟，其中該前置USB 接口係為防靜電金屬方殼。 前述的可讀卡之微型USB隨身碟，其中該尾塞封蓋 於該記憶卡插接槽之一側係裝設有一扣接彈片。 前述的可讀卡之微型USB隨身碟，其中該封膠體係 為方塊狀’其周邊尺寸係平齊於該電路板之側邊。 前述的可讀卡之微型USB隨身碟，其中該封膠體係 φ 以轉移模製（transfer molding)方式形成。 前述的可讀卡之微型USB隨身碟，其中該記憶體封 裝碑塊之該電路板係為COB封裝基板。 【實施方式】 請參閱第1及2圖，在本發明之第一具體實施例 中’一種可讀卡之微型USB隨身碟1〇〇主要包含一前 置USB接口 11〇、一記憶體封裝磚塊12〇以及一尾塞封蓋 1 3 0 〇 該前置USB接口 U0係為導電金屬材質，如不銹鋼，可 7 ‘1289371 由一金屬板經裁切後一體彎折成形，可成為一防靜電金屬方 殼。該前置USB接口 11〇係具有一前插置端與一後開口端， 其中該前插置端110係形成有一擋唇i i i，以防止該記憶體 封裝碑塊120由該前插置端脫出。 該記憶體封裝磚塊120係容置於該前置USB接口 11〇 内。如第3圖所示，該記憶體封裝碑塊12〇係包含一封膠體 121與一在該封膠體121表面之電路板ι22。該封膠體l2i 内封設有至少一快閃記憶體晶片123，其係設置於該電路板 122之内表面122B。另該電路板122之外表面122A形成有 複數個USB接觸指124與複數個讀卡接指125。在本實施例 中’該記憶體封裝磚塊120之該電路板122係為 COB(Chip-On-Board)封裝基板，該封膠體ι21内可另封設有 所需要的被動元件126與控制器晶片127,亦可設置於該電 路板122之内表面122B。此外，可利用目前已知的轉接卡 讀卡機制’將其内建於該記憶體封裝磚塊丨2〇内，便可經由 ”衾些4卡接指12 5達到讀卡電性傳遞功能，在此不予贅述。 在本實施例中，該封膠體121係為方塊狀，其周邊尺寸係平 齊於該電路板122之侧邊，其尺寸可等同傳統USB接頭之 絕緣子。通常該封膠體12 1係以轉移模製方式形成，以符合 更為準確的尺寸要求。此外，該些讀卡接指125上係可設有 複數個彈片128,譬如能以點焊方式固定在該些讀卡接指125 上，以供電接觸一記憶卡之接觸指（圖未繪出）。在本實施例 中，該些USB接觸指124上亦設有複數個彈片128，以供電 接觸一 USB插槽之端子（圖未繪出）。 ，1289371Lu The aforementioned micro-USB flash drive of the readable card, wherein the front USB interface is an anti-static metal square shell. The micro-USB flash drive of the aforementioned readable card, wherein the tail plug cover is provided with a fastening elastic piece on one side of the memory card insertion slot. The aforementioned micro-USB flash drive of the readable card, wherein the encapsulation system is square-shaped, and its peripheral dimension is flush with the side of the circuit board. A micro USB flash drive of the aforementioned readable card, wherein the sealant system φ is formed by transfer molding. The aforementioned micro-USB flash drive of the readable card, wherein the circuit board of the memory sealed monument is a COB package substrate. [Embodiment] Please refer to Figures 1 and 2, in a first embodiment of the present invention, a micro USB flash drive 1 readable card mainly includes a front USB interface 11 〇, a memory package brick Block 12〇 and a tail plug cover 1 3 0 〇 The front USB interface U0 is made of conductive metal material, such as stainless steel, can be 7 '1289371 by a metal plate after cutting and integrally bent to form an anti-static Metal square shell. The front USB port 11 has a front insertion end and a rear open end, wherein the front insertion end 110 is formed with a lip iii to prevent the memory package block 120 from being removed from the front insertion end. Out. The memory package brick 120 is housed in the front USB interface 11A. As shown in Fig. 3, the memory package block 12 includes a glue body 121 and a circuit board ι22 on the surface of the sealant body 121. The encapsulant l2i is internally provided with at least one flash memory chip 123 disposed on the inner surface 122B of the circuit board 122. In addition, the outer surface 122A of the circuit board 122 is formed with a plurality of USB contact fingers 124 and a plurality of card reader fingers 125. In the present embodiment, the circuit board 122 of the memory package brick 120 is a COB (Chip-On-Board) package substrate, and the required passive component 126 and controller can be additionally sealed in the seal body ι21. The wafer 127 may also be disposed on the inner surface 122B of the circuit board 122. In addition, the currently known riser card reading mechanism can be built into the memory package bricks 2, and the card can be electrically transferred via the "4 card fingers 12 5". In the present embodiment, the encapsulant 121 is in the shape of a square, and its peripheral dimension is flush with the side of the circuit board 122, and its size can be equivalent to the insulator of the conventional USB connector. The encapsulant 12 1 is formed by transfer molding to meet more accurate dimensional requirements. In addition, the card reader fingers 125 may be provided with a plurality of elastic pieces 128, such as spot welding. In the present embodiment, the USB contact fingers 124 are also provided with a plurality of elastic pieces 128 for power supply contact with a USB plug. The terminal of the slot (not shown). ,1289371

