200816346 九、發明說明： 【發明所屬之技術領域】 本發明係關於用於侷限記憶體礤碟、矽晶圓等以便進行運輪、 儲存或處理之裝置。更具體而言，本發明係關於一種複合晶圓固 定結構。 【先前技術】 某些容器用於在加工磁碟或晶圓之前、期間或之後運輸及儲存 成批之矽晶圓或磁碟。晶圓係加工成積體電路，磁碟則加工成電 腦用磁性儲存碟。本文所述「晶圓」係指矽晶圓、磁性基材等。 將晶圓碟加工成積體電路晶片常常涉及到數個步驟，在該數個 步驟中要反覆地加工、儲存及運輪磁碟。由於磁碟之精密性及其 極大的價值，在整個該程序中對其進行妥當保護及牢牢固定至關 重要。相應地，晶圓容器一般構造成用以容納一晶圓載具，該晶 圓載具在罪近晶圓周緣處將晶圓支揮於狹槽或搁架部件中。 某些傳統容器構造成容納一 Η條型式之載具，例如標準化機械 介面（standardized mechanical interface，SMIF)盒。SMIF 盒通常 具有一底部開口門板，以用於取放帶有晶圓之H條式載具，且一 般包含一晶圓固定器，以防止其中所容納之一給定晶圓相對於其 對齊平面橫向滑動。此等晶圓固定器可包含一溝槽狀結構，其可 操作地耦合SMIF盒穹頂内之一致動機構。當該底部或門嚙合時， 该致動機構將晶圓固定器旋轉或平移至接觸晶圓邊緣。該晶圓容 器易於直接並移動地接觸SMIF盒中所容納晶圓之外周緣。 由晶圓之外周緣與主表面交匯所界定之角常常比較尖銳。該等 200816346 銳角在接觸晶圓固定器時可對晶圓固定器造成局部碎裂或凹陷， 進而使容器中之晶圓受到微粒污染。相反地，該等銳角自身也可 易於出現此種碎裂或凹陷’此亦可污染晶圓。即便在晶圓或晶圓 固定器中並不出現凹陷或碎裂之情景中，晶圓固定器一般亦將在 嚙合晶圓時沿晶圓邊緣軸向或切向滑動，此可產生細微之微粒而 污染晶圓。 【發明内容】 非常適合製作容器之一部件之材料可能並不很適合於同一容器 中之不同部件。舉例而言，聚醚醚酮（polyehterehterketone，PEEK ) 係一種具有理想耐磨性之材料，非常適合於晶圓接觸部，但其難 以模製，且相對於其他可以使用之塑膠而言可能相對較貴。因此， PEEK可能不如例如聚碳酸酯等其他塑膠一樣為晶圓容器之主體 或結構元件之良好選材。 相應地，本發明各實施例中之複合晶圓固定器包含具有一第一 材料之一支撐部及具有一不同材料之一可操作或重複模塑部，以 形成將該等部牢固結合於一起之無間隙氣密性介面。本發明之各 實施例包含具有此等重複模塑部之晶圓固定器以及一種製造此等 晶圓固定器之方法。 在一實施例中，一種用於將複數個晶圓固定於一晶圓容器中之 重複模塑晶圓固定器包含：一基部，其包含一第一材料，並包含 具有一邊緣之至少一執道部，以用於嚙合該晶圓容器中之該複數 個晶圓；一重複模塑部，其包含一第二材料，可至少部分地沿該 至少一執道部之邊緣設置，該第二材料係以熱物理方式結合至該 200816346 第一材料，以使該重複模塑部無需使用分離之機械扣件即可緊固 至該基部上。該第二材料可設置於該第一材料上，以防止該第一 材料碎裂、凹陷或磨損。 在另一實施例中，具有一門框之一容器部與一門配合形成一殼 體。該殼體容納至少一晶圓。一致動機構可操作地耦合於該殼體 内，並貼近該容器部之一内壁。當將該門置於該門框内時，該致 動機構之一末端部可遠離該内壁延伸。一晶圓固定器可操作地耦 合該致動機構。該晶圓固定器可包含具有一第一材料之一基部以 r ^ 及具有一第二材料之一重複模塑部，該第二材料係以熱物理方式 結合至該第一材料，以使該重複模塑部無需使用分離之機械扣件 即可緊固至該基部上。當該致動機構之末端部遠離該内壁延伸 時，該重複模塑部接觸該至少一晶圓之各該邊緣。可對該第二材 料進行定製，以使該重複模塑部具有特定之機械及/或電特性，例 如柔軟、更耐磨及具有更高之電耗散品質。 本發明特定實施例之一優點在於，可以最低之材料及人工成本 < 製成具有增強之效能特性之固定機構。 本發明特定實施例之另一優點在於，可微調最終部件之尺寸， 使之適合於尺寸容差。 本發明特定實施例之再一優點在於，由模製或熔合於一起之二 部分形成一實質一體之晶圓固定器。該二不同材料間之結合部可 無間隙、具氣密性且牢固，由此減低在該等材料間陷獲污染物或 其他化學品之可能性。 本發明特定實施例之又一優點及特徵在於，重複模塑材料之選 7 200816346 取能夠減低使用期間之摩擦、磨損及微粒產生。 【實施方式】 參見第1A、IB、1C及2圖，其繪示本發明一實施例中之一晶 圓容器10，晶圓容器10包含一穹頂或容器部12及一門14。所示 特定實施例係為一 SMIF盒，其中容器部12大體係立方體形狀並 具有一前壁20、一後壁16、二側壁18及22、一頂部24、及一底 部總成26。底部總成26包含門14，門14可承座於一門框28内 而形成一殼體27。具有邊緣29.1之複數個晶圓29可容納於殼體 27中，並可由一 Η條載具（未圖示）掛持。 在所示實施例中，一致動機構30倚靠於頂部24而貼近後壁16 之一内表面3卜在其他構造中，致動機構30可操作地耦接壁16、 18、20或22其中之一，或者耦接至門14。致動機構30包含一框 架32，用於支撐一上部心軸34及一下部心軸36。一對拉桿38及 40各自分別自心軸34及36伸出。拉桿38及40各自界定致動機 構30之一末端部42及44，該等末端部42、44各自分別支撐一圓 柱形樞軸46、48。一重複模塑晶圓固定器50具有一正面51及一 背面52，其可操作地耦接圓柱形樞軸46及48。 參見第3至第8圖，其圖解說明重複模塑晶圓固定器50之一實 施例。重複模塑晶圓固定器50可包含一基部54及一重複模塑部 56。基部54可藉由注射成型製程而形成，並可由例如聚碳酸酯等 相當硬之聚合物製成。重複模塑部56則可由具有某些所需物理性 質（例如相當之柔軟度、耐磨性及/或某些電耗散特性）之一不同 材料製成。重複模塑部之一實例性且非限定性材料可為例如聚醚 8 200816346 麵（PEEK)等熱塑性塑膠或者例如經碳摻雜或經碳填充之ρΕΕκ 等具有一定導電性質之材料。200816346 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a device for confining memory disks, wafers, and the like for transporting, storing, or processing. More specifically, the present invention relates to a composite wafer fixing structure. [Prior Art] Some containers are used to transport and store batches of wafers or disks before, during or after processing a disk or wafer. The wafer is processed into an integrated circuit, and the magnetic disk is processed into a magnetic storage disk for the computer. As used herein, "wafer" refers to germanium wafers, magnetic substrates, and the like. Processing a wafer into an integrated circuit wafer often involves several steps in which the disk is to be processed, stored, and transported over and over again. Due to the precision of the disk and its great value, it is important to properly protect and secure it throughout the program. Accordingly, the wafer container is generally configured to receive a wafer carrier that wraps the wafer in the slot or shelf member at the periphery of the wafer. Some conventional containers are constructed to accommodate a string of carriers, such as a standardized mechanical interface (SMIF) cartridge. The SMIF box typically has a bottom open door panel for pick and place wafered H-type carriers and typically includes a wafer holder to prevent a given wafer from being aligned with respect to its alignment plane. Slide horizontally. The wafer holders can include a channel-like structure operatively coupled to the actuators in the dome of the SMIF box. The actuation mechanism rotates or translates the wafer holder to contact the wafer edge when the bottom or door is engaged. The wafer container is easy to directly and movably contact the outer periphery of the wafer contained in the SMIF box. The angle defined by the intersection of the outer perimeter of the wafer and the major surface is often sharp. These 200816346 acute angles can cause local chipping or dents on the wafer holder when contacting the wafer holder, which in turn can contaminate the wafer in the container. Conversely, the acute angles themselves may also be prone to such cracks or depressions. This may also contaminate the wafer. Even in the case where there are no dents or chipping in the wafer or wafer holder, the wafer holder will generally slide axially or tangentially along the edge of the wafer while the wafer is being bonded, which can produce fine particles. And contaminating the wafer. SUMMARY OF THE INVENTION Materials that are well suited for making one part of a container may not be well suited for different parts of the same container. For example, polyetheretherketone (PEEK) is a material with ideal wear resistance, which is very suitable for wafer contacts, but it is difficult to mold and may be relatively relatively good compared to other plastics that can be used. expensive. Therefore, PEEK may not be a good material for the main body or structural components of the wafer container as other plastics such as polycarbonate. Correspondingly, the composite wafer holder of each embodiment of the present invention comprises a support portion having a first material and an operable or reshaped molded portion having a different material to form the portions firmly bonded together The gapless airtight interface. Embodiments of the invention include wafer holders having such re-molded portions and a method of making such wafer holders. In one embodiment, a remolded wafer holder for securing a plurality of wafers in a wafer container comprises: a base comprising a first material and comprising at least one edge having an edge a plurality of wafers for engaging the plurality of wafers in the wafer container; a repeating molding portion including a second material disposed at least partially along an edge of the at least one obstruction portion, the second The material is thermo-physically bonded to the 200816346 first material such that the re-molded portion can be fastened to the base without the use of separate mechanical fasteners. The second material can be disposed on the first material to prevent the first material from chipping, denting, or abrading. In another embodiment, a container portion having a door frame cooperates with a door to form a housing. The housing houses at least one wafer. An actuating mechanism is operatively coupled within the housing proximate the inner wall of the container portion. When the door is placed in the door frame, one end portion of the actuating mechanism can extend away from the inner wall. A wafer holder is operatively coupled to the actuation mechanism. The wafer holder may include a base having a base material of a first material and having a remolded portion of a second material, the second material being thermo-physically bonded to the first material to enable the The re-molded portion can be fastened to the base without the use of separate