TWI715623B - Front opening substrate container with compression latches - Google Patents
Front opening substrate container with compression latches Download PDFInfo
- Publication number
- TWI715623B TWI715623B TW105128134A TW105128134A TWI715623B TW I715623 B TWI715623 B TW I715623B TW 105128134 A TW105128134 A TW 105128134A TW 105128134 A TW105128134 A TW 105128134A TW I715623 B TWI715623 B TW I715623B
- Authority
- TW
- Taiwan
- Prior art keywords
- container
- wafer support
- wafer
- wall
- latch member
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
本發明一般而言係關於用於侷限晶圓、扁平面板、其他基板及諸如此類以用於輸送、儲存及處理之基板容器。更特定而言,本發明係關於一種前開基板容器,其具有用於將一或多個容器組件固定至容器外殼且能夠耐受一衝擊震動之一或多個壓縮閂鎖部件。 The present invention generally relates to substrate containers for confined wafers, flat panels, other substrates, and the like for transportation, storage, and processing. More specifically, the present invention relates to a front opening substrate container, which has one or more compression latch components for fixing one or more container components to the container shell and capable of withstanding an impact and vibration.
晶圓載體或傳送盒(pod)用於在處理之前、處理期間及處理之後固持、輸送及儲存基板。此等基板用於製作諸如積體電路及液晶顯示器面板之半導體。在其成為最終產品之變換中,此等精密且高度有價值之基板經受重複處理、儲存及輸送。必須保護此等基板免受來自特定污染物、靜電放電之損壞、來自斷裂之實體損壞或者來自蒸汽或氣體(諸如自處理中使用之材料除氣之蒸汽或氣體)之污染。 Wafer carriers or pods are used to hold, transport, and store substrates before, during, and after processing. These substrates are used to make semiconductors such as integrated circuits and liquid crystal display panels. In its transformation into the final product, these sophisticated and highly valuable substrates undergo repeated processing, storage, and transportation. These substrates must be protected from specific contaminants, damage from electrostatic discharge, physical damage from fracture, or contamination from steam or gas (such as steam or gas degassed from materials used in processing).
此等基板容器稱作FOUP(前開統一傳送盒之一縮寫字)及FOSB(前開運送盒之一縮寫字)。工業標準規定此等基板容器利用運動耦合件,該等運動耦合件在容器之底部上包括與在處理裝備上配置成一個三角形之三個圓形突出部介接之三個經徑向定向凹槽。此等運動耦合件提供對晶圓容器之精確定向,藉此允許對容器及內容物之精確操縱,舉例而言晶圓之機 器人移除及插入。此等容器通常將具有用於允許對具有內容物之該等容器進行機器人傳送之構件。此構件可包含晶圓容器之頂部上之一機器人凸緣以及容器之底部上之適合軌道或其他特徵以允許容器在運輸機上利用滾輪或適合載架適合地運輸。應明瞭,突然起動及停止(其係具有所負荷晶圓之晶圓容器之振動)可導致對晶圓之損壞。因此,適當在輸送(包含在一設施內之運輸)期間為晶圓提供適合緩衝。晶圓限動器及外部封裝在自設施至設施之輸送期間習用地提供此緩衝。當容器藉助在一設施內嚙合FOUP及/或FOSB之底板之運輸機輸送時,亦期望具有用於晶圓之額外阻尼及緩衝。 These substrate containers are called FOUP (an abbreviation for Front Opening Unified Transport Box) and FOSB (an abbreviation for Front Opening Transport Box). The industry standard stipulates that these substrate containers utilize kinematic couplings. The kinematic couplings include three radially oriented grooves on the bottom of the container that interface with three circular protrusions arranged in a triangle on the processing equipment. . These kinematic couplings provide precise orientation of the wafer container, thereby allowing precise manipulation of the container and its contents, for example, a wafer machine Robot removal and insertion. These containers will usually have means for allowing robotic transfer of the containers with contents. This component may include a robotic flange on the top of the wafer container and suitable rails or other features on the bottom of the container to allow the container to be transported properly on a conveyor using rollers or a suitable carrier. It should be understood that sudden start and stop (which is the vibration of the wafer container with the loaded wafer) can cause damage to the wafer. Therefore, it is appropriate to provide suitable buffers for wafers during transportation (including transportation within a facility). Wafer stoppers and external packaging provide this buffer in customary areas during transportation from facility to facility. It is also desirable to have additional damping and cushioning for the wafers when the containers are transported by means of a conveyor that engages the floor of the FOUP and/or FOSB in a facility.
本發明一般而言係關於一種前開基板容器,其具有用於將一或多個容器組件固定至容器外殼且能夠耐受一衝擊震動之一或多個壓縮閂鎖部件。該壓縮閂鎖部件包含一臂,該臂經構形以接觸提供於容器部分上之一或多個對應特徵且施加一負荷至該一或多個對應特徵,從而將該容器組件固定至該容器主體。 The present invention generally relates to a front-opening substrate container, which has one or more compression latch components for fixing one or more container components to the container shell and capable of withstanding an impact and vibration. The compression latch member includes an arm configured to contact one or more corresponding features provided on the container portion and apply a load to the one or more corresponding features, thereby fixing the container assembly to the container main body.
