TW200809916A - Coating and developing apparatus, control method of coating and developing apparatus and recording medium - Google Patents

Abstract

The substrate transportation means in the inspection station gives priority to the delivery of the substrate between the cassette station and the processing station. The substrate is handed over to the inspection module at remaining time in the cycle time of the substrate transportation means in the processing station, the substrate can be outstripped about carrying out the substrate from the inspection module (The processing order can be carried out and the processing order carry out a previous substrate of the following substrate), and outstripping the substrate is prohibited about carrying the substrate into the inspection module.

Description

200809916 IX. Description of the invention: [Technical field to which the invention pertains] Drying is used to coat, for example, a semiconductor wafer or an LCD substrate (solution coating and development after liquid crepe processing and exposure processing) [previous technique], night, g is applied to a substrate such as a semiconductor device or an lcd substrate by coating a photoresist or a photoresist, and the coating and developing device are processed by a row-column crystal granule statl°n. Station (pr. café (10)) = box, ΐ has a transfer arm for the transfer of the "ιίίΓΐίί i"; the processing station is the wafer. A / or shirt processing, the interface station is connected to the exposure device. Check the item ΐ ΐ ΐ ΐ ^ ^ 进行 进行 进行 进行 进行 进行 进行 进行 进行The line width of the photoresist pattern, such as the line width of the photoresist pattern, and the bottom pattern of the photoresist pattern, are sent to the next process. Although such a large substrate is only clothed and "2fir is inspected, the online system using the inspection device in the LSg" is a station. This patent document 1 is recorded in the crystal box. The unloading station and the processing technology in this (5) fine-grained check-in and Wei-arm checkpoint. The money system here is to transport the substrate from the crystal box station via the inspection station 200809916, the substrate after Sif processing Temporarily return to the ®1 □匚^ of the Wafer® box loading station, and then check the substrate from the paste inspection station. Look at the example of the structure when constructing this age. Figure 9 is an overview of the ιΐί from above. Among them, the meaning of each symbol is as follows: the device is connected to the surface station. The 3 series $ station, the 14 series and the exposed wafer are in the processing station 13, and are transported in a special area, a bay, and a path. Then, Handling, and then moving from the secrets of the 14th 彳 光 光 所 所 所 所 所 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 Through the processing, then, in this case, the road in the bucket factory 5 is returned to the wafer. Box C. ^ ; 13 h Tiger to No. 13. Then start from the nickname, the knife, the flat, the serial number is a set of pre-set a series of mold turtles, k boiled (main arm), is in the module The operation of the wafer exchange inside. 'The hunting is performed by two arms, the transport arm is wound around the circulation path - the cycle of the cycle (2) the wafer taken out by the t-crystal box c) skips the i number; Comparing the operation of the wafer ") taken out of the wafer c) (that is, the reason for the earlier shipment is that this is the case - it is not practical to prohibit such an action.) Yunmei cut _ pole riding and 200809916 S ΐϊί ° and in the crystal 81, the (four) inspection is also different:::: ϊ 1 inspection, or only check the inspection module Ε 2, or only 杳 [ In the inspection of the inspection module Ε2, the inspection of the inspection module Ε2 is carried out. The inspection of the wafer is also carried out in the same way as in the case of the iron and the 盾1 shield%. Simultaneously, the wafer of the transfer module TRSa must be placed (not shown) until the main arm = 'transfer the wafer; iif can not receive the wafer In the forward mode ": two:, two: in order to use the inventor to conceive the transport arm 16 relative to = transfer Moss City, ready to transport from the station, or from the processing station "^ In the case of the second mode, the transfer speed of the transfer arm 15 _ times is, for example, 200809916 δ seconds; and the transport operation of the transport arm 16 times takes 5 seconds, for example. Processing at a rate of 150 sheets per hour, the above-mentioned production, for the ring time, must exceed 3600 seconds / 150 sheets = 24 seconds. Such an arm 15 can only be performed 3 times in one cycle. The transport action A' is transmitted for 24 seconds); or in the case of the transport arm 16, the port 8 transport operation (5 seconds x 4 = 20 seconds) in one cycle. Here, as described above, as described above, since it is necessary to transfer the wafer to the transfer 槿* • the operation of the transfer module TRSb is given the highest priority, so! , ^^: and TRSa and the hand arm 15 can carry out the transfer module TRSc and the transfer module TRSd: pass; and in one cycle, the transport arm 16 can check the check module (g$ For the 1 line, the transport operation is 2 times. The inspection modules El, E2, and E3 are used to perform the same inspection of the 狨U, and the inspection time between the individual inspection modules is also different. For example, each = check module El, When the inspection time of E2 and E3 is 30 seconds, 1 sec./second, for example, when the 11th wafer enters the inspection module 耵: = the wafer enters the inspection module E2, the ninth The wafer is inspected by the inspection module E3 at the end of the eleventh wafer _ inspection, and the ninth crystallization is checked, and the eleven wafers are taken from the inspection module by the thermal method. The reason is that if the wafer is allowed to perform the over-processing section in the inspection station, it is possible to generate, for example, in the inspection module E3, the latter batch (1〇t) is ranked first in the wafer before: The final wafer of a batch is immediately followed by the incoming condition. As a result, a process that must change the inspection module £3 (R problem, the result will result in a shipment) The stagnation of p. However, as shown in the comparative example in the implementation type, if the inspection of the wafer is finished, it will not be able to be shipped out of the inspection module, which will result in a considerable cost of inspection. The problem of a long time. [Patent Document 1] Japanese Patent Laid-Open No. 2005-175052 (paragraph (10) 42, Figure [Description of the Invention] 200809916 The invention is to be solved by the problem of the above-mentioned conventional technology. The purpose of the invention is to reduce the stagnation of the substrate in the inspection of the molding material. The invention provides a coating and developing device for improving the processing amount of the coating and developing device. The coating and developing device of the present invention are characterized in that: The box loading and unloading station 'places a crystal cassette containing a plurality of substrates, and is provided with a transfer t for transferring the substrate between the wafer and the g-box; and, the station: has: a plurality of processing modes