TW200808479A - laser beam splitting wafer system - Google Patents
laser beam splitting wafer system Download PDFInfo
- Publication number
- TW200808479A TW200808479A TW95129132A TW95129132A TW200808479A TW 200808479 A TW200808479 A TW 200808479A TW 95129132 A TW95129132 A TW 95129132A TW 95129132 A TW95129132 A TW 95129132A TW 200808479 A TW200808479 A TW 200808479A
- Authority
- TW
- Taiwan
- Prior art keywords
- laser
- cutting
- wafer
- sub
- light
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 48
- 230000007246 mechanism Effects 0.000 claims abstract description 24
- 238000005520 cutting process Methods 0.000 claims description 78
- 235000012431 wafers Nutrition 0.000 claims description 73
- 230000010287 polarization Effects 0.000 claims description 8
- 239000002131 composite material Substances 0.000 claims description 7
- 239000013078 crystal Substances 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 7
- 238000003698 laser cutting Methods 0.000 claims description 7
- 230000008859 change Effects 0.000 claims description 3
- 238000004513 sizing Methods 0.000 claims description 3
- 230000003595 spectral effect Effects 0.000 claims description 3
- 239000002689 soil Substances 0.000 claims description 2
- 101100001231 Caenorhabditis elegans aha-1 gene Proteins 0.000 claims 1
- 241001606201 Patia Species 0.000 claims 1
- 235000000001 Phoenix pusilla Nutrition 0.000 claims 1
- 244000290891 Phoenix pusilla Species 0.000 claims 1
- 206010036790 Productive cough Diseases 0.000 claims 1
- 241000239226 Scorpiones Species 0.000 claims 1
- 201000009310 astigmatism Diseases 0.000 claims 1
- 238000001459 lithography Methods 0.000 claims 1
- 210000003802 sputum Anatomy 0.000 claims 1
- 208000024794 sputum Diseases 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 229910052770 Uranium Inorganic materials 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005549 size reduction Methods 0.000 description 2
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 description 2
- 235000009827 Prunus armeniaca Nutrition 0.000 description 1
- 244000018633 Prunus armeniaca Species 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 210000002700 urine Anatomy 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95129132A TW200808479A (en) | 2006-08-09 | 2006-08-09 | laser beam splitting wafer system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95129132A TW200808479A (en) | 2006-08-09 | 2006-08-09 | laser beam splitting wafer system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200808479A true TW200808479A (en) | 2008-02-16 |
| TWI304758B TWI304758B (https=) | 2009-01-01 |
Family
ID=44766919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95129132A TW200808479A (en) | 2006-08-09 | 2006-08-09 | laser beam splitting wafer system |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200808479A (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI484543B (zh) * | 2008-05-27 | 2015-05-11 | 迪思科股份有限公司 | Segmentation of wafers (1) |
| CN108780778A (zh) * | 2016-03-25 | 2018-11-09 | 应用材料公司 | 使用旋转光束激光刻划工艺及等离子体蚀刻工艺的混合式晶片切割方法 |
| CN114654109A (zh) * | 2022-04-09 | 2022-06-24 | 法特迪精密科技（苏州）有限公司 | Mems探针硅片切割方法 |
-
2006
- 2006-08-09 TW TW95129132A patent/TW200808479A/zh not_active IP Right Cessation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI484543B (zh) * | 2008-05-27 | 2015-05-11 | 迪思科股份有限公司 | Segmentation of wafers (1) |
| CN108780778A (zh) * | 2016-03-25 | 2018-11-09 | 应用材料公司 | 使用旋转光束激光刻划工艺及等离子体蚀刻工艺的混合式晶片切割方法 |
| CN108780778B (zh) * | 2016-03-25 | 2023-07-28 | 应用材料公司 | 使用旋转光束激光刻划工艺及等离子体蚀刻工艺的混合式晶片切割方法 |
| CN114654109A (zh) * | 2022-04-09 | 2022-06-24 | 法特迪精密科技（苏州）有限公司 | Mems探针硅片切割方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI304758B (https=) | 2009-01-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |