TW200809020A - Epitaxial substrate and liquid-phase-epitaxial growth method - Google Patents

Epitaxial substrate and liquid-phase-epitaxial growth method Download PDF

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TW200809020A
TW200809020A TW96128744A TW96128744A TW200809020A TW 200809020 A TW200809020 A TW 200809020A TW 96128744 A TW96128744 A TW 96128744A TW 96128744 A TW96128744 A TW 96128744A TW 200809020 A TW200809020 A TW 200809020A
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substrate
layer
epitaxial
carbon
concentration
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TW96128744A
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Chinese (zh)
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TWI405880B (en
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Susumu Higuchi
Makoto Kawasaki
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Shinetsu Handotai Kk
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  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Chemical & Material Sciences (AREA)
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  • Crystals, And After-Treatments Of Crystals (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

To provide an epitaxial substrate having an adjusted optional concentration profile of carbon other than the fixed concentration profile of carbon by the auto-dope from a jig, and to provide a liquid-phase-epitaxial growth method. In an epitaxial substrate in which an epitaxial layer is integrated on a substrate by liquid-phase-epitaxial growth method, the epitaxial substrate is one that has a concentration profile of carbon in the epitaxial layer integrated on the substrate which crosses the concentration profile of carbon having a ± 50% carbon concentration from the carbon concentration supplied from the carbon jig for holding a solvent.

Description

200809020 九、發明說明: 【發明所屬之技術領域】200809020 IX. Description of the invention: [Technical field to which the invention belongs]

/本發明疋有關藉由液相磊晶成長方法使磊晶層積層而 得〗的猫日日基板及液相磊晶成長方法,特別是有關在要積 層的蠢晶層中掺C(碳)之蠢晶基板及液相i晶成長方 法0 術 技 前 先 般來說’為了要在單結晶晶圓上進行磊晶成長,有 氣相磊晶、液相磊晶、分子線磊晶等的方法。其中,作為 氣作化合物半導體的磊晶基板之方法,液相磊晶法廣泛地 被利用。 液相磊晶法,例如有逐漸地降低飽和溶劑的溫度而使 磊晶在晶圓上成長的方法(漸冷法)、使晶圓與溶劑之間有 溫度差而使磊晶在晶圓上成長的方法(溫度差法)❶這些液 相磊晶法,一般來說,其製作出來的磊晶層的差排 (diSl〇cation)或點缺陷密度等,比其他方法低,特別對於間 接遷移結晶的磊晶是有利的,已經開始被使用於例如Gap 的LED用蠢晶基板的製作等方面。 又,要製作AlGaAs磊晶晶板的情況,是使A1與QaAs 溶解在作為溶劑的Ga中,若使其在GaAs基板上析出,則 能以比較簡便的方式,形成三元系的混晶結晶的磊晶。 此種液相磊晶法,需要用以保持溶劑的容器(治具), 一般來說,是使用價格比較便宜且施工容易的石墨製成的 200809020 冶具或是石英玻璃製成的治具。然而,以此溶劑所使用的 Ga為代表的金屬,這些治具的成分會溶入,於是在磊晶成 長中’治具的成分會被自動摻雜在磊晶層中。 以往的液相磊晶成長方法,例如將碳摻雜在磊晶層中 而使羞晶成長時,是利用上述自動摻雜,從碳製成的治具 將破供給至磊晶層中。碳是化合物半導體中的P型不純 物’作為p型摻雜劑的性質,已知比其他的P型摻雜劑良 好(參照日本特許第1 63985號公報)。 在此’首先在第7圖中,表示出以往的一般的]s[(氮) 換雜的LED用GaP磊晶基板的構造與不純物濃度分布圖。 此以往的LED用磊晶基板Γ ,是在基板2,上,積 層依序由η型層4, 、ρ型層5,和Ρ型層0,所構成的磊 晶層3’ 。通常,在η型層4, 、5,,由於不需要將成為 Ρ型摻雜劑的碳,所以使用石英等的治具來進行磊晶成 長,使得不會由於自動摻雜而對磊晶層供給不必要的碳。 没有從治具自動摻雜碳的情況,在磊晶層中的唆濃度,沒 有到達5xl015at〇ms/cm3。作為ρ型不純物,例如可使用Ζη。 另方面,如上述,磊晶基板有導入作為ρ型摻雜劑 的性質比較優異的碳的情況,是使用石磨等的碳製成的治 具來進行磊晶成長,使得可以藉由自動摻雜來供給碳,例 如能夠製造出第8圖(a)所示構造的磊晶基板1,,。此磊晶 基板1 ” ,從基板2”侧,積層依序由n型層4” 、ρ型層 5 ”和ρ型層6 ’’所構成的磊晶層3,,。 然而,使用此種碳製成的治具,在藉由自動摻雜一邊 6/The present invention relates to a cat day substrate and a liquid phase epitaxial growth method for depositing an epitaxial layer by a liquid crystal epitaxial growth method, in particular, a method of doping C (carbon) in a stray layer to be laminated The stupid crystal substrate and the liquid crystal i crystal growth method 0 Before the technique, in order to perform epitaxial growth on a single crystal wafer, there are methods such as vapor phase epitaxy, liquid phase epitaxy, and molecular line epitaxy. . Among them, liquid phase epitaxy is widely used as a method of epitaxial substrate of a gas compound semiconductor. Liquid phase epitaxy, for example, a method of gradually lowering the temperature of a saturated solvent to cause epitaxial growth on a wafer (gradual cooling method), causing a temperature difference between the wafer and the solvent to cause epitaxy on the wafer Growth method (temperature difference method) ❶ These liquid phase epitaxy methods, in general, the difference between the produced epitaxial layer (diSl〇cation) or point defect density, etc., is lower than other methods, especially for indirect migration. Crystalline epitaxy is advantageous, and has been used in the production of a stray substrate for LEDs such as Gap. Further, in the case of producing an AlGaAs epitaxial crystal plate, A1 and QaAs are dissolved in Ga as a solvent, and when deposited on a GaAs substrate, a ternary mixed crystal can be formed in a relatively simple manner. Epitaxial. Such a liquid phase epitaxy method requires a container (fixture) for holding a solvent, and is generally a tool made of 200809020 or quartz glass made of graphite which is relatively inexpensive and easy to construct. However, as the metal represented by Ga used in the solvent, the components of these jigs are dissolved, and thus the components of the jig are automatically doped in the epitaxial layer during epitaxial growth. In the conventional liquid phase epitaxial growth method, for example, when carbon is doped in an epitaxial layer to grow a crystal, the jig made of carbon is supplied to the epitaxial layer by the above-described automatic doping. Carbon is a property of a P-type impurity in a compound semiconductor as a p-type dopant, and is known to be better than other P-type dopants (refer to Japanese Patent No. 1 63985). Here, first, in the seventh diagram, the structure of the conventional general s [(nitrogen)-doped GaP epitaxial substrate and the impurity concentration distribution map are shown. The conventional epitaxial substrate for LEDs is an epitaxial layer 3' composed of an n-type layer 4, a p-type layer 5, and a Ρ-type layer 0 on the substrate 2 in this order. In general, in the n-type layers 4, 5, since carbon which is a erbium-type dopant is not required, epitaxial growth is performed using a jig such as quartz so that the epitaxial layer is not formed by automatic doping. Supply unnecessary carbon. Without the automatic doping of carbon from the fixture, the concentration of germanium in the epitaxial layer did not reach 5xl015at〇ms/cm3. As the p-type impurity, for example, Ζη can be used. On the other hand, as described above, in the case where the epitaxial substrate has a carbon having a relatively excellent property as a p-type dopant, the epitaxial growth is performed using a jig made of carbon such as stone mill, so that the epitaxial growth can be performed by automatic doping. For example, the epitaxial substrate 1 having the structure shown in Fig. 8(a) can be produced by supplying carbon. The epitaxial substrate 1", from the side of the substrate 2", is sequentially laminated with an epitaxial layer 3 composed of an n-type layer 4", a p-type layer 5" and a p-type layer 6''. However, the jig made of such carbon is doped by auto doping 6