a group, the rib pair is printed on the cloth from the sunday box, and the substrate after the photoresist is coated and exposed; and the first substrate transport device is used to process the mold; And According to a r ί 查 : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : The substrate is transferred between the stations, and the substrate is transferred to the inspection set; and the control unit is configured to control the second substrate transport device; and the function is provided in the second substrate transport I to perform the following control a) the transfer operation of the board from the crystal_box loading station to the processing station, the processing of the receiving station by the processing station is prioritized; b) the inspection is carried out from the processing serial number assigned to each substrate Module; jin starts with a small substrate in the current season, c) The substrate is inspected and shipped out of the inspection module without being limited by the size of the processing serial number assigned to each substrate. f In the specific aspect of the present invention, the coating and developing device of the present invention may be further provided with a transfer module and a transfer module of the other side, a transfer device and a second substrate. Between the money transfer, the substrate is transferred; 10 200809916 ^In the control crystal _ box loading station (10) transfer device, used to transfer the substrate processed at the processing station to the crystal with each direct use ί£=!2 :: into; take the cassette out of the substrate, and transfer it to the outside of the transfer of the square to the transfer device in the sunday box loading and unloading station, for example, 哕 - -a;: - ^ ' when the substrate is from In the case where the crystal cassette loading and unloading station is transferred to the group, for example, in the case of the cooling module, the control unit controls the second substrate transport device to follow the cycle: The transportation time taken to transport to the processing station; 3) The time remaining after the transportation time of the board is transferred, and the substrate is transferred. In this case, if it is asked from the US! The monthly condition # fruit is due to the transfer, so that the time from the wafer to the box is fixed, u = shipped to the processing module has exceeded TG, the party is about to S ==ϊ: A control coating and developing device 200809916 delivery device is provided, and the substrate is sequentially transported in the circulation path during the cycle of processing the mold and μ and winding around the circulation path, and the inspection station has: The substrate is inspected and inspected; the door is required to complete the board transport device at the f processing station, and is used in the future; the guards are different from each other; and the second base transfer and check module The substrate between the board station and the processing station is characterized by the following steps: when outputting a ready signal to inform the delivery of the processing station of Jiang's processing station; or outputting the box loading and unloading station to the station for delivery to the station When the destination is prepared for transportation, the first shipment is preferentially processed; the clothing is placed in the processing serial number assigned to each substrate, and the serial number is transferred to the inspection module; the soil is initially not distributed. Give each woven board a small scale, The step of transporting the substrate of the inspection unit from the inspection module. The memory of other inventions is characterized by the electric difficulty of applying the method of making money. In the present invention, it is useful to use a substrate with a smaller processing number assigned to the substrate. In the operation of the inspection module, the over-processing of the substrate is allowed, so that the substrate that has been processed can be reduced in waiting for the wasted lag time in the inspection module, thereby increasing the throughput. In addition, as for the substrate to be transported into the inspection module, it will not be generated in a certain inspection module because of the overtaking s. The last two crystals of the previous batch after the wafer is entered. The situation immediately followed by the entry = the problem that caused the handler to be changed. [Embodiment] First, the following is a top view of Figure 1 and a perspective view of Figure 2, sample 12 200809916 = 2 : ', No. 21 system box loading and unloading station, used to set the time 3ί)' box C is sealed, for example, with 13 pieces of shingling boards (for example, 12, E box C, switch unit 23, placed on the front side from which the sound is placed: 22:2); and f 24 is transmitted. The ribs will be replaced by the switch unit 23: the transfer arm ^^曰 is lifted and lowered, and can be freely moved in all directions of the front, rear, left and right, and == the shaft can be freely rotated In addition, the transfer arm 24 is controlled by a command from a control unit 200 to be described later. 糸 Based on the inner side of the correcting box loading and unloading station 21, the detection of the use around each frame = 4G And processing (4), connected by ribs _ phase. The surrounding E3 · two four transfer modules TRSa ~ TRSd; inspection module E1 ~ is the transport arm 4 of the substrate transport device, the transport arm 4 俜 for the name The above d / delivery. As shown in Figure 3, the transfer module job ~ curry type can most = ί == into, and check the module to, take, to also The above two, i. In this case, a more detailed description of the processing station Si will be described later. 眺知查站40 25 (2 ΐ from the f operator side from the order: 3 The scaffolding module 9 is grasped, 0 ui 5 ), and the two main arms 26A as the first substrate transporting device are arranged alternately with each other. Among them, the tethering system is to heat and cool the system. The module's multi-voice ', two / 卞 、, and 25 two main 劈 9RA hai as the transmission of the brother 1 substrate transport device. (Α Α iif described in the processing pool between the wafer w, and can be in the secret paste The arm portion 27 is configured to be freely moved by the method of the control unit 200, which will be described later, and is controlled by the position of the wafer cassette loading and unloading station 21. The scaffolding module 25 13 200809916 , inflammatory, jC) and the main arms 26A and 26B are arranged in a row in the front and rear. * The connecting portion G on the female side is formed with a transport f (not shown). = i ^ Here, inside the processing station S1, the wafer is freely moved from the --stage scaffolding group 25A to the scaffolding module 25C at the other end. Further, the main arm 26, The 26β system is placed in a space surrounded by the partition wall formed by the following device, and the package f is placed at the position of the crystal® g box (4) 21, and is arranged in the direction of the secret 25·(25Α, 25B, 25C) one side of the side; for example, the liquid processing mold on the right side, and the side on the side; and the back surface formed by the left side. The position where the substrate is transferred by the main arm 26 (26Α, 26Β) is further provided.