mechanical fasteners. The re-molding portion contacts each of the edges of the at least one wafer when the end portion of the actuating mechanism extends away from the inner wall. The second material can be tailored to impart specific mechanical and/or electrical properties, such as softness, wear resistance, and higher electrical dissipation qualities. An advantage of a particular embodiment of the invention is that a minimum of material and labor costs can be <<>> made into a securing mechanism with enhanced performance characteristics. Another advantage of certain embodiments of the present invention is that the size of the final component can be fine tuned to fit the dimensional tolerance. Yet another advantage of certain embodiments of the present invention is that a substantially integral wafer holder is formed by molding or fusing the two portions together. The joint between the two different materials can be gap-free, airtight and strong, thereby reducing the likelihood of trapping contaminants or other chemicals between the materials. Yet another advantage and feature of a particular embodiment of the present invention is that the selection of the re-molding material 7 200816346 is capable of reducing friction, wear and particle generation during use. [Embodiment] Referring to Figures 1A, IB, 1C and 2, there is shown a wafer container 10 according to an embodiment of the present invention. The wafer container 10 comprises a dome or container portion 12 and a door 14. The particular embodiment shown is a SMIF box in which the container portion 12 is generally cylindrical in shape and has a front wall 20, a rear wall 16, two side walls 18 and 22, a top portion 24, and a bottom assembly 26. The bottom assembly 26 includes a door 14 that can seat within a door frame 28 to form a housing 27. A plurality of wafers 29 having edges 29.1 can be received in the housing 27 and can be held by a string carrier (not shown). In the illustrated embodiment, the actuating mechanism 30 rests against the top portion 24 proximate the inner surface 3 of the rear wall 16 . In other configurations, the actuating mechanism 30 is operatively coupled to the wall 16 , 18 , 20 or 22 . One, or coupled to the door 14. The actuating mechanism 30 includes a frame 32 for supporting an upper mandrel 34 and a lower mandrel 36. A pair of tie rods 38 and 40 each extend from the mandrels 34 and 36, respectively. The tie rods 38 and 40 each define a distal end portion 42 and 44 of the actuator 30, each of which supports a cylindrical pivot 46, 48, respectively. A re-molded wafer holder 50 has a front side 51 and a back side 52 that are operatively coupled to the cylindrical pivots 46 and 48. Referring to Figures 3 through 8, an embodiment of a remolded wafer holder 50 is illustrated. The remolded wafer holder 50 can include a base portion 54 and a repeat molding portion 56. The base 54 can be formed by an injection molding process and can be made of a relatively hard polymer such as polycarbonate. The re-molded portion 56 can be made of a different material having one of the desired physical properties (e.g., comparable softness, abrasion resistance, and/or some electrical dissipation characteristics). An exemplary and non-limiting material of the re-molded portion may be a thermoplastic such as Polyether 8 200816346 (PEEK) or a material having a certain conductive property such as carbon doped or carbon filled ρΕΕκ.