該尾塞封蓋130係結合於該前置USB接口 lio之後端， 該尾塞封蓋130係具有一記憶卡插接槽131與一扣接尾 132,該扣接尾132係卡扣該記憶體封裝碑塊12〇之一側緣， 以防止該記憶體封裝磚塊12〇由該前置USB接口 11〇脫出。 在本實施例中，該尾塞封蓋丨3〇於該記憶卡插接槽131之一 側係裝設有一扣接彈片丨33。在結合之後，該些讀卡接指125 係顯露且位於由該記憶體封裝碑塊120與該尾塞封蓋13〇之 該記憶卡插接槽13 1所構成的空間内。如第4圖所示，該記 憶體封裝磚塊120與該尾塞封蓋130之該記憶卡插接槽131 所構成的空間大小係可容許一微型保全數位卡2〇〇(Micr〇 SD card)之插置。 因此，該前置USB接口 11〇、該記憶體封裝碑塊12〇該 尾塞封蓋130¾述二者可一體結合而不可脫出，且整體尺寸 如同傳統之USB接頭，達到微小化，更兼具有讀卡以 擴充記憶體容量的功能。 在本實施例中，如第2圖所示，該前置USB接口 11〇係 具有複數個倒勾扣片112，且該扣接尾132係具有複數個為 置對應之扣孔134。當該扣接尾⑴插U位時，該些倒勾 扣片112係滑入該些扣孔134且不可脫出。 以上所述，僅是本發明的較佳實施例而已，並非對 本發明作任何形式上的限制，雖然本發明已以較佳實 施例揭露如上’然而並非用以限定本發明，任何熟悉 本項技術者’在不脫離本發明之技術範圍$，所作的 任何簡單修改、等效性變化與修飾，均仍屬於本發明 9 、1289371 的技術範圍内。 【圖式簡單說明】 第1圖：依據本發明之第一具體實施例，一種可讀卡 之微型USB隨身碟之立體圖。The tail plug cover 130 is coupled to the rear end of the front USB interface lio. The tail plug cover 130 has a memory card insertion slot 131 and a buckle tail 132. The buckle tail 132 is buckled to the memory package. One side edge of the block 12 , prevents the memory package brick 12 from coming out of the front USB interface 11 . In the embodiment, the tail plug cover 〇3 is attached to one side of the memory card insertion slot 131 to be provided with a fastening tab 丨33. After bonding, the card reader fingers 125 are exposed and located in the space formed by the memory package block 120 and the memory card insertion slot 13 1 of the tail plug cover 13 . As shown in FIG. 4, the size of the memory package block 120 and the memory card insertion slot 131 of the tail plug cover 130 can accommodate a micro-preserved digital card 2 (Micr〇 SD card). ) Interposed. Therefore, the front USB interface 11〇, the memory package block 12, the tail plug cover 1303⁄4 can be integrated and cannot be taken out, and the overall size is like a conventional USB connector, which is miniaturized and more Has the ability to read cards to expand the memory capacity. In this embodiment, as shown in FIG. 2, the front USB port 11 has a plurality of barbs 112, and the button 132 has a plurality of corresponding button holes 134. When the buckle tail (1) is inserted into the U position, the barb fasteners 112 are slid into the button holes 134 and are not detachable. The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, although the present invention has been disclosed in the above preferred embodiments. However, it is not intended to limit the present invention. Any simple modifications, equivalent changes, and modifications made by the present invention without departing from the technical scope of the present invention are still within the technical scope of the present invention 9,1289371. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a micro USB flash drive of a readable card in accordance with a first embodiment of the present invention.

