200811072 九、發明說明： 【發明所屬之技術領域】 本發明為一種脆性材料之切割裝置及其方法，尤指一 種利用微小凹槽以成長初始裂紋的切割方法。 【先前技術】 目前已知的脆性材料之切割方法，主要可分為三種： 鑽石研磨切割、雷射熱熔法與雷射熱破裂法（或稱為雷射 _ 熱劈裂法）。其中鑽石研磨切割法係利用鑽石砂輪進行切 割，唯所獲得的切割面之粗糙度不佳，且其切割時會產生 J 出此切屑，當實際應用在光電產業之液晶玻璃基板切割 時，就需要增加精磨與清洗等流程。而雷射熱溶法是利用 一種雷射能量高度集中的特性，將雷射光經光學鏡頭而將 光束聚焦於切割工作物上，使切割處的材料就瞬間被融 化，甚至於蒸發，藉以達到切割的效果。又此雷射熱熔法 所需的雷射功率較高，被切割材料熔融蒸發時，難免會喷 ⑩ 濺沾污切縫附近工作物表面，且其熱影響區與熱殘留應力 對液晶玻璃基板等精度要求較高之切割工作物而言，也有 過大之虞。 至於第三種雷射熱破裂法，是利用雷射光源經光學鏡 頭將光束聚焦於玻璃基板上，以產生熱場，再輔以適當的 冷卻效應，使得基板邊端產生初始裂紋（initial crack)， 再經由此熱冷場產生足夠大的應力強度因子場（stress intensity factor field，其由溫度場所產生，而溫度場 是由熱場所產生），促使裂紋成長至基板另一端，形成切割 3 200811072 結果。此雷射熱破裂法有加工速度快、熱影響區小、切割 面平整及熱殘留應力低等優點，其已逐漸取代傳統鑽石研 磨切割法，漸漸成為光電產業之液晶玻璃基板加工主流。 、 又因為此雷射熱破裂法具有切割速度快與切割面平整 等優點，且其切割過程並無切屑產生，在切割後亦無需進 行巧洗。再加上熱殘留的應力低，因此除一般脆性材料切 割加工外，也逐漸應用在光電產業液晶玻璃基板切割加 工。不過，此雷射熱破裂法的切割面之平整特性反而會在 某些切剎應用上造成限制。請參閱第一圖，因為一光電產 晶玻璃基板10或其他脆性材料進行棋盤式切割u 日^田以雷射熱破肢完成—橫方向㈣ττ；^，將再進 LT 2〇 到一第-道橫向切割裂缝2卜裂紋（即裂縫2G)即停止延 # 〇 t ^ 21 ^ ^ ^ ^ 初始裂紋”，以完成德蜻七對 > 珉後、，Λ切紂但由於雷射熱破裂法的切 副面過於平整，使得”新的初始裂紋，，不 * 士 不產生。所以，對於此棋盤式切们r，· 切割法或雷射鏡絲進行似。^、心鑽石研磨 如欲切割如第三圖所示之切割路徑有轉折工件(如 口角形，或一個心形31)’物 紋在特定位置上停止成長也不容易。所以在 初始裂紋不易產生與裂紋停止成長難μ制問月面之 制了雷射熱破肢的運用雜，確實是㈣心 又雷射熱破裂法的原理是利用1射“;，並施以 200811072 -適當的冷源，使得脆性材料10中產生足夠大的應力強度 因子場（stress intensity fact〇r fieid，Κι)，當冷熱源 產生的應力強度因子場⑹大於材料1{)最大抗破裂之應力 強度因子場㈤時，基板10的表面才會產生初始裂紋。一 旦初始裂紋產生，熱場與應力強度因子場也愈來愈大，其 間裂紋20成長將逐漸加速，如第四圖中的加速區。當雷射 聚焦光束進人準穩態區時，熱場與應力強度因子場趨於一 應定’裂紋20成長也幾乎等速，&時冷熱源產生的應力強度 因子％ (K〇略大於材料最大抗破裂之應力強度因子場 (IU) ’如圖四的成長區。在冷熱源不改變的情況下，若材 料ίο發生改變，如内含雜質、裂紋等，會打破平衡使Κι 降低’當Κ!低於Κκ時裂紋將停止成長，如爵四的回復區。 因此，要如何在雷射熱破裂法之過於平整切割面上， 獲致一種”新的初始裂紋，，可以容易產生的效果，經發明 人致力於實驗、測試及研究後，終於獲得一種脆性材料之 _切刎裝置及其方法，除了有效解決先前技術的缺點外，又 能獲致脆性材料之切割加工能夠迅速成長出初始裂紋的便 利性。亦即本發明所欲解決的課題即為如何克服脆性材料 之平整切割面無法成長初始裂紋的問題，以及如何切割路 徑有轉折之工件，又如何克服控制該裂紋之適時停止成長 是相當困難的問題等。. 【發明内容】 '本發明為一種脆性材料之切割方法，其步驟包含產生 一微小凹槽於該脆性材料上，施加一冷熱場於談脆性材料 200811072 上，以成县—列 長一㈣ϋ 施加該冷熱場㈣微小凹槽上，以成 〜 Χ、、、，以及移動該冷熱場以切割該脆性材料，梭 元成一雷射熱裂切割過程。 '叶俾 初始=者’該方法的微小凹槽係在-撕^ 初始^者’該方法的微小凹槽係在—直線方向上成長該 二-，且產生該微小凹槽與成長該裂紋係以一同 系方式進行。 ^ p . 按…、個主要技術的觀點來看，本發明即為—種吝 力方法’其步驟包含產生一不均質部 t件之一4寸定部位上，施加一第一冷熱場於該待加工件 .長了第—裂紋，以及施加該第一冷熱場於該不均 貝 ’以產生—裂缝纽之應力強度sr子場，俾完成 一切割過程。 平凡珉 工株’該方法更可以包括利用—第二冷熱場於該 工件上，以成長―第二裂紋。 可以包括在―轉折方向上成長一勒始 衣、、文且私動該弟一冷熱場以切割該待加工件。 不灼=f，T法的裂缝尖端之應力強度因子場係因該 :以降低至該待加工件之一最大抗破她 度因子^下，使得該第一裂紋得以停止成長，且該第一 冷熱場即停止施加，以獲致一截止之效果。 料之，Γ:Γ的角度來看二發明乃-種脆性材 枓之_衣置’其包括一雷射熱裂切割機，用以產生一冷 200811072 熱場，並利用該冷熱場以成長該脆性材料之一裂紋，以及 -一微小鑽石輪磨鑽頭，裝設於該雷射熱裂切割機上，以^ 作-微小凹槽於該脆性材料上，該冷熱場即於該微小凹= ^成長-初始狀，再移動該冷熱場以切割該脆性材料; 俾完成一雷射熱裂切割過程。 較佳者，該裝置的則、凹槽係為1定位之圓形凹 槽、y以利於成長該初始裂紋，且該微小凹槽具有一 01随 I之深度。 切置的雷射熱裂切割過程係咖 作广且該衣置更包括-增設之微小鑽石輪 作另一微小凹槽。 衣 . - . / t然’該.裝置的雷射熱裂切割過程係可以進行一 形或一心形之切割。 若是從另-個可實_層面來看，—種 工件之切割裝置，其包括一切難 U乃種待加 I場，並利㈣第-冷埶場以以產生—第一冷熱 紋，⑽-加工裝該待加工件之一第一裂 質部位於該待加工件之:：迹; 該不均質部位產生該第一冷熱場即於 -切割過程。 縫A之應力強度因子場，俾完成 鑽頭，且該不均質部^該加工裝置為一微小鑽石輪磨 長-初始裂紋，而移::r小凹槽，並在該微 #動該弟一冷熱場以切割該待加工件' 200811072 較佳者，該裝置的不均質部位係為一刮痕或一里物， 而該異物為一黏膠或貼紙並被黏貼於該待加工二馑 一截止效果，且該凹槽、該刮痕及該異物 雄 加工件之-應力強度因子場。用乂改安該待 較佳者，該裝置更包括利用一雷射源以加工該待加工 件而形成該不均質部位，且該不均質部位 一^ 口工 質變部位。^ ^ ^ ^ 衣、、文或一 • 當然，該裝置的冷熱場係可以具有一雷射之熱源。 當然，該裝置更可以包括一第二冷熱場，且 =熱_位於該代加X件之同—面，間時崎二割 位於ί:ΐΓ:裝置的第一冷熱場係與一第 =該代加工件之—上面及-下面，以同時進㈣切_ 較佳者，該裝置的不均質部位係為—預定位凹， •利於成長該初始裂紋。^ ^ ^ ^ 乂200811072 IX. Description of the Invention: [Technical Field] The present invention relates to a cutting device and method for a brittle material, and more particularly to a cutting method using a micro groove to grow an initial crack. [Prior Art] Currently known methods for cutting brittle materials can be mainly classified into three types: diamond grinding cutting, laser hot melting method and laser thermal breaking method (or laser _ thermal splitting method). Among them, the diamond grinding and cutting method uses the diamond grinding wheel to cut, only the roughness of the obtained cutting surface is not good, and the cutting chip will produce J chips. When it is actually used in the photoelectric glass substrate cutting, it is needed. Increase the process of fine grinding and cleaning. The laser hot-dissolving method utilizes a highly concentrated laser energy characteristic, and the laser light is focused on the cutting work object through the optical lens, so that the material at the cutting portion is instantly melted or even evaporated, thereby