基部54 ^•包含一對軌道部58及59,其藉由橫襟61至％隔開。 在該實施例中，一中央或縱向軸線67界定於横樑61_66之中間跨 度處。一上部失誠68可自橫樑62及63伸出，並可包含自橫： 60伸出之二L形分叉部件7G。-中央橋接部件74可延伸於橫襟 62與63間，炎可包含一拱形部％，拱形部76之形狀適於在晶圓 固定器50玎操作地耦接致動機構時容納圓柱形樞軸46。 同樣地，〆下部夾總成78可自橫樑64及65伸出。下部失總成 78可實質類似於上部夾總成68，例如具有二L形分又部件及 82以及帶一拱形部86之中央橋接部件84,拱形部86之形狀適於 容納圓柱形樞軸48 ° 在第3圖所示實施例中，一橋接板87延伸於橫樑65與66間。 一支柱88可凸離重複模塑晶圓固定器50之背面51。在圖中將支 柱88繪示成自橫樑65上伸出，但其亦可自基部54之任一部分上 伸出。可利用一個以上之支柱部件88。具有一自由端92之一輪輛 9〇沿中央轴線67自橫樑66伸出，且一輪94可操作地耗接輪輛 90。在此種構造中，輪94突伸出輪軛90之自由端92以外。 L形分叉部件70、72與80、82與各自之中央橋接部件74及84 協同將重複模塑晶圓固定器50牢固地夾緊至圓柱形樞軸46及48 (第 1Α、IB、1C 及 2 圖）。 在第3圖所示特定實施例中，執道部58及59各自包含一近端 部96及一遠端部98。執道部58及59之近端部％可連接至橫標 9 200816346 61-66或與其成一體，並可實質正交於橫樑61_66。在一實施例中， 各遠端部98自各近端部96伸出，分別相對於近端部96以一傾斜 角度100遠離中央軸線67突出，並界定一實質背對中央軸線67 之邊緣102。由一重複模塑材料105製成之一凸脊部1〇4可設置於 邊緣102上。 重複模塑部56可設置於使用一熱塑性注射成型製程之基部56 上。此一製程之一實例揭示於2005年3月29曰提出申請之第 11/092,528號美國專利申請案中，該美國專利申請案係為2002年 8月5日提出申請之第1〇/213,282號美國專利申請案之接續申請 案，其公告為第6,871，741號美國專利，該第6,871，741號美國專 利案又係為1999年5月25日提出申請之第09/317,989號美國專 利申請案之部分接續申請案，且在2002年8月6日公告為第 6,428,729號美國專利，該第6,428,729號美國專利案則基於1998 年5月28日提出申請之第60/087,205號美國臨時申請案。各該參 考文獻皆讓與本發明之受讓人，其與本發明之標的有關，且除其 中所包含明確之$義外，其全部揭示内容皆以引用方式倂入本文 中。該等專利揭示複合晶圓載具及容器，其中晶圓支撐結構係由 第一熱塑性材料重複模塑至不同於第一熱塑性材料之第二熱塑性 材料上而製成。該重複模塑元件形成一無間隙之氣密性介面，其 將該等部分牢固地結合於一起。具體而言，第6,871，741號美國專 利揭示對透明視窗、閂鎖機構及用於支撐晶圓之晶圓接觸部進行 重複模塑。 在使用中，重複模塑晶圓固定器50嚙合容納於晶圓容器1〇中 200816346 之晶圓29之邊緣，以將晶圓29固定於例如H條載具等晶圓載具 (未圖不）内。在門14取下之情況下，重複模塑晶圓固定器5〇 懸置於在一回縮位置上之框架28之開口上方（第1A圖），其中輪 94處於下方極限點。支柱88貼靠後壁16之内表面（未圖示）對 齊，由此防止致動機構30之旋轉部件在該回縮位置上過度伸展。 當將門14置於框架28内時，門14接觸輪94,進而使重複模塑晶 圓固定器50朝頂部24向上移動。重複模塑晶圓固定器5〇向上移 動會使拉桿38及40圍繞心軸34及36旋轉，從而更使重複模塑 曰曰圓固定器50遠離後壁16延伸，並將重複模塑晶圓固定器5〇之 凸脊部104橋接至接觸晶圓29之周緣。第1B圖之示意圖繪示處 於伸出或接觸位置上之重複模塑晶圓固定器5Q。輪％使重複模塑 晶圓固定ϋ 50能夠沿門14之内表面平料不會過度產生微粒。 橋接板87月匕有效地強化橫樑66,以在輪94喃合門14時抵抗由傳 遞至輪概90之反作用力弓I起之力矩或扭轉載荷。 盆還應'主思’亦可利用致動機構30及重複模塑晶圓固定器50之 八實⑫例（例如致動機構30不包含輪94)，且此仍歸屬於本發 明之範圍内。 見第9 " 至11圖’現在將更詳細地說明重複模塑晶圓固定器50 之重複模鄕制和 、氣担。一種方法涉及在第一模具中澆鑄基部54，然後 將基部5 4韓_ ί a 符秒至弟二权具，以覆於重複模塑部56上。第二模具 配備有脈路系統106，以使重複模塑材料105能夠接近軌道部 58及59之邊緣1〇2。 第一方法涉及第一模具，其包含提供脈路系統106之條件，脈 11 200816346 路系統106視需要適配於嵌件（未圖示）。在對基部54注射成型 期間，將該等嵌件置於界定脈路系統106之通道中。在形成基部 54之後，自模具中移出基部54並自脈路通道中移出嵌件。然後將 基部54重新置於第一模具内，並經由現在空出之通道注入重複模 塑材料105而形成脈路系統106,其將重複模塑材料105輸送至軌 道部58及59之邊緣102。 在該二方法中，模具皆可由一上模具部與一下模具部配合構 成，該下模具具有一分界線108定位成包封基部54及脈路系統 f ‘ 106。應注意，儘管圖中未繪示該等模具部，然而上模具部係位於 分界線108上方由字母「A」所標記之區域中，而下模具部係位於 分界線下方由字母「B」所標記之區域中。 分界線108能夠完全界定與晶圓29之間的所謂「鋼安全介面」 110。鋼安全介面包含重複模塑晶圓固定器50中與晶圓29之邊緣 相接觸之部分。鋼安全介面較佳不帶有尖角，且通常具有一修圓 面112與晶圓29相接觸。鋼安全介面110具有一突出尺寸114在 ^ 晶圓29之方向上突出至基部之外。 視需要，分界線108之位置使得能夠將重複模塑部56微調至一 最佳尺寸。該模製製程易於出現偏差，該等偏差以一種不確定但 通常可重複之方式影響最終元件之尺寸。吾人可藉由自模具中移 除金屬、直至達到最終模製產品所期望之尺寸容差為止來「微調」 模製製程。藉由利用該製程之模具所形成之元件稱作「鋼安全」 元件，其乃因儘管存在偏差，由該模具製成之產品之尺寸重複性 通常仍極佳。 12 200816346 因此，在本發明之一實施例中，吾人將減小上模具部上用於界 疋犬出尺寸114之模穴之尺寸，以在考量到收縮因素及其他已知 效應之情況下減小所形成鋼安全介面11〇之尺寸。根據該結果， 便可推斷出估計要自上模具部上用於界定突出尺寸114之模穴移 除之材料量。視推斷值而定，可選擇移除略小於計算值之材料量， 以保證所得到之部件不會尺寸過大。在對模穴進行二或三次修整 之後’便可形成能製成處於尺寸容差内之元件之模具。 ( 參見第12A至12C圖，其繪示本發明一實施例中之前開式統一 標準晶圓盒（front opening unified p〇d5 FOUP ) 120 具有一門總成 122，門總成122具有複數個重複模塑晶圓固定器指狀件124。該 實施例中之重複模塑晶圓固定器指狀件124可操作地耦接至門總 成122之一内表面126。晶圓固定器指狀件124之末端部13〇可由 有利於接觸F0UP 120中所容納晶圓128之材料重複模塑製成。 當將門總成122置於F0UP 120之開口上時，晶圓固定器指狀件 122嚙合F0UP中所容納之晶圓128，以將其貼靠晶圓接觸結構132 ◎ 牢固地偏置於F0UP 120内。可對重複模塑材料加以選擇，以保護 晶圓固定器指狀件120與晶圓128皆不會出現鑿削、凹陷及/或磨 損。 以上論述係關於SMIF晶圓盒及F0UP晶圓容器。然而，應特別 注意，該概念亦適用於其他晶圓固定器結構。相應地，本文所揭 示實施例之每一方面皆應視為例示性而非限定性的，應參照隨附 申請專利範圍而非上文說明來指示本發明之範圍。 為便於解釋本發明之申請專利範圍，除非在請求項中引述特定 13 200816346 用語「用於…之構件（means for )」或「用於…之步驟（step for )」， 否則35 U.S.C.第112部分第6段之規定將明確地不予援引。 所引用之相對性用語，例如上部、前後、左右等等，皆係為了 便於說明，而非打算將本發明或其元件限定為任何特定取向。圖 式中所示之所有尺寸皆可隨本發明具體實施例之潛在設計及擬定 用途而異，此並不背離本發明之範圍。 本文所揭示之各附圖及方法皆可單獨用於、或與其他特徵及方 法結合用於提供改良之裝置、系統及其製造和使用方法。因此， 本文所揭示各特徵及方法之組合可能未必係為實施最廣意義之本 發明所必需的，而是僅為具體說明本發明之代表性實施例而揭示。 【圖式簡單說明】 第1A圖係為本發明一實施例中一使晶圓固定器自晶圓脫離之 晶圓容器之側視剖視立面圖； 第1B圖係為在晶圓固定器嚙合晶圓情況下第1A圖所示晶圓容 器之側視剖視立面圖； k 第1C圖係為在移除晶圓固定器情況下第1A及第1B圖中所用 致動機構之立體圖； 第2圖係為在剖切後壁以露出晶圓固定器及致動機構情況下第 1圖所示晶圓容器之立面圖； 第3圖係為在本發明一實施例中一重複模塑晶圓固定器之正面 之立體圖； 第4圖係為第3圖所示重複模塑晶圓固定器之背面之立體圖； 第5圖係為第3圖所示重複模塑晶圓固定器之端視圖； 14 200816346 第6圖係為第3圖所示重複模塑晶圓固定器之前視圖； 第7圖係為第3圖所示重複模塑晶圓固定器之側視圖； 第8圖係為第3圖所示重複模塑晶圓固定器之後視圖； 第9圖係為在附連有注入口情況下第3圖所示重複模塑晶圓固 定器之背面之立體圖； 第丨〇圖係為第9圖所示重複模塑晶圓固定器之正面之立體圖； 第11圖係為第9圖所示重複模塑晶圓固定器之端視圖； 事' 第11A圖係為第η圖所示重複模塑部之局部放大圖； 第12A圖係為本發明一實施例中一前開式統一標準晶圓盒之平 面圖； 第12B圖係為第12A圖所示前開式統一標準晶圓盒之門；以及 第12C圖係為第12b圖中其中一個重複模塑晶圓固定器指狀件 之放大剖視圖。 