第2圖：依據本發明之第一具體實施例，該微型USB 隨身碟之元件分解圖。 第3圖··依據本發明之第一具體實施例，該微型USB 隨身碟之記憶體封裝磚塊之截面示意圖。Figure 2 is an exploded view of the micro USB flash drive in accordance with a first embodiment of the present invention. Fig. 3 is a cross-sectional view showing a memory package brick of the micro USB flash drive according to a first embodiment of the present invention.

第4圖：依據本發明之第一具體實施例，該微型USB 隨身碟在可擴充狀態之示意圖。 【主要元件符號說明】 100微型USB隨身碟 1 1 〇前置USB接口 1 1 1擋唇 1 1 2倒勾扣片 1 2 1封膠體 122B 内表面 120記憶體封裝碑塊 122電路板 122A外表面 1 2 3快閃記憶體晶片 124 USB接觸指125讀卡接指 126被動疋件 127控制器晶片128彈片 130尾塞封蓋131記憶卡插接槽ι32扣接尾 1 3 3扣接彈片 1 3 4扣孔 2 0 0微型保全數位卡 10Figure 4 is a schematic illustration of the micro USB flash drive in an expandable state in accordance with a first embodiment of the present invention. [Main component symbol description] 100 micro USB flash drive 1 1 〇 front USB interface 1 1 1 lip 1 1 2 inverted hook 1 2 1 seal 122B inner surface 120 memory package block 122 circuit board 122A outer surface 1 2 3 flash memory chip 124 USB contact finger 125 card reader finger 126 passive device 127 controller chip 128 spring 130 tail plug cover 131 memory card docking slot ι32 buckle tail 1 3 3 buckled shrapnel 1 3 4 Buckle hole 2 0 0 micro security digital card 10

Claims (1)