achieving cutting. Effect. Moreover, the laser power required for the laser hot melt method is high, and when the material to be melted is evaporated and evaporated, it is inevitable that the surface of the workpiece near the slit is spattered, and the heat affected zone and the heat residual stress are on the liquid crystal glass substrate. For cutting work with higher precision requirements, it is also too big. As for the third type of laser thermal rupture method, a laser light source is used to focus a light beam on a glass substrate through an optical lens to generate a thermal field, and an appropriate cooling effect is applied to cause an initial crack at the edge of the substrate. Then, through the hot and cold field, a stress intensity factor field (which is generated by the temperature field and the temperature field is generated by the heat place) is generated, which causes the crack to grow to the other end of the substrate to form the cut 3 200811072 result. The laser thermal cracking method has the advantages of high processing speed, small heat affected zone, flat cutting surface and low thermal residual stress, and has gradually replaced the traditional diamond grinding and cutting method, and has gradually become the mainstream of liquid crystal glass substrate processing in the photovoltaic industry. Moreover, since the laser thermal rupture method has the advantages of fast cutting speed and flattening of the cutting surface, and no cutting occurs in the cutting process, it is not necessary to perform delicate washing after cutting. In addition to the low stress of heat residue, in addition to the general cutting process of brittle materials, it is also gradually applied to the cutting of liquid crystal glass substrates in the optoelectronic industry. However, the flatness of the cutting surface of this laser thermal rupture method may limit the application of some cutting brakes. Please refer to the first figure, because a photoelectrically produced glass substrate 10 or other brittle material is used for checkerboard cutting. U Day ^ field is completed by laser thermal breakage - transverse direction (four) ττ; ^, will be further into LT 2 to a - The horizontal cutting crack 2 crack (ie, crack 2G) stops the extension # 〇t ^ 21 ^ ^ ^ ^ initial crack" to complete the German 蜻 seven pairs > 珉, Λ 纣 纣 but due to laser thermal rupture The cut side faces are too flat, making "new initial cracks, not * not produced. Therefore, it is similar to this checkerboard cutting, r cutting method or laser mirror wire. ^, Heart Diamond Grinding If you want to cut the cutting path as shown in the third figure, there is a turning part (such as a corner shape, or a heart shape 31). It is not easy to stop growing at a specific position. Therefore, in the initial crack is not easy to occur and the crack stops growing, it is difficult to use the system to make the laser hot break. It is indeed (four) the principle of the heart and the laser thermal rupture method is to use 1 shot "; 200811072 - Appropriate cold source to produce a sufficient stress intensity factor 〇 r fieid (Κι) in the brittle material 10, when the stress intensity factor field (6) generated by the cold heat source is greater than the material 1 {) maximum resistance to cracking In the stress intensity factor field (5), the initial crack will be generated on the surface of the substrate 10. Once the initial crack is generated, the thermal field and the stress intensity factor field will become larger and larger, and the growth of the crack 20 will gradually accelerate, as shown in the fourth figure. When the laser focused beam enters the quasi-steady-state region, the thermal field and the stress intensity factor field tend to be fixed. 