【主要元件符號說明】 10 : 晶圓容器 12 ： 容器部 14 ： 門 16 ： 後壁 18 ： 側壁 20 ： 前壁 22 ： 側壁 24 ： 頂部 26 ： 底部總成 27 ： 殼體 28 ： 門框 29 ： 晶圓 29.1 :邊緣 30 ： 致動機構 31 ： 内表面 32 ： 框架 34 ： 心軸 36 ： 心軸 15 200816346 38 ·· 拉桿 40 ： 42 ： 末端部 44 ： 46 ： 圓柱形樞軸 48 ： 50 ·· 重複模塑晶圓固定器 51 ： 52 ： 背面 54 ： 56 ： 重複模塑部 58 ： 59 ： 軌道部 60 ： 61 ： 橫樑 62 ： 63 ·· 橫樑 64 ： 65 ： 橫標 66 ： 67 ： 中央或縱向軸線 68 ： 70 ： L形分叉部件 72 ： 74 ： 中央橋接部件 76 ： 78 ： 下部夾總成 80 ： 82 ： L形分叉部件 84 ： 86 ： 拱形部 87 ： 88 ： 支柱部件 90 ： 92 ： 自由端 94 ： 96 ·· 近端部 98 ： 100 :傾斜角度 102 104 :凸脊部 105 106 :脈路系統 108 110 :鋼安全介面 112 拉桿 末端部 圓柱形極轴 正面 基部 軌道部 橫樑 橫樑 橫樑 橫樑 上部夾總成 L形分叉部件 拱形部 L形分叉部件 中央橋接部件 橋接板 輪輛 輪 遠端部 :邊緣 :重複模塑材料 •分界線 :修圓面 16 200816346 114 :突出尺寸 120 ： 前開式統一標準晶圓盒 122 :門總成 124 ： 重複模塑晶圓固定器指狀件 126 :内表面 128 ： 晶圓 130 :末端部 132 ： 晶圓接觸結構 17The base 54 ^• includes a pair of rail portions 58 and 59 separated by a cross-section 61 to %. In this embodiment, a central or longitudinal axis 67 is defined at the intermediate span of the beam 61_66. An upper disgrace 68 may extend from the beams 62 and 63 and may include a self-crossing: 60-extending L-shaped furcation member 7G. The central bridging member 74 can extend between the yokes 62 and 63, and the swell can include an arched portion 76 shaped to accommodate the cylindrical shape when the wafer holder 50 is operatively coupled to the actuating mechanism Pivot 46. Similarly, the lower jaw clamp assembly 78 can extend from the beams 64 and 65. The lower portion 78 can be substantially similar to the upper clip assembly 68, such as having two L-shaped components and 82 and a central bridging member 84 with an arch 86 shaped to accommodate the cylindrical pivot Shaft 48 ° In the embodiment shown in Fig. 3, a bridge plate 87 extends between the beams 65 and 66. A post 88 can be raised away from the back side 51 of the remolded wafer holder 50. The post 88 is shown extending from the beam 65 in the figures, but it may also extend from any portion of the base 54. More than one strut member 88 can be utilized. A wheel 9 having a free end 92 extends from the beam 66 along a central axis 67 and a wheel 94 operatively dissipates the wheel 90. In this configuration, the wheel 94 projects beyond the free end 92 of the yoke 90. The L-shaped furcation members 70, 72 and 80, 82 cooperate with the respective central bridge members 74 and 84 to securely clamp the re-molded wafer holder 50 to the cylindrical pivots 46 and 48 (1, IB, 1C) And 2 pictures). In the particular embodiment illustrated in Figure 3, the obstruction portions 58 and 59 each include a proximal end portion 96 and a distal end portion 98. The proximal end % of the obstruction portions 58 and 59 can be coupled to or integral with the crossbar 9 200816346 61-66 and can be substantially orthogonal to the beam 61_66. In one embodiment, each distal end portion 98 extends from each proximal end portion 96, respectively projecting away from the central axis 67 at an oblique angle 100 relative to the proximal end portion 96, and defining an edge 102 substantially opposite the central axis 67. A ridge 1b4 made of a re-molding material 105 may be disposed on the edge 102. The repeat molding portion 56 can be disposed on the base 56 using a thermoplastic injection molding process. An example of such a process is disclosed in U.S. Patent Application Serial No. 11/092,528, filed on March 29, 2005, which is incorporated herein by reference. U.S. Patent Application Serial No. 6,871,741, which is incorporated herein by reference. Part of the continuation of the application is disclosed in U.S. Patent No. 6,428,729 issued on Aug. 6, 2002. Each