CN201829472U - Accommodating container for carrying processing clamp of base plate - Google Patents
Accommodating container for carrying processing clamp of base plate Download PDFInfo
- Publication number
- CN201829472U CN201829472U CN2008901000115U CN200890100011U CN201829472U CN 201829472 U CN201829472 U CN 201829472U CN 2008901000115 U CN2008901000115 U CN 2008901000115U CN 200890100011 U CN200890100011 U CN 200890100011U CN 201829472 U CN201829472 U CN 201829472U
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- China
- Prior art keywords
- annular frame
- support chip
- vessel
- anchor clamps
- storage case
- Prior art date
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- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
- H01L21/67323—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides an accommodating casing for carrying a processing clamp of a base plate, which can inhibit the swinging of an annular framework along with the generation of contact foreign materials of support sheets and the annular framework and can reduce the part number through simplifying the composition of a container body. The accommodating casing comprises the container body (10) and a pair of support sheets (20), wherein the container body (10) is respectively provided with an opening at the front part and the back part, the pair of support sheets (20) are formed in a way facing the inner surfaces of two side walls (14) of the container body (10), the annular framework (2) is used for supporting and carrying the processing clamp of a semiconductor wafer, a plurality of pairs of support sheets (20) are ranged at intervals in the upwards and downwards directions of the container body (10), and insertion grooves (21) for the annular framework are formed through the abutment support sheets (20) and gaps of the support sheets (20). In addition, a stop element (22) interfering with the back side of the lateral part of the annular framework (2) is arranged at the back part of each support sheet (20), and inclined surfaces (23) are formed through the stop elements (22). Because the inclined surfaces (23) are gradually buried into the insertion grooves (21), the annular framework can be prevented from swinging in the upwards and downwards directions, and the damage on the annular framework can be prevented.
Description
Technical field
The present invention relates to carry the storage case that the processing anchor clamps of the various substrates that are made of semiconductor wafer etc. are used.
Background technology
When the manufacturing of semiconductor packages, semiconductor wafer carries and is being called as on the processing anchor clamps of scribing with banded framework, and this annular frame of handling anchor clamps is generally taken care of in storage case.Though show among the figure, this storage case possess the front and rear part respectively the aluminum of opening vessel and on the inner face of the two side of this vessel, be oppositely arranged and support the SUS system annular frame a pair of support chip and constitute (with reference to patent documentation 1,2).This storage case is many to support chip with being spaced of regulation along the above-below direction of vessel, and the interval of the support chip of adjacency and support chip is divided and formed the insertion groove that annular frame is used along the vertical direction.
; because aspect the relation of operator's conveyance, carrying, conveying, when conveyance, carrying, conveying, annular frame might fly out and comes off from vessel at this storage case; thereby, discuss and adopted various method for limiting in order to limit flying out of this annular frame.
As relevant method for limiting, enumerated following method etc.: (1) installs the method that compresses part at the front and rear of a pair of support chip; (2) make revolving fragment be supported on the peristome both sides of vessel respectively, by the peristome of this revolving fragment blocking container body and limit the method that flies out of annular frame; (3) possess the sliding wall of a part that forms a plurality of support chips at each sidewall of vessel in the mode that can slide, this sliding wall is slided along the vertical direction and the method for clamping annular frame.
Patent documentation 1: Japanese kokai publication hei 8-80989 communique
Patent documentation 2: Japanese Unexamined Patent Application Publication 2005-508274 communique
Summary of the invention
Because the storage case that processing anchor clamps of the prior art are used only uses aluminium to make vessel and a plurality of support chip as described above, thereby be accompanied by the sliding contact of support chip and annular frame and produce the foreign matter of conductivity, as a result, exist the pollution problems of causing semiconductor wafer and annular frame.
In addition, though the various method for limiting that the storage case that processing anchor clamps of the prior art are used has adopted the restriction annular frame to fly out from vessel, but under the situation of the method for (1), (2), though can limit flying out of annular frame, but can not prevent annular frame since the vibration when conveyance, carrying, conveying and up and down direction rock, thereby newly produced the big problem of the damage that causes semiconductor wafer and annular frame.In addition, under the situation of the method for (3), though can prevent annular frame up and down direction rock, require the slide of sliding wall, further make the formation of vessel complicated, might increase the part number.