在一項實施例中,一基板容器包含:一門及一容器部分,該容器部分包括一對大體相對側壁對;一後壁;一頂部壁;一底部;及一對大體相對晶圓支撐件,其以可移除方式附接該等側壁中之每一者。該等晶圓支撐件中之每一者具有用於容納複數個基板之複數個架。另外,該等晶圓支撐件中之至少一者包含一壓縮閂鎖部件,該壓縮閂鎖部件具有朝向該容器部分以一向下角度延伸遠離至少一個架橋接支撐件之一臂,其中該臂經構形以接觸提供於該容器部分上之一或多個對應特徵且施加一負荷至該一或多個對應特徵。該基板容器可係一前開運送盒、一前開統一傳送盒或一多應 用載體中之任一者。 In one embodiment, a substrate container includes: a door and a container portion, the container portion including a pair of substantially opposite side walls; a rear wall; a top wall; a bottom; and a pair of substantially opposite wafer supports, It attaches each of these side walls in a removable manner. Each of the wafer supports has a plurality of racks for accommodating a plurality of substrates. In addition, at least one of the wafer supports includes a compression latch member having an arm extending away from at least one bridging support member at a downward angle toward the container portion, wherein the arm passes The configuration is configured to contact one or more corresponding features provided on the container portion and apply a load to the one or more corresponding features. The substrate container can be a front-opening transport box, a front-opening unified transfer box or a multi-application Use any of the carriers.
在另一實施例中,一基板容器包含:一門及一容器部分,該容器部分包括一對大體相對相對側壁;一後壁;一頂部壁;及一底部。至少一個容器組件與該容器部分嚙合。該至少一個容器組件包含具有一撓性臂之一壓縮閂鎖部件,該撓性臂經構形以接觸該容器部分上之一對應特徵且施加一負荷至該對應特徵。 In another embodiment, a substrate container includes: a door and a container portion, the container portion including a pair of substantially opposite side walls; a rear wall; a top wall; and a bottom. At least one container assembly engages the container portion. The at least one container assembly includes a compression latch component having a flexible arm that is configured to contact a corresponding feature on the container portion and apply a load to the corresponding feature.
在又一實施例中,將一容器組件固定至一基板載體之一容器主體之一方法包含將一容器組件之一壓縮閂鎖部件之一臂與提供於該容器主體上之一部分上之一對應特徵嚙合,其中該臂經構形以接觸提供於該容器主體上之該等對應特徵且施加一負荷至該等對應特徵。 In yet another embodiment, a method for fixing a container assembly to a container body of a substrate carrier includes aligning an arm of a compression latch member of a container assembly corresponding to an arm provided on a portion of the container body Feature engagement, wherein the arm is configured to contact the corresponding features provided on the container body and apply a load to the corresponding features.
前述發明內容經提供以促進對本發明獨有之某些創新性特徵之一理解且並非意欲係一充分說明。可藉由將整個說明書、申請專利範圍、圖式及摘要作為一整體而獲得對本發明之一充分瞭解。 The foregoing summary of the invention is provided to facilitate the understanding of one of the unique innovative features of the invention and is not intended to be a full description. A full understanding of one of the present inventions can be obtained by taking the entire specification, patent application scope, drawings and abstract as a whole.
10:載體/晶圓載體 10: Carrier/wafer carrier
14:前門框 14: Front door frame
16:門開口 16: door opening
20:容器部分/容器主體 20: container part/container body
24:門 24: door
26:底板 26: bottom plate
30:頂部/頂部容器壁 30: Top/top container wall
32:底部/底部容器壁 32: bottom/bottom container wall
34:側/右舷容器壁/埠容器壁 34: side/starboard container wall/port container wall
36:背部/後容器壁 36: back/rear container wall
37:底部表面 37: bottom surface
40:晶圓支撐件/第一晶圓支撐件/第二晶圓支撐件/右舷晶圓支撐件/埠晶圓支撐件 40: Wafer support/first wafer support/second wafer support/starboard wafer support/port wafer support
44:自動凸緣 44: automatic flange
47:運動耦合組件 47: Motion coupling components
48:V形凹槽 48: V-shaped groove
52:晶圓支撐架/弓形晶圓支撐架/架 52: Wafer support frame/bow wafer support frame/frame
54:第一架橋接支撐件 54: The first bridge support
55:第二架橋接支撐件/架橋接支撐件 55: The second bridge support / bridge support
56:晶圓接納區域 56: Wafer receiving area
60:晶圓嚙合部分 60: Wafer engagement part
64:托架/附接構件 64: bracket/attachment member
66:第一側 66: first side
70:壓縮閂鎖部件/閂鎖部件 70: Compression Latch Parts/Latch Parts
74:臂/閂鎖臂/懸伸臂 74: arm / latch arm / cantilever arm
78:內表面 78: inner surface
82:指狀物/叉指 82: finger/interdigit
86:區塊特徵 86: Block Features
88:三角形剖面 88: Triangular section
92:壓縮閂鎖部件/壓縮部件 92: Compression latch parts/compression parts
96:臂 96: arm
98:樞轉點 98: pivot point
102:軌道結構/軌道/靜態軌道部件/成角度軌道結構 102: Track structure/track/static track components/angled track structure
104:外表面 104: outer surface
106:第一部分 106: Part One
108:第二部分 108: Part Two
112:底部表面 112: bottom surface
120:V形凹槽 120: V-shaped groove
122:壓縮閂鎖部件 122: Compression latch parts
123:運動耦合組件 123: Motion coupling components
124:t形槽 124: T-slot
125:軌道結構 125: track structure
126:臂 126: Arm
128:區塊結構 128: block structure
130:主要部分 130: main part
132:承窩 132: Socket
134:支柱 134: Pillar
136:第一支腿 136: The first leg
138:第二支腿 138: Second leg
140:翼樑 140: wing spar
150:錨狀物 150: anchor
152:通道 152: Channel
X:右舷方向 X: starboard direction
-X:埠方向 -X: port direction
Y:向上方向 Y: upward direction
-Y:向下方向/降低方向 -Y: downward direction/lower direction
Z:向後方向 Z: backward direction
-Z:向前方向 -Z: forward direction
結合隨附圖式考量各種說明性實施例之以下說明可更完全地理解本發明。 The following description of various illustrative embodiments may be considered in conjunction with the accompanying drawings to understand the present invention more completely.