of the references to the present invention is hereby incorporated by reference in its entirety in its entirety in its entirety in its entirety in its entirety in its entirety herein in its entirety The patents disclose composite wafer carriers and containers wherein the wafer support structure is formed by re-molding a first thermoplastic material onto a second thermoplastic material different from the first thermoplastic material. The re-molded component forms a gap-free, airtight interface that securely bonds the portions together. In particular, U.S. Patent No. 6,871,741 discloses the re-molding of transparent windows, latching mechanisms, and wafer contacts for supporting wafers. In use, the re-molded wafer holder 50 engages the edge of the wafer 29 contained in the wafer container 1 200816346 to secure the wafer 29 to a wafer carrier such as an H carrier (not shown). Inside. With the door 14 removed, the re-molded wafer holder 5 is suspended above the opening of the frame 28 in a retracted position (Fig. 1A) with the wheel 94 at the lower limit point. The post 88 abuts against the inner surface (not shown) of the rear wall 16 thereby preventing the rotating member of the actuating mechanism 30 from overstretching in the retracted position. When the door 14 is placed within the frame 28, the door 14 contacts the wheel 94, thereby moving the re-molded wafer holder 50 upward toward the top 24. The upward movement of the re-molded wafer holder 5〇 causes the pull rods 38 and 40 to rotate about the mandrels 34 and 36, thereby further extending the re-molding round holder 50 away from the rear wall 16 and re-molding the wafer. The raised ridges 104 of the holder 5 are bridged to the periphery of the contact wafer 29. Figure 1B is a schematic illustration of a remolded wafer holder 5Q in an extended or contact position. The wheel % enables the re-molding of the wafer holder 50 to be able to level along the inner surface of the door 14 without excessively generating particles. The bridge plate 87 effectively strengthens the beam 66 to resist the moment or torsional load transmitted by the reaction force transmitted to the wheel 90 when the wheel 94 is tempered. The basin should also be 'introspected' to utilize the actuation mechanism 30 and the repeated molding of the wafer holder 50 (for example, the actuation mechanism 30 does not include the wheel 94), and this still falls within the scope of the present invention. . See Fig. 9 " to Fig. 11' The repetitive molding and airlift of the remolded wafer holder 50 will now be described in more detail. One method involves casting the base 54 in a first mold and then applying a base to the repeat molding portion 56. The second mold is equipped with a pulse path system 106 to enable the re-molding material 105 to approach the edge 1〇2 of the rail portions 58 and 59. The first method involves a first mold that includes the conditions for providing the vascular system 106, which is adapted to the insert (not shown) as desired. The inserts are placed in the channels defining the venous system 106 during injection molding of the base 54. After forming the base 54, the base 54 is removed from the mold and the insert is removed from the passageway. The base 54 is then repositioned into the first mold and the repetitive molding material 105 is injected through the now vacant passage to form the venous system 106 which delivers the re-molding material 105 to the edges 102 of the track portions 58 and 59. In both methods, the mold can be formed by an upper mold portion that cooperates with a lower mold portion that has a boundary line 108 positioned to enclose the base portion 54 and the pulse system f ' 106. It should be noted that although the mold