'Crack 20 growth is also almost constant, and the stress intensity factor generated by the cold heat source is %. Slightly larger than the material's maximum resistance to cracking stress intensity factor field (IU) 'Figure 4 growth area. If the cold heat source does not change, if the material ίο changes, such as impurities, cracks, etc., will break the flat Make Κι lower 'When Κ! The crack will stop growing when it is lower than Κκ, such as the recovery zone of Jue 4. So, how to get a "new initial crack" on the overly flat surface of the laser thermal rupture method, can The easy-to-produce effect, after the inventor's commitment to experiment, test and research, finally obtained a brittle material-cutting device and method thereof, in addition to effectively solving the shortcomings of the prior art, the cutting process capable of obtaining brittle material can be quickly The convenience of growing the initial crack, that is, the problem to be solved by the present invention is how to overcome the problem that the flat cutting surface of the brittle material cannot grow the initial crack, and how to cut the workpiece with the turning path, and how to overcome the control of the crack. It is quite difficult to stop growth at the right time. [Invention] The present invention is a method for cutting a brittle material, the method comprising: generating a tiny groove on the brittle material, applying a cold heat field to the brittle material 200811072 To Cheng County - Li Changyi (4) 施加 Apply the cold and hot field (4) on the tiny grooves to form ~ Χ, ,,, And moving the hot and cold field to cut the brittle material, and the shuttle element is formed into a laser thermal cracking cutting process. 'Ye's initial = 'the tiny groove of the method is tied to - tear ^ initial ^ ' the micro groove system of the method The di-- is grown in a straight line direction, and the micro-groove is generated in the same manner as growing the crack. ^ p . According to a main technical point of view, the present invention is a method of force 'The step of generating a portion of the inhomogeneous portion t of the 4 inch portion, applying a first thermal field to the workpiece to be processed. Lengthening the first crack, and applying the first thermal field to the unevenness In order to generate a stress field sr subfield of the crack, a cutting process is completed. The ordinary planter's method may further include utilizing a second cold heat field on the workpiece to grow a second crack. It may include growing a garment in the direction of turning, and moving the hot and cold field to cut the workpiece to be processed. Non-burning = f, the stress intensity factor field of the crack tip of the T method is due to: to reduce the maximum resistance to one of the to-be-processed parts, so that the first crack can stop growing, and the first The application of the cold and hot field is stopped to obtain a cutoff effect. According to the 发明: Γ 二 二 发明 发明 发明 发明 发明 发明 发明 发明 发明 其 其 其 其 其 其 其 其 其 其 其 其 其 其 其 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' 雷 雷 雷 雷 雷a crack of one of the brittle materials, and a tiny diamond wheel grinding bit, mounted on the laser thermal cracking cutter, to make a tiny groove on the brittle material, the cold heat field is in the micro concave = ^ Growing-initial, moving the hot and cold field to cut the brittle material; 俾 completing a laser thermal cracking process. Preferably, the recess of the device is a circular groove of locating, y to facilitate the growth of the initial crack, and the microgroove has a depth of 01 with respect to I. The cut laser thermal cracking process is widely used and the garment includes an additional tiny diamond wheel for another tiny groove.衣. - . / / The device's laser thermal cracking process can be a shape or a heart-shaped cut. If it is from another level, the cutting device of the workpiece, including all the difficulties, is to add an I field, and the (four) first-cold field to produce - the first hot and cold lines, (10) - The first cracked portion of the workpiece to be processed is located at: the trace of the workpiece to be processed; the inhomogeneous portion generates the first cold heat field or the cutting process. The stress intensity factor field of the seam A, the boring bit is completed, and the inhomogeneous part ^ the processing device is a tiny diamond wheel grinding long-initial crack, and