圖1係一例示性晶圓載體之一透視圖。 Figure 1 is a perspective view of an exemplary wafer carrier.
圖2係圖1中所展示之晶圓載體之一俯視平面圖。 FIG. 2 is a top plan view of the wafer carrier shown in FIG. 1. FIG.
圖3係圖1中所展示之晶圓載體之一仰視平面圖。 FIG. 3 is a bottom plan view of the wafer carrier shown in FIG. 1. FIG.
圖4係圖1中所展示之晶圓載體之一側視剖面圖。 4 is a side cross-sectional view of the wafer carrier shown in FIG. 1.
圖5係根據本發明之各種實施例之一說明性晶圓支撐件之一透視圖。 Figure 5 is a perspective view of an illustrative wafer support according to one of the various embodiments of the present invention.
圖6係根據本發明之各種實施例之一說明性晶圓支撐件之一側視圖。 Figure 6 is a side view of an illustrative wafer support in accordance with one of the various embodiments of the present invention.
圖7A至圖7C展示根據本發明之一實施例之一例示性壓縮閂鎖部件70
之不同近視圖。
7A to 7C show an exemplary
圖8係根據本發明之一實施例之包含一或多個壓縮閂鎖部件之一例示性自動凸緣之一近視圖。 Figure 8 is a close-up view of an exemplary automatic flange including one or more compression latch components in accordance with one embodiment of the present invention.
圖9係根據本發明之一實施例之提供於容器主體上之一或多個軌道結構之一近視圖。 Figure 9 is a close-up view of one or more track structures provided on the container body according to an embodiment of the present invention.
圖10A係展示包含一自動凸緣之一晶圓載體之一俯視圖。圖10B係展示圖10A中所見之自動凸緣之一經放大俯視圖。圖10B係略微示意圖且展示與提供於晶圓載體之容器主體上之一或多個軌道結構嚙合之自動凸緣。圖10A及圖10B可統稱為圖10。 Figure 10A shows a top view of a wafer carrier including an automatic flange. Figure 10B shows an enlarged top view of one of the automatic flanges seen in Figure 10A. Fig. 10B is a schematic diagram and shows an automatic flange engaged with one or more track structures provided on the container body of the wafer carrier. 10A and 10B can be collectively referred to as FIG. 10.
圖11係處於一未經閂鎖構形中之與提供於容器主體上之一對應軌道結構相互作用之一例示性壓縮閂鎖部件之一近視圖。 Figure 11 is a close-up view of an exemplary compression latch component interacting with a corresponding track structure provided on the container body in an unlatched configuration.
圖12展示處於經閂鎖構形中之圖11之相同壓縮閂鎖部件與軌道結構。 Figure 12 shows the same compression latch component and track structure of Figure 11 in a latched configuration.
圖13A係一例示性晶圓載體之一透視圖。圖13B係根據本發明之一實施例之包含一壓縮閂鎖部件之一V形凹槽之近視示意圖。圖13A及圖13B可統稱為圖13。 FIG. 13A is a perspective view of an exemplary wafer carrier. FIG. 13B is a close-up view of a V-shaped groove including a compression latch component according to an embodiment of the present invention. 13A and 13B can be collectively referred to as FIG. 13.
圖14A係一例示性晶圓載體之一剖面透視圖。圖14B係根據本發明之一實施例之包含一壓縮閂鎖部件之一V形凹槽之近視示意圖。圖14A及圖14B可統稱為圖14。 FIG. 14A is a cross-sectional perspective view of an exemplary wafer carrier. 14B is a close-up view of a V-shaped groove including a compression latch component according to an embodiment of the present invention. 14A and 14B can be collectively referred to as FIG. 14.
圖15A係一例示性晶圓載體容器部分之一剖面透視圖。圖15B係進一步圖解說明圖15A中所展示之晶圓載體容器部分之一部分之一經放大透視圖。圖15C係進一步圖解說明圖15A中所展示之晶圓載體容器部分之一部分之一經放大透視圖。圖15A至圖15C可統稱為圖15。 FIG. 15A is a cross-sectional perspective view of an exemplary wafer carrier container portion. FIG. 15B further illustrates an enlarged perspective view of a portion of the wafer carrier container portion shown in FIG. 15A. FIG. 15C further illustrates an enlarged perspective view of a portion of the wafer carrier container portion shown in FIG. 15A. 15A to 15C may be collectively referred to as FIG. 15.
圖16係展示一說明性晶圓支撐件及一例示性晶圓載體容器部分之一分解透視圖。在圖16中出於圖解說明目的而對例示性晶圓載體容器部分剖面。 Figure 16 shows an exploded perspective view of an illustrative wafer support and an illustrative wafer carrier container portion. The exemplary wafer carrier container is partially sectioned in FIG. 16 for illustration purposes.
圖17A係一例示性晶圓載體之一剖面透視圖。圖17B係進一步圖解說明圖17A中所展示之晶圓載體之一部分之一經放大透視圖。圖17C係進一步圖解說明圖17A中所展示之晶圓載體之一部分之一經放大透視圖。圖17A至圖17C可統稱為圖17。 FIG. 17A is a cross-sectional perspective view of an exemplary wafer carrier. FIG. 17B further illustrates an enlarged perspective view of a portion of the wafer carrier shown in FIG. 17A. FIG. 17C further illustrates an enlarged perspective view of a portion of the wafer carrier shown in FIG. 17A. 17A to 17C can be collectively referred to as FIG. 17.