28 (28Α, 2δβ) ′ is used to set the coating apparatus and the liquid processing apparatus of the developing apparatus and the like. As shown in Fig. 2, the liquid processing module 2δ (2δΑ, 28Β) is formed by laminating a plurality of layers (for example, five layers) from a county device 29 such as a (4) money cloth device. Further, as for the scaffolding module 25 (25Α, 25Β, 25C), for example, as shown in FIG. 3, the following devices are assigned, for example, to the upper and lower 1G layers, including a transfer module (TRsi to TRS4) for use as a transfer unit for performing wafer transfer; a heating module (Lff1), a heating device for heating treatment after applying the photoresist or after applying the developer; and a cooling module (CPL1, CPL2, CPL3) as The cooling device is used for crystal-cooling treatment before and after the application of the photoresist and before the development process; and the heating module (PEB) is used as a heating device for heat-treating the exposed crystal. Here, the TRS1 and TRS4 are used between the wafer cassette loading and unloading station 'Μ and the processing station si; and the transfer modules TRS2 and TRS3 are used to respectively perform between the two 26A and 26B. Use for wafer transfer operations. In this example, the heating module (LHP1, LHP2), the cooling module (cpu, cm, CPL3), and the heating module (peb) correspond to the processing module. In such a processing station S1, the inner distal end side of the scaffolding module 25C is connected to the exposure device S4 via the first dielectric surface S2 and the second dielectric surface S3. The first first face S2 includes a transfer arm 31, a scaffold arranged in a plurality of layers, a thinner 32A, and a scaffolding module 32B arranged in a plurality of layers. Among them, the transfer arm, μ 14 200809916 is freely ascending and descending, and can be freely rotated around the vertical axis.