the shift:: r small groove, and in the micro# move the brother one The hot and cold field is used to cut the workpiece to be processed. [200811072 Preferably, the uneven portion of the device is a scratch or a lining, and the foreign matter is a glue or a sticker and is adhered to the cut-off of the workpiece to be processed. The effect, and the groove, the scratch, and the stress intensity factor field of the foreign object. Preferably, the apparatus further comprises: using a laser source to process the workpiece to form the inhomogeneous portion, and the inhomogeneous portion is a metamorphic portion. ^ ^ ^ ^ Clothing, text or one • Of course, the device's hot and cold field system can have a laser heat source. Of course, the device may further include a second hot and cold field, and = heat_ is located on the same side of the generation plus X pieces, and the time is between the first cold and hot field and the first = The upper and lower parts of the workpiece are simultaneously cut into four (4). Preferably, the inhomogeneous part of the device is a pre-predetermined recess, which facilitates the growth of the initial crack. ^ ^ ^ ^ 乂
當然，該裝置的預定位:凹處係可以為—圓形凹一 刮痕’且該圓形凹槽具有一 01mm之课度。 I t然，該裝置的切割過程係可以進行—祺盤式切^ 本發明經由上述構想的解說，即能看出所運^ 材料的切割裝置及其方法，果能藉一 微小凹槽以成長出初始裂紋，並 二有運用在-I折方向上成長該初始裂紋，進而完成 瓜狀之㈣的特色。為了易於說明，本發明得藉由下述之 200811072 較佳實施例及圖示而得到一更加瞭解。 【實施方式】 請參閱第三圖（a)，顯示出一種脆性材料32之切割方 法，其步驟包含產生一微小凹槽33 (詳第三圖（b)所示者） 於脆性材料32上，施加如第九圖所示之一冷熱場90於脆 性材料32上，以成長一裂紋71 (詳第七圖），施加冷熱場 90於微小凹槽33上，以成長一初始裂紋72，以及移動冷 熱場90以切割脆性材料32，俾完成一雷射熱裂切割過程。 • 又按照一個主要技術的觀點來看，本發明即為一種待 加工件32之切割方法，其步驟包含產生一不均質部位（例 如一微小凹槽33或一刮痕）於待加工件32之一特定部位 (即一個預定位之處）上，施加一第一冷熱場90於待加工 件32上，以成長一第一裂紋71，以及施加第一冷熱場90 於該不均質部位上，以產生一裂缝尖端（如第六圖中的標 號63所示者）之應力強度因子場，俾完成一切割過程。 I 當然，此時的方法更可以包括利用一第二冷熱場（圖 中未示出）於待加工件32上，以成長如第七圖所示之一第 二裂紋732。至於本切割方法實施例之不一定產生微小凹槽 33的其他細節部分，係如前段所述，故於此不再贅述。 若是從另一個可行的角度來看，本裝置其中一種實現 方式之示意圖形如第九圖所示者，本發明乃一種脆性材料 32之切割裝置，其包括一雷射熱裂切割機（圖中未示出）， 用以產生一冷熱場90，並利用冷熱場90以成長脆性材料 32之一裂紋71，以及如第九圖所示之一微小鑽石輪磨鑽頭 200811072 91 (或稱為微小鑽石研磨頭），裝設於該雷射熱裂切割機 上’以製作一微小凹槽33於脆性材料32上，冷熱場卯即 於微小凹槽33上成長-初始裂紋72，再移動冷熱場9〇以 切割脆性材料32，俾完成—雷射熱裂切#1過程。 X如第三圖（a)所示者，該雷射熱裂切割過程 三角形30之二個具有轉折方向之微小凹槽35上㈣^^^ 裂紋72，或在心、形31之多個具有轉折方向之微小凹槽別 •上成長初始裂紋72。且該裝置的微小凹槽33係為如第三圖 (b)所示的一預定位之圓形凹槽犯，以利於成長初穿 〜本專利構想利用應力強度因子場^此一特^控制裂 紋71在特定位置（如微小凹槽33)處停止成長，並於需^ 生新裂紋72處預先設置粗糙面75，以利新裂紋72產生。 該雷射熱裂切割過程係可以進行如第一圖所示之棋般式切 割1卜針對前述兩個問題，本專利提出以微小鑽石輪磨鑽 頭91在第三圖（a)所示的切割路徑3〇1之一截止、一六叉 •或-轉折處鑽一深度約01mm的截止之微小凹槽^ = 之微小凹槽39或轉折之微小凹槽33做為「預定位點」，使 裂紋71成長至預定位凹槽33時，由於預定位凹槽33存在， 造成應力強度因子場（Κι)小於材料最大抗破裂之應力強声 因子場（KIC)，以控制裂紋71成長停止。々又 此外，由微小鑽石輪磨鑽頭91所加工之粗糙表面7 一(詳第七圖）恰可作為新裂紋72產生的種子，如第I圖戶, 不，因此本發明能順利地進行交叉之微小凹槽39的一^ 方向BD切割。若搭配冷熱場9〇調整，亦可^成裂紋= 200811072 徑囀浙，達到傳統雷射熱裂切割所不能達到的效果。由於 本方法所鑽預定位凹槽33極小，不會產生如鐵石研磨切割 法般的切屑污染’所以不需增加清洗手續，且同時保有雷 射熱裂切割之平整切斷面優點。本發明可以下列幾種狀況 來討論： 一、 截止 利用微小凹槽33以獲致一截止34的效果，請參閱第 五圖，當裂紋51成長至截止之微小凹槽34時，同時停止 供應冷熱場90。由於裂紋51尖端之應力強度因子場（Κι)因 遇到預定位凹槽34 (即為-不均質部位34)而降低至一最 大抗破裂之應力強度因子場叫以下，使得裂紋51停止成 長。且冷熱場9G停止施加，以獲致—截止之效果，因此新 衣紋72不會產生，裂紋51恰成長至預定位凹槽34處。 二、 未切割交叉 . . . ' 請參閱第六圖’顯示出第一裂乡文61成長至預定位凹槽 • 62 一時，冷熱場90維持不變。此時裂紋61的一尖端（圖中 未示出其係如所示者）之應力強度因子場（Κι) 因遇到預定位凹槽62而降低至最大抗破裂之應力強度因手 场（Le)以下，使付裂紋61停止成長。但冷熱場⑽持續施 加’使付預定位槽62另-端產生新裂紋64，由於凹槽 62極小，新舊裂紋64,61會連結在-起，並隨著冷熱場90 丽進而繼續往前成長。形同裂紋61未受預定位凹槽62影 響般往前切割。 三、 已切割分交叉 11 200811072 一請參閱第七圖，第-裂紋71成長至分割裂縫732處， 因雨方已無材料，裂紋71將於裂縫處732停止。亦即第三 圖（a )中的—條直線3 7，3 8所進行之―種交叉（其預定位之 微小凹槽的標號是39 )而不轉折的情況。此時冷敎場知维 持不^則預定位凹槽33另一端將產生新裂紋72，並隨著 冷熱場9G前進而持續往前成長。形同裂紋71未受已分割 裂缝732影響般，將此間隙732越過而持續往前成長，ς 馨即本發明係_微小凹槽33賜產生而成長初始裂縫72 此订為’儘管有第二裂缝732之一極平整面74存在，仍不 致於阻斷第一裂紋71之繼續往前成長，所以不會受到第二 裂縫732之影響而停頓。 一 四、轉折 、月，閱第八圖，當裂紋W成長至微小凹槽犯時，該 方法更包括在-轉折方向TD上成長初始裂紋⑽。而產生微 小凹槽35與成長似81係可以-同步作業方式進行，彼 參此搭配以達到更精確、有效的控制。裂紋si成長至預定位 凹槽35時’冷熱場9〇依轉折.TD後的切割路徑調整杆進的 方向。此時裂紋81尖端之應力強度因子場(Κι)因遇到預定 位凹槽而降低至最大抗破裂之應力強度因子場(Klc)以下， 使得裂紋81停止成長。但由於冷熱場9〇旋轉方向後持續 加加’預定位凹槽35於新切割方向TD上將產生新裂紋砂 由於預定位凹槽35極小，新裂紋83與舊裂紋Μ會連結在 起’並隨著冷熱場90前進而往前成長。形同裂紋Μ於 預定位凹槽35處轉折TD後，依預定切割路線進行切割。 12 200811072 本發月可於原有的雷射熱裂切割機台上増加微小鑽石 :磨鑽頭91，以製作微小預定位凹槽33。可依原有雷射熱 裂切割移動方式來移動微小鑽石輪磨鑽頭9 ，進行微小預定位凹一，或另:=以 =且該衣置更可以包括一增設之微小鑽石輪磨鑽頭（圖 二：：出）’以製作另一微小凹槽33 ,則更大量生產時，也 0用夕=微小鑽石輪磨鑽頭同時進行多個預定位凹槽义加 工’以節省加工時間。 工件若是從另一個可實施的層面來看’本發明乃一種待加 以L 一t:割裝置，其包括一切割機物 工件32—m場9G’並湘第—冷熱場％以成長待加 弟裂紋71，以及一加工裝置（例如料ί旗工 輪磨鑽頭91)’裝設於該切割機上，以製作、.