200809020 供給碳一邊使磊晶層3 ”液相磊晶成長 (b)所示,磊晶層中的碳濃度,只會成為 低的輪廓,濃度輪廓會被固定,不但不 濃度,由於其他不純物(例如成為η型孝 輪靡,而會發生例如在ρ型層中會出現 料以外的閘流體(thyristor)構造等的問| 【發明内容】 本發明是鑑於如此的問題點而開發 提供一種磊晶基板及液相磊晶成長方法 被調整後的任意的碳濃度輪廓,而不是 摻雜所產生的固定的碳濃度輪廓。 為了達成上述目的,本發明提供一 由液相蠢晶成長方法在基板上積層蠢 板,其特徵為: 積層在上述基板上的磊晶層令的碳 由用以保持溶劑之碳製成的治具供給而 的》辰度輪廊交叉。 如此,藉由本發明所提供而得到的 層中的碳濃度輪廓,與基於由用以保持 具供給而得到的碳濃度±5〇%的濃度輪廟 基板1’其具有完全從以往的碳濃度輪 得到)脫離的輪廓。 又’本發明提供一種磊晶基板,是 的時候’如第8圖 從基板側逐漸地降 可能控制成任意的 參雜劑的Si)的濃度 η反轉層雨成為意 出來,其目的在於 ,該磊晶基板具有 藉由治具來的自動 種磊晶基板,是藉 晶層而成的蠢晶基 濃度輪廓,與基於 得到的碳濃度±50% 蠢晶基板,其蠢晶 溶劑之碳製成的治 丨父叉,是一種蠢晶 靡(利用自動摻雜而 L精由液相蠢晶成長 200809020 方法在基板上積層磊晶層而成的磊晶基板,其特徵為: 積層在上述基板上的磊晶層中的碳濃度輪廓,具有從 基於由用以保持溶劑之碳製成的治具供給而得到的碳濃度 ±5 0%的濃度輪廓所包圍的區域脫離之部份,並具有 10i5atoms/em3以上的部份。 如上述,以往的藉由將碳摻雜在磊晶層中的液相磊晶 成長方法所產生的磊晶基板,是利用從碳製成的治具經由 溶劑將碳供給至磊晶層中來進行摻雜之自動摻雜,製作出 來。如此的以往的磊晶基板,其磊晶層中的碳濃度輪廓, 只會成為逐漸地減少的輪廓。 另一方面,本發明的磊晶基板,其在磊晶層中的碳濃 度輪廓,具有從基於由用以保持溶劑之碳製成的治具供給 而得到的碳濃度±50%的濃度輪廓所包圍的區域脫離之部 份’並具有5xl015atoms/cm3以上的部份。 能夠作出一種磊晶基板,其具有的碳濃度輪廓,與藉 由上述以往的液相蠢晶成長方法所產生的磊晶基板的碳濃 度輪廓相異,完全地脫離僅依存磊晶成長時的溫度(藉由自 動摻雜)所形成的輪廓。 而且’也與使用石英治具等的不會發生自動摻雜之治 具而成長的磊晶層的輪廓相異,能夠作出具有5 X l〇15atoms/cm3以上的部份之磊晶基板。 因此’碳濃度輪廓沒有被固定,且藉此可以成為一種 蠢晶基板’其能夠有效地防止形成閘流體(thyrist〇r)構造等 的意料以外的濃度輪廓。 200809020 法 壤 〇 比 作 地 磊 液 長 lx 5x 根 濃 往 上 下 序 進而,提供-種蠢晶基板,是藉由液相蠢晶成長方 在基板上積層磊晶層而成的磊晶基板,其特徵為: 積層在上述基板上的磊晶層的至少一積層部位中的 濃度,比在該積層部位之前被積層的部位中的碳濃度高 如此,磊晶脣的至少一積層部位中的碳濃度,若是 在該積層部位之前被積層的部位中的碳濃度高,則能夠 出一種磊晶基板,其具有與往磊晶成長方向碳濃度逐漸 減少的輪廓相異之碳濃度輪廓 '也就是說,在本發明的 晶基板中,能夠形成一種碳濃度輪廓,其在藉由以往的 相晶成長方法所產生的蠢晶基板中,並無法得到。 又,本發明提供一種蠢晶基板,是藉由液相磊晶成 方法在基板上積層蠢晶層而成的屋晶基板,其特徵為: 積層在上述基板上的磊晶層,具有其碳濃度在 1 OlBatoms/cm3以上的積層部份,並具有其碳濃度在 1015atoms/cm3以下的積層部份。 以往的藉由液相蠢晶成長方法所產生的蠢晶基板的 晶層中的碳濃度輪靡,僅是依存於蠢晶成長時的溫度, 據在蠢晶成長步驟中的溫度’被換雜在蠢晶層中的碳的 度範圍(上限與下限)也會被限定。 然而,本發明的磊晶基板,並不會被限定在如此以 的碳濃度範圍内,而能夠作成具有以lxl〇16atoms/cm3以 的高濃度而被積層的部份,並具有以5X1015atoms/cm3以 的低濃度被積層的部份。 而且,積層在上述基板上的蠢晶層,能夠作成是依 200809020 積層二個以上的層而成。 如此· 夠按知、用途等,使被積層在基板上的蠢晶層, 是依序積層二個以上的層而成。 此時’上述二個以上的層,能夠作成從基板側依序是 η型層、p型層、p型層。 如此’蠢晶層中的二個以上的層,若從基板側依序是 η型層、ρ型層、ρ型層,則例如在形成發光二極體時,能 夠作成其ρη接合位置距離電極比較遠之發光二極體,使被 電極吸收的光的比率減少,而能夠增加發光輸出。 又’上述蠢晶層能夠設成是由化合物半導體所構成的 層。 如上述,液相蠢晶成長方法,廣泛地應用在使化合物 半導體蠢晶成長的步驟中。本發明的磊晶基板,其磊晶層 若是由化合物半導體所構成的層,則能夠作成其碳濃度被 控制而成的兩品質磊晶基板,能夠作出符合市場需要的磊 晶基板。 此時’上述化合物半導體能夠設成是GaP。 如此’上述化合物半導體若是Gap,則能夠得到碳濃 度被控制而成的高品質GaP的LED用磊晶基板。 又’本發明提供一種液相磊晶成長方法,是使溶劑接 觸基板而使蠢晶層液相磊晶成長之方法,其特徵為: 當使蠢晶層液相磊晶成長在上述基板上的時候,藉由 使烴氣體接觸上述溶劑,將後供給至上述成長的遙晶層 中,而將碳摻雜在該磊晶層中。 10 200809020 如此,當使磊晶層液相磊晶成長在基板上的時候,若 藉由使烴氣體接觸溶劑(此溶劑接觸基板),將碳供給至成 長的磊晶層中來進行摻雜,則與以往的液相磊晶成長方法 (僅利用從用以保持溶劑的碳製成的治具來的自動摻雜)相 • 異,能夠以自由的濃度與時機(timing)將碳摻雜在磊晶層 中。 也就是說,藉由本發明所得到的任意地被控制的輪 g 廓,其在磊晶層中的碳濃度輪廓,能夠從以往的;5岌濃度輪 廓(僅是根據磊晶成長時的溫度來決定,只會往蠢晶成長方 向逐漸地減少)脫離出來;藉此,能夠有效地防止形成意料 以外的例如閘流體構造等。 此時,在使蠢晶詹液相蟲晶成長時,用以保持上述溶 劑之治具,是由·石英製成。 如此’在使蠢晶層液相蠢晶成長時,用以保持上述溶 劑之治具,若是由石英製成,不會從治具供給碳,摻雜在 遙晶層中的碳的濃度幾乎是根據烴氣體的供給條件來決 φ 定,所以對於磊晶層,可精度佳且簡便地控制所希望的碳 濃度,是較佳的。 而且,摻雜在上述遙晶層中的碳濃度,較佳是藉由調 節上述烴氣體的流量來進行控制。 如此,要摻雜在蠢晶層中的碳的濃度,若藉由調節烴 , 氣體的流量來進行控制’由於被摻雜的碳濃度和烴氣體的 流量的相關關係良好,所以能夠將碳濃度正確地控制成所 希望的碳濃度。 11 200809020 又’能夠將上述磊晶層設為是由化合物半導體 的層。 如此,若將磊晶層設為是由化合物半導體所 層’則能夠成長出符合市場需要的高品質磊晶基板 此時,能夠將上述化合物半導體設為GaP。 如此,能夠將上述化合物半導體設為GaP,便 到其碳濃度被控制而成的高品質GaP的LED用磊晶 而且,能夠將上述烴氣體設為甲烷。 如此’若將烴氣體設為曱烷,則由於曱烷價格 容易取得,所以能夠以低成本,液相磊晶成長出所 蠢晶基板。 根據本發明的磊晶基板,能夠得到一種藉由液 成長方法所產生的磊晶基板,其具有任意地被控制 碳濃度輪廓’此碳濃度輪廓,從以往的圖案(通過自 並根據磊晶成長時的溫度而被決定,一直往磊晶成 減少的圖案)脫離,也與僅使用石英治具等的情況所 圖案相異^ 又,根據本發明的液相磊晶成長方法,可以自 碳摻雜在蠢晶層中,能夠液相磊晶成長成具有所希 ^辰度輪廊之蟲晶基板。 【實施方式】 以下’說明關於本發明的實施形態,但是本發 被限定於這些實施形態。 所構成 搆成的 〇 能夠得 基板。 便宜且 希望的 相蠢晶 而成的 動摻雜 長方向 形成的 由地將 望的碳 明並未 12 S > 200809020 以往,在使溶劑接觸在基板上而使磊晶層液相磊晶成 長時,將碳摻雜在該磊晶層中的情況,是利用一種自動摻 雜技術,其將用以保持溶劑之治具設為以碳製成,藉由(通 過)將碳溶進溶劑中,來將碳導入磊晶層中。200809020 When carbon is supplied to the epitaxial layer 3" liquid phase epitaxial growth (b), the carbon concentration in the epitaxial layer will only become a low profile, and the concentration profile will be fixed, not only in concentration, but also due to other impurities ( For example, the η-type 孝 靡 靡 靡 靡 靡 η 例如 例如 thy thy thy 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 The substrate and the liquid phase epitaxial growth method are adjusted to an arbitrary carbon concentration profile instead of the fixed carbon concentration profile generated by doping. To achieve the above object, the present invention provides a liquid crystal stupid growth method on a substrate. a laminated board characterized in that: an epitaxial layer laminated on the substrate causes carbon to be supplied by a fixture made of carbon for holding a solvent. Thus, by the present invention The carbon concentration profile in the obtained layer is desorbed from the concentration of the rim substrate 1' which is obtained from the carbon concentration of the conventional carbon concentration based on the carbon concentration of ±5〇% obtained by the supply of the holder. Further, the present invention provides an epitaxial substrate, and it is intended that the concentration η inversion layer of the Si which may be controlled to be an optional dopant from the substrate side as shown in FIG. 8 is intended to be The epitaxial substrate has an automatic seed epitaxial substrate by means of a jig, and is a stupid crystal concentration profile formed by a crystal layer, and is based on the obtained carbon concentration ± 50% of a stray substrate, and an amorphous solvent Carbon-made 丨 丨 叉 , , 是 是 是 是 是 是 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳 碳The carbon concentration profile in the epitaxial layer on the substrate has a portion deviated from a region surrounded by a concentration profile of a carbon concentration of ±50% based on the supply of the jig made of carbon for holding the solvent, And having a portion of 10i5 atoms/em3 or more. As described above, the conventional epitaxial substrate produced by the liquid phase epitaxial growth method in which carbon is doped in the epitaxial layer is formed by using a jig made of carbon. The solvent supplies carbon to the epitaxial layer for performing The conventional epitaxial substrate has a carbon concentration profile in the epitaxial layer, which is only a gradually decreasing profile. On the other hand, the epitaxial substrate of the present invention is in the Lei The carbon concentration profile in the crystal layer has a portion detached from a region surrounded by a concentration profile of a carbon concentration of ±50% based on a supply of a jig made of carbon for holding a solvent, and has a size of 5×l015 atoms/cm 3 or more A part of an epitaxial substrate having a carbon concentration profile which is different from the carbon concentration profile of the epitaxial substrate produced by the above-described conventional liquid crystal growth method, completely detached from the epitaxial deposit only The profile formed by the temperature at the time of growth (by automatic doping). Moreover, it is also different from the profile of the epitaxial layer grown using a fixture such as a quartz jig that does not undergo automatic doping. X l〇15 atoms/cm3 or more of the epitaxial substrate. Therefore, the carbon concentration profile is not fixed, and thereby it can be an amorphous substrate which can effectively prevent an unexpected concentration profile of a thyristor structure or the like. 200809020 〇 〇 〇 地 液 液 液 l l l l x x x x x x x x x x x x x x x x x x x x x x x 090 090 090 090 090 090 090 090 090 090 090 090 090 090 090 090 090 The method is characterized in that a concentration of at least one laminated portion of the epitaxial layer laminated on the substrate is higher than a concentration of carbon in a portion to be laminated before the laminated portion, and a carbon concentration in at least one laminated portion of the epitaxial lip If the carbon concentration in the portion to be laminated before the laminated portion is high, an epitaxial substrate having a carbon concentration profile different from a contour in which the carbon concentration gradually decreases toward the epitaxial growth direction can be obtained. In the crystal substrate of the present invention, a carbon concentration profile can be formed which is not obtained in the stray substrate produced by the conventional phase crystal growth method. Moreover, the present invention provides a matte substrate which is a house crystal substrate formed by laminating a stray layer on a substrate by a liquid crystal epitaxial method, characterized in that an epitaxial layer laminated on the substrate has carbon The layered portion having a concentration of 1 OlBatoms/cm3 or more and a laminated portion having a carbon concentration of 1015 atoms/cm3 or less. The carbon concentration rim in the crystal layer of the stupid crystal substrate produced by the liquid phase stray crystal growth method is only dependent on the temperature at which the stupid crystal grows, and is replaced by the temperature in the stigma growth step. The range of carbon (upper and lower limits) in the stray layer is also limited. However, the epitaxial substrate of the present invention is not limited to such a carbon concentration range, and can be formed to have a layer deposited at a high concentration of 1×10 〇 16 atoms/cm 3 and has a size of 5×10 15 atoms/cm 3 . The portion of the layer that is deposited at a low concentration. Further, the stray layer laminated on the substrate can be formed by laminating two or more layers according to 200809020. In this way, the stupid layer deposited on the substrate is formed by sequentially stacking two or more layers in order to know, use, and the like. In this case, the above two or more layers can be formed as an n-type layer, a p-type layer, or a p-type layer in this order from the substrate side. When two or more layers in the 'stupid layer are sequentially an n-type layer, a p-type layer, or a p-type layer from the substrate side, for example, when a light-emitting diode is formed, a distance ρη bonding position electrode can be formed. Comparing the far-emitting light-emitting diodes, the ratio of the light absorbed by the electrodes is reduced, and the light-emitting output can be increased. Further, the above-mentioned stray layer can be formed as a layer composed of a compound semiconductor. As described above, the liquid phase stray crystal growth method is widely used in the step of growing the compound semiconductor in a stupid crystal. In the epitaxial substrate of the present invention, if the epitaxial layer is a layer composed of a compound semiconductor, a two-quality epitaxial substrate whose carbon concentration is controlled can be obtained, and an epitaxial substrate which meets market needs can be obtained. At this time, the above compound semiconductor can be made to be GaP. When the compound semiconductor is Gap, a high-quality GaP LED epitaxial substrate in which the carbon concentration is controlled can be obtained. Further, the present invention provides a liquid phase epitaxial growth method, which is a method for causing a solvent to contact a substrate to cause a liquid phase epitaxial growth of a stray layer, characterized in that: a liquid crystal epitaxial growth of the stray layer is performed on the substrate. At this time, carbon is doped into the epitaxial layer by bringing the hydrocarbon gas into contact with the solvent and then supplying the carbon to the grown crystal layer. 10 200809020 Thus, when the epitaxial layer is epitaxially grown on the substrate, doping is performed by supplying a carbon gas to the grown epitaxial layer by contacting the hydrocarbon gas with the solvent (the solvent contacts the substrate). In contrast to the conventional liquid phase epitaxial growth method (automatic doping using only a jig made of carbon for holding a solvent), carbon can be doped at a free concentration and timing. In the epitaxial layer. That is to say, the carbon concentration profile in the epitaxial layer obtained by the arbitrarily controlled wheel g profile obtained by the present invention can be obtained from the conventional 5 岌 concentration profile (only according to the temperature at which the epitaxial growth occurs) It is decided that it will only gradually decrease in the direction in which the stupid crystal grows. Thereby, it is possible to effectively prevent the formation of an unexpected structure such as a thyristor. At this time, the jig for holding the above-mentioned solvent is made of quartz when the crystal of the liquid crystal is grown. Thus, when the stray layer liquid crystal is grown in a stray crystal, the jig for holding the above solvent, if made of quartz, does not supply carbon from the jig, and the concentration of carbon doped in the crystal layer is almost Depending on the supply conditions of the hydrocarbon gas, it is preferable to control the desired carbon concentration with high precision and ease for the epitaxial layer. Further, the concentration of carbon doped in the above-mentioned crystal layer is preferably controlled by adjusting the flow rate of the above hydrocarbon gas. Thus, the concentration of carbon to be doped in the stray layer is controlled by adjusting the flow rate of the hydrocarbon and the gas. 'The carbon concentration can be determined because the correlation between the doped carbon concentration and the flow rate of the hydrocarbon gas is good. Properly controlled to the desired carbon concentration. 11 200809020 Further, the epitaxial layer can be formed as a layer of a compound semiconductor. When the epitaxial layer is made of a compound semiconductor layer, it is possible to grow a high-quality epitaxial substrate that meets market needs. In this case, the compound semiconductor can be made of GaP. In this way, the compound semiconductor can be made into GaP, and the high-quality GaP LED can be epitaxially controlled by the carbon concentration, and the hydrocarbon gas can be made into methane. When the hydrocarbon gas is decane, the price of decane is easily obtained, so that the liquid crystal epitaxial growth can be carried out at a low cost. According to the epitaxial substrate of the present invention, it is possible to obtain an epitaxial substrate produced by a liquid growth method having an arbitrarily controlled carbon concentration profile 'this carbon concentration profile from a conventional pattern (through self-alignment and epitaxial growth) When the temperature is determined, the pattern is deviated from the epitaxial pattern, and the pattern is different from the case where only the quartz jig is used. Further, the liquid phase epitaxial growth method according to the present invention can be doped from carbon. Miscellaneous in the stupid layer, it can be liquid crystal epitaxially grown into a crystal substrate with a whirlpool. [Embodiment] Hereinafter, embodiments of the present invention will be described, but the present invention is limited to these embodiments. The structure constituting 能够 can obtain a substrate. The cheap and desirable phase of the doped crystal is formed by the long-term direction of the carbon do not look at the surface of the carbon is not 12 S > 200809020 In the past, the solvent is brought into contact with the substrate to cause the epitaxial layer liquid phase epitaxial growth In the case where carbon is doped in the epitaxial layer, an automatic doping technique is employed in which the jig for holding the solvent is made of carbon by dissolving carbon into the solvent. To introduce carbon into the epitaxial layer.