圖18係一例示性晶圓載體之一分解圖。 FIG. 18 is an exploded view of an exemplary wafer carrier.
雖然本發明適用於各種修改及替代形式,但其詳情已在圖式中以實例方式展示且將被詳細地闡述。然而,應理解,並非意圖將本發明之態樣限制於所闡述之特定說明性實施例。相反,意圖涵蓋歸屬於本發明之精神及範疇內之所有修改、等效形式及替代方案。 Although the present invention is applicable to various modifications and alternative forms, the details thereof have been shown in the drawings as examples and will be elaborated in detail. However, it should be understood that it is not intended to limit the aspects of the invention to the specific illustrative embodiments set forth. On the contrary, the intention is to cover all modifications, equivalent forms, and alternatives that fall within the spirit and scope of the present invention.
如本說明書及隨附申請專利範圍中所使用,除非內容另外明確指示,否則單數形式「一(a、an)」及「該(the)」包含複數指代物。如本說明書及隨附申請專利範圍中所使用,除非內容另外明確指示,否則通常在其包含「及/或」之意義上採用術語「或」。 As used in this specification and the accompanying patent application, unless the content clearly indicates otherwise, the singular forms "一 (a, an)" and "the (the)" include plural referents. As used in the scope of this specification and the accompanying application, unless the content clearly indicates otherwise, the term "or" is usually used in the sense that it includes "and/or".
伸長可定義為在具有一長度、一寬度及一厚度之一物件中具有大於約4之一長度對寬度縱橫比。其中寬度小於長度且大於厚度。 Elongation can be defined as having a length to width aspect ratio greater than about 4 in an object having a length, a width, and a thickness. The width is less than the length and greater than the thickness.
應參考圖式閱讀以下詳細說明,在該等圖式中類似元件在不同圖式中編號相同。詳細說明及圖式(其未必按比例)繪示說明性實施例且並非意欲限制本發明之範疇。所繪示之說明性實施例僅意欲為例示性的。除非明確陳述相反之情形,否則任何說明性實施例之選定特徵可併入至一額外實 施例中。 The following detailed description should be read with reference to the drawings, in which similar elements are numbered the same in different drawings. The detailed description and drawings (which are not necessarily to scale) illustrate illustrative embodiments and are not intended to limit the scope of the present invention. The illustrative embodiments shown are intended to be illustrative only. Unless the contrary is clearly stated, selected features of any illustrative embodiment may be incorporated into an additional embodiment In the examples.
圖1、圖2、圖3及圖4展示一例示性晶圓載體10之不同視圖。載體10可係經構形以容納具有300mm或450mm之一直徑之晶圓之一前開運送盒(FOSB)、一前開統一傳送盒(FOUP)或一多應用載體(MAC)中之任一者,且通常包含具有一前開口、一門24(其用以閉合前開口)及一底板26之一容器部分20。容器部分通常具有一頂部30、一底部32、側34、背部36、底部表面37及一內部開口。用於支撐晶圓之晶圓支撐件40定位於容器部分之內部中、位於其各側處,如圖4中所圖解說明。此項技術中已知的前開晶圓載體具有諸如美國專利第7,866,480號、第7,316,325號及第6,267,245號中所圖解說明之特徵,所有該等美國專利出於所有目的以其全文引用方式併入本文中。
1, 2, 3 and 4 show different views of an
在某些情形中,如圖1至圖4中所展示,載體10可包含附接至容器部分20之一或多個容器組件。可附接至容器部分且形成載體10之一部分之例示性容器組件包含(但不限於)晶圓支撐件40、一自動凸緣44及一或多個運動耦合組件47,該一或多個運動耦合組件具有用於與提供於一晶圓處理設施內之自動化裝備上之運動耦合(KC)銷介接之V形凹槽48。
In some cases, as shown in FIGS. 1 to 4, the
載體10(如圖1至圖4中所展示)可包含固定至容器側壁之內表面之一對大體相對晶圓支撐件40。更特定而言,一第一晶圓支撐件40固定至一第一側壁,與固定至一第二側壁之一第二晶圓支撐件40相對,該第二側壁與第一側壁相對使得晶圓支撐件40中之每一者之晶圓支撐架52彼此面對。