J289371 十、申請專利範圍： 1、一種可讀卡之微型USB隨身碟，包含： 一前置USB接口； 一記憶體封裝碑塊，其係容置於該前置USB接口内，該 記憶體封裝磚塊係包含一封膠體與一在該封膠體表面之 電路板，该封膠體内封設有至少一快閃記憶體晶片，該 電路板之外表面形成有複數個USB接觸指與複數個讀卡 接指；以及 _ 一尾塞封蓋，其係結合於該前置USB接口之後端，該尾 塞封蓋係具有一記憶卡插接槽與一扣接尾，該扣接尾係 卡扣該記憶體封裝磚塊之一側緣，以防止該記憶體封裝 碑塊由該前置USB接口脫出。 2、 如申凊專利範圍第1項所述之可讀卡之微型USB隨身 碟，其中該些讀卡接指係顯露且位於由該記憶體封裝碑 塊與該尾塞封盖之該$己憶卡插接槽所構成的空間内。 3、 如申請專利範圍第2項所述之可讀卡之微型USB隨身 籲 碟，其中由該記憶體封裝磚塊與該尾塞封篕之該記憶卡 插接槽所構成的空間大小係可容許一微型保全數位卡 (Micro SD card)之插置。 4、 如申凊專利範圍第1項所述之可讀卡之微型USB隨身 碟’其中該前置USB接口係具有一前插置端，其係形成 有一擋唇。 5、 如申請專利範圍第4項所述之可讀卡之微型USB隨身 碟’其中該則置USB接口係為防靜電金屬方殼。 11 '1289371 6、如申請專利範圍第1項所述之可讀卡之微型USB隨身 碟，其中該尾塞封蓋於該記憶卡插接槽之一侧係裝設有 一扣接彈片。 7、 如申請專利範圍第1項所述之可讀卡之微型USB隨身 碟，其中該封膠體係為方塊狀，其周邊尺寸係平齊於該 電路板之側邊。 8、 如申請專利範圍第7項所述之可讀卡之微型USB隨身 碟，其中該封膠體係以轉移模製方式形成。 籲 9、如申請專利範圍第1項所述之可讀卡之微型USB隨身 碟，其中該記憶體封裝磚塊之該電路板係為COB封裝基 板。 10、 一種記憶體封裝磚塊，用以容置於一隨身碟之前置 USB接口内，該記憶體封裝碑塊係包含一封膠體與一在 該封膠體表面之電路板，該封膠體内封設有至少一快閃 記憶體晶片’該電路板之外表面形成有複數個USB接觸 | 指與複數個讀卡接指。 11、 如申請專利範圍第i 〇項所述之記憶體封裝磚塊，其 中该封膠體係為方塊狀，其周邊尺寸係平齊於該電路板 之側邊。 12、 如巾請專利範圍第u項所述之記憶體封裝碑塊，其 中該封膠體係以轉移模製方式形成。 13、 如申请專利圍第1〇項所述之記憶體封裝磚塊，其 中該記憶體封裝磚塊之該電路板料⑽封裝基板。 14、 如中明專利範圍第1G項所述之記憶體封裝磚塊，其 12 J289371 中該些讀卡接指上係設有複數個彈片。 15、如申請專利範圍第14項所述之記憶體封裝磚塊，其 中該些USB接觸指上亦設有複數個彈片。J289371 X. Patent application scope: 1. A micro USB flash drive with a readable card, comprising: a front USB interface; a memory package block, the system is placed in the front USB interface, the memory package The brick comprises a glue body and a circuit board on the surface of the sealant. The seal body is sealed with at least one flash memory chip, and the outer surface of the circuit board is formed with a plurality of USB contact fingers and a plurality of readings. And a tail plug cover having a memory card insertion slot and a buckle tail The body encapsulates one side edge of the brick to prevent the memory package block from coming out of the front USB interface. 2. The micro USB flash drive of the readable card of claim 1, wherein the card reader fingers are exposed and located at the memory package enclosing the block and the tail plug Recall the space formed by the card slot. 3. The micro USB portable disk of the readable card according to claim 2, wherein the memory package brick and the memory card insertion slot of the tail plug are configured to have a space size. Allow insertion of a micro SD card. 4. A micro USB portable disk of a readable card as claimed in claim 1 wherein the front USB interface has a front insertion end which is formed with a lip. 5. A micro USB flash drive with a readable card as described in item 4 of the patent scope. The USB interface is an anti-static metal square case. The 'micro-USB portable disk of the readable card of claim 1, wherein the tail plug is attached to a side of the memory card slot to be provided with a snap-up spring. 7. The micro USB portable disc of the readable card of claim 1, wherein the encapsulation system is in the form of a block having a peripheral dimension flush with the side of the circuit board. 8. The micro USB portable disc of the readable card of claim 7, wherein the encapsulation system is formed by transfer molding. 9. The micro USB flash drive of the readable card of claim 1, wherein the circuit board of the memory package brick is a COB package substrate. 10. A memory package brick for housing in a USB interface of a flash drive, the memory package block comprising a glue body and a circuit board on the surface of the sealant body, the seal body At least one flash memory chip is sealed. The outer surface of the circuit board is formed with a plurality of USB contacts | and a plurality of card reader fingers. 11. The memory package brick of claim i, wherein the encapsulation system is in the form of a block having a peripheral dimension flush with a side of the circuit board. 12. The memory package block of claim 5, wherein the sealant system is formed by transfer molding. 13. The memory package brick of claim 1, wherein the memory package encapsulates the circuit board (10) package substrate. 14. The memory package brick according to the 1Gth item of the patent scope of Zhongming, wherein the plurality of shrapnels are arranged on the card reader fingers in 12 J289371. 15. The memory package brick of claim 14, wherein the USB contact fingers are also provided with a plurality of shrapnel. 1313
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Publication number Priority date Publication date Assignee Title
TWI384690B (en) * 2010-06-29 2013-02-01 Zhen Ding Technology Co Ltd Printed circuit board module

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TW201241755A (en) * 2011-04-15 2012-10-16 Walton Advanced Eng Inc Thin data storage device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI384690B (en) * 2010-06-29 2013-02-01 Zhen Ding Technology Co Ltd Printed circuit board module

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