然而,如第8圖所示,例如使GaP層蠢晶成長時,以 此種方式摻雜P型摻雜劑也就是碳的情況,例如根據Si 的η型換雜劑的濃度輪廓(Pr〇file),在p型蠢晶層中會出 現η反轉層,而會有形成了意料之外的閘流體(thyristor) 構造這樣的問題。 發生了這樣的問題的原因,被認為是在上述以往的液 相蠢晶成長方法中’莊日日層中的碳濃度,是僅根據蠢晶成 長時的溫度來決疋’歲手纟又有自由度而發生。 僅從治具來的自動換雜’對蠢晶層的後換雜量(濃 度),是由該治具的材質對溶劑的溶解度來決定。因此,換 雜量是溫度的函數,根據磊晶成長時的溫度而被決定,而 隨著磊晶成長的進行’碳濃度會固定成逐漸下降的圖案輪 廓(profile) 0 如此,以往的方法,要脫離由上述自動摻雜所產生的 碳濃度輪廓,而以任意的濃度將碳摻雜在磊晶層中,是困 難的。因此,本發明的發明人,針對在液相磊晶成長方法 中的將碳摻雜在蠢晶層中的方法,重覆專心研究後的結 果,認為:在進行液相磊晶成長時,若使烴氣體接觸溶劑, 則碳會被導入溶劑中’其結果將可以自由地將碳供給至成 長的磊晶層中。如此,發現在液相磊晶成長時,能夠將碳 13 j 200809020 以所希望的濃度、時機(timing),摻雜在磊晶層中,不但能 夠任意地控制磊晶層中的碳濃度輪廓,同時也能夠防止形 成如上述般的意料以外的η反轉層等,而完成本發明。 以下,參照圖面具體地說明關於本發明的實施形態。 第1圖是表示本發明的磊晶基板的一例之概要構成 圖。如第1圖所示,在本發明的磊晶基板1中,在基板2 上,藉由液相磊晶成長方法,形成磊晶層3。However, as shown in Fig. 8, for example, when the GaP layer is grown in a stray crystal, the P-type dopant is doped in this manner, that is, carbon, for example, according to the concentration profile of the n-type dopant of Si (Pr〇 File), an η inversion layer appears in the p-type stray layer, and there is a problem that an unexpected thyristor structure is formed. The reason why such a problem has occurred is considered to be that the carbon concentration in the above-mentioned conventional liquid phase stray crystal growth method is determined by the temperature at the time of growth of the stupid crystal. Freedom occurs. The post-change amount (concentration) of the stray layer only from the jig of the jig is determined by the solubility of the material of the jig to the solvent. Therefore, the amount of change is a function of temperature, and is determined according to the temperature at which the epitaxial growth is performed, and as the epitaxial growth proceeds, the carbon concentration is fixed to a pattern profile that gradually decreases. Thus, the conventional method, It is difficult to dope carbon in the epitaxial layer at any concentration to escape the carbon concentration profile produced by the above automatic doping. Therefore, the inventors of the present invention repeated the results of intensive research on the method of doping carbon into the stray layer in the liquid phase epitaxial growth method, and considered that when liquid phase epitaxial growth is performed, When the hydrocarbon gas is brought into contact with the solvent, carbon is introduced into the solvent. As a result, carbon can be freely supplied to the grown epitaxial layer. Thus, it has been found that in the liquid phase epitaxial growth, carbon 13 j 200809020 can be doped in the epitaxial layer at a desired concentration and timing, and the carbon concentration profile in the epitaxial layer can be arbitrarily controlled. At the same time, it is also possible to prevent the formation of an n-inversion layer or the like which is unexpected as described above, and complete the present invention. Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings. Fig. 1 is a schematic configuration diagram showing an example of an epitaxial substrate of the present invention. As shown in Fig. 1, in the epitaxial substrate 1 of the present invention, the epitaxial layer 3 is formed on the substrate 2 by a liquid phase epitaxial growth method.

首先,由於是藉由液相蠢晶成長方法來形成屋晶層, 所以相較於藉由氣相磊晶成長方法或分子線磊晶成長方法 等的其他方法,磊晶層3中的差排(dislocation)或點缺陷密 度等’可以比較低。 而且,此基板2和磊晶層3的材質並沒有特別限定, 能夠按照用途加以適當選擇。如上述,一般來說,液相蠢 晶成長方法廣泛地被使用,特別是對於間接遷移結晶的蠢 晶(epitaxy)是有效的,所以磊晶層3若是化合物半導體例 如是由GaP所構成的層,則能夠作成市場上需求高的化合 物半導體的磊晶基板1。 又,磊晶層3能夠作成由二個以上的層依序積層而 成。積層的層數、各層的厚度等,能夠每次根據用途來決 定。例如,如第1圖所示,能夠作成從基板2側,依序積 層η型層4、p型層5、p型層6而成。若是如此的構造, 例如第2圖所示,在形成有電極8之已經元件化的發光裝 置(device)7中,其ρη接合的形成位置,離電極8較遠, 而可以減少由於電極8所吸收光的比率。在此,第1 7圖是 14 200809020 表示在如第2圖般地積層的情況(B)和從基板2側依序積層 n型層、η型層、p型層的情況(〇中,比較電極所造成的 光的吸收比率的說明圖。如此,若是第2圖的構造(Β),例 如能夠比(C)的情況更有效率地取出光,而可提高發光輸 出。 在此,詳細說明關於本發明的磊晶基板i的磊晶層3 中的碳濃度輪廓。作為例子,說明關於化合物半導體GaP 被液相蠢晶成長後的情況,但是如前述,本發明並未被限 定於化合物半導體;又,即使是化合物半導體,也不限定 於 GaP。 如第8圖所示,如以往般的利用從治具來的自動掺雜 雨製造出來的蟲晶基板中的碳濃度輪廓,是成為從蠢晶成 長方向也就是從基板2”側往磊晶基板1”的表面方向,逐 漸地減少的輪廓。這是因為被摻雜在磊晶層中的碳濃度, 如前述般,是根據治具對於溶劑的溶解度來決定;換言之, 是依存於磊晶成長時的溫度。因此,在使溫度下降而緩慢 地依序積層磊晶層之液相磊晶成長方法中,對應該溫度變 化’被摻雜的碳濃度(輪廓)只會成為逐漸地減少的圖案。 然而’例如第2圖所示,本發明的磊晶基板i (發光裝 置Ό ’能夠作成具有與以往的輪廓(由碳製成的治具供給 而得到的碳濃度輪廓L)相異之輪廓C!之磊晶基板;該以往 的輪廓’是藉由以往的方法,使用碳製成的治具,自動摻 雜碳的情況所得到的輪廓,也就是如第8圖所示的只會逐 漸地減少之由於自動摻雜而使其濃度變化被固定的以往的 15 200809020 輪廓◊在第2圖中,例如考慮濃度測定裝置的精度 對於由碳製成的治具供給而得到的碳濃度輪廓L, 出表示±50%的濃度的輪廓L,。由第2圖可知,在 的輪廓^與輪廓L,交又。與輪廓L,的交叉, + 50%、-50%的濃度輪廓的至少任一方即可。如此的 L’交叉之輪廓Cl,完全地脫離由自動摻雜的以往 產生的輪廓,是以往無法得到而藉由本發明才可得 廓。 針對磊晶層3,在以往的磊晶基板,例如在p 即使是具有發生意料以外的n反轉層而成為閘流體 樣的η型摻雜劑的矽的濃度輪廓的情況(參照第8围 只要是第2圖所示的本發明的磊晶基板丨,在ρ型^ 碳濃度能夠作成不會被矽濃度逆轉,不會形成^反 當然也不會成為閘流體構造,而能夠作出所希望構 晶基板。 又,第3圖表示本發明的磊晶基板丨的另外的 態。 在此例中,碳濃度,成為是從磊晶層3的基板 始算起,在一疋深度處,急速地減少,而從該深度 基板1的表面為止’則維持低值之輪廓c2。 如此,存在從區域rl.脫離的部位,該區域Rl 對於由碳製成的治具供给而得到的碳濃度輪廓L 50%濃度之輪廓L’所包圍的區域;而且,磊晶基板 有5xl〇l5atoms/cin3以上的部位之輪廓C2,完全地從 等,相 也顯示 此例中 只要是 與輪廓 方法所 到的輪 型層, 構造這 丨⑻), ,5中, 轉層。 造的蠢 實施形 2側開 至遙晶 是由相 &表示士 1所具 以往的 16 200809020 輪廓L脫離;又,也與僅使用石英治具之以往的情況相異 (參照第7圖),可以說此輪廓G不可能由以往的方法獲 得’而只可以由本發明的方法得到。 並且,關於5x1015atoms/cm3以上的部位的碳濃度的上 限’並沒有特別限定,能夠作成所希望的濃度值。 進而’將本發明的其他例表示於第4圖。 第4圖的本發明的磊晶基板1中的碳濃度輪廓C3,能 夠作成是從蠢晶層3的基板2側開始算起至一定深度為 止’逐漸地減少,但是在該深度處,急速地增加,直至磊 晶基板1的表面為止,一直維持該增加後的值之輪廓。如 此’能夠僅在特定的層,摻雜碳。 如此’在某一積層部位(此情況是積層部位21)中的碳 》辰度’可以比先前被積層的部位(積層部位2 0 )中的碳濃度 T?} 〇 又,在第5圖所示的例子中,如碳濃度輪廓C4所示, I晶基板1成為具有碳濃度為lxl〇i6atoms/cm3以上的積層 部位22 ’並具有5xl〇i5at〇ms/cm3以下的濃度的積層部位 2 3之基板。 如前所述,以往的磊晶基板,其碳濃度輪廓僅是由蠢 晶成長時的溫度來決定,碳濃度的上限和下限會被限定。 然而,本發明的磊晶基板1,該範圍並不會特別地被 限定’而可以具有可看到1x1 016atoms/cm3以上的高丨農度僅" 和5><l〇15atoms/cm3以下的低濃度之輪廓。 這些lxl016atoros/cm3以上的高濃度值的上眼、5> 17 200809020 1015atonis/cm3以下的低濃度值的下限並沒有特別地被限 定,能夠作成所希望的濃度值。 以下,詳細地說明本發明的液相磊晶成長方法。First, since the roof layer is formed by the liquid phase stray crystal growth method, the difference in the epitaxial layer 3 is compared with other methods such as the vapor phase epitaxial growth method or the molecular line epitaxial growth method. (dislocation) or point defect density, etc. can be relatively low. Further, the material of the substrate 2 and the epitaxial layer 3 is not particularly limited, and can be appropriately selected depending on the application. As described above, in general, a liquid phase stray crystal growth method is widely used, particularly for an epitaxy which indirectly migrates crystals, so that the epitaxial layer 3 is a compound semiconductor such as a layer composed of GaP. Then, an epitaxial substrate 1 of a compound semiconductor having high demand on the market can be produced. Further, the epitaxial layer 3 can be formed by sequentially laminating two or more layers. The number of layers to be laminated, the thickness of each layer, and the like can be determined each time depending on the use. For example, as shown in Fig. 1, it is possible to form the n-type layer 4, the p-type layer 5, and the p-type layer 6 in this order from the substrate 2 side. With such a configuration, as shown in Fig. 2, in the already-elementized light-emitting device 7 in which the electrode 8 is formed, the formation position of the ρη junction is far from the electrode 8, and the electrode 8 can be reduced. The ratio of absorbed light. Here, Fig. 17 is a case where 14 200809020 shows a case where a layer is laminated as in Fig. 2 (B) and a case where an n-type layer, an n-type layer, and a p-type layer are sequentially laminated from the substrate 2 side (in comparison, An explanatory diagram of the absorption ratio of light by the electrode. Thus, in the structure of Fig. 2, for example, light can be taken out more efficiently than in the case of (C), and the light emission output can be improved. The carbon concentration profile in the epitaxial layer 3 of the epitaxial substrate i of the present invention is described as an example of the case where the compound semiconductor GaP is crystallized by the liquid crystal, but as described above, the present invention is not limited to the compound semiconductor. Further, even a compound semiconductor is not limited to GaP. As shown in Fig. 8, the carbon concentration profile in the insect crystal substrate produced by the automatic doping rain from the jig is conventionally The growth direction of the stray crystal is a gradually decreasing profile from the side of the substrate 2" toward the surface of the epitaxial substrate 1". This is because the concentration of carbon doped in the epitaxial layer is as described above. For the solubility of the solvent In other words, it depends on the temperature at which the epitaxial growth occurs. Therefore, in the liquid phase epitaxial growth method in which the temperature is lowered and the epitaxial layer is slowly laminated, the carbon concentration corresponding to the temperature change (contour) It is only a gradually decreasing pattern. However, as shown in Fig. 2, the epitaxial substrate i (light-emitting device Ό ' of the present invention can be formed to have a conventional profile (a supply of a jig made of carbon). The carbon concentration profile L) the epitaxial substrate of the different contour C!; the conventional profile 'is a profile obtained by automatically doping carbon using a fixture made of carbon by a conventional method, that is, The conventional 15 200809020 contour shown in Fig. 8 which is only gradually reduced due to the automatic doping and whose concentration change is fixed is shown in Fig. 2, for example, considering the accuracy of the concentration measuring device for the treatment made of carbon. The carbon concentration profile L obtained by the supply has a contour L indicating a concentration of ±50%. As can be seen from Fig. 2, the contour ^ and the contour L are intersected, and the intersection with the contour L, + 50%, -50% of the concentration profile of at least either The L'crossing profile C1 is completely out of the conventionally generated profile by auto-doping, which is not available in the past and can be obtained by the present invention. For the epitaxial layer 3, the conventional epitaxial substrate For example, in the case where p is a concentration profile of yt-type dopant which is a thyristor-like dopant having an n-inversion layer other than the expected one (see the eighth aspect, the projection of the present invention shown in FIG. In the crystal substrate 丨, the concentration of the p-type carbon can be prevented from being reversed by the erbium concentration, and the constitutive crystal substrate can be formed without forming the thyristor structure. Further, Fig. 3 shows the present invention. In this example, the carbon concentration is rapidly decreased from a depth of the substrate of the epitaxial layer 3 from the surface of the epitaxial layer 3, and from the surface of the depth substrate 1 The contour c2 of the low value is maintained. Thus, there is a portion detached from the region rl., the region surrounded by the contour L' of the carbon concentration profile L 50% obtained by supplying the jig made of carbon; and, the epitaxial substrate has 5xl〇 The contour C2 of the part above l5atoms/cin3 is completely equal, and the phase also shows that in this example, as long as it is the wheel-shaped layer with the contour method, the structure (8)), 5, and the transition layer are constructed. The stupid embodiment 2 is opened to the remote crystal by the phase & indicates that the previous 16 200809020 outline L is separated from the phase 1; it is also different from the previous case where only the quartz fixture is used (see Fig. 7). It can be said that this profile G cannot be obtained by the conventional method' and can only be obtained by the method of the present invention. Further, the upper limit of the carbon concentration in the portion of 5x1015 atoms/cm3 or more is not particularly limited, and a desired concentration value can be obtained. Further, another example of the present invention is shown in Fig. 4. The carbon concentration profile C3 in the epitaxial substrate 1 of the present invention in Fig. 4 can be gradually reduced from the substrate 2 side of the stupid layer 3 to a certain depth, but at this depth, the carbon concentration is rapidly decreased. The contour of the increased value is maintained until the surface of the epitaxial substrate 1 is increased. Thus, it is possible to dope carbon only in a specific layer. Thus, the carbon "degree" in a certain laminated portion (in this case, the laminated portion 21) can be higher than the carbon concentration T?} in the previously laminated portion (the laminated portion 20), and in Fig. 5 In the example shown, the I crystal substrate 1 has a laminated portion 22' having a carbon concentration of lxl〇i6 atoms/cm3 or more and a laminated portion 2 having a concentration of 5xl〇i5at〇ms/cm3 or less as indicated by the carbon concentration profile C4. The substrate. As described above, in the conventional epitaxial substrate, the carbon concentration profile is determined only by the temperature at which the stray crystal grows, and the upper limit and the lower limit of the carbon concentration are limited. However, in the epitaxial substrate 1 of the present invention, the range is not particularly limited' and may have a high degree of agriculturality of only 1x1 016 atoms/cm3 or more and "5><l〇15 atoms/cm3 or less The contour of the low concentration. The lower limit of the high concentration value of the upper eye, 5 > 17 200809020 1015 atoms/cm3 or less of these lxl016atoros/cm3 or more is not particularly limited, and a desired concentration value can be obtained. Hereinafter, the liquid phase epitaxial growth method of the present invention will be described in detail.