、 如一微小凹掸qq弋r- \ 句貝口Η立（例 七33或一刮痕）於待加工件32之一特定邱办 上’第—冷熱場9G即於該不均質部位產生—、、端= ,力強度因子場，俾完成—切割過m之應 ”係可以為-脆性材料3 2，該切割:;為—工 _ ’ It加工裝置可為—微小鑽石輪磨鑽 質部位可為—微小喊33，録微小叫以且該不均 紋72 ,而移動第一冷熱場㈨以切成長一初始裂 又該不均質部位係可以改為一道刮#式—° 中未示出），祕|物為—黏膠或料並^種異物（圖 工件32上，此時亦可《獲致如第三圖⑷於待加 效果，且㈣33、剌以料耗如㈣變/加 200811072 32之一應力強度因子埸。 定位凹處（例如圓形 & =不均質部位係可以為一預 裂紋巧。該裝置更可以包^用f)，以利於成長初始 以加工待加工件32的材料内 二射源（圖中未示出） 不均質部位即變為—侔㈣^形成該不均f部位，且該 可以具有如第九圖所示變部位。冷㈣ 然亦可利用其他熱源來製造:二 熱場（圖中未示出 >，且盘M人二！可以包括—第二冷 32之π品 共弟―冷熱場9〇均位於代加工件 32之同一面，以同時進行該切割過程。 件 當然，該裝置的第-冷熱場與一 以改成分別位於代加工件32之一上面、芬:' 亦可 同時進行切割過程。當鈇，壯 下面95，以 桩炉斗叫 田羔襞置的切割過程係可以進行一 鑽本切割裝置實施w =鑽糊其他細節部分，係如前段所述咖 * · - . 小凹本發明確能以—種嶄新的作法，藉由-微 成异? 5於該脆性材料上，即得以利用該微小凹槽以 又出初始裂紋，並且所運用之在一轉折方向上成長該 二，確能:，完成特她 社仔任紅匠思而為諸般修飾，然皆不脱如附申 祕所欲保護者。亦即不限本專利所揭示的實施例 所敎述範2其他方式產生相同功效者，皆在本專利申請 【圖式簡單說明】 200811072 .第一圖：是習知的脆性材料進行祺盤式切割之路徑的 立體不意圖，以及 第二圖（a)，(b):是利用先前的雷射熱裂切割法而依照第 一圖之切割路徑以進行切割及切割部位放大的立體示意 圖； 第三圖（a)，(b):是本發明之脆性材料的切割裝置及其方 法之較佳實施例的各式切割路徑與預定位凹槽之分佈位置 . - 及轉折區之凹槽放大的立體示意圖； m 響 第.四圖··是進行第二圖中的切割之應力強度因子場的 變化曲線之示意圖； 第五圖：是成長第三圖中的一裂紋而於預定位凹槽截 止之立體示意圖； 第六圖：是成長第三圖中的一裂紋而穿越預定位凹槽 之立體示I圖； 第七圖··是成長第三圖中的一裂紋而穿越裂缝之立體 不意圖， 第八圖··是成長第三圖中的一裂紋而轉折之立體示意 圖；以及 ; 第九圖：是進行第三圖中的預定位熱裂切割之裝置的 立體示意圖。 【主要元件符號說明】 10 ·液晶玻璃基板/脆性材料11 ·棋盤式切割 TT ·桓方向切割 LT ·縱方向切割 20 :裂缝/裂紋 21 :第一道橫向切割裂缝 200811072 30 ··三角形 301 ··切割路徑 31 ·心形 3 2 ·脆性材料/待加工件 33,35,36 :轉折（方向）之微小/圓形/預定位凹槽 34 :截止之微小凹檜/不均質部位 37,38 :直線 39 :交叉之微小凹槽 51，61，71，81 ··(第一）裂紋 TD :轉折（方向） 63 :尖端 ， 64,72,83 :初始/新裂紋 732:第二裂紋/分割裂缝/間隙 7 4 :極平整面 BD :直線方向 91 ··微小鑽石輪磨鑽頭 93 :冷源 93 ·•下面 7 5 ·粗植面 90 :(第一）冷熱場 92 :熱源 94 :上面 16Of course, the predetermined position of the device: the recess may be a circular concave-scratch' and the circular groove has a degree of 01 mm. The cutting process of the device can be carried out - the disk cutting method. According to the above description, the cutting device and the method thereof can be seen, and the material can be grown by a small groove. The initial crack, and the second use of the initial crack in the -I fold direction, and then complete the characteristics of the melon-like (four). For ease of explanation, the present invention will be better understood by the following preferred embodiments and illustrations of 200811072. [Embodiment] Referring to the third figure (a), a method of cutting a brittle material 32 is shown, the steps of which include generating a micro-groove 33 (shown in detail in FIG. 3(b)) on the brittle material 32. Applying a cold heat field 90 as shown in FIG. 9 to the brittle material 32 to grow a crack 71 (detailed in FIG. 7), applying a cold heat field 90 to the micro groove 33 to grow an initial crack 72, and moving The hot and cold field 90 is used to cut the brittle material 32, and a laser thermal cracking process is completed. • According to another main technical point of view, the present invention is a method of cutting a part to be machined 32, the step of which comprises producing an inhomogeneous part (for example, a minute groove 33 or a scratch) on the part to be processed 32. Applying a first thermal field 90 to the workpiece 32 to grow a first crack 71 and applying a first thermal field 90 to the inhomogeneous portion at a specific portion (ie, a predetermined position) A stress intensity factor field of a crack tip (as indicated by reference numeral 63 in the sixth figure) is generated, and a cutting process is completed. I of course, the method at this time may further comprise using a second cold heat field (not shown) on the workpiece 32 to grow a second crack 732 as shown in the seventh figure. As for the other details of the embodiment of the cutting method which do not necessarily produce the minute grooves 33, as described in the preceding paragraph, they will not be described again. If it is from another feasible point of view, one of the implementation forms of the device is as shown in the ninth figure, the invention is a cutting device for the brittle material 32, which comprises a laser thermal cracking cutting machine (in the figure) Not shown), used to generate a cold field 90, and utilizes the hot and cold field 90 to grow one of the cracks 71 of the brittle material 32, and