portions are not shown in the drawings, the upper mold portion is located in the area marked by the letter "A" above the boundary line 108, and the lower mold portion is located below the boundary line by the letter "B". In the marked area. The boundary line 108 is capable of fully defining a so-called "steel safety interface" 110 between the wafers 29. The steel safety interface includes the portion of the remolded wafer holder 50 that is in contact with the edge of the wafer 29. The steel safety interface preferably has no sharp corners and typically has a rounded surface 112 in contact with the wafer 29. The steel safety interface 110 has a protruding dimension 114 that projects beyond the base in the direction of the wafer 29. The position of the dividing line 108 enables the fine molding portion 56 to be finely adjusted to an optimum size, as needed. The molding process is prone to deviations that affect the size of the final component in an indeterminate but often repeatable manner. We can “fine-tune” the molding process by removing metal from the mold until the desired dimensional tolerance of the final molded product is reached. The component formed by the mold using the process is referred to as a "steel safety" component because the dimensional repeatability of the product made of the mold is generally excellent despite the deviation. 12 200816346 Therefore, in one embodiment of the present invention, we will reduce the size of the cavity on the upper mold portion for the size of the dog's out size 114 to be reduced in consideration of shrinkage factors and other known effects. The small steel formed a safety interface of 11 inches. Based on this result, it can be inferred that the amount of material to be removed from the mold portion for defining the protruding dimension 114 from the upper mold portion is estimated. Depending on the inferred value, it is optional to remove the amount of material that is slightly less than the calculated value to ensure that the resulting part is not oversized. After two or three trimming of the cavity, it is possible to form a mold that can be made into components within the dimensional tolerance. (See FIGS. 12A through 12C, which illustrate a front opening unified p〇d5 FOUP 120 having a door assembly 122 having a plurality of repeating modes in an embodiment of the present invention. Plastic wafer holder fingers 124. The re-molded wafer holder fingers 124 in this embodiment are operatively coupled to one of the inner surfaces 126 of the door assembly 122. The wafer holder fingers 124 The end portion 13A can be repeatedly molded from a material that facilitates contact with the wafer 128 contained in the FOUP 120. When the door assembly 122 is placed over the opening of the FOUP 120, the wafer holder finger 122 engages the F0UP. The wafer 128 is received to be securely biased against the wafer contact structure 132 ◎ within the FOUP 120. The re-molding material can be selected to protect the wafer holder fingers 120 and wafers 128. No chiseling, dents, and/or wear will occur. The above discussion is about SMIF wafer cassettes and FUP wafer containers. However, it should be noted that this concept also applies to other wafer holder structures. Accordingly, this article Each aspect of the disclosed embodiments should be considered as an illustration The scope of the invention is indicated by the scope of the appended claims, and the description of the claims "Means for" or "step for", otherwise 35 USC Part 112, paragraph 6, will be explicitly not invoked. The relative terms cited, such as upper, front, back, left and right Etc., for convenience of description, and are not intended to limit the invention or its elements to any particular orientation. All of the dimensions shown in the drawings may vary depending on the potential design and intended use of the embodiments of the present invention. The various figures and methods disclosed herein may be used alone or in combination with other features and methods for providing improved apparatus, systems, and methods of making and using the same. Combinations of features and methods may not necessarily be required to implement the invention in the broadest scope of the invention, but are merely illustrative of specific embodiments of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a side elevational cross-sectional elevation view of a wafer container for detaching a wafer holder from a wafer in accordance with an embodiment of the present invention; FIG. 1B is a wafer holder A side elevational view of the wafer container shown in FIG. 1A in the case of meshing the wafer; k 1C is a perspective view of the actuating mechanism used in FIGS. 1A and 1B in the case of removing the wafer holder FIG. 2 is an elevational view of the wafer container shown in FIG. 1 in the case where the rear wall is cut to expose the wafer holder and the actuating mechanism; FIG. 3 is a repeat in an embodiment of the present invention; A perspective view of the front side of the molded wafer holder; Fig. 4 is a perspective view of the back side of the remolded wafer holder shown in Fig. 3; and Fig. 5 is a remolded wafer holder shown in Fig. 3. End view; 14 200816346 Figure 6 is a front view of the remolded wafer holder shown in Figure 3; Figure 7 is a side view of the remolded wafer holder shown in Figure 3; The rear view of the wafer holder is shown in Figure 3; Figure 9 is the repeat shown in Figure 3 with the inlet attached. A perspective view of the back side of the molded wafer holder; the first drawing is a perspective view of the front side of the remolded wafer holder shown in Fig. 9; and Fig. 11 is a re-molding wafer fixing shown in Fig. 9. Figure 11A is a partial enlarged view of the re-molded portion shown in Figure η; Figure 12A is a plan view of a front-open unified standard wafer cassette in an embodiment of the present invention; The figure is the door of the front open unified standard wafer cassette shown in Figure 12A; and the 12C is an enlarged cross-sectional view of one of the remolded wafer holder fingers of Figure 12b. [Main component symbol description] 10 : Wafer container 12 : Container portion 14 : Door 16 : Rear wall 18 : Side wall 20 : Front wall 22 : Side wall 24 : Top 26 : Bottom assembly 27 : Housing 28 : Door frame 29 : Crystal Circle 29.1: Edge 30: Actuating mechanism 31: Inner surface 32: Frame 34: Mandrel 36: Mandrel 15 200816346 38 ·· Pull rod 40: 42 : End portion 44: 46: Cylindrical pivot 48: 50 ·· Repeat Molded wafer holder 51 : 52 : Back 54 : 56 : Remolded part 58 : 59 : Track part 60 : 61 : Beam 62 : 63 · · Beam 64 : 65 : Banner 66 : 67 : Center or longitudinal axis 68 : 70 : L-shaped furcation part 72 : 74 : Center bridge part 76 : 78 : Lower clamp part 80 : 82 : L-shaped branch part 84 : 86 : Arched part 87 : 88 : Pillar part 90 : 92 : Free End 94: 96 ·· Near end 98 : 100 : Inclined angle 102 104 : Spine 105 106 : Pulse system 108 110 : Steel safety interface 112 Tie rod end cylindrical end Axle base Road beam beam beam beam beam upper clamp assembly L-shaped bifurcated component arched section L-shaped bifurcation component central bridge component bridge plate wheel wheel distal end: edge: re-molding material • dividing line: rounding surface 16 200816346 114: Outer dimension 120: Front open unified standard wafer cassette 122: Door assembly 124: Remolded wafer holder finger 126: Inner surface 128: Wafer 130: End portion 132: Wafer contact structure 17