The carrier 10 (as shown in FIGS. 1 to 4) may include a pair of substantially opposed wafer supports 40 fixed to the inner surface of the container sidewall. More specifically, a
圖5係根據本發明之各種實施例之可固定至容器側壁中之一者之一內表面之一說明性晶圓支撐件40之一透視圖且圖6係該說明性晶圓支撐件之
一平面圖。如圖5中所展示,晶圓支撐件40包含在一第一架橋接支撐件54與一第二架橋接支撐件55之間延伸之複數個弓形晶圓支撐架52,每一架52界定一晶圓接納區域56及一晶圓嚙合部分60。每一晶圓支撐件40亦可包含延伸遠離第一架橋接支撐件54之一或多個托架或附接構件64,該一或多個托架或附接構件用於將晶圓支撐件40之一第一側66固定至容器側壁之內表面。另外,每一晶圓支撐件40可包含用於經由壓縮力進一步將晶圓支撐件40固定至容器側壁之一或多個壓縮閂鎖部件70。如圖5及圖6中所展示,每一晶圓支撐件40包含沿著晶圓支撐件40之一側與另一個間隔開之兩個閂鎖部件70。然而,預期晶圓支撐件40在必要或期望時可包含更少或更多閂鎖部件70。晶圓支撐件40(包含壓縮閂鎖部件70)可由聚碳酸酯或另一熱塑性聚合物材料射出成型。壓縮閂鎖部件70係與晶圓支撐件之其餘部分整體地形成,使得晶圓支撐件40具有一單個整體式主體且並非由單獨個別零件構成。
FIG. 5 is a perspective view of an
圖7A至圖7C展示一例示性壓縮閂鎖部件70之不同近視圖。圖7A展示處於一未經閂鎖構形中之閂鎖部件70且圖7B展示處於一經閂鎖構形中之閂鎖部件70。圖7C係圖7B中所展示之處於經閂鎖構形中之閂鎖部件70之一側視圖。如圖7A至圖7C中之最佳所見,每一壓縮閂鎖部件70具有延伸遠離第二架橋接支撐件55之一臂74。在諸多情形中,臂74以一向下角度遠離架橋接支撐件55延伸至晶圓載體10之容器部分20之內表面78中。當閂鎖部件70處於如圖7B中所展示之經閂鎖構形中時,以相對於容器部分20之內表面78之一向下角度定位臂74將壓縮負荷自閂鎖部件70驅動至容器部分中,從而提供一強固閂鎖力。每一臂具有一彈性模數,使得該臂足夠剛硬以處置施加至容器部分20之壓縮負荷,但仍充分地撓性使得臂可藉
由手而卡扣至適當位置中。在某些實施例中(如圖7A至圖7B中所展示),每一臂包含一或多個指狀物或叉指82,該一或多個指狀物或叉指經構形以與形成於容器部分之內表面78上之一或多個對應區塊特徵86接觸且將一壓縮負荷施加至該一或多個對應區塊特徵。另外,在某些實施例中,如圖7C中所展示,指狀物或叉指82中之每一者可具有一個三角形剖面88。指狀物或叉指82之三角形剖面88提供一額外機構以用於將閂鎖部件70進一步支撐於其中將負荷施加至容器部分20之點處。另外,將閂鎖部件70支撐於兩個或多於兩個的接觸點處可防止壓縮閂鎖部件70自身向後屈曲及旋轉,且亦可提供可有助於增強閂鎖臂74與容器部分20之間的閂鎖之另一支撐點。此一閂鎖配置可防止晶圓支撐件40在一震動事件中自容器部分20解除固定。在一震動事件期間,閂鎖臂74之向下角度致使閂鎖臂74朝向容器部分20驅動,此可進一步強化壓縮閂鎖部件70與容器部分20之間的連接,且此可防止晶圓支撐件40自容器部分拆離。
7A-7C show different close-up views of an exemplary
參考圖2及圖8至圖11,自動凸緣44亦可包含可與容器部分20上之一對應結構協作以將自動凸緣44固定至容器部分20之一或多個壓縮閂鎖部件92。如同本文中所論述之晶圓支撐件40,自動凸緣44(包含壓縮閂鎖部件92)亦可由聚碳酸酯或另一適合熱塑性材料射出成型。在某些實施例中,壓縮閂鎖部件92與自動凸緣44之其餘部分整體地形成,使得自動凸緣44具有一單個整體式主體且並非由單獨個別零件構成。然而,此非必需的。每一臂具有一彈性模數,使得該臂足夠剛硬以處置施加至其之壓縮負荷,但仍充分地撓性使得臂准許藉由手而將自動凸緣44卡扣至適當位置中。
Referring to FIGS. 2 and 8 to 11, the
圖8係包含兩個壓縮閂鎖部件92之一例示性自動凸緣44之一近視圖。
此僅係一項實例。預期某些實施例可包含多於兩個的壓縮閂鎖部件92。每一壓縮部件92包含以一角度自自動凸緣44之一中心軸x延伸之一臂96。另外,每一臂96包含一樞轉點98,該樞轉點准許當將一負荷施加至臂96時,臂96自其中無負荷被施加至臂96之一第一鬆弛構形樞轉或撓曲成其中臂96沿箭頭方向朝向中心軸x樞轉或移動之一第二構形。圖8展示處於其中無負荷被施加至臂96之第一鬆弛構形中之臂96。
FIG. 8 is a close-up view of one of the exemplary
壓縮閂鎖部件92之臂96中之每一者經構形以與提供於容器部分20之外表面上之一對應區塊或軌道結構相互作用。圖9係提供於一例示晶圓載體之容器部分20之外表面104上之兩個軌道結構102的一近視圖。軌道102中之每一者包含以一角度沿著外表面104朝向容器主體20之一中心軸y延伸之一第一部分106,及沿朝向容器主體20之一中心軸y之一方向自第一部分延伸之一第二部分108。軌道結構102係靜態結構,此乃因該等軌道結構在一力施加至其時不移動。而是該等軌道結構充當一區塊,可將來自一對應壓縮閂鎖部件92之一壓縮負荷或力施加至該區塊。由於軌道結構102沿與壓縮閂鎖部件92之角度之方向相反的一方向朝向容器主體之中心軸y成角度,因此該等軌道結構充當一止擋件或一區塊且可接納來自壓縮閂鎖部件92之任何壓縮力。壓縮閂鎖部件92與軌道結構102之間的壓縮力提供自動凸緣44與容器部分20之間的一強固連接,該強固連接能夠耐受一震動事件且可防止自動凸緣44在此一事件中自容器部分20移出。
Each of the
圖10係與提供於容器主體上之軌道結構102嚙合之一自動凸緣44之一示意圖。圖11係處於一未經閂鎖構形中之與一對應軌道結構102相互作用之一例示性壓縮閂鎖部件92之一近視圖。圖12展示處於經閂鎖構形中之相同壓縮閂鎖部件92與軌道結構。如圖11中所展示,由於自動凸緣44沿
著提供於容器部分之外表面上之軌道結構102向前移動,因此一軌道結構102接觸且嚙合一對應壓縮閂鎖部件92,從而致使壓縮閂鎖部件沿朝向自動凸緣44之一中心軸之一方向在樞轉點處撓曲或樞轉。由於壓縮閂鎖部件92正自其中無負荷被施加之一鬆弛狀態過渡至一第二狀態,因此壓縮閂鎖部件92施加一壓縮力或負荷至靜態軌道部件102。壓縮閂鎖部件92與軌道結構102之間的此相互作用繼續直至壓縮閂鎖部件92移動超出軌道結構102之第二部分108為止,在此之後壓縮閂鎖部件92至少部分地朝向如圖12中所展示之第一鬆弛構形過渡。在此部分鬆弛構形中,壓縮閂鎖部件92繼續施加一壓縮力或負荷至成角度軌道結構102,從而提供壓縮閂鎖部件92與軌道結構102之間的一強固閂鎖機構,從而將自動凸緣44固定至容器部分。
Fig. 10 is a schematic diagram of an
在晶圓載體之某些實施例中,V形凹槽亦可包含用於將V形凹槽固定至容器主體之一壓縮閂鎖部件。V形凹槽與提供於一晶圓製作設施內之自動化裝備上之運動耦合(KC)銷介接。 In some embodiments of the wafer carrier, the V-shaped groove may also include a compression latch for fixing the V-shaped groove to the container body. The V-shaped groove interfaces with Kinematic Coupling (KC) pins provided on automated equipment in a wafer fabrication facility.
圖13及圖14係具有固定至容器主體20之底部表面112之V形凹槽120之一運動耦合組件123之兩個示意圖。熟習此項技術者通常理解,具有V形凹槽120之多於一個的運動耦合組件123可固定至一例示性晶圓載體之底部。舉例而言,一前開運送盒可包含固定至容器主體之三個V形凹槽。具有V形凹槽120之每一運動耦合組件123包含一壓縮閂鎖部件122。除壓縮閂鎖部件122以外,具有V形凹槽120之每一運動耦合組件123亦包含一t形槽124,該t形槽與提供於容器主體20之底部表面112上之一對應軌道結構125相互作用且提供用於將具有V形凹槽120之運動耦合組件123保持並固定至容器主體20之一第一保持機構。壓縮閂鎖部件122包含一臂126,
該臂沿一向下方向自V形凹槽120之一上部表面延伸且經構形以與提供於容器主體20之底部表面112上或與該底部表面整體地形成之一對應區塊結構128相互作用。另外,在某些情形中(如圖14中可見)臂126具有在V形凹槽120固定至容器主體20時幫助保持V形凹槽之一個三角形形狀。亦預期其他形狀。臂126與V形凹槽120之其餘部分經由射出成型或某一其他適合製造方法整體地形成。臂126具有一彈性模數,使得該臂足夠剛硬以處置施加至其之一壓縮負荷,但仍充分地撓性使得臂126准許藉由手而將V形凹槽120卡扣至適當位置中。
13 and 14 are two schematic diagrams of a
在裝配期間,由於V形凹槽120之t形槽124嚙合軌道結構125、壓縮閂鎖部件122之臂126接觸區塊結構128,從而迫使臂126沿遠離V形凹槽120之主要部分130之一方向移動。此移動致使將一負荷施加至臂126,從而致使該臂自其中無負荷被施加之一鬆弛狀態撓曲至其中一負荷被施加之一第二狀態。臂126又施加一壓縮力至區塊結構128。由於V形凹槽繼續沿著軌道結構移動,因此臂126移動超出區塊結構128且自第二狀態過渡至其中臂126施加一壓縮力至區塊結構128之一至少部分鬆弛狀態,從而允許臂126卡扣至適當位置中以將V形凹槽固定並保持至容器主體。
During assembly, since the t-shaped
參考圖1至圖18,用於固持基板之一經間隔堆疊之一設備包括與一後容器壁36間隔開之一前門框14。前門框14界定經構形以接納一門24之一門開口16。在一實施例中,一門24安置於由前門框14界定之門開口16中。一頂部容器壁30沿一向後方向Z自前門框14延伸至該後容器壁36且沿一向前方向-Z自後容器壁36延伸至前門框14。一底部容器壁32沿一向後方向Z自前門框14延伸至後容器壁36且沿一向前方向-Z自後容器壁36延伸至前門框14。
Referring to FIGS. 1 to 18, a device for holding one of the substrates stacked at intervals includes a
一右舷容器壁34沿一向上方向Y自底部容器壁32延伸至頂部容器壁30且沿一向下方向-Y自頂部容器壁30延伸至底部容器壁32。右舷容器壁34沿向後方向Z自前門框14延伸至後容器壁36且沿向前方向-Z自後容器壁36延伸至前門框14。右舷容器壁34包括一內表面78及突出超過內表面78之複數個區塊特徵86。一埠容器壁34沿向上方向Y自底部容器壁32延伸至頂部容器壁30且沿向下方向-Y自頂部容器壁30延伸至底部容器壁32。埠容器壁34沿向後方向Z自前門框14延伸至後容器壁36且沿向前方向-Z自後容器壁36延伸至前門框14。
A
設備包括一對大體相對晶圓支撐件40。每一晶圓支撐件40包括用於載運基板之複數個架52。該對晶圓支撐件40包含一埠晶圓支撐件40及一右舷晶圓支撐件40。在一實施例中,埠晶圓支撐件40及右舷晶圓支撐件40係彼此之鏡像。右舷晶圓支撐件40包括沿向後方向Z延伸遠離複數個架52之複數個托架64。每一托架64界定沿向後方向Z開口之一承窩132。
The device includes a pair of generally opposed wafer supports 40. Each
右舷容器壁34支撐複數個支柱134。每一支柱134沿向前方向-Z延伸穿過由右舷晶圓支撐件40之托架64界定之複數個承窩132中之一者以沿向上、向下、埠及右舷方向相對於右舷容器壁34約束右舷晶圓支撐件40。右舷晶圓支撐件40包括複數個閂鎖部件70,每一閂鎖部件包括固定至一懸伸臂74之一叉指82。每一叉指嚙合右舷容器壁34之一區塊特徵86以約束右舷晶圓支撐件40沿向後方向Z相對於右舷容器壁34之移動。
The
右舷容器壁34包括複數個錨狀物150部分。每一錨狀物150部分界定沿向前方向-Z開口之一通道152。右舷晶圓支撐件40包括複數個錨狀物嚙合部件。每一錨狀物嚙合部件包括皆沿向前方向-Z延伸遠離複數個架52之一第一支腿136及一第二支腿138。每一錨狀物嚙合部件亦包含在第一支
腿136與第二支腿138之間延伸之一翼樑(spar)。每一錨狀物嚙合部件之翼樑延伸穿過由右舷容器壁34之一對應錨狀物150界定之通道152以約束右舷晶圓支撐件40沿埠方向-X相對於右舷容器壁34之移動。
The
埠晶圓支撐件40包括沿向後方向Z延伸遠離複數個架52之複數個托架64。每一托架64界定沿向後方向Z開口之一承窩132。埠容器壁34支撐複數個支柱134。每一支柱134沿向前方向-Z延伸穿過由埠晶圓支撐件40之托架64界定之複數個承窩132中之一者以約束埠晶圓支撐件40沿向上、向下、埠及右舷方向相對於埠容器壁34之移動。埠晶圓支撐件40亦包括複數個閂鎖部件70。每一閂鎖部件70包括固定至一懸伸臂74之一叉指82。每一叉指82嚙合埠容器壁34之一區塊特徵86以約束埠晶圓支撐件40沿向後方向Z相對於埠容器壁34之移動。
The
埠容器壁34包括複數個錨狀物150部分。每一錨狀物150部分界定沿向前方向-Z開口之一通道152。埠晶圓支撐件40包括複數個錨狀物嚙合部件。每一錨狀物嚙合部件包括一第一支腿136及一第二支腿138。兩個支腿皆沿向前方向-Z延伸遠離複數個架52。每一錨狀物嚙合部件亦包括在第一支腿136與第二支腿138之間延伸之一翼樑140。每一錨狀物嚙合部件之翼樑140延伸穿過由埠容器壁34之一對應錨狀物150界定之通道152以約束埠晶圓支撐件40沿右舷方向X相對於埠容器壁34之移動。
The
參考圖1至圖4、圖15A、圖16及圖17B,使用標記為「Y」及「-Y」之箭頭分別圖解說明一向上方向Y及一向下或降低方向-Y。使用標記為「-Z」及「Z」之箭頭分別圖解說明一向前方向-Z及一向後方向Z。使用標記為「X」及「-X」之箭頭分別圖解說明一右舷方向S及一埠方向P。使用此等箭頭圖解說明之方向貫穿本申請案適用於設備。埠方向亦可稱為向 埠(portward)方向。在一實施例中,向上方向大體與向下方向相反。在一實施例中,向上方向及向下方向兩者大體皆與由向前方向及右舷方向界定之一平面正交。在一實施例中,向前方向大體與向後方向相反。在一實施例中,向前方向及向後方向兩者大體皆與由向上方向及右舷方向界定之一平面正交。在一實施例中,右舷方向大體與埠方向相反。在一實施例中,右舷方向及埠方向兩者大體皆與由向上方向及向前方向界定之一平面正交。各種方向指示術語在本文中用作用以論述各圖中所展示之物件之一方便方式。將瞭解,諸多方向指示術語係關於所闡述物件之即時定向。亦將瞭解,在不背離此詳細說明之精神及範疇之情況下本文中所闡述之物件可假定各種定向。因此,諸如「向上」、「向下」、「向前」、「向後」、「向埠」及「右舷」等方向指示術語不應解釋為限制隨附申請專利範圍中所述之本發明之範疇。 Referring to Figures 1 to 4, Figure 15A, Figure 16 and Figure 17B, the arrows labeled "Y" and "-Y" are used to illustrate an upward direction Y and a downward or downward direction -Y, respectively. Use the arrows marked "-Z" and "Z" to illustrate a forward direction -Z and a backward direction Z respectively. Use the arrows marked "X" and "-X" to illustrate a starboard direction S and a port direction P respectively. The directions illustrated using these arrows are applicable to the equipment throughout this application. Port direction can also be called Port (portward) direction. In one embodiment, the upward direction is substantially opposite to the downward direction. In one embodiment, both the upward direction and the downward direction are substantially orthogonal to a plane defined by the forward direction and the starboard direction. In one embodiment, the forward direction is substantially opposite to the backward direction. In one embodiment, both the forward direction and the backward direction are substantially orthogonal to a plane defined by the upward direction and the starboard direction. In one embodiment, the starboard direction is substantially opposite to the port direction. In one embodiment, both the starboard direction and the port direction are substantially orthogonal to a plane defined by the upward direction and the forward direction. Various direction indicating terms are used herein as a convenient way to discuss the objects shown in each figure. It will be understood that many direction-indicating terms relate to the instantaneous orientation of the object being described. It will also be understood that the objects described in this article can assume various orientations without departing from the spirit and scope of this detailed description. Therefore, directional terms such as "up", "down", "forward", "backward", "toward" and "starboard" should not be construed as limiting the scope of the invention described in the accompanying patent application category.
因此,雖然已闡述本發明之數個說明性實施例,但熟習此項技術者將易於瞭解,可在隨附申請專利範圍之範疇內做出且使用其他實施例。已在前述說明中陳述由此文件涵蓋之本發明之眾多優點。然而,將理解在諸多態樣中本發明僅係說明性的。可在不超出本發明之範疇之情況下在細節上、特定而言就零件之形狀、大小及配置而言做出改變。當然,本發明之範疇在其中表達隨附申請專利範圍之語言中加以界定。 Therefore, although several illustrative embodiments of the present invention have been described, those skilled in the art will easily understand that other embodiments can be made and used within the scope of the attached patent application. The numerous advantages of the invention covered by this document have been stated in the foregoing description. However, it will be understood that the present invention in many aspects is only illustrative. Changes can be made in details, specifically in terms of the shape, size, and configuration of parts, without going beyond the scope of the present invention. Of course, the scope of the present invention is defined in the language in which the scope of the accompanying patent application is expressed.
20‧‧‧容器部分/容器主體 20‧‧‧Container part/container body
55‧‧‧第二架橋接支撐件/架橋接支撐件 55‧‧‧Second bridge support / bridge support
70‧‧‧壓縮閂鎖部件/閂鎖部件 70‧‧‧Compression Latch Parts/Latch Parts
74‧‧‧臂/閂鎖臂/懸伸臂 74‧‧‧Arm/Latch Arm/Cantilever Arm
78‧‧‧內表面 78‧‧‧Inner surface
82‧‧‧指狀物/叉指 82‧‧‧Finger/Interfinger
86‧‧‧區塊特徵 86‧‧‧Block characteristics
88‧‧‧三角形剖面 88‧‧‧Triangular Section
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562212215P | 2015-08-31 | 2015-08-31 | |
US62/212,215 | 2015-08-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201719798A TW201719798A (en) | 2017-06-01 |
TWI715623B true TWI715623B (en) | 2021-01-11 |
Family
ID=58188266
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105128134A TWI715623B (en) | 2015-08-31 | 2016-08-31 | Front opening substrate container with compression latches |
Country Status (2)
Country | Link |
---|---|
TW (1) | TWI715623B (en) |
WO (1) | WO2017040707A1 (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060272975A1 (en) * | 2002-12-27 | 2006-12-07 | Miraial Co., Ltd. | Thin plate supporting container |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5269077B2 (en) * | 2008-06-23 | 2013-08-21 | 信越ポリマー株式会社 | Support and substrate storage container |
WO2012088172A2 (en) * | 2010-12-20 | 2012-06-28 | Entegris, Inc. | Front opening large substrate container |
US9312157B2 (en) * | 2011-08-12 | 2016-04-12 | Entegris, Inc. | Wafer carrier |
KR102098790B1 (en) * | 2013-06-19 | 2020-04-08 | 미라이얼 가부시키가이샤 | Substrate storing container |
-
2016
- 2016-08-31 WO PCT/US2016/049760 patent/WO2017040707A1/en active Application Filing
- 2016-08-31 TW TW105128134A patent/TWI715623B/en active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060272975A1 (en) * | 2002-12-27 | 2006-12-07 | Miraial Co., Ltd. | Thin plate supporting container |
Also Published As
Publication number | Publication date |
---|---|
WO2017040707A1 (en) | 2017-03-09 |
TW201719798A (en) | 2017-06-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4153874B2 (en) | Wafer carrier with wafer holding system | |
KR0185702B1 (en) | Wafer suspension box | |
US10217655B2 (en) | Wafer container with shock condition protection | |
TW201514073A (en) | Wafer container and method of manufacture | |
US20130299384A1 (en) | Front opening wafer container with wafer cushion | |
US9633877B2 (en) | Wafer container with door mounted shipping cushions | |
JP2010109039A (en) | Cassette for substrate | |
TW201235276A (en) | Front opening wafer container with robotic flange | |
JP2004515916A (en) | Wafer carrier with stacking adapter plate | |
TWI715623B (en) | Front opening substrate container with compression latches | |
JP6214630B2 (en) | Replaceable backstop to support the wafer | |
JP6265662B2 (en) | Substrate storage container | |
JP7336923B2 (en) | Substrate storage container | |
KR20110046035A (en) | Front retainer | |
JP2012164720A (en) | Transport box | |
US12080577B2 (en) | Substrate storage container | |
US20230197488A1 (en) | Substrate storage container | |
US20130277268A1 (en) | Front opening wafer container with door deflection minimization | |
CA2218347C (en) | Shipping and transport cassette with kinematic coupling | |
JP2023070578A (en) | Substrate housing container | |
WO2016154536A1 (en) | Wafer container with cross-slotting protection | |
KR20220093801A (en) | Stocker apparatus | |
TWI373820B (en) | A wafer container with restraint | |
JP2024038598A (en) | Substrate housing container |