one of the tiny diamond wheel bits 200811072 91 (or called a tiny diamond) as shown in the ninth figure The grinding head) is mounted on the laser thermal cracking cutter to make a tiny groove 33 on the brittle material 32, and the hot and cold field grows on the micro groove 33 - the initial crack 72, and then moves the cold field 9 〇 to cut the brittle material 32, 俾 completed - laser thermal cracking #1 process. X, as shown in the third figure (a), the two of the triangles 30 of the laser hot-cutting process have a turning groove 35 on the micro-groove 35 in the turning direction, or a plurality of turns in the heart, the shape 31 Small grooves in the direction • The initial crack 72 is grown. And the micro-groove 33 of the device is a circular groove of a predetermined position as shown in the third figure (b), so as to facilitate the growth of the initial wear--the patent concept utilizes the stress intensity factor field. The crack 71 stops growing at a specific position (e.g., the minute groove 33), and a rough surface 75 is previously provided at a new crack 72 to facilitate the generation of the new crack 72. The laser thermal cracking cutting process can perform the chess-like cutting as shown in the first figure. For the above two problems, this patent proposes cutting with the tiny diamond wheel grinding bit 91 shown in the third figure (a). One of the paths 3〇1 is cut off, a hexagonal•or-turned portion is drilled with a micro-groove 39 of a cut-off micro-cavity having a depth of about 01 mm, or a micro-groove 33 of the turn is used as a “predetermined site”. When the crack 71 grows to the pre-position groove 33, the stress intensity factor field (Κι) is smaller than the stress-strong sound factor field (KIC) of the material maximum crack resistance due to the presence of the pre-position groove 33, to control the growth and stop of the crack 71. Further, in addition, the rough surface 7 (the seventh drawing) processed by the minute diamond wheel grinding bit 91 can be used as a seed for the new crack 72, as shown in Fig. 1, no, so the present invention can smoothly cross The direction BD of the minute groove 39 is cut. If it is adjusted with the hot and cold field 9〇, it can also be cracked = 200811072 diameter 啭Zhejiang, which can not achieve the effect of traditional laser hot crack cutting. Since the pre-positioning groove 33 of the method is extremely small, there is no chip contamination as in the case of the iron grinding and cutting method, so there is no need to increase the cleaning procedure, and at the same time, the advantage of the flat cut surface of the laser thermal cracking is maintained. The present invention can be discussed in the following situations: 1. The effect of using the micro-groove 33 to obtain a cut-off 34 is cut off. Referring to the fifth figure, when the crack 51 grows to the cut-off minute groove 34, the supply of the cold and hot field is stopped at the same time. 90. Since the stress intensity factor field at the tip of the crack 51 is reduced to a maximum stress resistance factor field due to the occurrence of the predetermined groove 34 (i.e., the -inhomogeneous portion 34), the crack 51 stops growing. Moreover, the application of the hot and cold field 9G is stopped to obtain the effect of the cut-off, so that the new pattern 72 does not occur, and the crack 51 just grows to the predetermined groove 34. 2. Uncut crossover . . . 'Please refer to the sixth figure' to show that the first cracked township 61 grows to the pre-positioning groove. • At one o'clock, the hot and cold field 90 remains unchanged. At this time, the stress intensity factor field (Κι) of a tip end of the crack 61 (not shown in the figure) is reduced to the maximum stress resistance due to the pre-positioning groove 62 due to the hand field (Le In the following, the crack 61 is stopped from growing. However, the hot and cold field (10) continues to apply 'to make a new crack 64 at the other end of the predetermined position groove 62. Since the groove 62 is extremely small, the new and old cracks 64, 61 will be