32B, package] includes: wafer transfer module and high-precision temperature adjustment module. , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Transfer module or high-precision temperature adjustment module, exposure device % 'to perform the next wafer: Describe the movement of the main arms 26Α, 26Β inside the processing station si. As shown in Fig. 4, the two main arms 2Μ, 26Β is transported from the crystal cassette loading and unloading station 21 to the first dielectric surface S2 by the path of TRS1-CPL1-coating device (COT)-TRS2-LHP1-QPL2; then, the peb-CPL3-developing device (dev)—L|IP2—TRS3—The path of TRS4 transports the wafer from the second interface S2 to the wafer cassette unloading station 21. In addition, 'between the processing station si and the first dielectric level%, Cpl2 and PEB transfer wafers.

As shown in FIG. 4, in this embodiment at this time, the individual diameters of the main arms 2^, 266 are indicated by broken lines, and the main arm 26A is, for example, TRS1 - CPL1 - C0T - TRS2 - TRS3 - The cyclic path of TRS4-TRS1, which transports the wafer cyclically; and the main arm 26B is TRS2-LHP1-CPL2-PEB-CPL3-DEV-LHP2-TRS3-TRS2

The path transports the wafer. Therefore, an example of the arrangement of the scaffolding modules 25A to 25C is shown in Fig. 3 . In this example, TRS1 and TRS4 are disposed in the scaffolding module 25A; TRS2 and TRS3 are disposed in the scaffolding module 25B; CPL2 and PEB are disposed in the scaffolding module 25C; and the CPL1 is disposed in the scaffolding module 25A. Or the scaffolding module 25B; the LHP1 and the LHP2 are disposed in the scaffolding module 25B or the scaffolding module 25C. Further, the main arms 26A and 26B each have two arm bodies for taking out the wafer W placed on the processing module as a transfer target, and then transferring the held one wafer W to the module. . Then, the main arms 26A, 26B 15 200809916 === = strokes (the order in which the modules of the wafer w are transported) are shifted one by one to the next module by ===曰曰. At this time, in the transport path I, when the lamp is transported in the order of aging, the wafer W is not entered, and the wafer w having a larger serial number does not enter the heating mode earlier than the wafer W of the ^=. group. The human 曰曰WW is smaller than the sequel. The rest of the substrate is treated when the S1 female board is treated. First, ;::ϊι 2r fa, group TRSa. As shown in FIG. 3 and FIG. 4, by the check station 4〇 = to the transfer module TRS1. Next, the main arm 26A then sends the photoresist coated wafer to the i-th via the main arm 26A, the hall, and the path CPn; C〇T.TRS2^LHP^CPL2 0 as before. Introduce facial makeup. In S2, in the S2, the wafer w is transported in the order of the internal slow-up i-peripheral exposure device-high-precision temperature adjustment module by the transfer arm μ, and transmitted through the scaffolding module 32B. The module is transported to the second face S3. After the absence, the wafer W of the second surface portion S3 is transported to the exposure device S4 via the internal platform of the exposure & The exposed wafer is transported to the processing station si via the second dielectric surface S3 to the first dielectric surface S2 via the PEB of the processing station S1. As described above, it is transported via the path of pEB-cfL3^>DEV4LHP2-TRS3-TRS4. According to this flow, a predetermined development process is performed on the developing device to form a predetermined photoresist pattern. This day's main arm 26A transports the wafer n of the nth batch number to the CPL1 of the next program via TRS1. Then, according to the path of C0T-TRS2-TRS3-TRS4-TRS^, a cycle is performed, then return to TRS1, and then the next wafer, that is, the n+1th wafer Wn+Ι, is transported via TRS1 to CPL1. Further, the main arm 26B transports the wafer of the TRS 2 to the LHP 1 of the next program. Then, according to CPL2 16 200809916: Qing - (10) - view - TRS3 - TRS2, go back to TRS2, and then transfer the next wafer to Cong. As described in the prior art project, in order to process (10) the target of the wafer w by the device, a cycle m, Γ 4〇° TRSa^ = load *aaHC is taken out, and the miscellaneous is sent to the processing station. The _ handing module TRSb is used to carry back the UW 3 W from the processing station S1. In addition, in this example, the transfer module grade is used to process the processed wafer w; and the crystals are right white: w E l receives the wafer W that has been processed, and then until ^ Send = 4 has been checked in the k, and El (E2, E3) completed the inspection of the wafer w of the 3 transfer module TRSa ~ TRSd and inspection modules E1, E2, E3 " = S shows but for the convenience of explanation For example, the transport arm 4 is arranged in a plane in FIG. 4 and has the following features: The transfer of the wafer w between the green unloading station 21 and the processing station S1 is performed, and the cycle time as described above is 24 seconds, false & owe: send seconds if ' '一=二= group, to the difficult transport of the two excellent, can carry out 2-L iron Γ I I ί (that is, 1 cycle time ) Only between (10) and E3)! : The delivery module TRSc, TRSd and the inspection module E1. For example, π may be performed twice in each cycle to take out the crystal 11 w on the transfer leg by the transport arm, in which case the / 疒 / Λ々 wafer W is transported from the transfer module TRSa To TRS1. After TRS1 is obtained; 4, t=after the ring time, the main arm 26A will go to the transmission module to pay the crystal 51 W after the ". Then, for this, the wafer-free W-loading is transmitted, and the arm f is transferred to the TRS1. ..., the person 17 can transfer the substrate as it is, and it will become secondary in one cycle. Off = ’

In addition, she is in the following manner: a) Starting in the process sequence assigned to the wafer w, it is carried into the inspection module E1 (E2, Eb3). &Sequential Small Wafer W Inspection b) Regardless of the processing number assigned to the wafer w, the wafer W to be inspected is transported out from the c) module El (E2, E3). Therefore, although it will be selected from the 1st to the 3rd

*«M TRSc E1 (E; ; l], ,,^'2 J;^J (2) 22:=4; Γ 完成 completed 2 = _. 门木成日守, this time will first cross 9铐s Pi W ^ , 唬 wafer f is shipped from inspection module E1 (E2, E3). 9唬 曰曰SlWi^n its-person, describes the inspection module. In this example 2 wafers The macro macro (macr〇) defect on W is used to detect the film thickness and _' width of the inspection module formed on the crystal HW. · The inspection module E3 is used to detect the exposure weight. Thickness • Line width: The positional deviation between the pattern of this and the pattern of the substrate is ^^^, and this is assumed in each inspection module 耵, E2, E3. It is 3G seconds, (10) seconds, and 14Q seconds. -^=费=时间' 18 200809916 Into the serial number is relatively large (later) day yen w order; ratio) wafer W check] ίί finished The transfer arm 24 of the 1st and 5th loading and unloading station 21 also has the following functions: TRSa. ) 攸阳0 IC receives the crystal 81 W before processing, and passes it to the transfer module c: ' , , ☆ yen Y, and returns to the wafer 匣 ί 完成 completed wafer w from the wafer 11 box c. Give the transfer module TRSC. Further, when the wafer w is transferred from the transfer module TRSd to the cassette c°, the transfer operation of 1 m can be performed, for example, in the case of 8 seconds, and only the item of c) or d) can be performed. ί ί of arm 4: i!=r 20°. Including the transfer arm 24 and the transporting module 2 about the transfer module, when the edge of the module is placed: when the control unit is output, the ready signal of the module . Further, the control unit 200 rotates the signal r that is rotated when the wafer w is placed on the job: ΐίϊ', the two output signals, if the arm 24 and the transport 3 The signal that is ready to be completed. So pass ^ to that she. Based on this judgment and the previous rules, the shipping action is obtained

Shown in the implementation type on the side of the inspection series. Figure 5 shows the number 2, the daily pass =, the coffee, and the serial number of each check module J 曰曰 51. That is to say, the crystal box c _ off w will root 19 40 ‘ 200809916 =; = fruit: in (four) in the future ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί If the number is processed, it is in the first! In the ring of Judah, the serial number of 曰5 and r is used as the order of the yucca, and the one of ^ does not enter the side of each transmission module, > is because of the above, this is '1' Times. In the third cycle, the TRSe wafer "" ♦ m ^ is placed on the wafer "2" by the transfer arm 24 in the clothing. In the middle of the TRSc, "9 yiyiyiyi, J::E1, because the inspection of the wafer is not finished, so it is maintained; in the thin loop, the transport arm 4 transports the wafer "3" to the inspection mold, And E3, - people will have completed inspection in inspection module E1, and transfer arm 24 passes the next wafer "4" to TRSUc. Hey, privately. The way 'to make the loop constantly. At the end of the 27th cycle, the serial number is 2, 隹I: 2"/ and wafer 1", and the inspection is performed in the inspection module E3 and the inspection module E2 = the wafer after the serial number is " U", the processing at the end of the inspection has been slowed down. Therefore, in this case, the wafer "9", which is not waiting for the front, is transported from the inspection module to the wafer "n" after the inspection: 曰:丨曰The round 12" is transferred from the TRSc to the inspection module Ei, while the crystal 0 1 13" is placed in the TRSc. ^ The system is not in the 27th cycle, the output of the ready signal and the transport path I, so that the control action of the transport arm 4 is more clear. First, = 20 200809916 Check the end of the signal (as the Yunling preparation completed the delivery of the delivery, to show that the shipment from TRSc is here, and then the output ready to be shipped to TRS1 ready to be ready signal It is a ready signal for the squatting of the squid, and the delivery of the wafer "n" to the processing station S1 is better than the delivery of the processing station S1. It will be given priority. After the fall, 曰i "12a will be transported from TRSc to inspection module E1. ..., Junhao will be day-to-day® 12" On the other hand, Figure β shows another type of bear. The inspection of 11" has been reduced, and the eyes of the next day _ 31 Wei Shi, until the 39th cycle, a good ^7 / hour, 疋: f in the inspection "check the model is waiting for each r broken, &" stone λα / 不 守 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 61 read ring. Small = upper 3 lean ί type 'because it can be assigned, the wafer processing number is better than 3) ^ ', also ί ί larger wafer 'making it earlier from the inspection module El (Ε2, out 'Because the wafer overrun procedure is allowed. Therefore, ^= Wafer is in the inspection mode (4) (E2, E3) = Several processes have been processed 詈Γ 1)) 4 The heat to be consumed Time. Therefore, you can mention (Ε^, Ε3), #赫^文日率^. Then, because the wafer is transported into the inspection module E1 wafer immediately after the incoming wafer is entered, the last _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ In addition, the path of the i-S can be used as a module for transmitting both the heat and the substrate in the transfer module of the μ-transfer module, so that Τ ί^, which can be used as a transfer. Module TRS1. In this case, one of the times such as 21 200809916 r =: 3⁄4

El (E2.E3), ΐ ; 2^ΤΜ Point, beyond the end of the cycle time, when the end of the rushing 1 is the time, you must sue the second 忐 忐 忐 忐 、 , , ! From the end of the cycle time, the wafer W transfer module Μ (E2, E3) is performed in the (10) two-two-time cycle, when the cycle circle "11" is shipped out, from this t_check mode, _ crystal If the transport operation time, that is, the time of 5 seconds, exceeds whether the transport arm 4 doubles the wafer W from the inspection module E1, the transport is not performed. ϋ She, group TRSd, if less than twice the previous wafer from the transfer mode & (for example, ^^^ by the main arm 26A to carry out the subsequent yen "[Changjie 杈 group" TRS1, immediately after荽ί :ί : ® ;SJ ί ΐπ TRSa TRS^ ^ ^ Also, in this ^""_ is transported to the transfer module TRSd. The processing station selects the Λ81 to check. In addition, it is not necessary to accept the face The crystal of the cartridge c is inspected', but for the wafers EHE2 > El) of the externally placed portion 22 of the rotating device, ΙΙΤ〇24 4 ? 22 200809916 [Simplified illustration] Fig. 1 is a plan view showing an embodiment of the coating and developing apparatus of the present invention. Fig. 2 is a perspective view showing the appearance of the coating and developing apparatus. σ Fig. 3 is a side view showing a schematic arrangement of a coating and developing apparatus. Fig. 4 is an explanatory view showing the flow of the substrate of the coating and developing device. Fig. 5/ is a schematic explanatory view showing the operation of the substrate in the inspection station in the present invention. Xiao (four), the inspection of the oily state, the replacement plan of the oily transportation plan. An illustration of the interaction between the inspection module and the transmission signal and the dynamics of the substrate in the cycle of the plan. The inspection module and the signal and the substrate are displayed in the side ring of the transport. (4) A plan view of the processing flow of the substrate in the coating and developing device of the known device [Description of the main components] 4~Transporting arm 4Α~ Coating device 11~ Wafer cassette moving station 12~Check Station 13 to processing station 14 to interface station 15 to transfer arm 16 to transport arm 21 to wafer cassette loading and unloading station 22 to placing unit 23 to switch unit Μ to transfer arm 23 200809916 25A ~ scaffolding module 25B ~ shed Rack module 25C to scaffolding module 26A to main arm 26B to main arm 27 to arm 28A to liquid processing module 28B to liquid processing module 29 to processing container 31 to transfer arm 32A to scaffolding module 32B Scaffolding module 33 to transfer arm 40 to inspection station 200 to control unit C to wafer cassette C0T to coating device CPL1 to cooling module CPL2 to cooling module CPL3 to cooling module DEV to developing device E1 to inspection mode Group E2~Check Module E3~Check Module G~Connect Part LHP1~heating module LHP2~heating module PEB~heating module S1~processing station 200809916 S2~1st face S3~2nd face S4~exposure device TO~End of cycle time point TRS1~transfer module TRS2~ Transfer module TRS3~transfer module TRS4~transfer module TRSa~transfer module TRSb~transfer module TRSc~transfer module TRSd~transfer module W~wafer

Wn~nth wafer

25

Claims (1)

200809916 X. The scope of application for patents·· 1. 曰. The coating and developing device is characterized in that it includes a Japanese yen box loading and unloading station, and a plurality of spares are placed in the loading and unloading, and the _ is in the middle of the box. The processing module for the number of turns is used to take out the cloth from the wafer cassette and the substrate after the photoresist is coated and exposed. The inspection station has a plurality of inspection modules. The time required for the substrate to be processed and the inspection are different from each other; and the transfer of the substrate between the second substrate transport/transformation cassette and the processing station, and the transfer of the substrate by the fish inspection group; and/or a dual control unit for controlling the second substrate transport device; wherein the control unit includes a) that controls the substrate from the wafer cassette loading and unloading station to the processing station. The operation of receiving the substrate from the processing station is prioritized; starting from the substrate having the smaller serial number of the processing number of each substrate, transferring the / into the inspection right group, and C) not receiving the processing number assigned to each substrate The size of the substrate is removed from the inspection module . The nuclear fish raft 2. The coating and developing device of the first application of the patent scope, and the transfer device and the second substrate transport device in the wafer cassette loading and unloading station are provided. The transfer module of one side and the transfer module of the other side; wherein, the second part is used to control the transfer device in the wafer cassette loading and unloading station, so that the processed substrate is transferred to the wafer cassette. The substrate is taken out from the wafer cassette and fed to the transfer module of the other side, and the finished substrate is transferred from the transfer module to the wafer cassette. ' 26 200809916 3 'The submerged b part of the second application of the patent application scope is used to control the transfer device to take out the control device in the control device, and transfer it to the transfer module of the party. The substrate is coated from the wafer 匣. ί. ί 申请 范围 申请 第 第 第 第 第 申请 申请 第 第 壮 壮 壮 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制 控制The incoming wafer® is taken from the inspection module by the coating. The substrate is taken out and transferred to the one side. 5. According to the second to fourth aspects of the patent application, the transfer of the crystal cassette loading and unloading shaft, the coating and developing device, the transfer device of the one side or the transfer device of the other side , the transfer of the board within the _ ring time. And one of the x sets, only one time base 6. As in the scope of the patent application, the coating and developing device of the official item, the substrate from the wafer cassette loading and unloading station, and the processing mode of the double-twisting to the processing station The ; 由 乐 乐 2 substrate transport device is transmitted and the control unit controls the second substrate, and the board is transported from the wafer cassette loading and unloading station ==3⁄4 time to check the module for the substrate transfer operation Among the remaining time, the control method of the "earth soil cloth" Erying device is included, and the coating and developing device is provided with a crystal im box for transferring a plurality of substrates, and has a Lubo & The substrate is transferred between the cassettes; the base i is used for photoprocessing = for the extraction of the crystal from the crystal box, the main cloth, the head shadow' or the front and rear processing; and the first beauty, silkworm U clothing, for these processing modules to follow the political floor k and around the circulation road and January sacred two squatting / σ 者 衣 衣 path to transport the substrate, the two-week shield time has been determined in advance;理之行;;:间27 200809916 board transport device 'used at the foundry box loading station* And the substrate is transferred to the inspection module;" s performing the coating of the substrate, the control method of the developing device ^ when the output-ready signal informs the substrate from the crystal step: when the transportation station is ready for transportation, or is turned out - ready The g substrate private device that is transported everywhere (4) the transport quality of the substrate = the step of assigning the serial number to the substrate to the inspection module; the use of the cat to transport it to the processing serial number assigned to the substrate The steps of the board from the inspection module. _ will be the final basis of the application of the coating and development device of the seventh paragraph of the patent range, the transmission of the = 曰曰 0 £ reading and unloading shaft and the transmission of the second neon transport device , the method of transmitting the module and the transfer module of the other side; Ding ^ 'The control method of the coating and developing device further comprises the following steps: The processing station of the sputum is transferred to the substrate of the secret device Steps of the crystal cassette 'Step ι 取 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从 从The step of transferring the inspected substrate from the other transfer module to the wafer S-box by the transfer device. 9. The method for controlling a coating and developing device according to the eighth aspect of the invention, wherein the substrate transferred to the one of the transfer modules is brought in from the outside of the coating and developing device for inspection. The substrate taken out of the wafer cassette. 10. The method of controlling a coating and developing device according to the eighth aspect of the invention, wherein the substrate transferred to the one of the transfer modules is a substrate processed by the processing station. The method for controlling a coating and developing device according to any one of claims 8 to 1, wherein the transfer device in the wafer cassette loading and unloading station is transmitted in the following 28 200809916 ===3⁄4 The other party's method of controlling her money, 12. The method of controlling the patent scope, paragraphs 7 to 1 , where the main cloth, the development, and the substrate are transported from the wafer cassette loading and unloading station. , the process of transferring the dream to the processing module of the processing station, and the step of transferring the substrate to the inspection module by the 3 music Z substrate transport device, the board is transported from the wafer loading and unloading station to the processing station The remaining space after the time of the substrate transport: Into the ^ 13. - Kind of record body, storage money = towel _ ^ ordered. For the coating of the photoresist and the exposure level of the fine cloth, and the program, which is in the computer application of the paste coating and developing device, the application of the patent range 8 to 1 mussels The coating method of the item and the control method of the developing device. XI. Schema: 29