The present invention makes in view of the above problems, its purpose is, a kind of storage case that anchor clamps are used of handling is provided, this storage case can suppress to be accompanied by the production of foreign matters that contacts of support chip and annular frame, and suppress rocking of annular frame, can make the formation of vessel simplify and reduce the part number.
In the present invention, in order to solve above-mentioned problem, possess the front and rear part vessel and a pair of support chip of opening respectively, relative and outstanding formation of the inner face of this a pair of support chip and the two side of this vessel, and the annular frame of the processing anchor clamps of support mounted board, it is characterized in that
Above-below direction along vessel is many to support chip with being spaced of regulation, the interval of the support chip of adjacency and support chip is divided and is formed the insertion groove that annular frame is used along the vertical direction, roughly rear portion the either party of support chip and insertion groove, the retainer relative with the sidepiece rear of annular frame is set, and, form the inclined plane of rocking of limiting annular frame at this retainer.
In addition, can possess either party's at least the lid of front and rear part that the opening of not busy vessel is opened in loading and unloading freely, the teat of interfering at the inner face setting and the annular frame of this lid.
In addition, can be by the two side at least and a pair of support chip of the moulding material forming containers body of the resin that contains sliding.
In addition, can the projection relative with the sidepiece of annular frame be set the either party at least in the roughly anterior and substantial middle portion of support chip, this projection formation along with towards below support chip and the inclined plane that narrows down gradually.
At this, the vessel in the scope of claim can be transparent, opaque, translucent any one.Substrate can be the semiconductor wafer of bore 200mm, 300mm, 450mm, also can be glass substrate of rectangle etc.In addition, the annular frame of handling anchor clamps can be supported by support chip under the state of mounted board, also can be supported by support chip under the independent state of mounted board not.Though this annular frame can be the annular of hollow, also can form otch or line part etc. at outer peripheral face, outer peripheral face also can be a polygon etc.Roughly the rear portion comprises rear portion that comprises rearward end and the part that is considered to the rear portion.
The roughly anterior of support chip comprises the front portion that comprises leading section and is considered to anterior part.Similarly, the substantial middle portion of support chip comprises central portion and the part that is considered to central portion.In addition, lid can be transparent, opaque, translucent any one, no matter pliability or flexible having or not.No matter the teat of this lid is single or a plurality of.And, though the storage case that processing anchor clamps of the present invention are used based on the level use, do not limit especially, for example also can the front portion that makes opening towards above the state that erects under use.
According to the present invention, has the effect of the production of foreign matters that contacts that can suppress to be accompanied by support chip and annular frame effectively.In addition, have and to suppress rocking and the formation of vessel is simplified and being reduced the effect of part number of annular frame.
In addition, if possess either party's at least the lid of front and rear part that loading and unloading open and close the opening of vessel freely, the teat of interfering at the inner face setting and the annular frame of this lid, so, by the interference of this teat, can more effectively suppress to be accommodated in rocking of annular frame in the vessel.
In addition, if, so, can suppress to be accompanied by the production of foreign matters that contacts of support chip and annular frame by the two side at least and a pair of support chip of the moulding material forming containers body of the resin that contains sliding.
In addition, if the either party at least in the roughly anterior and substantial middle portion of support chip is provided with the projection relative with the sidepiece of annular frame, this projection form be accompanied by towards below support chip and the inclined plane that narrows down gradually, so, can imbed the insertion groove that annular frame inserts by projection, thus can prevent annular frame be accompanied by the vibration etc. and rock.And, since the guide function on the inclined plane of projection the discrepancy in insertion groove brings the situation of obstacle to tail off to annular frame, thereby can expect that the damage of annular frame prevents at least.
Description of drawings
Fig. 1 is the front key diagram that pattern ground shows the execution mode of the storage case that processing anchor clamps of the present invention are used.
Fig. 2 is the plane key diagram that pattern ground shows the execution mode of the storage case that processing anchor clamps of the present invention are used.
Fig. 3 is the side illustration figure that pattern ground shows the execution mode of the storage case that processing anchor clamps of the present invention are used.
Fig. 4 is the perspective illustration of the processing anchor clamps of the pattern ground execution mode that shows the storage case that processing anchor clamps of the present invention are used.
Fig. 5 is the perspective illustration of annular frame of the hollow of the pattern ground execution mode that shows the storage case that processing anchor clamps of the present invention are used.
Fig. 6 is the key diagram of the lid of the pattern ground execution mode that shows the storage case that processing anchor clamps of the present invention are used.
Fig. 7 is the plane key diagram of the lid of the pattern ground execution mode that shows the storage case that processing anchor clamps of the present invention are used.
Fig. 8 is the side illustration figure of the lid of the pattern ground execution mode that shows the storage case that processing anchor clamps of the present invention are used.
Fig. 9 is the major part key diagram that pattern ground shows the execution mode of the storage case that processing anchor clamps of the present invention are used.
Figure 10 is the major part key diagram that pattern ground shows the 2nd execution mode of the storage case that processing anchor clamps of the present invention are used.
Figure 11 is the key diagram of the relation of the pattern ground annular frame that shows the 2nd execution mode of the storage case that processing anchor clamps of the present invention are used, support chip, insertion groove etc.
Figure 12 is the major part key diagram that pattern ground shows the 3rd execution mode of the storage case that processing anchor clamps of the present invention are used.
Symbol description
1 handles anchor clamps
2 annular frames
10 vessels
14 sidewalls
20 support chips
21 insertion grooves
22 retainers
23 inclined planes
24 projections
The 24A projection
25 inclined planes
30 lids
31 teats
W semiconductor wafer (substrate)
Embodiment
Below, with reference to accompanying drawing, the preferred implementation of the storage case that processing anchor clamps of the present invention are used is described, extremely shown in Figure 6 as Fig. 1, the storage case that processing anchor clamps in the present embodiment are used possesses: vessel 10, take in the processing anchor clamps 1 that carry semiconductor wafer W in the mode that can come in and go out; A pair of support chip 20 is oppositely arranged in the two side 14 of this vessel 10, supports the annular frame 2 of handling anchor clamps 1; And transparent lid 30, the front portion of the opening of switching vessel 10.
As shown in Figure 4, semiconductor wafer W for example is made of the silicon wafer of the bore 200mm that is cut into thin rounded flakes, optionally suitably is formed with the roughly semicircular recess of directional plane or plane that contraposition is used at circumference.
As Fig. 1, Fig. 4, shown in Figure 5, handle anchor clamps 1 and possess annular frame 2, this annular frame 2 has the hollow that can take in semiconductor wafer W, flexual adhesion layer 3 loading and unloading that cover hollow from the below stick to the back side of this annular frame 2 freely, and the semiconductor wafer W loading and unloading adhere to freely and remain on this adhesion layer 3.Annular frame 2 forms the flat board of hollow by SUS or the material that contains the regulation of resin etc., and the otch 4 of location usefulness forwardly forms general triangular respectively in both sides.
As shown in Figure 1 to Figure 3, vessel 10 possesses: the base plate 11 of rectangle has and can take in the size of handling anchor clamps 1; The top board 13 of similar shape is from the top devices spaced apart and relative with this base plate 11; And pair of sidewalls 14, vertically connect between the both sides of these base plates 11 and top board 13, vessel 10 constitutes the respectively box-shaped of the rectangle of opening of front and rear part, plays such effect: flatly arrange and take in the processing anchor clamps 1 of a plurality of lift-launch semiconductor wafer W via the conveyance automaton that does not show among the figure or carry the annular frame 2 of the processing anchor clamps 1 of semiconductor wafer W.
The base plate 11 of vessel 10, top board 13 and pair of sidewalls 14 by the moulding material injection molding of the resin that for example contains excellent in sliding property, are assembled by a plurality of securing members such as screws respectively.As the moulding material of this sliding, for example can list the Merlon (polycarbonate) that contains the PTFE particle and polyacetals (polyacetal) etc.In addition, as shown in Figure 1, inner face leading section at base plate 11, cut the recess 12 of rectangle of the discrepancy of the annular frame 2 that helps the below, between the place ahead, top of relative to each other pair of sidewalls 14 and between the rear, top, prop up the cross section with the mode axle that can rise and fall respectively and be the handle 15 (with reference to Fig. 2) that the holding operation of hat is roughly used.
As Fig. 1 and shown in Figure 9, a pair of support chip 20 is integrally formed by the above-mentioned moulding material of the resin that contains excellent in sliding property, at the two side of vessel 10 inner face, devices spaced apart and relatively outstanding formation plays the effect of the both sides of approximate horizontal ground support ring shape framework 2.This a pair of support chip 20 along the above-below direction of vessel 10 separate the interval of regulation and arrange how right, the insertion groove 21 that forms annular frame 2 usefulness is divided at the interval of the support chip 20 of adjacency and support chip 20 along the vertical direction, and each support chip 20 forms along the elongated board of the fore-and-aft direction elongation of vessel 10.
As shown in Figure 9, rear portion below each support chip 20, interfere relative with the sidepiece rear of annular frame 2 and retainer 22 that locate is integrally formed, side at this retainer 22, along with towards the support chip 20 of below and the inclined plane 23 that narrows down gradually form smoothly, this inclined plane 23 separates the gap with the posterior face of annular frame 2 and is relative.These retainers 22 and inclined plane 23 also are shaped by the above-mentioned moulding material of the resin that contains excellent in sliding property.Each insertion groove 21 forms along the fore-and-aft direction elongation of vessel 10 in the same manner with support chip 20, has the above height (width) of thickness of annular frame 2.
To shown in Figure 8, lid 30 is configured as roughly ware shape of rubber-like cross section by the moulding material of the resin that contains regulation as Fig. 6, and loading and unloading are entrenched in the front portion of the opening of vessel 10 freely.The lid 30 of this front essentially rectangular is arranged the teat 31 that is formed with a plurality of roughly wire along the above-below direction of its central portion, this teat 31 is interfered with the front portion of annular frame 2 and location and carry out clamping, in both sides, the bulge 32 of essentially rectangular is integrally formed three-dimensionally respectively, these bulge 32 pressure weldings suppress and prevent to rock in the front part sides of annular frame 2.
As Fig. 6 and shown in Figure 8, the circumference of lid 30 is bent to teat 31 and bulge 32 sides, is roughly shaped as frame, the both sides in top and the bottom, fastener 33 bulging integratedly of lid 30 usefulness forms, and these fastener 33 cards end on the anterior outer peripheral face of the opening of vessel 10.
In addition, also can form fastener 33 in the left and right sides of the circumference of lid 30, these fastener 33 cards end on the anterior outer peripheral face of the opening of vessel 10.
In above-mentioned, under the annular frame 2 that will handle anchor clamps 1 was accommodated in situation in the vessel 10, the annular frame 2 that will handle anchor clamps 1 from the place ahead by the conveyance automaton flatly inserted in the vessel 10 and gets final product.
So, annular frame 2 flatly inserts in the insertion groove 21 of vessel 10 and slides, and, by the both sides of a pair of support chip 20 from below approximate horizontal ground support ring shape framework 2, annular frame 2 be directed to retainer 22 inclined plane 23 and the contact stop, thus, annular frame 2 is located rightly and is accommodated in the vessel 10.
If will handle the annular frame 2 of anchor clamps 1 is accommodated in the vessel 10, then lid 30 loading and unloading are entrenched in the front portion of the opening of vessel 10 freely, the front portion of a plurality of teats 31 clamping annular frames 2 of this lid 30 is also limited it and is moved, thus, suppress and the vibration when preventing that annular frame 2 is accompanied by conveyance, carrying, conveying and up and down direction rock.
According to above-mentioned formation, because vessel 10 and a plurality of support chip 20 are not made of aluminum, but make by the light-duty resin of excellent in sliding property, thereby be accompanied by the sliding contact of annular frame 2 and support chip 20 and produce conductivity foreign matter situation in fact seldom.So, the contamination preventing that can seek semiconductor wafer W and annular frame 2.In addition, make by the resin of sliding, and handle under the situation that anchor clamps 1 are also made by the resin of sliding, can prevent to be accompanied by the production of foreign matters of the conductivity of sliding contact reliably at the not only two side 14 and the support chip 20 of vessel 10.In addition, when above-mentioned operation, because the rear portion of retainer 22 restriction annular frames 2, thereby prevented the offset of the annular frame 2 that inserted effectively or come off.
In addition because the remaining space of insertion groove 21 is imbedded on the inclined plane 23 of the taper of retainer 22 gradually, thereby can suppress and prevent annular frame 2 to be accompanied by vibration and up and down direction rock, do not cause the damage of semiconductor wafer W and annular frame 2.And, because without any necessity setting sliding wall as prior art etc., thereby the formation of vessel 10 is simplified, thus can seek the reduction of part number.
Then, Figure 10, Figure 11 have shown the 2nd execution mode of the present invention, in this case, central portion below each support chip 20, the outstanding integratedly projection 24 that forms, this projection 24 separates the gap with the side surface of annular frame 2 and is relative, and this projection 24 is formed the platform shape of convergent, with its both sides as along with towards the support chip 20 of below and the level and smooth inclined plane 25 that narrows down gradually.Because other parts and above-mentioned execution mode are roughly the same, thereby omit explanation.
In the present embodiment, also can expect the action effect identical with above-mentioned execution mode, and, owing to can further imbed insertion groove 21 by the outstanding of projection 24, thereby it is evident that, even omit lid 30, also can suppress significantly and prevent annular frame 2 is accompanied by vibration and up and down direction rock.In addition, because the sliding contact and not stopping in the way of inserting smoothly of the inclined plane 25 of annular frame 2 and the inclination with guide function of projection 24 does not hinder the discrepancy of annular frame 2, thereby can prevent the damage of semiconductor wafer W and annular frame 2.
Then, Figure 12 has shown the 3rd execution mode of the present invention, in this case, front portion below each support chip 20, the outstanding integratedly projection 24A that forms, this projection 24A separate the gap with the side surface of annular frame 2 and relative, this projection 24A are formed the platform shape of convergent, with its both sides as along with towards the support chip 20 of below and the level and smooth inclined plane 25 that narrows down gradually, thereby make annular frame 2 can with these inclined plane 25 sliding contacts.Because other parts and above-mentioned execution mode are roughly the same, thereby omit explanation.
In the present embodiment, also can expect the action effect identical with above-mentioned execution mode, and, owing to can imbed the remaining space of insertion groove 21 more by the outstanding of another projection 24A, thereby it is evident that, can suppress significantly and prevent annular frame 2 the operation of coming in and going out at last up and down direction rock.In addition, since annular frame 2 guided to smoothly projection 24A the inclination with guide function inclined plane 25 and slide along fore-and-aft direction, thereby can not bring obstacle to the discrepancy of annular frame 2, can expect widely that the damage of semiconductor wafer W and annular frame 2 prevents.
In addition, the storage case of processing anchor clamps 1 usefulness of the present invention is not limited to above-mentioned execution mode.For example, in the above-described embodiment, though the inner face leading section at base plate 11 cuts recess 12, but also can be formed with the recess 12 of the discrepancy that helps annular frame 2 the either party at least of end before and after the inner face of base plate 11, also can be before and after the inner face of top board 13 either party at least of end be formed with the recess 12 of the discrepancy that helps annular frame 2.
In addition, in the above-described embodiment, though the elongated board that support chip 20 is extended for the fore-and-aft direction along vessel 10, but be not limited thereto at all, if can not bring obstacle especially to taking in of annular frame 2, so, also can make support chip 20 be module extender board, also can make support chip 20 bend to the plate of J font etc. for the rear portion.
In addition, though can on each support chip 20, form retainer 22 and projection 24,24A, also can on support chip 20 arbitrarily, form retainer 22 and projection 24,24A.In addition, though the retainer 22 of interfering with the sidepiece rear of annular frame 2 is set,, so, also the retainer 22 of interfering with the sidepiece rear of annular frame 2 can be set at the rear portion of insertion groove 21 if obstacle can not brought especially at the rear portion of support chip 20.In addition, also can not make the both sides of projection 24 and projection 24A and only make the level and smooth inclined plane 25 of a sidepiece for narrowing down gradually along with support chip 20 towards the below.
In addition, also can be only in the front portion of support chip 20 the projection 24A relative with the sidepiece of annular frame 2 be set and omits the projection 24 of central portion.And, also lid 30 loading and unloading can be entrenched in freely the rear portion of the opening of vessel 10, the front and rear part that also lid 30 can be loaded and unloaded the opening that is entrenched in vessel 10 freely respectively.In addition, vessel 10 is erected and the front portion that makes opening towards the top, the annular frame 2 that manually will handle anchor clamps 1 from the top inserts these vessels 10, also can and be accommodated in the vessel 10 annular frame 2 location.
Claims (4)
1. handle the storage case that anchor clamps are used for one kind, possess the front and rear part respectively vessel and a pair of support chip of opening, the relative and outstanding formation of the inner face of this a pair of support chip and the two side of this vessel, and the annular frame of the processing anchor clamps of support mounted board, it is characterized in that
Above-below direction along vessel is many to support chip with being spaced of regulation, the interval of the support chip of adjacency and support chip is divided and is formed the insertion groove that annular frame is used along the vertical direction, roughly rear portion the either party of support chip and insertion groove, the retainer relative with the sidepiece rear of annular frame is set, and, form the inclined plane of rocking of limiting annular frame at this retainer.
2. the storage case that processing anchor clamps according to claim 1 are used is characterized in that, possesses either party's at least the lid of front and rear part that loading and unloading open and close the opening of vessel freely, the teat of interfering at the inner face setting and the annular frame of this lid.
3. the storage case that processing anchor clamps according to claim 1 and 2 are used is characterized in that, by the two side at least and a pair of support chip of the moulding material forming containers body of the resin that contains sliding.
4. the storage case of using according to claim 1,2 or 3 described processing anchor clamps, it is characterized in that, either party at least in the roughly anterior and substantial middle portion of support chip, the projection relative with the sidepiece of annular frame is set, this projection form along with towards below support chip and the inclined plane that narrows down gradually.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-207404 | 2007-08-09 | ||
| JP2007207404A JP4965380B2 (en) | 2007-08-09 | 2007-08-09 | Storage case for processing jig |
| JP2008-016022 | 2008-01-28 | ||
| JP2008016022A JP4965472B2 (en) | 2008-01-28 | 2008-01-28 | Storage container for processing jig |
| PCT/JP2008/063876 WO2009020068A1 (en) | 2007-08-09 | 2008-08-01 | Container for processing tool for mounting substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201829472U true CN201829472U (en) | 2011-05-11 |
Family
ID=40341302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008901000115U Expired - Lifetime CN201829472U (en) | 2007-08-09 | 2008-08-01 | Accommodating container for carrying processing clamp of base plate |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR101486612B1 (en) |
| CN (1) | CN201829472U (en) |
| TW (1) | TWI431716B (en) |
| WO (1) | WO2009020068A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102152894A (en) * | 2011-05-27 | 2011-08-17 | 浙江大之医药胶囊有限公司 | Storage rack convenient to place capsule die |
| CN102167189A (en) * | 2011-05-27 | 2011-08-31 | 浙江大之医药胶囊有限公司 | Storage rack for capsule moulds |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0613452A (en) * | 1992-06-25 | 1994-01-21 | Sony Corp | Carrier for semiconductor wafer and processing method thereof |
| JPH0880989A (en) * | 1994-07-11 | 1996-03-26 | Disco Abrasive Syst Ltd | Wafer cassette and method for using the same |
| JP4001671B2 (en) * | 1998-03-26 | 2007-10-31 | 宮城沖電気株式会社 | Tape peeling method, tape peeling mechanism and tape peeling device |
| JP4487278B2 (en) * | 2003-01-21 | 2010-06-23 | 株式会社ニックス | Board storage frame |
| JP4159946B2 (en) * | 2003-08-19 | 2008-10-01 | 信越ポリマー株式会社 | Substrate storage container |
| JP4338617B2 (en) * | 2004-10-20 | 2009-10-07 | 信越ポリマー株式会社 | Substrate storage container |
| JP4412235B2 (en) * | 2005-05-25 | 2010-02-10 | 信越ポリマー株式会社 | Substrate storage container |
-
2008
- 2008-08-01 WO PCT/JP2008/063876 patent/WO2009020068A1/en active Application Filing
- 2008-08-01 KR KR1020107000782A patent/KR101486612B1/en active IP Right Grant
- 2008-08-01 CN CN2008901000115U patent/CN201829472U/en not_active Expired - Lifetime
- 2008-08-06 TW TW97129850A patent/TWI431716B/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102152894A (en) * | 2011-05-27 | 2011-08-17 | 浙江大之医药胶囊有限公司 | Storage rack convenient to place capsule die |
| CN102167189A (en) * | 2011-05-27 | 2011-08-31 | 浙江大之医药胶囊有限公司 | Storage rack for capsule moulds |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20100050451A (en) | 2010-05-13 |
| TW200917413A (en) | 2009-04-16 |
| TWI431716B (en) | 2014-03-21 |
| WO2009020068A1 (en) | 2009-02-12 |
| KR101486612B1 (en) | 2015-01-26 |
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Granted publication date: 20110511 |