connected at the same time, and continue to move forward along with the hot and cold field 90 growing up. The same shape crack 61 is not cut forward by the predetermined groove 62. III. Cut and crossover 11 200811072 Please refer to the seventh figure. The first crack 71 grows to the split crack 732. Since the rain has no material, the crack 71 will stop at the crack 732. That is, the case where the straight line 3 7, 3 8 in the third figure (a) is crossed (the number of the minute groove of the predetermined position is 39) is not turned. At this time, the cold field is not maintained, and the other end of the predetermined groove 33 will generate a new crack 72, and will continue to grow as the cold and hot field 9G advances. The same crack 71 is not affected by the split crack 732, and the gap 732 is passed over and continues to grow forward, and the present invention is a small groove 33 generated and grown into an initial crack 72. This is defined as 'although there is a second One of the cracks 732 has a flat surface 74 that does not block the growth of the first crack 71, so it is not affected by the second crack 732. First, the transition, the month, read the eighth figure, when the crack W grows into a tiny groove, the method further includes growing the initial crack (10) in the - turning direction TD. The generation of the micro-grooves 35 and the growth of the 81-series can be performed in a synchronous manner, with which they are combined for more precise and effective control. The crack si grows to the pre-position. When the groove 35 is used, the cold-heat field 9 turns into a direction. The cutting path after the TD adjusts the direction in which the rod enters. At this time, the stress intensity factor field (Κι) at the tip of the crack 81 is lowered to the maximum stress-resistant factor field (Klc) of the maximum crack resistance due to the occurrence of the predetermined groove, so that the crack 81 stops growing. However, due to the continuous rotation of the hot and cold field 9〇, the 'pre-position groove 35 will generate new cracked sand in the new cutting direction TD. Since the pre-positioning groove 35 is extremely small, the new crack 83 and the old crack will be connected to each other. As the hot and cold field 90 advances, it grows forward. After the shape of the crack Μ is turned into the TD at the pre-positioning groove 35, the cutting is performed according to the predetermined cutting route. 12 200811072 This month can be used to add tiny diamonds to the original laser thermal cracking machine: grinding bit 91 to make tiny pre-positioning grooves 33. The micro-diamond wheel grinding bit 9 can be moved according to the original laser hot-cutting cutting movement mode, and the micro-predetermined position concave one, or another:=== and the clothing can further include an added micro diamond wheel grinding bit (Fig. Two:: out) 'To make another tiny groove 33, when more mass production, also use the eve = tiny diamond wheel grinding bit while performing multiple pre-positioning groove processing" to save processing time. If the workpiece is from another implementable level, the present invention is a kind of L-t: cutting device, which includes a cutting machine workpiece 32-m field 9G' and Xiangdi-hot and cold field% to grow up A crack 71, and a processing device (for example, a material roller grinding wheel 91) are mounted on the cutting machine to make, for example, a tiny concave 掸qq弋r-\ 句贝口立立 (Example 733 Or a scratch) on the specific part of the workpiece 32 to be processed, 'the first hot and cold field 9G is generated at the inhomogeneous part-, the end =, the force intensity factor field, the 俾 complete-cut the m should be" It can be a brittle material 3 2, the cutting:; for the work_' It processing device can be - the tiny diamond wheel grinding the diamond part can be - tiny shouting 33, recording the micro and the uneven pattern 72, and moving The first hot and cold field (nine) is cut to grow an initial crack and the inhomogeneous part can be changed to a scrape #式-° not shown), the secret|object