並且,在此舉出以漸冷法來實行的方法作為例子來加 以說明,但是本發明並未被限定於此種方法,例如也可以 利用溫度差法等的方法來實施。/又,舉出使第6圖所示的 GaP磊晶基板液相磊晶成長的例子來進行說明,但是並不 限定於這個例子,只要是前述輪廓的例子便可以;基板和 磊晶層等,也不限定為化合物半導體基板或GaP。只要按 照想要得到的磊晶基板的用途,準備適當的基板等來進行 實施便可以。 在此,首先,說明關於能夠用來實施上述本發明的方 法之液杻磊晶成長裝置。第9圖表示該裝置的一例。 在此液相磊晶成長裝置1 0中,於石英管1 7内,配置 用來進行磊晶成長之石英治具14。以型GaP單結晶基板2 被固定在此石英治具14的底部,進而在石英治具14内, 充滿Ga溶液1 5。又,在石英治具14的上部,設置石英蓋 1 6,其被加工成可以使摻雜劑通過。 將其内部具有Zn (成為p型摻雜劑)之坩堝1 3,配置在 石英管17的其中一方的端部附近。在石英管17的外周部, 設置加熱器11 (用以使11型0&?單結晶基板2與〇3溶液15 等的溫度升降)、和辅助加熱器12(用以使Zn的溫度上 升)。而且,在石英管17的配置具有Zn的坩堝13側的端 -i S > 18 200809020 石厌的烴氣體,例如與H2、Ar等 英管1 7内。進而,若有進行氮 供給。 長裝置1 0,能夠在GaP單結晶 部’設置開口部;用以摻雜 的運载氣體一起被供給至石 掺雜’則NH3也從此開口部 藉由如此的液相磊晶成 基板2上,積層GaP磊晶層 亚且,在此液 〜八取且上u甲,配置了石英治Further, the method performed by the gradual cooling method is described as an example. However, the present invention is not limited to such a method, and may be implemented by, for example, a method such as a temperature difference method. Further, an example in which liquid phase epitaxial growth of the GaP epitaxial substrate shown in Fig. 6 is described will be described. However, the present invention is not limited to this example, and may be an example of the outline; a substrate, an epitaxial layer, etc. It is not limited to a compound semiconductor substrate or GaP. It suffices to prepare an appropriate substrate or the like in accordance with the use of the epitaxial substrate to be obtained. Here, first, a liquid helium epitaxial growth apparatus which can be used to carry out the above-described method of the present invention will be described. Fig. 9 shows an example of the device. In this liquid phase epitaxial growth apparatus 10, a quartz jig 14 for epitaxial growth is disposed in the quartz tube 17. The GaP single crystal substrate 2 is fixed to the bottom of the quartz jig 14 and further filled with the Ga solution 15 in the quartz jig 14. Further, on the upper portion of the quartz jig 14, a quartz cover 16 is provided which is processed to allow passage of a dopant. The crucible 13 having Zn (which becomes a p-type dopant) is disposed in the vicinity of one end portion of the quartz tube 17. On the outer peripheral portion of the quartz tube 17, a heater 11 (for raising and lowering the temperature of the 11-type 0-?? single crystal substrate 2 and the 〇3 solution 15) and an auxiliary heater 12 (for raising the temperature of Zn) are provided. . Further, in the arrangement of the quartz tube 17, the end of the 坩埚13 side of the Zn-i S > 18 200809020 is a hydrocarbon gas, for example, in the British tube 17 such as H2 and Ar. Further, if nitrogen is supplied. The long device 10 can be provided with an opening portion in the GaP single crystal portion; the carrier gas for doping is supplied to the stone doping together, and the NH3 is also epitaxially formed on the substrate 2 from the opening portion by such liquid phase. , the layered GaP epitaxial layer sub-and, in this liquid ~ eight taken and on the armor, with quartz treatment

14’但是並不限定於石英治具’也能夠作成配置碳製成 治具。首先,若是石英治具14,則能夠從治具供給發, 能夠防止從治具供給碳。因此’被摻雜的碳的濃度,由 僅是根據從石英管丨7的開口部供給的烴氣體來決定,所 調整比較容易。當然’也能夠設為石英製以外的不會進 後的自動摻雜之治具。 方面,若使使用峡製成的治具,則會進行碳的自 動摻2。例如,考慮由於此治具所產生的自動摻雜的碳濃 度,> 2果只要調整所供給的烴氣體,使得碳會被摻雜所希 望$邋度即可。又,利用預先將矽粉混入Ga溶液丨5中, ^_摻雜將成為n型摻雜劑的矽。 接著,詳細地說明關於使用此種液相磊晶成長裝置 1 0,倍吞 為晶層3積層在基板2上而使本發明的磊晶基板! l> e 的步聲的一例。步驟的概要表示於第1〇圖。 在此,如前所述,說明關於製造磊晶基板1的步驟, '、 6圖所示,在磊晶層3中,具有碳被摻雜在p型層 5中而成的碳濃度輪廓C5。 首先,如第10圖Ο)所示,將Ga溶液15配置在η型 19 接著,使Η2在石英管14' is not limited to the quartz jig', but it can also be made into a fixture made of carbon. First, in the case of the quartz jig 14, it is possible to supply the hair from the jig, and it is possible to prevent carbon from being supplied from the jig. Therefore, the concentration of the carbon to be doped is determined only by the hydrocarbon gas supplied from the opening of the quartz tube 7, and the adjustment is relatively easy. Of course, it is also possible to use a fixture other than quartz which does not enter the automatic doping. On the other hand, if a jig made of a gorge is used, automatic carbon doping is performed. For example, considering the auto-doped carbon concentration produced by the jig, it is only necessary to adjust the supplied hydrocarbon gas so that the carbon is doped to be desired. Further, by mixing the tantalum powder into the Ga solution crucible 5 in advance, ^_ doping becomes a niobium of an n-type dopant. Next, the epitaxial substrate of the present invention will be described in detail by using such a liquid phase epitaxial growth apparatus 10 and doubling the crystal layer 3 on the substrate 2. l> An example of the step sound of e. A summary of the steps is shown in Figure 1. Here, as described above, the step of manufacturing the epitaxial substrate 1 will be described, and as shown in FIGS. 6 and 6, in the epitaxial layer 3, the carbon concentration profile C5 in which carbon is doped in the p-type layer 5 is formed. . First, as shown in Fig. 10, the Ga solution 15 is placed in the n-type 19, and then the crucible 2 is placed in the quartz tube.

200809020200809020

GaP單結晶基板2上。此時的溫度,例:! 在600 °C以下,輔助加熱器12是設定在 溫度低的溫度。 度上升至100(TC。於是,將η型GaP單I 逐漸地溶解,GaP溶解於Ga溶液1 5中 溶液15a(第1〇圖。 如此地進行n型GaP單結晶基板2 進行第1 0圖(e)以後的步驟。在第1 〇圖 使石英管1 7内的溫度下降,在溶解後 基板2a上,使Gap磊晶層3液相磊晶 首先,如第10圖(c)所示,在此降 層蠢晶成長,同時從石英治具1 4溶入的 的Si,被摻雜在成長的磊晶層中。如此 地被摻雜而成的η型層4。 進而’如第10圖(d)所示,作為烴 為運载乳體,藉由將ch4添加在此運截 央& 17内,使摻雜碳的P型層5,成長 矽而成的n型層4上。 並且,在上逑中,舉出供給cH4 ^ 能夠供給瑞的柄# 灭的 >二虱體便可以,並沒有裝 可以設為关悉&卜 香族起氣體,只要是能夠心 夬管17内便可 之j u。但是,CH4價格比4 所以簡便。運恭友 運载虱體也沒有限定是Ar t加熱器11是設定 充分地比加熱器的 L使加熱器1 1的溫 〖晶基板2的上部, ,而成為Ga( + GaP) 的上部溶解之後, (Ο以後的步驟中, 勺η型GaP單結晶 良長。 溫步驟中,使Gap 將成為η型摻雜劑 ,可以形成矽充分 I體,例如將Ar作 氣體中而供給至石 在上述過度地摻雜 情況,但是只要是 別地限定。例如也 氣體狀態供給至石 L便宜且容易取得, 也可以使用U2。 20 叼决定係數GaP single crystal substrate 2. The temperature at this time, for example: ! Below 600 °C, the auxiliary heater 12 is set at a temperature low. The degree is raised to 100 (TC. Thus, the n-type GaP single I is gradually dissolved, and GaP is dissolved in the solution 15a of the Ga solution 15 (Fig. 1). The n-type GaP single crystal substrate 2 is subjected to the first 0. (e) Subsequent steps. The temperature in the quartz tube 17 is lowered in the first diagram, and the liquid phase epitaxy of the Gap epitaxial layer 3 is first formed on the substrate 2a after dissolution, as shown in Fig. 10(c). In this case, the falling layer of stupid crystal growth, while the Si dissolved in the quartz fixture 14 is doped in the growing epitaxial layer. The n-type layer 4 thus doped is doped. 10 (d), as the hydrocarbon is a carrier milk, the carbon-doped P-type layer 5 is grown by the addition of ch4 in the transport center & 17 In addition, in the upper jaw, the supply of cH4 ^ can supply the handle of the ruin # 灭 > 虱 虱 便 便 便 便 便 便 便 便 便 便 虱 关 & & & & & & & & & & & & & The inside of the tube 17 can be ju. However, the price of CH4 is simpler than that of 4. Therefore, it is not limited to carry the body of the friend. The Ar t heater 11 is set to be sufficiently larger than the heater L to make the heater 1 1 After the upper portion of the crystal substrate 2 is dissolved, the upper portion of Ga(+GaP) is dissolved. (In the subsequent step, the η-type GaP single crystal is long and long. In the temperature step, Gap is made to be an n-type dopant. It is possible to form a sufficient body, for example, when Ar is supplied as a gas and supplied to the stone in the above-described excessive doping, but it is not particularly limited. For example, the gas state is supplied to the stone L inexpensively and easily obtained, and U2 may be used. 20 叼determination coefficient

200809020 又’此時藉由調節供給的ch4等的烴氣體的流量 夠控制要摻雜的碳的濃度。 在此,第1 1圖是表示CH4的流量和磊晶層中的 度的相關關係的圖。此圖是改變供給的氣相中的CH4 (流量^ ’而,繪出在各流量的情況下,成長後的蠢晶 的厌/辰度(取大值與平均值)而成的圖。根據此圖(平』 可以得 碳濃度的相關關係良#,確認能夠藉由調冑CL的 充分地控制成長的磊晶層中的碳濃度。 接著,如第10圖⑷所示,停止Ar、CH4等的流 將輔助加熱器12的溫度例如上升至7〇〇t:,繼續進行 器11的降溫。藉此,坩堝13中的Zn會與運載氣體 起在石英管内流通,而在碳摻雜的p型層5上,形成 Zn而成的P型層6。 並且’ GaP是間接遷移型半導體,即使形成pn接 在k種狀癌下,由於其亮度極低,所以摻雜氮也能夠 發光輸出。對於磊晶層3的氮摻雜,能夠藉由在磊晶 中將NH3等供給至石英管Η内來進行。 又,也不限定於上述步驟,而能夠自由地設定各 與各摻雜劑(特別是與碳相關)的供給時機和量等,使 以得到所希望的構造、濃度輪廓。藉此,能夠任意地 成長後的蠢晶層中的碳濃度與其他的摻雜劑濃度。 如上述’使用本發明的液相磊晶成長方法,使磊 3液相蠢晶成長在基板2上,能夠使本發明的磊晶基 ,能 碳濃 濃度 層中 与值) 中的 量, 通, 加熱 Η2 一 推雜 合, 提雨 成長 氣體 得可 控制 晶層 板1 ί S > ί.··^ 21 200809020 液相磊晶成長。第6圖是表示利用上述步驟製造出來的石 晶基板1中的不純物濃度輪廓。如此,藉由供给Cg4等的 烴氣體,在液相磊晶成長的磊晶層3的積層部位(上述例子 的情況,是P型層5 ),可以儘可能地將碳自由地摻雜所希 望的量。 藉由本發明的方法,可以得到一種具有任意地被調整 後的碳濃度輪廓之向品質的蠢晶基板,其碳濃度輪廊大中s 地從以往的磊晶基板中的被固定的碳濃度輪廓(僅依存從 治具來的自動摻雜,而只會往磊晶成長方向逐漸地減少) 脫離。 以下,舉出本發明的實施例與比較例,更詳細地說明, 但是本發明並未被限定於這些實施例。 (實施例1) 使用第9圖所示的液相磊晶成長裝置,並將Ga溶液 配置在η型GaP單結晶基板上,如第1圖的磊晶基板1, 藉由本發明的液相磊晶成長方法,從基板側依照η型層、 ir 型層、P型層的順序,使GaP磊晶層成長。此時的製程時 間•溫度、氣體或摻雜劑的供給時機(timing) ·供給量等 的實施條件,概要地表示於第1 8圖。用以保持基板與Ga 溶液之治具,是由石英製成。 首先,將GaP單結晶基板與Ga溶液配置在治具内之 後,在石英管内,使H2(流量:1 .Oslm)與Ar(流量:1 .〇s!m) 流通’並使加熱器的溫度上升至1〇〇〇°C,將GaP單結晶基 22 200809020 板的上部,溶解於Ga溶液中。 使GaP單結晶基板溶解規定厚度之後,使石英管内降 温’而使GaP蠢晶層3成長。 最初,摻雜要成為η型摻雜劑的S i來使η型層4成長 (厚度·大約10/zm)。Si的換雜方法,是從石英治具來的 自動摻雜,以8xl016atoms/cm3的濃度,被進行摻雜。200809020 Also at this time, the concentration of carbon to be doped can be controlled by adjusting the flow rate of the supplied hydrocarbon gas such as ch4. Here, Fig. 1 is a view showing the correlation between the flow rate of CH4 and the degree in the epitaxial layer. This figure is a graph in which CH4 (flow rate ^' in the gas phase of the supply is changed, and the odor/length of the stray crystal after growth (taking a large value and an average value) in the case of each flow rate is plotted. In this figure (flat), the correlation of the carbon concentration can be obtained, and it is confirmed that the concentration of carbon in the grown epitaxial layer can be sufficiently controlled by adjusting the CL. Next, as shown in Fig. 10 (4), Ar and CH4 are stopped. The flow of the auxiliary heater 12 raises the temperature of the auxiliary heater 12, for example, to 7 〇〇t: to continue the temperature drop of the heater 11. Thereby, the Zn in the crucible 13 is circulated in the quartz tube with the carrier gas, and is doped in the carbon. On the p-type layer 5, a P-type layer 6 made of Zn is formed. And 'GaP is an indirect migration type semiconductor, and even if pn is formed under k-type cancer, since the luminance is extremely low, the doped nitrogen can emit light. The nitrogen doping of the epitaxial layer 3 can be performed by supplying NH 3 or the like into the quartz tube in the epitaxial layer. Further, it is not limited to the above steps, and each dopant can be freely set. The timing and amount of supply (especially related to carbon) to obtain the desired structure, Thereby, the carbon concentration in the stray layer which can be arbitrarily grown and other dopant concentrations are obtained. As described above, the liquid crystal epitaxial growth method of the present invention is used to grow the epitaxial crystal in the liquid crystal. On the substrate 2, the amount of the epitaxial group in the carbon concentration layer of the present invention can be increased, and the heating Η2 can be mixed, and the growth gas can be controlled to raise the crystal layer 1 ί S > ί.··^ 21 200809020 Liquid phase epitaxial growth. Fig. 6 is a view showing the impurity concentration profile in the stone substrate 1 manufactured by the above steps. Thus, liquid phase epitaxy is carried out by supplying a hydrocarbon gas such as Cg4. The laminated portion of the grown epitaxial layer 3 (in the case of the above example, the P-type layer 5) can be freely doped with carbon in a desired amount as much as possible. By the method of the present invention, it is possible to obtain a layer which is arbitrarily The adjusted carbon concentration profile of the quality of the stray substrate, the carbon concentration of the wheel lands from the conventional epitaxial substrate in the fixed carbon concentration profile (only dependent on the automatic doping from the fixture, and Will only gradually grow toward the direction of epitaxial growth The invention is described in more detail below with reference to examples and comparative examples of the invention, but the invention is not limited to the examples. (Example 1) Liquid phase epitaxy shown in Fig. 9 is used. a growth device, and a Ga solution is disposed on the n-type GaP single crystal substrate, such as the epitaxial substrate 1 of FIG. 1, by the liquid phase epitaxial growth method of the present invention, from the substrate side according to the n-type layer, the ir-type layer, The order of the P-type layer is such that the GaP epitaxial layer is grown. The process time, temperature, gas, or dopant supply timing, supply amount, and the like are generally shown in Fig. 18. The jig for holding the substrate and the Ga solution is made of quartz. First, after the GaP single crystal substrate and the Ga solution are disposed in the jig, H2 (flow rate: 1.0 mslm) and Ar (flow rate) are placed in the quartz tube. :1 .〇s!m) Circulates and raises the temperature of the heater to 1 °C, and dissolves the upper portion of the GaP single crystal group 22 200809020 plate in the Ga solution. After the GaP single crystal substrate is dissolved in a predetermined thickness, the inside of the quartz tube is lowered to make the GaP stray layer 3 grow. Initially, S i to be an n-type dopant is doped to grow the n-type layer 4 (thickness: about 10/zm). The Si replacement method is an automatic doping from a quartz fixture, and is doped at a concentration of 8 x 10 016 atoms/cm 3 .

接著’摻雜要成為p型摻雜劑的碳來使p型層5成長 (厚度:大約12 μ m)。此時,要充分地考慮η型摻雜劑Si 的濃度輪廓,注意不要形成意料以外的反轉層等,以此方 式將CH4供給至石英管内,而將摻雜濃度調整成2 X 1016at〇ffls/cm3(CH4 氣體濃度:Ar 基質(base)5%、(Ar + CH4) 流量:200sccm)。 又,同時供給Nih,以2xl018atoms/cm3程度的濃度, 摻雜氮(流量:50sccm)。 之後,更掺雜要成為p型摻雜劑的Zn來使p型層6 成長(厚度:27 μ m)。藉由使輔助加熱器的溫度上升至7〇〇 使Zn和運载氣體Hz(carrier gas)—起在石英管内流 通,而可以lxl018atoms/cm3程度的濃度,被進行摻雜。 並且,使此P型層6成長厚度時,停止供給CH4。 之後,在蠢晶層幾乎不會成長的8〇〇 ,停止供給h2、 NH3、Zn,進而降低溫度,使溫度下降至室溫為止而得到本 發明的磊晶基板。 藉由SIMS來分析以如此方式得到的本發明的磊晶基 板1的不純物濃度輪廓(檢測界限:lxl〇15atoms/cni3)。將 23 200809020 分析結果表示於第1 2圖。 在第12圖中,為了進行比較,也表示出:由碳製成的 治具供給而得到的碳濃度輪廓L、表示出相對於輪廓L之士 50%的濃度輪廓l,及被輪廓L’包圍的區域Rl·。 - 由第1 2圖可知,僅是已供給CH4之p型層5與p型層 6的一部份,其碳濃度是以2x10i6atoms/cm3的濃度被摻 雜’而得到了以高濃度(比在p型層5之前被積層的η型層 4高)被摻雜在ρ型層5等之中的急峻的輪廓。Then, the carbon to be a p-type dopant is doped to grow the p-type layer 5 (thickness: about 12 μm). At this time, the concentration profile of the n-type dopant Si should be sufficiently considered, taking care not to form an inversion layer other than the expected one, and in this way, CH4 is supplied into the quartz tube, and the doping concentration is adjusted to 2 X 1016 at 〇ffls. /cm3 (CH4 gas concentration: Ar substrate (base) 5%, (Ar + CH4) flow rate: 200 sccm). Further, Nih was supplied at the same time, and nitrogen was doped at a concentration of about 2 x 10 018 atoms/cm 3 (flow rate: 50 sccm). Thereafter, Zn to be a p-type dopant is more doped to grow the p-type layer 6 (thickness: 27 μm). By raising the temperature of the auxiliary heater to 7 Torr, Zn and carrier gas Hz are allowed to flow in the quartz tube, and doping can be performed at a concentration of about lxl018 atoms/cm3. Further, when the P-type layer 6 is grown to a thickness, the supply of CH4 is stopped. Thereafter, the epitaxial substrate of the present invention was obtained by stopping the supply of h2, NH3, and Zn at a level of almost no growth of the stray layer, and further lowering the temperature to lower the temperature to room temperature. The impurity concentration profile (detection limit: lxl 〇 15 atoms/cni3) of the epitaxial substrate 1 of the present invention obtained in this manner was analyzed by SIMS. The analysis results of 23 200809020 are shown in Figure 12. In Fig. 12, for comparison, it is also shown that the carbon concentration profile L obtained by supplying the jig made of carbon, the density profile l showing 50% with respect to the contour L, and the contour L' The enclosed area Rl·. - It can be seen from Fig. 2 that only a part of the p-type layer 5 and the p-type layer 6 to which CH4 has been supplied is carbon-concentrated at a concentration of 2x10i6 atoms/cm3 to obtain a high concentration (ratio). The n-type layer 4 which is laminated before the p-type layer 5 is high) is doped with a sharp outline in the p-type layer 5 or the like.

® 又,成為具有從區域RL ·脫離的部份,且具有 5 X ” 1〇15atoms/cm3以上的部分之輪廓。也與輪廓L’交叉。 又’成為具有1 X 1 0 1 5 a t 0丽s / cm3以上的濃度部分,並具 有5xlOl5atoms/cm3以下的濃度部分之輪廓。 如此’藉由本發明,可以得到大幅地從輪廓L (在以往 的方法由碳製'成的治具供給而得到的碳濃度輪廓L)脫離 的輪廓,而能夠做出所希望的碳濃度輪廓。如此,能夠得 到碳濃度被控制之高品質的磊晶基板。 % 又,與上述實施例1同樣,藉由本發明的液相磊晶成 長方法,摻雜碳而製作30片本發明的磊晶基板的時候,與 以往僅疋逐漸地減少之固定的輪廓相異,都具有第12圖般 的濃度輪廓,且不會形成意料外的反轉層。 (比較例1) 使用第9圖所示的液相吳曰士、 ;狀邗猫日日成長裝置,並將Ga溶液 配置在η型GaP單妹黑其把μ # t 早日日基板上,稭由以往的液相磊晶成長 24 200809020 方法,從基板側依照η型層、p型層、p型層的順序,使 GaP磊晶層成長。但是,與實施本發明的上述實施例丄相 異’並沒有進行CH4的供給。又,用以保持基板與溶 液之治具,是由石英製成,而藉由如以往的自動摻雜來摻 雜碳。 首先,將GaP單結晶基板與Ga溶液配置在治具内之 後,在石英管内,使H2(流量:匕^…與Ar(流量:i 〇_) 流通,並使加熱器的溫度上升至1〇〇(rc,將Gap單結晶農 板的上部,溶解於Ga溶液中。 使GaP單結晶基板溶解規定厚度之後,使石英管内降 溫,而使GaP蠢晶層成長。 最初,摻雜要成為η型摻雜劑的si來使n型層成長(厚 度·· 22 μ m)。Si的摻雜方法,是利用在室溫狀態下,預先 使高純度的Si結晶混入Ga中的方法來進行,調節Si量使 得其能以2x1 017atoms/cm3的濃度被摻雜。 之後,停止藉由上述方法所實行的s i的供給,而使碳 之藉由自動摻雜所產生的p型層成長(厚度久 此時,供給M3,以lxl〇18at〇ms/cm3程度的濃度,摻 雜氮(流量·· 5 0sccm)。 進而,更摻雜要成為p型摻雜劑的Zn來使p型層成 長(厚度:22私m)。藉由使辅助加熱器的溫度上升至7〇〇它, 使Zn和運載氣體Η〆carrier gas)-起在石英管内流通, 而可以1x1018atoms/cm3程度的濃度,被進行摻雜。 之後’停止各氣體、Zn的供給,使溫度下降至室溫為 25 200809020 止而得到根據以往方法所製得的磊晶基板。 並且,如上述,碳在磊晶成長中,從碳製成的治具溶 解在Ga溶液中,而被摻雜在成長的蠢晶層(上述η型層、ρ 型層、Ρ型層)中。 藉由 SI MS來分析以此種以往方法得到的磊晶基板的 不純物濃度輪廓。將分析結果表示於第1 3圖。 由第1 3圖可知,比較例1的磊晶層中的碳濃度輪廓, 是沿著從碳製成的治具供給而得到的碳濃度輪廓L,能夠 確認是成為全部集中在區域Rl_内的輪廓。 如此,以往的方法,與本發明相異,並不能任意地調 整碳濃度,而無法得到從輪廓L大幅地脫離之碳濃度輪廓。 與此比較例1同樣,藉由以往的磊晶成長方法,摻雜 碳而製作3 0片磊晶基板的時候,有二片形成了意料以外的 反轉層。被認為這是因為以往的方法,與本發明的方法相 異,僅能夠以規定的圖案來摻雜碳,對於其他的不純物(矽 等)的變化,由於無法靈活地對應,而會形成反轉層。 (實施例2 ·比較例2) 利用與實施例1同樣的步驟,但是變更氣體流量、供 給時機等,使得可以成為第14圖所示的構造與濃度輪廓, 來製作出3 3片蠢晶基板。蠢晶層,從基板側’依序設為η 型層、ρ型層、ρ型層(實施例2 )。在此磊晶基板上形成電 極,作成元件化,而製造出LED用裝置。 並且,都沒有形成反轉層等,而能夠得到全部具有所 26 200809020 希望的構造.濃度輪廓之磊晶基板、LED用裝置。 另一方面,與上述實施例2同樣,但是沒有供給CH4, 在沒有進行碳的摻雜的情況下,製作出29片第15圖所示 的具有以往的一般的構造與濃度輪廓之磊晶基板。磊晶層, 從基板侧,依序設為η型層、ρ型層、ρ型層(比較例2)。 在此磊晶基板上形成電極,作成元件化,而製造出LED用 裝置。In addition, it has a contour having a portion which is separated from the region RL · and has a portion of 5 X ” 1〇15 atoms/cm 3 or more. It also intersects with the contour L′. It also has 1 X 1 0 1 5 at 0 丽The concentration portion of s / cm3 or more has a contour portion of a concentration portion of 5xlOl5 atoms/cm3 or less. Thus, by the present invention, it is possible to obtain a large outline from the jig of the conventional method of carbon-made jig. The carbon concentration profile L) is a profile that is separated, and a desired carbon concentration profile can be obtained. Thus, a high-quality epitaxial substrate having a controlled carbon concentration can be obtained. % Further, as in the first embodiment, the present invention In the liquid phase epitaxial growth method, when 30 sheets of the epitaxial substrate of the present invention are doped with carbon, the concentration profile of the present invention is different from that of the conventionally reduced profile which is gradually reduced, and does not have the concentration profile as shown in FIG. An unexpected inversion layer was formed. (Comparative Example 1) The liquid phase Wu Shishi, the 邗 日 cat day growth device shown in Fig. 9 was used, and the Ga solution was placed in the n-type GaP single sister black. # t Early on the substrate, straw from the previous liquid phase Lei Crystal growth 24 200809020 Method, the GaP epitaxial layer is grown in the order of the n-type layer, the p-type layer, and the p-type layer from the substrate side. However, unlike the above-described embodiment of the present invention, the CH4 is not performed. Further, the jig for holding the substrate and the solution is made of quartz, and is doped with carbon by conventional automatic doping. First, after the GaP single crystal substrate and the Ga solution are disposed in the jig In the quartz tube, let H2 (flow rate: 匕^... and Ar (flow rate: i 〇 _) flow, and raise the temperature of the heater to 1 〇〇 (rc, dissolve the upper part of the Gap single crystal agricultural plate, dissolve it in Ga In the solution, after the GaP single crystal substrate is dissolved to a predetermined thickness, the inside of the quartz tube is cooled to grow the GaP stray layer. Initially, the n-type layer is grown by the doping of the n-type dopant (thickness·22) μ m). The doping method of Si is carried out by previously mixing high-purity Si crystals into Ga at room temperature, and the amount of Si is adjusted so that it can be doped at a concentration of 2x1 017 atoms/cm 3 . Thereafter, the supply of si carried out by the above method is stopped, and carbon is made The p-type layer generated by the automatic doping is grown (the thickness is long, and M3 is supplied at a concentration of about lxl 〇 18 at 〇 ms/cm 3 , and nitrogen is doped (flow rate · 50 sec). Further, more doping Zn to be a p-type dopant to grow the p-type layer (thickness: 22 ng). By raising the temperature of the auxiliary heater to 7 〇〇, Zn and carrier gas It is circulated in a quartz tube and can be doped at a concentration of about 1×10 18 atoms/cm 3 . Then, the supply of each gas and Zn is stopped, and the temperature is lowered to room temperature of 25 200809020 to obtain epitaxial crystals obtained according to the conventional method. Substrate. Further, as described above, in the epitaxial growth of carbon, the jig made of carbon is dissolved in the Ga solution, and is doped in the growing stray layer (the above-mentioned n-type layer, p-type layer, Ρ-type layer) . The impurity concentration profile of the epitaxial substrate obtained by this conventional method was analyzed by SI MS. The analysis results are shown in Fig. 13. As can be seen from Fig. 3, the carbon concentration profile in the epitaxial layer of Comparative Example 1 is the carbon concentration profile L obtained along the supply of the jig made of carbon, and it can be confirmed that all of the carbon concentration profiles L are concentrated in the region R1_. Outline. As described above, the conventional method is different from the present invention in that the carbon concentration cannot be arbitrarily adjusted, and the carbon concentration profile which is largely separated from the contour L cannot be obtained. In the same manner as in Comparative Example 1, when 30 epitaxial substrates were formed by doping carbon by a conventional epitaxial growth method, two of them formed an unexpected inversion layer. This is considered to be because the conventional method differs from the method of the present invention in that carbon can be doped only in a predetermined pattern, and changes in other impurities (矽, etc.) cannot be flexibly matched, and an inversion is formed. Floor. (Example 2: Comparative Example 2) The same procedure as in Example 1 was carried out, except that the gas flow rate, the supply timing, and the like were changed so that the structure and the concentration profile shown in Fig. 14 could be obtained, and three or three odd crystal substrates were produced. . The stray layer is sequentially referred to as an n-type layer, a p-type layer, and a p-type layer from the substrate side (Example 2). An electrode is formed on the epitaxial substrate to form an element, and an LED device is manufactured. Further, no inversion layer or the like is formed, and an epitaxial substrate and an LED device having all the structures and concentration profiles desired by 26 200809020 can be obtained. On the other hand, in the same manner as in the above-described second embodiment, CH4 was not supplied, and when carbon doping was not performed, 29 epitaxial substrates having the conventional general structure and concentration profile shown in Fig. 15 were produced. . The epitaxial layer was sequentially set to an n-type layer, a p-type layer, and a p-type layer from the substrate side (Comparative Example 2). An electrode was formed by forming an electrode on the epitaxial substrate and forming a device.

關於實施例2與比較例2的裝置,測定正上方亮度 Iv(mcd)、放射束p〇(mw)、光束Pv(mlm),比較各平均值。 將比較結果表示於第16圖((a)正上方亮度Iv、(b)放射束 P〇、(c)光束 pv)。 由第1 6圖可知,任一種資料,相較於比較例 例2顯示出更佳的值 這是因為如第15圖所示,首先,在比較例2,邱接人 是被形成在從表面算起20…部分。另一方面,在實施 例2,如第14圖所示,叩接合是被形成在 # m的部分。在LEJ)用奘 异起40 在LED用裝置中,吸收最多發光的地 表面的電極。根㈣單的幾何學計算, 來的光,其被電極吸收的比率,相對於比二= 例2會被抑制在56%程度 在實施 17圖)…由於"層變成2:對二?,(參照第 也變高。 成2倍對於電流的擴散效果 進而’藉由摻雜作為 有更佳的特性。 P型摻雜劑的碳 實施例 2會具 27 200809020 (實施例3〜8 ) 在實施例3、4、7、8,變争ΓγτWith respect to the apparatus of Example 2 and Comparative Example 2, the direct luminance Iv(mcd), the radiation beam p〇(mw), and the light beam Pv (mlm) were measured, and the respective average values were compared. The comparison result is shown in Fig. 16 ((a) luminance Iv, (b) radiation beam P〇, (c) beam pv). As can be seen from Fig. 6, any of the data shows a better value than Comparative Example 2 because, as shown in Fig. 15, first, in Comparative Example 2, Qiu is formed on the surface. Count 20... part. On the other hand, in Embodiment 2, as shown in Fig. 14, the 叩 joint is a portion formed at #m. In LEJ), in the LED device, the electrode on the ground surface that emits the most light is absorbed. The geometric calculation of the root (four) single, the ratio of the light that is absorbed by the electrode, relative to the ratio of two = example 2 will be suppressed at 56% in the implementation of Figure 17) ... because the " layer becomes 2: to two? (Refer to the first step also becomes higher. The diffusion effect of 2 times for current is further 'by doping as a better characteristic. Carbon of P-type dopant Example 2 will have 27 200809020 (Examples 3 to 8) In the examples 3, 4, 7, and 8

CfU的供給流量與時機 (timing)的條件;在實施例5、6, 燹更CH4的供給流量盥 時機的條件,且沒有供給Zn ;哈了 \ /、 除了上述以外,分別與實施 例1同樣地實施本發明的液相磊曰 狀相""日日成長方法。實施例3〜8 中的CH4的供給條件,表示於表j中。 表1 -—_ CH4 — 實施例3 開始L成長,並開始供給流量咖_(注丨),在使p型層6成長? 厚度之後,停止供給。 實施例4 在使η型層4成長8"m之後,開始供給流量2。。議(注2),直到一 P型層6成長規定厚度完成為止。 實施例5 開始展晶成長,並開始供贿量2QQ_(注3),而在㈣型層5成長 12/zm之後’以230sccm供給100%的(¾,直到p型層6成長規定厚度 完成為止。 實施例6 在使η型層4成長8μπι之後,開始供給流量2〇〇sccm(注4),而在使 p型層5成長12_之後,以230sccm供給1〇〇%的cm,直到p型層6 成長規定厚度完成為止。 實施例7 開始磊晶成長,並開始供給流量15〇sccm(注5),逐漸地減少流量,直 到P型層6成長規定厚度完成為止。並且,p型層6成長完成時的供給 流里為130sccm(注6)。 實施例8 開始蠢晶成長,並以230sccm的流量開始供給1〇〇%的ch4,逐漸地減少 流量’直到p型層6成長規定厚度完成為止。並且,p型層6成長完成 時的供給流量為115sccm。 (注1〜6)是指CH4氣體濃度為Ar基質5%之(Ar+CH4)流量。 28 -¾ > 200809020 藉由SI MS來分析在實施例3〜8中所得到的本發 晶基板\的不純物濃度輪。任何一個實施例,都藉 CH4的流罝之供給條件,來調整碳濃度,可以得到利 :獲得的碳濃度輪廟。冑分析結果表示於^ 2 4圖。 百先,在實施例3(第19圖)所得到的磊晶基板 始猫日日成長時,便供給規定量的CH4,對應此條件 碳濃度成為一定的2xl〇16at〇ros/cffi3程度的濃度。而 使P聖層6成長7 " m厚度之後,停止供給d,對 件,碳濃度急速地下降。成為靠近檢測界限值 1015atoms/cm3程度。 又’在實施W 4 (第2 〇圖)中,對於n型層4, 有供給CH4,所以碳濃度成為檢測界限值;對於p 5 6,藉由供給CH4,碳濃度急速地上升,而可以得 101&atoms/cm3程度的濃度d 接著’在實施例5(第21圖)中,藉由供給CIL 型層4、p型層5,碳以2xl〇16at〇ms/cm3程度的濃 雜。而在p型層6,利用以23〇sccm的流量,流通 CH4,碳濃度急速地上升,碳以4xl〇1?at〇ms/cm3程 濃度被摻雜。 而且’在實施例6(第22圖)中,得到將實施例 施例5組合起來的濃度輪廓。此濃度輪廓,是如實 所不,開始磊晶成長時,由於沒有供給CH4,所以 是檢測界限值,而藉由供給^,碳濃度急速地上 明的磊 由调整 用以往 客19〜 ,從開 ’得知 且,在 應此條 的 lx 由於沒 ί層5、 ,到 2 X ι,在η 度被捧 1 0 0 % 的 度的兩 4和實 施例4 碳濃度 升,成 29 ί s > 200809020 為2x1016atoms/cm3程度的濃度;而且,如實施例5所示, 利用以230sccm的流量,流通1 〇〇%的CH4 ’碳濃度急速地 上升,而成為4 X1 017 a t 〇 m s / c m3程度的高濃度。The supply flow rate and the timing of the timing of the CfU; in the fifth and sixth embodiments, the conditions of the supply flow rate of the CH4 are changed, and Zn is not supplied; and the same as in the first embodiment except for the above The liquid phase stretched phase "" daily growth method of the present invention is carried out. The supply conditions of CH4 in Examples 3 to 8 are shown in Table j. Table 1 - -_ CH4 - Example 3 Start L growth, and start to supply flow coffee _ (Note), in the growth of the p-type layer 6? After the thickness, the supply is stopped. Example 4 After the n-type layer 4 was grown 8 " m, the supply flow rate 2 was started. . (Note 2) until a P-type layer 6 grows to a specified thickness. Example 5 Start crystal growth, and start the bribe amount 2QQ_ (Note 3), and after the (4) layer 5 grows 12/zm, '100% is supplied at 230 sccm (3⁄4 until the p-type layer 6 grows to a predetermined thickness) Example 6 After the n-type layer 4 was grown by 8 μm, the supply flow rate of 2 〇〇sccm was started (Note 4), and after the p-type layer 5 was grown by 12 _, the % of the cm was supplied at 230 sccm until p The layer 6 is grown to a predetermined thickness. Example 7 Start epitaxial growth, and start the supply flow rate of 15 〇sccm (Note 5), and gradually reduce the flow rate until the P-type layer 6 grows to a predetermined thickness. 6 The supply flow at the time of completion of growth is 130 sccm (Note 6). Example 8 Starts stupid crystal growth, and starts supplying 1% of ch4 at a flow rate of 230 sccm, and gradually reduces the flow rate until the p-type layer 6 grows to a predetermined thickness. Further, the supply flow rate at the completion of growth of the p-type layer 6 is 115 sccm. (Notes 1 to 6) means that the CH4 gas concentration is 5% (Ar + CH4) flow rate of the Ar matrix. 28 -3⁄4 > 200809020 by SI MS was used to analyze the impurity concentration wheel of the present crystal substrate obtained in Examples 3 to 8. In one embodiment, the carbon concentration is adjusted by the supply condition of the flow of CH4, and the obtained carbon concentration can be obtained. The analysis result is shown in Fig. 24. First, in Example 3 (19th) Fig.) When the epitaxial substrate obtained from the cat grows day by day, a predetermined amount of CH4 is supplied, and the carbon concentration becomes a certain concentration of 2xl〇16at〇ros/cffi3 corresponding to the condition. After the thickness of m, the supply of d is stopped, and the carbon concentration is rapidly decreased, and the detection limit value is about 1015 atoms/cm3. In the implementation of W 4 (Fig. 2), there is supply for the n-type layer 4. CH4, so the carbon concentration becomes the detection limit value; for p 5 6, the carbon concentration is rapidly increased by supplying CH4, and the concentration d of about 101 & atoms/cm3 can be obtained. Then, in Example 5 (Fig. 21) By supplying the CIL type layer 4 and the p type layer 5, the carbon is concentrated at a level of 2xl 〇 16at 〇 ms/cm 3 , and in the p type layer 6 , the CH 4 is circulated at a flow rate of 23 〇 sccm, and the carbon concentration is rapidly increased. Ascending, carbon is doped at a concentration of 4xl〇1?at〇ms/cm3 and is 'in Example 6 (Fig. 22) The concentration profile of the embodiment 5 is obtained. This concentration profile is true. When the epitaxial growth is started, since the CH4 is not supplied, the limit value is detected, and by supplying the carbon concentration, the carbon concentration is rapidly increased. Ming Lei is adjusted by the past guest 19~, from the open 'learned, and in the lx of this article, because there is no layer 5, to 2 X ι, in the η degree is held 1 0 0% of the degree of two 4 And Example 4, the carbon concentration is increased to 29 ί s > 200809020 to a concentration of about 2x1016 atoms/cm3; and, as shown in Example 5, the carbon concentration of 1% by weight of CH4' is rapidly circulated at a flow rate of 230 sccm. Rise and become a high concentration of 4 X1 017 at 〇ms / c m3.

又,如實施例7 (第2 3圖)、實施例8 (第2 4圖)所示, 即使是從取4刀蠢晶成長開始便換雜後之輪廊’藉由調節CH4 的流量,輪廓全體在濃度的高度方向可以自由地移位 (shift),而能夠得到具有在以往方法中無法得到的範圍的 濃度之碳濃度輪廓。特別是在實施例8,在磊晶層中,成 為具有比基板2高的碳濃度之輪廓,此種蟲晶基板只有藉 由本發明才可以得到。 如以上所述’若是本發明的磊晶基板及液相磊晶成長 方法’可以脫離由以往的碳製成治具來的自動摻雜所形成 的固定的碳濃度輪廓,而與僅使用石英治具等的以往方法 所形成的輪廓相異,能夠得到具有任意的碳濃度輪廓之高 品質蠢晶基板。 又,藉由此手段,例如也能夠有效地防止發生意料以 外的反轉層等。 施形態。上述實施形 本發明的申請專利範 能得到同樣的作用效 明的技術範圍内。 而且,本發明並未限定於上述實 悲僅是例不,只要是具有與被記载於 園中的技術思想實質上相同的構成, 果者,不論為何者,皆被包含在本發 ί n 'y 30 200809020 【圖式簡單說明】 第1圖是表示本發明的磊晶基板的一例之概要構成 圖。 第2圖是表示本發明的磊晶基板中的不純物濃度輪廓 的一例之圖。 第3圖是表示本發明的磊晶基板中的不純物濃度輪廓 的其他例之圖。 第4圖是表示本發明的磊晶基板中的不純物濃度輪廓 的其他例之圖。 第5圖是表示本發明的磊晶基板中的不純物濃度輪廓 的其他例之圖。 第6圖是表示本發明的磊晶基板中的不純物濃度輪廓 的其他例之圖。 第7圖是表示以往的磊晶基板(使用石英治具)中的不 純物濃度輪廓的一例之圖。 第8圖(a)是表示以往的磊晶基板(使用碳製成的治具) 中的不純物濃度輪廓的一例之圖。(b )是表示具有反轉層之 磊晶基板(使用碳製成的治具)中的不純物濃度輪廓的一例 之圖。 第9圖是表示液相磊晶成長裝置的一例之構成概要 圖。 第1 0圖是表示本發明的液相磊晶成長方法的步驟的 一例之概要步驟圖。 第11圖是表示本發明的液相磊晶成長方法中的ch4 31 •i f > 200809020 的供給流量和蠢晶層中的礙濃度的相關關係之圖。 第1 2圖是表示實施例1的不純物濃度輪廓之圖。 第1 3圖是表示比較例1的不純物濃度輪廓之圖。 第1 4圖是表示實施例2的磊晶基板中的不純物濃度輪 廓之圖。 第1 5圖是表示比較例2的磊晶基板中的不純物濃度輪 廓之圖。Further, as shown in the seventh embodiment (Fig. 2) and the eighth embodiment (Fig. 24), even if the flow of the CH4 is adjusted from the start of the four-blade growth, the flow rate of the CH4 is adjusted. The entire profile can be freely shifted in the height direction of the concentration, and a carbon concentration profile having a concentration in a range which cannot be obtained by the conventional method can be obtained. Particularly in Embodiment 8, in the epitaxial layer, a profile having a higher carbon concentration than that of the substrate 2 is obtained, and such a crystal substrate can be obtained only by the present invention. As described above, if the epitaxial substrate and the liquid phase epitaxial growth method of the present invention can be separated from the fixed carbon concentration profile formed by the automatic doping of the conventional carbon-made jig, and only the quartz treatment is used. The contours formed by the conventional methods of the prior art are different, and a high-quality amorphous substrate having an arbitrary carbon concentration profile can be obtained. Further, by this means, for example, it is possible to effectively prevent the occurrence of an inversion layer or the like which is unexpected. Form. The above-described embodiments of the present invention are within the technical scope of the same effects. Further, the present invention is not limited to the above-described sorrows, and is merely an embodiment having substantially the same technical concept as that described in the garden, and the present invention is included in the present invention regardless of the reason. 'y 30 200809020 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic configuration diagram showing an example of an epitaxial substrate of the present invention. Fig. 2 is a view showing an example of an impurity concentration profile in the epitaxial substrate of the present invention. Fig. 3 is a view showing another example of the impurity concentration profile in the epitaxial substrate of the present invention. Fig. 4 is a view showing another example of the impurity concentration profile in the epitaxial substrate of the present invention. Fig. 5 is a view showing another example of the impurity concentration profile in the epitaxial substrate of the present invention. Fig. 6 is a view showing another example of the impurity concentration profile in the epitaxial substrate of the present invention. Fig. 7 is a view showing an example of an impurity concentration profile in a conventional epitaxial substrate (using a quartz jig). Fig. 8(a) is a view showing an example of an impurity concentration profile in a conventional epitaxial substrate (a jig made of carbon). (b) is a view showing an example of an impurity concentration profile in an epitaxial substrate (a jig made of carbon) having an inversion layer. Fig. 9 is a schematic view showing the configuration of an example of a liquid phase epitaxial growth apparatus. Fig. 10 is a schematic flow chart showing an example of the procedure of the liquid phase epitaxial growth method of the present invention. Fig. 11 is a graph showing the correlation between the supply flow rate of ch4 31 • i f > 200809020 and the concentration concentration in the stray layer in the liquid phase epitaxial growth method of the present invention. Fig. 12 is a view showing the impurity concentration profile of Example 1. Fig. 13 is a view showing the impurity concentration profile of Comparative Example 1. Fig. 14 is a view showing the impurity concentration profile in the epitaxial substrate of the second embodiment. Fig. 15 is a view showing the impurity concentration profile in the epitaxial substrate of Comparative Example 2.

第1 6圖是表示實施例2和比較例2的(a)正上方亮度、 (b)放射束、(c)光束的比較結果之圖。 第1 7圖是表示電極的光吸收情況的例子之概要說明 圖。 第1 8圖是表示實施例1的實施條件的概要之說明圖。 第1 9圖是表示實施例3的不純物濃度輪廓之圖。 第20圖是表示實施例4的不純物濃度輪廓之圖。 第2 1圖是表示實施例5的不純物濃度輪廓之圖。 第22圖是表示實施例6的不純物濃度輪廓之圖。 第23圖是表示實施例7的不純物濃度輪廓之圖。 第24圖是表示實施例8的不純物濃度輪廓之圖。 32 200809020 【主要元件符號說明】 1 蠢晶基板 2a 溶解後的η型GaP單 3 羞晶層 5 p型層 7 發光裝置 1 0液相磊晶成長裝置 1 2輔助加熱器 1 4石英治具 1 5a Ga( + GaP)溶液 1 7石英管 21積層部位 23積層部位 (η型GaP單結晶)基板 晶基板 η型層 ρ型層 電極 加熱器 坩堝 Ga溶液 石英蓋 積層部位 積層部位 33Fig. 16 is a view showing comparison results of (a) direct brightness, (b) radiation beam, and (c) light beam in Example 2 and Comparative Example 2. Fig. 17 is a schematic explanatory view showing an example of the light absorption of the electrode. Fig. 18 is an explanatory view showing an outline of the execution conditions of the first embodiment. Fig. 19 is a view showing the impurity concentration profile of Example 3. Fig. 20 is a view showing the impurity concentration profile of Example 4. Fig. 2 is a view showing the impurity concentration profile of Example 5. Fig. 22 is a view showing the impurity concentration profile of Example 6. Fig. 23 is a view showing the impurity concentration profile of Example 7. Fig. 24 is a view showing the impurity concentration profile of Example 8. 32 200809020 [Explanation of main component symbols] 1 Stupid crystal substrate 2a Dissolved n-type GaP single 3 Shame layer 5 p-type layer 7 Light-emitting device 1 0 liquid phase epitaxial growth device 1 2 auxiliary heater 1 4 quartz fixture 1 5a Ga( + GaP) solution 1 7 quartz tube 21 laminated portion 23 laminated portion (n-type GaP single crystal) substrate crystal substrate n-type layer p-type layer electrode heater 坩埚Ga solution quartz cap laminate portion laminated portion 33

Claims (1)

200809020 十、申請專利範圍: 1. 一種蠢晶基板,是藉由液相蠢晶成長方法 層蠢晶層而成的蠢晶基板’其特徵為: 積層在上述基板上的磊晶層中的碳濃度輪 由用以保持溶劑之碳製成的治具供給而得到的 的濃度輪廓交叉。 2· 一種磊晶基板,是藉由液相磊晶成長方法 層磊晶層而成的磊晶基板,其特徵為: 積層在上述基板上的蠢晶層中的碳濃度輪 基於由用以保持溶劑之碳製成的治具供給而得 土 5 0%的濃度輪廓所包圍的區域脫離之部份, 1015atonis/cm3以上的部份。 3. 一種轰晶基板,是藉由液相蠢晶成長方法 層磊晶層而成的磊晶基板,其特徵為: 積層在上述基板上的磊晶層的至少一積層 濃度’比在該積層部位之前被積層的部位中的 4· 一種蠢晶基板,是藉由液相磊晶成長方法 層蠢晶層而成的磊晶基板,其特徵為: 積層在上述基板上的蠢晶層,具有其碳 1016atoms/cm3以上的積層部份,並具有其碳 1015atonis/cm3以下的積層部份。 5 ·如申請專利範圍第1項所述之磊晶基板, 上述基板上的磊晶層,是依序積層二個以上的 34 在基板上積 廓,與基於 碳濃度±50% 在基板上積 廓,具有從 到的碳濃度 並具有 5 X 在基板上積 部位中的碳 碳濃度高。 在基板上積 濃度在1X 濃度在5 X 其中積層在 層而成。 200809020 6 · 如申請專利範圍第2項所述之磊晶基板,其中積層在 上述基板上的磊晶層,是依序積層二個以上的層而成。 7 · 如申請專利範圍第3項所述之磊晶基板,其中積層在 上述基板上的磊晶層,是依序積層二個以上的層而成。 8 · 如申請專利範圍第4項所述之蠢晶基板,其中積層在 上述基板上的蠢晶層’是依序積層二個以上的層而成。 9· 如申請專利範圍第5項所述之磊晶基板,其中上述二 個以上的層,從基板側依序是η型層、p型層、p型層。 10.如申請專利範圍第6項所述之磊晶基板,其中上述二 個以上的層,從基板侧依序是η型層、ρ型層、ρ型層。 11 ·如申請專利範圍第7項所述之磊晶基板,其中上述二 個以上的層,從基板側依序是η型層、ρ型層、ρ型層。 12·如申請專利範圍第8項所述之遙晶基板,其中上述二 個以上的層,從基板側依序是η型層、ρ型層、ρ型層。 1 3 ·如申請專利範圍第1項至第1 2項中任一項所述之磊晶 基板,其中上述磊晶層是由化合物半導體所構成的層。 1 4 ·如申請專利範圍第1 3項所述之磊晶基板,其中上述化 合物半導體是GaP。 1 5 · —種液相磊晶成長方法,是使溶劑接觸基板而使磊晶 層液相蠢晶成長之方法,其特徵為·· 當使磊晶層液相磊晶成長在上述基板上的時候,藉由 使烴氣體接觸上述溶劑,將碳供給至上述成長的磊晶層 中,而將碳摻雜在該磊晶層中。 35 200809020 1 6. 如申請專利範圍第1 5項所述之液相蠢晶成長方法, 其中在使上述磊晶層液相磊晶成長時,用以保持上述溶劑 之治具,是由石英製成。 17. 如申請專利範圍第1 6項所述之液相磊晶成長方法, 其中摻雜在上述磊晶層中的碳濃度,是藉由調節上述烴氣 體的流量來進行控制。 18. 如申請專利範圍第1 6項所述之液相磊晶成長方法, 其中將上述磊晶層設為是由化合物半導體所構成的層。 19. 如申請專利範圍第1 7項所述之液相磊晶成長方法, 其中將上述磊晶層設為是由化合物半導體所構成的層。 20. 如申請專利範圍第18項或第19項所述之液相磊晶成 長方法,其中將上述化合物半導體設為GaP。 21. 如申請專利範圍第1 5項至第1 9項中任一項所述之液 相磊晶成長方法,其中將上述烴氣體設為曱烷。 22. 如申請專利範圍第20項所述之液相磊晶成長方法, 其中將上述烴氣體設為甲烷。 ί 36200809020 X. Patent application scope: 1. A stupid crystal substrate is a stupid crystal substrate formed by a liquid crystal stupid growth method layer characterized by: carbon deposited in an epitaxial layer on the substrate The concentration profile of the concentration wheel is obtained by the supply of the jig made of carbon to hold the solvent. 2. An epitaxial substrate, which is an epitaxial substrate formed by a liquid crystal epitaxial growth layer epitaxial layer, characterized in that: a carbon concentration wheel laminated in a stray layer on the substrate is based on The jig made of carbon of the solvent is supplied with a portion of the region surrounded by the 50% concentration profile, and the portion separated by 1015 atomis/cm3 or more. 3. A crystal-grown substrate, which is an epitaxial substrate formed by a liquid crystal epitaxial growth method layer epitaxial layer, characterized in that: at least one layer concentration of the epitaxial layer laminated on the substrate is greater than that in the layer 4 . A stray substrate which is a stray crystal layer formed by a liquid crystal epitaxial growth method, characterized by: a stupid layer laminated on the substrate, having The carbon layer has a laminated portion of 1016 atoms/cm3 or more and has a laminated portion having a carbon content of 1015 atoms/cm3 or less. 5. The epitaxial substrate according to claim 1, wherein the epitaxial layer on the substrate is formed by sequentially stacking two or more layers 34 on the substrate, and accumulating on the substrate based on a carbon concentration of ±50%. The profile has a carbon concentration from the top and has a high carbon and carbon concentration of 5 X on the substrate. The concentration on the substrate is formed at a concentration of 1X at 5 X in which the layer is laminated. The substrate of the epitaxial substrate according to claim 2, wherein the epitaxial layer laminated on the substrate is formed by sequentially laminating two or more layers. The epitaxial substrate according to claim 3, wherein the epitaxial layer laminated on the substrate is formed by sequentially laminating two or more layers. 8. The amorphous substrate according to claim 4, wherein the staggered layer deposited on the substrate is formed by sequentially laminating two or more layers. 9. The epitaxial substrate according to claim 5, wherein the two or more layers are sequentially an n-type layer, a p-type layer, and a p-type layer from the substrate side. 10. The epitaxial substrate according to claim 6, wherein the two or more layers are sequentially an n-type layer, a p-type layer, and a p-type layer from the substrate side. The epitaxial substrate according to claim 7, wherein the two or more layers are sequentially an n-type layer, a p-type layer, and a p-type layer from the substrate side. The remote crystal substrate according to claim 8, wherein the two or more layers are sequentially an n-type layer, a p-type layer, and a p-type layer from the substrate side. The epitaxial substrate according to any one of claims 1 to 2, wherein the epitaxial layer is a layer composed of a compound semiconductor. The epitaxial substrate according to claim 13, wherein the compound semiconductor is GaP. 1 5 · A liquid phase epitaxial growth method is a method in which a solvent is brought into contact with a substrate to cause a liquid crystal growth of an epitaxial layer, and is characterized in that: when a liquid crystal epitaxial layer is epitaxially grown on the substrate At this time, carbon is doped into the epitaxial layer by contacting the hydrocarbon gas with the solvent to supply the carbon to the grown epitaxial layer. 35 200809020 1 6. The liquid phase stray crystal growth method according to claim 15, wherein when the epitaxial layer is subjected to liquid phase epitaxial growth, the jig for holding the solvent is made of quartz. to make. 17. The liquid phase epitaxial growth method according to claim 16, wherein the concentration of carbon doped in the epitaxial layer is controlled by adjusting a flow rate of the hydrocarbon gas. 18. The liquid phase epitaxial growth method according to claim 16, wherein the epitaxial layer is a layer composed of a compound semiconductor. 19. The liquid phase epitaxial growth method according to claim 17, wherein the epitaxial layer is a layer composed of a compound semiconductor. 20. The liquid phase epitaxial growth method according to claim 18, wherein the compound semiconductor is a GaP. The liquid phase epitaxial growth method according to any one of the items 1 to 5, wherein the hydrocarbon gas is decane. 22. The liquid phase epitaxial growth method according to claim 20, wherein the hydrocarbon gas is set to methane. 36 36
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