is - glue or material and ^ foreign matter (Fig. 32 At this time, it is also possible to obtain the effect as shown in the third figure (4), and (4) 33, the material consumption is as high as (four) change / plus 200811072 32 Degree factor 埸. Positioning recess (for example, the circle & = inhomogeneous part can be a pre-crack. The device can also use f) to facilitate the initial growth of the material to be processed 32 Source (not shown) The inhomogeneous part becomes - 侔 (4) ^ forms the uneven part f, and the part may have the variable part as shown in the ninth figure. Cold (4) can also be manufactured by using other heat sources: The thermal field (not shown in the figure), and the disk M2; may include - the second cold 32 π product common brother - the hot and cold field 9 〇 are located on the same side of the processing member 32 to simultaneously perform the cutting process Of course, the first cold heat field of the device is changed to be placed on one of the substitute workpieces 32, respectively, and the fen: ' can also be cut simultaneously. When 鈇, strong below 95, the pile furnace is called the field lamb The cutting process of the device can be carried out by a drilling device to implement w = other details of the plaster, as described in the previous paragraph. The small concave invention can indeed be used in a new way, by - micro On the brittle material, the micro-groove is utilized to re-initial crack And the use of the growth in the direction of a turn in the second, can indeed:, complete her special social servant as a redsmith and for all kinds of modifications, but they are not detained as the defender wants to protect. That is, not limited to this patent office The disclosed embodiments of the present invention are the same as those of the other methods, and all of them are in the present patent application. [Simplified description of the drawings] 200811072. The first figure is a stereoscopic intention of the conventional brittle material for the path of the disk cutting. And the second figure (a), (b): is a perspective view of the cutting and cutting portion according to the cutting path of the first drawing by the previous laser thermal crack cutting method; the third figure (a), ( b): is a distribution position of various cutting paths and pre-positioning grooves of the preferred embodiment of the cutting device and method of the brittle material of the present invention. - and a magnified perspective view of the groove of the turning region; m ringing. Figure 4 is a schematic diagram showing the variation of the stress intensity factor field of the cutting in the second figure; Figure 5 is a three-dimensional diagram of the growth of the crack in the third figure and the cutting of the predetermined groove; : is the third picture of growth a three-dimensional I diagram of a crack passing through a predetermined groove; the seventh figure is a three-dimensional non-intention of growing a crack in the third figure and crossing the crack, and the eighth figure is one of the third in the growth chart. A three-dimensional schematic diagram of a crack and a turning; and a ninth drawing: a perspective view of a device for performing a predetermined thermal cracking cut in the third figure. [Main component symbol description] 10 · Liquid crystal glass substrate / brittle material 11 · Checkerboard cutting TT · 桓 direction cutting LT · Longitudinal cutting 20 : Crack / crack 21 : First transverse cutting crack 200811072 30 · · Triangle 301 ·· Cutting path 31 · Heart shape 3 2 · Brittle material / workpiece to be machined 33, 35, 36: minute/circular/predetermined groove 34 of the turning (direction): minute recessed/inhomogeneous parts 37, 38: Straight line 39: intersecting minute grooves 51, 61, 71, 81 · (first) crack TD: turning (direction) 63: tip, 64, 72, 83: initial/new crack 732: second crack/segment crack / Gap 7 4 : Extremely flat surface BD : Linear direction 91 · · Tiny diamond wheel grinding bit 93 : Cold source 93 ·• Below 7 5 · Rough surface 90 : (First) Cooling field 92 : Heat source 94 : Top 16